A packaging manufacturing device for multi-chip integrated circuits

Abstract

The present invention discloses a packaging manufacturing device for multi-chip integrated circuits, including a working turntable, the bottom end of the working turntable is rotatably connected to a working plate, the center position of the top surface of the working plate is fixedly connected to a motor, the output end of the motor is fixedly connected to the working turntable, and the top surface of the working plate is fixedly connected to a first conveyor belt, a multi-station conveyor belt, a glue filling machine, a second conveyor belt, a packaging mechanism and a manual inspection table in a counterclockwise direction around the outer position of the working turntable. The present invention slides the sliding ring downward, so that the sliding ring drives the first heating rack and the second heating rack to move downward. The rotating ring and the threaded outer thread are threadedly connected, so that when the sliding ring and the rotating ring slide down for the last short distance, the sliding ring slides down and remains without rotating, and the cleaning shovel on the slide rail rotates around the trajectory of the first heating rack, so that the thermosetting glue overflowing from the circuit bottom plate and the circuit top plate can be removed and cleaned.

Description

Technical Field

[0001] The present invention relates to the field of chip technology, in particular to packaging and manufacturing equipment for multi-chip integrated circuits. Background Art

[0002] The shell used to install integrated circuit chips plays the role of placing, fixing, sealing, protecting the chips and enhancing the electrical and thermal performance. It is also a bridge between the internal world of the chip and the external circuit. When installing the chip, place the circuit base plate, and then place multiple circuit chips inside the circuit base plate. Use a glue dispenser to apply thermosetting glue to the outside of the circuit chip, and finally place the circuit top plate. The thermosetting glue is encapsulated through a series of processes such as pressing and heating.

[0003] In the prior art, such as the Chinese patent application: CN114256109A "A packaging manufacturing device for multi-chip integrated circuits", includes a base; a turntable is rotatably provided on the top of the base; a mounting frame is fixedly installed on the top rear side of the base by bolts; a loading trough is fixedly provided on the top right side of the base by bolts; a fixing frame is fixedly installed in a circular array shape on the top of the turntable by bolts; by providing the base, turntable, mounting frame, loading trough, fixing frame and fixing rod, the movement distance of the packaging device can be adjusted according to chips of different thicknesses, so as to quickly match the packaging process of chips of different thicknesses; the entire packaging process can be automatically completed, which can greatly improve the speed and efficiency of chip packaging.

[0004] However, in the prior art, during the packaging process, the circuit bottom plate and the circuit top plate are coated with thermosetting adhesive but have not yet solidified. When the packaging is squeezed and pressed, the distance between the circuit bottom plate and the circuit top plate is reduced by pressing, and the unsolidified thermosetting adhesive will be squeezed out of the gap between the circuit bottom plate and the circuit top plate. The thermosetting adhesive flowing to the circuit bottom plate and the circuit top plate will affect the appearance of the cost, and the thermosetting adhesive flowing onto the bottom plate will affect the detachment of the circuit bottom plate. Summary of the invention

[0005] The object of the present invention is to provide a packaging manufacturing device for multi-chip integrated circuits to solve the problem raised in the above-mentioned background technology that during the packaging process, the circuit bottom plate and the circuit top plate are coated with thermosetting glue but have not yet solidified. When the packaging is squeezed and pressed, the distance between the circuit bottom plate and the circuit top plate is reduced by pressing, and the unsolidified thermosetting glue will be squeezed out of the gap between the circuit bottom plate and the circuit top plate. The thermosetting glue flowing to the circuit bottom plate and the circuit top plate will affect the appearance of the cost, and the thermosetting glue flowing onto the bottom plate will affect the detachment of the circuit bottom plate.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a packaging manufacturing device for multi-chip integrated circuits, comprising a working turntable, the bottom end of the working turntable is rotatably connected to a working plate, a motor is fixedly connected to the center position of the top surface of the working plate, the output end of the motor is fixedly connected to the working turntable, and the top surface of the working plate is fixedly connected to a first conveyor belt, a multi-station conveyor belt, a glue filling machine, a second conveyor belt, a packaging mechanism and a manual inspection table in sequence in a counterclockwise direction around the outer position of the working turntable;

[0007] The packaging mechanism includes a base, the base is fixedly connected to the working plate, the top surface of the base is fixedly connected to a cylinder, the output end of the cylinder passes through the top wall of the base and is fixedly connected to a connecting tube, the bottom end of the connecting tube is provided with a pressing assembly, the pressing assembly includes a connecting rod, the top surface of the connecting rod is fixedly connected to a fixing plate, a spring is fixedly connected between the top surface of the fixing plate and the inner wall of the connecting tube, the bottom end of the connecting rod is connected to a pressing plate, and the interior of the connecting tube is fixedly connected to a pressing baffle at a position above the fixing plate;

[0008] The outer wall of the connecting cylinder is provided with a cleaning assembly, and the cleaning assembly includes a sliding ring, the outer wall of the sliding ring is fixedly connected with four L-shaped frames, the bottom surfaces of the four L-shaped frames are fixedly connected with the second heating frame, the top surface of the sliding ring is rotatably connected with a rotating ring, the outer wall of the rotating ring is slidably connected with two slide rails, the bottom surfaces of the slide rails are slidably connected with sliding rods, the sliding rods are slidably connected to the second heating frame, the bottom end of the sliding rods is slidably connected with a cleaning shovel, and the bottom end of the cleaning shovel is slidably connected with the first heating frame, the outer wall of the connecting cylinder is fixedly connected with a threaded external thread, and the threaded external thread is threadedly connected to the rotating ring. The overall general process is that the first conveyor belt The circuit board is transported to the side of the working turntable, and the working turntable rotates to drive the circuit board to the position of the multi-station conveyor belt. The multi-station conveyor belt transports the chip on its surface to the inside of the circuit board. The working turntable rotates to drive the circuit board and the chip to the position of the glue filling machine to apply glue to the side of the circuit board. The working turntable rotates to drive the circuit board to the position of the second conveyor belt. The second conveyor belt transports the circuit top board on its surface to the top of the circuit board on the side of the working turntable. The working turntable transports the circuit board and the circuit top board to the packaging mechanism position. After the circuit board and the circuit top board are packaged, they are transported to the position of the manual inspection table, and the packaging is manually inspected to see if it is completed. The circuit board and the circuit top board that are not fully packaged are recycled; packaging The specific function of the mechanism is to start the cylinder to press the connecting cylinder downward, and the pressing plate at the lower end of the connecting cylinder first contacts the top surface of the circuit top plate. Since it is not compressed at this time, the pressure of the pressing plate on the circuit top plate is relatively small, and at the same time, the connecting rod slides upward under pressure. When the connecting rod slides to the fixing plate and contacts the pressing baffle, the pressing plate is not only subjected to the smaller elastic force of the spring, but also to the larger force of the pressing baffle on the spring, so that the pressing plate presses the circuit top plate to move downward. When the circuit top plate and the circuit bottom plate are tightly attached to each other, the adhesion of the thermosetting glue to the circuit bottom plate and the circuit top plate is also increased, thereby achieving the fixation between the circuit bottom plate and the circuit top plate. At the same time, the sliding ring is slid downward to drive the sliding ring to drive the first heating frame and the second heating frame to move downward, so that the first heating frame and the second heating frame can be fixed together. The first heating rack and the second heating rack move to the sealing position between the circuit bottom plate and the circuit top plate. When the sliding ring slides to the bottom end of the connecting tube, the rotating ring and the threaded outer thread are threadedly connected, so that when the sliding ring and the rotating ring slide down the last short distance, the sliding ring slides down and remains without rotating, the rotating ring slides down and rotates, and the rotation of the rotating ring drives the slide rail to rotate. The cleaning shovel on the slide rail rotates around the track of the first heating rack to scrape and clean the thermosetting adhesive overflowed from the circuit bottom plate and the circuit top plate. In addition, the length and width of the first heating rack are inconsistent, and the slide rail slides with the sliding rod. When the cleaning shovel slides to the length direction of the first heating rack, the sliding rod moves outward, and when the cleaning shovel slides to the width direction of the first heating rack, the sliding rod moves inward.

[0009] Preferably, a transmission assembly is disposed inside the connecting cylinder, and the transmission assembly includes two rotating shafts.

[0010] Preferably, the rotating shaft is fixedly connected to the inner side wall of the connecting cylinder, and the outer side walls at both ends of the connecting cylinder are rotatably connected to transmission wheels.

[0011] Preferably, a transmission belt is transmission-connected between the two transmission wheels on the same side of the two rotating shafts, and a first connecting plate and a second connecting plate are respectively fixedly connected between the two transmission belts.

[0012] Preferably, the first connecting plate is fixedly connected to the connecting rod, and both ends of the second connecting plate pass through the outer wall of the connecting cylinder and are fixedly connected to the sliding ring. When the pressing plate and the circuit top plate are squeezed to cause the connecting rod to move upward, the connecting rod drives the connected first connecting plate to move upward, and the first connecting plate drives the transmission belt to move, and the transmission belt drives the fixedly connected transmission wheel to rotate, and the two transmission wheels rotate around the rotating shaft. The first connecting plate on one side moves up with the transmission belt, and the second connecting plate on the other side moves down with the transmission belt, and the second connecting plate drives the sliding ring on the outside to slide downward, thereby increasing the driving force for the cleaning component.

[0013] Preferably, a robotic arm is provided on the outer side of the first conveyor belt and the outer side of the second conveyor belt, and the feet of the robotic arm are fixedly connected to the working plate. A robotic arm is provided on the outer side of the first conveyor belt and the second conveyor belt. The robotic arm is a mechanical wall with a clamp at one end. The circuit bottom plate is clamped by the robotic arm and placed in a fixed position, which improves the precision of the subsequent glue dispensing process of the glue filling machine. The circuit top plate is clamped by the robotic arm so that the sealing parts of the circuit bottom plate and the circuit top plate can be aligned.

[0014] Preferably, a circuit base plate is arranged on the upper side of the first conveyor belt, and there are multiple circuit base plates; a chip is arranged on the upper side of the multi-station conveyor belt, and there are multiple chips; a circuit top plate is arranged on the upper side of the second conveyor belt, and there are multiple circuit top plates; both the first conveyor belt and the second conveyor belt are single-station conveyor belts; within one working time, the first conveyor belt transports a circuit base plate to the working turntable, and the second conveyor belt transports a circuit top plate to the circuit base plate, and the multi-station conveyor belt can transport multiple chips to the inside of the same circuit base plate.

[0015] Preferably, a storage groove is provided between the manual inspection table and the first conveyor belt, the bottom end of the storage groove is fixedly connected to a storage box, the top end of the storage groove is located on the outside of the working turntable, and the completely packaged finished products are taken out from the working turntable through manual inspection at the manual inspection table and placed in the top opening of the storage groove, and then slide into the storage box through the storage groove, thereby greatly shortening the time for removing the finished products from the working turntable.

[0016] Preferably, the outer side wall of the sliding ring is fixedly connected to a battery protective shell, a battery is arranged inside the battery protective shell, and electric wires are connected between the first heating rack and the second heating rack and the battery protective shell. In order to shorten the coagulation speed of the thermosetting adhesive between the circuit bottom plate and the circuit top plate, the battery in the battery protective shell is started, and the first heating rack and the second heating rack are powered on to generate heat, and the heat generated accelerates the coagulation of the thermosetting adhesive.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. In the present invention, the sliding ring is slid downward to drive the first heating rack and the second heating rack to move downward. The rotating ring and the threaded outer thread are threadedly connected, so that when the sliding ring and the rotating ring slide down for the last short distance, the sliding ring slides down and remains without rotating, and the rotating ring slides down and rotates. The rotation of the rotating ring drives the slide rail to rotate, and the cleaning shovel on the slide rail rotates around the track of the first heating rack, thereby achieving the effect of scraping and cleaning the thermosetting adhesive overflowed from the circuit bottom plate and the circuit top plate.

[0019] 2. In the present invention, when the connecting rod moves upward due to the squeezing between the pressing plate and the circuit top plate, the connecting rod drives the connected first connecting plate to move upward, the first connecting plate drives the transmission belt to move, the transmission belt drives the fixedly connected transmission wheel to rotate, the two transmission wheels rotate around the rotating shaft, the first connecting plate on one side moves upward with the transmission belt, and the second connecting plate on the other side moves downward with the transmission belt, the second connecting plate drives the sliding ring on the outside to slide downward, thereby increasing the driving force for the cleaning component.

[0020] 3. In the present invention, the pressing plate and the circuit top plate are squeezed by the cylinder, and the pressing plate presses the circuit top plate to move downward. When the circuit top plate and the circuit bottom plate are in close contact, the adhesion of the thermosetting glue to the circuit bottom plate and the circuit top plate is also increased. At the same time, the battery in the battery protective shell is started, and the first heating rack and the second heating rack are powered on to generate heat. The heat generated accelerates the condensation of the thermosetting glue, thereby achieving a fixing effect between the circuit bottom plate and the circuit top plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the overall structure of a packaging and manufacturing device for multi-chip integrated circuits of the present invention;

[0022] Figure 2 This is a schematic diagram of the overall bottom structure of a packaging manufacturing device for multi-chip integrated circuits of the present invention;

[0023] Figure 3 This is a schematic structural diagram of a circuit bottom plate and a circuit top plate used in packaging and manufacturing equipment for multi-chip integrated circuits of the present invention;

[0024] Figure 4A top view of the overall structure of a packaging manufacturing device for multi-chip integrated circuits of the present invention;

[0025] Figure 5 A schematic diagram of the packaging structure of a packaging manufacturing device for multi-chip integrated circuits according to the present invention;

[0026] Figure 6 A schematic diagram of a cleaning assembly mechanism for a multi-chip integrated circuit packaging manufacturing device according to the present invention;

[0027] Figure 7 A side cross-sectional view of a connection barrel for a multi-chip integrated circuit packaging manufacturing device according to the present invention Figure 1 ;

[0028] Figure 8 A side cross-sectional view of a connection barrel for a multi-chip integrated circuit packaging manufacturing device according to the present invention Figure 2 .

[0029] In the figure:

[0030] 1. Working plate; 2. Motor; 3. Working turntable; 4. First conveyor belt; 5. Robotic arm; 6. Multi-station conveyor belt; 7. Glue filling machine; 8. Second conveyor belt;

[0031] 9. Packaging mechanism; 91. Base; 92. Cylinder; 93. Connecting tube; 931. Threaded outer thread; 932. Pressing baffle; 94. Cleaning assembly; 941. First heating rack; 942. Second heating rack; 943. L-shaped rack; 944. Sliding ring; 945. Battery protective shell; 946. Slide rail; 947. Rotating ring; 948. Sliding rod; 949. Cleaning shovel; 95. Pressing assembly; 951. Connecting rod; 952. Pressing plate; 953. Spring; 954. Fixed plate; 96. Transmission assembly; 961. Transmission wheel; 962. Transmission belt; 963. First connecting plate; 964. Second connecting plate; 965. Rotating shaft;

[0032] 10. Manual inspection table; 11. Storage slot; 12. Storage box; 13. Circuit bottom plate; 14. Chip; 15. Circuit top plate. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the implementation regulations described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] Example 1

[0035] reference Figure 1-8As shown: a packaging manufacturing device for multi-chip integrated circuits, including a working turntable 3, the bottom end of the working turntable 3 is rotatably connected to a working plate 1, a motor 2 is fixedly connected to the center of the top surface of the working plate 1, the output end of the motor 2 is fixedly connected to the working turntable 3, the top surface of the working plate 1 is fixedly connected to a first conveyor belt 4, a multi-station conveyor belt 6, a glue filling machine 7, a second conveyor belt 8, a packaging mechanism 9 and a manual inspection table 10 in a counterclockwise direction around the outer position of the working turntable 3; the packaging mechanism 9 includes a base 91, the base 91 is fixedly connected to the working plate 1, the top surface of the base 91 is fixedly connected to a cylinder 92, the output end of the cylinder 92 passes through the top wall of the base 91 and is fixedly connected to a connecting tube 93 A pressing assembly 95 is provided at the bottom end of the connecting cylinder 93, and the pressing assembly 95 includes a connecting rod 951, and a fixing plate 954 is fixedly connected to the top surface of the connecting rod 951, and a spring 953 is fixedly connected between the top surface of the fixing plate 954 and the inner wall of the connecting cylinder 93, and a pressing plate 952 is connected to the bottom end of the connecting rod 951, and a pressing baffle 932 is fixedly connected to the upper position of the fixing plate 954 in the interior of the connecting cylinder 93; a cleaning assembly 94 is provided on the outer wall of the connecting cylinder 93, and the cleaning assembly 94 includes a sliding ring 944, and four L-shaped frames 943 are fixedly connected to the outer wall of the sliding ring 944, and the bottom surfaces of the four L-shaped frames 943 are fixedly connected to the second heating frame 942, and the top surface of the sliding ring 944 A rotating ring 947 is rotatably connected, and the outer side wall of the rotating ring 947 is slidably connected to two slide rails 946. The bottom surfaces of the slide rails 946 are slidably connected to sliding rods 948. The sliding rods 948 are slidably connected to the second heating frame 942. The bottom end of the sliding rod 948 is slidably connected to a cleaning shovel 949. The bottom end of the cleaning shovel 949 is slidably connected to the first heating frame 941. The outer side wall of the connecting tube 93 is fixedly connected to a threaded external thread 931. The threaded external thread 931 is threadedly connected to the rotating ring 947. The overall process is as follows: the first conveyor belt 4 transports the circuit base plate 13 on its surface to the side of the working turntable 3. The working turntable 3 rotates to drive the circuit base plate 13 to the position of the multi-station conveyor belt 6. The conveyor belt 6 transports the chip 14 on its surface to the inside of the circuit bottom plate 13, the working turntable 3 rotates to drive the circuit bottom plate 13 and the chip 14 to the position of the glue filling machine 7 to apply glue to the side of the circuit bottom plate 13, the working turntable 3 rotates to drive the circuit bottom plate 13 to the position of the second conveyor belt 8, the second conveyor belt 8 transports the circuit top plate 15 on its surface to the top of the circuit bottom plate 13 on the side of the working turntable 3, the working turntable 3 transports the circuit bottom plate 13 and the circuit top plate 15 to the packaging mechanism 9 position, the circuit bottom plate 13 and the circuit top plate 15 are packaged and then transported to the position of the manual inspection table 10, and the packaging is manually inspected to see if it is completed, and the circuit bottom plate 13 and the circuit top plate 15 that are not completely packaged are recycled;The specific function of the packaging mechanism 9 is to start the cylinder 92 to press the connecting tube 93 downward, and the pressing plate 952 at the lower end of the connecting tube 93 first contacts the top surface of the circuit top plate 15. Since the spring 953 is not compressed at this time, the pressure of the pressing plate 952 on the circuit top plate 15 is relatively small, and the connecting rod 951 slides upward under the pressure. When the connecting rod 951 slides to the fixing plate 954 and contacts the pressing baffle 932, the pressing plate 952 is not only subjected to the smaller elastic force of the spring 953, but also subjected to the larger force of the pressing baffle 932 on the spring 953, so that the pressing plate 952 presses the circuit top plate 15 to move downward. When the circuit top plate 15 and the circuit bottom plate 13 are tightly attached, the adhesion of the thermosetting glue to the circuit bottom plate 13 and the circuit top plate 15 is also increased, thereby achieving the fixation between the circuit bottom plate 13 and the circuit top plate 15. At the same time, the sliding ring 944 is slid downward, so that the sliding ring 944 drives the first heating frame 941 and the second heating frame 942 to move downward. The heating rack 941 and the second heating rack 942 move to the sealing portion between the circuit bottom plate 13 and the circuit top plate 15. When the sliding ring 944 slides to the bottom end of the connecting tube 93, the rotating ring 947 and the threaded outer thread 931 are threadedly connected, so that when the sliding ring 944 and the rotating ring 947 slide down for the last short distance, the sliding ring 944 slides down and remains without rotating, and the rotating ring 947 slides down and rotates. The rotating ring 947 rotates to drive the slide rail 946 to rotate. The cleaning shovel 949 on the slide rail 946 rotates around the track of the first heating rack 941 to remove and clean the hot setting glue overflowing from the circuit bottom plate 13 and the circuit top plate 15. In addition, the length and width of the first heating rack 941 are inconsistent, and the slide rail 946 slides with the sliding rod 948. When the cleaning shovel 949 slides to the length direction of the first heating rack 941, the sliding rod 948 moves outward, and when the cleaning shovel 949 slides to the width direction of the first heating rack 941, the sliding rod 948 moves inward. ;

[0036] Example 2

[0037] like Figure 7 and Figure 8As shown, a transmission assembly 96 is provided inside the connecting cylinder 93, and the transmission assembly 96 includes two rotating shafts 965, and the rotating shafts 965 are fixedly connected to the inner side wall of the connecting cylinder 93, and the outer side walls at both ends of the connecting cylinder 93 are rotatably connected with transmission wheels 961, and a transmission belt 962 is transmission-connected between the two transmission wheels 961 on the same side of the two rotating shafts 965, and a first connecting plate 963 and a second connecting plate 964 are respectively fixedly connected between the two transmission belts 962, and the first connecting plate 963 is fixedly connected to the connecting rod 951, and the two ends of the second connecting plate 964 pass through the outer side wall of the connecting cylinder 93 and are connected to the sliding ring 944. When the pressing plate 952 and the circuit top plate 15 are squeezed to cause the connecting rod 951 to move upward, the connecting rod 951 drives the connected first connecting plate 963 to move upward, the first connecting plate 963 drives the transmission belt 962 to move, the transmission belt 962 drives the fixedly connected transmission wheel 961 to rotate, and the two transmission wheels 961 rotate around the rotating shaft 965. The first connecting plate 963 on one side moves up with the transmission belt 962, and the second connecting plate 964 on the other side moves down with the transmission belt 962. The second connecting plate 964 drives the outer sliding ring 944 to slide downward, thereby increasing the driving force for the cleaning component 94.

[0038] Example 3

[0039] like Figure 1 As shown, a robot arm 5 is provided on the outer side of the first conveyor belt 4 and the outer side of the second conveyor belt 8, and the feet of the robot arm 5 are fixedly connected to the working plate 1. A robot arm 5 is provided on the outer side of the first conveyor belt 4 and the second conveyor belt 8, and a clamp is attached to one end of the robot arm 5. The robot arm 5 clamps the circuit bottom plate 13 and places it in a fixed position, thereby improving the precision of the subsequent glue dispensing process of the glue filling machine 7. The robot arm 5 also clamps the circuit top plate 15 so that the sealing parts of the circuit bottom plate 13 and the circuit top plate 15 can be aligned.

[0040] In addition, a circuit substrate 13 is arranged on the upper side of the first conveyor belt 4, and there are multiple circuit substrates 13. A chip 14 is arranged on the upper side of the multi-station conveyor belt 6, and there are multiple chips 14. A circuit top plate 15 is arranged on the upper side of the second conveyor belt 8, and there are multiple circuit top plates 15. The first conveyor belt 4 and the second conveyor belt 8 are both single-station conveyor belts. Within one working time, the first conveyor belt 4 transports one circuit substrate 13 to the working turntable 3, and the second conveyor belt 8 transports one circuit top plate 15 to the circuit substrate 13, and the multi-station conveyor belt 6 can transport multiple chips 14 to the inside of the same circuit substrate 13.

[0041] Example 4

[0042] like Figure 1As shown, a storage groove 11 is arranged between the manual inspection table 10 and the first conveyor belt 4, and a storage box 12 is fixedly connected to the bottom end of the storage groove 11, and the top end of the storage groove 11 is located on the outside of the working turntable 3. Through manual inspection by the manual inspection table 10, the completely packaged finished product is taken out from the working turntable 3 and placed in the top opening of the storage groove 11, and slides into the storage box 12 through the storage groove 11, so that the time for removing the finished product from the working turntable 3 is greatly shortened.

[0043] In addition, the outer wall of the sliding ring 944 is fixedly connected to a battery protective shell 945, and a battery is arranged inside the battery protective shell 945. Wires are connected between the first heating frame 941 and the second heating frame 942 and the battery protective shell 945. In order to shorten the coagulation speed of the thermosetting adhesive between the circuit bottom plate 13 and the circuit top plate 15, the battery in the battery protective shell 945 is started, and the first heating frame 941 and the second heating frame 942 are powered on to generate heat, and the heat generated accelerates the coagulation of the thermosetting adhesive.

[0044] The use method and working principle of the device are as follows: the first conveyor belt 4 transports the circuit substrate 13 on its surface to the side of the working turntable 3, one end of the mechanical arm 5 is provided with a clamp, and the circuit substrate 13 is clamped by the mechanical arm 5 and placed in a fixed position, the working turntable 3 rotates to drive the circuit substrate 13 to the position of the multi-station conveyor belt 6, the multi-station conveyor belt 6 transports the chip 14 on its surface to the inside of the circuit substrate 13, the working turntable 3 rotates to drive the circuit substrate 13 and the chip 14 to the position of the glue filling machine 7 to apply glue to the side of the circuit substrate 13, the working turntable 3 rotates to drive the circuit substrate 13 to the position of the second conveyor belt 8, the second conveyor belt 8 transports the circuit top plate 15 on its surface to the top of the circuit substrate 13 on the side of the working turntable 3, and the working turntable 3 transports the circuit substrate 13 When the circuit top plate 15 is moved to the packaging mechanism 9 position, the cylinder 92 is started to press the connecting tube 93 downward, and the pressing plate 952 at the lower end of the connecting tube 93 first contacts the top surface of the circuit top plate 15. Since the spring 953 is not compressed at this time, the pressure of the pressing plate 952 on the circuit top plate 15 is relatively small, and the connecting rod 951 slides upward under the pressure. When the connecting rod 951 slides to the fixing plate 954 and contacts the pressing baffle 932, the pressing plate 952 is not only subjected to the smaller elastic force of the spring 953, but also subjected to the larger force of the pressing baffle 932 on the spring 953, so that the pressing plate 952 presses the circuit top plate 15 to move downward. When the circuit top plate 15 and the circuit bottom plate 13 are in close contact, the adhesion of the thermosetting adhesive to the circuit bottom plate 13 and the circuit top plate 15 is also increased. When the pressure plate 952 and the circuit top plate 15 are squeezed and the connecting rod 951 moves upward, the connecting rod 951 drives the connected first connecting plate 963 to move upward, the first connecting plate 963 drives the transmission belt 962 to move, the transmission belt 962 drives the fixedly connected transmission wheel 961 to rotate, the two transmission wheels 961 rotate around the rotating shaft 965, the first connecting plate 963 on one side moves up with the transmission belt 962, and the second connecting plate 964 on the other side moves down with the transmission belt 962, the second connecting plate 964 drives the sliding ring 944 on the outside to slide downward, the sliding ring 944 drives the first heating frame 941 and the second heating frame 942 to move downward, so that the first heating frame 941 and the second heating frame 942 move to the circuit bottom plate 13 and the circuit top At the sealing portion between the plates 15, when the sliding ring 944 slides to the bottom end of the connecting tube 93, the rotating ring 947 and the threaded outer thread 931 are threadedly connected, so that when the sliding ring 944 and the rotating ring 947 slide down for the last short distance, the sliding ring 944 slides down and remains without rotating, and the rotating ring 947 slides down and rotates. The rotation of the rotating ring 947 drives the slide rail 946 to rotate, and the cleaning shovel 949 on the slide rail 946 rotates around the trajectory of the first heating frame 941 to remove and clean the thermosetting adhesive overflowed from the circuit bottom plate 13 and the circuit top plate 15. In addition, the length and width of the first heating frame 941 are inconsistent, and the slide rail 946 slides with the sliding rod 948. When the cleaning shovel 949 slides to the length direction of the first heating frame 941, the sliding rod 948 moves outward.When the cleaning shovel 949 slides to the width direction of the first heating rack 941, the sliding rod 948 moves inward to start the battery in the battery protection shell 945, and the first heating rack 941 and the second heating rack 942 are powered on to generate heat. The heat generated accelerates the coagulation of the thermosetting glue, and the circuit bottom plate 13 and the circuit top plate 15 are packaged and transported to the position of the manual inspection table 10. The packaging is manually inspected to see if it is completed. The fully packaged finished product is taken out from the work turntable 3 and placed in the top opening of the storage slot 11. It slides through the storage slot 11 to the inside of the storage box 12. The circuit bottom plate 13 and the circuit top plate 15 that are not fully packaged are recycled to form a closed process loop.

[0045] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A packaging manufacturing device for multi-chip integrated circuits, comprising a working turntable (3), characterized in that: The bottom end of the working turntable (3) is rotatably connected to a working plate (1); a motor (2) is fixedly connected to the center of the top surface of the working plate (1); an output end of the motor (2) is fixedly connected to the working turntable (3); and the top surface of the working plate (1) is fixedly connected in sequence in a counterclockwise direction around the outer position of the working turntable (3) to a first conveyor belt (4), a multi-station conveyor belt (6), a glue filling machine (7), a second conveyor belt (8), a packaging mechanism (9) and a manual inspection table (10); The packaging mechanism (9) comprises a base (91), wherein the base (91) is fixedly connected to the working plate (1), a cylinder (92) is fixedly connected to the top surface of the base (91), an output end of the cylinder (92) passes through the top wall of the base (91) and is fixedly connected to a connecting tube (93), a pressing assembly (95) is provided at the bottom end of the connecting tube (93), the pressing assembly (95) comprises a connecting rod (951), a fixing plate (954) is fixedly connected to the top surface of the connecting rod (951), a spring (953) is fixedly connected between the top surface of the fixing plate (954) and the inner wall of the connecting tube (93), the bottom end of the connecting rod (951) is connected to the pressing plate (952), and a pressing baffle (932) is fixedly connected to the inside of the connecting tube (93) at a position above the fixing plate (954); The outer wall of the connecting tube (93) is provided with a cleaning assembly (94), and the cleaning assembly (94) comprises a sliding ring (944), the outer wall of the sliding ring (944) is fixedly connected to four L-shaped frames (943), the bottom surfaces of the four L-shaped frames (943) are fixedly connected to a second heating frame (942), the top surface of the sliding ring (944) is rotatably connected to a rotating ring (947), the outer wall of the rotating ring (947) is slidably connected to two slide rails (946), and the sliding ring (944) is fixedly connected to the bottom surfaces of the four L-shaped frames (943) and the second heating frame (942) is fixedly connected to the bottom surfaces of the four L-shaped frames (943). The bottom surface of the rail (946) is slidably connected to a sliding rod (948), the sliding rod (948) is slidably connected to the second heating rack (942), the bottom end of the sliding rod (948) is slidably connected to a cleaning shovel (949), the bottom end of the cleaning shovel (949) is slidably connected to the first heating rack (941), the outer side wall of the connecting tube (93) is fixedly connected to a threaded external thread (931), and the threaded external thread (931) is threadedly connected to the rotating ring (947).

2. The packaging manufacturing equipment for multi-chip integrated circuits according to claim 1, characterized in that: A transmission assembly (96) is disposed inside the connecting cylinder (93), and the transmission assembly (96) comprises two rotating shafts (965).

3. The packaging manufacturing equipment for multi-chip integrated circuits according to claim 2, characterized in that: The rotating shaft (965) is fixedly connected to the inner side wall of the connecting cylinder (93), and the outer side walls at both ends of the connecting cylinder (93) are rotatably connected to transmission wheels (961).

4. The packaging manufacturing equipment for multi-chip integrated circuits according to claim 3, characterized in that: A transmission belt (962) is transmission-connected between the two transmission wheels (961) on the same side of the two rotating shafts (965), and a first connection plate (963) and a second connection plate (964) are respectively fixedly connected between the two transmission belts (962).

5. The packaging manufacturing equipment for multi-chip integrated circuits according to claim 4, characterized in that: The first connecting plate (963) is fixedly connected to the connecting rod (951), and both ends of the second connecting plate (964) penetrate the outer wall of the connecting tube (93) and are fixedly connected to the sliding ring (944).

6. The packaging manufacturing equipment for multi-chip integrated circuits according to claim 2, characterized in that: Mechanical arms (5) are provided on the outer sides of the first conveyor belt (4) and the second conveyor belt (8), and the feet of the mechanical arms (5) are fixedly connected to the working plate (1).

7. The packaging manufacturing equipment for multi-chip integrated circuits according to claim 1, characterized in that: A circuit bottom plate (13) is arranged on the upper side of the first conveyor belt (4), and the number of the circuit bottom plates (13) is plural; a chip (14) is arranged on the upper side of the multi-station conveyor belt (6), and the number of the chips (14) is plural; a circuit top plate (15) is arranged on the upper side of the second conveyor belt (8), and the number of the circuit top plates (15) is plural.

8. The packaging manufacturing equipment for multi-chip integrated circuits according to claim 1, characterized in that: A storage groove (11) is provided between the manual inspection platform (10) and the first conveyor belt (4), the bottom end of the storage groove (11) is fixedly connected to a storage box (12), and the top end of the storage groove (11) is located outside the working turntable (3).

9. The packaging manufacturing equipment for multi-chip integrated circuits according to claim 1, characterized in that: The outer wall of the sliding ring (944) is fixedly connected to a battery protection shell (945), a storage battery is arranged inside the battery protection shell (945), and electric wires are connected between the first heating rack (941) and the second heating rack (942) and the battery protection shell (945).

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