A kind of manufacturing method of fpc

A manufacturing method and small board technology, applied in printed circuit manufacturing, circuit board tool positioning, printed circuit, etc., can solve problems such as low punching accuracy, easy wrinkling of FPC, and defective products, so as to improve punching accuracy and prevent Wrinkle or warpage, yield improvement effect

Active Publication Date: 2022-04-29
四川上达电子有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the embodiments of the present invention is to provide a method for manufacturing FPC to solve the technical problems in the prior art that the FPC is easy to wrinkle or warp, resulting in low punching precision and poor products produced

Method used

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  • A kind of manufacturing method of fpc
  • A kind of manufacturing method of fpc
  • A kind of manufacturing method of fpc

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Embodiment Construction

[0040] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0041] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0042] It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other indicated orientations...

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Abstract

The invention provides a method for manufacturing an FPC, which includes: providing an FPC small board, and at least one FPC single piece is arranged on the FPC small board; performing a first punching shape treatment on the FPC small board; and cleaning the FPC small board ; Provide a supporting substrate, set the FPC small plate on the supporting substrate; carry out the second punching shape processing on the supporting substrate and the FPC small plate on it; inspect the FPC single piece on the supporting substrate; The support substrate is peeled off to obtain a single piece of FPC. Compared with the prior art, the present invention disposes the FPC small board on the supporting substrate before performing the second punching shape processing on the FPC small board, and the FPC small board is supported by the supporting substrate to prevent the FPC small board. Wrinkling or warping improves the punching accuracy, so that the FPC small plate can obtain a flat FPC single piece after the second punching shape treatment, which effectively improves the yield of the FPC single piece and reduces the occurrence of customer complaints. .

Description

technical field [0001] The invention belongs to the technical field of flexible circuit board production, and more specifically relates to a method for manufacturing an FPC. Background technique [0002] Flexible Printed Circuit (FPC), also known as flexible circuit board, flexible circuit board, is popular for its light weight, thin thickness, free bending and folding, etc. However, FPC is easy to produce Wrinkles or warpage, FPC wrinkles or warpage will reduce the precision of punching and eventually lead to defective products. Contents of the invention [0003] The purpose of the embodiment of the present invention is to provide a method for manufacturing FPC to solve the technical problems existing in the prior art that the FPC is easy to wrinkle or warp, resulting in low punching precision and defective products produced. [0004] In order to achieve the above object, the technical solution adopted in the present invention is to provide a method for making an FPC, co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0008H05K3/0044
Inventor 李秀芳邹飞李晓华
Owner 四川上达电子有限公司
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