Piezoelectric heat dissipation unit, heat dissipation system and piezoelectric heat dissipation fan

Abstract

The invention relates to the technical field of electronic equipment, and discloses a piezoelectric heat dissipation unit, a heat dissipation system and a piezoelectric heat dissipation fan, and the piezoelectric heat dissipation unit comprises a piezoelectric element, a vibrating diaphragm, a supporting frame, a jet flow plate, an air outlet plate and a connecting assembly. The supporting frame is provided with a cavity, and the two sides, in the first direction, of the cavity are open. The vibrating diaphragm and the jet flow plate cover the two sides of the cavity in the first direction respectively and are connected with the supporting frame, jet flow holes are formed in the jet flow plate, the piezoelectric element is attached to the side, away from the cavity in the first direction, of the vibrating diaphragm, and the air outlet plates are arranged on the side, away from the cavity in the first direction, of the jet flow plate at intervals. The edge of the air outlet plate is connected with the edge of the jet flow plate through a connecting assembly, the connecting assembly is provided with an air inlet channel, the air inlet channel is communicated with the jet flow hole, and the air outlet plate is provided with an air outlet hole communicated with the jet flow hole. The gas flow channel is reasonable in design, high in heat dissipation efficiency and suitable for heat dissipation of light and thin electronic products.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic equipment, and in particular to a piezoelectric heat dissipation device, a heat dissipation system and a piezoelectric heat dissipation fan. Background Art

[0002] With the rapid development of science and technology, electronic products are constantly moving towards high performance, miniaturization and high integration. However, this trend also makes the cooling system of electronic products face greater challenges, because high performance usually brings greater heat generation. In addition, due to the limitations of its mechanical structure, traditional cooling fans are difficult to achieve miniaturization and thinness, which is also contrary to the development trend of electronic products to be thin and light. At present, the commonly used heat dissipation devices and heat dissipation systems have become unable to cope with a series of challenges such as the growing demand for heat dissipation and the miniaturization and thinness of products. Summary of the invention

[0003] The purpose of the present invention is to design a piezoelectric heat dissipation unit, a heat dissipation system and a piezoelectric heat dissipation fan that can achieve miniaturization and lightness.

[0004] In order to achieve the above-mentioned object, the present invention provides a piezoelectric heat dissipation unit, comprising: a piezoelectric element, a diaphragm, a support frame, a jet plate, an air outlet plate and a connecting assembly;

[0005] The support frame has a chamber, and both sides of the chamber are open along the first direction; the diaphragm and the jet plate are respectively covered on both sides of the chamber along the first direction and are connected to the support frame, the jet plate is provided with a jet hole, the piezoelectric element is attached to the side of the diaphragm away from the chamber along the first direction, the air outlet plate is spaced apart from the side of the jet plate away from the chamber along the first direction, and the edge of the air outlet plate is connected to the edge of the jet plate through the connecting component, the connecting component is provided with an air inlet channel, so the air inlet channel is connected with the jet hole, and the air outlet plate is provided with an air outlet hole connected with the jet hole.

[0006] Further, the spacing dimension between the diaphragm and the jet plate in the first direction is H1 mm, wherein 0.02 m ≤ H1 ≤ 0.5 mm; and / or,

[0007] The spacing dimension between the jet plate and the air outlet plate in the first direction is H2 mm, wherein 0.1 mm≤H2≤2 mm.

[0008] Furthermore, the jet plate is provided with a plurality of jet holes, wherein the projection area of ​​the jet plate in the first direction is S1mm 2 The projection area of ​​the jet hole in the first direction is S2mm 2, satisfying 0.1%≤S2 / S1≤10%; and / or,

[0009] The outlet plate is provided with a plurality of outlet holes, wherein the projection area of ​​the outlet plate in the first direction is S3 mm 2 The projection area of ​​the air outlet in the first direction is S4mm 2 , satisfying 1%≤S4 / S3≤20%.

[0010] The present invention also provides a heat dissipation system, comprising the above-mentioned piezoelectric heat dissipation unit.

[0011] Furthermore, it includes a heat-conducting component, which includes a heat-conducting part and a heating element. The heat-conducting part is provided with a heat-conducting channel running through the heat-conducting part. The heat-conducting part is connected to the piezoelectric heat dissipation unit and the heat-conducting channel is connected to the air inlet channel. The heating element is attached to the outer wall of the heat-conducting part.

[0012] Furthermore, it also includes an air guide plate and a support member, the piezoelectric heat dissipation unit, the support member and the air guide plate are connected in sequence along the first direction, and the air outlet plate, the support member and the air guide plate are enclosed to form an air outlet channel, and the support member is provided with an exhaust port connected to the air outlet channel, and the exhaust port and the air inlet channel are staggered in the second direction, wherein the second direction is perpendicular to the first direction.

[0013] Further, it includes two heat-conducting components, the connecting component is provided with two air inlet channels, the two air inlet channels are respectively arranged on both sides of the connecting component in the second direction, the two heat-conducting components are respectively connected to both sides of the piezoelectric heat dissipation unit in the second direction, and the two heat-conducting channels are respectively connected to the two air inlet channels in a one-to-one correspondence;

[0014] The second direction is perpendicular to the first direction.

[0015] Furthermore, the heat conduction component includes a plurality of heat dissipation fins, which are arranged in the heat conduction channel at intervals along the second direction, and flow channels are provided between the heat dissipation fins and the inner peripheral wall of the heat conduction channel or on the heat dissipation fins.

[0016] Furthermore, it also includes a heating element and a supporting member, the piezoelectric heat dissipation unit, the supporting member and the heating element are connected in sequence along the first direction, and the air outlet plate, the supporting member and the heating element are enclosed to form an air outlet channel, and the supporting member is provided with an exhaust port connected to the air outlet channel, and the exhaust port and the air inlet channel are staggered in the second direction, wherein the second direction is perpendicular to the first direction.

[0017] The present invention also provides a piezoelectric cooling fan, comprising a shell body and the above-mentioned piezoelectric cooling unit, the shell body is provided with an opening on one side along the first direction, the piezoelectric cooling unit is arranged in the shell body, and the air outlet plate cover is arranged on the opening, and the shell body is also provided with an air inlet connected to the air inlet channel.

[0018] Compared with the prior art, the piezoelectric heat dissipation unit, heat dissipation system and piezoelectric heat dissipation fan of the embodiment of the present invention have the following beneficial effects:

[0019] The piezoelectric heat dissipation unit, heat dissipation system and piezoelectric heat dissipation fan of the embodiments of the present invention have an air inlet channel arranged between the jet plate and the air outlet plate, located on the side of the piezoelectric heat dissipation unit. When installing and using the piezoelectric heat dissipation unit, only the horizontal air inlet space needs to be reserved, which can reduce the demand for the vertical space size and is suitable for dissipating heat for lighter and thinner electronic products. In addition, the air inlet channel is closer to the jet hole and the air outlet. The gas enters from the air inlet channel and is discharged from the air outlet. During the whole process, the flow path passed is shorter, the energy loss during the gas flow is smaller, and the heat dissipation efficiency is higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic cross-sectional structure diagram of a piezoelectric heat dissipation unit according to an embodiment of the present invention;

[0021] Figure 2 is a schematic cross-sectional structure diagram of a piezoelectric heat dissipation unit in an embodiment of the present invention in which a diaphragm is bent downward;

[0022] Figure 3 is a schematic cross-sectional structure diagram of a piezoelectric heat dissipation unit in which a diaphragm bends upward in an embodiment of the present invention;

[0023] Figure 4 is a schematic diagram of the size identification structure of the piezoelectric heat dissipation unit of an embodiment of the present invention;

[0024] Figure 5 is a schematic cross-sectional structural diagram of a heat dissipation system according to a first embodiment of the present invention;

[0025] Figure 6 is a schematic cross-sectional structural diagram of a heat dissipation system according to a second embodiment of the present invention;

[0026] Figure 7 is a schematic cross-sectional structural diagram of a heat dissipation system according to a third embodiment of the present invention;

[0027] Figure 8 is a schematic cross-sectional structural diagram of a heat dissipation system according to a fourth embodiment of the present invention;

[0028] Fig. 9 is a schematic cross-sectional structural diagram of a heat dissipation system according to a fifth embodiment of the present invention;

[0029] Fig.10 is a schematic cross-sectional structural diagram of a heat dissipation system according to a sixth embodiment of the present invention;

[0030] Fig.11 is a schematic cross-sectional structural diagram of a piezoelectric heat dissipation fan according to an embodiment of the present invention;

[0031] Fig.12 is a schematic diagram of the three-dimensional structure of a piezoelectric heat dissipation fan according to an embodiment of the present invention;

[0032] Fig.13 is a schematic cross-sectional structural diagram of a piezoelectric heat dissipation fan according to another embodiment of the present invention;

[0033] Fig.14 is a schematic diagram of the three-dimensional structure of a piezoelectric heat dissipation fan according to another embodiment of the present invention;

[0034] Fig.15 is a schematic diagram of a top view of a piezoelectric heat dissipation unit according to another embodiment of the present invention;

[0035] Fig.16 It is a schematic diagram of the top structure of a piezoelectric heat dissipation unit according to another embodiment of the present invention.

[0036] In the figure, 11, shell body; 111, opening; 112, air inlet; 3, piezoelectric heat dissipation unit; 31, piezoelectric element; 32, diaphragm; 33, support frame; 330, chamber; 34, jet plate; 341, jet hole; 35, air outlet plate; 351, air outlet hole; 36, connecting component; 361, air inlet channel; 4, heat conduction component; 41, heat conduction member; 411, heat conduction channel; 42, heating element; 43, heat dissipation fins; 430, flow channel; 7, support member; 70, air outlet channel; 71, exhaust port; 8, air guide plate; x, first direction; y, second direction. DETAILED DESCRIPTION

[0037] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0038] In the description of the present invention, it should be understood that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" used in the present invention to indicate the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0039] In the description of the present invention, it should be understood that the terms "connected", "connected", "fixed" and the like used in the present invention should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or a welding connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] The present invention uses the terms "first", "second", etc. to describe various information, but these information should not be limited to these terms, and these terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present invention, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information.

[0041] Reference Figure 1 , a piezoelectric heat dissipation unit 3 according to an embodiment of the present invention comprises: a support frame 33, a piezoelectric element 31, a diaphragm 32, a jet plate 34, an air outlet plate 35 and a connecting assembly 36;

[0042] The support frame 33 has a chamber 330, and both sides of the chamber 330 are open along the first direction x; the diaphragm 32 and the jet plate 34 are respectively covered on both sides of the chamber 330 along the first direction x and are connected to the support frame 33, the jet plate 34 is provided with a jet hole 341, the piezoelectric element 31 is attached to the side of the diaphragm 32 away from the chamber 330 along the first direction x, the air outlet plate 35 is spaced apart from the side of the jet plate 34 away from the chamber 330 along the first direction x, and the edge of the air outlet plate 35 is connected to the edge of the jet plate 34 through the connecting component 36, the connecting component 36 is provided with an air inlet channel 361, so the air inlet channel 361 is connected with the jet hole 341, and the air outlet plate 35 is provided with an air outlet hole 351 connected with the jet hole 341.

[0043] Specifically, the diaphragm 32 can be made of metal films such as stainless steel, copper, aluminum alloy, titanium alloy, etc., or can be made of non-metallic films such as polyimide film, PET film, epoxy resin, rubber, etc., and its thickness can range from 0.01mm to 1mm. The piezoelectric element 31 is fixed on the diaphragm 32. The piezoelectric element 31 can be a separate piezoelectric crystal, which together with the diaphragm 32 constitutes a transducer that can bend and vibrate; it can also be a piezoelectric single crystal composed of a piezoelectric crystal and an elastic substrate; or a piezoelectric double crystal formed by attaching a piezoelectric crystal to both sides of an elastic substrate; it can also be a piezoelectric laminate formed by bonding two piezoelectric crystals that can bend and vibrate. The common point of the above schemes is that they can drive the diaphragm 32 to produce bending deformation vibration. The above piezoelectric crystal can be a multilayer piezoelectric ceramic or a single layer piezoelectric ceramic. The piezoelectric element 31 can be of any structural shape, such as a circular, square, annular, etc.

[0044] Applying an AC excitation signal to the piezoelectric element 31 causes the diaphragm 32 to vibrate at a high frequency, thereby doing work on the gas and driving the gas to flow in a directional manner. The frequency of the applied excitation signal is within the ultrasonic frequency range to avoid generating noise audible to the human ear. When the frequency of the excitation signal is the same as or close to the characteristic frequency of the piezoelectric element 31, the maximum flow rate can be obtained. The Helmholtz resonance frequency of the chamber 330 can be designed to be close to the drive signal frequency to maximize the use of system energy. Of course, other frequencies can also be used.

[0045] The piezoelectric element 31 vibrates at high speed under an AC driving signal of a specific frequency, driving the diaphragm 32 to generate periodic bending deformation. Figure 2 As shown, the piezoelectric element 31 bends downward, the gas in the chamber 330 is compressed, and obtains an initial forward velocity. The gas moves outward through the jet hole 341 of the jet plate 34, generating a gas jet, forming a vortex pair and entraining nearby gas. The gas ejected from the jet hole 341 forms a gas jet, entrains the surrounding gas and continues to move forward, and is ejected through the outlet hole 351.

[0046] like Figure 3 As shown, the piezoelectric element 31 bends upward, the pressure in the chamber 330 decreases, and the external gas enters the chamber 330 from the air inlet channel 361 through the jet hole 341. Due to inertia, the gas previously ejected from the chamber 330 has passed through the air outlet hole 351 and is far away from the jet hole 341. Combined with the blocking effect of the air outlet plate 35, only a small part of the gas will flow back at this time, and the rest of the gas entering the chamber 330 mainly enters through the air inlet channel 361 of the connecting component 36. Repeat the cycle continuously Figure 2 and Figure 3 By means of the process, the cooling gas can be continuously sucked in from the air inlet passage 361 and finally ejected from the air outlet 351 .

[0047] In this embodiment, the air inlet channel 361 is arranged between the jet plate 34 and the air outlet plate 35, and is located on the side of the piezoelectric heat dissipation unit 3. When installing and using the piezoelectric heat dissipation unit 3, only the air inlet space in the horizontal direction needs to be reserved, so the demand for the vertical space size can be reduced, which is suitable for heat dissipation of thinner electronic products. In addition, the air inlet channel 361 is closer to the jet hole 341 and the air outlet hole 351. The gas enters from the air inlet channel 361 and is discharged from the air outlet hole 351. During the whole process, the flow path passed is shorter, and the energy loss during the gas flow process is smaller. Therefore, the efficiency of the piezoelectric heat dissipation unit 3 is higher.

[0048] like Figure 4 As shown, in some improved schemes of the present application, the spacing dimension between the diaphragm 32 and the jet plate 34 in the first direction x is H1mm, wherein 0.02mm≤H1≤0.5mm. The dimension from the diaphragm 32 to the jet plate 34 in the first direction x is the height H1 of the chamber 330. In order to prevent the jet plate 34 from interfering with the vibration of the diaphragm 32, H1 needs to be greater than the maximum downward amplitude of the diaphragm 32. At the same time, the closer to the diaphragm 32, the higher the energy obtained by the gas, and the greater its initial velocity. In some embodiments, the size of H1 is 0.02mm~0.3mm. In other embodiments, the size of H1 is 0.05mm~0.5mm.

[0049] In some improved solutions of the present application, the spacing dimension between the jet plate 34 and the outlet plate 35 in the first direction x is H2mm, wherein 0.1mm≤H2≤2mm. The distance between the jet plate 34 and the outlet plate 35 is H2, which affects the size of the gas flow rate entering the chamber 330 from the inlet channel 361, and also affects the size of the gas flow rate carried away during the entrainment of the gas jet in the jet hole 341. The size of H2 can be adjusted according to the required flow rate and noise level. In some embodiments, the size of H2 is 0.5mm~2mm. In other embodiments, the size of H2 is 0.1mm~1mm.

[0050] In some improved solutions of the present application, a plurality of jet holes 341 are provided on the jet plate 34, wherein the projection area of ​​the jet plate 34 in the first direction x is S1 mm. 2 The projection area of ​​the jet hole 341 in the first direction x is S2 mm 2, satisfying 0.1%≤S2 / S1≤10%. The jet holes 341 are evenly distributed on the jet plate 34. The jet holes 341 are generally circular, and can also be rectangular, waist-shaped, elliptical, and other shapes. The diameter of a single jet hole 341 can be 5um to 500um. The number of jet holes 341 is determined by the total area of ​​the jet plate 34 and the area of ​​a single jet hole 341. The total opening area on the jet plate 34 accounts for 0.1% to 10%. In some embodiments, the number of jet holes 341 is 10 to 2000.

[0051] In some improved solutions of the present application, a plurality of the outlet holes 351 are provided on the outlet plate 35, wherein the projection area of ​​the outlet plate 35 in the first direction x is S3 mm. 2 The projection area of ​​the air outlet 351 in the first direction x is S4 mm 2 , satisfying 1%≤S 4 / S3≤20%. The air outlet holes 351 on the air outlet plate 35 are used for allowing gas to jet through the jet holes 341. Generally speaking, the air outlet holes 351 and the jet holes 341 correspond one to one, or they may not correspond one to one. For example, multiple air outlet holes 351 may be combined into one air outlet hole 351 to allow gas from multiple jet holes 341 to pass through. Generally speaking, the size of the air outlet hole 351 is larger than the size of the jet hole 341, or it may be equal to or smaller than the size of the jet hole 341, and can be adjusted according to the required flow rate and noise level. In some embodiments, the opening area on the air outlet plate 35 accounts for 1% to 20%.

[0052] In some improved solutions of the present application, the jet plate 34 is provided with a plurality of jet holes 341 , and the outlet plate 35 is provided with a plurality of outlet holes 351 , wherein in the first direction x, one outlet hole 351 is provided corresponding to a plurality of jet holes 341 .

[0053] like Fig.15 As shown, the air outlet holes 351 on the air outlet plate 35 are not circular, nor do they correspond one-to-one to the jet holes 341 on the jet plate 34, but are arc-shaped strip holes. Each strip-shaped air outlet hole 351 can correspond to three jet holes 341, allowing the gas jets from these three jet holes 341 to pass through. In the initial scheme, when the gas ejected from the jet hole 341 passes through the small hole air outlet hole 351, the speed and pressure change dramatically, causing the surrounding air to vibrate and generate airflow noise. The design in this embodiment can increase the cross-sectional area of ​​the air outlet hole 351, reduce the rate of change of the gas flow rate, and thus reduce the noise generated when the airflow passes.

[0054] Apart from Fig.15 In addition to the arc-shaped strip holes shown in the figure, Fig.16As shown, in this embodiment, a relatively large circular air outlet hole 351 is used. Each air outlet hole 351 can allow the gas jets of four jet holes 341 to pass through, and can also play the effect of reducing the airflow noise.

[0055] Of course, the arrangement of the air outlet 351 is not limited to the above two methods, and other methods that can achieve similar effects are feasible, and the corresponding solution can be selected according to actual needs.

[0056] A heat dissipation system according to an embodiment of the present invention includes the piezoelectric heat dissipation unit 3 mentioned above.

[0057] like Figure 5 As shown, in some improved schemes of the present application, a heat-conducting component 4 is included, and the heat-conducting component 4 includes a heat-conducting part 41 and a heating element 42. The heat-conducting part 41 is provided with a heat-conducting channel 411 that runs through the heat-conducting part 41, the heat-conducting part 41 is connected to the piezoelectric heat dissipation unit 3 and the heat-conducting channel 411 is connected to the air inlet channel 361, and the heating element 42 is attached to the outer wall of the heat-conducting part 41.

[0058] The heat of the heating element 42 is transferred to the heat conduction channel 411 through the heat conduction member 41, and the piezoelectric heat dissipation unit 3 extracts the heat in the heat conduction channel 411 through the air inlet channel 361, and also sucks the external cold air through the other side of the heat conduction channel 411 to exchange heat with the gas in the heat conduction channel 411, and finally discharges the heat dissipation system through the air outlet 351. This embodiment can prevent the discharged heat from passing through the heat conduction channel 411 again, thereby improving the effect of heat exchange; at the same time, the piezoelectric heat dissipation unit 3 is separated from the heating element 42 and is not directly in contact with it, which can also ensure dust and moisture resistance inside the heating element 42, reducing its damage risk.

[0059] In some improved schemes of the present application, it also includes an air guide plate 8 and a support member 7, the piezoelectric heat dissipation unit 3, the support member 7 and the air guide plate 8 are connected in sequence along the first direction x, and the air outlet plate 35, the support member 7 and the air guide plate 8 form an air outlet channel 70, and the support member 7 is provided with an exhaust port 71 connected to the air outlet channel 70, and the exhaust port 71 and the air inlet channel 361 are staggered in the second direction y, wherein the second direction y is perpendicular to the first direction x.

[0060] like Figure 6 or Figure 7As shown, by adding an air guide plate 8 as a baffle structure below the piezoelectric heat dissipation unit 3, a support member 7 is provided to connect the air guide plate 8 and the piezoelectric heat dissipation unit 3, wherein the support member 7 has an exhaust port 71 on one side, and the air flow is sprayed to the air guide plate 8 for heat dissipation, taking away the heat, and discharged from the exhaust port 71. At the same time, the piezoelectric heat dissipation unit 3 only has an air inlet channel 361 on the side away from the exhaust port 71, and the air inlet channel 361 is staggered with the exhaust port 71, which can prevent the exhausted hot air from being sucked in through the air inlet channel 361 again, so that the cooling gas can be sucked in from one side of the piezoelectric heat dissipation unit 3, and after taking away the heat, it can be ejected from the other side. Among them, the air guide plate 8 can be a heat transfer structure such as a heat sink and a heat spreader.

[0061] like Figure 8 As shown, in some improved schemes of the present application, the two heat-conducting components 4 are included, the connecting component 36 is provided with two air inlet channels 361, the two air inlet channels 361 are respectively arranged on both sides of the connecting component 36 in the second direction y, the two heat-conducting components 4 are respectively connected to the piezoelectric heat dissipation unit 3 on both sides in the second direction y, and the two heat-conducting channels 411 are respectively connected to the two air inlet channels 361 in a one-to-one correspondence; wherein, the second direction y is perpendicular or approximately perpendicular to the first direction x.

[0062] The air inlet channel 361 of the piezoelectric heat dissipation unit 3 is connected to the heat conductive channel 411 formed by the heat conductive member 41. The cooling gas enters from one side of the heat conductive channel 411, passes through the heat conductive channel 411 first, then enters the piezoelectric heat dissipation unit 3 from the air inlet channel 361, and is finally discharged from the air outlet 351. During this process, the cooling air will exchange heat with the heat conductive member 41 to reduce its temperature. The heating element 42, such as an electronic component, a chip, etc., needs to be connected to the heat conductive member 41 to achieve the purpose of heat dissipation of the heating element 42.

[0063] like Fig. 9 As shown, in some improved solutions of the present application, the heat conducting component 4 includes a plurality of heat dissipation fins 43, and the plurality of heat dissipation fins 43 are arranged in the heat conducting channel 411 at intervals along the second direction y, and a flow channel 430 is arranged between the heat dissipation fins 43 and the inner peripheral wall of the heat conducting channel 411, or on the heat dissipation fins 43. In the heat conducting channel 411 formed by the heat conducting member 41, the heat dissipation fins 43 are arranged to increase the area for heat exchange with the cooling gas, thereby increasing the heat dissipation effect.

[0064] like Fig.10As shown, in some improved schemes of the present application, a heating element 42 and a support member 7 are further included, the piezoelectric heat dissipation unit 3, the support member 7 and the heating element 42 are connected in sequence along the first direction x, and the air outlet plate 35, the support member 7 and the heating element 42 are enclosed to form an air outlet channel 70, and the support member 7 is provided with an exhaust port 71 connected to the air outlet channel 70, and the exhaust port 71 and the air inlet channel 361 are staggered in the second direction y, wherein the second direction y is perpendicular or approximately perpendicular to the first direction x.

[0065] A direct air blowing heat dissipation method is adopted, and the air inlet channel 361 is opened on the side of the piezoelectric heat dissipation unit 3. By opening an exhaust port 71 on the other side of the support frame, the exhaust port 71 is offset and away from the air inlet channel 361. When the piezoelectric heat dissipation unit 3 is working, the cooling gas can be continuously inhaled from the air inlet channel 361 and sprayed from the air outlet 351 to the heating element 42. Through heat exchange, the cooling air becomes hot and is finally discharged from the exhaust port 71, taking away a large amount of heat, thereby achieving a heat dissipation effect.

[0066] This embodiment requires that an air inlet space be reserved on the side of the piezoelectric heat dissipation unit 3, and is suitable for occasions where the vertical space is small but the horizontal space is large.

[0067] The heat dissipation method of this embodiment directly uses cooling gas to blow air to the heating element 42 to dissipate heat, which reduces the intermediate heat conduction process and has the highest heat dissipation efficiency.

[0068] refer to Fig.11 An embodiment of the present invention is a piezoelectric heat dissipation fan, comprising a shell body 11 and the above-mentioned piezoelectric heat dissipation unit 3, wherein the shell body 11 is provided with an opening 111 on one side along the first direction x, the piezoelectric heat dissipation unit 3 is arranged in the shell body 11, and the air outlet plate 35 is covered on the opening 111, and the shell body 11 is also provided with an air inlet 112 connected with the air inlet channel 361.

[0069] like Fig.12 As shown, from top to bottom are the shell body 11, the piezoelectric element 31, the diaphragm 32, the support frame 33, the jet plate 34, the connecting assembly 36 and the air outlet plate 35, and the various components are fixed by welding or adhesive.

[0070] The shell body 11 is made of metal or plastic and has an air inlet 112 thereon.

[0071] The diaphragm 32 is a rectangular film, which is rectangular in the figure, but can also be circular or other shapes. The piezoelectric element 31 is bonded and fixed in the middle of the diaphragm 32, and an alternating driving signal is applied to the piezoelectric element 31 to generate bending vibration, thereby driving the diaphragm 32 to vibrate together. The diaphragm 32 and the jet plate 34 are fixed on the support frame 33 around, and a hollow chamber 330 is provided in the middle of the support frame 33 to form an energy conversion chamber.

[0072] The jet plate 34 has a plurality of jet holes 341 evenly distributed, and the distribution area of ​​the jet holes 341 is within the hollow area of ​​the chamber 330 .

[0073] The other side of the jet plate 34 is fixed on the connecting assembly 36, and an air inlet channel 361 for gas to enter is left around the connecting assembly 36. The air outlet plate 35 is located on the other side of the connecting assembly 36, and the air outlet plate 35 is fixed on the shell body 11.

[0074] In some improved schemes of the present application, the connecting component 36 includes at least two elastic support members, which connect the piezoelectric heat dissipation unit 3 and the air outlet plate 35, and each elastic support member is arranged at intervals along the circumference of the piezoelectric heat dissipation unit 3. The piezoelectric heat dissipation unit 3 is connected and fixed to the air outlet plate 35 through multiple elastic support members. Because when the piezoelectric heat dissipation unit 3 is working, the vibration of the piezoelectric element 31 will be transmitted to the air outlet plate 35 and the shell body 11 through the connecting component 36, driving the entire piezoelectric heat dissipation fan to vibrate, thereby losing some energy and reducing efficiency. In this embodiment, the piezoelectric heat dissipation unit 3 is connected and fixed by an elastic support member, which can play a vibration-absorbing role when the fan is working, and can minimize the vibration transmitted to the air outlet plate 35 and the shell body 11 when the piezoelectric heat dissipation unit 3 is working, thereby effectively reducing energy loss and improving heat dissipation efficiency.

[0075] like Fig.13 As shown, in some improved schemes of the present application, a plurality of piezoelectric heat dissipation units 3 can be provided in the piezoelectric heat dissipation fan, each of the piezoelectric heat dissipation units 3 is arranged in an array, and the edges of adjacent air outlet plates 35 are interconnected to form an air outlet cover plate covering the opening 111 of the shell body 11.

[0076] Fig.14 This is a three-dimensional diagram of the above embodiment, and it can be seen that four piezoelectric heat dissipation units 3 are arranged inside the shell body 11. This embodiment can integrate more energy conversion structures in a limited cavity, so it has a higher flow rate than the first embodiment. In addition, the overall area of ​​the air outlet 351 of this embodiment is increased, and the heat dissipation area is increased, which is suitable for occasions requiring large flow and large heat dissipation area.

[0077] In other specific embodiments, other numbers of piezoelectric heat dissipation units 3 may be arranged in the shell body 11 of a piezoelectric heat dissipation fan, such as 2, 8, etc.

[0078] In summary, the embodiments of the present invention provide a piezoelectric heat dissipation unit 3, a heat dissipation system and a piezoelectric heat dissipation fan, which have the following advantages:

[0079] 1. High degree of thinness and lightness: The air inlet channel 361 is arranged between the jet plate 34 and the air outlet plate 35, and is located on the side of the piezoelectric heat dissipation unit 3. When installing and using the piezoelectric heat dissipation unit 3, only the air inlet space in the horizontal direction needs to be reserved, which can reduce the demand for the vertical space size, and is suitable for heat dissipation of lighter and thinner electronic products.

[0080] 2. High heat dissipation efficiency: The air inlet channel 361 is located between the jet plate 34 and the air outlet plate 35, and is closer to the jet hole 341 and the air outlet hole 351. The gas enters from the air inlet channel 361 and is discharged from the air outlet hole 351. During the whole process, the flow channel passed is shorter, the energy loss during the gas flow process is smaller, and the heat dissipation efficiency is higher.

[0081] 3. Reasonable structure: The structural design of the heat dissipation system can realize the suction of cooling gas from the cooling end and the ejection of gas from the other end away from the cooling end to the heating element 42 for heat dissipation. The heat exchange efficiency is high and the heat dissipation effect can be further improved.

[0082] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A piezoelectric heat dissipation unit, characterized in that: include: Piezoelectric element, diaphragm, support frame, jet plate, air outlet plate and connecting components; The support frame has a chamber, and both sides of the chamber are open along the first direction; the diaphragm and the jet plate are respectively covered on both sides of the chamber along the first direction and are connected to the support frame, the jet plate is provided with a jet hole, the piezoelectric element is attached to the side of the diaphragm away from the chamber along the first direction, the air outlet plate is spaced apart from the side of the jet plate away from the chamber along the first direction, and the edge of the air outlet plate is connected to the edge of the jet plate through the connecting component, the connecting component is provided with an air inlet channel, so the air inlet channel is connected with the jet hole, and the air outlet plate is provided with an air outlet hole connected with the jet hole.

2. The piezoelectric heat dissipation unit according to claim 1, characterized in that: The spacing between the diaphragm and the jet plate in the first direction is H1 mm, wherein 0.02 mm ≤ H1 ≤ 0.5 mm; and / or, The spacing dimension between the jet plate and the air outlet plate in the first direction is H2 mm, wherein 0.1 mm≤H2≤2 mm.

3. The piezoelectric heat dissipation unit according to claim 1, characterized in that: The jet plate is provided with a plurality of jet holes, wherein the projection area of ​​the jet plate in the first direction is S1 mm 2 The projection area of ​​the jet hole in the first direction is S2mm 2 , satisfying 0.1%≤S2 / S1≤10%; and / or, The outlet plate is provided with a plurality of outlet holes, wherein the projection area of ​​the outlet plate in the first direction is S3 mm 2 The projection area of ​​the air outlet in the first direction is S4mm 2 , satisfying 1%≤S4 / S3≤20%.

4. A heat dissipation system, characterized in that: It comprises the piezoelectric heat dissipation unit according to any one of claims 1 to 3.

5. The heat dissipation system as claimed in claim 4, characterized in that: It includes a heat-conducting component, which includes a heat-conducting part and a heating element. The heat-conducting part is provided with a heat-conducting channel running through the heat-conducting part. The heat-conducting part is connected to the piezoelectric heat dissipation unit and the heat-conducting channel is connected to the air inlet channel. The heating element is attached to the outer wall of the heat-conducting part.

6. The heat dissipation system as claimed in claim 4 or 5, characterized in that: It also includes an air guide plate and a support member, wherein the piezoelectric heat dissipation unit, the support member and the air guide plate are connected in sequence along the first direction, and an air outlet channel is formed between the air outlet plate, the support member and the air guide plate, and an exhaust port connected to the air outlet channel is opened on the support member, and the exhaust port and the air inlet channel are staggered in the second direction, wherein the second direction is perpendicular to the first direction.

7. The heat dissipation system according to claim 5, characterized in that: The two heat-conducting components are included, the connecting component is provided with two air inlet channels, the two air inlet channels are respectively arranged on both sides of the connecting component in the second direction, the two heat-conducting components are respectively connected to both sides of the piezoelectric heat dissipation unit in the second direction, and the two heat-conducting channels are respectively connected to the two air inlet channels in a one-to-one correspondence; The second direction is perpendicular to the first direction.

8. The heat dissipation system according to claim 7, characterized in that: The heat conduction assembly includes a plurality of heat dissipation fins, which are arranged in the heat conduction channel at intervals along the second direction, and a flow channel is provided between the heat dissipation fins and the inner peripheral wall of the heat conduction channel or on the heat dissipation fins.

9. The heat dissipation system according to claim 4, characterized in that: It also includes a heating element and a supporting member, wherein the piezoelectric heat dissipation unit, the supporting member and the heating element are connected in sequence along the first direction, and an air outlet channel is formed between the air outlet plate, the supporting member and the heating element, and an exhaust port connected to the air outlet channel is provided on the supporting member, and the exhaust port and the air inlet channel are staggered in the second direction, wherein the second direction is perpendicular to the first direction.

10. A piezoelectric cooling fan, characterized in that: It comprises a shell body and a piezoelectric heat dissipation unit as described in any one of claims 1 to 3, wherein the shell body is provided with an opening on one side along the first direction, the piezoelectric heat dissipation unit is arranged in the shell body, and the air outlet plate cover is arranged on the opening, and the shell body is also provided with an air inlet connected to the air inlet channel.

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