Device for checking a soldered connection to a board

Abstract

The technical solution relates to the field of checking the assembly of printed circuits (printed circuit boards) and can be used for checking the correctness of a soldered connection to a board, as well as for teaching soldering to inexperienced users. A need exists to provide easy-to-master kits for soldering and for learning how to solder connections using different electronic components. A device for checking a soldered connection to a board is proposed. The technical result achieved by the claimed technical solution, in addition to providing a product and / or process which fulfils its intended purpose, is that of providing a simplified design that is ergonomic and can be easily used by an inexperienced user, including but not limited to, for example, a child.

Description

Device for testing soldered joints on a board

[0001] AREA OF TECHNOLOGY

[0002] The technical solution relates to the field of control of printed circuit board (PCB) assembly and can be used to control the correctness of the soldered connection on the board, as well as in training untrained users in soldering.

[0003] LEVEL OF TECHNOLOGY

[0004] Various methods and techniques for learning soldering, including on a PCB, are known. For example, but not limited to, at least twenty-five different soldering training kits are known, as described in the article "Top 25 Cheap and Simple Soldering and Electronics Training Kits" (URL: https: / / pikabu.ru / story / top_25_deshevyikh_i_prostyikh_naborov_dlya_obucheniya_payke_i _printsipa_rabotyi_yelektroniki_10452330) (D1).However, no prior art soldering training kit includes any means of monitoring soldered joints. Therefore, any prior art kit has limited capabilities for training and use by an untrained user, such as, but not limited to, a child, who, if creating a defective solder joint, would not be able to independently determine the cause of the defect. Furthermore, even a specialist would need time to inspect each solder joint for defects, such as, but not limited to, incomplete soldering or short circuits. Furthermore, there are no solutions for studying the influence of specific components on the board on generated signals using an easy-to-learn kit that includes a simple-to-learn meter.

[0005] Patent document RU2212775C2, published on September 20, 2003 (D2), discloses an invention aimed at creating a device for electrically testing printed circuit boards with adjustable probe needle positions. The device for electrically testing printed circuit boards, as described in D2, utilizes at least two adjacent coplanar boards with multiple conductive probe needles connected to means for analyzing the electrical parameters between the probe needles. However, the solution described in D2 and similar solutions are difficult to operate for an untrained user, particularly a child aged 7 years or older. in connection with which they cannot be used for training untrained users.

[0006] Therefore, there is a need to provide easy-to-learn soldering kits and kits for learning soldered joints using various electronic components.

[0007] The solution known from D2 can be accepted as the closest analogue of the declared technical solution.

[0008] DISCLOSURE OF THE TECHNICAL SOLUTION

[0009] The technical problem solved by the claimed technical solution is the creation of a product and / or method and / or application for a product or method that eliminates the deficiencies of the prior art and thus provides easy-to-learn and easy-to-use soldering kits and / or for studying soldered joints using various electronic components. Another technical problem solved by the claimed technical solution is the creation of a product and / or method and / or application that expands the arsenal of technical means—devices for monitoring soldered joints on a board, devices for monitoring soldered joints on a board, and / or devices and systems for training in soldering on a board.

[0010] The technical result achieved through the implementation of the stated technical solution, in addition to the product and / or method fulfilling its intended purpose, is the simplification of the design and the provision of ergonomics and ease of use for an untrained user, such as, but not limited to, a child.

[0011] The technical result is achieved due to the fact that a device is provided for testing a soldered connection on a board, comprising at least: a housing with a seat for the tested printed circuit board, wherein the seat is provided with a plurality of spring-loaded contacts made with the possibility of connecting with opposite contacts on the rear side of the tested printed circuit board, wherein the device is provided with at least one processor connected to the mentioned contacts in such a way as to ensure the possibility of testing the soldered connection on the tested printed circuit board for the presence of at least one defect selected from the group: undersoldering, short circuit, incorrect rating of an electronic component, incorrect electronic component, incorrect placement of an electronic component; and memory containing a program code, which, when executed by the processor, causes the processor to at least ensure that at least one soldered connection with at least one electronic component on said printed circuit board located in the mounting location is checked for the presence of at least one said defect.

[0012] BRIEF DESCRIPTION OF DRAWINGS

[0013] Illustrative embodiments of the present utility model are described below in detail with reference to the accompanying drawings, which are incorporated herein by reference, and in which:

[0014] Fig. 1 shows an approximate view of a device for monitoring a soldered connection on a board.

[0015] Fig. 2 shows an approximate diagram of a device for monitoring a soldered connection on a board.

[0016] Fig. 3 and 4 show an approximate diagram of the controlled printed circuit board.

[0017] Fig. 5 shows an exemplary view of a device for generating and / or measuring electrical signals.

[0018] Fig. 6 shows an exemplary diagram of a device for generating and / or measuring electrical signals.

[0019] Fig. 7 shows an exemplary diagram of a system for monitoring soldered connections on a board and / or analyzing electrical signals.

[0020] IMPLEMENTATION OF THE TECHNICAL SOLUTION

[0021] In a preferred embodiment of the present invention, there is provided a device for testing a soldered joint on a board, comprising at least: a housing with a seat for a printed circuit board to be tested, wherein the seat is provided with a plurality of spring-loaded contacts configured to connect with opposite contacts on the back side of the printed circuit board to be tested, wherein the device is provided with at least one processor connected to said contacts in such a way as to ensure the possibility of testing a soldered joint on the printed circuit board to be tested for the presence of at least one defect selected from the group: undersoldering, short circuit, incorrect rating of an electronic component, incorrect electronic component, incorrect placement of an electronic component; and memory containing program code that, when executed by the processor, causes the processor to at least ensure that at least one soldered connection with at least one electronic component on said printed circuit board located in the mounting location is checked for the presence of at least one said defect.

[0022] In a particular embodiment of the present invention, said device is provided, characterized in that said memory is additionally configured to store the results of said check.

[0023] In a particular embodiment of the present invention, any said device is provided, characterized in that it is additionally provided with a transceiver configured to transmit said stored results to a server of a solder joint control system on a board, wherein said memory additionally contains at least a program code that, when executed by a processor, causes the processor to transmit said stored test results to said server.

[0024] In a particular embodiment of the present invention, any said device is provided, characterized in that it is additionally provided with an output device configured to at least provide the results of said check.

[0025] In a particular embodiment of the present invention, there is provided any said device, characterized in that said memory additionally contains at least a program code which, when at least one said defect is detected, when executed by the processor, causes the processor to generate instructions for the user to eliminate said detected defect.

[0026] In a particular embodiment of the present invention, said device is provided, characterized in that said output device is configured to provide said generated instructions to the user.

[0027] In another preferred embodiment of the present invention, a method is provided for testing a soldered joint on a board, which involves placing a tested printed circuit board with at least one electronic component placed thereon by soldering in a seat of any of the said device for testing the soldered joint. connections to the board and, by means of the processor of the said device for checking the soldered connection, a check of the soldered connection is performed for the presence of at least one said defect.

[0028] In another preferred embodiment of the present invention, a kit for testing a soldered joint on a board is provided, comprising at least: one or more of any of the mentioned devices for testing a soldered joint on a board, one or more tested printed circuit boards, at least configured with the possibility of placing at least one electronic component on it by means of a soldered joint, and one or more electronic components intended for placement on at least one tested printed circuit board included in the kit.

[0029] In another preferred embodiment of the present invention, a system for testing soldered joints on a board is provided, comprising at least: one or more of any of the said devices for testing a soldered joint on a board, each of which is configured to store in memory the results of said testing and is provided with a transceiver configured to transmit said stored results via a data transmission network; a server comprising at least one or more processors and a memory containing at least a program code that, when executed by a processor, causes the processor to at least receive and store in the memory of the server said test result transmitted by any of the said testing devices.

[0030] In another preferred embodiment of the present invention, a machine-readable data carrier is provided, containing a program code, which, when executed by at least one processor of said device for testing a soldered joint on a board, causes the processor to at least ensure the inspection of at least one soldered joint with at least one electronic component on said tested printed circuit board, located in the seat of the device for testing a soldered joint, for the presence of at least one said defect.

[0031] In another preferred embodiment of the present invention, there is provided a device for generating and / or measuring electrical signals, comprising at least a signal generator unit, an oscilloscope unit configured to connect a breadboard, wherein the breadboard is configured to allow for a detachable connection of at least one electronic component; wherein the signal generator unit is configured to supply a signal to the input of said oscilloscope unit and to the input of said breadboard with an electronic component connected thereto, wherein the oscilloscope unit is two-channel and provides for the display of at least: a signal coming directly from the signal generator unit and a signal coming from the signal generator unit through said breadboard.

[0032] In another preferred embodiment of the present invention, a method for measuring a signal is provided, which consists in placing at least one electronic component on any said breadboard, after which said breadboard is connected to said device for generating and / or measuring electrical signals and a signal is supplied to the input of the breadboard by means of a signal generator unit of the device, after which the value of the signal is obtained by means of an oscilloscope unit of the device.

[0033] In another preferred embodiment of the present invention, a kit for generating and / or measuring electrical signals is provided, comprising at least: one or more of the said devices for generating and / or measuring electrical signals; one or more breadboards configured to be connected to any of the said devices for generating and / or measuring electrical signals; one or more electronic components configured to be detachably connected to the said breadboard.

[0034] The following are embodiments of the present invention, revealing examples of its implementation in specific implementations. However, the description itself is not intended to limit the scope of rights granted by this patent. Rather, it should be understood that the claimed invention may also be implemented in other ways that incorporate different elements and conditions, or combinations of elements and conditions similar to those described herein, in combination with other existing and future technologies.

[0035] Fig. 1 shows an exemplary view of a device 10 for monitoring a soldered connection on a board. Fig. 2 shows an exemplary diagram of a device 10 for testing a soldered joint on a board. Fig. 3 and 4 show an exemplary diagram of a tested printed circuit board. In a preferred embodiment of the present invention, a device 10 is provided for testing a soldered joint on a board, comprising at least: a housing 11 with a seat 111 for a tested printed circuit board 20, wherein the seat 111 is provided with a plurality of spring-loaded contacts 1111 (pogo pin 1111), configured to interact with opposing contacts 21 on the rear side of the tested printed circuit board 20, wherein the device 10 is provided with at least one processor 14, connected to said contacts 1111 in such a way as to ensure the possibility of testing a soldered joint on the tested printed circuit board for the presence of at least one defect selected from the group: undersoldering, short circuit, incorrect rating of an electronic component, incorrect electronic component,incorrect placement of an electronic component; wherein, for example, but not limited to, said checking is ensured by means of interaction of the processor 14 with a measuring unit 17 controlled by the processor 14, connected to a plurality of spring-loaded contacts 1111; and a memory 15 containing a program code that, when executed by the processor 14, causes the processor 14 to at least ensure checking of at least one soldered connection with at least one electronic component (not shown in the drawing) on ​​the said printed circuit board 20, placed in the mounting location 111, for the presence of at least one said defect. Preferably, without limitation, the mounting location 111 is formed by shelves 1112 for placing thereon at least partially the said printed circuit board 20, fixed at least by grooves 1113,formed by projections 1114 and one of the shelves 1112; wherein the projections 1114 can be made with holes 11141 for clamping screws (not shown in the drawing). Preferably, without limitation, the printed circuit board 20 is provided with at least one seat 22 formed by at least two points 221 for placing and soldering an electronic component onto the board 20, most typically in the form of plated holes with contact pads. Preferably, without limitation, checking for the presence of any said defect is carried out by applying a direct current to the said contacts 1111 and then measuring its passage between the points 221; for example, without limitation, when, the monitored board comprises a soldered resistor, and the voltage drop is measured when current passes from one point 221 to another point 221 to which the resistor is connected; for example, but not limited to, at least the class of the soldered component is determined in this way. In this case, preferably, but not limited to, the detection of undersoldering is carried out by applying a direct current in the said manner and determining the absence of contact between the conductive contact of the electronic component and the contact pad of point 221. In this case, preferably, but not limited to, the detection of a short circuit is carried out by measuring the voltage drop between at least two points 221 that form a seat 22, and by comparing the measured voltage value with the corresponding value for the seat 22 stored in memory 15.In this case, preferably, but not limited to, the detection of an incorrect electronic component rating is detected by measuring its rating and comparing the obtained value with a predetermined value stored in said memory 15, corresponding to the mounting location 22 where the corresponding component was detected. In this case, preferably, but not limited to, the detection of an incorrect electronic component soldered in the mounting location 22 is carried out by identifying its largest parameter and correlating such identified parameter with the values ​​corresponding to the classes of electronic components contained in said memory 15.In this case, preferably, without being limited to, the detection of the incorrect placement of the electronic component is carried out by measuring its values ​​​​between at least two points 221 forming the seat 22, and comparing the measured values ​​​​with the specified values ​​​​stored in the mentioned memory 15, corresponding to the seat 22, where the corresponding component was detected. In this case, preferably, without being limited, alternatively, for some classes of electronic components, such as, for example, transistors, the detection of the incorrect placement of the electronic component is carried out by identifying its largest parameters and correlating the identified parameters with the values ​​​​of the largest parameters contained in the memory 15, corresponding to the classes of electronic components, as well as correlating the location of the soldered electronic component with the locations between two points 221 contained in the memory 15. In this case, a person skilled in the art.It should be obvious to a technician with ordinary knowledge, for whom the present invention is intended, that the test being carried out can be subject to the adjustment of its parameters, most suitable for one or another electronic component soldered to the board 20, and / or a set of electronic components. In this case, preferably, without being limited, the device 10 is also provided with an output device 12, which is, for example, but not limited to, a display, for example, but not limited to, an LCD display, or a speaker, or the like. In this case, preferably, without being limited, the device 10 is also provided with an input device 13, for example, but not limited to, a button or a touch screen, or a microphone, and the like, configured with the ability, after user interaction with such input device 13, to generate a control electronic signal for the said processor.In this case, preferably, but not limited to, the output of the test results is ensured via said output device 12. Preferably, but not limited to, said memory 15 is further configured to store the results of said test. In this case, without limitation, the electronic component is at least one electronic component selected from the group: an active electronic component, a passive electronic component.

[0036] In this case, without being limited, the said device 10 may be additionally provided with a transceiver 16, configured with the possibility of transmitting the said stored results to the server 41 of the system 40 for monitoring the soldered joints on the board, wherein the said memory 15 additionally contains at least a program code, which, when executed by the processor, causes the processor to transmit the said stored test results to the said server 41. In this case, without being limited, the said memory 15 additionally may contain at least a program code, which, when at least one said defect is detected, when executed by the processor, causes the processor to generate instructions for the user for eliminating the said detected defect; in this case, for example, without being limited, the said output device 12 may be configured with the possibility of providing the said generated instructions to the user.Alternatively, without limitation, the generated instructions can be stored in memory 15 and transmitted via transceiver 16 to server 41 of said system 40, where subsequently, jointly or separately with. The results of the checks can be provided to the automated workstation 42, when interacting with which the controlling user, for example, but not limited to, a teacher, can receive information about the results of checks from a plurality of devices 10.

[0037] Thus, without being limited, a method for testing a soldered joint on a board can be provided, in which a tested printed circuit board 20 with at least one electronic component placed on it by soldering is placed in a seat 111 of said device 10 for testing a soldered joint on a board and, by means of a processor 14 of said device 10 for testing a soldered joint, a check of the soldered joint is performed for the presence of at least one said defect.

[0038] Thus, without limitation, a kit for monitoring a soldered connection to a board can be provided, comprising at least: one or more of the mentioned devices 10 for monitoring a soldered connection to a board, one or more monitored printed circuit boards 20, at least configured with the possibility of placing at least one electronic component on it by means of a soldered connection, and one or more electronic components intended for placement on at least one monitored printed circuit board 20 included in the kit.

[0039] After testing the board 20, the device 10 can measure the signals passing through the soldered electronic components. For this purpose, for example, but not limited to, the output of the board 20 can be connected to the input 301 of the device 300 for generating and / or measuring electrical signals. In this case, without limitation, as shown in Fig.5, a device 300 for generating and / or measuring electrical signals may be provided, comprising at least a signal generator unit 302, an oscilloscope unit 303 configured to connect to a printed circuit board 20; wherein the signal generator unit 302 is configured to supply a signal to the input of said oscilloscope unit 303 and to the input of said printed circuit board 20 via an output 304 of the device 300 with at least one soldered electronic component, wherein the oscilloscope unit 303 is two-channel and provides for the display of at least: a signal coming directly from the signal generator unit 302, and a signal coming from the signal generator unit 302 through said printed circuit board 20. In this case, not. being limited, as was unexpectedly discovered by the author, not every device similar to device 300 may be suitable for use by an untrained user, for example, a child who does not have special knowledge for working with complex combined generator-oscilloscopes. Thus, preferably, without being limited, a device 300 may be provided, equipped with only the following input devices: a latching button 313 for turning device 300 on and off; a latching button 305, providing for selection of the signal type from the group: constant signal, alternating signal; a non-latching button 306, providing for decrementation of the signal frequency value when device 300 is operating in the signal frequency setting mode and providing for a change in the signal type when interacting with the graphical user interface when device 300 is operating in the signal type selection mode;a non-locking button 310 that provides for the incrementation of the signal frequency value when the device 300 is operating in the signal frequency setting mode and that provides for the change of the signal type when interacting with the graphical user interface when the device 300 is operating in the signal type selection mode; a non-locking button 307 that provides for the selection of a digit when the device 300 is operating in the signal frequency change mode; a non-locking button 309 that provides for the selection of a digit when the device 300 is operating in the signal frequency change mode; a non-locking button 308 that provides for the switching on and off of the generation of a given signal; a rotating knob (variable resistor; potentiometer) 314 that provides for the adjustment of the signal amplitude at the generator output; a switch 311 that provides for switching from a low-frequency signal to a high-frequency signal;non-locking buttons 316, 317, providing input when interacting with the graphical user interface when the device 300 is operating in the stopped signal display mode and when the device 300 is operating in the real-time signal display mode; non-locking button 318, providing initiation of interaction with the graphical user interface, input when interacting with the graphical user interface when the device 300 is operating in the real-time signal display mode; non-locking button 319, providing initiation and termination of the operating mode of the device 300 in the stopped signal display mode, input when interacting with the graphical user interface when the device 300 is operating in the real-time signal display mode,; switching between channels; and only the following output devices: display 312, providing display of information about the type and / or frequency of the signal generated at output 304, and / or about the state of generator block 302, and providing display of the variable digit when device 300 is operating in setup mode; display 303, providing display of the oscilloscope and a graphical user interface for interaction with it.

[0040] In this case, alternatively, without being limited to, instead of the printed circuit board 20 or the like, a breadboard (not shown in the drawing) can be used, preferably, without being limited to, not being the printed circuit board 20 or the like or any other printed circuit board. Such a breadboard, preferably, without being limited to, is configured to be able to detachably connect at least one electronic component; and in this case, the signal generator unit 302 is configured to supply a signal to the input of the said oscilloscope unit 303 and to the input of the said breadboard with the electronic component connected to it, wherein the oscilloscope unit 303 is two-channel and ensures the display of at least: a signal coming directly from the signal generator unit 302, and a signal coming from the signal generator unit 302 through the said breadboard.

[0041] In this way, a method for measuring a signal can be provided, which consists in placing at least one electronic component on any mentioned breadboard, after which said breadboard is connected to said device 300 for generating and / or measuring electrical signals and a signal is supplied to the input of the breadboard via the signal generator unit 302 of the device 300, after which the signal value is obtained via the oscilloscope unit 303 of the device.

[0042] In this way, a set for generating and / or measuring electrical signals can be provided, comprising at least: one or more of the mentioned devices 300 for generating and / or measuring electrical signals; one or more breadboards, configured with the possibility of connection to any of the mentioned devices 300 for generating and / or measuring electrical signals; one or more electronic components, configured with the possibility of detachable connection to the mentioned breadboard.

[0043] In this case, preferably, without limitation, as shown in Fig. 7, a system 40 for monitoring soldered connections on a board can be provided, comprising at least: one or more of any of the mentioned devices 10 for checking the soldered joint on the board, each of which is configured to store in memory the results of said checking and is provided with a transceiver 16 configured to transmit said stored results via a data transmission network 50; a server 41, comprising at least one or more processors 411 and a memory 412 containing at least a program code that, when executed by the processor 411, causes the processor 411 to at least receive and store in the memory 412 of the server 41 said checking result transmitted by any of the mentioned device 10. In this case, preferably, without limitation, the received checking result and / or, as was shown earlier, the received instructions for the user, can be received from the server 41 via the data transmission network 50 by the automated workstation 42 of the controlling user.In this case, for example, without being limited to, the server memory 412 may include program code that, when executed by the processor 411 of the server 41, causes the processor 411 to perform the actions of the method, which consists of analyzing the obtained test results and generating user instructions, which, for example, without being limited to, may subsequently be transmitted via the data transmission network 50 to the corresponding device 10 for reproduction via its output device for the user being trained.In addition, without being limited, the system 40 may also include one or more of the said devices 300 with the said boards 20 or the said breadboards connected thereto, wherein the devices 300 may thus be provided with transceivers 320, by means of which, using the network 50, an exchange with the server of the system 40 is ensured, which is thus a system for monitoring soldered joints on the board and / or analyzing electrical signals; for example, without being limited, at least one set of instructions for the generator block 302 may thus be generated by means of the server 41, wherein the generation of instructions may be based on the results of the said check.

[0044] Thus, preferably, without limitation, a computing device may be provided in the context of the present invention. Such a computing device most typically comprises at least: one or more processors; memory containing corresponding program code, as previously shown. At the same time, such a computing device may to act as a corresponding server of the corresponding system, which thus also contains at least one or more processors and memory, which are thus essentially similar, respectively, to the processor and memory of the previously described computer devices. By way of example, but not limitation, the memory (machine-readable storage medium) may include non-volatile memory (NVRAM); random access memory (RAM); read-only memory (ROM); electrically erasable programmable read-only memory (EEPROM); flash memory or other memory technologies; CDROM, digital versatile disc (DVD) or other optical or holographic storage media; magnetic cassettes, magnetic tape, magnetic disk storage device or other magnetic storage devices; as well as any other storage medium that can be used to store and encode the required information.In this case, memory includes, but is not limited to, a storage medium based on a computer storage device in the form of volatile or nonvolatile memory, or a combination thereof. In this case, exemplary hardware devices include, but are not limited to, solid-state memory, hard drives, optical drives, and the like. In this case, the machine-readable storage medium (memory) is non-transient (permanent, non-transitive), so it does not include a temporary (transitive) propagating signal. In this case, memory may store, without limitation, an exemplary environment in which, using computer commands or codes, including those stored in server memory, any previously described computer procedure executable by the processor of the computer device may be implemented.In this case, without limitation, the computing device, when it is not a thin client, contains one or more processors that are designed to execute computer commands or codes stored in the device's memory for the purpose of ensuring the execution of the said procedures. In this case, without limitation, the server may be essentially similar to the computing device, when it is not a thin client, and, accordingly, contain one or more processors that are designed to execute computer commands or codes stored in the server's memory for the purpose of ensuring the execution of the said procedures. In this case, without limitation, any described system may also include a database (DB) 60. Such a DB may be, but is not limited to: a hierarchical DB, a network DB, A relational database, an object database, an object-oriented database, an object-relational database, a spatial database, a combination of two or more of these databases, and the like. The database, without limitation, stores at least data, parameters, raw data, labeled data, modified data, machine learning models, and other information in memory or in a suitable memory of another computing device associated with any of the aforementioned computing devices and / or with a server, which may be, but is not limited to, memory similar to any memory as previously shown, and which can be accessed via the server. Furthermore, without limitation, a server is provided that, in addition to the functions previously described, stores and facilitates the manipulation of computer commands or codes previously described in this document, which, accordingly, are not further described.In this case, without limitation, the server, in addition to the previously described functions, can provide for the regulation of data exchange in the system. In this case, without limitation, the exchange of data within the corresponding system is carried out thanks to one or more data transmission networks 50. In this case, without limitation, the data transmission networks 50 may include, but are not limited to, one or more local area networks (LAN) and / or wide area networks (WAN), or may represent an information and telecommunications network, the Internet, or an Intranet, or a virtual private network (VPN), or a combination thereof, and the like. In this case, without limitation, the server also has the ability to provide a virtual computing environment for ensuring interaction between the components of the system. In this case, without limitation, the network 50 serves to ensure interaction between a computing device, a server, optionally a database, and optionally the previously described systems and other systems.In this case, without limitation, a non-thin client computing device and / or server may be directly connected to the database 60 using wired and wireless communication methods and techniques known in the art, which, accordingly, are not described in detail below, or, without limitation, the database may be implemented in the memory of any computing device, including one that serves as a server. In this case, without limitation, a suitable non-thin client computing device may act as a system server for other computing devices that serve as thin clients. Most typically, without limitation, the components of the computing devices described herein are devices, server components are connected to each other, including via some kind of data bus.

[0045] This description of the claimed technical solution demonstrates only particular embodiments and does not limit other embodiments of its implementation, since possible other alternative embodiments that do not go beyond the scope of the information set out in this application should be obvious to a specialist in this field of technology with the usual qualifications for whom the claimed technical solution is intended.

Claims

Invention formula 1. A device for testing a soldered joint on a board, comprising at least: a housing with a seat for a tested printed circuit board, wherein the seat is provided with a plurality of spring-loaded contacts configured to connect with opposite contacts on the rear side of the tested printed circuit board, wherein the device is provided with at least one processor connected to said contacts in such a way as to ensure the possibility of testing the soldered joint on the tested printed circuit board for the presence of at least one defect selected from the group: undersoldering, short circuit, incorrect rating of an electronic component, incorrect electronic component, incorrect placement of an electronic component;and a memory containing program code that, when executed by the processor, causes the processor to at least ensure that at least one soldered connection with at least one electronic component on said printed circuit board located in the mounting location is checked for the presence of at least one said defect.

2. The device according to paragraph 1, characterized in that said memory is additionally configured to store the results of said check.

3. The device according to claim 2, characterized in that it is additionally provided with a transceiver configured to transmit said stored results to a server of the solder joint control system on the board, wherein said memory additionally contains at least a program code which, when executed by the processor, causes the processor to transmit said stored test results to said server.

4. The device according to claim 1, characterized in that it is additionally provided with an output device configured to at least provide the results of said check.

5. The device according to claim 4, characterized in that said memory additionally contains at least a program code which, when at least one said defect is detected, when executing the processor causes the processor to generate instructions for the user to eliminate the said detected defect.

6. The device according to paragraph 5, characterized in that said output device is configured to provide said generated instructions to the user.

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