A water vapor atomization device for semiconductor waste gas treatment equipment

Abstract

The present invention discloses a water vapor atomization device for semiconductor waste gas treatment equipment, including a cover body, a first connection seat and a second connection seat are respectively provided on both sides of the outer wall of the cover body, the first connection seat and the second connection seat are integrated with the cover body, the cover body is provided with a mounting groove, a cooling component is embedded in the mounting groove, the cooling component is composed of a first connection seat, a second connection seat and a third connection seat, the first connection seat, the second connection seat and the third connection seat are respectively provided with a first nozzle, a second nozzle and a third nozzle, the first connection seat, the second connection seat and the third connection seat are connected with connecting pipes at both ends, and the connecting pipes at one end of the first connection seat, the second connection seat and the third connection seat are connected to the inside of the first connection seat. The water vapor atomization device effectively increases the spraying area and expands the cooling area, so that the waste gas can fully contact with water to achieve better treatment and cooling effects.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor waste gas treatment, and in particular to a water vapor atomization device for semiconductor waste gas treatment equipment. Background Art

[0002] In semiconductor waste gas treatment equipment, high-temperature combustion in the front section causes the waste gas to generate high temperature, while the exhaust equipment requires the gas temperature to be at normal room temperature. This requires the high-temperature gas to be cooled rapidly to meet the emission standards.

[0003] At present, most of the treatment of high-temperature exhaust gas adopts the spray cooling method. When spraying and cooling, it is achieved through a spiral nozzle. Since traditional nozzles are fixed on the inner wall of the cooling chamber or the cooling tube, the spraying range is limited. The exhaust gas moves quickly in the cooling chamber or the cooling tube, which can easily lead to insufficient contact between the gas and water, resulting in incomplete spraying. Therefore, the best spraying effect cannot be achieved. The present invention provides a water vapor atomization device for semiconductor exhaust gas treatment equipment. Summary of the invention

[0004] The purpose of the present invention is to provide a water vapor atomization device for semiconductor waste gas treatment equipment to solve the problem that the traditional spray cooling method in the above-mentioned background technology has a limited spray range, resulting in insufficient contact between gas and water, causing incomplete spraying.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A water vapor atomization device for semiconductor waste gas treatment equipment includes a cover body, and a first external seat and a second external seat are respectively provided on both sides of the outer wall of the cover body, the first external seat and the second external seat are integrated with the cover body, the cover body is provided with a mounting groove, and a cooling component is embedded in the mounting groove, and the cooling component is composed of a first connecting seat, a second connecting seat and a third connecting seat, and the first connecting seat, the second connecting seat and the third connecting seat are respectively provided with a first nozzle, a second nozzle and a third nozzle, and both ends of the first connecting seat, the second connecting seat and the third connecting seat are connected with connecting pipes, the connecting pipes at one end of the first connecting seat, the second connecting seat and the third connecting seat are connected to the inside of the first external seat, and the connecting pipes at the other ends of the first connecting seat, the second connecting seat and the third connecting seat are connected to the inside of the second external seat, and the first external seat and the second external seat are respectively provided with a water inlet and an air inlet.

[0007] As a preferred embodiment of the present invention, the first nozzle, the second nozzle and the third nozzle are all embedded and fixed on the first connecting seat, the second connecting seat and the third connecting seat, and the first nozzle, the second nozzle and the third nozzle are all spiral atomizing nozzles.

[0008] As a preferred embodiment of the present invention, the first nozzle and the second nozzle are located on both sides of the third nozzle, the first nozzle and the second nozzle correspond to the notch position at one end of the installation slot, and the third nozzle corresponds to the notch position at the other end of the installation slot.

[0009] As a preferred embodiment of the present invention, fixing screw sleeves are embedded on the connecting pipes at both ends of the first connecting seat, the second connecting seat and the third connecting seat, and the connecting pipes at both ends of the first connecting seat, the second connecting seat and the third connecting seat are all made of tetrafluoroethylene material.

[0010] As a preferred embodiment of the present invention, the cover body is a circular structure, and the cover body, the first external seat and the second external seat are all made of PVC material.

[0011] As a preferred embodiment of the present invention, the first external seat and the second external seat are both hollow structures, the water inlet on the first external seat is connected to the water supply equipment through an external water pipe, and the air inlet on the second external seat is connected to the air compression device through an external air pipe.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] 1. The water vapor atomization device adopts a circular seat structure and a spiral atomization nozzle is installed in the seat. The spiral atomization nozzle is installed in a horizontal arrangement, and the arranged nozzles have different spraying directions. Through the design of the water vapor atomization device with this structure, the spraying area is effectively increased, the cooling area is expanded, and the exhaust gas can be fully contacted with water to achieve better treatment and cooling effects.

[0014] 2. The spraying form of the water vapor atomization device is mainly in the form of unified water intake and unified air intake through the first connecting seat and the second connecting seat. In this way, multiple groups of nozzles are provided with water and air supply by the first connecting seat and the second connecting seat, which effectively avoids the use of independent water pipes and air pipes for multiple groups of nozzles, resulting in cumbersome connection structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0016] Figure 2 It is a front view structural schematic diagram of the present invention;

[0017] Figure 3 It is a side structural schematic diagram of the present invention.

[0018] In the figure: 1-cover body, 2-cooling assembly, 3-first external seat, 4-second external seat, 5-first connecting seat, 6-second connecting seat, 7-third connecting seat, 8-first nozzle, 9-second nozzle, 10-third nozzle, 11-water inlet, 12-air inlet. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] See also Figure 1-3 , the present invention provides a technical solution:

[0021] A water vapor atomization device for semiconductor waste gas treatment equipment includes a cover body 1, and a first external seat 3 and a second external seat 4 are respectively provided on both sides of the outer wall of the cover body 1. The first external seat 3 and the second external seat 4 are integrated with the cover body 1. The cover body 1 is provided with a mounting groove, and a cooling component 2 is embedded in the mounting groove. The cooling component 2 is composed of a first connecting seat 5, a second connecting seat 6 and a third connecting seat 7. The first connecting seat 5, the second connecting seat 6 and the third connecting seat 7 are respectively provided with a first nozzle 8, a second nozzle 9 and a third nozzle 10. The first connecting seat 5, the second connecting seat 6 and the third connecting seat 7 are connected to connecting pipes at both ends. The first connecting seat 5, the second connecting seat 6 and the third connecting seat 7 are connected to the first connecting seat 5, the second connecting seat 6 and the third connecting seat 7. 6 and the connecting pipe at one end of the third connecting seat 7 are connected to the inside of the first connecting seat 3, and the connecting pipes at the other ends of the first connecting seat 5, the second connecting seat 6 and the third connecting seat 7 are connected to the inside of the second external seat 4. The first external seat 3 and the second external seat 4 are respectively provided with a water inlet 11 and an air inlet 12. The cover body 1 of the water vapor atomization device is an integrated cover body 1. The cover body 1 is equipped with horizontally arranged nozzles, and the nozzles have different spraying directions to achieve all-round spraying. At the same time, the cover body 1 is connected to a gas connecting seat and a water body connecting seat. Water is atomized and sprayed by means of gas pressurization, which ensures that the exhaust gas is fully in contact with water and achieves better treatment and cooling effects on high-temperature exhaust gas.

[0022] The first nozzle 8, the second nozzle 9 and the third nozzle 10 are all embedded and fixed on the first connecting seat 5, the second connecting seat 6 and the third connecting seat 7. The first nozzle 8, the second nozzle 9 and the third nozzle 10 are all spiral atomizing nozzles. After the water body is atomized by gas pressurization, it can be sprayed through the spray holes distributed on the rotary atomizing nozzle, which effectively increases the area of ​​atomization spraying and ensures the spray cooling effect.

[0023] The first nozzle 8 and the second nozzle 9 are located on both sides of the third nozzle 10. The first nozzle 8 and the second nozzle 9 correspond to the slot position at one end of the mounting groove, and the third nozzle 10 corresponds to the slot position at the other end of the mounting groove. The third nozzle 10 is in opposite directions to the first nozzle 8 and the second nozzle 9, thereby providing a spraying effect on both ends of the mounting groove of the cover body 1, increasing the spraying area, thereby expanding the cooling area, and allowing the high-temperature gas to fully contact with water.

[0024] The connecting pipes at both ends of the first connecting seat 5, the second connecting seat 6 and the third connecting seat 7 are embedded with fixing screw sleeves. The connecting pipes at both ends of the first connecting seat 5, the second connecting seat 6 and the third connecting seat 7 are all made of tetrafluoroethylene. The fixing screw sleeves mainly provide reinforcement effect for the connecting pipes at both ends of the first connecting seat 5, the second connecting seat 6 and the third connecting seat 7. Tetrafluoroethylene has good corrosion resistance and can increase the service life of the connecting pipes.

[0025] The cover body 1 is a circular structure. The cover body 1, the first external seat 3 and the second external seat 4 are all made of PVC material. The cover body made of PVC material is light in weight and has good heat resistance and corrosion resistance, and can withstand the high temperature of exhaust gas.

[0026] The first external seat 3 and the second external seat 4 are both hollow structures. The water inlet 11 on the first external seat 3 is connected to the water supply equipment through an external water pipe, and the air inlet 12 on the second external seat 4 is connected to the air compression device through an external air pipe. The hollow structure of the connecting seat allows water and pressurized air to enter the connecting pipes at both ends of the first connecting seat 5, the second connecting seat 6 and the third connecting seat 7 respectively.

[0027] Working principle: When using the water vapor atomization device to treat semiconductor waste gas, the cover body 1 of the water vapor atomization device can be fixed to the waste gas discharge port of the semiconductor processing equipment through an external fixing component or screws, and the water inlet 11 and the air inlet 12 on the first external seat 3 and the second external seat 4 at both ends of the cover body 1 are sealed and fixed through a water pipe and an air pipe. When the semiconductor processing equipment discharges waste gas, it is necessary to perform atomization spraying operation in advance, and inject air and water into the first external seat 3 and the second external seat 4 respectively through the air pipe and the water pipe. The air compression device The compressed air is injected into the second external seat 4, and the compressed air enters the first nozzle 8, the second nozzle 9 and the third nozzle 10 respectively through the connecting pipe. After the water enters the first external seat 3, it also flows to the first nozzle 8, the second nozzle 9 and the third nozzle 10 through the connecting pipe in the form of diversion. The water is atomized by the pressure of the compressed air and sprayed through the first nozzle 8, the second nozzle 9 and the third nozzle 10. At this time, the exhaust gas discharge port of the semiconductor processing equipment is opened, and the high-temperature exhaust gas is cooled by atomization spraying.

[0028] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A water vapor atomization device for semiconductor waste gas treatment equipment, characterized in that: The invention comprises a cover body (1), wherein a first external connection seat (3) and a second external connection seat (4) are respectively provided on both sides of the outer wall of the cover body (1), wherein the first external connection seat (3) and the second external connection seat (4) are integrated with the cover body (1), wherein a mounting groove is provided on the cover body (1), wherein a cooling assembly (2) is embedded in the mounting groove, wherein the cooling assembly (2) is composed of a first connection seat (5), a second connection seat (6) and a third connection seat (7), wherein a first nozzle (8), a second nozzle (9) are respectively provided on the first connection seat (5), the second connection seat (6) and the third connection seat (7), wherein a first nozzle (8), a second nozzle (10) and a second nozzle (11) are respectively provided on the first connection seat (5), the second connection seat (6) and the third connection seat (7). The first connecting seat (5), the second connecting seat (6) and the third connecting seat (7) are connected to connecting pipes at both ends, the connecting pipes at one end of the first connecting seat (5), the second connecting seat (6) and the third connecting seat (7) are connected to the interior of the first external seat (3), and the connecting pipes at the other end of the first connecting seat (5), the second connecting seat (6) and the third connecting seat (7) are connected to the interior of the second external seat (4), and the first external seat (3) and the second external seat (4) are respectively provided with a water inlet (11) and an air inlet (12); The first nozzle (8) and the second nozzle (9) are located on both sides of the third nozzle (10), the first nozzle (8) and the second nozzle (9) correspond to the slot position at one end of the installation slot, and the third nozzle (10) corresponds to the slot position at the other end of the installation slot; The first external seat (3) and the second external seat (4) are both hollow structures; the water inlet (11) on the first external seat (3) is connected to a water supply device via an external water pipe, and the air inlet (12) on the second external seat (4) is connected to an air compression device via an external air pipe.

2. The water vapor atomization device for semiconductor waste gas treatment equipment according to claim 1, characterized in that: The first nozzle (8), the second nozzle (9) and the third nozzle (10) are all embedded and fixed on the first connecting seat (5), the second connecting seat (6) and the third connecting seat (7); the first nozzle (8), the second nozzle (9) and the third nozzle (10) are all spiral atomizing nozzles.

3. The water vapor atomization device for semiconductor waste gas treatment equipment according to claim 1, characterized in that: The connecting pipes at both ends of the first connecting seat (5), the second connecting seat (6) and the third connecting seat (7) are embedded with fixing screw sleeves, and the connecting pipes at both ends of the first connecting seat (5), the second connecting seat (6) and the third connecting seat (7) are all made of tetrafluoroethylene material.

4. The water vapor atomization device for semiconductor waste gas treatment equipment according to claim 1, characterized in that: The cover body (1) is a circular structure; the cover body (1), the first external seat (3) and the second external seat (4) are all made of PVC material.

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