2results about How to "Will not affect the detection effect" patented technology

This utility model proposes a high-speed rotary drying and testing device for cylinder heads, belonging to the field of drying and testing technology. It solves the problem in existing technologies that cannot detect the proper clamping of workpieces, easily leading to workpiece damage due to incomplete clamping or the risk of workpiece detachment during operation, posing a safety hazard. It includes a top high-speed rotating shaft, a positioning plate, a frame, a lifting plate, a spring-type triggering mechanism, and a waterproof proximity switch. The positioning plate is connected to the bottom of the top high-speed rotating shaft, which is mounted on the top of the frame. A waterproof proximity switch is installed on the side of the top high-speed rotating shaft and mounted on the frame. The spring-type triggering mechanism is mounted on the positioning plate, and the lifting plate is located below the positioning plate and installed in the middle of the frame. It is mainly used for high-speed rotary drying and testing of cylinder heads.

The application provides a multispectral detection chip, comprising a readout wafer, a bearing wafer, a conductive hole, a visible light pixel and an infrared pixel; the bearing wafer is on the readout wafer; the conductive hole penetrates through the bearing wafer, the visible light pixel is embedded in the bearing wafer, and the infrared pixel is on the conductive hole. The application provides a preparation method, comprising the following steps: preparing the visible light pixel and the conductive hole on the front surface of the bearing wafer; stacking the front surface of the bearing wafer on the readout wafer; thinning the back surface of the bearing wafer to expose the conductive hole and arranging the infrared pixel. The application also provides a multispectral detection chip, comprising a readout wafer and a visible light pixel group and an infrared pixel group which are cross-arranged on the readout wafer. The application also provides a preparation method, comprising the following steps: forming a first temporary layer, a first support layer, a heat-sensitive film and first and second electrodes on the readout wafer to form an infrared pixel; and continuously forming a second temporary layer, a second support layer, a photosensitive film and third and fourth electrodes to form a visible light pixel.