2results about How to "Avoid affecting the adsorption effect" patented technology

This invention discloses a lithium battery NMP recycling device, relating to the field of recycling equipment technology. It includes a recycling chamber, an air inlet, an exhaust outlet, a heat-conducting plate, and a cooling channel; a heat exchange unit used in conjunction with the heat-conducting plate; a filter body comprising a filter sponge and cotton felt adhered to the outer walls on both sides of the filter sponge in the thickness direction; and a compression unit disposed on the heat-conducting plate, which is used to compress the filter body when the temperature of the heat-conducting plate decreases. By setting up a movable perforated frame, a fixed perforated frame, a rotating arm, a drive unit, and a fixed column, as the temperature of the heat-conducting plate decreases, the drive unit gradually drives the fixed column to move the movable perforated frame, causing the movable perforated frame to begin compressing the filter body. This squeezes out the liquid in the filter body, preventing it from affecting the adsorption effect of the filter body on impurities. Furthermore, after the operation is completed, as the temperature of the heat-conducting plate rises, the movable perforated frame will move away from the fixed perforated frame, allowing the filter body to return to its expanded state.

The present application relates to chip production technical field, especially a kind of chip pick-and-place manipulator of full-automatic die bonder, including workbench, the workbench upper end is provided with suction pump, the workbench one end is fixedly connected with motor, the output shaft of motor is fixedly connected with runner, the lateral wall of workbench both sides are rotatably provided with runner, and transmission belt is connected between two runners, the lateral wall of the end of workbench away from motor is bolted with link frame, sliding table is fixedly connected on the transmission belt.The chip pick-and-place manipulator of full-automatic die bonder provided in the present application, when the gas extracted by suction pump is sprayed inward, the chip can be quickly cleaned, when the gas extracted by suction pump is sprayed outward, the chuck can be used to adsorb the chip, and the gas extracted can quickly detect that the chuck is not located directly above the chip, and is extracted, effectively reduce the load during transportation, and the setting of link frame can balance relative to motor.