Electronic packaging and method of manufacturing the same

Abstract

The present invention relates to an electronic package and a manufacturing method thereof, comprising: a first supporting structure having a plurality of antenna feed lines, and an antenna module arranged on the first supporting structure, wherein the antenna module comprises a substrate body having a plurality of recesses of different depths, so that an antenna layer is formed in the plurality of recesses, so that the antenna layer is electromagnetically coupled to the antenna feed line to improve the overall radiation efficiency of the antenna component.

Description

Technical Field

[0001] The invention relates to an electronic package, and in particular to an electronic package with an antenna structure and a manufacturing method thereof. Background Art

[0002] Nowadays, wireless communication technology has been widely used in various consumer electronic products (such as mobile phones, tablet computers, etc.) to receive or send various wireless signals. In order to meet the portability and Internet access convenience of consumer electronic products (such as watching multimedia content), the manufacturing and design of wireless communication modules are developed towards the requirements of lightness, thinness, shortness and smallness. Among them, patch antennas are widely used in wireless communication modules of electronic products due to their small size, light weight and easy manufacturing.

[0003] In addition, as the current multimedia content has become larger in file data volume due to the improvement in image quality, the bandwidth of wireless transmission also needs to be increased, resulting in the fifth generation of wireless transmission (5G). In addition, due to the higher transmission frequency of 5G, the requirements for its related wireless communication modules are also higher.

[0004] The application of 5G is a trend of full commercialization in the future. Its application frequency range is approximately in the high-frequency band between 1GHz and 1000GHz. Its commercial application model is 5G in combination with 4G LTE, and a cellular base station is set up outdoors to cooperate with the small base station installed indoors. Therefore, 5G mobile communications will use a large number of antennas in the base station to meet the large-capacity, fast transmission and low latency of the 5G system.

[0005] Figure 1 FIG. 1 is a three-dimensional schematic diagram of an existing wireless communication module 1. Figure 1 As shown, the wireless communication module 1 includes: a substrate 10, a plurality of electronic components 11 disposed on the substrate 10, an antenna structure 12, and a packaging material 13. The substrate 10 is a circuit board and is rectangular. The electronic component 11 is disposed on the substrate 10 and is electrically connected to the substrate 10. The antenna structure 12 is planar and has an antenna body 120 and a wire 121. The antenna body 120 is electrically connected to the electronic component 11 via the wire 121. The packaging material 13 covers the electronic component 11 and part of the wire 121.

[0006] Taking smartphones as an example, the 5G frequency band can be divided into 3.5Ghz~6Ghz, 28Ghz, 39Ghz, 60Ghz, 71Ghz~73Ghz, etc., and the 5G system requires more antenna configurations to improve signal quality and transmission speed due to signal quality and transmission speed requirements.

[0007] However, in the existing wireless communication module 1, the antenna structure 12 is planar, and the length and width of the substrate 10 are fixed, resulting in limited circuit wiring space (number of layers), thereby limiting the function of the antenna structure 12, causing the wireless communication module 1 to be unable to provide the electrical functions required to operate the 5G system, and it is difficult to meet the antenna operation requirements of the 5G system.

[0008] In addition, if a layout area is added on the surface of the substrate 10 to form an antenna body 120 of multiple frequencies, the width of the substrate 10 will increase, making it difficult to reduce the width of the wireless communication module 1, resulting in the wireless communication module 1 being unable to meet the miniaturization requirements.

[0009] Therefore, how to overcome the various problems of the above-mentioned prior art has become a topic that needs to be solved urgently. Summary of the invention

[0010] In view of the above-mentioned defects of the prior art, the present invention provides an electronic package and a manufacturing method thereof, which can improve the overall radiation efficiency of the antenna assembly.

[0011] The electronic package of the present invention includes: a first supporting structure, which has a plurality of antenna feed lines; and an antenna module, which is arranged on the first supporting structure, and the antenna module includes a substrate body having a first surface and a second surface relative to each other, so that the substrate body is arranged on the first supporting structure with its first surface, wherein the first surface of the substrate body has a plurality of recesses of different depths to form a first antenna layer in the plurality of recesses, and the second surface of the substrate body has a second antenna layer configured corresponding to the first antenna layer, so that the first antenna layer electromagnetically couples the antenna feed line and the second antenna layer.

[0012] In the aforementioned electronic package, an air gap is formed between the first antenna layer and the antenna feeding circuit.

[0013] In the aforementioned electronic package, the antenna module is disposed on the first supporting structure via a supporting member.

[0014] In the aforementioned electronic package, the first supporting structure has two opposite sides so that the antenna module is arranged on one side of the first supporting structure, and the electronic package also includes: a second supporting structure, which is stacked on the other side of the first supporting structure via a plurality of conductors; and at least one electronic component, which is arranged between the first supporting structure and the second supporting structure and electrically connected to the conductor.

[0015] In the aforementioned electronic package, the first supporting structure is electrically connected to the second supporting structure via the conductor.

[0016] In the aforementioned electronic package, the antenna feed circuit is electrically connected to the conductor to be electrically connected to the electronic component.

[0017] The aforementioned electronic package also includes a covering layer formed between the first supporting structure and the second supporting structure to cover the electronic component.

[0018] The aforementioned electronic package further includes a plurality of conductive elements formed on the second supporting structure, and the conductive elements and the conductor are located on different sides of the second supporting structure.

[0019] The present invention also provides a method for manufacturing an electronic package, comprising: providing a substrate body having a first surface and a second surface opposite to each other, and having a second antenna layer on the second surface; forming a plurality of recesses of different depths on the first surface of the substrate body; forming a first antenna layer in the plurality of recesses so that the first antenna layer is electromagnetically coupled to the second antenna layer; and arranging the substrate body with its first surface on a first supporting structure having a plurality of antenna feeding lines so that the first antenna layer is electromagnetically coupled to the antenna feeding lines.

[0020] In the aforementioned manufacturing method, an air gap is formed between the first antenna layer and the antenna feeding line.

[0021] In the aforementioned manufacturing method, the substrate body is disposed on the first supporting structure via a supporting member.

[0022] In the aforementioned manufacturing method, the plurality of recesses are formed on the first surface of the substrate body by etching.

[0023] In the aforementioned manufacturing method, the first supporting structure has two opposite sides so that the antenna module is arranged on one side of the first supporting structure, and the manufacturing method also includes stacking the second supporting structure on the other side of the first supporting structure via a plurality of conductors, and arranging at least one electronic component between the first supporting structure and the second supporting structure and electrically connecting the conductors.

[0024] In the aforementioned manufacturing method, the first supporting structure is electrically connected to the second supporting structure via the conductor.

[0025] In the aforementioned manufacturing method, the antenna feeding circuit is electrically connected to the conductor to be electrically conducted to the electronic component.

[0026] The aforementioned manufacturing method further includes forming a coating layer covering the electronic component between the first supporting structure and the second supporting structure.

[0027] The aforementioned manufacturing method further includes disposing a plurality of conductive elements on the second supporting structure, wherein the conductive elements and the conductive body are respectively located on different sides of the second supporting structure.

[0028] From the above, it can be seen that the electronic package and its antenna component and manufacturing method of the present invention, through the design of the recess, can improve the overall radiation efficiency of the antenna structure of the electronic package (or the antenna component) when the first antenna layer electromagnetically couples the antenna feed line and the second antenna layer. Therefore, compared with the prior art, the present invention can improve the performance gain and efficiency of the antenna, and enhance the electric field strength of the antenna to facilitate signal transmission, thereby meeting the antenna operation requirements of the 5G system.

[0029] In addition, the present invention can adjust the electromagnetic coupling distance between the first antenna layer and the second antenna layer to generate different frequencies through the design of the multiple recesses of different depths, so that the antenna of the electronic package (or the antenna component) can transmit different antenna signals as needed. Therefore, compared to the prior art, the single electronic package of the present invention can meet the needs of radio frequency products of multiple frequencies to replace multiple packaging modules corresponding to different frequencies, thereby reducing the product size, so as to help the electronic package (or the antenna component) meet the needs of miniaturization.

[0030] In addition, the present invention stacks the antenna module on the first supporting structure, thereby eliminating the need to increase the layout area on the first supporting structure. Therefore, antennas of various frequencies can be manufactured within a predetermined first supporting structure size, thereby enabling the electronic package (or the antenna component) to meet miniaturization requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a cross-sectional schematic diagram of an existing wireless communication module.

[0032] FIG. 2A to FIG. 2F It is a cross-sectional schematic diagram of a first embodiment of a method for manufacturing an electronic package of the present invention.

[0033] FIG. 3A to FIG. 3E It is a cross-sectional schematic diagram of a second embodiment of a method for manufacturing an electronic package of the present invention.

[0034] Figure 3C-1 for Figure 3C A schematic diagram of another embodiment of the present invention.

[0035] FIG. 4A to FIG. 4C It is a cross-sectional schematic diagram of a method for manufacturing an antenna module of an electronic package of the present invention.

[0036] Description of Reference Numerals

[0037] 1: Wireless communication module

[0038] 10:Substrate

[0039] 11,21:Electronic components

[0040] 12: Antenna structure

[0041] 120: Antenna body

[0042] 121: Wire

[0043] 13: Packaging material

[0044] 2,3: Electronic packaging

[0045] 2',3': Antenna assembly

[0046] 2a,3a: Encapsulation module

[0047] 2b: Antenna module

[0048] 20,30: First bearing structure

[0049] 20a,30a: First side

[0050] 20b,30b: Second side

[0051] 200: first insulating layer

[0052] 201,301: First circuit layer

[0053] 21a: Action surface

[0054] 21b: Non-active surface

[0055] 21c: Solid crystal layer

[0056] 210: Electrode pad

[0057] 211,212: Protective film

[0058] 213,313: Conductive bumps

[0059] 22,32: Second bearing structure

[0060] 220: Second insulation layer

[0061] 221,321: Second circuit layer

[0062] 23,33: Conductor

[0063] 24: Conductive element

[0064] 240: Under Bump Metal Layer

[0065] 25: Coating layer

[0066] 26: Support

[0067] 27,29: Antenna body

[0068] 27a: Low frequency antenna part

[0069] 270: first antenna feed line

[0070] 271,291: First antenna layer

[0071] 272,292: Second antenna layer

[0072] 28:Substrate body

[0073] 28a: First surface

[0074] 28b: Second surface

[0075] 280,281: concave part

[0076] 29a: High frequency antenna part

[0077] 290: Second antenna feed line

[0078] 300,320: Insulator

[0079] 302: Insulation protection layer

[0080] 302a,900: Open hole

[0081] 330: Core block

[0082] 331: Conductive material

[0083] 35: Primer

[0084] 9: Loading plate

[0085] A: Open area

[0086] A1, A2: air gap

[0087] D1,D2,L1,L2: distance

[0088] H1,H2: Depth

[0089] S: cutting path. DETAILED DESCRIPTION

[0090] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0091] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions under which the present invention can be implemented, so they have no substantial technical significance. Any structural modification, change in proportional relationship, or adjustment in size should still fall within the scope of the technical contents disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "on", "first", "second", and "one" cited in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the present invention without substantially changing the technical contents.

[0092] FIG. 2A to FIG. 2F FIG. 1 is a cross-sectional view of a first embodiment of a method for manufacturing an electronic package 2 according to the present invention.

[0093] like Figure 2A As shown, a first supporting structure 20 is provided on a supporting board 9, the first supporting structure 20 having a first side 20a and a second side 20b opposite to each other, and the first supporting structure 20 is coupled to the supporting board 9 with its second side 20b. Then, a plurality of conductors 23 electrically connected to the first supporting structure 20 are formed on the first side 20a, and at least one electronic component 21 is disposed on the first side 20a of the first supporting structure 20.

[0094] In this embodiment, the first carrier structure 20 is a coreless circuit structure, which includes at least one first insulating layer 200 and a first circuit layer 201 disposed on the first insulating layer 200, such as a circuit redistribution layer (RDL), which has a first antenna feed line 270 and a second antenna feed line 290, so that the first carrier structure 20 can be used as an antenna substrate. For example, the material forming the first circuit layer 201 is copper, and the material forming the first insulating layer 200 is a dielectric material such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), etc.

[0095] In addition, the carrier plate 9 is, for example, a circular plate made of a semiconductor material (such as silicon or glass), on which the first insulating layer 200 of the first carrier structure 20 is placed.

[0096] In addition, the conductor 23 is, for example, a columnar body, a linear body or a spherical body, which is disposed on the first circuit layer 201 and electrically connects the first circuit layer 201 (or the first antenna feeding circuit 270 and the second antenna feeding circuit 290), and the material forming the conductor 23 is a metal material such as copper, gold or a solder material. It should be understood that the conductor 23 has many types, such as a passive component, and is not limited to the above.

[0097] In addition, the electronic component 21 is an active component, a passive component or a combination of the two, and the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, and an inductor. In the present embodiment, the electronic component 21 is a semiconductor chip having an active surface 21a and an inactive surface 21b opposite to each other. The electronic component 21 is bonded to the first side 20a of the first supporting structure 20 with its inactive surface 21b via a solid crystal layer 21c, and the active surface 21a has a plurality of electrode pads 210, and a plurality of conductive bumps 213 and at least one protective film for covering the electrode pads 210 and the conductive bumps 213 are formed on the plurality of electrode pads 210 (the present embodiment is illustrated with two layers of protective films 211, 212), wherein the protective films 211, 212 are, for example, poly(p-oxadiazole) (PBO), nitride (such as silicon nitride), oxide (such as silicon oxide), and the conductive bumps 213 are spherical in shape such as conductive lines or solder balls, or pillars of metal materials such as copper pillars and solder bumps, or studs made by a wire bonding machine, but are not limited thereto. It should be understood that the electronic component 21 can also be flip-chip bonded and electrically connected to the first supporting structure 20 via the conductive bumps 213. Therefore, there are many ways to connect the electronic component 21 to the supporting structure, such as wire bonding, and it is not limited to the above.

[0098] like Figure 2B As shown, a coating layer 25 is formed on the first side 20a of the first supporting structure 20 so that the coating layer 25 covers the electronic component 21 and the conductors 23, and then through a flattening process, the upper protective film 212, the end surface of the conductor 23 and the end surface of the conductive bump 213 are exposed from the coating layer 25, so that the upper surface of the coating layer 25 is flush with the upper protective film 212, the end surface of the conductor 23 and the end surface of the conductive bump 213.

[0099] In this embodiment, the coating layer 25 is an insulating material, such as polyimide (PI), dry film, epoxy or molding compound, which can be formed on the first side 20a of the first supporting structure 20 by lamination or molding.

[0100] In addition, the flattening process removes part of the material of the conductor 23 , the protection film 212 , the conductive bump 213 and the cladding layer 25 by grinding, so that the upper surface of the cladding layer 25 is flush with the end surface of the protection film 212 , the conductor 23 and the end surface of the conductive bump 213 .

[0101] like Figure 2C As shown, a second supporting structure 22 is formed on the encapsulation layer 25 , and the second supporting structure 22 is stacked on the first supporting structure 20 to form a packaging module 2 a , and the second supporting structure 22 is electrically connected to the conductors 23 and the conductive bumps 213 .

[0102] In this embodiment, the second supporting structure 22 is a circuit structure without a core layer, which includes a plurality of second insulating layers 220 and a plurality of second circuit layers 221 such as RDL disposed on the second insulating layers 220, and the outermost second insulating layer 220 can be used as a solder mask to expose the outermost second circuit layer 221 to the solder mask. Alternatively, the second supporting structure 22 can also include only a single second insulating layer 220 and a single second circuit layer 221.

[0103] In addition, the material forming the second circuit layer 221 is copper, and the material forming the second insulating layer 220 is a dielectric material such as poly(p-oxadiazole) (PBO), polyimide (PI), or prepreg (PP).

[0104] In addition, the first circuit layer 201 is electrically connected to the second circuit layer 221 via the conductors 23 , so that the first antenna feeding circuit 270 and the second antenna feeding circuit 290 are electrically connected to the electronic component 21 .

[0105] In addition, a plurality of conductive elements 24 such as solder balls are formed on the outermost second circuit layer 221. For example, an under bump metallurgy (UBM) 240 may be formed on the outermost second circuit layer 221 to facilitate bonding of the conductive elements 24.

[0106] like Figure 2D As shown, the carrier plate 9 is removed and the whole structure is turned over so that the outermost first insulating layer 200 serves as an insulating protection layer, and a plurality of openings 900 are formed on the outermost first insulating layer 200 so that part of the first circuit layer 201 is exposed from the openings 900 .

[0107] In this embodiment, an insulating protective layer (not shown) such as a solder mask may be formed on the second side 20b of the first supporting structure 20, and a plurality of openings may be formed in the insulating protective layer to expose a portion of the first circuit layer 201 from the openings. Therefore, there are many types of the packaging module 2a, and they are not limited to the above.

[0108] like Figure 2E As shown, an antenna module 2 b is stacked on the second side 20 b of the first supporting structure 20 of the packaging module 2 a via a plurality of supporting members 26 , so that an open area A is formed between the antenna module 2 b and the first supporting structure 20 .

[0109] In this embodiment, the antenna module 2b includes a substrate body 28, which is a package substrate type, such as a package substrate (substrate) with a core layer and a circuit structure or a coreless circuit structure, so as to form a plurality of thin antenna bodies 27, 29 on a dielectric material by sputtering, vaporizing, electroplating, electroless plating, chemical plating or foiling. For example, the substrate body 28 is defined with a first surface 28a and a second surface 28b opposite to each other, so that the substrate body 28 is disposed on the second side 20b of the first supporting structure 20 with its first surface 28a through the supporting members 26, and the antenna body 27, 29 has a first antenna layer 271, 291 and a second antenna layer 272, 292 separated from each other and correspondingly disposed on the first surface 28a and the second surface 28b. Specifically, the first antenna layer 271, 291 serves as an inner antenna, and the second antenna layer 272, 292 serves as an outer antenna.

[0110] In addition, the first antenna layer 271, 291 and the second antenna layer 272, 292 transmit signals in a coupled manner. For example, the first antenna layer 271, 291 and the second antenna layer 272, 292 can generate radiation energy by alternating voltage, alternating current or radiation change, and the radiation energy is an electromagnetic field, so that the first antenna layer 271, 291 and the second antenna layer 272, 292 can be electromagnetically coupled to each other, so that the antenna signal can be transmitted between the first antenna layer 271, 291 and the second antenna layer 272, 292. Specifically, the first antenna layers 271, 291 also electromagnetically couple the first antenna feed line 270 and the second antenna feed line 290, so that the antenna signal can be transmitted (such as sending or receiving) between the antenna bodies 27, 29 and the first circuit layer 201, so the antenna module 2b and the first supporting structure 20 form an antenna assembly 2', and the antenna bodies 27, 29 and the first antenna feed line 270 and the second antenna feed line 290 can be regarded as antenna structures.

[0111] In addition, the first surface 28a of the substrate body 28 has a plurality of recesses 280, 281 with different depths H1, H2, which are respectively arranged corresponding to the antenna bodies 27, 29, so that the first antenna layer 271, 291 is formed on the bottom surface of the recesses 280, 281. The larger the distance D1, D2 between the first antenna layer 271, 291 and the first antenna feed line 270 and the second antenna feed line 290, the wider the bandwidth, which is conducive to adjusting the radiation frequency. Therefore, compared with the antenna layer formed on the first surface 28a, the antenna layer formed in the recesses 280, 281 will increase the distance D1, D2 between the first antenna layer 271, 291 and the first antenna feed line 270 and the second antenna feed line 290. On the other hand, the shorter the distance L1, L2 between the first antenna layer 271, 291 and the second antenna layer 272, 292, the higher the frequency. Therefore, the depth H1, H2 of the recess 280, 281 can be adjusted as needed to adjust the distance L1, L2 between the first antenna layer 271, 291 and the second antenna layer 272, 292, so as to obtain the required multiple frequencies.

[0112] In addition, the support member 26 is in the shape of a column or a wall, which is connected to the first circuit layer 201 in the openings 900 but is not connected to the first circuit layer 201 by signals, so the support member 26 is only used for support and does not have a signal transmission function. For example, the support member 26 can be an insulating material or a conductive material such as solder, without special restrictions.

[0113] like Figure 2F As shown, along Figure 2E The cutting path S shown is used for performing a singulation process to complete the manufacturing method of the electronic package 2 .

[0114] In this embodiment, the electronic package 2 can be connected to an electronic device such as a circuit board (not shown) via the conductive elements 24, and the antenna module 2b utilizes the first antenna feed line 270 and the second antenna feed line 290 via the conductor 23 and the second supporting structure 22 to receive / transmit antenna signals to the electronic element 21.

[0115] This embodiment mainly improves the overall radiation efficiency of the antenna structure of the electronic package 2 (or the antenna component 2') by using a low dielectric constant structure between the first antenna layer 271, 291 and the first antenna feed line 270 and the second antenna feed line 290, which includes air gaps A1, A2 (which are composed of an open area A and recesses 280, 281) as signal transmission media.

[0116] In addition, by designing the recesses 280 and 281, the height of the air gaps A1 and A2 can be adjusted, that is, the distances L1 and L2 of the electromagnetic coupling between the first antenna layer 271 and 291 and the second antenna layer 272 and 292 can be adjusted to generate 5G millimeter waves of different frequencies, so that the antenna structure of the electronic package 2 (or the antenna assembly 2') can transmit different antenna signals as required, for example, the first antenna feed line 270, the first antenna layer 271 and the second antenna layer 272 are used as the low-frequency antenna part 27a, and the second antenna feed line 290, the first antenna layer 291 and the second antenna layer 292 are used as the high-frequency antenna part 29a. Specifically, the electronic component 21 transmits and receives 5G millimeter wave signals of 28 GHz frequency via the low-frequency antenna part 27a; or, the electronic component 21 transmits and receives 5G millimeter wave signals of 60 GHz frequency via the high-frequency antenna part 29a.

[0117] Therefore, compared to the prior art, the antenna module 2b of this embodiment is designed to include antenna parts with multiple frequencies (the low-frequency antenna part 27a and the high-frequency antenna part 29a), so that a single electronic package 2 can meet the needs of radio frequency products with multiple frequencies, thereby replacing multiple package modules 2a corresponding to different frequencies, thereby reducing the product size and helping the electronic package 2 (or the antenna component 2') to meet the needs of miniaturization.

[0118] In addition, the present invention stacks the antenna module 2b on the first supporting structure 20, so there is no need to increase the layout area on the first supporting structure 20, so that the manufacturing method of this embodiment can produce antennas of various frequencies (i.e., millimeter wave antennas) under the predetermined size of the first supporting structure 20, thereby enabling the electronic package 2 (or the antenna component 2') to meet the requirements of miniaturization.

[0119] FIG. 3A to FIG. 3E Schematic cross-sectional view of a method for manufacturing a second embodiment of an electronic package 3 of the present invention. This embodiment is substantially the same as the first embodiment, so only the differences are described below, and the similarities are not repeated.

[0120] like Figure 3A As shown, a first supporting structure 30 provided with a plurality of conductors 33 and a second supporting structure 32 provided with electronic components 21 are provided.

[0121] The first supporting structure 30 has a first side 30a and a second side 30b opposite to each other, and an insulating protective layer 302 such as a solder mask is formed on the first side 30a and the second side 30b. In the present embodiment, the first supporting structure 30 is a package substrate, which includes a circuit structure with a core layer or a circuit structure without a core layer, and the circuit structure includes an insulator 300 such as a dielectric material and a first circuit layer 301 formed on the insulator 300, such as a fan-out type RDL, and the first circuit layer 301 has a first antenna feed line 270 and a second antenna feed line 290, so that the first supporting structure 30 can be regarded as an antenna substrate. Specifically, the dielectric material is, for example, prepreg (PP), polyimide (PI), epoxy resin or glass fiber, and the material forming the first circuit layer 301 is metal, such as copper. It should be understood that the first supporting structure 30 may also be other carriers for supporting chips, such as organic plates, wafers, or other carriers with metal routing, and is not limited to the above. Figure 2A The carrier 9 is shown.

[0122] In addition, the insulating protection layer 302 is formed with a plurality of openings 302 a so that a portion of the surface of the first circuit layer 301 is exposed through the openings 302 a .

[0123] The second supporting structure 32 is a package substrate, which includes a circuit structure with a core layer or a circuit structure without a core layer, and the circuit structure includes an insulator 320 such as a dielectric material and a second circuit layer 321 formed on the insulator 320, such as a fan-out RDL. Specifically, the dielectric material is, for example, prepreg (PP), polyimide (PI), epoxy resin or glass fiber, and the material forming the second circuit layer 321 is metal, such as copper. It should be understood that the second supporting structure 32 can also be other carriers for carrying chips, such as organic boards, wafers, or other carriers with metal routing, and is not limited to the above.

[0124] The electronic component 21 is electrically connected to the second supporting structure 32 by means of a flip chip method through its electrode pads 210 via a plurality of conductive bumps 313 made of, for example, solder.

[0125] The conductor 33 is formed on the first side 30a of the first supporting structure 30. In this embodiment, the conductor 33 is in the form of various materials, including a core block 330 and a conductive material 331 covering the core block 330, wherein the core block 330 is an insulating material such as a plastic ball or a metal material such as a copper ball, and the conductive material 331 is a solder material such as nickel tin, tin-lead or tin-silver, but not limited thereto. It should be understood that the conductor 33 can also be a passive component or a conductive material such as a solder. Figure 2A Single material form shown.

[0126] like Figure 3B As shown, the first supporting structure 30 is stacked on the second supporting structure 32 via the conductors 33, and the conductive material 331 is reflowed to fix the first supporting structure 30 to the second supporting structure 32 to form a packaging module 3a, and the electronic component 21 is located between the first supporting structure 30 and the second supporting structure 32.

[0127] In this embodiment, the first supporting structure 30 is electrically connected to the second supporting structure 32 via the conductors 33 .

[0128] like Figure 3C As shown, a coating layer 25 is formed between the first supporting structure 30 and the second supporting structure 32 to cover the conductors 33 , the conductive bumps 313 and the electronic element 21 .

[0129] In this embodiment, if Figure 3C-1 As shown, the underfill 35 may be formed between the second supporting structure 32 and the electronic component 21 to cover the conductive bumps 313 , and then the covering layer 25 may be formed to cover the conductors 33 , the underfill 35 and the electronic component 21 .

[0130] like Figure 3D As shown, continued Figure 3C In the manufacturing process shown, the antenna module 2b is stacked on the first supporting structure 30 via a plurality of supporting members 26, and the positions of the first antenna layers 271, 291 correspond to the positions of the first antenna feeding circuit 270 and the second antenna feeding circuit 290, so that the antenna signal can be transmitted between the antenna body 27, 29 and the first circuit layer 301, wherein the antenna module 2b and the first supporting structure 30 are regarded as the antenna component 3', and the first antenna feeding circuit 270 and the second antenna feeding circuit 290, the first antenna layer 271, 291 and the second antenna layer 272, 292 are regarded as the antenna structure.

[0131] In this embodiment, the support members 26 are connected to the first circuit layers 301 in the openings 302 a but are not signal-connected to the first circuit layers 301 . Therefore, the support members 26 are only used for support but do not have a signal transmission function.

[0132] like Figure 3E As shown, a plurality of conductive elements 24 such as solder balls are formed on the second supporting structure 32, and along the Figure 3D The cutting path S shown is used for performing a singulation process to complete the manufacturing method of the electronic package 3 .

[0133] In this embodiment, the air gaps A1 , A2 are used as signal transmission media between the first antenna layers 271 , 291 and the first antenna feeding circuit 270 and the second antenna feeding circuit 290 , thereby improving the overall radiation efficiency of the antenna assembly 3 ′ of the electronic package 3 .

[0134] In addition, the height of the air gap A1, A2 is adjusted through the design of the recesses 280, 281, that is, the distance L1, L2 of the electromagnetic coupling between the first antenna layer 271, 291 and the second antenna layer 272, 292 is adjusted to generate 5G millimeter waves of different frequencies, so that the antenna structure of the electronic package 3 (or the antenna component 3') can transmit different antenna signals as required. Therefore, compared with the prior art, the present embodiment uses the design of the antenna module 2b including antenna parts of multiple frequencies (the low-frequency antenna part 27a and the high-frequency antenna part 29a) to enable a single electronic package 3 to meet the needs of radio frequency products of multiple frequencies, thereby replacing multiple package modules 3a corresponding to different frequencies, thereby reducing the product size, so as to facilitate the electronic package 2 (or the antenna component 3') to meet the needs of miniaturization.

[0135] In addition, in this embodiment, the antenna module 2b is stacked on the first supporting structure 30, so there is no need to increase the layout area on the first supporting structure 30, so that the manufacturing method of the present invention can produce antennas of various frequencies (i.e., millimeter wave antennas) under the predetermined size of the first supporting structure 30, thereby enabling the electronic package 3 to meet the requirements of miniaturization.

[0136] FIG. 4A to FIG. 4C It is a cross-sectional schematic diagram of a method for manufacturing the antenna module 2b of the present invention.

[0137] like Figure 4A As shown, a substrate body 28 is provided, which has a first surface 28a and a second surface 28b opposite to each other, and a second antenna layer 272, 292 is formed on the second surface 28b of the substrate body 28 by electroplating metal material, so as to serve as an external antenna.

[0138] like Figure 4B As shown, a plurality of recesses 280 , 281 with different depths H1 , H2 are formed on the first surface 28 a of the substrate body 28 by, for example, etching.

[0139] like Figure 4CAs shown, the first antenna layers 271 , 291 are formed on the bottom surfaces of the recesses 280 , 281 by electroplating metal material to serve as internal antennas, and a plurality of support members 26 are formed in the peripheral area on the first surface 28 a of the substrate body 28 .

[0140] It should be understood that there are many ways to form the antenna layer, not limited to the above, and there are also many ways to form the recesses 280, 281, not limited to the above. For example, the recesses 280, 281 may be formed first, and then the second antenna layer 272, 292 may be manufactured.

[0141] The present invention further provides an electronic package 2, 3, comprising: a first supporting structure 20, 30 having a first antenna feeding line 270 and a second antenna feeding line 290, and an antenna module 2b.

[0142] The antenna module 2b is disposed on the first supporting structure 20, 30, and the antenna module 2b includes a substrate body 28 having a first surface 28a and a second surface 28b opposite to each other, so that the substrate body 28 is disposed on the first supporting structure 20, 30 with its first surface 28a, wherein the first surface 28a of the substrate body 28 has a plurality of recesses 280, 281 with different depths H1, H2, so that a first antenna layer 271, 291 is formed in the plurality of recesses 280, 281, and the second surface 28b of the substrate body 28 has a second antenna layer 272, 292 configured corresponding to the first antenna layer 271, 291, so that the first antenna layer 271, 291 electromagnetically couples the first antenna feeding line 270 and the second antenna feeding line 290 with the second antenna layer 272, 292.

[0143] In one embodiment, air gaps A1 and A2 are formed between the first antenna layer 271 and 292 and the first antenna feeding circuit 270 and the second antenna feeding circuit 290 .

[0144] In one embodiment, the antenna module 2 b is disposed on the first supporting structure 20 , 30 via a plurality of supporting members 26 .

[0145] In one embodiment, the electronic package 2, 3 further includes: a second supporting structure 22, 32 and at least one electronic component 21, and the first supporting structure 20, 30 has a first side 20a, 30a and a second side 20b, 30b opposite to each other, so that the antenna module 2b is arranged on the second side 20b, 30b of the first supporting structure 20, 30.

[0146] The second supporting structure 22 , 32 is stacked on the first side 20 a , 30 a of the first supporting structure 20 , 30 via a plurality of conductors 22 , 33 .

[0147] The electronic component 21 is disposed between the first supporting structure 20 , 30 and the second supporting structure 22 , 32 and is electrically connected to the conductors 23 , 33 .

[0148] In one embodiment, the first supporting structures 20 , 30 are electrically connected to the second supporting structures 22 , 32 via the conductors 23 , 33 .

[0149] In one embodiment, the first antenna feeding circuit 270 and the second antenna feeding circuit 290 are electrically connected to the conductors 23 and 33 to be electrically connected to the electronic component 21 .

[0150] In one embodiment, the electronic package 2 , 3 further includes a coating layer 25 formed between the first supporting structure 20 , 30 and the second supporting structure 22 , 32 to coat the electronic component 21 .

[0151] In one embodiment, the electronic package 2 , 3 further includes a plurality of conductive elements 24 formed on the second supporting structure 22 , 32 , which are located on different sides of the second supporting structure 22 , 32 from the conductive body 23 , 33 .

[0152] In summary, the electronic package and its manufacturing method and the antenna assembly and its manufacturing method of the present invention use air space between the first antenna layer and the antenna feeding line as a signal transmission medium to improve the overall radiation efficiency of the antenna structure of the electronic package (or the antenna assembly).

[0153] In addition, the present invention adjusts the electromagnetic coupling distance between the first antenna layer and the second antenna layer to generate different frequencies through the design of the multiple recesses of different depths, so that the antenna of the electronic package (or the antenna component) can transmit different antenna signals as needed. Therefore, the single electronic package of the present invention can meet the needs of radio frequency products of multiple frequencies to replace multiple packaging modules corresponding to different frequencies, thereby reducing the product size, so as to help the electronic package (or the antenna component) meet the needs of miniaturization.

[0154] In addition, by stacking the antenna module on the first supporting structure, there is no need to increase the layout area on the first supporting structure, so antennas of various frequencies can be manufactured within the predetermined first supporting structure size, so that the electronic package (or the antenna component) meets the requirements of miniaturization.

[0155] The above embodiments are only used to illustrate the principles and effects of the present invention, and are not used to limit the present invention. Any person skilled in the art may modify the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the claims.

Claims

1. An electronic package, characterized in that: include: A first supporting structure having a plurality of antenna feed lines; as well as An antenna module is arranged on the first supporting structure, and the antenna module includes a substrate body having a first surface and a second surface relative to each other, so that the substrate body is arranged on the first supporting structure with its first surface, wherein the first surface of the substrate body has a plurality of recesses with different depths, so that a first antenna layer is formed in the plurality of recesses, and the second surface of the substrate body has a second antenna layer configured corresponding to the first antenna layer, so that the first antenna layer electromagnetically couples the antenna feed line and the second antenna layer.

2. The electronic package according to claim 1, wherein: An air gap is formed between the first antenna layer and the antenna feeding line.

3. The electronic package according to claim 1, wherein: The antenna module is arranged on the first supporting structure via a supporting member.

4. The electronic package according to claim 1, wherein: The first supporting structure has two opposite sides, so that the antenna module is arranged on one side of the first supporting structure, and the electronic package further includes: A second supporting structure, which is stacked on the other side of the first supporting structure via a plurality of electrical conductors; and At least one electronic component is disposed between the first supporting structure and the second supporting structure and is electrically connected to the conductor.

5. The electronic package as claimed in claim 4, characterized in that The first supporting structure is electrically connected to the second supporting structure via the conductor.

6. The electronic package as claimed in claim 4, characterized in that The antenna feeding circuit is electrically connected to the conductor so as to be electrically conducted to the electronic component.

7. The electronic package according to claim 4, characterized in that: The electronic package also includes a covering layer formed between the first supporting structure and the second supporting structure to cover the electronic element.

8. The electronic package as claimed in claim 4, characterized in that The electronic package also includes a plurality of conductive elements formed on the second supporting structure, and the conductive elements and the conductor are respectively located on different sides of the second supporting structure.

9. A method for manufacturing an electronic package, characterized in that: include: Providing a substrate body having a first surface and a second surface opposite to each other, and a second antenna layer is provided on the second surface; Forming a plurality of recesses of different depths on the first surface of the substrate body; forming a first antenna layer in the plurality of recesses so that the first antenna layer is electromagnetically coupled to the second antenna layer; as well as The substrate body is disposed with its first surface on a first supporting structure having a plurality of antenna feeding lines, so that the first antenna layer is electromagnetically coupled to the antenna feeding lines.

10. The method for manufacturing an electronic package as claimed in claim 9, wherein: An air gap is formed between the first antenna layer and the antenna feeding line.

11. The method for manufacturing an electronic package as claimed in claim 9, wherein: The substrate body is arranged on the first supporting structure via a supporting member.

12. The method for manufacturing an electronic package as claimed in claim 9, wherein: The plurality of recesses are formed on the first surface of the substrate body by etching.

13. The method for manufacturing an electronic package as claimed in claim 9, wherein: The first supporting structure has two opposite sides, so that the substrate body is disposed on one side of the first supporting structure, and the manufacturing method further includes: The second supporting structure is stacked on the other side of the first supporting structure via a plurality of conductors, and at least one electronic component is arranged between the first supporting structure and the second supporting structure and electrically connected to the conductors.

14. The method for manufacturing an electronic package as claimed in claim 13, wherein: The first supporting structure is electrically connected to the second supporting structure via the conductor.

15. The method for manufacturing an electronic package as claimed in claim 13, wherein: The antenna feeding circuit is electrically connected to the conductor so as to be electrically conducted to the electronic component.

16. The method for manufacturing an electronic package as claimed in claim 13, wherein: The manufacturing method further comprises forming a coating layer covering the electronic component between the first supporting structure and the second supporting structure.

17. The method for manufacturing an electronic package as claimed in claim 13, wherein: The manufacturing method further comprises arranging a plurality of conductive elements on the second supporting structure, wherein the conductive elements and the conductive body are respectively located at different sides of the second supporting structure.

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