Dustproof heat dissipation computer case

A computer and chassis technology, applied in the computer field, can solve problems such as poor heat dissipation

Inactive Publication Date: 2022-01-14
ZHENGZHOU TOURISM COLLEGE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the above situation, in order to solve the problems existing in the prior art, the purpose of the present invention is to provide a dust-proof and heat-dissipating computer case, which can effectively solve the problem of poor heat dissipation caused by computer dust deposition

Method used

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  • Dustproof heat dissipation computer case
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  • Dustproof heat dissipation computer case

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Embodiment Construction

[0022] The specific implementation manners of the present invention will be described in further detail below in conjunction with the accompanying drawings.

[0023] Depend on Figure 1 to Figure 8 Provide, the present invention comprises cabinet 1, and the bottom of cabinet 1 has air inlet 8, and the upper end in air inlet 8 is provided with air intake fan 9, and the filter screen 10 that moves up and down in air inlet 8 is provided with below air inlet fan 9, enters A spring is arranged between the air fan 9 and the filter screen 10; a plurality of air intake cover plates 11 arranged horizontally are arranged below the filter screen 10, and each air intake cover plate 11 is rotatably connected in the cabinet 1, when multiple intake air The cover plate 11 is in the vertical state, and there is an interval between the two connected air intake cover plates 11, and the air inlet 8 is opened. When a plurality of air intake cover plates 11 are in the horizontal state, there Fit e...

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PUM

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Abstract

The invention relates to a dustproof heat dissipation computer case. The problem that heat dissipation is not smooth due to dust deposition of a computer is effectively solved. According to the technical scheme, the dustproof heat dissipation computer case comprises a case, an air inlet, an air inlet fan, a filter screen and air inlet cover plates are arranged on the lower portion of the case, the air inlet cover plates open the air inlet in the vertical state, and the multiple air inlet cover plates close the air inlet in the transverse state; a vertical plate is arranged below the air inlet cover plates, and the air inlet is closed, and the vertical plate moves from left to right to drive the multiple air inlet cover plates to rotate to a vertical state; the air inlet is opened, the vertical plate moves from right to left to be in contact with and separated from the multiple air inlet cover plates, the air inlet cover plates are kept in the vertical state, and the air inlet cover plates vibrate and enable the filter screen to vibrate; a side plate, an air outlet, an air outlet cover plate and an exhaust fan are arranged in the case; the air outlet cover plates on the same side are connected with the vertical plate through first ropes; and the problem of unsmooth heat dissipation caused by dust deposition of a computer is solved, and the dustproof heat dissipation effect is good.

Description

technical field [0001] The invention relates to the field of computers, in particular to a dust-proof and heat-dissipating computer case. Background technique [0002] For the convenience of heat dissipation, the computer will install heat dissipation holes and cooling fans on the chassis to drive the air flow to dissipate heat inside the chassis shell. Due to the dust particles in the air, the computer often accumulates a large amount of dust during daily use, which is easy to be adsorbed to In the heat dissipation holes of the chassis, the accumulation of time will cause the heat dissipation holes to be blocked, resulting in poor heat dissipation, which will cause the internal temperature of the chassis to be too high, and the life of internal components will be greatly shortened if they work in such a working environment. Once the dust accumulates a lot, it will greatly affect the heat dissipation effect. Therefore, in order to ensure the heat dissipation effect, it is ne...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20B01D46/10B01D46/76
CPCG06F1/182G06F1/20B01D46/10G06F2200/1638
Inventor 谭丹丹
Owner ZHENGZHOU TOURISM COLLEGE
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