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Banknote binding device and banknote binding method

A bundling device and technology for banknotes, which are applied to devices for accepting coins, packaging of paper products, handling coins or valuable banknotes, etc., can solve the problem of not being able to set and change the bundling position of the banknotes to be bundled.

Active Publication Date: 2012-02-08
GLORY KOGYO KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in Patent Document 1, since the binding position of the binding target banknotes is fixed regardless of the denomination of the banknotes, the binding position of the binding target banknotes cannot be set and changed according to the denominations of the banknotes.

Method used

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  • Banknote binding device and banknote binding method
  • Banknote binding device and banknote binding method
  • Banknote binding device and banknote binding method

Examples

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Embodiment

[0078] figure 1 It is a perspective view clearly showing the external structure of the banknote sorting and binding processing device of this embodiment, figure 2 It is an explanatory diagram showing the schematic structure inside the banknote sorting and binding processing device.

[0079] The banknote sorting and binding processing device 1 includes: a banknote processing device 2, which deposits and trades banknotes continuously, and classifies and accumulates these deposited banknotes according to each banknote type, and calculates the deposit number of the banknotes according to each banknote type. Counting; banknote binding device 3 , which bundles banknotes of a specific denomination sorted in banknote processing device 2 in units of a predetermined number such as 100; and display device 4 , for example, displays various information such as counting results.

[0080]The banknote processing device 2 includes: a storage (hopper) unit 11, which inserts transaction bankno...

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Abstract

A banknote binding device (3) has a stacking section (21) for banknote binding operation, in which stacking section (21) banknotes to be bound are stacked in a sorted state, a binding section (22) for binding together, by using a binding band, one hundred banknotes to be bound, a pre-binding conveying section (25), and a holding and conveying section (27). The pre-binding conveying section (25) and the holding and conveying section (27) are adapted such that, when the number of banknotes to be bound reaches one hundred, these sections (25, 27) convey the one hundred banknotes stacked in the stacking section (21) to the binding section (22). The banknote binding device (3) also has a banknote denomination acquiring section (172) which acquires the denomination of the banknote which, among the hundred banknotes to be bound, is the last stacked in the stacking section (21), and also has a binding position setting section (174) which, based on the denomination of the last stacked banknote, sets the position of a binding band. The position of the binding band can be easily set depending on the denomination of the banknote.

Description

technical field [0001] The present invention relates to, for example, a banknote binding device and a banknote binding method for binding banknotes of a specific denomination in units of a predetermined number of sheets. Background technique [0002] In the past, in such a banknote binding device, a technology comprising the following components is known: a bundling accumulating section for sorting and accumulating banknotes to be bound; a binding section for bundling a predetermined number of banknotes to be bound with a binding belt; section, when the bundled banknotes accumulated in the stacking section for bundling reach a predetermined number, the bundled banknotes of the specified number of sheets accumulated in the stacking section for bundling are conveyed to the bundling section (for example, refer to the patent document 1~2). [0003] For example, in Patent Document 1, the banknotes to be bundled are accumulated in the stacking section for bundling after the front...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65B27/08G07D9/00
CPCG07D11/40
Inventor 铃木寿彦佐藤友康
Owner GLORY KOGYO KK
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