Invoicing system based on layered principle and loading method thereof
A layered and principled technology, applied in the field of tax information, can solve problems such as poor security and lack of understanding of underlying technologies, and achieve the effect of increasing hardware scalability and reducing development costs
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Embodiment 1
[0047] In order to clarify the overall structure of the billing system, make the definition of the billing system clearer, and achieve the goal of better product development, this application provides a billing system based on the principle of layering. The billing device system based on the principle of layering will ensure The future hardware platform will be expanded with more abundant component models and types.
[0048] see figure 2 , the layered billing system includes an application layer, a board-level support package layer (or BSP layer) and a hardware layer; wherein, the specific implementation of each layer of the billing system is as follows:
[0049] (1) The application layer includes an application boot program and an application firmware;
[0050] The application bootloader is used to load and start the application firmware and the board-level support package to ensure the security and reliability of writing the application firmware and the board-level support p...
Embodiment 2
[0077] Embodiment 2 of the present application provides a loading method of the billing system, through which the communication association between layers in the billing system can be realized, such as image 3 As shown, the loading method includes:
[0078] Step 310, the billing system is started, and it is detected whether the application boot program of the application layer has been loaded, if yes, then execute step 330, otherwise execute step 320;
[0079] Step 320, the chip boot program of the hardware layer starts the initial program of the main control chip, and guides the application layer and the board-level support package to be written into the main control MCU security chip;
[0080] Step 330, the chip bootloader starts the application bootloader by default, and the application bootloader loads and starts the application firmware and the board-level support package to realize the communication connection between the application layer, the board-level support packa...
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