A kind of dispensing and pressure maintaining curing device and method

A pressure-holding curing and dispensing technology, which is applied to the device and coating of the surface coating liquid, can solve the problems of low production efficiency and high labor intensity, so as to improve production efficiency, reduce labor intensity and ensure product quality Effect

Active Publication Date: 2019-02-15
GUANGDONG BEIBEI ROBOT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the existing operation method, the operator needs to open the clip frequently, place the parts, and take the parts frequently, which is labor-intensive and low in production efficiency.

Method used

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  • A kind of dispensing and pressure maintaining curing device and method
  • A kind of dispensing and pressure maintaining curing device and method

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Embodiment Construction

[0030] Below in conjunction with accompanying drawing, invention is described in further detail.

[0031] figure 1 and figure 2 Schematically shows a glue dispensing and pressure holding curing device according to an embodiment of the present invention, which is used for pressure holding and curing the earphone front shell and rear shell products 6 that have been assembled by glue dispensing. As shown in the figure, the device includes a chassis 1, an operation terminal 2, a power module 3, a lower module 4, and a pressure holding module 5. The operation terminal 2 and the power module 3 are connected to the chassis 1 through a data line, and the lower module 4 and the pressure maintaining module 5 are connected with the power module 3, and the power module 3 can drive the lower module 4 and the pressure maintaining module 5 to move synchronously. A PLC switching power supply and a stepping motor driver are provided inside the chassis 1, the PLC switch is connected to the o...

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Abstract

The invention discloses an adhesive-dispensing and pressure-maintaining curing device and method. The adhesive-dispensing and pressure-maintaining curing device comprises a machine case, an operating terminal, a power module, a lower die module and a pressure-maintaining module, wherein the operating terminal is connected with the power module and the machine case, the lower die module comprises a conveying belt and multiple lower dies, and the pressure-maintaining module comprises a guide rod and multiple press rod assemblies. The method comprises the following steps that S001, adhesive-dispensing combination is conducted on a product, then the product is put on the lower dies;S002, the device is started, the product is transported forwards, the guide rod drives the press rod assemblies to be lifted; S003, the press rod assemblies drop and press the product for pressure maintenance; S004, the device is started for multiple times, the press rod assemblies and the product move synchronously and forwards; S005, after pressure maintenance is completed, the product leaves a pressure-maintaining module zone, and when the moving and rotation angles of the lower dies are greater than 90 degrees, the product drops from the lower dies. After one-key starting, pressure-maintaining conveying can be conducted on the product, the whole process is completed automatically, the labor intensity of operating workers is reduced, the product quality is ensured, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of glue dispensing processing of electronic products, in particular to a glue dispensing pressure maintaining pressure curing device and method. Background technique [0002] During the processing of electronic products, it is often necessary to glue two parts together. In order to ensure the bonding quality, a pressure-holding device is also required for pressure-holding. In the original manual work process, when two parts are bonded together, glue is first placed on the surface to be bonded of any part, and then the two parts are put together, and the pressure is maintained at the same time. The pressure holding method uses a clip or a cylinder to apply a certain pressure on the two parts and keep it until the set glue curing time (such as 20 seconds), and then remove the parts to complete the glue dispensing and pressure holding curing process. [0003] In the existing operation method, the operator need...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): B05C13/00
CPCB05C13/00
Inventor徐华平胡中骥
OwnerGUANGDONG BEIBEI ROBOT