Miniature integrated piezoelectric pump device

Abstract

The present invention relates to a miniature integrated piezoelectric pump device, comprising a pump body, a valve body, and a bottom substrate, wherein a hollow vibration cavity is provided inside the pump body; the valve body is mounted below the pump body, and comprises a first fixing layer, an elastic film layer, a second fixing layer and a side wall portion assembled from top to bottom; one of the first fixing layer and the elastic film layer is provided with a normally closed hole; when the pump body is in a first working state, the other one of the first fixing layer and the elastic film layer covers the normally closed hole, and the vibration cavity is not in communication with the inside of the side wall portion; when the pump body is in a second working state, the second fixing layer abuts against the elastic film layer, the other one of the first fixing layer and the elastic film layer leaves the normally closed hole, and the vibration cavity is in communication with the inside of the side wall portion; and the bottom substrate serves as a bottom plate and is fixed to the bottom of the side wall portion, and can supply power to and control the pump body. Compared with the prior art, the miniature integrated piezoelectric pump device of the present invention can reduce fluid leakage.

Description

Miniature integrated piezoelectric pump device TECHNICAL FIELD

[0001] The present application relates to the technical field of piezoelectric pumps, in particular to a miniature integrated piezoelectric pump device. BACKGROUND

[0002] A piezoelectric pump is a miniature pump that uses the inverse piezoelectric effect of piezoelectric materials to drive fluid transport. It generates periodic deformation of the piezoelectric vibrator under the action of high-frequency voltage, extruding or pushing the fluid in the pump cavity to achieve continuous flow.

[0003] As a miniature device with strong coupling between materials, structures, fluids, electronics, and processes, piezoelectric pumps have the advantages of small size, low power consumption, high specific back pressure, large specific flow, high response speed, and high flow accuracy. They have a wide range of applications in medical devices and semiconductor thermal management, especially in wearable and portable medical devices and micro-space cooling management applications. However, the existing structure of piezoelectric pumps in this technical field is still difficult to adapt to the increasing miniaturization and ultrathin application requirements due to the limitations of the power supply circuit.

[0004] However, during the process of miniaturization and ultrathin structure improvement of existing piezoelectric pumps, it is often found that fluid leakage occurs, affecting the performance. SUMMARY

[0005] To solve the above problems, according to the embodiments of the present application, a miniature integrated piezoelectric pump device is provided, and the technical scheme is as follows:

[0006] A miniature integrated piezoelectric pump device, comprising:

[0007] A pump body with a hollow vibration cavity inside;

[0008] A valve body installed below the pump body, including from top to bottom: a first fixed layer, an elastic membrane layer, a second fixed layer, and a side wall part for fixing the first fixed layer, the elastic membrane layer, and the second fixed layer; one of the first fixed layer and the elastic membrane layer is provided with a normally closed hole; when the pump body is in a first working state, the other of the first fixed layer and the elastic membrane layer covers the normally closed hole, and the vibration cavity is not connected with the inside of the side wall part; when the pump body is in a second working state, the second fixed layer abuts against the elastic membrane layer, and the other of the first fixed layer and the elastic membrane layer is away from the normally closed hole, and the vibration cavity is connected with the inside of the side wall part; and

[0009] A bottom substrate as a bottom plate fixed with the side wall part, capable of supplying power to and controlling the pump body.

[0010] Compared with the prior art, the micro integrated piezoelectric pump device can ensure miniaturization and ultra-thin under the premise that the first fixed layer, the elastic film layer and the second fixed layer are stacked to realize that the valve body can be opened only when the first fixed layer and the elastic film layer bend to the side wall part and the elastic film layer abuts against the second fixed layer, effectively reducing fluid leakage and improving the reliability of the micro integrated piezoelectric pump device. Moreover, the bottom substrate is used as the substrate for mounting after the chip is sealed and as the bottom plate of the valve body, and the space utilization rate is high.

[0011] In one embodiment, the normally closed hole is arranged in the first fixed layer; the elastic film layer is provided with a transmission hole; the second fixed layer is provided with a transmission opening; the transmission hole is staggered with the normally closed hole in the projection in the up-down direction; and the transmission hole and the normally closed hole are located in the transmission opening.

[0012] In the above structure, the valve body can be opened only when the elastic film layer does not cover the normally closed hole, and the fluid can flow into the inside of the side wall part through the normally closed hole, the transmission hole and the transmission opening.

[0013] In one embodiment, a plurality of transmission holes are arranged around the outer periphery of the normally closed hole in the projection in the up-down direction.

[0014] Through the above structure, the flow rate of the fluid when the valve body is opened can be increased, so as to accelerate the flow rate of the fluid.

[0015] In one embodiment, the normally closed hole is arranged in the elastic film layer; the first fixed layer is provided with a transmission hole; the second fixed layer is provided with a transmission opening; the transmission hole is staggered with the normally closed hole in the projection in the up-down direction; and the transmission hole and the normally closed hole are located in the transmission opening.

[0016] In the above structure, the valve body can be opened only when the first fixed layer does not cover the normally closed hole, and the fluid can flow into the inside of the side wall part through the transmission hole, the normally closed hole and the transmission opening.

[0017] In one embodiment, the elastic film layer is provided with a recess on the side surface facing the first fixed layer, and the normally closed hole penetrates through the recess; the first fixed layer is provided with an abutting table on the side facing the elastic film layer, and the abutting table can cover the normally closed hole.

[0018] Through the above structure, the fluid can be temporarily stored in the recess before the valve is opened, and can immediately enter the inside of the side wall part when the normally closed hole is opened.

[0019] In one embodiment, a plurality of transmission holes are arranged around the outer periphery of the normally closed hole in the projection in the up-down direction and communicate with the recess.

[0020] Through the above structure, when the valve is opened, the flow into the recess can be increased, thereby increasing the flow rate of the fluid.

[0021] In one embodiment, the side wall portion is provided with a boss protruding inwardly, the boss is provided with a boss transmission hole extending from top to bottom, the boss is provided with a side wall outlet communicating with the boss transmission hole and the outer side of the side wall portion; the second fixed layer is provided with a second avoiding opening corresponding to the boss; the elastic membrane layer covers the second avoiding opening and is spaced apart from the boss; the first fixed layer is provided with a first avoiding opening opposite to the second avoiding opening.

[0022] Through the above structure, the micro integrated piezoelectric pump device can be pressure released when not working.

[0023] In one embodiment, the side of the boss facing the elastic membrane layer is covered with a reinforcing sheet spaced apart from the elastic membrane layer, the boss transmission hole penetrates through the boss and the reinforcing sheet; the sum of the thicknesses of the boss and the reinforcing sheet is greater than or equal to the thickness of the side wall portion.

[0024] Through the above structure, the micro integrated piezoelectric pump device can be pressure released when working, the boss transmission hole can be better sealed, and fluid leakage from the boss transmission hole can be prevented.

[0025] In one embodiment, the elastic membrane layer is further provided with a sound absorbing portion; the sound absorbing portion includes a plurality of blocks protruding towards the first fixed layer; in the upward and downward direction projection, each block surrounds the outer periphery of the boss transmission hole, and is provided with a gap extending radially along the boss transmission hole between each other, and the small end of each block faces the boss transmission hole.

[0026] Through the above structure, the elastic modulus of the elastic membrane layer can be increased, the abnormal sound can be reduced, and noise reduction can be achieved.

[0027] In one embodiment, the pump body includes, from top to bottom: a top heat sink, a flow channel plate, a resonance plate, a vibrator, an outer frame in which the vibrator is embedded, and an electrode plate; the vibrator is hollow below; the vibrator includes an elastic plate and a piezoelectric element, the elastic plate is embedded in the outer frame, and the piezoelectric element is mounted on the side of the elastic plate away from the resonance plate; the electrode plate includes a frame one part, a frame two part and a cantilever, the frame one part and the frame two part are insulated from each other, the cantilever extends from the frame two part and is electrically connected to one side of the piezoelectric element away from the elastic plate; the frame one part is electrically connected to one side of the piezoelectric element facing the elastic plate through the outer frame and the elastic plate; the side wall portion is provided with a conductive through hole spaced apart and penetrating from top to bottom; the bottom substrate is electrically connected to the frame one part and the frame two part through the conductive through hole to supply power and control the piezoelectric element.

[0028] In the above structure, the cantilever can move with the elastic fluctuation of the elastic plate, and the electrode plate can increase the contact area for power supply, thereby improving the stability of power supply to the piezoelectric element and reducing the installation difficulty.

[0029] In one embodiment, the pump body further comprises a cushion layer, which is electrically connected between the outer frame and the electrode plate.

[0030] Through the above structure, the vibration space of the vibrator and the contact area between the electrode plate and the outer frame can be increased.

[0031] In one embodiment, the pump body further comprises a separation layer for providing buffering, which is located between the electrode plate and the first fixed layer.

[0032] Through the above structure, the vibration of the pump body to the valve body can be buffered, and the influence of the vibration of the pump body on the operation of the valve body can be reduced.

[0033] In one embodiment, the pump body further comprises two conductive grooves, which are located in the one part of the surrounding frame, at least penetrating the cushion layer and the electrode plate, and communicating with the vibration cavity; one of the two conductive grooves is close to the conductive through hole for electrically connecting with the one part of the surrounding frame.

[0034] In the above structure, the open conductive groove can reduce the gap and cavity caused by filling the internal conductive glue, avoid open circuit, and solve the problem of impedance rise caused by poor heat dissipation after long time work.

[0035] In one embodiment, the cantilever comprises an extension, a connecting part, a tooth part and a separation groove; the extension extends from the second part of the surrounding frame to the inside; the connecting part is located at one end of the extension away from the second part of the surrounding frame in the extension direction; the tooth part comprises a plurality of semicircles arranged in the extension direction, and the two tooth parts are respectively located on the two sides of the connecting part in the direction perpendicular to the extension direction; the separation groove is opened in the middle of the connecting part and extends along the extension direction until it communicates with the vibration cavity; in the direction in which the one side tooth part points to the other side tooth part, the width of the separation groove is equal to the diameter of the tooth part.

[0036] Through the above structure, the adhesion of the cantilever on the piezoelectric element can be ensured, thereby improving the stability of electrical connection.

[0037] In one embodiment, the vibrator comprises:

[0038] The elastic plate comprises a reinforcing part and a support frame; the reinforcing part has a circular sheet structure, one side of which faces the resonant plate; the support frame comprises a plurality of side beams, inclined support beams and inner beams surrounding the outer periphery of the reinforcing part; both ends of each inclined support beam in the extending direction are connected to the outer frame; each side beam is connected between two adjacent inclined support beams, and the inner beam is connected from the middle of the side beam to the reinforcing part;

[0039] A piezoelectric unit is arranged on the side of the reinforcing part facing away from the resonant plate and is electrically connected to the reinforcing part, and the cantilever is electrically connected to the side of the piezoelectric unit facing away from the reinforcing part.

[0040] The above structure enables the elastic plate to obtain uniform support, ensures the flatness of the reinforcing part, and thus ensures the pumping capacity. In addition, the distance between the inclined support beam and the reinforcing part can be adjusted to obtain the required vibration frequency, thereby improving the applicability of the micro-integrated piezoelectric pump device.

[0041] In one embodiment, the vibrator comprises:

[0042] The elastic plate comprises a reinforcing part and a support frame; the reinforcing part has a circular sheet structure, one side of which faces the resonant plate; the support frame comprises a plurality of side beams, inclined support beams and inner beams surrounding the outer periphery of the reinforcing part; both ends of each inclined support beam in the extending direction are connected to the outer frame; one end of each adjacent two inclined support beams close to each other is connected to a side beam, and the ends of the two side beams away from the inclined support beam are close to each other and are respectively connected to two inner beams arranged at intervals; one end of the inner beam away from the side beam is connected to the reinforcing part; both ends of the same inclined support beam in the extending direction are respectively connected to a side beam;

[0043] A piezoelectric unit is arranged on the side of the reinforcing part facing away from the resonant plate and is electrically connected to the reinforcing part, and the cantilever is electrically connected to the side of the piezoelectric unit facing away from the reinforcing part.

[0044] The above structure can improve the stability and consistency of the vibration of the vibrator, improve the vibration frequency, so that better vibration effect can be obtained at a smaller amplitude, and reduce the damage of PZT ceramic piezoelectric elements.

[0045] In one embodiment, the width of the side beam is smaller than the width of the inclined support beam.

[0046] The above structure can not only ensure the support of the reinforcing part and the piezoelectric element, but also provide a larger elastic deformation range.

[0047] In one embodiment, a plurality of avoiding grooves are formed on the resonant plate, and each avoiding groove surrounds the side beam and the inner beam between the two adjacent inclined support beams in the upward and downward direction projection.

[0048] Through the above structure, the collision between the resonant plate and the vibrator can be reduced, and the influence on the vibration range of the vibrator can be reduced.

[0049] In one embodiment, the flow channel plate comprises a center through hole, flow channels and short channels; the center through hole is located in the middle of the flow channel plate, a plurality of flow channels are distributed along the circumference of the center through hole, one end of each flow channel communicates with the center through hole, and the other end extends radially outward along the center through hole; the short channels are connected to one end of each flow channel away from the center through hole and extend to the outside of the flow channel plate on both sides of the flow channel in a direction perpendicular to the extension direction of the flow channel.

[0050] Through the above structure, more fluid can flow into the flow channel plate together, and the fluid flowing into the flow channel plate is buffered, and the turbulence is reduced.

[0051] In one embodiment, the flow channel plate comprises a center through hole and flow channels; the center through hole is located in the middle of the flow channel plate, a plurality of flow channels are distributed along the circumference of the center through hole, one end of each flow channel communicates with the center through hole, and the other end extends radially outward along the center through hole; the top heat dissipation plate is provided with heat dissipation plate holes respectively communicating with each flow channel; the flow channel plate further comprises a plurality of strip-shaped holes distributed near the edge of the flow channel plate, and each avoidance groove is arranged opposite to each strip-shaped hole.

[0052] Through the above structure, a large amount of fluid can be ensured to flow into the flow channel plate together, and the fluid flowing into the flow channel plate is buffered, the turbulence is reduced, and the obstacle caused by the flow channel plate to the vibration of the vibrator is reduced, so that the amplitude of the vibrator is increased. BRIEF DESCRIPTION OF DRAWINGS

[0053] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments will be briefly introduced below, and the features and advantages of the present application can be more clearly understood by referring to the drawings. The drawings are schematic and should not be understood as any limitation on the present application. For those skilled in the art, other drawings can be obtained without creative labor on the basis of these drawings.

[0054] Fig. 1 is an exploded view of a pump body of a micro integrated piezoelectric pump device according to embodiment 1 of the present application.

[0055] Fig. 2 is a schematic view of the pump body of the micro integrated piezoelectric pump device after assembly according to embodiment 1 of the present application.

[0056] Fig. 3 is an isometric side view of a flow channel plate of the pump body of the micro integrated piezoelectric pump device according to embodiment 1 of the present application.

[0057] FIG. 4 is an isometric view of a resonance plate of a pump body of a micro-integrated piezoelectric pump device according to Embodiment 1 of the present application.

[0058] FIG. 5 is a plan view of an elastic plate of a pump body of a micro-integrated piezoelectric pump device according to Embodiment 1 of the present application.

[0059] FIG. 6 is an isometric view of an outer frame of a pump body of a micro-integrated piezoelectric pump device according to Embodiment 1 of the present application.

[0060] FIG. 7 is a schematic view of a combination of an elastic plate and an outer frame of a pump body of a micro-integrated piezoelectric pump device according to Embodiment 1 of the present application.

[0061] FIG. 8 is an isometric view of an electrode plate of a pump body of a micro-integrated piezoelectric pump device according to Embodiment 1 of the present application.

[0062] FIG. 9 is a schematic view of a first operating state of a pump body of a micro-integrated piezoelectric pump device according to Embodiment 1 of the present application.

[0063] FIG. 10 is a schematic view of a second operating state of a pump body of a micro-integrated piezoelectric pump device according to Embodiment 1 of the present application.

[0064] FIG. 11 is a schematic view of a third operating state of a pump body of a micro-integrated piezoelectric pump device according to Embodiment 1 of the present application.

[0065] FIG. 12 is an exploded view of a valve body of a micro-integrated piezoelectric pump device according to Embodiment 1 of the present application.

[0066] FIG. 13 is an isometric view of a first fixing layer of a valve body of a micro-integrated piezoelectric pump device according to Embodiment 1 of the present application.

[0067] FIG. 14 is an isometric view of an elastic film layer of a valve body of a micro-integrated piezoelectric pump device according to Embodiment 1 of the present application.

[0068] FIG. 15 is an isometric view of a second fixing layer of a valve body of a micro-integrated piezoelectric pump device according to Embodiment 1 of the present application.

[0069] FIG. 16 is an isometric view of a side wall portion of a valve body of a micro-integrated piezoelectric pump device according to Embodiment 1 of the present application.

[0070] FIG. 17 is a plan view of a bottom substrate of a valve body of a micro-integrated piezoelectric pump device according to Embodiment 1 of the present application.

[0071] FIG. 18 is a schematic view of a first operating state of a valve body of a micro-integrated piezoelectric pump device according to Embodiment 1 of the present application.

[0072] Fig. 19 is a schematic diagram of a second working state of the valve body of the micro-integrated piezoelectric pump device according to Embodiment 1 of the present application.

[0073] Fig. 20 is a schematic diagram of a third working state of the valve body of the micro-integrated piezoelectric pump device according to Embodiment 1 of the present application.

[0074] Fig. 21 is a schematic diagram of a micro-integrated piezoelectric pump device according to Embodiment 2 of the present application.

[0075] Fig. 22 is a schematic diagram of a micro-integrated piezoelectric pump device according to Embodiment 3 of the present application.

[0076] Fig. 23 is an isometric side view of a top heat sink of a micro-integrated piezoelectric pump device according to Embodiment 3 of the present application.

[0077] Fig. 24 is an isometric side view of a flow channel plate of a micro-integrated piezoelectric pump device according to Embodiment 3 of the present application.

[0078] Fig. 25 is a schematic diagram of a micro-integrated piezoelectric pump device according to Embodiment 4 of the present application.

[0079] Fig. 26 is a schematic diagram of an assembled pump body of a micro-integrated piezoelectric pump device according to Embodiment 4 of the present application.

[0080] Fig. 27 is a top view of a flow channel plate of a micro-integrated piezoelectric pump device according to Embodiment 4 of the present application.

[0081] Fig. 28 is a top view of a vibrator mounted to an outer frame of a micro-integrated piezoelectric pump device according to Embodiment 4 of the present application.

[0082] Fig. 29 is a top view of a spacer layer of a micro-integrated piezoelectric pump device according to Embodiment 4 of the present application.

[0083] Fig. 30 is a top view of an electrode plate of a micro-integrated piezoelectric pump device according to Embodiment 4 of the present application.

[0084] Fig. 31 is a top view of a separation layer of a micro-integrated piezoelectric pump device according to Embodiment 4 of the present application.

[0085] Fig. 32 is a top view of a first fixing layer of a micro-integrated piezoelectric pump device according to Embodiment 4 of the present application.

[0086] Fig. 33 is a top view of an elastic film layer of a micro-integrated piezoelectric pump device according to Embodiment 4 of the present application.

[0087] Fig. 34 is a top view of a side wall portion of a micro-integrated piezoelectric pump device according to Embodiment 4 of the present application.

[0088] 100 pump body; 102 vibration cavity; 104 pump cavity; 110 top heat sink; 120 flow channel plate; 122 center through hole; 124 flow channel; 126 short channel; 130 resonance plate; 132 center hole; 134 avoidance slot; 140 vibrator; 150 elastic plate; 152 reinforcing portion; 154 support frame; 155 side beam; 156 inclined support beam; 157 mounting convex portion; 158 inner beam; 160 piezoelectric element; 170 outer frame; 172 square opening; 177 mounting groove; 180 internal hollow; 182 corner hollow; 184 side hollow; 190 electrode plate; 192 surrounding frame; 194 cantilever; 195 insulation strip; 196 surrounding frame part; 198 surrounding frame part; 200 valve body; 210 first fixed layer; 212 normally closed hole; 214 first avoidance opening; 220 elastic film layer; 222 transmission hole; 230 second fixed layer; 232 transmission opening; 234 second avoidance opening; 240 side wall portion; 241 side wall outlet; 242 first step wall; 244 second step wall; 246 third step wall; 248 boss; 249 boss transmission hole; 250 conductive via hole; 300 bottom substrate; 310 substrate hole; 320 control unit; 350 power supply unit; 1100 pump body; 1110 top heat sink; 1120 flow channel plate; 1130 resonance plate; 1170 outer frame; 1190 electrode plate; 1200 valve body; 1210 first fixed layer; 1220 elastic film layer; 1230 second fixed layer; 1240 side wall portion; 1300 bottom substrate; 2100 pump body; 2110 top heat sink; 2112 heat sink hole; 2120 flow channel plate; 2122 center through hole; 2124 flow channel; 2200 valve body; 3100 pump body; 3300 bottom substrate; 3110 top heat sink; 3112 heat sink hole; 3120 flow channel plate; 3122 center through hole; 3124 flow channel; 3126 strip hole; 3140 vibrator; 3150 elastic plate; 3154 support frame; 3155 side beam; 3156 inclined support beam; 3158 inner beam; 3160 piezoelectric element; 3190 electrode plate; 3194 cantilever; 3194A extension; 3194B connecting portion; 3194C tooth portion; 3194D separation groove; 3400 heightening layer; 3410 separation layer; 3420 conductive groove; 3200 valve body; 3210 first fixed layer; 3212 transmission hole; 3214 first avoidance opening; 3215 abutting table; 3220 elastic film layer; 3222 normally closed hole; 3224 recessed portion; 3226 sound reduction portion; 3230 second fixed layer; 3240 side wall portion; 3248 boss; 3249 boss transmission hole; 3251 reinforcing sheet. DETAILED DESCRIPTION

[0089] In order to enable a more clear understanding of the above-mentioned objects, features and advantages of the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0090] In the following description, a large number of specific details are set forth in order to facilitate a thorough understanding of the present application, but the present application can also be implemented in other manners different from those described herein, and therefore, the protective scope of the present application is not limited by the specific embodiments disclosed below.

[0091] The applicant analyzes and studies the existing piezoelectric pump structure, finds that in order to realize miniaturization and ultra-thin, the existing piezoelectric pump often reduces the setting of parts as much as possible, and a structure in which a single elastic membrane covers the fluid inlet and outlet is universally adopted. However, if the elastic membrane is too loose, it will be difficult to open the inlet and outlet; if it is set too loose, the covering effect will be poor, the sealing will not be strict, and leakage will occur, and the elastic membrane will also be fatigued after long-term use, and eventually fluid leakage will still occur.

[0092] Therefore, the applicant sets a first fixed layer, an elastic membrane layer and a second fixed layer in the micro integrated piezoelectric pump device provided by the present application. On the one hand, the first fixed layer, the elastic membrane layer and the second fixed layer are sheet structures, which will not have too much impact on miniaturization and ultra-thin, and on the other hand, the valve needs the first fixed layer and the elastic membrane layer to bend to the second fixed layer at the same time, and the elastic membrane layer abuts against the second fixed layer, so that the first fixed layer and the elastic membrane layer can be opened only when they are separated, thereby improving the sealing performance of the valve under the premise of ensuring miniaturization and ultra-thin.

[0093] The micro integrated piezoelectric pump device provided by the embodiment of the present application will be described in detail below with reference to the accompanying drawings.

[0094] Embodiment 1

[0095] FIG. 1 is an exploded view of a micro integrated piezoelectric pump device according to an embodiment of the present application. FIG. 2 is a schematic view of the pump body of a micro integrated piezoelectric pump device according to an embodiment of the present application after assembly.

[0096] As shown in FIG. 1 and FIG. 2, the micro integrated piezoelectric pump device according to the present embodiment comprises a pump body 100, a valve body 200 and a bottom substrate 300 stacked in sequence in a straight direction as the arrangement direction, wherein in the present embodiment, the arrangement direction is the up-down direction; wherein the bottom substrate 300 serves as the bottom plate of the micro integrated piezoelectric pump device, and supplies power to and controls the pump body 100 and the valve body 200, the valve body 200 is located between the pump body 100 and the bottom substrate 300, and the bottom substrate 300 at the bottom is connected to the pump body 100 through the valve body 200 to supply power to the pump body 100. With the movement of the pump body 100, the pump body 100 draws fluid from the outside, and opens the valve body 200 to make the fluid flow in a certain direction in the micro integrated piezoelectric pump device. In the present embodiment, the pump body 100 and the valve body 200 have consistent outer peripheral shape and size, so that the assembled micro integrated piezoelectric pump device has uniform and consistent external shape, which is convenient for transportation and storage, and is suitable for integration into various practical application products.

[0097] The pump body 100 of the micro integrated piezoelectric pump device of the present embodiment will be described in detail below with reference to FIG. 1 to FIG. 11.

[0098] As shown in FIG. 1, the pump body 100 of the present embodiment comprises, in sequence from top to bottom, a top heat dissipation plate 110, a flow channel plate 120, a resonance plate 130, a vibrator 140, an outer frame 170 in which the vibrator 140 is embedded, and an electrode plate 190. The above-mentioned multi-layer elements have consistent outer peripheral size and shape, and form consistent pump body 100 external shape after assembly. In the present embodiment, the flow channel plate 120, the resonance plate 130 and the outer frame 170 are assembled together by bonding.

[0099] In the present embodiment, the top heat dissipation plate 110 is located at the topmost part of the pump body 100, the plate surface of the top heat dissipation plate 110 is perpendicular to the up-down direction, and cooperates with the flow channel plate 120 below to form a channel for fluid to enter. The top heat dissipation plate 110 can be made of copper, aluminum alloy or carbon fiber composite material to have good heat conduction and dissipation capacity. Alternatively, in other embodiments, the top heat dissipation plate 110 can also be made of ceramic material as needed.

[0100] As shown in Fig. 3, in the present embodiment, the flow channel plate 120 located below the top heat sink plate 110 has a plate surface parallel to the plate surface of the top heat sink plate 110, a center through hole 122 passing through the flow channel plate 120 at a center position, and flow channels 124 recessed on the surface of the flow channel plate 120 towards the side of the top heat sink plate 110, the flow channels 124 connecting the center through hole 122 and the outside of the side edges of the flow channel plate 120 to allow fluid to flow in from the outside of the side edges. In the present embodiment, the flow channel plate 120 is rectangular when projected in the up-down direction, the center through hole 122 is circular, the axis of the center through hole 122 extends in the up-down direction, and the four flow channels 124 are evenly distributed around the center through hole 122 in the circumferential direction and extend to the four corners of the flow channel plate 120 in the radial direction of the center through hole 122. Further, as shown in Fig. 3, a short channel 126 intersecting the four corners and connected to each flow channel 124 is provided at the end of each flow channel 124 away from the center through hole 122, the extension direction of each short channel 126 is not parallel to the extension direction of the connected flow channel 124, for example, the extension direction of the short channel 126 is perpendicular to the extension direction of the connected flow channel 124, and the short channel 126 is bidirectionally connected to the outside, so that the end of each flow channel 124 is connected to two adjacent side edges, and the four corner portions of the flow channel plate 120 remain intact. The bidirectionally connected short channels 126 can provide greater fluid inflow when the micro-integrated piezoelectric pump device is in operation, and can provide a buffering effect at the connection between the flow channels 124 and the outside, achieving smoother fluid inflow and outflow, avoiding too rapid fluid flow, and also preserving the corner portions around the flow channel plate for alignment and assembly with other elements above and below during installation. The flow channel plate 120 can be made of stainless steel or carbon fiber composite material.

[0101] Referring to Fig. 4, in the present embodiment, the resonant plate 130 located below the flow channel plate 120 has a center hole 132 passing through it, and the center hole 132 is connected to the center through hole 122. Further, the center hole 132 is coaxial with the center through hole 122, and the diameter of the center hole 132 is smaller than the diameter of the center through hole 122, so as to ensure that the fluid return from the pump body 100 to the outside is small enough when the micro-integrated piezoelectric pump device is in operation, forming a one-way transport of fluid into the pump body 100. For example but not limited to, the diameter of the center through hole 122 is set to be in the range of 4.5mm to 6.0mm and is calculated and optimized according to the different resonant frequencies required, and correspondingly, the diameter of the center hole 132 is set to be in the range of 0.5mm to 1.2mm. Further, the resonant plate 130 also has relief grooves 134 around the center hole 132, the positions of the relief grooves 134 correspond to the vibration positions of the vibrator 140 support, so as to avoid the flow channel plate 120 support from fluctuating vibration when the vibrator 140 vibrates, reduce the impact and collision between elements, avoid element failure caused by vibration, and improve the overall durability of the micro-integrated piezoelectric pump device.

[0102] As shown in FIGS. 5-7, in this embodiment, the resonant plate 130 is below a combination of the vibrator 140 and the outer frame 170. The vibrator 140 includes the elastic plate 150 and the piezoelectric unit 160. The outer frame 170 is used to support the elastic plate 150, which is embedded into the separately manufactured outer frame 170 with a gap between them. The elastic plate 150 is opposite to the resonant plate 130, and the piezoelectric unit 160 is located on the side of the elastic plate 150 opposite to the resonant plate 130 and close to the middle, so that the elastic plate 150 vibrates. When the piezoelectric unit 160 does not vibrate, the resonant plate 130 is spaced apart from the elastic plate 150, so that the vibration cavity 102 is formed between them, and the pump cavity 104 is formed below the elastic plate 150 together with the pump body 100; when the piezoelectric unit 160 vibrates, the fluid flows into the vibration cavity 102 through the central hole 132, and then flows into the pump cavity 104 from the gap between the vibrator 140 and the outer frame 170. In assembly, the elastic plate 150 and the outer frame 170 can also be embedded at the same time using the bonding method, so that they are more firmly combined and can withstand vibration for a longer time without loosening. In this embodiment, the outer frame 170 has a square opening 172 in the middle, and a mounting groove 177 is formed on the inner side facing the square opening 172 for mounting the elastic plate 150. The elastic plate 150 can be integrally formed, for example, cut from a carbon composite sheet. The outer frame 170 can be made of stainless steel, carbon fiber composite material, etc.

[0103] As shown in FIG. 5 and FIG. 6, the elastic plate 150 includes a reinforcing portion 152 and a support frame 154. The reinforcing portion 152 is a circular sheet structure, and a protrusion (not labeled) is arranged near the center of the side surface of the resonant plate 130, so that when the elastic plate 150 protrudes towards the resonant plate 130, the reinforcing portion 152 is closer to the center hole 132. The piezoelectric element 160 can be fixed to the side surface of the reinforcing portion 152 away from the resonant plate 130 by adhesion or welding, between the reinforcing portion 152 and the electrode plate 190. The support frame 154 includes a side beam 155 and a diagonal beam 156, the diagonal beam 156 is embedded on the outer frame 170 around the outside of the reinforcing portion 152, and the side beam 155 is connected between two adjacent diagonal beams 156 and connected with the reinforcing portion 152. The avoidance slot 134 is arranged opposite to the side beam 155. With the ups and downs of the reinforcing portion 152, the side beam 155 rises and falls relative to the avoidance slot 134, and in the above structure, the diagonal beam 156 and the side beam 155 uniformly support the reinforcing portion 152, so that the reinforcing portion 152 remains flat and is not prone to fluid pumping capacity decline caused by local deformation; in addition, the diagonal beam 156 can adjust the vibration frequency of the straight beam, the closer the diagonal beam 156 is to the reinforcing portion 152, the higher the vibration frequency of the reinforcing portion 152 during work; the farther the diagonal beam 156 is from the reinforcing portion 152, the lower the vibration frequency of the reinforcing portion 152 during work. Adjusting the relative position between the diagonal beam 156 and the reinforcing portion 152 can adjust the vibration frequency of the reinforcing portion 152 according to the required function, even the vibration frequency is higher than 20KHz, and when working in the ultrasonic frequency band, it will not produce too high vibration frequency, too high frequency, for example, more than 30KHz, will cause the flow to decrease, the heat dissipation of the pump body to increase, and fatigue failure is easy to occur.

[0104] In the present embodiment, the support frame 154 comprises four side beams 155 and four inclined support beams 156 which are alternately connected to each other to form the octagonal structure, wherein two adjacent side beams 155 are arranged on the outer periphery of the reinforcing portion 152 with their extending directions perpendicular to each other, and the middle part of the extending direction is connected to the reinforcing portion 152, and each inclined support beam 156 is connected between two adjacent side beams 155 and extends in a direction which is not parallel to the extending direction of the adjacent side beam 155. Further, two adjacent inclined support beams 156 are symmetrically arranged along a straight line passing through the center of the reinforcing portion 152. Further, the side beam 155 is narrower than the inclined support beam 156, and the structure of the side beam 155 and the inclined support beam 156 with different widths can provide a larger elastic deformation range. Further, there is a gap between the side beam 155 and the reinforcing portion 152, and the support frame 154 further comprises an inner beam 158 extending radially inward from the side beam 155 to the reinforcing portion 152, which is connected to the reinforcing portion 152 through the inner beam 158 to provide better vibration performance. Further, four radially outward extending inner beams 158 are uniformly arranged around the reinforcing portion 152, and four side beams 155 with equal length are arranged at the outer ends of the four inner beams 158, wherein the adjacent side beams 155 are perpendicular to each other.

[0105] The adjacent side beams 155 are connected by the inclined support beam 156, and the inclined support beam 156 extends to both ends of the outer side edge of the side beam 155 and is convexly provided with a mounting protrusion 157 on the side surface facing away from the vibrator 140, which is matched with the mounting groove 177 of the outer frame 170 to be embedded together during installation. The above structure makes the elastic plate 150 only need a suitable thickness of material (such as 0.25mm to 0.3mm) to be processed by etching or laser processing in one layer of material through different steps or hollowing processing, and the entire elastic plate 150 has good overall flatness and is not easy to produce local deformation to cause the yield of the pump to decrease; the mounting protrusion 157 is arranged at the two inclined angles of the ends of the inclined support beam 156, so that the inclined support beam 156 forms a stepped structure towards the side surface of the outer frame 170, which is matched with the mounting groove 177 of the outer frame 170 with the same inclined angle shape, and the shape makes the vibrator 140 and the outer frame 170 more stable and not easy to loosen.

[0106] As shown in FIG. 7, after the elastic plate 150 is assembled with the outer frame 170, the side beams 155 are parallel to the side edges of the square openings 172 of the outer frame 170, and the diagonal beams 156 are cut at the four corners of the square openings 172 of the outer frame 170, thereby forming corner hollows 182 at the four corners. The support frames 154 and the reinforcing portions 152 of the elastic plate 150 form a plurality of internal hollows 180. The support frames 154 can be arranged such that the width of one side beam 155 from the outer side to the outer side of another side beam 155 parallel thereto is slightly narrower than the corresponding width of the square opening 172 of the outer frame 170, thereby forming an elongated side hollow 184 between the adjacent side beams 155 and the side edges of the outer frame 170. As shown in FIG. 7, after the elastic plate 150 is assembled with the outer frame 170, the corner hollows 182 are formed between the support frames 154 of the elastic plate 150 and the outer frame 170 at the four corners, and the side hollows 184 are formed between the side beams 155 and the outer frame 170. The corner hollows 182 and the side hollows 184 are a plurality of gaps formed between the elastic plate 150 and the outer frame 170 and spaced apart from each other. Thus, in the combination of the assembled vibrator 140 and the outer frame 170, a plurality of internal hollows 180, corner hollows 182, and side hollows 184 are spaced apart from each other, so that the fluid can flow quickly through the hollow spaces during operation, thereby reducing the flow resistance. Further, the thickness of the outer frame 170 is greater than or equal to the thickness of the vibrator 140 formed by stacking the elastic plate 150 and the piezoelectric element 160. Optionally, the thickness of the outer frame 170 can range from 0.35 mm to 0.5 mm, and the thickness of the vibrator 140 can range from 0.35 mm to 0.45 mm. The size settings can ensure that sufficient vibration space is provided while ensuring that the overall size of the micro-integrated piezoelectric pump device meets the requirements of various ultra-thin applications. The elastic plate 150 with the above structure can provide excellent vibration performance for the pump body 100 of the micro-integrated piezoelectric pump device, and the structure allows the elastic plate 150 to be integrally cut on a single piece of material, facilitating manufacturing, saving raw materials, and reducing manufacturing costs. The embedded assembly of the elastic plate 150 and the outer frame 170 is conducive to improving the manufacturing error tolerance of the elastic plate 150, facilitating assembly, and also has excellent adaptability. The elastic plate 150 can be assembled with outer frames having different external shapes, thereby being applicable to different pump bodies and pump devices, and thus being applicable to various different application products. The elastic plate 150 can be made of fiber-reinforced composite material. The vibrator 140 includes the above-mentioned substantially linear support frames 154, which can fully utilize the enhanced modulus of the fiber direction of the fiber-reinforced composite material, thereby providing better vibration performance and durability. The elastic plate 150 and the outer frame 170 can be made of different materials and then embedded and bonded or bonded, which is conducive to meeting the requirements of ultra-thin and low heat generation of the vibrator structure, and also enables the outer frame 170 to meet the requirements of wafer dicing machines.For example, the elastic plate 150 can be made of stainless steel or carbon fiber composite material, and the outer frame 170 can be made of glass fiber or carbon fiber composite material, ceramic, stainless steel, etc., wherein the glass fiber and ceramic material used can be subjected to a metallization process.

[0107] As shown in Fig. 8, the electrode plate 190 is located below the vibrator 140 and has a surrounding frame 192 and a cantilever 194 extending inwardly from the surrounding frame 192. The surrounding frame 192 can include two insulating strips 195 separating the surrounding frame 192 into a surrounding frame part 196 and a surrounding frame part 198 which are insulated from each other, wherein the surrounding frame part 196 is electrically connected to the outer frame 170, the surrounding frame part 198 is insulated from the outer frame 170, and the cantilever 194 extends inwardly from the surrounding frame part 198. The electrode plate 190 is made of a conductive metal material, such as copper. During operation of the pump body 100, the cantilever 194 is connected to the side of the piezoelectric element 160 away from the reinforcing part 152 for power supply. The surrounding frame part 196 is connected to the outer frame 170 by conductive glue, and since the outer frame 170 and the elastic plate 150 are good conductors, the piezoelectric element 160 is supplied with power on the side facing the reinforcing part 152 through the surrounding frame part 196, the conductive glue, the outer frame 170, and the elastic plate 150. Thus, low impedance power supply is achieved for the two electrode surfaces of the piezoelectric element, and power loss is reduced.

[0108] The fixing method of the electrode plate 190 and the outer frame 170 of the vibrator 140 is that the surrounding frame part 196 of the electrode plate 190 is bonded or keyed to the outer frame 170 by conductive glue, and the surrounding frame part 198 is bonded or keyed to the outer frame 170 by insulating glue. The cantilever 194 and the piezoelectric element 160 are connected by tin soldering or silver paste high-temperature curing.

[0109] Further, in the assembled pump body 100, the central through hole 122 of the flow channel plate 120, the central hole 132 of the resonant plate 130, the reinforcing part 152 of the elastic plate 150, and the piezoelectric element 160 are coaxial, thereby providing excellent fluid flow performance and oscillation effect.

[0110] The working process of the pump body 100 of the present embodiment will be described in detail below with reference to Figs. 9 to 11. When the pump body 100 of the present embodiment is in operation, the piezoelectric element 160 is powered to generate radial expansion and contraction movement, driving the vibrator 140 to vibrate and achieving fluid pumping.

[0111] Specifically, as shown in Fig. 9, the pump body 100 is in a first working state, the vibrator 140 is not powered, and the piezoelectric element 160 is in a flat and undeformed state.

[0112] As shown in Fig. 10, the pump body 100 is in the second working state. During the vibration of the vibrator 140, when the piezoelectric element 160 is stretched, the reinforcing portion 152 of the vibrator 140 is depressed to expand the vibration cavity 102; at the same time, the support frame 154 is bent upward to form a high pressure area above it; at this time, the space of the expanded vibration cavity 102 above the reinforcing portion 152 forms a low pressure; so that the fluid flows from the outside of the pump body 100 into the expanded vibration cavity 102 through the flow channel 124 and the center through hole 122 of the flow channel plate 120, and the center hole 132 of the resonant plate 130, realizing the suction of the fluid.

[0113] As shown in Fig. 11, the pump body 100 is in the third working state. During the vibration of the vibrator 140, when the piezoelectric element 160 is contracted, the reinforcing portion 152 of the vibrator 140 is convex to narrow the vibration cavity 102 to form a high pressure area; at the same time, the support frame 154 area is depressed above it to form a low pressure area; at this time, since the center position above the reinforcing portion 152 is a high pressure area with large flow resistance, and the surrounding is a low pressure area with small flow resistance, as shown by the arrows in Fig. 11, the fluid flows from the high pressure area at the center position to the surrounding low pressure area, and part of the fluid flows downward from the hollow part of the support frame 154; due to the size of the above-mentioned center hole 132 and center through hole 122, only a small amount of fluid is discharged from the vibration cavity 102 to the outside of the pump body 100 through the center hole 132, the center through hole 122 and the flow channel 124. This makes the amount of fluid flowing out when the piezoelectric element 160 vibrates upward much less than the amount of fluid sucked in when the piezoelectric element 160 vibrates downward, realizing the unidirectional flow of fluid. When the pressure in the cavity of the pump body 100 increases to a certain pressure value, the amount of fluid flowing from the pump cavity 104 below the vibrator 140 to the vibration cavity 102 above the vibrator 140 through the multiple hollow structures of the vibrator 140 when the piezoelectric element 160 vibrates downward is roughly equal to the amount of fluid flowing from the vibration cavity 102 to the pump cavity 104 through the multiple hollow structures of the vibrator 140 when the piezoelectric element 160 vibrates upward, reaching dynamic balance. At this time, the micro integrated piezoelectric pump device reaches the zero flow back pressure state, and the fluid in it only oscillates and does not form unidirectional flow.

[0114] The valve body 200 of the micro integrated piezoelectric pump device of the embodiment will be described in detail below with reference to Figs. 12 to 20.

[0115] As shown in Fig. 12, the valve body 200 of the present embodiment comprises, from top to bottom, a first fixed layer 210, an elastic film layer 220, a second fixed layer 230, and a side wall portion 240 for fixing the first fixed layer 210, the elastic film layer 220, and the second fixed layer 230. The bottom surface of the side wall portion 240 is fixed with a bottom substrate 300 as a bottom plate. The elastic film layer 220 and the second fixed layer 230 have the same size, and the length and width of the first fixed layer 210 are greater than those of the elastic film layer 220 and the second fixed layer 230, so that the first fixed layer 210 can cover the elastic film layer 220 and the second fixed layer 230. The side wall portion 240 and the bottom substrate 300 have the same outer peripheral size and shape, and form a uniform outer shape of the valve body 200 after assembly. In addition, the pump body 100 and the valve body 200 can have the same outer peripheral shape and size, so that the assembled micro-integrated piezoelectric pump device has a uniform outer shape. The thickness of the side wall portion 240 is greater than the total thickness of the first fixed layer 210, the elastic film layer 220, and the second fixed layer 230, so as to form a space for accommodating the chip and the device on the bottom substrate 300, accommodating the deformation of the elastic film layer 220, and providing fluid flow. The first fixed layer 210, the elastic film layer 220, the second fixed layer 230, and the side wall portion 240 of the valve body 200 together form a normally closed valve and a normally open valve.

[0116] Referring to Fig. 13, the first fixed layer 210 is formed with a normally closed hole 212 and a first relief opening 214, and the size of the first relief opening 214 is greater than that of the normally closed hole 212. The first relief opening 214 is used to provide a relief space for accommodating the upward deformation of the elastic film layer 220 when the elastic film layer 220 deforms upward.

[0117] As shown in FIG. 14, the first fixed layer 210 is below the elastic film layer 220. The elastic film layer 220 is made of material with good elasticity, such as rubber. The elastic film layer 220 is formed with a transmission hole 222 corresponding to the normally closed hole 212 of the first fixed layer 210. When no external force is applied, the elastic film layer 220 covers the normally closed hole 212 and the first escape opening 214. The transmission hole 222 can be set as a plurality of independent fan-shaped small holes, which are circumferentially arranged outside the normally closed hole 212 to form a circular area. The center of the circular area is a solid part and is opposite to the normally closed hole 212 of the first fixed layer 210. This setting allows the solid part to block the normally closed hole 212 when the elastic film layer 220 is in a flat state or an upward deformation state. When the elastic film layer 220 is in a downward deformation state, the solid part of the elastic film layer 220 deforms downward to open the normally closed hole 212, and the normally closed hole 212 can communicate with the transmission hole 222. In the embodiment, the elastic film layer 220 is integrally made of a single piece of elastic film material. In other embodiments, the elastic film layer 220 is divided into two pieces of elastic film pieces covering the normally closed hole 212 and the first escape opening 214, respectively.

[0118] As shown in FIG. 15, the elastic film layer 220 is below the second fixed layer 230 for supporting the elastic film layer 220 and providing space for the downward movement of the elastic film layer 220. The second fixed layer 230 is formed with a transmission opening 232 corresponding to the transmission hole 222 of the elastic film layer 220, and a second escape opening 234 corresponding to the first escape opening 214 of the first fixed layer 210. The transmission opening 232 can be circular and has a size larger than the circular area surrounded by the transmission hole 222 and the normally closed hole 212, for providing an escape space for the downward deformation of the elastic film layer 220 and a fluid communication path from the normally closed hole 212 via the transmission hole 222 and the transmission opening 232 of the downwardly deformed elastic film layer 220. In the embodiment, the axis of the transmission opening 232 extends vertically to the side of the second fixed layer 230. The second escape opening 234 can have the same size as the first escape opening 214 of the first fixed layer 210, and is located corresponding to the first escape opening 214 of the first fixed layer 210, for providing an escape space for the downward deformation of the elastic film layer 220. Further, the normally closed hole 212 is coaxial with the transmission opening 232 to increase the difference in bending amount between the first fixed layer 210 and the elastic film layer 220 when they are bent downward.

[0119] Referring to FIG. 16, in the present embodiment, the side wall portion 240 has a multi-step structure with a hollow opening enclosed by four side walls, thereby forming a cavity for containing fluid, and the interior of the pump body 100 is in communication with or separated from the cavity of the side wall portion 240 with the movement of the piezoelectric element 160. The opening of the side wall portion 240 is in communication with the upper and lower sides to facilitate the installation of the first fixed layer 210, the elastic film layer 220, and the second fixed layer 230. The multi-step structure includes, from top to bottom, a first step wall 242 forming a first opening size, a second step wall 244 forming a second opening size, and a third step wall 246 forming a third opening size, with the first, second, and third opening sizes decreasing in turn. The third step wall 246 further includes a boss 248 located in the opening of the side wall portion 240 and extending inward from a side inner wall, and a boss transmission hole 249 formed in the boss 248 and extending downward from the upper surface of the boss 248, the boss transmission hole 249 serving as a pressure relief hole for discharging part of the fluid in the pump cavity 104 and reducing the pressure in the pump cavity 104 after the pump body 100 stops working. In the up-down direction, the upper surface of the boss 248 is lower than the top surface of the third step wall 246. Further, the boss transmission hole 249 can extend downward from the upper surface of the boss 248 and pass through the boss 248. The side wall portion 240 is formed with a side wall outlet 241 from the boss transmission hole 249 to the outside of the side wall portion 240 on the side wall where the boss 248 is located, the extension direction of the side wall outlet 241 being perpendicular to the extension direction of the boss transmission hole 249, and one end of the side wall outlet 241 being in communication with the outside of the side wall and the other end being in communication with the boss transmission hole 249. It is shown in the figure that the side wall outlet 241 is located at the bottom of the side wall portion 240. It should be understood that the side wall outlet 241 can be arranged at other suitable positions of the side wall portion according to requirements. The first opening size of the first step wall 242 matches the first fixed layer 210, and the second opening size of the second step wall 244 matches the elastic film layer 220 and the second fixed layer 230. When the first fixed layer 210, the elastic film layer 220, and the second fixed layer 230 are assembled to the side wall portion 240, the first fixed layer 210 is contained in the first opening enclosed by the first step wall 242 and is supported by the top surface of the second step wall 244, and the elastic film layer 220 and the second fixed layer 230 are contained in the second opening enclosed by the second step wall 244 and are supported by the top surface of the third step wall 246. The boss transmission hole 249 of the boss 248 corresponds to the position of the second relief opening 234. Thus, the boss 248 of the side wall portion 240 cooperates with the elastic film layer 220 and the first fixed layer 210 and the second fixed layer 230 to block the boss transmission hole 249 when the elastic film layer 220 is in a downward deformed state, and to allow the boss transmission hole 249 to be in communication with the space in the valve body 200 when the elastic film layer 220 is in a flat state or an upward deformed state. The side wall portion 240 of the valve body 200 is made of an insulating material.

[0120] After assembly, the normally closed hole 212 of the first fixed layer 210 and the transmission hole 222 of the elastic film layer 220 together form a normally closed valve. When the elastic film layer 220 is in an undeformed flat state, the normally closed hole 212 is closed by the elastic film layer 220, and the passage is closed. The first relief opening 214 of the first fixed layer 210 and the boss transmission hole 249 of the boss 248 together form a normally open valve. When the elastic film layer 220 is in an undeformed flat state, there is a gap between the elastic film layer 220 and the boss 248, and the boss transmission hole 249 is not covered by the elastic film layer 220, so the passage from the inside of the valve body 200 to the outside is open.

[0121] In addition, with continuous reference to FIG. 16, two spaced-apart through holes 250 can be formed in the side wall portion 240, and the through holes 250 are filled with conductive material. The power supply unit 350 of the bottom substrate 300 is in electrical communication with the electrode plate 190 of the pump body 100 through the through holes 250, so as to supply power to the piezoelectric element 160 of the pump body 100 to control the vibration action. The two through holes 250 are respectively connected to and in electrical communication with the frame one portion 196 and the frame two portion 198 of the electrode plate 190, and are respectively in electrical communication with the frame body 170 and the cantilever 194, so as to supply power to the piezoelectric element 160 of the vibrator 140 and avoid short circuit. The through holes 250 of the valve body 200 can effectively reduce the number of elements, realize a compact, efficient and reliable power supply and control mode, and reduce the structure size, so that the micro integrated piezoelectric pump device can be applied to more application scenarios. The conductive material can be, for example but not limited to, copper material, silver material, etc. Compared with the traditional pad power supply mode, the power supply mode of the bottom substrate 300 to the piezoelectric element 160 through the through holes 250, the frame one portion 196 and the frame two portion 198 of the electrode plate 190, the cantilever 194, the frame body 170 and the elastic plate 150 not only improves the integration of the piezoelectric pump device, but also provides sufficient elasticity, so that even if the elastic plate 150 moves up and down, the electrical connection can still be maintained well, and the stability of power supply is improved. In addition, since the sheet-shaped frame one portion 196 and the frame two portion 198 are located in the same layer in the up-down direction, the connection mode of connecting the frame one portion 196 and the frame two portion 198 to the upper and lower sides of the piezoelectric element 160 respectively through the through holes 250 connected to the mutually insulated frame one portion 196 and the frame two portion 198 can reduce the space volume of the micro integrated piezoelectric pump device and improve the integration. Moreover, only the through holes 250 are provided in the side wall portion 240, and then the sheet-shaped frame one portion 196 and the frame two portion 198 are connected to the through holes 250, which not only increases the contact area and improves the stability of electrical connection, but also eliminates the step of aligning the electrode plate 190 with the through holes 250 when the electrode plate 190 is mounted to the side wall portion 240, thereby reducing the assembly difficulty.

[0122] As shown in FIG. 17, in the present embodiment, the valve body 200 takes the bottom substrate 300 as its bottom plate. The bottom substrate 300 is consistent with the outer shape and size of the sidewall part 240, and is fixedly connected with the sidewall part 240 below. The bottom substrate 300 includes a substrate hole 310, a control unit 320, and a power supply unit 350 corresponding to and electrically connected with the conductive through hole 250 in the sidewall part 240; the substrate hole 310 is arranged at the center of the bottom substrate 300 facing the pump cavity 104, for fluid to enter and exit the valve body 200 without the need for additional connecting pipelines. The control unit 320 includes a chip arranged on the bottom substrate 300, a driving device, and an input and output port for electrical connection and communication with the outside. The components arranged on the bottom substrate 300 can be arranged away from the position of the substrate hole 310 and the boss 248 of the sidewall part 240, to facilitate assembly. The bottom substrate 300 is made of a circuit layer and an insulating layer.

[0123] The working process of the valve body 200 of the present embodiment is described in detail below with reference to FIGS. 18-20.

[0124] As shown in FIG. 18, the valve body 200 according to the embodiment of the present application is in the first working state, in which the inner and outer pressures are consistent, the elastic film layer 220 is in a flat and undeformed state, the normally closed one-way valve is closed, i.e., the normally closed hole 212 and the first relief opening 214 of the first fixed layer 210 are blocked by the elastic film layer 220; the normally open one-way valve is open, i.e., the gap between the convex transmission hole 249 and the flat elastic film layer 220 is not blocked, allowing fluid to flow.

[0125] As shown in Fig. 19, the valve body 200 provided by the embodiment of the present application is in the second working state, when the pump body 100 above the valve body 200 works, the pressure P2 above the valve body 200 is higher than the pressure P1 in the valve body 200, and acts on the first fixed layer 210 and the elastic film layer 220 through the normally closed hole 212, the first fixed layer 210 and the elastic film layer 220 are deformed downward, because the second fixed layer 230 stops the elastic film layer 220 and the normally closed hole 212 is close to the center of the transmission opening 232, the first fixed layer 210 and the elastic film layer 220 are different in the degree of bending in the transmission opening 232, the first fixed layer 210 and the elastic film layer 220 are separated at the corresponding position of the transmission opening 232, the normally closed check valve is opened, that is, the downward deformed elastic film layer 220 leaves the normally closed hole 212 of the first fixed layer 210, so that the normally closed hole 212 communicates with the inside of the valve body 200 through the transmission hole 222 of the elastic film layer 220, as shown by the arrow, the fluid enters the inside of the valve body 200 from above through the normally closed hole 212 and the transmission hole 222, and flows out from the substrate hole 310 of the bottom substrate 300; at the same time, the normally open check valve is closed, that is, the downward deformed elastic film layer 220 blocks the boss transmission hole 249 on the boss 248, and the fluid cannot flow through it.

[0126] As shown in Fig. 20, the valve body 200 provided by the embodiment of the present application is in the third working state, when the pump body 100 stops working, the pressure P1 in the valve body 200 is higher than the pressure P2 above the valve body 200, the elastic film layer 220 is deformed upward, the normally closed check valve is closed, that is, the upward deformed elastic film layer 220 blocks the normally closed hole 212 of the first fixed layer 210, and the fluid cannot flow through it; at the same time, the normally open check valve is opened, that is, the upward deformed elastic film layer 220 leaves the boss transmission hole 249 on the boss 248, as shown by the arrow, the fluid enters the inside of the valve body 200 from below through the substrate hole 310 in the center of the bottom substrate 300, passes through the boss transmission hole 249, and then is discharged out of the valve body 200 through the side wall outlet 241.

[0127] The following describes the assembly and fixation of the pump body 100 and the valve body 200. The pump body 100 and the valve body 200 are assembled by fixing the bottom surface of the electrode plate 190 at the bottom of the pump body 100 to the top surface of the side wall portion 240 of the valve body 200. The bottom surface of the electrode plate 190 at the bottom of the pump body 100 and the top surface of the side wall portion 240 of the valve body 200 can be fixed by using a flexible insulating adhesive. When fixed, the flexible adhesive avoids the conductive body of the conductive through hole 250 of the side wall portion 240 of the valve body 200, so that the conductive body of the conductive through hole 250 is in contact with and electrically connected to the frame one portion 196 and the frame two portion 198 of the electrode plate 190, respectively, to achieve the power supply and control of the piezoelectric element 160 in the pump body 100 from the bottom substrate 300. The power supply circuit of the piezoelectric element 160 in the pump body 100 from the bottom substrate 300 is as follows: from one power supply unit 350 of the bottom substrate 300, via one conductive through hole 250 in the side wall portion 240, the frame one portion 196 of the electrode plate 190 electrically connected to the conductive through hole 250, the outer frame 170 above the frame one portion 196, the elastic plate 150 fitted with the outer frame 170, and further electrically connected to the upper surface of the piezoelectric element 160; from another power supply unit 350 of the bottom substrate 300, via another conductive through hole 250 in the side wall portion 240, the frame two portion 198 of the electrode plate 190 electrically connected to the conductive through hole 250, the cantilever 194 extending from the frame two portion 198, and further electrically connected to the lower surface of the piezoelectric element 160. Thus, the power supply circuit of the piezoelectric element 160 is formed.

[0128] In addition, the pump body 100 and the valve body 200, as well as the layers of the pump body 100 and the valve body 200, can be combined by making microstructures on a wafer and then using eutectic bonding or resin bonding. This can quickly complete the bonding of materials at a relatively low temperature, which helps to protect the integrity of the device, avoid damage to the device caused by high temperature, provide higher yield, better consistency, and facilitate rapid mass production.

[0129] According to the valve body 200 provided in the embodiment, the chip and the driving device are integrated on the PCB bottom plate by using the integrated design of microelectronics and micromechanics. The internal structure is reasonably distributed, the volume of the piezoelectric pump body is reduced, and the overall mechanical and electronic area and volume are greatly reduced. The integrated algorithm IC, i.e., the chip, is integrated on the PCB bottom plate, which greatly reduces the development cycle of the downstream application and improves the spatial benefit of the downstream user. The circuit path is provided on the side wall portion to supply power to the pump body 100 and communicate, which not only reduces the volume and improves the space utilization rate, but also reduces external interference and improves the stability and reliability of the system.

[0130] Embodiment 2

[0131] FIG. 21 is a schematic diagram of a micro-integrated piezoelectric pump device according to Embodiment 2 of the present application.

[0132] As shown in Fig. 21, a micro-integrated piezoelectric pump device according to the embodiment 2 of the present application comprises a pump body 1100 with a circular outer periphery, a valve body 1200 and a bottom substrate 1300. The pump body 1100 comprises, from top to bottom, a top heat sink 1110, a flow channel plate 1120, a resonant plate 1130, an outer frame 1170 in which a resonator 140 is embedded, and an electrode plate 1190. The above-mentioned multi-layered elements of the pump body 1100 have a uniform outer periphery size and a circular outer periphery shape, and form the pump body 1100 with a circular outer periphery after assembly. The pump body 1100 of the present embodiment has substantially the same internal structure as the pump body 100 of the first embodiment, except that the outer periphery shape of the multi-layered elements is circular, and the rest of the structure will not be described here again. Since the square opening structure in the middle of the outer frame 1170 is the same as the square opening in the middle of the outer frame 170 of the first embodiment, the resonator 140 composed of the elastic plate 150 and the piezoelectric element 160 of the first embodiment can be matched therewith.

[0133] The valve body 1200 of the present embodiment comprises, from top to bottom, a first fixed layer 1210, an elastic film layer 1220, a second fixed layer 1230 and a side wall portion 1240, and the side wall portion 1240 is used to fixedly mount the above-mentioned first fixed layer 1210, elastic film layer 1220 and second fixed layer 1230; the bottom substrate 1300 is fixed to the bottom surface of the side wall portion 1240. The side wall portion 1240 and the bottom substrate 1300 have a uniform outer periphery size and a circular outer periphery shape, and form the valve body 1200 with a circular outer periphery after assembly, and match the above-mentioned pump body 1100. Although the outer periphery shape of the side wall portion 1240 of the valve body 1200 and the bottom substrate 1300 is circular, the internal structure of the valve body 1200 is the same as that of the pump body 100 of the first embodiment, and the first fixed layer, the elastic film layer and the second fixed layer of the valve body 1200 are the same as those of the first embodiment, and will not be described here again.

[0134] Embodiment 3

[0135] Fig. 22 is a schematic diagram of a micro-integrated piezoelectric pump device according to the embodiment 3 of the present application. Fig. 23 is an isometric side view of a top heat sink of a micro-integrated piezoelectric pump device according to the embodiment 3 of the present application. Fig. 24 is an isometric side view of a flow channel plate of a micro-integrated piezoelectric pump device according to the embodiment 3 of the present application.

[0136] As shown in FIGS. 22-24, a micro-integrated piezoelectric pump device according to embodiment 3 of the present application comprises a pump body 2100, a valve body 2200 and a bottom substrate 2300. The valve body 2200 has substantially the same structure as the valve body 200 of embodiment 1. The pump body 2100 comprises, from top to bottom, a top heat sink plate 2110, a flow channel plate 2120, a resonant plate, an outer frame and an electrode plate. The resonant plate, the vibrator, the outer frame and the electrode plate of the pump body 2100 have the same structure as the resonant plate 130, the vibrator 140, the outer frame 170 and the electrode plate 190 of embodiment 1. The difference is that, as shown in FIG. 23, the top heat sink plate 2110 of embodiment 3 has a plurality of heat sink holes 2112 formed therein, which extend through the heat sink plate 2110 in the up-down direction. As shown in FIG. 24, the flow channel plate 2120 of embodiment 3 has a central through hole 2122 and a plurality of flow channels 2124 which communicate with the central through hole 2122. The plurality of flow channels 2124 are evenly distributed around the central through hole 2122, and each flow channel 2124 extends radially outward from the central through hole 2122 and communicates with the heat sink hole 2112 formed in the top heat sink plate 2110, thereby forming a passage for fluid to enter the pump body 2100. The central through hole 2122 of the flow channel plate 2120 communicates with the central hole of the resonant plate below. The micro-integrated piezoelectric pump device of the present embodiment has a simple processing procedure and low manufacturing cost.

[0137] Embodiment 4

[0138] As shown in FIGS. 25 and 26, a micro-integrated piezoelectric pump device according to embodiment 4 of the present application comprises a pump body 3100, a valve body 3200 and a bottom substrate 3300. The structure of the micro-integrated piezoelectric pump device is substantially the same as that of embodiment 1, the pump body 3100, the valve body 3200 and the bottom substrate 3300 have the same outer peripheral size and shape, and the micro-integrated piezoelectric pump device has a rectangular outer shape when projected in the up-down direction. The difference is that:

[0139] The pump body 3100 comprises, from top to bottom, a top heat sink plate 3110, a flow channel plate 3120, a resonant plate, a vibrator 3140, an outer frame in which the vibrator 3140 is embedded, a spacer layer 3410, an electrode plate 3190 and a cushion layer 3400. The vibrator 3140 can be integrally formed with the outer frame, or can be separately provided from the outer frame.

[0140] As shown in FIG. 26, the top heat sink plate 3110 of embodiment 4 has a plurality of heat sink holes 3112 formed therein, which extend through the top heat sink plate 3110 in the up-down direction.

[0141] As shown in Fig. 27, the flow channel plate 3120 has a central through hole 3122, a plurality of flow channels 3124 communicating with the central through hole 3122, and a plurality of strip holes 3126. The plurality of flow channels 3124 are evenly distributed around the central through hole 3122 in a circumferential direction, extend radially along the central through hole 3122, and communicate with the central through hole 3122. Each flow channel 3124 communicates with at least one heat sink hole 3112. Each strip hole 3126 penetrates the flow channel plate 3120 and is close to an edge of the flow channel plate 3120. The extension direction of each strip hole 3126 is parallel to the extension direction of the edge of the flow channel plate 3120 adjacent to the strip hole 3126 and opposite to the avoiding slot on the resonant plate, so as to surround the central through hole 3122 and the flow channels 3124 therein. Compared with the flow channel plate of the embodiment 3, the added strip holes 3126 make the flow channel plate 3120 have a certain elasticity, so that the flow channel plate 3120 can vibrate with the vibrator 3140 in a small amplitude without hindering the vibration of the vibrator 3140, thereby increasing the amplitude of the vibrator 3140.

[0142] The vibrator 3140 includes an elastic plate 3150 and a piezoelectric element. One side of the elastic plate 3150 faces the resonant plate, and the piezoelectric element is located on the side of the elastic plate 3150 opposite to the resonant plate and close to the center of the elastic plate 3150. The elastic plate 3150 includes a reinforcing portion and a support frame 3154 for supporting the reinforcing portion. The support frame 3154 is connected between the reinforcing portion and the outer frame and elastically deforms with the undulation of the elastic plate 3150. As shown in Fig. 28, the support frame 3154 includes a diagonal bracing beam 3156, a side beam 3155, and an inner beam 3158. In a projection in the up-down direction, the diagonal bracing beam 3156 is obliquely connected between the inner sides of two adjacent frame edges of the outer frame, and the inner beam 3158 is connected to the outer side of the elastic plate 3150 in a radial direction of the elastic plate 3150. The side beam 3155 has two ends connected to the diagonal bracing beam 3156 and the inner beam 3158, respectively, and extends in a direction parallel to the adjacent frame edge of the outer frame. The same diagonal bracing beam 3156 has two ends extending in a direction perpendicular to the extension direction of the side beam 3155 and passing through the center of the elastic plate 3150. In this embodiment, the number of the diagonal bracing beams 3156 is four, which are distributed at the four corners of the outer frame. The number of the side beams 3155 and the inner beams 3158 is eight.

[0143] The structure of the vibrator 3140 can provide better stability and consistency, improve the vibration frequency, and maintain the same vibration effect at a lower amplitude, thereby reducing the damage to the piezoelectric element, especially for the piezoelectric element made of lead zirconate titanate ceramic (PZT ceramic). The structure can greatly improve the stability and reliability of the piezoelectric element. Further, the elastic plate 3150 and the outer frame can be processed by etching or laser processing to form an integral structure, thereby further improving the stability and consistency. As shown in FIG. 29, the spacer layer 3400 is made of a conductive material and is located between the outer frame and the electrode plate 3190 to increase the distance between the vibrator 3140 and the electrode plate 3190. By providing the spacer layer 3400, the vibration space of the vibrator 3140 can be increased, and the contact area between the electrode plate 3190 and the outer frame can be ensured, thereby ensuring the stability of the power supply to the upper side of the piezoelectric element 3160.

[0144] As shown in FIG. 30, the electrode plate 3190 has a frame and a cantilever 3194 extending inward from the frame. The cantilever 3194 includes an extension 3194A, a connecting portion 3194B, a tooth portion 3194C, and a separation groove 3194D. The extension 3194A extends from the frame to the inside of the pump cavity 104. The connecting portion 3194B is located at the end of the extension 3194A away from the frame and is used for electrical connection with the side of the piezoelectric element 3160 away from the elastic plate 3150. In a direction perpendicular to the extension direction of the extension 3194A, the tooth portion 3194C is located on the opposite sides of the connecting portion 3194B and is arranged along the extension direction of the extension 3194A. The separation groove 3194D is located between the two tooth portions 3194C and extends from the connecting portion 3194B along the extension direction of the extension 3194A and communicates with the pump cavity 104. In this embodiment, the tooth portion 3194C is formed by arranging a plurality of semicircles with a diameter of 0.4 mm along the extension direction of the extension 3194A. In a direction in which one side of the tooth portion 3194C points to the other side of the tooth portion 3194C, the width of the separation groove 3194D is equal to the diameter of the tooth portion 3194C. This structure can maximize the specific surface area under the premise of not being ablated by laser, thereby improving the adhesion and reliability of the cantilever 3194 to the piezoelectric element 3160 and improving the stability of the electrical connection. Further, in a direction in which one side of the tooth portion 3194C points to the other side of the tooth portion 3194C, the width of the connecting portion 3194B at the end away from the extension 3194A is greater than the width of the connecting portion 3194B at the end close to the extension 3194A, and chamfers are provided on the opposite sides of the separation groove 3194D away from the extension 3194A, thereby avoiding breakage due to stress concentration and vibration of the cantilever 3194 with the elastic plate 3150.

[0145] As shown in FIG. 31, the partition layer 3410 is made of insulating material with damping, such as silica gel, etc., and is arranged between the electrode plate 3190 and the valve body 3200, i.e., between the bottom of the electrode plate 3190 and the top of the first fixed layer, for partitioning the electrode plate 3190 and the valve body 3200 to reduce the vibration of the pump body 3100 from being transmitted to the valve body 3200, thereby achieving buffering.

[0146] Further, the profiles of the cushion layer 3400, the electrode plate 3190 and the partition layer 3410 are substantially consistent in the up-down direction projection, and two conductive grooves 3420 are arranged in the two adjacent corner portions inside the one portion of the frame, one of the two conductive grooves 3420 being close to the conductive through hole in the one portion of the frame. The conductive grooves 3420 are filled with conductive glue, which can increase the contact area of the electrode plate 3190 and the outer frame and improve the stability of the electrical connection. Further, the two conductive grooves 3420 penetrate the cushion layer 3400 and the electrode plate 3190 and communicate with the vibration cavity, forming open conductive grooves 3420. Compared with the traditional closed conductive grooves, the open conductive grooves 3420 can reduce the gaps and cavities that occur when the internal conductive glue is filled, avoid open circuit, and avoid the problem of impedance rise due to poor heat dissipation after long-term work.

[0147] The valve body 3200 includes the first fixed layer 3210, the elastic film layer 3220, the second fixed layer 3230 and the side wall portion 3240 assembled in sequence from top to bottom, and the structure is basically the same as that of the valve body of Embodiment 1, except that:

[0148] As shown in FIG. 25, the first fixed layer 3210, the elastic film layer 3220 and the second fixed layer 3230 are laid on the side wall portion 3240, and in the up-down direction projection, the first fixed layer 3210, the elastic film layer 3220 and the second fixed layer 3230 cover the side wall portion 3240. The first fixed layer 3210, the elastic film layer 3220 and the second fixed layer 3230 maintain a uniform outer profile size, which can improve the convenience of processing and installation.

[0149] As shown in FIG. 32 and FIG. 33, the elastic film layer 3220 is provided with a recess 3224 on the side surface facing the first fixed layer 3210, and the normally closed hole 3222 is close to the middle of the recess 3224 and penetrates the recess 3224. The first fixed layer 3210 is provided with an abutting table 3215 protruding on the side surface facing the elastic film layer 3220, the abutting table 3215 abuts with the recess 3224 and covers the normally closed hole 3222; the first fixed layer 3210 is further provided with three transmission holes 3212, but the number is not limited to three, and each transmission hole 3212 is arranged in the circumferential direction outside the abutting table 3215 and communicates with the recess 3224.

[0150] When the first fixed layer 3210 protrudes away from the elastic film layer 3220, the abutment platform 3215 abuts against the elastic film layer 3220, covering the elastic normally closed hole 3222, and the fluid in the cavity cannot flow into the inside of the side wall part 3240 through the normally closed hole 3222. At this time, the elastic film layer 3220 is separated from the boss 3248, and the fluid in the inside of the side wall part 3240 can flow out of the outside through the boss transmission hole 3249 to release pressure. When the first fixed layer 3210 protrudes away from the elastic film layer 3220, the abutment platform 3215 is away from the elastic normally closed hole 3222 due to the difference in bending degree between the first fixed layer 3210 and the elastic film layer 3220, the fluid flows into the recess 3224 through the transmission hole 3212, and then flows into the space surrounded by the side wall part 3240 through the elastic normally closed hole 3222. At this time, the elastic film layer 3220 abuts against the second fixed layer 3230 and covers the boss transmission hole 3249, and the fluid in the inside of the side wall part 3240 cannot flow out of the outside through the boss transmission hole 3249.

[0151] Further, as shown in FIG. 33, the elastic film layer 3220 is further provided with a sound damping part 3226, which is composed of a plurality of fan-shaped blocks (not labeled) protruding towards the first fixed layer 3210. Projected in the up-down direction, each fan-shaped block surrounds the outside of the boss transmission hole 3249 and forms a gap extending radially along the boss transmission hole 3249 between each other, and the small end of each fan-shaped block faces the boss transmission hole 3249, thereby forming a circular reinforcing area in the middle of the sound damping part 3226, and each fan-shaped block is located in the first avoiding opening 3214. By providing the sound damping part 3226, the elastic modulus of the elastic film layer 3220 can be enhanced, the elastic film layer 3220 can be prompted to change a certain shape when releasing pressure, the abnormal sound can be reduced, and the noise reduction can be achieved. In addition, in this embodiment, the blocks are fan-shaped, but in other embodiments, they can be other shapes of protrusions, such as rectangular, etc.

[0152] Further, as shown in FIG. 34, the boss 3248 of the side wall part 3240 is provided with a reinforcing sheet 3251 on the side facing the second fixed layer 3230, the reinforcing sheet 3251 covers at least a part of the boss 3248, the reinforcing sheet 3251 is spaced apart from the elastic film layer 3220, and the sum of the thicknesses of the boss 3248 and the reinforcing sheet 3251 is greater than or equal to the thickness of the side wall part 3240, and the boss transmission hole 3249 penetrates the boss 3248 and the reinforcing sheet 3251 at the same time, so that the elastic film layer 3220 bends downward better to seal the boss transmission hole 3249. Further, in order to improve the sealing, the boss 3248 and the reinforcing sheet 3251 can be made of different materials, for example but not limited to, the boss 3248 is made of glass fiber plate, and the reinforcing sheet 3251 is made of metal sheet.

[0153] In the above, the embodiments of the micro-integrated piezoelectric pump device with rectangular shape and with circular shape are described, however, according to other embodiments of the present application, the micro-integrated piezoelectric pump device can also be provided with other shapes, such as but not limited to rectangular, elliptical, polygonal, etc. according to the requirements. Among them, the outer frame of the pump body is provided with a square opening, which can be adapted to the vibrator structure of the above-mentioned embodiments, without the need for additional separate design and manufacture of the vibrator.

[0154] The above merely describes the preferred embodiments of the present application, but the protection scope of the present application is not limited thereto, and any changes or replacements easily thought of by those skilled in the art within the technical scope disclosed by the present application shall be covered within the protection scope of the present application.

Claims

1. A micro-integrated piezoelectric pump device, characterized by comprising: The utility model relates to a pump device, comprising: a pump body with a hollow vibration cavity inside; a valve body installed below the pump body, comprising, from top to bottom, a first fixed layer, an elastic film layer, a second fixed layer, and a side wall part for fixing the first fixed layer, the elastic film layer, and the second fixed layer; one of the first fixed layer and the elastic film layer is provided with a normally closed hole; when the pump body is in a first working state, the other of the first fixed layer and the elastic film layer covers the normally closed hole, and the vibration cavity is not in communication with the inside of the side wall part; when the pump body is in a second working state, the second fixed layer is in abutment with the elastic film layer, and the other of the first fixed layer and the elastic film layer is away from the normally closed hole, so that the vibration cavity is in communication with the inside of the side wall part; and a bottom substrate fixed to the bottom of the side wall part as a bottom plate, capable of supplying power to and controlling the pump body.

2. The micro-integrated piezoelectric pump device according to claim 1, characterized by: The normally closed hole is arranged on the first fixed layer; the elastic film layer is provided with a transmission hole; the second fixed layer is provided with a transmission opening; along the axial projection of the transmission opening, the transmission hole is staggered with the normally closed hole; The transmission hole and the normally closed hole are located in the transmission opening.

3. The micro-integrated piezoelectric pump device according to claim 2, characterized by: Along the axial projection of the transmission opening, a plurality of transmission holes are arranged around the periphery of the normally closed hole.

4. The micro-integrated piezoelectric pump device according to claim 1, characterized by: The normally closed hole is arranged on the elastic film layer; the first fixed layer is provided with a transmission hole; the second fixed layer is provided with a transmission opening; along the axial projection of the transmission opening, the transmission hole is staggered with the normally closed hole; The transmission hole and the normally closed hole are located in the transmission opening.

5. The micro-integrated piezoelectric pump device according to claim 4, characterized by: The elastic film layer is provided with a recess on the side surface facing the first fixed layer, and the normally closed hole penetrates through the recess; the first fixed layer is provided with an abutment platform on the side facing the elastic film layer, and the abutment platform can cover the normally closed hole.

6. The micro-integrated piezoelectric pump device according to claim 4, wherein: Along the axial projection of the transmission opening, a plurality of transmission holes are arranged around the periphery of the normally closed hole and in communication with the recess.

7. The micro integrated piezoelectric pump device according to any one of claims 1 to 6, characterized in that: the side wall part is provided with a boss protruding inward, the boss is provided with a boss transmission hole extending from top to bottom, and the boss is provided with a side wall outlet in communication with the boss transmission hole and the outer side surface of the side wall part; the second fixed layer is provided with a second avoiding opening corresponding to the boss; the elastic film layer covers the second avoiding opening and is spaced apart from the boss; the first fixed layer is provided with a first avoiding opening opposite to the second avoiding opening.

8. The micro-integrated piezoelectric pump device according to claim 7, characterized by: The side surface of the boss facing the elastic film layer is covered with a reinforcing sheet spaced apart from the elastic film layer, and the boss transmission hole penetrates through the boss and the reinforcing sheet; the sum of the thicknesses of the boss and the reinforcing sheet is greater than or equal to the thickness of the side wall part.

9. The micro-integrated piezoelectric pump device according to claim 7, characterized by: The elastic film layer is further provided with a sound-absorbing part; the sound-absorbing part comprises a plurality of blocks protruding towards the first fixed layer; along the projection perpendicular to the first fixed layer, each block surrounds the periphery of the boss transmission hole, is provided with a gap extending radially along the boss transmission hole between each other, and the small end of each block faces the boss transmission hole.

10. The micro-integrated piezoelectric pump device of claim 1, wherein: the pump body comprises, from top to bottom, a top heat sink, a flow channel plate, a resonant plate, a vibrator, an outer frame in which the vibrator is embedded, and an electrode plate; the vibrator is hollow below, and comprises an elastic plate embedded in the outer frame and a piezoelectric element mounted on a side of the elastic plate opposite to the resonant plate; the electrode plate comprises a frame part 1, a frame part 2, and a cantilever, the frame part 1 and the frame part 2 are insulated from each other, the cantilever extends from the frame part 2 and is electrically connected to a side of the piezoelectric element opposite to the elastic plate; the frame part 1 is electrically connected to a side of the piezoelectric element facing the elastic plate through the outer frame and the elastic plate; the side wall part is provided with electrically conductive through holes arranged in a spaced-apart and vertically-through manner; the bottom substrate is electrically connected to the frame part 1 and the frame part 2 through the electrically conductive through holes, respectively, to supply power to and control the piezoelectric element.

11. The micro-integrated piezoelectric pump device according to claim 10, characterized by: the pump body further comprises a cushion layer electrically connected between the outer frame and the electrode plate.

12. The micro-integrated piezoelectric pump device according to claim 11, characterized by: the pump body further comprises a separation layer for providing cushioning between the electrode plate and the first fixed layer.

13. The micro-integrated piezoelectric pump device according to claim 12, characterized by: the pump body further comprises two electrically conductive grooves in the frame part 1, which at least pass through the cushion layer and the electrode plate and communicate with the vibration cavity; one of the two electrically conductive grooves is close to the electrically conductive through hole for electrically connecting with the frame part 1.

14. The micro-integrated piezoelectric pump device according to claim 10, characterized by: the cantilever comprises an extension part, a connection part, a tooth part, and a separation groove; the extension part extends from the frame part 2 to the inside; the connection part is located at one end of the extension part away from the frame part 2 in the extension direction; the tooth part comprises a plurality of semicircles arranged in the extension direction of the extension part, and two tooth parts are respectively located on both sides of the connection part in a direction perpendicular to the extension direction of the extension part; the separation groove is opened in the middle of the connection part and extends along the extension direction of the extension part until it communicates with the vibration cavity; in a direction in which one side of the tooth part points to the other side of the tooth part, the width of the separation groove is equal to the diameter of the tooth part.

15. The micro-integrated piezoelectric pump device according to claim 10, wherein the vibrator comprises: an elastic plate comprising a reinforcing part and a support frame; the reinforcing part has a circular sheet structure with one side plate facing the resonant plate; the support frame comprises a plurality of side beams, inclined struts, and inner beams around the outer periphery of the reinforcing part; both ends of each inclined strut extend in the extension direction and are connected to the outer frame; each side beam is connected between two adjacent inclined struts, and the inner beam is connected from the middle of the side beam to the reinforcing part; a piezoelectric unit arranged on a plate surface of the reinforcing part opposite to the resonant plate and electrically connected to the reinforcing part; the cantilever is electrically connected to a side of the piezoelectric unit opposite to the reinforcing part.

16. The micro-integrated piezoelectric pump device according to claim 10, wherein the vibrator comprises: The elastic plate comprises a reinforcing part and a support frame; the reinforcing part has a circular sheet structure, and one side plate surface faces the resonant plate; the support frame comprises a plurality of side beams, inclined struts and inner beams around the outer periphery of the reinforcing part; two ends of each inclined strut in the extension direction are connected with the outer frame; one end of adjacent two inclined struts close to each other is connected with a side beam, and the other ends of the two side beams away from the inclined struts are close to each other and are respectively connected to two inner beams arranged at intervals; one end of the inner beam away from the side beam is connected with the reinforcing part; two ends of the same inclined strut in the extension direction are respectively connected with a side beam; A piezoelectric unit is arranged on the plate surface of the reinforcing part away from the resonant plate and is electrically connected with the reinforcing part, and the cantilever is electrically connected to one side of the piezoelectric unit away from the reinforcing part.

17. A micro-integrated piezoelectric pump device according to any one of claims 15 or 16, characterized by: The width of the side beam is smaller than the width of the inclined strut.

18. The micro-integrated piezoelectric pump device according to any one of claims 15 or 16, characterized by: A plurality of avoiding grooves are arranged on the resonant plate, and the projection of each avoiding groove in the up-down direction surrounds the side beam and the inner beam between adjacent two inclined struts.

19. The micro-integrated piezoelectric pump device according to claim 10, wherein: The flow channel plate comprises a center through hole, flow channels and short channels; the center through hole is located in the middle of the flow channel plate, a plurality of flow channels are distributed in the circumferential direction of the center through hole, one end of each flow channel is communicated with the center through hole, and the other end extends radially outward along the center through hole; the short channel is communicated at the end of each flow channel away from the center through hole and extends to the outside of the flow channel plate on both sides of the flow channel in the direction perpendicular to the extension direction of the flow channel.

20. The micro-integrated piezoelectric pump device according to claim 17, wherein: The flow channel plate comprises a center through hole and flow channels; the center through hole is located in the middle of the flow channel plate, a plurality of flow channels are distributed in the circumferential direction of the center through hole, one end of each flow channel is communicated with the center through hole, and the other end extends radially outward along the center through hole; the top heat dissipation plate is respectively provided with heat dissipation plate holes communicated with each flow channel; the flow channel plate further comprises a plurality of strip-shaped holes distributed near the edge of the flow channel plate, and each avoiding groove is arranged opposite to each strip-shaped hole.

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