A spectrum dimming packaging structure containing ultraviolet or near-ultraviolet chip and its manufacturing method

Abstract

The present invention relates to a spectral dimming packaging structure containing a violet or near-ultraviolet chip, and also to a manufacturing method of the packaging structure, which is characterized by comprising a first wavelength blue light chip, a second wavelength blue light chip, a violet or near-ultraviolet chip and a packaging layer, a long wavelength phosphor glue layer is arranged on the surface of the first wavelength blue light chip to form a long wavelength package, a short wavelength phosphor glue layer is arranged on the surface of the violet or near-ultraviolet chip to form a short wavelength package, and the packaging layer is used to encapsulate each short wavelength package, the second wavelength blue light chip and the long wavelength package as a whole. The advantages of the present invention are: using multiple chips with different wavelengths for excitation can take into account the excitation wavelengths of different phosphors, and can avoid the short wavelength fluorescence generated by the short wavelength phosphor from exciting the long wavelength phosphor again and being reabsorbed; the optimal excitation wavelength achieves the highest quantum efficiency and improves the light efficiency of the light source at the same time.

Description

Technical Field

[0001] The invention relates to a spectrum dimming packaging structure containing a violet light or near-ultraviolet chip, and also relates to a manufacturing method of the spectrum dimming packaging structure containing a violet light or near-ultraviolet chip. Background Art

[0002] Humans have lived on Earth for millions of years and have been evolving with the changes in the living environment, but the only thing that remains constant is our reliance on and adaptation to sunlight. Therefore, it can be considered that natural light or sunlight is the most comfortable and healthy light source for humans. Healthy lighting is an important trend in the future development of lighting, and LED-based full-spectrum solar light sources are the main way to achieve healthy lighting.

[0003] The spectrum of sunlight includes ultraviolet light, visible light and infrared light, which can be called full spectrum. Natural light full spectrum LED light source refers to the ratio of each band in the visible light part of LED light source is similar to sunlight, and the color rendering index is close to 100. Traditional LED light source mainly emits light by stimulating phosphor powder with a wavelength of about 450nm, which will cause excessive blue light radiation and lack of some blue-green light and deep red light, which can easily cause vision damage. Therefore, high-quality natural light-like full spectrum LED light source has become a new trend in the development of healthy and comfortable lighting.

[0004] There are currently two main solutions for LED full-spectrum light sources. One is a method of using 450-460nm blue light chips to excite phosphors. By improving the phosphors, the color rendering index and light efficiency are improved, and Ra can reach above 97. However, it still appears as a higher-intensity blue peak, but the coverage band of the phosphor is wider than that of ordinary LEDs to improve Ra and R9. The continuity of the spectrum is not perfect, and there is a big difference between the intensity ratio of each band and sunlight.

[0005] Another solution is to use a purple light chip to excite RGB multi-color phosphors to achieve a continuous spectrum, unlike the lack of blue-green and deep red coverage of two-color phosphors. The light source of this solution is as close to the solar spectrum as possible, not only achieving high reduction and high saturation, but also avoiding the appearance of short-wave blue light. However, compared with the ideal solar spectrum, the spectrum obtained by the existing technical solution has no purple spectrum segment, especially the purple light band with a wavelength below 420nm is missing; the long-wave spectrum with a wavelength greater than 750nm is missing; and the spectrum of the 475nm band is missing.

[0006] In order to further improve the color rendering index and light efficiency of the light source, the industry has also proposed several solutions. Seoul Semiconductor launched the SunLike full-spectrum light source, which combines Seoul Semiconductor's patented LED chip technology and Toshiba Materials TRI-R phosphor technology to produce a natural light spectrum. Sunlike full-spectrum implementation technology: It uses all purple LED chips to excite the various colors of phosphors mixed in the overall packaging layer. Specific implementation methods, such as Figure 1 As shown. The disadvantage of this solution is that all mixed phosphors are excited by violet light, and the excitation efficiency of violet light is very low, which cannot achieve high-efficiency excitation of mixed phosphors, resulting in a waste of violet light. In addition, this solution also has the problem of secondary excitation of other long-wavelength phosphors by blue light from violet light-exciting short-wavelength phosphors, thus affecting the overall display quality and failing to further improve the light efficiency and color rendering of the light source.

[0007] The patent technology of Nationstar Optoelectronics (patent application number: 201610067066.1) discloses a sunlight-simulating LED light source and its preparation method. The present invention discloses a sunlight-simulating LED light source, the LED light source includes a blue light chip and an LED phosphor, the LED phosphor is composed of the following components: 10-20% of blue-green powder with an emission wavelength of 490-510nm, 70-80% of green powder with an emission wavelength of 520-540nm, 1.5-5% of orange powder with an emission wavelength of 600-620nm, and 4-12.3% of red powder with an emission wavelength of 630-660nm. Correspondingly, the invention also provides a preparation method for the above-mentioned sunlight-simulating LED light source. Compared with the solar spectrum, the spectrum obtained by the invention can be found to have the following main defects: the obtained spectrum has no ultraviolet spectrum segment compared with the ideal solar spectrum, especially the purple light band with a wavelength below 420nm is missing; the long-wave spectrum with a spectrum wavelength greater than 750nm is missing; the spectrum of the 475nm band is missing.

[0008] Xinda Optoelectronics' patented technology for full spectrum implementation: (patent number 201810067979.2) uses violet or near-ultraviolet chips, two blue chips with different main wavelength ranges, and a light conversion layer coated on the violet or near-ultraviolet chips and blue chips. The light conversion layer is prepared by phosphor and encapsulation glue. In other words, the cyan powder with an emission wavelength of 490-505nm, the green powder with an emission wavelength of 520-540nm, and the crimson powder with an emission wavelength of 640-660nm are mixed with the encapsulation glue to form the light conversion layer. Specific implementation methods, such as Figure 2As shown. This solution still uses mixed phosphor excitation, but the difference is that some chips are purple light and some are blue light, which improves the quality of the full spectrum to a certain extent, but there are still problems of secondary excitation of phosphors and low excitation efficiency. The use of blue light chips with relatively high quantum efficiency improves the overall light efficiency, but there will be problems such as purple light being unnecessarily wasted in exciting phosphors other than 470-505 wavelengths, and blue light phosphors secondary excite long-wavelength phosphors, resulting in low overall excitation efficiency.

[0009] Combining the above solutions, we can conclude that there are several common problems:

[0010] First, from Figure 3-Figure 8 It can be seen from the spectra of the six phosphors in that different phosphors have different optimal excitation wavelengths. Using a single wavelength of light to excite the mixed phosphor cannot take into account the optimal excitation wavelength of each phosphor, so the excitation efficiency for a certain phosphor is low. Therefore, although the use of mixed phosphors can also improve the color rendering index, its energy loss is large and the luminous efficiency is low. For example, for cyan phosphors, since its luminous wavelength is close to the excitation wavelength, the excitation efficiency is very low, and shorter wavelength blue or purple light should be used for excitation. However, using shorter wavelength blue or purple light to excite the mixed phosphor can improve the excitation efficiency of the cyan phosphor, but it increases the photon energy consumption of short-wavelength photons when exciting the yellow and long-wavelength phosphors.

[0011] Second, there is the problem of secondary absorption for mixed phosphors. Figure 7 and Figure 8 It can be seen from the excitation spectra of the 655 and 660nm phosphors that there is still a relative absorption of up to 40% for the light emitted by the 495nm phosphor, which will not only reduce the component of cyan light, but also cause secondary energy loss. Assuming that the quantum efficiency of cyan phosphor and long-wavelength phosphor are both 90%, the quantum efficiency of cyan phosphor excited by blue light and then excited by long-wavelength phosphor is 81%, which is about 10% lower than the quantum efficiency of blue directly exciting long-wavelength phosphor. Therefore, secondary absorption has a great influence on color rendering and luminous efficiency.

[0012] Third, for phosphors excited by blue light, one blue light photon can only excite one photon of another color at most, and the energy difference between the two photons is called Stocks shift. Figure 7 , 8 It can be seen that when a single short-wavelength blue light is used to simultaneously excite the mixed phosphor, the energy difference between the red light and the blue light is large, and the photon energy loss is large. The excess energy is absorbed by the lattice vibration, which not only causes the waste of photon energy, but also generates heat energy, which puts high demands on the heat dissipation of the device.

[0013] Fourth, from Fig. 9 It can be seen that for the same phosphor, the emission wavelength is different when excited by blue light of different wavelengths. The emission wavelength will move relative to the movement of the excitation wavelength. At present, people are paying more and more attention to healthy lighting, that is, they hope that the emission spectrum will be wider and the color rendering index will be higher. Compared with multi-wavelength excitation, the emission spectrum of single-wavelength excitation light is narrower and the color rendering index is lower, which cannot meet the needs of wide spectrum and high color rendering index. Summary of the invention

[0014] The technical problem to be solved by the present invention is to provide a spectrum dimming packaging structure with a higher color rendering index and guaranteed luminous efficiency, and also provide a method for manufacturing the spectrum dimming packaging structure.

[0015] In order to solve the above technical problems, the technical solution of the present invention is: a spectrum dimming packaging structure containing ultraviolet or near-ultraviolet chips, the innovation of which is: comprising:

[0016] At least one first chip, the first chip is a first wavelength blue light chip, a long wavelength phosphor glue layer is arranged on the surface of the first wavelength blue light chip to form a long wavelength package, the long wavelength phosphor glue layer is formed by mixing a colloid and a long wavelength phosphor with an emission wavelength of 600-1000nm; and the weight ratio of the long wavelength phosphor to the colloid in the long wavelength phosphor glue layer is 0.2-5:1;

[0017] at least one second chip, wherein the second chip is a second wavelength blue light chip;

[0018] At least one third chip, the third chip is a violet or near-ultraviolet chip, a short-wavelength phosphor glue layer is arranged on the surface of the violet or near-ultraviolet chip to form a short-wavelength package, the short-wavelength phosphor glue layer is formed by mixing a colloid with a short-wavelength phosphor having an emission wavelength of 450-500nm; and the weight ratio of the short-wavelength phosphor to the colloid in the short-wavelength phosphor glue layer is 0.2-5:1;

[0019] An encapsulation layer, used to encapsulate the short-wavelength encapsulation bodies, the second chip and the long-wavelength encapsulation body as a whole, wherein the encapsulation layer contains any one or two of a green phosphor with an emission wavelength of 500-550nm and a yellow phosphor with an emission wavelength of 550-600nm, and does not contain a short-wavelength phosphor with an emission wavelength of 450-500nm and a long-wavelength phosphor with an emission wavelength of 600-1000nm;

[0020] The number and wavelength of the short-wavelength package, the second chip and the long-wavelength package satisfy:

[0021] (1) When the color temperature required by the spectral dimming package structure as a whole is higher than 4500K, the number of the long-wavelength package accounts for 5 to 30% of the total number of the short-wavelength package, the second chip and the long-wavelength package;

[0022] When the color temperature required by the spectral dimming package structure as a whole is lower than or equal to 4500K, the number of the long-wavelength packages accounts for 30-80% of the total number of the short-wavelength packages, the second chip and the long-wavelength packages;

[0023] (2) The ratio of the number of the short-wavelength package to the number of the second chip is 1:1 to 5;

[0024] (3) The wavelength of the first chip is denoted as λA, λA=445~550nm; the wavelength of the second chip is denoted as λB, λB=420~465nm; the wavelength of the third chip is denoted as λC, λC=370-420nm; and 0≤λA-λB≤130nm.

[0025] Preferably, the short-wavelength phosphor glue layer is arranged on the top surface and side surface of the ultraviolet or near-ultraviolet chip to form a CSP packaging structure, or is arranged on the top surface of the ultraviolet or near-ultraviolet chip to form a WLP packaging structure; the short-wavelength phosphor glue layer is arranged on the top surface of the ultraviolet or near-ultraviolet chip with a thickness of 20 to 400um, and on the side surface of the ultraviolet or near-ultraviolet chip with a thickness of 0 to 400um.

[0026] Preferably, the weight ratio of the short-wavelength phosphor to the colloid in the short-wavelength phosphor glue layer is greater than 2-5:1; and the quantity ratio of the short-wavelength package to the second chip is 1:1-3.

[0027] Preferably, the long-wavelength phosphor glue layer is arranged on the top surface and the side surface of the first wavelength blue light chip to form a CSP packaging structure, or is arranged on the top surface of the first wavelength blue light chip to form a WLP packaging structure; the long-wavelength phosphor glue layer is arranged on the top surface of the first wavelength blue light chip with a thickness of 20 to 400 um, and on the side surface of the first wavelength blue light chip with a thickness of 0 to 400 um.

[0028] Preferably, the long-wavelength phosphor with an emission wavelength of 600-1000 nm is any one of red phosphor and near-infrared phosphor or a mixture of the two.

[0029] A method for manufacturing a spectral dimming packaging structure containing a UV or near-UV chip, the innovation of which is that the method comprises:

[0030] Step S1: Chip or package production,

[0031] The first chip uses a first wavelength blue light chip, and a long wavelength phosphor glue layer is formed on the surface of the first wavelength blue light chip to obtain a long wavelength package in the form of WLP or CSP packaging, wherein the long wavelength phosphor glue layer is formed by mixing a colloid and a long wavelength phosphor with an emission wavelength of 600-1000nm; the powder-to-glue ratio of the colloid to the long wavelength phosphor in the long wavelength phosphor glue layer is controlled to be 0.2-5:1;

[0032] The second chip uses a second wavelength blue light chip;

[0033] The third chip uses a violet or near-ultraviolet chip, and a short-wavelength phosphor glue layer is made on the surface of the violet or near-ultraviolet chip to obtain a short-wavelength package in the form of WLP or CSP packaging, wherein the short-wavelength phosphor glue layer is a mixture of colloid and short-wavelength phosphor with an emission wavelength of 450-500nm; the powder-to-glue ratio of the short-wavelength phosphor to the colloid in the short-wavelength phosphor glue layer is controlled to be 0.2-5:1;

[0034] Step S2: Chip and package quantity ratio,

[0035] According to the color temperature requirements of the final spectrum dimming package structure containing ultraviolet or near-ultraviolet chips, select the proportion of long-wavelength packages to the total number of chips:

[0036] When the color temperature required by the spectrum dimming package structure as a whole is higher than 4500K, the number of the long-wavelength packages accounts for 5-30% of the total number of the short-wavelength packages, the second chip and the long-wavelength packages;

[0037] When the color temperature required by the spectral dimming package structure as a whole is lower than or equal to 4500K, the number of the long-wavelength packages accounts for 30-80% of the total number of the short-wavelength packages, the second chip and the long-wavelength packages;

[0038] The color point coordinates of the long wavelength package on the CIE chromaticity diagram after the selected quantity ratio are recorded as red points (X1; Y1);

[0039] Then, according to the relative height of the peak wavelength λB of the second chip and 480nm in the spectrum, the ratio of the number of the short-wavelength package to the second chip is selected to be within 1:1 to 5;

[0040] The color point coordinates of the short wavelength package and the second chip corresponding to each other on the CIE chromaticity diagram after the selected quantity ratio are recorded as the mixed blue point (X2; Y2);

[0041] Step S3: Pre-control of color temperature,

[0042] The short-wavelength package, the second chip and the long-wavelength package are respectively bonded to corresponding positions on the support or substrate; and they are illuminated to obtain the color point position corresponding to the CIE chromaticity diagram after illumination, which is recorded as the mixing point (X3; Y3), and it is ensured that 0.09≤Y3≤0.2, 0.22≤X3≤0.37; thereby pre-controlling the color temperature range; if it is not within the range, re-performing step S2;

[0043] Step S4:

[0044] Then, according to the color temperature requirements of the spectral dimming package structure containing the final ultraviolet or near-ultraviolet chip, the color point coordinates corresponding to the final color temperature on the Planckian locus of the CIE chromaticity diagram are found and recorded as the white point (X4; Y4);

[0045] The specific coordinate value or coordinate range of the required green point (X5; Y5) is obtained through the known red point (X1; Y1), mixed blue point (X2; Y2), mixed point (X3; Y3), and white point (X4; Y4);

[0046] Then, according to the coordinate value or coordinate range, a green phosphor with an emission wavelength of 500-550nm and a yellow phosphor with an emission wavelength of 550-600nm are selected in a suitable ratio, and then mixed into the colloid to form an encapsulated colloid.

[0047] The short-wavelength package bodies, the second chip and the long-wavelength package body are integrally packaged on a support member or a substrate by using a packaging colloid to form a packaging layer;

[0048] Then, the phosphor in the encapsulation layer is fully settled through a precipitation process, and then the temperature is raised to the curing temperature of the colloid for curing to obtain a finished product;

[0049] Step S5:

[0050] Check whether the luminous spectrum and color temperature of the finished product meet the design requirements. If the corresponding color point on the CIE chromaticity diagram is higher or lower than the Planckian locus, the amount of green phosphor and yellow phosphor in the external colloid should be reduced or increased accordingly.

[0051] If the color temperature does not meet the requirements, directly adjust the ratio of the long wavelength package to the total number of the short wavelength package, the second chip and the long wavelength package and then repeat steps S3 to S5;

[0052] If the luminescence spectrum does not meet the requirements, the number of the third chips is directly adjusted and steps S3 to S5 are repeated.

[0053] The advantages of the present invention are:

[0054] The present invention discloses a spectrum dimming packaging structure containing a violet light or near-ultraviolet chip. The excitation of multiple chips with different wavelengths can take into account the excitation wavelengths of different phosphors, that is, a short-wavelength chip can excite a short-wavelength phosphor, and a long-wavelength chip can excite a long-wavelength phosphor. At the same time, it can avoid that the short-wavelength fluorescence generated by the short-wavelength phosphor excites the long-wavelength phosphor again and is reabsorbed. The optimal excitation wavelength realizes the highest quantum efficiency and improves the light efficiency of the light source.

[0055] The packaging structure of chips with multiple different wavelengths is different from conventional technology in that the long-wavelength phosphor is packaged in the local area of ​​the top and side of the chip using CSP or WLP technology, and only a very small amount of short-wavelength and medium-wavelength fluorescence will irradiate the long-wavelength phosphor, which can effectively avoid the problem of secondary absorption of cyan, blue and green fluorescence by the long-wavelength phosphor. In particular, the excitation efficiency of cyan fluorescence is low, which can effectively reduce the secondary loss of cyan fluorescence, thereby improving the light efficiency and the color rendering index.

[0056] At the same time, according to the Stokes shift phenomenon, for the same kind of phosphor, when the wavelength of the excitation light moves, its luminous wavelength will also move relatively in the corresponding wavelength direction; therefore, the long-wavelength chip used in the present invention to excite the long-wavelength phosphor can obtain red fluorescence with a longer wavelength, and the short-wavelength chip used to excite the cyan, blue, and green phosphors can obtain cyan, blue, and green fluorescence with a shorter wavelength, so that the fluorescence band spectrum is widened, thereby further improving the color rendering index.

[0057] More importantly, the light source packaging structure of the present invention can change the color temperature directly by changing the ratio of the second chip to the long-wavelength package in the light source. Compared with the conventional technology, the color temperature of the light source needs to be changed by constantly adjusting the phosphor ratio and amount of the overall phosphor layer, which leads to the problem that the light-emitting surface of the COB package is dark and turbid. The present invention is implemented by using a full red-powder CSP chip, and the color temperature can be changed by changing the ratio of the red light chip to the blue light chip in the light source, unlike the conventional packaging form, which requires the phosphor to be accurately weighed by a high-precision balance, and then the mixing concentration of the long-wavelength phosphor in the overall packaging layer is changed to achieve the change of color temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0058] Figure 1 Schematic diagram of the Sunlike full spectrum implementation principle.

[0059] Figure 2 This is a schematic diagram of the full-spectrum implementation structure of Xinda Optoelectronics' patented technology.

[0060] Figure 3 This is the excitation and emission spectrum of 495 phosphor.

[0061] Figure 4 This is the excitation and emission spectrum of 518 phosphor.

[0062] Figure 5 This is the excitation and emission spectrum of 530 phosphor.

[0063] Figure 6 This is the excitation and emission spectrum of 535 phosphor.

[0064] Figure 7 This is the excitation and emission spectrum of 655 phosphor.

[0065] Figure 8 This is the excitation and emission spectrum of 660 phosphor.

[0066] Fig. 9 The excitation spectrum and emission spectrum of red phosphor excited by different excitation wavelengths.

[0067] Fig.10 The figure is a schematic diagram of the spectral dimming packaging structure containing a UV or near-UV chip of the present invention.

[0068] Fig.11 This is a spectrum diagram of the 4000K spectrum dimming packaging structure of the first embodiment of the present invention.

[0069] Fig.12 This is a spectrum diagram of the 3000K spectrum dimming packaging structure of the second embodiment of the present invention.

[0070] Fig.13 This is a spectrum diagram of the 5000K spectrum dimming packaging structure of the third embodiment of the present invention.

[0071] Fig.14 This is a spectrum diagram of the 2800K spectrum dimming packaging structure of the fourth embodiment of the present invention. DETAILED DESCRIPTION

[0072] like Fig.10 As shown, the spectral dimming packaging structure of the present invention contains a violet or near-ultraviolet chip, which includes

[0073] At least one first chip, the first chip is a first wavelength blue light chip 11, a long wavelength phosphor glue layer 12 is arranged on the surface of the first wavelength blue light chip 11 to form a long wavelength package, the long wavelength phosphor glue layer 12 is formed by mixing a colloid with a long wavelength phosphor with an emission wavelength of 600-1000nm; and the weight ratio of the long wavelength phosphor to the colloid in the long wavelength phosphor glue layer 12 is 0.2-5:1;

[0074] At least one second chip, the second chip being a second wavelength blue light chip 2;

[0075] At least one third chip, which is a violet or near-ultraviolet chip 31, and a short-wavelength phosphor glue layer 32 is arranged on the surface of the violet or near-ultraviolet chip 31 to form a short-wavelength package, and the short-wavelength phosphor glue layer 32 is formed by mixing a colloid with a short-wavelength phosphor with an emission wavelength of 450-500nm; and the weight ratio of the short-wavelength phosphor to the colloid in the short-wavelength phosphor glue layer 32 is 0.2-5:1;

[0076] The encapsulation layer 4 is used to encapsulate the short-wavelength encapsulation bodies, the second chip and the long-wavelength encapsulation body as a whole. The encapsulation layer 4 contains any one or two of a green phosphor with an emission wavelength of 500-550nm and a yellow phosphor with an emission wavelength of 550-600nm, and does not contain a short-wavelength phosphor with an emission wavelength of 450-500nm and a long-wavelength phosphor with an emission wavelength of 600-1000nm.

[0077] The number and wavelength of the short-wavelength package, the second chip and the long-wavelength package in the present invention satisfy:

[0078] (1) When the color temperature required by the spectral dimming package structure as a whole is higher than 4500K, the number of long-wavelength packages accounts for 5 to 30% of the total number of short-wavelength packages, the second chip and the long-wavelength packages;

[0079] When the color temperature required by the spectral dimming package structure as a whole is lower than or equal to 4500K, the number of long-wavelength packages accounts for 30% to 80% of the total number of short-wavelength packages, the second chip and the long-wavelength packages;

[0080] (2) The ratio of the number of short-wavelength packages to the number of second chips is 1:1 to 5;

[0081] (3) The wavelength of the first chip is denoted as λA, λA=445~550nm; the wavelength of the second chip is denoted as λB, λB=420~465nm; the wavelength of the third chip is denoted as λC, λC=370-420nm; and 0≤λA-λB≤130nm.

[0082] Among them, the short-wavelength phosphor glue layer 32 is arranged on the top surface and the side surface of the ultraviolet or near-ultraviolet chip 31 to form a CSP packaging structure, or is arranged on the top surface of the ultraviolet or near-ultraviolet chip 31 to form a WLP packaging structure; usually, the short-wavelength phosphor glue layer 32 is arranged on the top surface of the ultraviolet or near-ultraviolet chip 31 with a thickness of 20 to 400um, and on the side surface of the ultraviolet or near-ultraviolet chip 31 with a thickness of 0 to 400um.

[0083] In the seafood lamp application scenario, the weight ratio of the short-wavelength phosphor to the colloid in the short-wavelength phosphor glue layer 32 is greater than 2-5:1; and the quantity ratio of the short-wavelength package to the second chip is 1:1-3.

[0084] The long-wavelength phosphor glue layer 12 is arranged on the top and side surfaces of the first-wavelength blue light chip 11 to form a CSP packaging structure, or is arranged on the top surface of the first-wavelength blue light chip 11 to form a WLP packaging structure; usually, the long-wavelength phosphor glue layer is arranged on the top surface of the first-wavelength blue light chip with a thickness of 20 to 400 um, and on the side surfaces of the first-wavelength blue light chip 11 with a thickness of 0 to 400 um. The long-wavelength phosphor with an emission wavelength of 600-1000 nm adopts any one of red phosphor and near-infrared phosphor or a mixture of the two.

[0085] The method for manufacturing a spectral dimming packaging structure containing a UV or near-UV chip in the present invention comprises the following steps:

[0086] Step S1: Chip or package production,

[0087] The first chip selects a first wavelength blue light chip, and a long wavelength phosphor glue layer is formed on the surface of the first wavelength blue light chip to obtain a long wavelength package in the form of WLP or CSP packaging, wherein the long wavelength phosphor glue layer is formed by mixing a colloid and a long wavelength phosphor with an emission wavelength of 600-1000nm; the powder-to-glue ratio of the colloid to the long wavelength phosphor in the long wavelength phosphor glue layer is controlled to be 0.2-5:1; technicians in this field should understand that the powder-to-glue ratio refers to the mass ratio of glue to powder, and the wavelength of each color phosphor refers to the peak wavelength.

[0088] The second chip uses a second wavelength blue light chip;

[0089] The third chip uses a violet or near-ultraviolet chip, and a short-wavelength phosphor glue layer is made on the surface of the violet or near-ultraviolet chip to obtain a short-wavelength package in the form of WLP or CSP packaging, wherein the short-wavelength phosphor glue layer is a mixture of colloid and short-wavelength phosphor with an emission wavelength of 450-500nm; the powder-to-glue ratio of the short-wavelength phosphor to the colloid in the short-wavelength phosphor glue layer is controlled to be 0.2-5:1;

[0090] Step S2: Chip and package quantity ratio,

[0091] According to the color temperature requirements of the final spectrum dimming package structure containing ultraviolet or near-ultraviolet chips, select the proportion of long-wavelength packages to the total number of chips:

[0092] When the color temperature required by the spectrum dimming package structure as a whole is higher than 4500K, the number of the long-wavelength packages accounts for 5-30% of the total number of the short-wavelength packages, the second chip and the long-wavelength packages;

[0093] When the color temperature required by the spectral dimming package structure as a whole is lower than or equal to 4500K, the number of the long-wavelength packages accounts for 30-80% of the total number of the short-wavelength packages, the second chip and the long-wavelength packages;

[0094] The color point coordinates of the long wavelength package on the CIE chromaticity diagram after the selected quantity ratio are recorded as red points (X1; Y1);

[0095] Then, according to the relative height of the peak wavelength λB of the second chip and 480nm in the spectrum, the number ratio of the short-wavelength package to the second chip is selected to be within 1:1 to 5;

[0096] The color point coordinates of the short wavelength package and the second chip corresponding to each other on the CIE chromaticity diagram after the selected quantity ratio are recorded as the mixed blue point (X2; Y2);

[0097] Step S3: Pre-control of color temperature,

[0098] The short-wavelength package, the second chip and the long-wavelength package are respectively bonded to corresponding positions on the support or substrate; and they are illuminated to obtain the color point position corresponding to the CIE chromaticity diagram after illumination, which is recorded as the mixing point (X3; Y3), and it is ensured that 0.09≤Y3≤0.2, 0.22≤X3≤0.37; thereby pre-controlling the color temperature range; if it is not within the range, re-performing step S2;

[0099] Step S4:

[0100] Then, according to the color temperature requirements of the spectral dimming package structure containing the final ultraviolet or near-ultraviolet chip, the color point coordinates corresponding to the final color temperature on the Planckian locus of the CIE chromaticity diagram are found and recorded as the white point (X4; Y4);

[0101] The specific coordinate value or coordinate range of the required green point (X5; Y5) is obtained through the known red point (X1; Y1), mixed blue point (X2; Y2), mixed point (X3; Y3), and white point (X4; Y4);

[0102] Then, according to the coordinate value or coordinate range, a green phosphor with an emission wavelength of 500-550nm and a yellow phosphor with an emission wavelength of 550-600nm are selected in a suitable ratio, and then mixed into the colloid to form an encapsulated colloid.

[0103] The short-wavelength package bodies, the second chip and the long-wavelength package body are integrally packaged on a support member or a substrate by using a packaging colloid to form a packaging layer;

[0104] Then, the phosphor in the encapsulation layer is fully settled through a precipitation process, and then the temperature is raised to the curing temperature of the colloid for curing to obtain a finished product;

[0105] Step S5:

[0106] Check whether the luminous spectrum and color temperature of the finished product meet the design requirements. If the corresponding color point on the CIE chromaticity diagram is higher or lower than the Planckian locus, the amount of green phosphor and yellow phosphor in the external colloid should be reduced or increased accordingly.

[0107] If the color temperature does not meet the requirements, directly adjust the ratio of the long wavelength package to the total number of the short wavelength package, the second chip and the long wavelength package and then repeat steps S3 to S5;

[0108] If the luminescence spectrum does not meet the requirements, the number of the third chips is directly adjusted and steps S3 to S5 are repeated.

[0109] Embodiment 1

[0110] Take the 4000K color temperature spectrum dimming packaging structure as an example:

[0111] The first wavelength blue light chip is selected with a specification of 14*30mil, and its peak wavelength λA is 465nm. The peak wavelength of the long wavelength phosphor glue layer is 650nm, and the powder-to-glue ratio of the long wavelength phosphor glue layer is 1.7:1. The thickness of the long wavelength phosphor glue layer on the top surface of the first wavelength blue light chip is 200 microns, and the thickness on the side is 0 microns, that is, there is no phosphor glue layer on the side;

[0112] The second wavelength blue light chip specification is 14*30mil, and the wavelength λB is 452nm;

[0113] The specification of the ultraviolet or near-ultraviolet chip is 14*30mil, the wavelength λC is 410nm, the peak wavelength of the short-wavelength phosphor glue layer is 480nm, the powder-to-glue ratio of the short-wavelength phosphor glue layer is 2:1, and the thickness of the short-wavelength phosphor glue layer is 300 microns on the top of the ultraviolet or near-ultraviolet chip and 120 microns on the side;

[0114] The total number of chips in the entire spectrum dimming package structure is 40 to 50. According to the ratio, the number of long-wavelength packages is initially selected to be 18. The red dot coordinates of the long-wavelength packages on the CIE chromaticity diagram are (0.32, 0.14); the number of short-wavelength packages and the number of second chips are 7 and 20 respectively. On the CIE chromaticity diagram, the second chip and the short-wavelength package have corresponding coordinates (0.162, 0.22); the coordinates of the mixing point are (0.28, 0.124), and the CIE chromaticity diagram coordinates corresponding to the color temperature are (0.384, 0.379);

[0115] The weight ratio of each component in the encapsulation layer of this embodiment is 70% of colloid, 28% of green phosphor, and 2% of yellow phosphor powder.

[0116] Embodiment 2

[0117] Take the 3000K color temperature spectrum dimming packaging structure as an example:

[0118] The first wavelength blue light chip is selected with a specification of 14*30mil, and its peak wavelength λA is 465nm. The peak wavelength of the long wavelength phosphor glue layer is 650nm, and the powder-to-glue ratio of the long wavelength phosphor glue layer is 4:1. The thickness of the long wavelength phosphor glue layer on the top surface of the first wavelength blue light chip is 200 microns, and the thickness on the side is 120 microns.

[0119] The second wavelength blue light chip specification is 14*30mil, and the wavelength λB is 452nm;

[0120] The specification of the ultraviolet or near-ultraviolet chip is 14*30mil, the wavelength λC is 410nm, the peak wavelength of the short-wavelength phosphor glue layer is 480nm, the powder-to-glue ratio of the short-wavelength phosphor glue layer is 2:1, and the thickness of the short-wavelength phosphor glue layer is 300 microns on the top of the ultraviolet or near-ultraviolet chip and 120 microns on the side;

[0121] The total number of chips in the entire spectrum dimming package structure is 40 to 50. According to the ratio, the number of long-wavelength packages is initially selected to be 22. The red dot coordinates of the long-wavelength packages on the CIE chromaticity diagram are (0.384, 0.131); the number of short-wavelength packages and the number of second chips are 5 and 18 respectively. On the CIE chromaticity diagram, the second chip and the short-wavelength package have corresponding coordinates (0.162, 0.21); the coordinates of the mixing point are (0.3121, 0.1453), and the CIE chromaticity diagram coordinates corresponding to the color temperature are (0.442, 0.402);

[0122] The weight ratio of each component in the encapsulation layer of this embodiment is 70% of colloid, 20% of green phosphor, and 10% of yellow phosphor powder.

[0123] Embodiment 3

[0124] Take the 5000K color temperature spectrum dimming packaging structure as an example, which is applied to ice fresh lamps:

[0125] The first wavelength blue light chip is selected with a specification of 14*30mil, its peak wavelength λA is 465nm, the peak wavelength of the long wavelength phosphor glue layer is 650nm, the powder-to-glue ratio of the long wavelength phosphor glue layer is 0.2:1, and the thickness of the long wavelength phosphor glue layer on the top surface of the first wavelength blue light chip is 200 microns, and the thickness on the side is 0 microns;

[0126] The second wavelength blue light chip specification is 14*30mil, and the wavelength λB is 452nm;

[0127] The specification of the ultraviolet or near-ultraviolet chip is 14*30mil, the wavelength λC is 410nm, the peak wavelength of the short-wavelength phosphor glue layer is 480nm, the powder-to-glue ratio of the short-wavelength phosphor glue layer is 5:1, and the thickness of the short-wavelength phosphor glue layer is 400 microns on the top of the ultraviolet or near-ultraviolet chip and 120 microns on the side;

[0128] The total number of chips designed for the entire spectrum dimming package structure is 30 to 40. According to the ratio, the number of long-wavelength packages is initially selected to be 10. The red dot coordinates of the long-wavelength packages on the CIE chromaticity diagram are (0.26, 0.1); the number of short-wavelength packages and the number of second chips are 9 and 18 respectively. On the CIE chromaticity diagram, the second chip and the short-wavelength package have corresponding coordinates (0.163, 0.246); the mixing point coordinates are (0.24, 0.0965), and the CIE chromaticity diagram coordinates corresponding to the color temperature are (0.345, 0.359);

[0129] The weight ratio of each component in the encapsulation layer of this embodiment is 73% of colloid, 22% of green phosphor, and 5% of yellow phosphor powder.

[0130] Embodiment 4

[0131] Take the 2800K color temperature spectrum dimming packaging structure as an example, which is applied to ice fresh lamps:

[0132] The first wavelength blue light chip is selected with a specification of 14*30mil, with a peak wavelength λA of 465nm, a peak wavelength of the long wavelength phosphor glue layer of 650nm, a powder-to-glue ratio of the long wavelength phosphor glue layer of 5:1, and a thickness of 400 microns on the top surface of the first wavelength blue light chip and 120 microns on the side surface;

[0133] The second wavelength blue light chip specification is 14*30mil, and the wavelength λB is 452nm;

[0134] The specification of the ultraviolet or near-ultraviolet chip is 14*30mil, the wavelength λC is 410nm, the peak wavelength of the short-wavelength phosphor glue layer is 480nm, the powder-to-glue ratio of the short-wavelength phosphor glue layer is 0.5:1, and the thickness of the short-wavelength phosphor glue layer is 100 microns on the top of the ultraviolet or near-ultraviolet chip and 0 microns on the side;

[0135] The total number of chips designed for the entire spectrum dimming package structure is 40 to 50. According to the ratio, the number of long-wavelength packages is initially selected to be 20. The red dot coordinates of the long-wavelength packages on the CIE chromaticity diagram are (0.483, 0.24); the number of short-wavelength packages and the number of second chips are 7 and 18 respectively. On the CIE chromaticity diagram, the second chip and the short-wavelength package have corresponding coordinates (0.161, 0.18); the coordinates of the mixing point are (0.3598, 0.1896), and the CIE chromaticity diagram coordinates corresponding to the color temperature are (0.483, 0.428);

[0136] The weight ratio of each component in the encapsulation layer of this embodiment is 70% of colloid, 18% of green phosphor, and 12% of yellow phosphor powder.

[0137] The spectral dimming packaging structures of the above four embodiments adopt COB packaging form and are compared with the traditional 1919COB packaging structure of 4000K. The test data are as follows (sample number 10 / piece):

[0138]

[0139] The spectrum diagram of the spectral dimming packaging structure of the above four embodiments using COB packaging is shown in Figures 11 to 14 From the above table and spectrum, we can conclude that:

[0140] The spectral dimming packaging structure of the present invention makes the chip in the packaging layer clearly identifiable, which prevents the short-wavelength fluorescence generated by the short-wavelength phosphor from exciting the long-wavelength phosphor again and being reabsorbed, so that the luminous efficiency of the light source can be improved by more than 7%, and the heat dissipation effect is good; the fluorescence band spectrum becomes wider, and the color rendering index is slightly improved; and the color temperature is changed by changing the ratio of the red light chip to the blue light chip in the light source, which not only avoids the accurate weighing of the phosphor by a high-precision balance under the conventional structure, but more importantly, the amount of powder used is greatly reduced.

Claims

1. A spectral dimming packaging structure containing a UV or near-UV chip, characterized in that: include At least one first chip, the first chip is a first wavelength blue light chip, a long wavelength phosphor glue layer is arranged on the surface of the first wavelength blue light chip to form a long wavelength package, the long wavelength phosphor glue layer is formed by mixing a colloid and a long wavelength phosphor with an emission wavelength of 600-1000nm; and the weight ratio of the long wavelength phosphor to the colloid in the long wavelength phosphor glue layer is 0.2-5:1; at least one second chip, wherein the second chip is a second wavelength blue light chip; At least one third chip, the third chip is a violet or near-ultraviolet chip, a short-wavelength phosphor glue layer is arranged on the surface of the violet or near-ultraviolet chip to form a short-wavelength package, the short-wavelength phosphor glue layer is formed by mixing a colloid with a short-wavelength phosphor having an emission wavelength of 450-500nm; and the weight ratio of the short-wavelength phosphor to the colloid in the short-wavelength phosphor glue layer is 0.2-5:1; An encapsulation layer, used to encapsulate the short-wavelength encapsulation bodies, the second chip and the long-wavelength encapsulation body as a whole, wherein the encapsulation layer contains any one or two of a green phosphor with an emission wavelength of 500-550nm and a yellow phosphor with an emission wavelength of 550-600nm, and does not contain a short-wavelength phosphor with an emission wavelength of 450-500nm and a long-wavelength phosphor with an emission wavelength of 600-1000nm; The number and wavelength of the short-wavelength package, the second chip and the long-wavelength package satisfy: (1) When the color temperature required by the spectral dimming package structure as a whole is higher than 4500K, the number of the long-wavelength package accounts for 5 to 30% of the total number of the short-wavelength package, the second chip and the long-wavelength package; When the color temperature required by the spectral dimming package structure as a whole is lower than or equal to 4500K, the number of the long-wavelength packages accounts for 30-80% of the total number of the short-wavelength packages, the second chip and the long-wavelength packages; (2) The ratio of the number of the short-wavelength package to the number of the second chip is 1:1 to 5; (3) The wavelength of the first chip is denoted as λA, λA=445~550nm; the wavelength of the second chip is denoted as λB, λB=420~465nm; the wavelength of the third chip is denoted as λC, λC=370-420nm; and 0≤λA-λB≤130nm.

2. The spectral dimming packaging structure containing ultraviolet or near-ultraviolet chips according to claim 1, characterized in that: The short-wavelength phosphor glue layer is arranged on the top surface and side surface of the ultraviolet or near-ultraviolet chip to form a CSP packaging structure, or is arranged on the top surface of the ultraviolet or near-ultraviolet chip to form a WLP packaging structure; the short-wavelength phosphor glue layer is arranged on the top surface of the ultraviolet or near-ultraviolet chip with a thickness of 20 to 400um, and on the side surface of the ultraviolet or near-ultraviolet chip with a thickness of 0 to 400um.

3. The spectral dimming packaging structure containing ultraviolet or near-ultraviolet chips according to claim 1 or 2, characterized in that: The weight ratio of the short-wavelength phosphor to the colloid in the short-wavelength phosphor glue layer is greater than 2-5:1; and the quantity ratio of the short-wavelength package to the second chip is 1:1-3.

4. The spectral dimming packaging structure containing ultraviolet or near-ultraviolet chips according to claim 1, characterized in that: The long-wavelength phosphor glue layer is arranged on the top surface and the side surface of the first wavelength blue light chip to form a CSP packaging structure, or is arranged on the top surface of the first wavelength blue light chip to form a WLP packaging structure; the long-wavelength phosphor glue layer is arranged on the top surface of the first wavelength blue light chip with a thickness of 20 to 400 um, and on the side surface of the first wavelength blue light chip with a thickness of 0 to 400 um.

5. The spectral dimming packaging structure containing ultraviolet or near-ultraviolet chips according to claim 1 or 4, characterized in that: The long-wavelength phosphor with an emission wavelength of 600-1000 nm is any one of red phosphor and near-infrared phosphor or a mixture of the two.

6. A method for manufacturing a spectral dimming packaging structure containing a UV or near-UV chip according to claim 1, characterized in that: The method comprises: Step S1: Chip or package production, The first chip uses a first wavelength blue light chip, and a long wavelength phosphor glue layer is formed on the surface of the first wavelength blue light chip to obtain a long wavelength package in the form of WLP or CSP packaging, wherein the long wavelength phosphor glue layer is formed by mixing a colloid and a long wavelength phosphor with an emission wavelength of 600-1000nm; the powder-to-glue ratio of the colloid to the long wavelength phosphor in the long wavelength phosphor glue layer is controlled to be 0.2-5:1; The second chip uses a second wavelength blue light chip; The third chip uses a violet or near-ultraviolet chip, and a short-wavelength phosphor glue layer is made on the surface of the violet or near-ultraviolet chip to obtain a short-wavelength package in the form of WLP or CSP packaging, wherein the short-wavelength phosphor glue layer is a mixture of colloid and short-wavelength phosphor with an emission wavelength of 450-500nm; the powder-to-glue ratio of the short-wavelength phosphor to the colloid in the short-wavelength phosphor glue layer is controlled to be 0.2-5:1; Step S2: Chip and package quantity ratio, According to the color temperature requirements of the final spectrum dimming package structure containing ultraviolet or near-ultraviolet chips, select the proportion of long-wavelength packages to the total number of chips: When the color temperature required by the spectrum dimming package structure as a whole is higher than 4500K, the number of the long-wavelength packages accounts for 5-30% of the total number of the short-wavelength packages, the second chip and the long-wavelength packages; When the color temperature required by the spectral dimming package structure as a whole is lower than or equal to 4500K, the number of the long-wavelength packages accounts for 30-80% of the total number of the short-wavelength packages, the second chip and the long-wavelength packages; The color point coordinates of the long wavelength package on the CIE chromaticity diagram after the selected quantity ratio are recorded as red points (X1; Y1); Then, according to the relative height of the peak wavelength λB of the second chip and 480nm in the spectrum, the number ratio of the short-wavelength package to the second chip is selected to be within 1:1 to 5; The color point coordinates of the short wavelength package and the second chip corresponding to each other on the CIE chromaticity diagram after the selected quantity ratio are recorded as the mixed blue point (X2; Y2); Step S3: Pre-control of color temperature, The short-wavelength package, the second chip and the long-wavelength package are respectively bonded to corresponding positions on the support or substrate; and they are illuminated to obtain the color point position corresponding to the CIE chromaticity diagram after illumination, which is recorded as the mixing point (X3; Y3), and it is ensured that 0.09≤Y3≤0.2, 0.22≤X3≤0.37; thereby pre-controlling the color temperature range; if it is not within the range, re-performing step S2; Step S4: Then, according to the color temperature requirements of the spectral dimming package structure containing the final ultraviolet or near-ultraviolet chip, the color point coordinates corresponding to the final color temperature on the Planckian locus of the CIE chromaticity diagram are found and recorded as the white point (X4; Y4); The specific coordinate value or coordinate range of the required green point (X5; Y5) is obtained through the known red point (X1; Y1), mixed blue point (X2; Y2), mixed point (X3; Y3), and white point (X4; Y4); Then, according to the coordinate value or coordinate range, a green phosphor with an emission wavelength of 500-550nm and a yellow phosphor with an emission wavelength of 550-600nm are selected in a suitable ratio, and then mixed into the colloid to form an encapsulated colloid. The short-wavelength package bodies, the second chip and the long-wavelength package body are integrally packaged on a support member or a substrate by using a packaging colloid to form a packaging layer; Then, the phosphor in the encapsulation layer is fully settled through a precipitation process, and then the temperature is raised to the curing temperature of the colloid for curing to obtain a finished product; Step S5: Check whether the luminous spectrum and color temperature of the finished product meet the design requirements. If the corresponding color point on the CIE chromaticity diagram is higher or lower than the Planckian locus, the amount of green phosphor and yellow phosphor in the external colloid should be reduced or increased accordingly. If the color temperature does not meet the requirements, directly adjust the ratio of the long wavelength package to the total number of the short wavelength package, the second chip and the long wavelength package and then repeat steps S3 to S5; If the luminescence spectrum does not meet the requirements, the number of the third chips is directly adjusted and steps S3 to S5 are repeated.

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