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Camera module and circuit board thereof

A camera module and circuit board technology, applied in the field of cameras, can solve the problems of inability to solder, defective products, easy to fall off, etc., and achieve the effect of not easy to fall off

Inactive Publication Date: 2015-11-18
NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the support is pressed on the glue and the high temperature generated when the pins are welded to the pads on the circuit board will cause the glue to flow onto the pads, resulting in poor soldering and inability to solder; moreover, in the above-mentioned prior art, The pad is exposed as a whole and is easy to fall off, resulting in defective products

Method used

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  • Camera module and circuit board thereof
  • Camera module and circuit board thereof
  • Camera module and circuit board thereof

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Embodiment Construction

[0026] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. A preferred embodiment of the invention is shown in the drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the present invention will be thorough and complete.

[0027] It should be noted that when an element is referred to as being “fixed on” another element, it may be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only.

[0028] Unless otherwise d...

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PUM

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Abstract

A circuit board comprises a substrate, and lines and bonding pads arranged on the substrate. Further, the circuit board comprises an ink protective layer which covers part of the lines. The ink protective layer is provided with ink windows corresponding to the bonding pads, and the edge of each ink window is lapped on the edge of the corresponding bonding pad. The invention further provides a camera module using the circuit board. As the edge of each ink window is lapped on the edge of the corresponding bonding pad, the bonding pads are not easy to fall off, glue water is effectively prevented from directly flowing to the bonding pads, and the influence of glue water to the effect of welding between a voice coil motor and the bonding pads of the circuit board is avoided.

Description

technical field [0001] The invention relates to the technical field of cameras, in particular to a camera module and a circuit board thereof. Background technique [0002] At present, a camera module with a focus function mainly includes a lens, a voice coil motor (VCM), a filter, a bracket, and a circuit board. Among them, the voice coil motor is the core component to realize the focusing function of the camera module. In the prior art, the voice coil motor is soldered to the reserved pad on the circuit board through the pins at the bottom, so as to realize the connection between the circuit board and the voice coil. Motor signal transmission. [0003] The above-mentioned circuit board in the prior art mainly includes a base material, a copper foil line disposed in the middle of the base material, and at least two solder pads disposed on the edge of the base material. In order to fix the bracket to the circuit board, it is usually necessary to dispense glue on the substra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225
Inventor 刘燕妮雷光辉
Owner NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD
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