Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A cleaning system for mass production of pcb boards

A mass production and cleaning system technology, applied in the field of cleaning systems, can solve the problems of inconvenient access to PCB boards, inconvenient disposal of waste liquid, environmental pollution of solution, etc., to achieve the effect of easy collection and treatment, easy maintenance, and improved cleaning effect.

Active Publication Date: 2019-09-27
南通欧能达超声设备有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the process of cleaning the PCB board, the cleaning is not thorough, the PCB board is inconvenient to take after cleaning, the cleaning efficiency is low, the waste liquid is inconvenient to deal with after cleaning, and the solution causes environmental pollution

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A cleaning system for mass production of pcb boards
  • A cleaning system for mass production of pcb boards
  • A cleaning system for mass production of pcb boards

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0030] Such as figure 1As shown, a cleaning system for mass production of PCB boards according to the present invention includes a cleaning structure 1, a supporting structure 2, a placement structure 3, a motor 4, a collection box 5, a support frame 6, a sliding structure 7, a plurality of Drum 9, multiple connecting pipes 10, storage box 11, multiple water outlets 12, protective cover 14, main transmission shaft 15 and auxiliary transmission shaft 16, the sliding structure 7 is arranged at the bottom four corners of the support frame 6 , one end of the support frame 6 is provided with the collection box 5, the top slope of the collection box 5 is provided with a plurality of linearly distributed rollers 9; the side wall of the collection box 5 i...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of PCBs and particularly relates to a cleaning system for the batch production of the PCBs. The cleaning system comprises a cleaning structure, a support structure, a placement structure, a motor, a collection tank, a support frame, sliding structures, a roller, a connecting pipe, a storage tank, a water draining hole, a protecting cover, a main transmission shaft and an auxiliary transmission shaft, wherein the cleaning structure is used for cleaning layer by layer; the motor is used for driving the main transmission shaft and the auxiliary transmission shaft to drive the placement structure to rotate, and the placement structure is used for realizing the automatic movement of the PCBs; the support structure is used for supporting the cleaningstructure; the sliding structures are used for carrying devices; and the roller for connecting the next flow is used for preventing the collection tank and the storage tank in the environment from being polluted by sewage. According to the cleaning system, the surfaces of the PCBs are cleaned layer by layer; the cleaning structure is matched with the placement structure for use, so that the cleaned PCBs can be conveniently and automatically conveyed to the next flow, and the working efficiency is greatly improved; and the collection tank is matched with the storage tank for use, so that the sewage can be conveniently collected after cleaning.

Description

technical field [0001] The invention relates to the technical field of PCB boards, in particular to a cleaning system for mass production of PCB boards. Background technique [0002] With the continuous development of electronic technology, the demand for PCB boards is also increasing. PCB, the Chinese name is printed circuit board, also known as printed circuit board, which is an important electronic component and a support for electronic components. The carrier for the electrical connection of electronic components is called a "printed" circuit board because it is made by electronic printing. After electronic equipment uses printed boards, due to the consistency of similar printed boards, manual wiring is avoided. errors, and can realize automatic insertion or placement of electronic components, automatic soldering, and automatic detection, which ensures the quality of electronic equipment, improves labor productivity, reduces costs, and facilitates maintenance. At the sam...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/26
Inventor 李建张家安冷应杰
Owner 南通欧能达超声设备有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com