Access device for a motor vehicle, and motor vehicle

Abstract

The invention relates to an access device (100), a flap-control system, and a motor vehicle having an access device (100) and / or a flap-control system, the access device (100) being used to operate a flap element which covers an interior of a motor vehicle in a closed state and at least partially opens same in an open state. According to the invention, a heat-dissipation element (140) is provided which is designed to dissipate heat generated during operation of the access device (100).

Description

[0001] Applicant:

[0002] Huf Hülsbeck & Fürst GmbH & Co. KG

[0003] Description

[0004] Access device for a motor vehicle and motor vehicle

[0005] The present invention relates to an access device for a motor vehicle and to a motor vehicle with such an access device.

[0006] It is known from current technology to detect the approach of objects to a vehicle door using certain sensors. However, this detection is computationally intensive and power-intensive, and generates a lot of waste heat.

[0007] Disclosure of the invention

[0008] The invention relates to an access device with the features of claim 1 and a motor vehicle with the features of claim 15. Further features and details of the invention will become apparent from the respective dependent claims, the description, and the drawings. Features and details described in connection with the access device according to the invention naturally also apply in connection with the motor vehicle according to the invention, and vice versa, so that the disclosure regarding the individual aspects of the invention always refers, or can refer, to each other.

[0009] The invention relates in particular to an access device for a vehicle, preferably a motor vehicle. The vehicle is, for example, a passenger car and / or a truck.

[0010] The access device can be used to operate a flap element. The flap element can be designed and / or configured on the vehicle in such a way that it covers an interior area of ​​the vehicle when closed and at least partially exposes it when open.

[0011] The access device according to the invention can have at least one or exactly one sensor element configured to detect an activation action and preferably to recognize an object in the vicinity of the flap element. The sensor element is, for example, a gesture sensor and / or radar sensor and / or UWB sensor (for ultra-wideband communication) and / or an interface for near-field communication and / or a capacitive sensor and / or a camera sensor and / or the like. A control element, preferably an electronic control element such as a microcontroller, can also be part of the access device. The control element can be configured to perform control based on the detected activation action and preferably to control a locking and / or movement of the flap element based on the detected object.

[0012] Furthermore, a printed circuit board element can be provided in the access device according to the invention, which is preferably electronically connected to the sensor element and / or the control element. The printed circuit board element is preferably at least a part of an electronic printed circuit board.

[0013] Furthermore, the access device according to the invention can include a heat dissipation element designed to dissipate heat generated during operation of the access device. The heat dissipation element can be encompassed by the circuit board element and, in particular, be formed by the circuit board element itself.

[0014] A vehicle, preferably a motor vehicle, for which the access device according to the invention is designed, typically has at least one or more flap elements, which can also be referred to as flaps, hatches, openings, and / or doors. The flap elements can be controlled, moved, and, in particular, opened and / or closed by the access device according to the invention, as will be described in more detail below. In particular, the at least one flap element is at least one door and / or a compartment cover, such as a tailgate and / or trunk lid and / or a front trunk lid, which can also be referred to as a frunk lid. In a closed state, the one or more flap elements cover an interior space of the vehicle or seal it off from the environment or surroundings of the vehicle, and in an open state, they at least partially expose it.

[0015] For example, one or more doors cover or lock the passenger compartment of a vehicle when closed, and when open at least partially allow access to the passenger compartment, thus enabling a driver and / or passenger to enter. Similarly, a rear trunk lid covers the trunk, which may be connected to or separated from the passenger compartment, when closed, and when open at least partially exposes it, thus allowing access to items and / or objects inside.A front trunk lid also covers, in particular, a front trunk, such as may be designed in electric vehicles and / or vehicles with a rear engine, and in an open state at least partially exposes it, thus enabling access to items and / or objects located inside.

[0016] In particular, the flap element can also be part of a larger flap unit, such as the upper part of a trunk lid and / or the lower part of a trunk lid, which can be opened and closed both as a whole and in individual sections. Specifically, the flap element can also be a flap that opens and closes a specific functional element of the vehicle, such as a fuel filler flap for a fuel filler neck, a charging flap for a charging cable, and / or a storage compartment flap.

[0017] The flap element can also be included by the access device according to the invention and / or form a device and / or a system with it, in particular a flap control system, as will be explained further below.

[0018] The access device according to the invention preferably comprises a sensor element configured to detect an activation action. In particular, the sensor element is configured to detect an object or item in the vicinity of the flap element and / or the sensor element during operation and preferably to detect an activation action based on this detection. The sensor element can comprise one or more sensors, which can also be referred to as a sensor array, and which are configured to detect an activation action.

[0019] For example, the sensor element comprises at least one or more proximity sensors, preferably operating on an inductive, capacitive, magnetic, and / or optical principle. Alternatively or additionally, the sensor element can comprise one or more ultrasonic sensors configured to detect an object in the vicinity of the flap element using ultrasound. Alternatively or additionally, the sensor element can comprise one or more radar sensors configured to detect an object in the vicinity of the flap element using radar (radio detection and ranging), i.e., using radio-based positioning and distance measurement.

[0020] Alternatively or additionally, the sensor element can comprise one or more lidar sensors configured to detect an object in the vicinity of the flap element using lidar (light detection and ranging), i.e., using light-based localization and distance measurement. In particular, one or more such sensor elements can be provided for one or more, especially all, flap elements of the motor vehicle. Specifically, one or more of the sensor elements are arranged on a sill, a bumper, especially a front and / or rear bumper, a roof pillar, especially an A-, B-, and / or C-pillar of the roof, and further, in particular, behind a cover of one or more such roof pillars, and further, in particular, flush with the surface behind such a cover, which may also be made of glass fiber reinforced plastic.

[0021] The sensor element(s) preferably serve to detect an activation action. Such an activation action is an action, activity, and / or gesture that expresses a desire to activate the control of the flap element, and in particular to trigger the locking and / or unlocking and / or movement of the flap element. For this purpose, the sensor element can be configured to detect an object, and in particular also an approach and / or movement of the object in the vicinity of the respective flap element, especially from the outside or on the outer surface of the flap element, facing away from the interior.The object may be, in particular, one or more limbs and / or extremities of a person, especially a driver and / or passenger, such as one or more fingers, one or more hands, one or more forearms, one or more arms, one or more feet, one or more lower legs, one or more legs, a trunk, a torso, a neck, and / or a head. Alternatively or additionally, the object may be an item, such as a piece of transport or luggage, like a suitcase, a bag, a shopping bag, or a box. The sensor element may be designed to detect the approach of one or more such objects to the respective flap element, particularly without contact.

[0022] In particular, the sensor element can also be configured to detect one or more such objects in or on the opening of the flap. For this purpose, one or more sensor elements can be arranged along an opening that the flap element exposes in the open state. Alternatively or additionally, one or more sensor elements can also be provided in or on a handle element, in particular an external handle element, as will be explained further below. Alternatively or additionally, the sensor element can also be configured to detect and, in particular, evaluate one or more gestures, especially predefined gestures, particularly non-contact gestures, such as a swipe gesture, a pivot gesture, a grasping gesture, a lifting gesture, and / or a lowering gesture, performed by a hand, arm, foot, and / or leg near the flap element.According to the invention, at least one control element can also be provided which is configured to perform control based on the detected activation action, particularly with regard to the flap element. In particular, the control element is configured to control or effect an unlocking, a locking, and / or a movement of the flap element or elements based on the detected object. The control element can, for example, comprise and / or have access to one or more actuators, which can also be referred to as actuators, and / or one or more stepper motors, and at least effect or cause control and, in particular, movement of these actuators and / or stepper motors. In particular, the control element can be configured to effect a movement of the flap element by controlling one or more such actuators and / or stepper motors.In response to object detection, a movement of the flap element(s) can be triggered, started, and / or initiated, particularly from a previous resting or stationary state. A previous movement can also be reduced, slowed, and / or stopped in response to object detection. In particular, the direction of movement can also be changed, and especially reversed, in response to object detection. A movement can, for example, include opening or closing the flap element, which in particular includes a pivoting movement about one or more axes. In particular, locking and / or unlocking of the flap element can also be effected or controlled, especially without the flap element actually opening.In particular, different movement sequences of the flap element can be distinguished based on the detected object and especially on the object's approach and / or gesture. For example, an approach of an extremity and / or limb to the flap element can trigger unlocking, and a grasping and / or swiping gesture, especially a non-contact one, can trigger opening of the flap element. Alternatively or additionally, a grasping and / or swiping gesture, especially a non-contact one, particularly in the opposite direction, can trigger closing of the flap element, and an approach or departure of an extremity and / or limb can trigger locking of the flap element. In particular, the control element can be configured to slow down and / or abort a closing and / or opening movement if an object is detected in the path of the closing and / or opening movement.

[0023] The access device according to the invention preferably also includes a printed circuit board element that is electronically connected to the sensor element and / or the control element. The printed circuit board element, which can also be referred to as a circuit board, board, or printed circuit, is electronically, electrically, and / or signal-wise connected to at least one sensor element and / or a control element. The printed circuit board element is preferably made of a plastic, in particular an electrically non-conductive plastic, which may in particular be fiber-reinforced. In particular, the access device comprises at least one printed circuit board element, and in particular several printed circuit board elements. In particular, at least one printed circuit board element is provided for each sensor element and / or each control element. Furthermore, in particular, a central printed circuit board element may also be provided, which comprises a central control element.In particular, a sensor element and / or a control element is arranged on or attached to the printed circuit board element and / or connected to it, for example by an adhesive, plug, solder, and / or snap-fit ​​connection. The printed circuit board element(s) may also include other electronic elements or components.

[0024] The access device according to the invention preferably comprises a heat dissipation element configured to dissipate heat generated during operation of the access device, wherein the heat dissipation element is encompassed by and / or formed by the printed circuit board element. In particular, a heat dissipation element can be provided that is configured to dissipate heat generated during operation of the sensor element and / or the control element. The heat can be generated by one or more sensors themselves or by the sensor element(s), as well as by processing the object recognition provided by the sensor element, for example by the control element and / or by a processing element, as will be explained further below.In this configuration, at least one sensor element is arranged on the printed circuit board element, and the heat dissipation element dissipates the heat generated by the sensor element during operation, in particular away from the sensor element, the printed circuit board element, and / or from one or more other electrical or electronic elements or components located near the sensor element and / or on the printed circuit board element. In particular, several such heat dissipation elements may be provided, for example, one or more for each sensor, for each sensor element, for each printed circuit board element, and / or for each control element. In particular, several identical or different heat dissipation elements may also be provided, as will be explained further below. The heat dissipation element may be attached to or...be arranged on one of the elements of the printed circuit board element and / or be integrated into the printed circuit board element, as will be explained later.

[0025] The at least one heat dissipation element is preferably designed to dissipate operating heat from the access device, in particular through passive heat dissipation and / or passive cooling, as will be explained further below.

[0026] In particular, one or more projections or protrusions can be arranged on or attached to the printed circuit board element or the elements mounted thereon, and can be positioned perpendicular to or extending away from it. These projections can be made of a metallic material, such as iron, steel, silver, copper, gold, and / or aluminum. The projections can be applied to the printed circuit board element, in particular by injection molding. These projections, which can also be referred to as heat-conducting plates, can be positioned, in particular wherever, a sensor element is not impaired by the presence of such a heat-conducting plate, especially due to its metallic properties. In particular, one or more such heat-conducting plates can be positioned where the transmission of a radar, lidar, or camera signal is not required or necessary.

[0027] Preferably, the projections can also be used as mass balancing elements and, in particular, arranged such that, due to their material properties, especially their weight, they provide a mass balancing function for the access device. The access device according to the invention makes it possible to dissipate heat generated during operation of the access device, particularly from computationally and / or power-intensive components and / or elements, such as the sensor element(s) and / or their processing, particularly effectively and practically, thus preventing overheating, especially at high ambient temperatures, which could lead to a reduction in performance or a failure of object recognition.

[0028] The printed circuit board (PCB) element may include a thermal interface material made of a thermally conductive material, which is integral to the PCB element and forms the heat dissipation element. In particular, the thermally conductive material is integrated into the at least one PCB element. For example, the thermally conductive material is an additive material that is integrated, mixed, blended, displaced, and / or integrated into the material of the PCB element, especially the plastic, at least section by section. In particular, the thermally conductive material may also be integrated into or form a fiber reinforcement of the plastic. In particular, material structures made of thermally conductive material may be provided in the PCB element, especially along a core of the PCB element, which transfer heat from one surface to another.The thermally conductive material is designed to conduct heat away from or away from elements arranged on the printed circuit board (PCB) component, such as sensor elements and / or control elements, and in particular to discharge it to a location spaced apart from the respective element, for example, into the surrounding air. Specifically, the thermally conductive material is not an electrically conductive material arranged on one or more surfaces, such as copper, but rather the thermally conductive material has no electrically conductive function and / or connection with any of the elements of the PCB component. For example, the thermally conductive material could be a diamond, mica, and / or glass coating and / or an inclusion thereof. The thermally conductive material could also be a material that, in principle, also possesses good electrical conductivity, such as a metal, in particular silver, copper, gold, and / or aluminum.In this case, however, the thermally conductive material is different from, and / or insulated from, and / or not electrically connected to, the structures used for electrical conduction on or within the circuit board element. This enables particularly targeted and compact heat conduction.

[0029] It may additionally or alternatively be provided that the heat dissipation element includes a cooling element, wherein the cooling element comprises at least one cooling fin. A cooling element is, in particular, an element that increases the surface area of ​​a specific surface, especially a heat-emitting and / or heat-generating surface, and dissipates this absorbed heat to the surroundings. It is, in particular, a passive cooling element. For this purpose, the cooling element comprises at least one cooling fin, which can also be referred to as a cooling fin or cooling lamella. This cooling element can also be designed as a heat sink, and in particular as a mini heat sink, or be referred to as such. The cooling element, and in particular the at least one cooling fin, can be arranged on or attached to one of the heat-generating elements, or it can be integrated into the printed circuit board element, as will be explained further below.This enables particularly efficient heat dissipation and cooling.

[0030] It may be additionally or alternatively provided that the cooling fin is formed within the printed circuit board element. In particular, one or more such cooling fins are integrally formed with and / or provided within the printed circuit board element, especially in the core or the core material of the printed circuit board element. For example, one or more recesses and / or material removals may be provided in the printed circuit board element, the remaining material or its protrusion forming one or more cooling fins. Alternatively or additionally, the material of the printed circuit board element may include a material layer or protrusion that forms one or more cooling fins. In particular, one or more cooling fins are provided in the printed circuit board element where no other elements are arranged. This enables particularly simple and cost-effective heat dissipation.

[0031] It may additionally or alternatively be provided that the access device further comprises a computing element that is electronically connected to the circuit board element, the sensor element, and / or the control element, with the heat dissipation element being arranged on the computing element. A computing element, which may also be referred to as a processor element, processor unit, and / or microprocessor, may in particular be provided as a central computing unit, which is, for example, provided on and attached to a central circuit board element and electronically connected to it, and is electronically, electrically, and / or signal-wise connected to one, in particular several, and furthermore in particular all, sensor elements and / or control elements, either on the same circuit board element or, for example, via a cable, and receives data from them and / or provides instructions to them.In particular, the processing element can control and / or effect both the detection of an object and the control of a flap element, especially in conjunction with at least one sensor element and / or at least one control element. The heat dissipation element is preferably arranged on the processing element, and in particular on the processing element itself. Specifically, the heat dissipation element can be designed as a cooling element with at least one cooling fin and be arranged on or on the processing element. Additionally or alternatively, a cooling element can also be provided on one or more, in particular all, of the sensor elements and / or the control elements. This enables particularly efficient heat dissipation.

[0032] It may additionally or alternatively be provided that the printed circuit board element includes at least one connector element, wherein the heat dissipation element is designed as a stamped grid of the connector element. The printed circuit board element may include at least one connector element, for example, to be detachably connected to another printed circuit board element electronically, electrically, and / or for signaling purposes. In particular, for example, a computing element may be arranged on a first, central printed circuit board element, and at least one sensor element on a second printed circuit board element. These two printed circuit board elements can then be connected via a connector element, which typically includes a plug and / or a plug receptacle. The connector element is attached to and / or encompasses the printed circuit board element by means of a stamped grid.The stamped grid can have a shape that is particularly advantageous for heat dissipation, going beyond mere contact. In particular, the stamped grid can have projections and / or overhangs that promote heat conduction. This enables particularly integrated heat conduction.

[0033] It may additionally or alternatively be provided that the printed circuit board element comprises at least one pin extending substantially perpendicularly from a surface of the printed circuit board element, the heat dissipation element being configured as the pin. The pin, which may also be referred to as a stud, extends away from at least one surface of the printed circuit board element, in particular from one or both of the main surfaces, extending along the length and width and not along the height or thickness. The pin may have a substantially cylindrical, rectangular, and / or square cross-section and extend substantially perpendicularly away from the printed circuit board element, in particular by an integer and / or multiple multiple of the height or thickness of the printed circuit board element.In particular, several such pins are provided, especially in close proximity to an element arranged on the printed circuit board element, such as one or more sensor elements, control elements, computing elements, and / or connector elements. These pins can be arranged in one or more vias and / or holes of the printed circuit board element. This enables particularly efficient heat dissipation.

[0034] In particular, the pin may be designed solely for heat dissipation. Specifically, the pin has no electronic function. Specifically, the pin does not perform any electronic, electrotechnical, and / or signal-related function and / or interact with any of the elements arranged on the circuit board, such as one or more sensor elements, control elements, computing elements, and / or connector elements. Specifically, the pin(s) perform no function other than heat conduction and / or heat dissipation. For example, the pin may be designed as a so-called action pin. This also enables particularly integrated heat conduction.

[0035] The heat dissipation element can be thermally connected to a body panel of the vehicle and configured to transfer heat to that panel. In particular, the heat dissipation element can be arranged directly on a body panel, allowing it to transfer heat to the panel via a small gap, especially an air gap. Alternatively or additionally, the heat dissipation element can be directly connected to the body panel. Specifically, one or more cooling fins and / or one or more pins can contact a body panel to transfer the absorbed heat. In particular, a part of the circuit board element, especially a non-electrically conductive part, and further, especially an electrically insulated part, can also be connected to and / or contact the body panel.The body panel in question can be, in particular, an exterior body panel that is connected to the environment, especially the outside air. This enables particularly efficient heat dissipation. In particular, this also makes it possible to passively warm or heat the body panel.

[0036] In particular, the body panel can be designed as the flap element. The heat is then transferred to the flap element. This results in a particularly short path and thus efficient heat dissipation.

[0037] In particular, the body element may be designed as a handle. A handle is an element into which a driver or passenger engages, especially to gain entry into the vehicle. For this purpose, the handle may include, in particular, a recess or hole into which a human hand can be inserted. In particular, a pull and / or lever mechanism may also be provided that enables and / or causes the opening of the flap element and, in particular, a door.

[0038] In particular, the handle element can be provided to comprise a housing, with the access device being at least partially arranged within the housing. Specifically, the housing provides an outer contour for the handle element, which can be used for gripping or actuation. The housing can be hollow, at least in sections, and accommodate one or more components of the access device. In particular, at least the heat dissipation element and one or more of the circuit board element, the sensor element, the control element, and / or the computing element are provided within the housing. This results in a particularly compact and efficient heat dissipation.

[0039] In particular, the housing may be designed to have a thermally conductive material property and / or a thermally conductive coating, especially made of a metallic material. For example, the housing may be at least partially and / or sectionally made of a metal and / or comprise a metal, such as iron, steel, silver, copper, gold, and / or aluminum. This thermal conductivity can also provide a defrosting function for the housing.

[0040] Advantageously, the handle element can be designed as an external handle element. An external handle element is a handle element located on the outside of the flap element or the vehicle, allowing the flap element to be opened from the outside. Alternatively or additionally, the handle element can be designed as an internal handle element. An internal handle element is a handle element located on the inside of the flap element or the vehicle.

[0041] The heat dissipation element is intended for use in motor vehicles, particularly in the passenger compartment, and allows the flap element to be opened from the interior, especially in the form of a door. It is also particularly suitable for the defrosting function of the handle element, especially an exterior handle element.

[0042] In particular, existing elements or features of the handle that serve a different technical function, such as providing a grip recess and / or grip surface, can be used to great advantage as heat dissipation elements. The heat dissipation element can also be used as a decorative element.

[0043] The invention also relates to a flap control system comprising at least one access device and at least one flap element, as also described above. In particular, the flap control system comprises several flap elements and, furthermore, several access devices, in particular exactly one access device for all flap elements or exactly one access device for each individual flap element.

[0044] The invention also relates to a motor vehicle with one or more of the access devices described above and / or one or more of the flap control systems described above. In particular, the motor vehicle has at least two doors and a trunk lid, each of which is designed as a flap element and each of which comprises such an access device or together forms a flap control system.

[0045] Further advantages, features, and details of the invention will become apparent from the following description, in which exemplary embodiments of the invention are described in detail with reference to the drawings. The features mentioned in the claims and in the description can be essential to the invention individually or in any combination. It shows:

[0046] Fig. 1 is a schematic top view of an access device according to exemplary embodiments of the invention;

[0047] Fig. 2 shows a schematic top view of an access device according to further embodiments of the invention; and

[0048] Fig. 3 shows a perspective view of an access device according to further embodiments of the invention.

[0049] In the following figures, identical reference numerals are used for the same technical features even for different embodiments.

[0050] Fig. 1 shows a schematic top view of an access device 100 according to exemplary embodiments of the invention. The access device 100 is encompassed by a motor vehicle (not shown here for clarity) and serves to control at least one flap element of the motor vehicle (also not shown here).

[0051] The flap element covers an interior space of the motor vehicle when closed and at least partially exposes it when open. The flap element is designed, for example, as a door and / or trunk lid and can also include a handle element, which is not shown in this figure and will be explained in connection with Figure 2. The access device 100 comprises at least one sensor element 110, which is configured to detect an activation action and, in particular, to recognize an object, such as a hand or other object, in the vicinity of the flap element during operation, and especially also to detect an approach and / or a gesture.The access device 100 also includes a control element 120, which is configured to perform control based on the detected activation action and, in particular, to control a locking, unlocking, and / or movement of the flap element based on the detected object. In particular, the control element is configured to effect a movement, especially an opening and / or closing of the flap element, for example, via an actuator, which is also not shown here.

[0052] The access device 100 also includes a printed circuit board element 130, which is electronically connected to the sensor element 110 and the control element 120, wherein the sensor element 110 is arranged on and attached to the printed circuit board element 130. The access device 100 also includes a computing element 150, which is arranged on the printed circuit board element and is electronically connected to the sensor element 110 and the control element.

[0053] The access device 100 also includes several heat dissipation elements 140, various types of which are shown here as examples. These elements are designated with reference numerals 141, 142, 142-1, 142-2, 143, and 161 and are explained below. The heat dissipation elements 140 are designed to dissipate heat generated during the operation of the access device 100. The heat dissipation elements are encompassed by and / or formed by the circuit board element 130.

[0054] For example, the heat dissipation element 140 can be designed as a thermally conductive element 141 made of a thermally conductive material, which is integral with the circuit board element 130 and thus forms the heat dissipation element 140. Alternatively or additionally, the heat dissipation element 140 can comprise a cooling element 142, wherein the cooling element 142 comprises at least one cooling fin 142-1, 142-2. Shown here by way of example is first the cooling element 142, which is arranged on the sensor element 110 and comprises several cooling fins, one of which is designated by reference numeral 142-1. Also shown by way of example is the cooling element 142, which comprises several cooling fins formed in the circuit board element 130, for example by material removal, wherein one exemplary cooling fin is designated by reference numeral 142-2.Also shown by way of example is the heat dissipation element, which is designed as pin 143 and which extends essentially perpendicularly from a surface 131 of the circuit board element 130, which in this case lies in the plane of the drawing. This pin 143 serves exclusively for heat dissipation and has no electronic function whatsoever and is arranged directly adjacent to the computing element 150.

[0055] The circuit board element 130 also comprises at least one connector element 160, which connects the circuit board element 130 and the elements 110, 120, 150 arranged thereon, as well as further electronic elements 101, by way of example, to another sensor element and / or circuit board element not shown, wherein the heat dissipation element 140 is designed as a stamped grid 161 of the connector element 160. The circuit board element 130 and, in particular, all elements of the access device 100 according to the invention are shown here by way of example arranged in a housing 10, which has a thermally conductive material property and / or a thermally conductive coating. The housing 10 is connected to a body element 20 of the motor vehicle, which is shown here by way of example as a flap element 21. The heat generated and dissipated by the access device 100 is thereby transferred to the housing 10 and to the body element 20.

[0056] Fig. 2 shows a schematic top view of an access device 100 according to further embodiments of the invention.

[0057] In contrast to the access device 100 shown in Fig. 1, the circuit board element 130 is physically connected to the housing 10, firstly on the upper side by direct contact of the circuit board element 130, which comprises a thermally conductive material and thus forms the thermal conducting element 141, and secondly on the lower side by the formation of several cooling fins 142-2, which are formed from the circuit board element 130 by material removal. The body element 20 shown here is designed as a handle element 22, which can form both an outer handle element 22-1 and an inner handle element 22-2.

[0058] Fig. 3 shows a perspective view of an access device 100 according to further embodiments of the invention.

[0059] In contrast to the examples shown in Figs. 1 and 2, the heat dissipation element 140 is designed here as a cooling element 142 with several cooling fins 142-2 extending along the entire surface 131 of the printed circuit board element 130. The cooling fins 142-2 are arranged in groups of four, running in two rows one above the other, with two additional fins provided on each of the left and right sides. Any elements, in particular one or more computing elements, sensor elements, and / or control elements, as shown in Fig. 1, are arranged, in particular, on the surface (not shown here) opposite the surface 131. In particular, these elements are arranged centrally on the opposite surface so that heat generated by these elements can be dissipated through the surface 131 shown here.The cooling fins can be formed, in particular, by material tapering, along which the material thickness of the printed circuit board element 130 is reduced. Specifically, the edges can be chamfered or the material tapering can be gradual. Alternatively or additionally, the cooling fins can also be formed by material removal, along which the printed circuit board element 130 contains no material. Reference numeral list: Housing, Body element, Flap element, Handle element -1, Outer handle element -2, Inner handle element 0, Device 1, Electronic element 0, Sensor element 0, Control element 0, Printed circuit board element 1, Surface 0, Heat dissipation element 1, Heat conduction element 2, Cooling element 2-1, Cooling fin 2-2, Cooling fin 3, Pin 0, Calculator element 0, Connector element 1, Stamped grid.

Claims

Claims 1. Access device (100) for a motor vehicle, in particular for operating a flap element that covers an interior of the motor vehicle in a closed state and at least partially releases it in an open state, wherein the access device (100) comprises: a sensor element (110) configured to detect an activation action and preferably to detect an object in the vicinity of the flap element, a control element (120) configured to perform control based on the detected activation action and preferably to control a locking, unlocking and / or movement of the flap element based on the detected object, a circuit board element (130) that is electronically connected to the sensor element (110) and / or the control element (120), a heat dissipation element (140) configured to dissipate heat generated during operation of the access device (100),wherein the heat dissipation element (140) is encompassed by the circuit board element (130).

2. Access device (100) according to claim 1 , characterized in that the printed circuit board element (130) comprises a heat conducting element (141) made of a heat-conducting material which is integral with the printed circuit board element (130) and which forms the heat dissipation element (140).

3. Access device (100) according to one of the preceding claims, characterized in that the heat dissipation element (140) comprises a cooling element (142), wherein the cooling element comprises at least one cooling fin (142-1 , 142-2).

4. Access device (100) according to claim 3, characterized in that the at least one cooling fin (142-2) is formed in the printed circuit board element (130).

5. Access device (100) according to one of the preceding claims, characterized in that the access device (100) further comprises a computing element (150) which is connected to the circuit board element (130), the sensor element (110) and / or the The control element (120) is electronically connected, wherein the heat dissipation element (140) is arranged on the computing element (150).

6. Access device (100) according to one of the preceding claims, characterized in that the circuit board element (130) comprises at least one plug element (160) and that the heat dissipation element (140) is designed as a stamped grid (161) of the plug element (160).

7. Access device (100) according to one of the preceding claims, characterized in that the printed circuit board element (130) comprises at least one pin (143) which extends substantially perpendicularly from a surface (131) of the printed circuit board element (130) and that the heat dissipation element (140) is designed as the pin (143).

8. Access device (100) according to claim 7, characterized in that the pin (143) serves exclusively for heat dissipation and is designed in particular without electronic function.

9. Access device (100) according to one of the preceding claims, characterized in that the heat dissipation element (140) is thermally connected to a body element (20) of the motor vehicle and is designed to transfer heat to the body element. 19 10. Access device (100) according to claim 9, characterized in that the body element (20) is designed as the flap element (21).

11. Access device (100) according to claim 9 or 10, characterized in that the body element (20) is designed as a handle element (22).

12. Access device (100) according to claim 11, characterized in that the handle element (22) is designed as an outer handle element (22-1) and / or as an inner handle element (22-2).

13. Access device (100) according to claim 11 or 12, characterized in that the handle element comprises a housing (10) and that the access device (100) is at least partially arranged in the housing (10).

14. Access device (100) according to claim 13, characterized in that the housing (10) has a thermally conductive material property and / or a thermally conductive coating, in particular made of a metallic material.

15. Motor vehicle comprising an access device (100) according to any one of the preceding claims.

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