Three-dimensional chip testing method and three-dimensional chip testing device

Abstract

The invention provides a three-dimensional chip testing method and a three-dimensional chip testing device. The three-dimensional chip testing device comprises a first feature analyzer, a second feature analyzer and a third feature analyzer, wherein the first feature analyzer arranged on a first-layer chip is connected with the first-layer chip, a second-layer chip and a third-layer chip and is used for testing a three-dimensional chip to obtain a first testing result; the second feature analyzer arranged on the second-layer chip is used for testing the second-layer chip to obtain a second testing result; the third feature analyzer arranged on the third-layer chip is used for testing the third-layer chip to obtain a third testing result. The three-dimensional chip is a chip formed by binding of the first-layer chip, the second-layer chip and the third-layer chip. The three-dimensional chip testing method and the three-dimensional chip testing device have the advantages that testing of each chip before binding and the three-dimensional chip obtained after binding of the chips is achieved; the feature analyzers for chip testing are arranged inside the three-dimensional chip, so that the chips can be detected in real time, storage of a great number of data is unneeded, storage capacity is reduced and testing overheads are lowered.

Description

technical field [0001] The invention relates to the field of computers, in particular to a three-dimensional chip testing method and device. Background technique [0002] With the continuous improvement of on-chip integration, three-dimensional chips that bind different chips into a single packaged chip are being widely used. [0003] Usually, the design of a three-dimensional chip requires that the complete circuit module be divided into several parts, which are integrated into different chips, and then the different chips are bound to obtain a complete circuit module. Among them, the test for the three-dimensional chip includes two stages, the first stage is to test each chip before bonding, and the second stage is to test the complete circuit after bonding. [0004] However, the testing device for the three-dimensional chip is arranged outside the chip and needs to store the data of the above two stages, resulting in a very large amount of storage and increasing testing ...

AI Technical Summary

Problems solved by technology

[0005] The invention provides a three-dimensional chip testing method and device, which are used to solve the problem of low efficiency of remote testing and control of servers

Images