Heat dissipation device and electronic equipment

Abstract

The present application provides a heat dissipation device and an electronic device. The heat dissipation device includes: a base plate; a cover plate assembly, the cover plate assembly includes a cover plate and a capillary structure, the base plate and the cover plate enclose a cavity, the cavity is in a negative pressure state, and the cavity includes an evaporation section and a condensation section that are relatively arranged; the capillary structure is located in the evaporation section, and the capillary structure is arranged close to the cover plate, the thermal resistance of the part of the cover plate assembly corresponding to the evaporation section is a first thermal resistance, and the thermal resistance of the part of the cover plate assembly corresponding to the condensation section is a second thermal resistance, and the first thermal resistance is less than the second thermal resistance; and a liquid wick, the liquid wick is located in the cavity, and is arranged between the capillary structure and the base plate, the liquid wick is used to store condensation medium, and the condensation medium fills part of the cavity. The heat dissipation device of the present application has a high heat dissipation efficiency.

Description

Technical Field

[0001] The present application relates to the field of electronics, and in particular to a heat dissipation device and an electronic device. Background Art

[0002] Vapor chambers are widely used in electronic devices to efficiently transfer heat to dissipate heat from the electronic devices. However, existing vapor chambers have low heat transfer effects and low heat dissipation efficiency for high-efficiency electronic devices. Summary of the invention

[0003] In view of the above problems, an embodiment of the present application provides a heat dissipation device with high heat dissipation efficiency.

[0004] The embodiment of the present application provides a heat dissipation device, which includes:

[0005] Base plate;

[0006] A cover plate assembly, the cover plate assembly comprising a cover plate and a capillary structure, the bottom plate and the cover plate enclose a cavity, the cavity is in a negative pressure state, the cavity comprises an evaporation section and a condensation section arranged opposite to each other; the capillary structure is located in the evaporation section, and the capillary structure is arranged close to the cover plate, the thermal resistance of a portion of the cover plate assembly corresponding to the evaporation section is a first thermal resistance, the thermal resistance of a portion of the cover plate assembly corresponding to the condensation section is a second thermal resistance, and the first thermal resistance is less than the second thermal resistance; and

[0007] The wick is located in the cavity and arranged between the capillary structure and the bottom plate. The wick is used to store condensation medium, and the condensation medium fills part of the cavity.

[0008] Based on the same inventive concept, the present application also provides an electronic device in an embodiment, which includes:

[0009] The heat dissipation device described in the embodiment of the present application; and

[0010] A heat source is arranged on a side of the bottom plate away from the cover plate and close to the evaporation section.

[0011] The heat dissipation device of the embodiment of the present application is provided with a capillary structure at the position of the cover plate corresponding to the evaporation section, thereby increasing the capillary pressure of the heat dissipation device and increasing the speed of the liquid condensation medium reflux in the condensation section, thereby increasing the heat dissipation efficiency of the heat dissipation device. In addition, the thermal resistance of the portion of the cover plate assembly corresponding to the evaporation section is smaller than the thermal resistance of the portion of the cover plate assembly corresponding to the condensation section as the second thermal resistance, which makes the heat transfer speed of the evaporation section faster, and the liquid condensation medium can evaporate faster in the evaporation section, further accelerating the heat dissipation speed of the heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0013] Figure 1 It is a schematic diagram of the structure of the heat dissipation device of an embodiment of the present application.

[0014] Figure 2 It is a schematic diagram of the cross-sectional structure of the heat dissipation device of an embodiment of the present application along the PP direction.

[0015] Figure 3 It is a schematic diagram of the cross-sectional structure of the heat dissipation device along the QQ direction according to an embodiment of the present application.

[0016] Figure 4 It is a schematic diagram of the cross-sectional structure of the heat dissipation device of an embodiment of the present application.

[0017] Figure 5 It is a structural schematic diagram of a capillary structure according to an embodiment of the present application.

[0018] Figure 6 It is a structural schematic diagram of a capillary structure of another embodiment of the present application.

[0019] Figure 7 It is a structural schematic diagram of a capillary structure of yet another embodiment of the present application.

[0020] Figure 8 It is a structural schematic diagram of a capillary structure of yet another embodiment of the present application.

[0021] Fig. 9 It is a structural schematic diagram of a capillary structure of yet another embodiment of the present application.

[0022] Fig.10 It is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application.

[0023] Fig.11 It is a schematic diagram of the exploded structure of an electronic device provided in an embodiment of the present application.

[0024] Description of reference numerals:

[0025] 100-Heat dissipation device

[0026] 10- Bottom plate

[0027] 11-First groove

[0028] 20-Cavity

[0029] 21-Evaporation section

[0030] 22-Flow section

[0031] 23-Condensation section

[0032] 30-Cover assembly

[0033] 31-Cover

[0034] 311-Second groove

[0035] 33-Capillary structure

[0036] 331-Pores

[0037] 332-convex strip

[0038] 333-capillary

[0039] 3301-ribbed group

[0040] 35-Support

[0041] 50-wick

[0042] 200-Electronic equipment

[0043] 210-Heat source DETAILED DESCRIPTION

[0044] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0045] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0046] The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0047] It should be noted that, for the convenience of explanation, in the embodiments of the present application, the same figure marks represent the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments.

[0048] See also Figures 1 to 4 The embodiment of the present application provides a heat dissipation device 100 including: a base plate 10, a cover plate assembly 30 and a liquid wick 50. The cover plate assembly 30 includes a cover plate 31 and a capillary structure 33. The bottom plate 10 and the cover plate 31 enclose a cavity 20. The cavity 20 is in a negative pressure state (i.e., a vacuum state, in other words, the cavity 20 is a vacuum cavity). The cavity 20 includes an evaporation section 21 and a condensation section 23 that are arranged opposite to each other. The capillary structure 33 is located in the evaporation section 21, and the capillary structure 33 is arranged close to the cover plate 31. The thermal resistance of the portion of the cover plate assembly 30 corresponding to the evaporation section 21 is a first thermal resistance, and the thermal resistance of the portion of the cover plate assembly 30 corresponding to the condensation section 23 is a second thermal resistance, and the first thermal resistance is less than the second thermal resistance. The wick 50 is located in the cavity 20 and is arranged between the capillary structure 33 and the bottom plate 10. The wick 50 is used to store a condensation medium and provide capillary pressure for the flow of the liquid from the condensation section 23 to the evaporation section 21. The condensation medium fills part of the cavity 20.

[0049] Optionally, along the stacking direction perpendicular to the cover plate 31 and the base plate 10, the thermal resistance of the portion of the cover plate assembly 30 corresponding to the evaporation section 21 is a first thermal resistance, and the thermal resistance of the portion of the cover plate assembly 30 corresponding to the condensation section 23 is a second thermal resistance, and the first thermal resistance is smaller than the second thermal resistance.

[0050] Optionally, the heat dissipation device 100 may be, but is not limited to, a structure capable of dissipating or transferring heat, such as a vapor chamber (VC) or a heat pipe.

[0051] Optionally, the condensing medium may be, but is not limited to, at least one of water, alcohol, etc. The condensing medium may undergo a phase change when absorbing or releasing heat, for example, from gas to liquid, from liquid to gas, etc. Optionally, the height filled by the condensing medium is greater than 0.8 of the height of the wick 50 (along the stacking direction of the bottom plate 10 and the cover plate 31) and less than 1.2 of the height of the wick 50 when the heat dissipation device 100 is placed horizontally (that is, when the bottom plate 10 and the cover plate 31 are in a horizontal position, and the bottom plate 10 is downward and the cover plate 31 is upward), and is less than 1.2 of the height of the wick 50. Specifically, it may be, but is not limited to, 0.8, 0.9, 1.1, 1.1, 1.2, etc. In a specific embodiment, the height filled by the condensing medium is equal to the height of the wick 50. In other words, the height filled by the condensing medium is when the heat dissipation device 100 is placed horizontally, the condensing medium just covers the wick 50. In other words, the condensing medium just fills the entire wick 50.

[0052] When in use, the side of the bottom plate 10 of the heat dissipation device 100 away from the cover plate 31 is placed close to the heat source at the position of the evaporation section 21. The condensation medium (such as water) in the evaporation section 21 evaporates and vaporizes to become a gaseous condensation medium (steam) after being heated. The gaseous condensation medium quickly flows from the evaporation section 21 to the condensation section 23 to fill the entire cavity 20 (the vacuum cavity between the liquid wick 50 and the cover plate 31). When the gaseous condensation medium contacts the relatively cold area of ​​the condensation section 23, it condenses and becomes a liquid condensation medium, and releases heat. The condensed liquid condensation medium flows back from the condensation section 23 to the evaporation section 21 under the capillary pressure of the liquid wick 50 and the capillary structure 33. This cycle is repeated so that the heat emitted by the heat source is transferred to various positions of the heat dissipation device 100 through the heat dissipation device 100 for heat dissipation.

[0053] The heat dissipation device 100 of the embodiment of the present application is provided with a capillary structure 33 at the position of the cover plate 31 corresponding to the evaporation section 21, so that the capillary pressure of the heat dissipation device 100 is increased, and the speed of the liquid condensation medium reflux in the condensation section 23 is increased, so that the heat dissipation efficiency of the heat dissipation device 100 is increased. In addition, the thermal resistance of the portion of the cover plate assembly 30 corresponding to the evaporation section 21 is smaller than the thermal resistance of the portion of the cover plate assembly 30 corresponding to the condensation section 23, which is the second thermal resistance, so that the heat transfer speed of the evaporation section 21 is faster, and the liquid condensation medium can evaporate faster in the evaporation section 21. In other words, the speed of heat conduction from the heat source to the evaporation section 21 of the heat dissipation device 100 is accelerated, and the heat dissipation speed of the heat dissipation device 100 is further accelerated.

[0054] Optionally, the thickness of the heat dissipation device 100 (i.e., the height along the stacking direction of the cover plate 31 and the base plate 10) can be 0.2 mm to 0.5 mm, specifically, it can be but not limited to 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, 0.5 mm, etc.

[0055] Optionally, the chamber 20 further includes a flow section 22, which is located between the evaporation section 21 and the condensation section 23 and connects the evaporation section 21 and the condensation section 23. When dissipating heat, the gaseous condensation medium flows from the evaporation section 21 to the condensation section 23 through the flow section 22 (e.g., Figure 4 As shown by arrow A, the liquid condensing medium flows from the condensing section 23 through the flow section 22 to the evaporation section 21 (as shown in FIG. Figure 4 (indicated by arrow B).

[0056] Optionally, the depth of the cavity 20 (i.e., the height along the stacking direction of the cover plate 31 and the base plate 10) can be 0.12 mm to 0.4 mm, specifically, it can be but not limited to 0.12 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, etc.

[0057] In some embodiments, the bottom plate 10 has a first groove 11. When the bottom plate 10 is assembled with the cover plate assembly 30, the first groove 11 forms at least part of the cavity 20. In other words, the first groove 11 is the cavity 20, or the first groove 11 is a part of the cavity 20. In other embodiments, the bottom plate 10 may also be a flat plate structure, and the cavity 20 is formed in the cover plate 31. Optionally, the bottom plate 10 may be made of copper, aluminum, iron or other materials with high thermal conductivity or high thermal conductivity coefficient to improve the heat dissipation speed of the heat dissipation device 100. Optionally, the first groove 11 may be formed by an etching process such as laser, which is not specifically limited in this application. Optionally, the depth of the first groove 11 (i.e., the height along the stacking direction of the cover plate 31 and the base plate 10) can be 0.04 mm to 0.4 mm, specifically, it can be but not limited to 0.04 mm, 0.08 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, etc.

[0058] In some embodiments, the cover plate 31 has a second groove 311. When the base plate 10 is assembled with the cover plate assembly 30, the second groove 311 forms at least part of the cavity 20. In other words, the second groove 311 is the cavity 20, or the second groove 311 is a part of the cavity 20. In other embodiments, the cavity 20 may also be formed in the base plate 10. Optionally, the cover plate 31 may be made of a material with high thermal conductivity or high thermal conductivity coefficient, such as copper, aluminum, and iron, to improve the heat dissipation speed of the heat dissipation device 100. Optionally, the second groove 311 may be formed by an etching process such as a laser, which is not specifically limited in this application. Optionally, the depth of the second groove 311 (i.e., the height along the stacking direction of the cover plate 31 and the base plate 10) can be 0.04 mm to 0.4 mm, specifically, it can be but not limited to 0.04 mm, 0.08 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, etc.

[0059] exist Figure 2 In the embodiment, the base plate 10 has a first groove 11, and the cover plate 31 has a second groove 311. When the base plate 10 and the cover plate assembly 30 are assembled, the first groove 11 and the second groove 311 form the cavity 20. In other words, the cavity 20 includes the first groove 11 and the second groove 311.

[0060] In some embodiments, along the stacking direction perpendicular to the direction of the cover plate 31 and the bottom plate 10, the area occupied by the cross section of the capillary structure 33 is 1 / 10 to 1 / 2 of the cross section area of ​​the cavity 20, so that the cavity 20 has sufficient steam during heat dissipation. When the area occupied by the cross section of the capillary structure 33 is less than 1 / 10 of the cross section area of ​​the cavity 20, the capillary pressure increased by the capillary structure 33 is small, and the improvement of heat dissipation efficiency is not obvious; when the area occupied by the cross section of the capillary structure 33 is greater than 1 / 2 of the cross section area of ​​the cavity 20, the amount of steam in the cavity 20 is small during heat dissipation (the vacuum cavity 20 is too small), thereby affecting the speed of evaporation and condensation of the condensing medium and the gas flow rate, and reducing the heat dissipation efficiency of the heat dissipation device 100.

[0061] See also Figures 5 to 9 In some embodiments, the capillary structure 33 is hydrophilic, and includes a plurality of capillary pores 331 or a plurality of capillary tubes 333. The capillary pores or capillary tubes provide capillary pressure for the condensing medium to flow from the condensing section 23 to the evaporating section 21. Optionally, the capillary pores or capillary tubes may be directly formed on the cover plate 31, or may be formed first and then installed on the cover plate 31, or may be formed first and then installed on the wick 50, and located between the cover plate 31 and the wick 50, which is not specifically limited in the present application.

[0062] Optionally, the cover plate 31 may be made of, but is not limited to, copper, aluminum, iron, or other materials with high thermal conductivity or high thermal conductivity coefficient.

[0063] See also Figure 3 , Figure 5 and Figure 6 In some embodiments, the capillary structure 33 includes a plurality of convex strips 332 spaced apart from each other on the cover plate 31, wherein the plurality of convex strips 332 extend in a first direction (eg Figure 5 The capillary 333 is formed in the groove between two adjacent convex strips 332, wherein the first direction forms a preset angle α (as shown in the arrow C) with the arrangement direction of the evaporation section 21 and the condensation section 23. Figure 3As shown), the preset angle ranges from 0° to 30°. Optionally, the preset angle may be, but is not limited to, 0°, 5°, 10°, 15°, 20°, 25°, 30°, etc. When the preset angle is 0°, the first direction is parallel to the arrangement direction of the evaporation section 21 and the condensation section 23. At this time, the condensation medium of the evaporation section 21 can flow faster through the grooves formed between the convex strips 332, so that the heat dissipation device 100 has a higher heat dissipation speed. When the preset angle is greater than 30°, the capillary structure 33 is only partially connected to the vacuum cavity between the wick 50 of the condensation section 23 and the cover plate 31, or even not connected, and the grooves are longer at the same distance, so that the flow of the condensation medium is slowed down, which is not conducive to improving the heat dissipation speed of the heat dissipation device 100.

[0064] Optionally, the capillary structure 33 and the cover plate 31 are an integral structure; it is understood that the capillary structure 33 and the cover plate 31 are formed in the same process; it is also understood that the capillary structure 33 is formed by the following steps: etching the plate to form the capillary structure 33 and the second groove 311 on the cover plate 31. In other words, the cover plate 31, the capillary structure 33 and the second groove 311 are formed in the same process. Optionally, the convex strip 332 can be formed of one or more materials selected from copper, aluminum, iron, etc.

[0065] See also Figure 3 and Figure 5 In some embodiments, the plurality of ridges 332 are arranged along the second direction (eg Figure 5 The convex strips 332 are arranged in a first direction, each of which extends from one end of the evaporation section 21 away from the condensation section 23 to one end of the evaporation section 21 close to the condensation section 23. In other words, each of which extends from one end of the evaporation section 21 to the other end opposite to the evaporation section 21 along the first direction. In other words, each row includes a convex strip 332 along the first direction. The second direction intersects the first direction, and when the preset angle is 0°, the second direction is perpendicular to the first direction.

[0066] Optionally, along the second direction, the width d of the convex strip 332 is 10 μm to 200 μm; specifically, it can be, but is not limited to, 10 μm, 20 μm, 30 μm, 50 μm, 70 μm, 90 μm, 100 μm, 120 μm, 150 μm, 180 μm, 200 μm, etc. When the width of the convex strip 332 is less than 10 μm, the processing technology is required to be high and the processing cost is high. When the width of the convex strip 332 is greater than 200 μm, the number of grooves that can be formed is small, the capillary structure 33 has limited effect on increasing the pressure of the capillary tube 333 of the heat dissipation device 100, and the improvement of the heat dissipation effect of the heat dissipation device 100 is limited.

[0067] Optionally, the spacing s between two adjacent convex strips 332 (i.e., the width of the groove along the second direction) is 10 μm to 100 μm; specifically, it can be, but not limited to, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, etc. When the spacing between two adjacent convex strips 332 is less than 10 μm, the processing technology is required to be high and the processing cost is high. In addition, although the pressure of the capillary 333 of the capillary structure 33 can be increased, the capillary pores are too small and the permeability is low, which is not conducive to the flow of the liquid condensation medium in the capillary structure and affects the heat dissipation effect. When the spacing between two adjacent convex strips 332 is greater than 100 μm, the capillary 333 pressure generated by the capillary 333 formed by the groove between the two adjacent convex strips 332 is too small (the capillary effect is small), and the improvement of the heat dissipation effect of the heat dissipation device 100 is small. The term "pitch" in this application refers to the vertical distance between two adjacent convex strips 332. Optionally, the pitch between two adjacent convex strips 332 (i.e., the width of the groove along the second direction) is 70 μm to 80 μm, specifically, but not limited to, 70 μm, 72 μm, 75 μm, 78 μm, 80 μm, etc. When the pitch between two adjacent convex strips 332 is within this range, the formed groove has a greater capillary 333 pressure, so that the heat dissipation device 100 has a better heat dissipation effect.

[0068] Optionally, please also see Figure 2 , the height h of the convex strip 332 is 0.08mm to 0.2mm; specifically, it can be but not limited to 0.08mm, 0.1mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm, 0.2mm, etc. When the height of the convex strip 332 is less than 0.08mm, the vacuum cavity formed between the wick 50 and the cover plate 31 is too small. When heat is dissipated, the amount of steam formed in the cavity 20 is small, thereby affecting the speed of evaporation and condensation of the condensing medium and the gas flow rate, and reducing the heat dissipation efficiency of the heat dissipation device 100. When the height of the convex strip 332 is greater than 0.2mm, the thickness of the heat dissipation device 100 is large, which is not conducive to the miniaturization of electronic equipment and affects the user experience. The term "height of the convex strip 332" in this application refers to the height along the stacking direction perpendicular to the base plate 10 and the cover plate 31.

[0069] See also Figure 6In other embodiments, the plurality of ridges 332 include a plurality of ridge groups 3301, the plurality of ridge groups 3301 are arranged along the second direction, each ridge 332 extends along the first direction, each ridge group 3301 includes at least two ridges 332, and the ridges 332 in each ridge group 3301 are arranged corresponding to the gap between two adjacent ridges 332 in the adjacent ridge group 3301, and partially overlap with the two adjacent ridges 332. Optionally, each ridge group 3301 may include but is not limited to two ridges 332, three ridges 332, four ridges 332, five ridges 332, etc., which are not specifically limited in the present application. Figure 6 In the embodiment of FIG. 3 , each ridge group 3301 includes two ridges 332. Figure 5 The capillary structure 33 of the embodiment of the present invention is a capillary structure 33. The grooves (capillaries 333) formed between the convex strip groups 3301 of the capillary structure 33 of the present embodiment are interconnected. The condensing medium can flow not only in the first direction but also in the second direction, so that the heat dissipation device 100 has a better heat dissipation effect. In addition, when the area of ​​the heat dissipation device 100 is large (or the area of ​​the evaporation section 21 is large) and the area of ​​the heat source is small, the heat dissipation device 100 is used. Figure 5 In the structure of the embodiment, the condensing medium basically flows along the first direction, and the area on both sides of the heat source of the evaporation section 21 is difficult to use. Figure 6 According to the structure of the embodiment, the condensing medium can also flow along the second direction, making full use of the area on both sides of the heat source of the evaporation section 21, so that the heat dissipation device 100 has a better heat dissipation effect.

[0070] Optionally, along the second direction, the width d of the convex strip 332 is 10 μm to 200 μm; specifically, it can be, but is not limited to, 10 μm, 20 μm, 30 μm, 50 μm, 70 μm, 90 μm, 100 μm, 120 μm, 150 μm, 180 μm, 200 μm, etc. When the width of the convex strip 332 is less than 10 μm, the processing technology is required to be high and the processing cost is high. When the width of the convex strip 332 is greater than 200 μm, the number of grooves that can be formed is small, the capillary structure 33 has limited effect on increasing the pressure of the capillary tube 333 of the heat dissipation device 100, and the improvement of the heat dissipation effect of the heat dissipation device 100 is limited.

[0071] Optionally, the spacing s between two adjacent convex strip groups 3301 (i.e., the width of the groove along the second direction) is 10 μm to 100 μm; specifically, it can be, but is not limited to, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, etc. When the spacing between two adjacent convex strip groups 3301 is less than 10 μm, the processing technology is required to be high and the processing cost is high. In addition, although the pressure of the capillary 333 of the capillary structure 33 can be increased, the capillary pores are too small and the permeability is low, which is not conducive to the flow of the liquid condensation medium in the capillary structure and affects the heat dissipation effect. When the spacing between two adjacent convex strip groups 3301 is greater than 100 μm, the capillary 333 pressure generated by the capillary 333 formed by the groove between the two adjacent convex strip groups 3301 is too small (the capillary effect is small), and the improvement of the heat dissipation effect of the heat dissipation device 100 is small. The term "pitch" in this application refers to the vertical distance between two adjacent convex stripe groups 3301. Optionally, the spacing between two adjacent convex stripe groups 3301 (i.e., the width of the groove along the second direction) is 70 μm to 80 μm, specifically, but not limited to, 70 μm, 72 μm, 75 μm, 78 μm, 80 μm, etc. When the spacing between two adjacent convex stripe groups 3301 is within this range, the formed groove has a greater capillary 333 pressure, so that the heat dissipation device 100 has a better heat dissipation effect.

[0072] like Figure 2 As shown, optionally, the height h of the convex strip 332 is 0.08 mm to 0.2 mm; specifically, it can be, but not limited to, 0.08 mm, 0.1 mm, 0.12 mm, 0.14 mm, 0.16 mm, 0.18 mm, 0.2 mm, etc. When the height of the convex strip 332 is less than 0.08 mm, the vacuum cavity formed between the wick 50 and the cover plate 31 is too small, and the amount of steam formed in the cavity 20 during heat dissipation is small, thereby affecting the speed of evaporation and condensation of the condensing medium and the gas flow rate, and reducing the heat dissipation efficiency of the heat dissipation device 100. When the height of the convex strip 332 is greater than 0.2 mm, the thickness of the heat dissipation device 100 is large, which is not conducive to the miniaturization of electronic equipment and affects the user experience. The term "height of the convex strip 332" in this application refers to the height along the stacking direction perpendicular to the base plate 10 and the cover plate 31.

[0073] Optionally, along the first direction, the length L of each convex strip 332 is 200 μm to 1000 μm; specifically, it can be, but is not limited to, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, 1000 μm, etc. When the convex strip 332 is greater than 1000 μm, each convex strip group 3301 may only be able to accommodate one convex strip 332, and it is impossible to form a staggered structure of the convex strips 332 in each convex strip group 3301, and the heat dissipation effect is not as good as that of the convex strip 332 in the convex strip group 3301. Figure 5 The structures of the embodiments are similar, compared to Figure 5 The structure of the embodiment does not significantly improve the heat dissipation effect. When the length of the ribs 332 is less than 200 μm, the interlaced length between the ribs 332 in the adjacent rib groups 3301 is too short, the capillary 333 pressure formed is relatively small, and the heat dissipation effect of the heat dissipation device 100 is not significantly improved. In other words, when the length of the ribs 332 is too small, the interlaced length of each rib 322 with the ribs of the adjacent rib group 3301 is relatively short, and the interlaced length with the ribs of the spaced rib group is relatively long. However, the distance between the spaced rib groups 3301 (for example, the rib group of the first row and the rib group of the third row) is relatively large, and the capillary pressure formed between them is relatively small, so that the heat dissipation effect of the heat dissipation device 100 is not significantly improved. Optionally, the length of each rib 332 may be the same or different, and this application does not make any specific restrictions.

[0074] Optionally, the spacing s' between two adjacent ridges 332 in the same ridge group 3301 is 1 / 3 to 1 / 2 of the length of the ridge 332; specifically, the spacing between two adjacent ridges 332 in the same ridge group 3301 may be, but is not limited to, 1 / 3, 0.35, 0.4, 0.45, 1 / 2, etc. of the length of the ridge 332. When the spacing between two adjacent ridges 332 in the same ridge group 3301 is too large, the staggered length of the ridges 332 in the adjacent ridge group 3301 is short, the pressure of the formed capillary 333 is small, and the improvement of the heat dissipation effect of the heat dissipation device 100 is not obvious; when the spacing between two adjacent ridges 332 in the same ridge group 3301 is too small, the flow of the condensing medium along the second direction is affected, and the improvement of the heat dissipation effect of the heat dissipation device 100 is small.

[0075] See also Figures 7 to 9 Optionally, the capillary structure 33 may also include one or more of a particle sintering structure, a foam structure, and a mesh structure.

[0076] See also Figure 7In some embodiments, the capillary structure 33 includes a particle sintering structure, the particle sintering structure includes a plurality of penetrating capillary pores 331, and the diameter of the capillary pores 331 is 10 μm to 100 μm; specifically, it can be, but not limited to, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, etc. When the diameter of the capillary pore 331 is less than 10 μm, although the capillary 333 pressure of the capillary structure 33 can be increased, the capillary pore is too small and the permeability is low, which is not conducive to the flow of the liquid condensation medium in the capillary structure, affecting the heat dissipation effect; when the diameter of the capillary pore 331 is greater than 100 μm, the capillary effect is small, the capillary 333 pressure generated by the capillary pore 331 is too small, and the improvement of the heat dissipation effect of the heat dissipation device 100 is small. The term “particle sintering structure” in the present application refers to a structure having a plurality of through-going capillary pores 331 formed by sintering particles.

[0077] Optionally, the raw material components of the particle sintering structure include particles, and the diameter of the particles is 5μm to 50μm; specifically, it can be but not limited to 5μm, 10μm, 15μm, 20μm, 25μm, 30μm, 35μm, 40μm, 45μm, 50μm, etc. When the diameter of the particles is less than 5μm, although the pressure of the capillary 333 of the capillary structure 33 can be increased, the capillary pores 331 of the formed capillary structure 33 are too small, and the permeability is low, which is not conducive to the flow of the liquid condensation medium in the capillary structure, affecting the heat dissipation effect; when the diameter of the particles is greater than 100μm, the capillary pores 331 of the formed capillary structure 33 are too large, the number of the capillary pores 331 is small, the capillary effect is small, the capillary pores 331 The pressure of the capillary 333 is too small, and the improvement of the heat dissipation effect of the heat dissipation device 100 is small. Optionally, the particles can include one or more materials selected from copper, aluminum, iron, etc.

[0078] See also Figure 8In some embodiments, the capillary structure 33 includes a foam structure, the foam structure includes a plurality of through capillary pores 331, and the diameter of the capillary pores 331 is 10 μm to 100 μm; specifically, it can be, but not limited to, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, etc. When the diameter of the capillary pores 331 is less than 10 μm, although the capillary 333 pressure of the capillary structure 33 can be increased, the capillary pores are too small and the permeability is low, which is not conducive to the flow of the liquid condensation medium in the capillary structure, affecting the heat dissipation effect; when the diameter of the capillary pores 331 is greater than 100 μm, the capillary effect is small, the capillary 333 pressure generated by the capillary pores 331 is too small, and the improvement of the heat dissipation effect of the heat dissipation device 100 is small. Optionally, the foam structure can be, but not limited to, foam copper, foam aluminum, foam iron, etc.

[0079] See also Fig. 9 In some embodiments, the capillary structure 33 includes a mesh structure, the mesh structure includes a plurality of capillary holes 331, and the mesh number of the mesh structure is 200 to 300 meshes; specifically, it can be, but not limited to, 200 meshes, 210 meshes, 220 meshes, 230 meshes, 240 meshes, 250 meshes, 260 meshes, 270 meshes, 280 meshes, 290 meshes, 300 meshes, etc. When the mesh number is greater than 300 meshes, the capillary structure 33 has a larger capillary pressure head, and the diameter of the wire (such as copper wire, aluminum wire, iron wire, etc.) used to weave the mesh structure is too small (for example, 0.02 mm, or even smaller), and the wire is easy to break when weaving the wire, and the processing is difficult. When the mesh number is less than 200 meshes, the capillary effect is small, and the capillary 333 pressure generated by the capillary hole 331 is too small, which has little effect on improving the heat dissipation effect of the heat dissipation device 100. Optionally, the mesh structure may be, but is not limited to, a copper mesh, an aluminum mesh, an iron mesh, or the like.

[0080] In some embodiments, the capillary structure 33 further includes a nanoscale microstructure (not shown), which is used to improve the hydrophilicity of the capillary structure 33, so that the liquid condensation medium can flow on the capillary structure 33 faster and evaporate into a gaseous condensation medium, and the gaseous condensation medium fills the vacuum part of the entire cavity 20 faster. When the capillary structure 33 includes a plurality of ridges 332, the nanoscale microstructure is arranged on the surface of at least one of the ridges 332 and the grooves 333; in other words, the nanoscale microstructure can be arranged on the surface of the ridges 332, the surface of the grooves 333, or the surfaces of the ridges 332 and the grooves 333. When the capillary structure 33 is a mesh structure, the nanoscale microstructure is arranged on the surface of the mesh structure. The term "nanoscale microstructure" refers to a structure whose surface structure size is nanometer-scale.

[0081] Optionally, the nanoscale microstructure can be formed by the following steps: placing the capillary structure 33 at 280° C. to 350° C. to form nanoscale metal oxide on the surface of the capillary structure 33, thereby improving the hydrophilicity of the capillary structure 33. Optionally, the nanoscale microstructure can also be formed by the following steps: electroplating a layer of metal such as copper, aluminum, iron, etc. on the surface of the capillary structure 33 to form the nanoscale microstructure.

[0082] Optionally, when the capillary structure 33 includes a convex strip 332, or the capillary structure 33 is one or more of a microparticle sintering structure or a mesh structure, the capillary structure 33 also plays a role in supporting the cavity 20 and preventing the cover plate 31, or the bottom plate 10, or the cover plate 31 and the bottom plate 10 on both sides of the cavity 20 from sinking.

[0083] Optionally, the capillary structure 33 may be any one structure or a combination of multiple structures in the above embodiments, and the specific combination is not specifically limited in this application.

[0084] Please see again Figure 2 In some embodiments, the cover plate assembly 30 further includes a plurality of support members 35, the plurality of support members 35 are located in the cavity 20, the plurality of support members 35 are arranged adjacent to the capillary structure 33 and are arranged in an array on the cover plate 31, one end of the support member 35 away from the cover plate 31 abuts against the wick 50 or the bottom plate 10, and the gaps between the plurality of support members 35 are connected to the capillary structure 33. In other words, the plurality of support members 35 are arranged in an array in the flow section 22 and the condensation section 23. The support members 35 are used to prevent the cover plate 31, or the bottom plate 10, or the cover plate 31 and the bottom plate 10 from being sunken when the heat dissipation device 100 is evacuated, so as to avoid the vacuum space in the cavity 20 from being reduced, and the amount of the gaseous condensation medium is small during heat dissipation, which affects the heat dissipation efficiency of the heat dissipation device 100. Optionally, when the bottom plate 10 is covered by the absorbent core 50 , one end of the support member 35 away from the cover plate 31 abuts against the absorbent core 50 , and for the bottom plate 10 not covered by the absorbent core 50 , one end of the support member 35 away from the cover plate 31 abuts against the bottom plate 10 .

[0085] In the related designs, in order to prevent the cover plate 31, or the bottom plate 10, or the cover plate 31 and the bottom plate 10 of the heat dissipation device 100 from being sunken and compressing the vacuum space in the cavity 20, support members 35 are provided at the positions of the cover plate 31 corresponding to the evaporation section 21, the flow section 22 and the condensation section 23 of the cavity 20. The heat dissipation device 100 of the present application is provided with a capillary structure 33 at the position of the cover plate 31 corresponding to the evaporation section 21, and a support member 35 is provided at the position of the cover plate 31 corresponding to the flow section 22 and the condensation section 23, so that the first thermal resistance of the part of the cover plate assembly 30 corresponding to the evaporation section 21 is less than the second thermal resistance of the part of the cover plate assembly 30 corresponding to the flow section 22 and the condensation section 23. In other words, the thermal resistance of the part of the cover plate assembly 30 corresponding to the evaporation section 21 of the present application is less than the thermal resistance of the evaporation section 21 using the support member 35 in the related designs, so that the evaporation speed of the liquid condensation medium of the evaporation section 21 is faster, and the heat can be transferred to the entire heat dissipation device 100 faster for heat dissipation, thereby having a better heat dissipation effect. In other words, compared with the support member 35 of the related design, the capillary structure 33 has more heat dissipation solid material, faster heat dissipation, and better heat dissipation effect. In addition, the flow section 22 and the condensation section 23 are not provided with the capillary structure 33, which has little effect on the flow pressure drop of the steam in the condensation section 23, so that the pressure of the capillary 333 of the entire heat dissipation device 100 can be greatly improved. Furthermore, the capillary structure 33 is arranged at the position of the cover plate 31 corresponding to the evaporation section 21, and the capillary structure 33 and the support member 35 are arranged at intervals along the surface of the cover plate 31, so that the heat dissipation effect of the heat dissipation device 100 can be improved without increasing the thickness of the cover plate 31, which is conducive to the miniaturization and lightness of the heat dissipation device 100, and thus is conducive to the miniaturization and lightness of the electronic device using the heat dissipation device 100. In addition, when the capillary structure 33 is formed by the grooves between the convex strips 332, the convex strips 332 can be completed in the same process as the support member 35 (obtained by etching), without adding additional processing technology, and does not increase the cost of the heat dissipation device 100.

[0086] Optionally, along the stacking direction of the cover plate 31 and the bottom plate 10, the height h' of the support member 35 is 0.08 mm to 0.2 mm; specifically, it can be, but not limited to, 0.08 mm, 0.1 mm, 0.12 mm, 0.14 mm, 0.16 mm, 0.18 mm, 0.2 mm, etc. When the height of the support member 35 is less than 0.08 mm, the vacuum cavity formed between the wick 50 and the cover plate 31 is too small, and the amount of steam formed in the cavity 20 during heat dissipation is small, thereby affecting the speed of evaporation and condensation of the condensing medium and the gas flow rate, and reducing the heat dissipation efficiency of the heat dissipation device 100. When the height of the support member 35 is greater than 0.2 mm, the thickness of the heat dissipation device 100 is relatively large, which is not conducive to the miniaturization of electronic equipment and affects the user experience.

[0087] Optionally, along the stacking direction perpendicular to the direction of the cover plate 31 and the bottom plate 10, the equivalent circular diameter of the cross section of the support member 35 is 0.4 mm to 1 mm; specifically, it can be, but not limited to, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, etc. When the equivalent circular diameter of the cross section of the support member 35 is too small, it is difficult to process. When the equivalent circular diameter of the cross section of the support member 35 is too large, the vacuum cavity formed between the wick 50 and the cover plate 31 is too small. When heat is dissipated, the amount of steam formed in the cavity 20 is small, thereby affecting the speed of evaporation and condensation of the condensing medium and the gas flow rate, and reducing the heat dissipation efficiency of the heat dissipation device 100. The term "equivalent circular diameter" in this application refers to the diameter of a circle with the same area as the cross section of an irregular geometric figure.

[0088] Optionally, the spacing between two adjacent support members 35 is 1 mm to 3 mm; specifically, it can be but is not limited to 1 mm, 1.2 mm, 1.5 mm, 1.7 mm, 2 mm, 2.5 mm, 3 mm, etc.

[0089] Optionally, the height of the support member 35 and the thickness of the capillary structure 33 may be the same or different, and this application does not make specific limitations. When the height of the support member 35 and the thickness of the capillary structure 33 are equal, the support member 35 and the capillary structure 33 can better support the cover plate 31 and the bottom plate 10 on both sides of the cavity 20, and better prevent the cover plate 31 and the bottom plate 10 on both sides of the cavity 20 from being sunken.

[0090] In some embodiments, the wick 50 is hydrophilic, and the wick 50 extends from the evaporation section 21 to the condensation section 23. Along the stacking direction of the cover plate 31 and the bottom plate 10, the thickness of the wick 50 is 0.04 mm to 0.2 mm; specifically, it can be, but not limited to, 0.04 mm, 0.06 mm, 0.08 mm, 0.1 mm, 0.12 mm, 0.14 mm, 0.16 mm, 0.18 mm, 0.2 mm, etc. If the thickness of the wick 50 is too small, the capillary effect is small and the heat dissipation effect is not good. If the thickness of the wick 50 is too large, the thickness of the heat dissipation device 100 is increased, which is not conducive to the miniaturization of the electronic device and affects the user experience. In other embodiments, the wick 50 covers a portion of the cavity 20 corresponding to the bottom plate 10.

[0091] Optionally, the liquid absorbent core 50 may be one or more of a particle sintering structure, a foam structure, a mesh structure, etc. For detailed descriptions of the particle sintering structure, the foam structure, and the mesh structure, please refer to the description of the corresponding features of the above embodiments, which will not be repeated here.

[0092] In some embodiments, the wick 50 further includes a nanoscale microstructure, which is used to improve the hydrophilicity of the wick 50 so that the liquid condensation medium can better flow back from the condensation section 23 to the evaporation section 21. When the wick 50 includes a plurality of ridges 332, the nanoscale microstructure is disposed on the surface of at least one of the ridges 332 and the grooves 333; in other words, the nanoscale microstructure can be disposed on the surface of the ridges 332, the surface of the grooves 333, or the surfaces of the ridges 332 and the grooves 333. When the wick 50 is a mesh structure, the nanoscale microstructure is disposed on the surface of the mesh structure.

[0093] Optionally, the nanoscale microstructure can be formed by the following steps: placing the wick 50 at 280° C. to 350° C. to form nanoscale metal oxide on the surface of the wick 50, thereby improving the hydrophilicity of the wick 50. Optionally, the nanoscale microstructure can also be formed by the following steps: electroplating a layer of metal such as copper, aluminum, iron, etc. on the surface of the wick 50 to form the nanoscale microstructure.

[0094] See also Fig.10 and Fig.11 The embodiment of the present application also provides an electronic device 200, which includes: the heat dissipation device 100 described in the embodiment of the present application; and a heat source 210, which is arranged on a side of the base plate 10 away from the cover plate 31 and close to the evaporation section 21.

[0095] The electronic device 200 in the embodiment of the present application may be, but is not limited to, a mobile phone, a tablet computer, a smart watch, a smart bracelet, a desktop computer, a laptop computer, an e-reader, a game console, a display, or the like.

[0096] Optionally, the heat source 210 may be, but is not limited to, a processor, a battery, or other high-power-consuming component of an electronic device. Optionally, the processor includes one or more general-purpose processors, wherein the general-purpose processor may be any type of device capable of processing electronic instructions, including a central processing unit (CPU), a microprocessor, a microcontroller, a main processor, a controller, and an ASIC, etc. The processor is used to execute various types of digital storage instructions, such as software or firmware programs stored in a memory, which enables a computing device to provide a wide variety of services.

[0097] Optionally, the electronic device 200 further includes a display component 230 and a shell component 250, wherein the display component 230 is used for display, and the shell component 250 is used to support and protect the heat source 210 and the display component 230, the display component 230 and the shell component 250 enclose a housing space 201, and the heat source 210 and the heat dissipation device 100 are arranged in the housing space 201.

[0098] Optionally, the display component 230 may be, but is not limited to, one or more of a liquid crystal display component, a light emitting diode display component (LED display component), a micro light emitting diode display component (Micro LED display component), a sub-millimeter light emitting diode display component (Mini LED display component), an organic light emitting diode display component (OLED display component), etc.

[0099] References to "embodiments" and "implementations" herein mean that a particular feature, structure, or characteristic described in conjunction with an embodiment may be included in at least one embodiment of the present application. The appearance of the phrases in various locations in the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments that are mutually exclusive of other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0100] Finally, it should be noted that the above implementation modes are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the above preferred implementation modes, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A heat dissipation device, characterized in that: include: Base plate; A cover plate assembly, wherein the cover plate assembly comprises a cover plate and a capillary structure, wherein the bottom plate and the cover plate enclose a cavity, wherein the cavity is in a negative pressure state, and wherein the cavity comprises an evaporation section and a condensation section which are arranged opposite to each other; wherein the capillary structure is located in the evaporation section, and wherein the capillary structure is arranged close to the cover plate, wherein the thermal resistance of the portion of the cover plate assembly corresponding to the evaporation section is a first thermal resistance, and the thermal resistance of the portion of the cover plate assembly corresponding to the condensation section is a second thermal resistance, and wherein the first thermal resistance is smaller than the second thermal resistance; wherein the capillary structure comprises a plurality of capillary holes or a plurality of capillary tubes, wherein the capillary holes or capillary tubes provide capillary pressure for the condensation medium to flow from the condensation section to the evaporation section; wherein when the capillary structure comprises the plurality of capillaries, the capillary structure comprises a plurality of convex strips which are arranged at intervals on the cover plate, wherein the plurality of convex strips extend along a first direction, and wherein the grooves between two adjacent convex strips form the capillary tubes; as well as A liquid absorbent core, the liquid absorbent core is located in the cavity and is arranged between the capillary structure and the bottom plate, the liquid absorbent core is used to store the condensation medium, and the condensation medium fills part of the cavity; The cover plate assembly also includes a plurality of support members, which are located in the cavity, are arranged adjacent to the capillary structure and are arranged in an array on the cover plate, one end of the support member away from the cover plate abuts against the wick or the bottom plate, and the gaps between the plurality of support members are connected to the capillary structure.

2. The heat dissipation device according to claim 1, characterized in that: The first direction forms a preset angle with the arrangement direction of the evaporation section and the condensation section, and the preset angle ranges from 0° to 30°.

3. The heat dissipation device according to claim 1, characterized in that: The plurality of convex strips are arranged along the second direction, and each of the convex strips extends from an end of the evaporation section away from the condensation section to an end of the evaporation section close to the condensation section; or The plurality of ridges include a plurality of ridge groups, the plurality of ridge groups are arranged along the second direction, each of the ridge groups includes at least two ridges, and the ridges in each of the ridge groups are arranged corresponding to the gap between two adjacent ridges in the adjacent ridge group and partially overlap with the two adjacent ridges; The second direction intersects with the first direction.

4. The heat dissipation device according to claim 3, characterized in that: When the plurality of convex strips are arranged along the second direction, each of the convex strips extends from an end of the evaporation section away from the condensation section to an end of the evaporation section close to the condensation section, along the second direction, the width of the convex strips is 10 μm to 200 μm, and the spacing between two adjacent convex strips is 10 μm to 100 μm; the height of the convex strips is 0.08 mm to 0.2 mm; When the multiple ridges include multiple ridge groups, the multiple ridge groups are arranged along the second direction, each of the ridge groups includes at least two ridges, and the ridges in each ridge group are arranged corresponding to the gap between two adjacent ridges in the adjacent ridge group, and partially overlap with the two adjacent ridges, along the second direction, the width of the ridge is 10μm to 200μm, and the spacing between two adjacent ridge groups is 10μm to 100μm; the height of the ridge is 0.08mm to 0.2mm; along the first direction, the length of each ridge is 200μm to 1000μm, and the spacing between two adjacent ridges in the same ridge group is 1 / 3 to 1 / 2 of the length of the ridge.

5. The heat dissipation device according to claim 1, characterized in that: The capillary structure comprises a particle sintering structure, the particle sintering structure comprises a plurality of penetrating capillaries, the diameter of the capillary pores is 10 μm to 100 μm, and the raw material component of the particle sintering structure comprises particles, the diameter of the particles is 5 μm to 50 μm; or, The capillary structure includes a foam structure, and the foam structure includes a plurality of penetrating capillary pores, and the diameter of the capillary pores is 10 μm to 100 μm.

6. The heat dissipation device according to claim 1, characterized in that: The capillary structure comprises a mesh structure, the mesh structure comprises a plurality of the capillary pores, and the mesh number of the mesh structure is 200 to 300.

7. The heat dissipation device according to claim 1 or 4, characterized in that: The capillary structure also includes a nanoscale microstructure, which is used to improve the hydrophilicity of the capillary structure; when the capillary structure includes a plurality of convex strips, the nanoscale microstructure is arranged on the surface of at least one of the convex strips and the grooves; when the capillary structure is a mesh structure, the nanoscale microstructure is arranged on the surface of the mesh structure.

8. The heat dissipation device according to any one of claims 1 to 6, characterized in that: Along the stacking direction perpendicular to the direction of the cover plate and the bottom plate, the area occupied by the cross section of the capillary structure is 1 / 10 to 1 / 2 of the cross section area of ​​the cavity.

9. The heat dissipation device according to any one of claims 1 to 6, characterized in that: The liquid absorbent core is one or more of a particle sintering structure, a foam structure, and a mesh structure; the liquid absorbent core extends from the evaporation section to the condensation section, and along the stacking direction of the cover plate and the bottom plate, the thickness of the liquid absorbent core is 0.04 mm to 0.2 mm.

10. The heat dissipation device according to claim 1, characterized in that: Along the stacking direction of the cover plate and the base plate, the height of the support member is 0.08mm to 0.2mm; along the stacking direction perpendicular to the cover plate and the base plate, the equivalent circular diameter of the cross section of the support member is 0.4mm to 1mm; the spacing between two adjacent support members is 1mm to 3mm.

11. An electronic device, characterized in that: include: The heat dissipation device according to any one of claims 1 to 10; and A heat source is arranged on a side of the bottom plate away from the cover plate and close to the evaporation section.

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