Separating device for release films

A separation equipment and release film technology, applied in the direction of layered products, lamination auxiliary operation, lamination, etc., to achieve the effect of high stand-alone efficiency, saving labor costs, and realizing automatic operation.
CN109760404APending Publication Date: 2019-05-17XIAMEN HONGXIN ELECTRON TECH +1
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
XIAMEN HONGXIN ELECTRON TECH
Publication Date
2019-05-17

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Abstract

The invention discloses a separating device for release films. The separating device comprises a frame, a working platform, a moveable loading platform, a material putting mechanism, a loading mechanism, laminating mechanisms, a film-blowing and film-sucking mechanism, a blanking mechanism and a material collecting plate; the working platform is arranged above the frame; the moveable loading platform is horizontally arranged on the working platform; the material putting mechanism is arranged on one side of the moveable loading platform; the loading mechanism is arranged on one side of the material putting mechanism; the laminating mechanisms are arranged on the two sides of a middle area of the moveable loading platform; the film-blowing and film-sucking mechanism is arranged above the laminating mechanisms; the material collecting plate is arranged above the working platform; the blanking mechanism is arranged in a space stretching over one side of the moveable loading platform and above the material collecting plate. The separating device for release films is capable of realizing automatic operation, greatly increasing productivity and saving labor cost, is stable in equipment operation and is capable of guaranteeing quality of products.
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Description

technical field

[0001] The invention relates to automatic equipment for flexible circuit boards, in particular to a release film separation equipment. Background technique

[0002] One of the production and manufacturing processes of flexible circuit boards is EMI pasting and pressing of electromagnetic shielding film. From top to bottom, the EMI material structure of electromagnetic shielding film is release film, electromagnetic shielding layer and carrier protective film, and the electromagnetic shielding film of carrier protective film is removed. After the EMI is attached to the product, it is necessary to peel off the release film on the electromagnetic shielding layer. The existing EMI release film stripping operation method is to manually use a thimble jig to initially lift the EMI release film of each unit of the product. After one corner, the release film on the EMI is manually blown off with a high-pressure air gun. This operation method can only be done manually,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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