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A multi-frequency ultrasonic processing device for engineering ceramics

A technology of ultrasonic processing and engineering ceramics, applied in the direction of stone processing tools, stone processing equipment, work accessories, etc., can solve the problems of high cost, poor processing quality and efficiency, limited processing shape, etc., and achieve light weight and few moving parts , Improve the effect of processing accuracy and processing efficiency

Inactive Publication Date: 2018-11-13
TAIYUAN UNIV OF TECH
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Problems solved by technology

[0005] In order to solve the problems of poor processing quality and efficiency, high cost and limited processing shape in existing processing devices, the present invention provides a multi-frequency ultrasonic processing device for engineering ceramics

Method used

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  • A multi-frequency ultrasonic processing device for engineering ceramics
  • A multi-frequency ultrasonic processing device for engineering ceramics

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Embodiment Construction

[0016] A multi-frequency ultrasonic processing device for engineering ceramics, comprising a bracket 1 arranged on a machine tool table, a horn 2 is arranged on the bracket 1, a transducer 3 connected to the horn 2 is arranged at the lower end of the horn 2, and the horn 2 The upper end of 2 is provided with a stepped connecting block 4 connected to it and the diameter of the upper part is larger than that of the lower part. A drill bit 16 is connected to the upper end of the connecting block 4, a workpiece workbench 6 is arranged above the drill bit 16, and a guide rail 7 sliding up and down is arranged on one side of the workpiece workbench 6.

[0017] The top of the guide rail 7 is provided with a horizontal connecting plate 8 connected thereto. The horizontal connecting plate 8 is provided with fixed pulleys 9 distributed left and right, and the two fixed pulleys 9 are provided with one end connected to the right side of the workpiece table 6, and the other end connected wi...

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Abstract

The invention relates to a ceramic hole processing device, in particular to an engineering-ceramic complex-frequency ultrasonic processing device and solves problems that an existing processing device is poor in processing quality and efficiency, high in cost and limited in processing shape. The engineering-ceramic complex-frequency ultrasonic processing device comprises a frame, an amplitude-change pole is arranged on the frame, a transducer connected with the amplitude-change pole is arranged at the lower end of the same, a stepped connecting block with the upper diameter larger than the lower diameter and connected with the amplitude-change pole is arranged at the upper end of the same, the stepped connecting block is sleeved with a free-quality casing located between the stepped surface of the stepped connecting block and the upper end face of the amplitude-change pole, a drill is connected to the upper end of the stepped connecting block, a workpiece worktable is arranged above the drill, and a guide rail sliding vertically is arranged on one side of the workpiece worktable. The engineering-ceramic complex-frequency ultrasonic processing device is reasonable and reliable in structural design, low in energy consumption, simple in structure and light in weight, processing precision and processing efficiency are greatly improved, few movement parts are involved, rotational motion is omitted, keeping of rotation torque is not needed, and the device can be used for environments under high temperature, low temperature or vacuum and the like.

Description

technical field [0001] The invention relates to a ceramic hole processing device, in particular to a multi-frequency ultrasonic processing device for engineering ceramics. Background technique [0002] With the increasing application of engineering ceramics in aerospace, electronics, automobiles and other fields, the requirements for the processing methods of these materials are getting higher and higher. However, due to the hard and brittle characteristics of engineering ceramic materials, it is usually difficult to process by traditional machining methods, and most ceramics have poor electrical conductivity, thus limiting the use of EDM. In view of this, ceramic materials are greatly limited in processing. [0003] At present, the methods of ceramic processing mainly include mechanical processing, laser processing and ultrasonic processing, among which ultrasonic processing is widely used. Ultrasonic machining is mainly to convert the oscillation signal generated by the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D1/14B28D7/00B28D7/04
CPCB28D1/14B28D1/146B28D7/00B28D7/04
Inventor 王时英贺光明吕明轧刚方桂飞
Owner TAIYUAN UNIV OF TECH
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