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3results about How to "Avoid affecting the adsorption effect" patented technology

Activated carbon adsorption device for gas oil removal

PendingCN119318859AExtend the adsorption timeAvoid affecting the adsorption effectGas treatmentDispersed particle separationActivated carbonMechanical engineering
The invention relates to the technical field of air purification equipment, in particular to an activated carbon adsorption device for gas oil removal, which comprises a ventilation pipeline, an air inlet and an air outlet are respectively formed in two ends of the ventilation pipeline, a plurality of groups of activated carbon plates are stacked in the ventilation pipeline, and a vibration assembly is arranged at the air outlet. Clamping assemblies are arranged at the positions, located at the two ends of the activated carbon plate, of the inner wall of the ventilation pipeline, the clamping assembly close to one side of the air outlet is in transmission connection with the vibration assembly, a mounting and dismounting assembly used for replacing the activated carbon plate is arranged on the outer side of the ventilation pipeline, and the interior of the mounting and dismounting assembly is correspondingly matched with the activated carbon plate. The end, close to the air inlet, of the mounting and dismounting assembly is in contact fit with the clamping assembly. In the activated carbon adsorption process, the fan drives the activated carbon plate to vibrate, so that oily particles in gas are prevented from being hardened after being adsorbed and deposited with activated carbon.
Owner:HANGZHOU NEW CENTURY MIXED GAS CO LTD

An apparatus and method for NMP recycling of lithium batteries

ActiveCN117138514Breturn to inflated stateAvoid affecting the adsorption effectGas treatmentDispersed particle filtrationThermodynamicsPhysical chemistry
This invention discloses a lithium battery NMP recycling device, relating to the field of recycling equipment technology. It includes a recycling chamber, an air inlet, an exhaust outlet, a heat-conducting plate, and a cooling channel; a heat exchange unit used in conjunction with the heat-conducting plate; a filter body comprising a filter sponge and cotton felt adhered to the outer walls on both sides of the filter sponge in the thickness direction; and a compression unit disposed on the heat-conducting plate, which is used to compress the filter body when the temperature of the heat-conducting plate decreases. By setting up a movable perforated frame, a fixed perforated frame, a rotating arm, a drive unit, and a fixed column, as the temperature of the heat-conducting plate decreases, the drive unit gradually drives the fixed column to move the movable perforated frame, causing the movable perforated frame to begin compressing the filter body. This squeezes out the liquid in the filter body, preventing it from affecting the adsorption effect of the filter body on impurities. Furthermore, after the operation is completed, as the temperature of the heat-conducting plate rises, the movable perforated frame will move away from the fixed perforated frame, allowing the filter body to return to its expanded state.
Owner:FUJIAN WEISHIMAI TECH CO LTD

Chip pick-and-place manipulator of full-automatic die bonder

PendingCN122270092AReduce operating burdenreduce consumption
The present application relates to chip production technical field, especially a kind of chip pick-and-place manipulator of full-automatic die bonder, including workbench, the workbench upper end is provided with suction pump, the workbench one end is fixedly connected with motor, the output shaft of motor is fixedly connected with runner, the lateral wall of workbench both sides are rotatably provided with runner, and transmission belt is connected between two runners, the lateral wall of the end of workbench away from motor is bolted with link frame, sliding table is fixedly connected on the transmission belt.The chip pick-and-place manipulator of full-automatic die bonder provided in the present application, when the gas extracted by suction pump is sprayed inward, the chip can be quickly cleaned, when the gas extracted by suction pump is sprayed outward, the chuck can be used to adsorb the chip, and the gas extracted can quickly detect that the chuck is not located directly above the chip, and is extracted, effectively reduce the load during transportation, and the setting of link frame can balance relative to motor.
Owner:ZHONGJING XINFU SEMICONDUCTOR (JIANGSU) CO LTD