Nanoparticle printing and parallel sintering device and method

Abstract

The invention discloses a nanoparticle printing and parallel sintering device and method. The nanoparticle printing and parallel sintering device comprises a laser sintering mechanism, a nanoparticle generating and printing mechanism, a vacuum deposition cavity, a moving platform and a CDD high-resolution camera which are electrically connected with a control mechanism. The moving platform is arranged in the vacuum deposition cavity and is used for placing a printing substrate; the laser sintering mechanism and the nano-particle generating and printing mechanism are arranged above the moving platform, the nano-particle generating and printing mechanism is used for generating nano-particles and printing the nano-particles to the printing substrate to form a nano-particle circuit, and the laser sintering mechanism is used for conducting laser sintering on the nano-particle circuit. Any conductive or semiconductor material can be printed on any substrate, point, line, surface and patterning printing can be achieved, meanwhile, sintering and deposition particles are tracked, and the method can be applied to the fields of electro-catalysis, chemistry, optics or biological sensing, battery and microelectronic product packaging and manufacturing and the like.

Description

Technical Field

[0001] The present invention relates to the fields of additive manufacturing technology and nanomaterial technology, and in particular to a nanoparticle printing and parallel sintering device and method. Background Art

[0002] In order to realize ultra-precision electronic circuit manufacturing and break the bottleneck of traditional circuit manufacturing process, printing circuits directly on the surface of product structures and realizing integrated printing and sintering processing has always been a hot topic of research today.

[0003] Although nanoparticle deposition printing technology has been applied, these methods still have many disadvantages, mainly including the following: (1) The ink aerosol jet method uses a nozzle that is easily clogged, has a coffee ring effect, is not accurate, and requires a cumbersome process of removing and recovering solvents and surfactants after deposition; (2) At present, the deposited samples of dry aerosol nanoparticle printers need to be taken out and transferred to other instruments for the next process, which makes the samples easily contaminated and inefficient; (3) When the laser fully focuses on the nozzle printing point, the continuity of the circuit cannot be guaranteed. In summary, the current circuit printing method cannot achieve high-precision, high-performance and reliable electronic circuits. Summary of the invention

[0004] In view of the problems raised by the background technology, the purpose of the present invention is to propose a nanoparticle printing and parallel sintering device and method, which solves the problems of low manufacturing efficiency and low electronic circuit accuracy in the existing deposition printing technology.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] A nanoparticle printing and parallel sintering device, comprising a laser sintering mechanism, a nanoparticle generation and printing mechanism, a vacuum deposition chamber, a mobile platform, a CDD high-resolution camera and a control mechanism;

[0007] The movable platform is disposed in the vacuum deposition chamber, and the movable platform is used to place a printing substrate;

[0008] The laser sintering mechanism and the nanoparticle generation and printing mechanism are arranged above the mobile platform, the nanoparticle generation and printing mechanism is used to generate nanoparticles and print the nanoparticles onto the printing substrate to form nanoparticle circuits, and the laser sintering mechanism is used to perform laser sintering on the nanoparticle circuits;

[0009] The CDD high-resolution camera is used to observe the printed substrate and establish a relative coordinate system of the printed circuit;

[0010] The laser sintering mechanism, the nanoparticle generation and printing mechanism, the vacuum deposition chamber, the moving platform and the CDD high-resolution camera are electrically connected to the control mechanism respectively.

[0011] Preferably, the nanoparticle generation printing mechanism comprises a dry aerosol printing nozzle, a spark ablation assembly, a carrier gas flow controller and a carrier gas cylinder;

[0012] The dry aerosol printing nozzle is connected to the spark ablation component, and the spark ablation component is connected to the carrier gas cylinder through the carrier gas flow controller.

[0013] Preferably, the laser sintering mechanism comprises a micro-motion platform, a mounting bracket and a laser sintering head;

[0014] The laser sintering head is mounted on the micro-motion platform through the mounting bracket, and the micro-motion platform is used to allow the laser sintering head to follow the nanoparticle circuit to complete sintering.

[0015] Preferably, the diameter of the dry aerosol printing nozzle is 1-100 μm;

[0016] The total laser power of the laser sintering mechanism is 100-9000 mW, and the laser wavelength of the laser sintering mechanism is 527-980 nm.

[0017] Preferably, the vacuum deposition chamber comprises a steel deposition chamber, a vacuum pump, a three-way solenoid valve and a sensor;

[0018] The three-way solenoid valve is arranged at the air inlet of the steel deposition chamber, and the three-way solenoid valve is used to assist the dry aerosol printing nozzle in printing;

[0019] The vacuum pump is connected to the gas outlet of the steel deposition chamber, and the vacuum pump is used to discharge the gas inside the steel deposition chamber;

[0020] The sensor is arranged inside the steel deposition chamber, and is used to detect the vacuum degree or oxygen concentration inside the steel deposition chamber.

[0021] Preferably, the mobile platform comprises a base, a heating component, an electric-assisted deposition component and a three-degree-of-freedom mobile component;

[0022] The three-degree-of-freedom moving assembly is installed at the bottom of the inner cavity of the steel deposition chamber, the base is installed on the upper surface of the three-degree-of-freedom moving assembly, the heating assembly is used to heat the base, and the upper surface of the base is provided with a clamping assembly;

[0023] The negative pole of the power supply of the electric assisted deposition assembly is connected to the base, and the positive pole of the power supply of the electric assisted deposition assembly is connected to the steel deposition chamber.

[0024] Preferably, the three-degree-of-freedom moving assembly includes an X-axis moving unit, a Y-axis moving unit and a Z-axis moving unit, the effective stroke of the X-axis moving unit is 170 mm, the effective stroke of the Y-axis moving unit is 100 mm, and the effective stroke of the Z-axis moving unit is 30 mm.

[0025] A method for printing and sintering nanoparticles, characterized in that it comprises the following steps:

[0026] Step 1: input the printing circuit into the control mechanism, place the substrate to be printed on the mobile platform, and evacuate the air from the vacuum deposition chamber;

[0027] Step 2: Observe the printed substrate through a CCD high-resolution camera and establish a relative coordinate system for the printed circuit; the laser sintering mechanism is adjusted to the initial position for sintering according to the printed circuit;

[0028] Step 3, start printing and sintering: the nanoparticle generation printing mechanism gathers the dry aerosol particle beam through the dry aerosol printing nozzle and deposits it on the printing substrate. The printing platform drives the printing substrate to move according to the printing circuit so that the dry aerosol particle beam forms a nanoparticle circuit. The electric-assisted deposition component assists in the adsorption of charged dry aerosol particles. The laser sintering head sprays a laser beam to sinter the deposited nanoparticle circuit to form a sintering circuit, realizing the deposition and sintering in parallel steps. The heating component assists in sintering the nanoparticle circuit.

[0029] Step 4: After the deposition and sintering work is completed, the printed circuit is cleaned with a carrier gas flow to remove loose nanoparticles, and multiple ventilation and cleaning cycles are achieved through the cooperation of a three-way solenoid valve and a vacuum pump to remove the remaining nanoparticles from the vacuum deposition chamber.

[0030] Preferably, the particle size of the nanoparticles printed by the dry aerosol printing nozzle is 1-20 nm;

[0031] The radius of the laser spot of the laser sintering mechanism is 1-3 nm.

[0032] Preferably, the operating pressure of the vacuum deposition chamber is 0.2-1 mbar;

[0033] The maximum operating temperature of the heating component is 400° C., and the maximum heating rate of the heating component is 5° C. / min.

[0034] Compared with the prior art, one of the above technical solutions has the following beneficial effects:

[0035] 1. The nanoparticle printing and parallel sintering device of the present invention utilizes a laser sintering mechanism to generate aerosol jet printing nanoparticles through a nanoparticle generation and printing mechanism, thereby avoiding the nozzle blockage caused by ink printing, and utilizing a spark ablation component to generate nanoparticles with a smaller particle size and realizing precise nanoparticle printing through the cooperation of a precise mobile platform;

[0036] 2. The nanoparticle printing and parallel sintering method of the present invention realizes the integration of nanoparticle manufacturing, selective deposition, and sintering functions. The nanoparticles are deposited from the nozzle onto the printing substrate and then sintered using a laser. No post-processing process is required, which greatly improves the processing efficiency and ensures that the sample is not contaminated. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a schematic diagram of the printing and sintering working process of the present invention.

[0038] Figure 2 It is a schematic diagram of the overall structure of the present invention.

[0039] Figure 3 It is a schematic diagram of the printing result of Example 1 of the present invention.

[0040] Figure 4 This is a microscopic morphology image after printing of Example 4 of the present invention.

[0041] Figure 5 It is a TEM image of nanoparticle printing according to an embodiment of the present invention and its local magnified image.

[0042] Among them: laser sintering mechanism 1, laser beam 101, sintering circuit 102, micro-motion platform 11, mounting bracket 12, laser sintering head 13, nanoparticle generation printing mechanism 2, dry aerosol particle beam 201, nanoparticle circuit 202, dry aerosol printing nozzle 21, spark ablation component 22, carrier gas flow controller 23, carrier gas cylinder 24, vacuum deposition chamber 3, steel deposition chamber 31, vacuum pump 32, three-way solenoid valve 33, moving platform 4, base 41, heating component 42, electrically assisted deposition component 43, three-degree-of-freedom moving component 44, CDD high-resolution camera 5 and control mechanism 6. DETAILED DESCRIPTION

[0043] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0044] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0045] In addition, the terms "first", "second" and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, features defined as "first", "second" and "third" may explicitly or implicitly include one or more of the features.

[0046] It should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0047] The following is combined with Figures 1 to 5 The technical solution of the present invention is further illustrated by specific implementation methods.

[0048] A nanoparticle printing and parallel sintering device comprises a laser sintering mechanism 1, a nanoparticle generation and printing mechanism 2, a vacuum deposition chamber 3, a moving platform 4, a CDD high-resolution camera 5 and a control mechanism 6;

[0049] The movable platform 4 is disposed in the vacuum deposition chamber 3, and the movable platform 4 is used to place a printing substrate;

[0050] The laser sintering mechanism 1 and the nanoparticle generation and printing mechanism 2 are arranged above the mobile platform 4. The nanoparticle generation and printing mechanism 2 is used to generate nanoparticles and print the nanoparticles onto the printing substrate to form a nanoparticle circuit 202. The laser sintering mechanism 1 is used to perform laser sintering on the nanoparticle circuit 202.

[0051] The CDD high-resolution camera 5 is used to observe the printed substrate and establish a relative coordinate system of the printed circuit;

[0052] The laser sintering mechanism 1 , the nanoparticle generation and printing mechanism 2 , the vacuum deposition chamber 3 , the moving platform 4 and the CDD high-resolution camera 5 are electrically connected to the control mechanism 6 , respectively.

[0053] The present invention realizes direct generation and printing of nanoparticles by integrating a laser sintering mechanism 1 and a nanoparticle generation and printing mechanism 2, and is accompanied by laser sintering processing. This parallel processing method not only avoids the problems of nozzle clogging and coffee ring effect in traditional methods, but also can perform instant sintering while nanoparticles are being deposited, thereby ensuring the continuity and high precision of the nanoparticle circuit and improving the performance and reliability of the final electronic circuit.

[0054] The nanoparticle printing and sintering device has a built-in laser sintering function, so that the deposition and sintering of nanoparticles can be completed in the same vacuum deposition chamber 3, without taking the deposited samples out to other instruments for subsequent processing. This not only simplifies the process flow, but also reduces the risk of sample contamination during the transfer process, and improves production efficiency and product cleanliness.

[0055] The CDD high-resolution camera 5 is used to observe the printed substrate and establish a relative coordinate system of the printed circuit; the CDD high-resolution camera 5 can also record the printing and sintering conditions on the mobile platform in real time, providing high-precision feedback to the control mechanism 6. This real-time recording mechanism enables the system to adjust the printing parameters and sintering conditions in a timely manner, ensuring that each layer of nanoparticles can achieve the best deposition and sintering effect, further improving the quality and consistency of the product.

[0056] The centralized control and management of each component by the control mechanism 6 realizes the automatic control of the entire printing and sintering process. This not only reduces the skill requirements for operators, but also improves production efficiency and stability, making the nanoparticle printing and parallel sintering technology more suitable for large-scale industrial applications.

[0057] The design of the vacuum deposition chamber 3 effectively isolates the influence of the external environment on the printing process, reduces the interference of impurities and moisture in the air on the deposition of nanoparticles, and further improves the purity and reliability of the product. This is particularly important for manufacturing high-performance and high-precision electronic circuits.

[0058] Further, the nanoparticle generation printing mechanism 2 includes a dry aerosol printing nozzle 21, a spark ablation assembly 22, a carrier gas flow controller 23 and a carrier gas cylinder 24;

[0059] The dry aerosol printing nozzle 21 is connected to the spark ablation component 22 , and the spark ablation component 22 is connected to the carrier gas cylinder 24 through the carrier gas flow controller 23 .

[0060] The spark ablation component 22 can ablate the target material through high-energy sparks to produce high-quality nanoparticles. Compared with other generation methods, such as solution method or mechanical grinding method, this method can more directly and efficiently obtain nanoparticles with uniform particle size distribution and high purity. The generated nanoparticles are directly ejected from the printing nozzle 21 in the form of dry aerosol, avoiding the use of solvents and surfactants, simplifying subsequent processing steps, and reducing the introduction of potential pollutants.

[0061] The flow rate and pressure of the carrier gas can be accurately controlled by the carrier gas flow controller 23, so as to adjust the injection speed and concentration of the nanoparticles. This precise control helps to achieve uniform deposition of nanoparticles on the printed substrate and improve the accuracy and consistency of the printed circuit. The design of the carrier gas cylinder 24 allows the user to replace different types of carrier gases as needed to adapt to different nanoparticle generation and printing conditions, thereby improving the adaptability and flexibility of the equipment. The coordinated work of the spark ablation component 22 and the carrier gas flow controller 23 makes the generation and printing process of nanoparticles more stable and controllable, which helps to cope with different materials and printing requirements. By replacing different target materials for ablation in the spark ablation component, various types of nanoparticles can be flexibly generated to meet the needs of different electronic circuit manufacturing.

[0062] Preferably, the air flow rate of the carrier gas flow controller 23 is 1.2-10 L / min; the inner diameter of the electrode of the spark ablation component 22 is 1-50 mm, and the wall thickness is 1-20 mm; the pulse voltage of the spark ablation component 22 is 0.1-20 kV, and the frequency is 10-200 Hz.

[0063] Preferably, the target material is a single substance or alloy material, including conductive metal materials such as lithium, beryllium, carbon, magnesium, aluminum, calcium, vanadium, chromium, manganese, iron, cobalt, nickel, silver, tin, etc., semiconductor materials such as boron and silicon, and alloy materials such as Au / Pd and Ag / Cu.

[0064] Furthermore, the diameter of the dry aerosol printing nozzle 21 is 1-100 μm, and the particle size of the nanoparticles is 1-20 nm.

[0065] The diameter of the dry aerosol printing nozzle 21 is controlled within the range of 1-100 μm, which can more accurately control the spray direction and flow rate of the nanoparticles, thereby achieving higher-precision printing. This high-precision nozzle design helps to form more delicate and uniform nanoparticle circuits on the printed substrate, thereby improving the manufacturing accuracy of electronic circuits.

[0066] The particle size of nanoparticles is controlled within the range of 1-20nm, so that the nanoparticles have a higher specific surface area and surface activity, which is conducive to the attachment and deposition of nanoparticles on the printed substrate. Such small-sized nanoparticles can be more closely packed together to form a dense nanoparticle circuit, which improves the conductivity and stability of the circuit.

[0067] Nanoparticles with small particle sizes have higher surface energy and shorter diffusion distances during sintering, which enables them to be effectively sintered at lower temperatures. Therefore, the nanoparticle size setting in this technical solution helps to lower the sintering temperature, reduce energy consumption, and improve sintering efficiency.

[0068] Furthermore, the laser sintering mechanism 1 includes a micro-motion platform 11, a mounting bracket 12, and a laser sintering head 13;

[0069] The laser sintering head 13 is mounted on the micro-motion platform 11 through the mounting bracket 12 , and the micro-motion platform 11 is used to allow the laser sintering head 13 to follow the nanoparticle line to complete sintering.

[0070] The laser sintering head 13 is stably mounted on the micro-motion platform 11 through the mounting bracket 12. This stable structural design can reduce vibration and shaking during the sintering process, thereby ensuring the stability of the sintering process and the reliability of the sintering quality. A stable sintering process helps to reduce sintering defects and defective products and improve the product qualification rate. By mounting the laser sintering head 13 on the micro-motion platform 11, high-precision movement of the laser sintering head can be achieved. The micro-motion platform 11 has a small stepping capability and high-precision positioning control, which can ensure that the laser sintering head 13 accurately follows the nanoparticle circuit 202 for sintering, avoiding offset and misalignment during the sintering process, thereby improving the accuracy and consistency of sintering. The introduction of the micro-motion platform 11 enables the laser sintering head 13 to be flexibly adjusted according to different shapes and paths of the nanoparticle circuit 202. This flexibility enables the device to adapt to various complex sintering requirements, including curves, broken lines and irregularly shaped nanoparticle circuits, thereby broadening the application range of the device. Since the laser sintering head 13 can closely follow the nanoparticle circuit 202 for sintering, the generation of ineffective sintering areas is reduced, and the utilization rate of materials and the sintering efficiency are further improved.

[0071] Furthermore, the total laser power of the laser sintering mechanism 1 is 100-9000 mW, the laser wavelength of the laser sintering mechanism 1 is 527-980 nm, and the radius of the laser spot of the laser sintering mechanism 1 is 1-3 nm.

[0072] The laser sintering mechanism 1 uses a flat-top laser, and the total laser power is set in the range of 100 to 9000 mW, which provides sufficient energy input for the sintering process. Higher laser power can accelerate the melting and consolidation process of nanoparticles, shorten the sintering time, and improve the sintering efficiency. At the same time, sufficient energy can also ensure that the nanoparticles form a good metallurgical bond, improve the sintering effect, and make the sintered nanoparticle circuit have higher conductivity and mechanical strength.

[0073] The laser wavelength is set in the range of 527-980nm, which matches the absorption characteristics of many materials; metal materials have a high absorption rate for short-wavelength lasers, such as blue light and green light. Selecting the right laser wavelength can ensure that the laser energy is effectively absorbed by the nanoparticles, reduce energy loss and reflection, and thus improve the uniformity and consistency of sintering. In addition, lasers of specific wavelengths may also produce specific physical and chemical effects on certain materials, further optimizing the sintering quality. The radius of the laser spot is set to 1-3nm, achieving an extremely small spot size, which is consistent with the accuracy of the nanoparticle circuit 202, avoiding repeated sintering that may cause circuit defects and ensuring that the circuit is sintered once. The small spot means that the laser energy can act more concentratedly on the nanoparticles, reducing energy diffusion and thermal effects on adjacent areas. This helps to achieve high-precision sintering control and ensure the precise forming and positioning of the nanoparticle circuit at the micron or even nanometer scale.

[0074] Reasonable laser parameter settings help ensure the stable operation and safety of the equipment. Excessive laser power or improper wavelength selection may cause equipment damage or safety hazards, while reasonable parameter settings can reduce these risks while ensuring the sintering effect. By adjusting parameters such as total laser power, wavelength and spot radius, the laser sintering mechanism can adapt to the sintering process of different materials and printing requirements. This flexibility makes the device have a wider application prospect in the fields of ultra-precision electronic circuit manufacturing, micro-nano device processing, etc.

[0075] Further, the vacuum deposition chamber 3 includes a steel deposition chamber 31, a vacuum pump 32, a three-way solenoid valve 33 and a sensor;

[0076] The three-way solenoid valve 33 is disposed at the air inlet of the steel deposition chamber 31 , and the three-way solenoid valve 33 is used to assist the dry aerosol printing nozzle 21 in printing;

[0077] The vacuum pump 32 is connected to the gas outlet of the steel deposition chamber 31, and the vacuum pump 32 is used to discharge the gas inside the steel deposition chamber 31;

[0078] The sensor is disposed inside the steel deposition chamber 31 , and is used to detect the vacuum degree and / or oxygen concentration inside the steel deposition chamber 31 .

[0079] The introduction of the vacuum deposition chamber 3 provides a low-oxygen, low-impurity deposition environment for the printing of nanoparticles. By exhausting the gas inside the steel deposition chamber 31 through the vacuum pump 32, the oxygen concentration and impurity content in the chamber can be significantly reduced, and the reaction of nanoparticles with oxygen or other gases during the printing process can be reduced, thereby improving the purity and quality of the printed nanoparticle circuits. Sintering in a vacuum environment helps to reduce the oxidation and contamination of nanoparticles during the sintering process, and improves the conductivity and stability of the nanoparticle circuits after sintering. At the same time, the vacuum environment also helps to reduce the sintering temperature and reduce energy consumption.

[0080] The setting of the three-way solenoid valve 33 enables the dry aerosol printing nozzle 21 to be effectively assisted during the printing process. By controlling the switch state of the three-way solenoid valve 33, the gas flow and pressure entering the steel deposition chamber 31 can be adjusted, thereby optimizing the injection effect and deposition quality of the nanoparticles. In addition, the introduction of the sensor can monitor the vacuum degree and oxygen concentration inside the steel deposition chamber 31 in real time, providing accurate data support for the adjustment of process parameters, and further enhancing the controllability of the process.

[0081] The sealing design of the vacuum deposition chamber 3 and the continuous operation of the vacuum pump 32 can ensure that a certain vacuum is always maintained in the chamber to prevent external gases and impurities from interfering with the printing and sintering process. At the same time, the monitoring function of the sensor can timely detect and handle abnormal situations, such as insufficient vacuum or excessive oxygen concentration, so as to ensure the stable operation and safety of the equipment.

[0082] Furthermore, the operating pressure of the vacuum deposition chamber 3 is 0.2-1 mbar.

[0083] At lower pressures, the diffusion and collision of nanoparticles in the air are reduced, allowing them to be deposited more accurately on the printed substrate. This helps to improve the accuracy and resolution of printing, making the printed nanoparticle circuits more delicate and uniform. A proper vacuum environment helps to reduce the sintering temperature because under vacuum conditions, the contact between nanoparticles is closer, and the diffusion and reaction rates are accelerated. This not only reduces energy consumption, but also shortens the sintering time and improves production efficiency. At the same time, a lower sintering temperature helps to reduce the grain growth and deformation of nanoparticles and maintain their original microstructure and properties.

[0084] By monitoring and adjusting the pressure of the vacuum deposition chamber 3, it can be ensured that each printing and sintering process is carried out under optimal conditions, thereby improving the consistency and reliability of the product.

[0085] Further, the mobile platform 4 includes a base 41, a heating component 42, an electric assisted deposition component 43 and a three-degree-of-freedom mobile component 44;

[0086] The three-degree-of-freedom moving assembly 44 is installed at the bottom of the inner cavity of the steel deposition chamber 31, the base 41 is installed on the upper surface of the three-degree-of-freedom moving assembly 44, the heating assembly 42 is used to heat the base 41, and the upper surface of the base 41 is provided with a clamping assembly;

[0087] The negative pole of the power supply of the electric-assisted deposition assembly 43 is connected to the base 41 , and the positive pole of the power supply of the electric-assisted deposition assembly 43 is connected to the steel deposition chamber 31 .

[0088] The installation of the three-degree-of-freedom moving assembly 44 (usually a platform that can move in the three directions of X, Y, and Z) enables the printing substrate on the base 41 to achieve precise position adjustment and dynamic control according to the set printing line. This flexibility ensures that the nanoparticles can be accurately printed and sintered according to the predetermined path and shape, improving the accuracy and consistency of the product.

[0089] The introduction of the heating component 42 provides a controllable heating environment for the base 41. By adjusting the temperature of the heating component 42, the temperature conditions during the sintering process can be accurately controlled to meet the sintering requirements of different nanoparticle materials. This helps to reduce defects such as thermal stress and cracks during the sintering process and improve the quality of the sintered body. The addition of the electric-assisted deposition component 43 can promote the deposition and adhesion of nanoparticles on the base 41 by providing an electric field between the base 41 and the steel deposition chamber 31. The action of the electric field can accelerate the migration and aggregation of nanoparticles to the base 41, making the deposition process more uniform and dense. This helps to improve the quality and thickness of the deposited layer and enhance the mechanical properties and conductive properties of the sintered body.

[0090] Further, the three-degree-of-freedom moving assembly 44 includes an X-axis moving unit, a Y-axis moving unit and a Z-axis moving unit, the effective stroke of the X-axis moving unit is 170 mm, the effective stroke of the Y-axis moving unit is 100 mm, and the effective stroke of the Z-axis moving unit is 30 mm;

[0091] The maximum operating temperature of the heating component 42 is 400° C., and the maximum heating rate of the heating component 42 is 5° C. / min.

[0092] The three-degree-of-freedom moving assembly 44 includes X-axis, Y-axis and Z-axis moving units, and the effective strokes of each axis are 170mm, 100mm and 30mm respectively. These specific stroke parameters provide sufficient movement range and flexibility for the printing and sintering processes. The X-axis and Y-axis moving units are equipped with linear motors and piezoelectric ceramic macro-micro composite drives with a positioning accuracy of ±1nm, and the Z-axis moving unit is equipped with a stepper motor with a positioning accuracy of ±10μm. The large strokes of the X-axis and Y-axis allow precise two-dimensional printing in a larger working area, while the stroke of the Z-axis supports fine-tuning in the vertical direction to accommodate the deposition requirements of nanoparticles of different thicknesses and shapes. This flexibility enables the device to handle more complex printing and sintering tasks.

[0093] The maximum operating temperature of the heating assembly 42 is 400°C, which covers the sintering temperature range of various nanoparticle materials. By accurately controlling the temperature of the heating assembly 42, it is possible to ensure that the sintering process is carried out under optimal temperature conditions, thereby improving the quality and performance of the sintered body. The maximum heating rate of the heating assembly 42 is 5°C / min, which helps to achieve a smooth temperature rise and reduce the adverse effects of sudden temperature changes on the nanoparticles and the sintered body.

[0094] By accurately controlling the position and speed of the mobile platform 4 and the temperature of the heating component 42, the occurrence of equipment failures and safety accidents can be reduced. In addition, these parameters also help to achieve automatic control and remote monitoring of the equipment, improving production efficiency and safety.

[0095] Clear parameter settings make the nanoparticle printing and parallel sintering device applicable to the printing and sintering of more types of nanoparticle materials and complex structures. Whether it is microelectronic devices that require high-precision printing or ceramic materials that require high-temperature sintering, the parameters of the equipment can be adjusted to meet production needs. This broadens the application range and market prospects of the device.

[0096] Reference Figure 1A nanoparticle printing parallel sintering device includes a laser sintering mechanism 1, a nanoparticle generation printing mechanism 2, a vacuum deposition chamber 3, a mobile platform 4, a CDD high-resolution camera 5 and a control mechanism 6; the laser sintering head 13 of the laser sintering mechanism 1 is installed on the micro-motion platform 11 through a mounting bracket 12, and the laser sintering head 13 and the micro-motion platform 11 are connected to the control mechanism 6 through a signal transmission line to control their power, switch, etc.; the dry aerosol printing nozzle 21 of the nanoparticle generation printing mechanism 2 is connected to the carrier gas flow controller 23 through an air pipe, and finally connected to the carrier gas cylinder 24 through an air pipe; the CDD high-resolution camera 5 is connected to the control mechanism 6 through a signal transmission line to achieve the establishment of a relative coordinate system and the observation of the printing process. The mobile platform 4 is arranged inside the vacuum deposition chamber 3, and the base 41 of the mobile platform 4 is provided with a heating component 42 and an electric assisted deposition component 43, and the base 41 is installed on a three-degree-of-freedom moving component 44.

[0097] Reference Figure 2 Nanoparticles are generated by the spark ablation component 22 and mixed with the carrier gas through the carrier gas flow controller 23 and the carrier gas cylinder 24 to form dry aerosol particles. The dry aerosol particles are ejected into a dry aerosol particle beam 201 through the dry aerosol printing nozzle 21. The movement of the mobile platform 4 is controlled by the control mechanism 6 according to the printing circuit (printing pattern). The dry aerosol particle beam 201 is deposited on the printing substrate to form a nanoparticle circuit 202. The electric assisted deposition component 43 assists in the adsorption of the charged dry aerosol particles. While the nanoparticles are being deposited, the laser sintering head 13 emits a laser beam 101 to follow the nanoparticle circuit 202 for sintering, and the heating component 42 is used to assist in the sintering.

[0098] A method for printing and sintering nanoparticles in parallel, comprising the following steps:

[0099] Step 1: input the printing circuit into the control mechanism 6, place the substrate to be printed on the mobile platform 4, and evacuate the air from the vacuum deposition chamber 3;

[0100] Step 2: observe the printed substrate through the CCD high-resolution camera 5 and establish a relative coordinate system of the printed circuit; the laser sintering mechanism 1 is adjusted to the initial position of sintering according to the printed circuit;

[0101] Step 3, start printing and sintering: the nanoparticle generation printing mechanism 2 gathers the dry aerosol particle beam 201 through the dry aerosol printing nozzle 21 and deposits it on the printing substrate. The printing platform drives the printing substrate to move according to the printing circuit so that the dry aerosol particle beam 201 forms a nanoparticle circuit 202. The electric assisted deposition component 43 assists in adsorbing the charged dry aerosol particles. The laser sintering head 13 sprays the laser beam 101 to sinter the deposited nanoparticle circuit to form a sintered circuit 102, so that deposition and sintering are carried out in parallel in steps. The heating component 42 assists in sintering the nanoparticle circuit 202.

[0102] Step 4: After the deposition and sintering work is completed, the printed circuit is cleaned with a carrier gas flow to remove loose nanoparticles, and the three-way solenoid valve 33 and the vacuum pump 32 are used to achieve multiple ventilation and cleaning cycles to remove the remaining nanoparticles from the vacuum deposition chamber 3.

[0103] Example 1

[0104] Print copper wire circuits on the copper board. The steps are as follows:

[0105] (1) The target line width is 50 nm, the line thickness is 100 nm, and the CAD pattern is designed according to the printing requirements. The CAD pattern is uploaded to the control mechanism 6, and the moving speed of the mobile platform 4 is set to 10 nm / s through the control mechanism 6, the deposition mode is set to single scan, the distance between the base 41 and the dry aerosol printing nozzle 21 is 110 nm, the diameter of the dry aerosol printing nozzle 21 is 120 nm, the heating rate of the heating component 42 is 5 ° C / min, and the maximum rising temperature is 220 ° C;

[0106] (2) Open the steel deposition chamber 31 and place the 1×1 mm copper plate on the base 41, fix and clamp it with the spring sheet, close the steel deposition chamber 31, turn on the vacuum pump 32, and start evacuating to achieve negative pressure in the steel deposition chamber 31;

[0107] (3) Install a pair of copper electrodes into the spark ablation assembly 22, turn on the spark ablation assembly 22, wait for the voltage and current parameters to stabilize, and then start printing through the control mechanism 6;

[0108] (4) First, the copper plate is observed by the CDD high-resolution camera 5 to establish a relative coordinate system, and printing is performed according to the target line. During printing, the laser sintering head 13 is aligned with the deposited part for sintering, and the heating component 42 is heated to a preset temperature during printing. When printing and sintering are completed, the work is completed and the platform is reset;

[0109] (5) After the circuit is printed, the spark ablation assembly 22 is turned off, the vacuum pump 32 is turned off, and the chamber is allowed to cool down and pressurized to room temperature before taking out the sample.

[0110] SEM electron microscopy showed that the width of the sample's nano-copper wire was 45nm and the wire thickness was 90nm.

[0111] Example 2

[0112] To print the silver wire on the PI, follow these steps:

[0113] (1) The target line width is 40 nm, the line thickness is 90 nm, and a CAD pattern is designed according to the printing requirements. The CAD pattern is uploaded to the control mechanism 6, and the printing speed is set to 10 nm / s through the control mechanism 6, the deposition mode is a single scan, the distance between the base 41 and the dry aerosol printing nozzle 21 is 110 nm, the diameter of the dry aerosol printing nozzle 21 is 120 nm, the heating rate of the heating component 42 is 5 ° C / min, and the maximum rising temperature is 150 ° C;

[0114] (2) Open the steel deposition chamber 31 and place the 1×1 mm PI on the substrate, fix and clamp it with a spring sheet, close the steel deposition chamber 31, turn on the vacuum pump 32, and start evacuating to achieve negative pressure in the vacuum chamber;

[0115] (3) Install a pair of silver electrodes into the spark ablation assembly 22, turn on the spark ablation assembly 22, and wait for the voltage and current parameters to stabilize before starting printing through the control mechanism 6;

[0116] (4) First, the PI is observed by the CDD high-resolution camera 5 to establish a relative coordinate system, and printing is performed according to the target line. During printing, the laser sintering head 13 is aligned with the deposited part for sintering, and the heating component 42 is heated to a preset temperature during printing. When printing and sintering are completed, the mobile platform 4 is reset;

[0117] (5) After the circuit is printed, the spark ablation assembly 22 is turned off, the vacuum pump 32 is turned off, and the chamber is allowed to cool down and pressurized to room temperature before taking out the sample.

[0118] SEM electron microscopy showed that the nanosilver line width of the sample was 40nm, the line thickness was 90nm, and the resistivity was 10.28μΩ·cm measured by the four-point probe method.

[0119] Example 3

[0120] Printing silver wire circuits on PET, the steps are as follows:

[0121] (1) The target line width is 35 nm, the line thickness is 75 nm, and the CAD pattern is designed according to the printing requirements. The CAD pattern is uploaded to the control mechanism 6, and the printing speed is set to 10 nm / s through the control mechanism 6, the deposition mode is a single scan, the distance between the base 41 and the dry aerosol printing nozzle 21 is 110 nm, the diameter of the dry aerosol printing nozzle 21 is 120 nm, the heating rate of the heating component 42 is 5 ° C / min, and the maximum rising temperature is 180 ° C;

[0122] (2) Open the steel deposition chamber 31 and place the 1×1 mm PET on the substrate, fix and clamp it with a spring sheet, close the steel deposition chamber 31, turn on the vacuum pump 32, and start evacuating to achieve negative pressure in the vacuum chamber;

[0123] (3) Install a pair of silver electrodes into the spark ablation assembly 22, turn on the spark ablation assembly 22, and wait for the voltage and current parameters to stabilize before starting printing through the control mechanism 6;

[0124] (4) First, the PET is observed by the CDD high-resolution camera 5 to establish a relative coordinate system, and printing is performed according to the target line. During printing, the laser sintering head 13 is aligned with the deposited part for sintering, and the heating component 42 is heated to a preset temperature during printing. When printing and sintering are completed, the mobile platform 4 is reset;

[0125] (5) After the circuit is printed, the spark ablation assembly 22 is turned off, the vacuum pump 32 is turned off, and the chamber is allowed to cool down and pressurized to room temperature before taking out the sample.

[0126] SEM electron microscopy showed that the nanosilver line width of the sample was 35nm, the line thickness was 75nm, and the resistivity was 15.46μΩ·cm measured by the four-point probe method.

[0127] Example 4

[0128] Print the copper layer on the copper pillars of the daisy chain substrate as follows:

[0129] (1) The target layer thickness is 10 nm, the spacing is 1 μm, and the CAD pattern is designed according to the printing requirements. The CAD pattern is uploaded to the control mechanism 6, and the printing speed is set to 10 nm / s through the control mechanism 6, the deposition mode is a single scan, the spacing between the base 41 and the dry aerosol printing nozzle 21 is 110 nm, the diameter of the dry aerosol printing nozzle 21 is 120 nm, the heating rate of the heating component 42 is 5 ° C / min, and the maximum rising temperature is 200 ° C;

[0130] (2) Open the steel deposition chamber 31 and place the 10×10 μm daisy chain on the substrate, fix and clamp it with a spring sheet, close the steel deposition chamber 31, turn on the vacuum pump 32, and start evacuating to achieve negative pressure in the vacuum chamber;

[0131] (3) Install a pair of silver electrodes into the spark ablation assembly 22, turn on the spark ablation assembly 22, and wait for the voltage and current parameters to stabilize before starting printing through the control mechanism 6;

[0132] (4) First, the CDD high-resolution camera 5 is used to observe the daisy chain to capture the marker points and establish a relative coordinate system. Printing is performed according to the target line, and the heating component 42 is heated to a preset temperature during printing. When printing and sintering are completed, the mobile platform 4 is reset;

[0133] (5) After the circuit is printed, turn off the spark ablation assembly 22, turn off the vacuum pump 32, wait for the chamber to cool down, increase the pressure to room temperature, and take out the sample;

[0134] (6) Place the sample on a bonding machine and bond it using a simulated chip.

[0135] SEM electron microscopy showed that the thickness of the nano-copper layer of the sample was 10 nm, the resistivity was measured by the four-point probe method and was 25.5 μΩ·cm, and the shear strength was measured by a push-pull machine and was 20 MPa.

[0136] Figure 4 This is a microscopic diagram of the daisy chain substrate after the nanoparticles are printed. The nano-copper particles are evenly dispersed on the surface of each copper column.

[0137] The technical principle of the present invention is described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations herein, those skilled in the art can associate other specific implementations of the present invention without paying creative labor, and these methods will fall within the scope of protection of the present invention.

Claims

1. A nanoparticle printing and sintering device, characterized in that: It includes laser sintering mechanism, nanoparticle generation printing mechanism, vacuum deposition chamber, mobile platform, CDD high-resolution camera and control mechanism; The movable platform is disposed in the vacuum deposition chamber, and the movable platform is used to place a printing substrate; The laser sintering mechanism and the nanoparticle generation and printing mechanism are arranged above the mobile platform, the nanoparticle generation and printing mechanism is used to generate nanoparticles and print the nanoparticles onto the printing substrate to form nanoparticle circuits, and the laser sintering mechanism is used to perform laser sintering on the nanoparticle circuits; The CDD high-resolution camera is used to observe the printed substrate and establish a relative coordinate system of the printed circuit; The laser sintering mechanism, the nanoparticle generation and printing mechanism, the vacuum deposition chamber, the moving platform and the CDD high-resolution camera are electrically connected to the control mechanism respectively.

2. The nanoparticle printing and sintering device according to claim 1, characterized in that: The nanoparticle generation printing mechanism includes a dry aerosol printing nozzle, a spark ablation component, a carrier gas flow controller and a carrier gas cylinder; The dry aerosol printing nozzle is connected to the spark ablation component, and the spark ablation component is connected to the carrier gas cylinder through the carrier gas flow controller.

3. The nanoparticle printing and sintering device according to claim 2, characterized in that: The laser sintering mechanism includes a micro-motion platform, a mounting bracket and a laser sintering head; The laser sintering head is mounted on the micro-motion platform through the mounting bracket, and the micro-motion platform is used to allow the laser sintering head to follow the nanoparticle circuit to complete sintering.

4. The nanoparticle printing and sintering device according to claim 3, characterized in that: The diameter of the dry aerosol printing nozzle is 1-100 μm; The total laser power of the laser sintering mechanism is 100-9000 mW, and the laser wavelength of the laser sintering mechanism is 527-980 nm.

5. The nanoparticle printing and sintering device according to claim 4, characterized in that: The vacuum deposition chamber comprises a steel deposition chamber, a vacuum pump, a three-way solenoid valve and a sensor; The three-way solenoid valve is arranged at the air inlet of the steel deposition chamber, and the three-way solenoid valve is used to assist the dry aerosol printing nozzle in printing; The vacuum pump is connected to the gas outlet of the steel deposition chamber, and the vacuum pump is used to discharge the gas inside the steel deposition chamber; The sensor is arranged inside the steel deposition chamber, and is used to detect the vacuum degree or oxygen concentration inside the steel deposition chamber.

6. The nanoparticle printing and sintering device according to claim 5, characterized in that: The mobile platform includes a base, a heating component, an electric assisted deposition component and a three-degree-of-freedom mobile component; The three-degree-of-freedom moving assembly is installed at the bottom of the inner cavity of the steel deposition chamber, the base is installed on the upper surface of the three-degree-of-freedom moving assembly, the heating assembly is used to heat the base, and the upper surface of the base is provided with a clamping assembly; The negative pole of the power supply of the electric assisted deposition assembly is connected to the base, and the positive pole of the power supply of the electric assisted deposition assembly is connected to the steel deposition chamber.

7. The nanoparticle printing and sintering device according to claim 6, characterized in that: The three-degree-of-freedom moving assembly includes an X-axis moving unit, a Y-axis moving unit and a Z-axis moving unit. The effective stroke of the X-axis moving unit is 170 mm, the effective stroke of the Y-axis moving unit is 100 mm, and the effective stroke of the Z-axis moving unit is 30 mm.

8. A method for printing and sintering nanoparticles, characterized in that: The following steps are involved: Step 1: input the printing circuit into the control mechanism, place the substrate to be printed on the mobile platform, and evacuate the air from the vacuum deposition chamber; Step 2: Observe the printed substrate through a CCD high-resolution camera and establish a relative coordinate system for the printed circuit; the laser sintering mechanism is adjusted to the initial position for sintering according to the printed circuit; Step 3, start printing and sintering: the nanoparticle generation printing mechanism gathers the dry aerosol particle beam through the dry aerosol printing nozzle and deposits it on the printing substrate, the printing platform drives the printing substrate to move according to the printing circuit so that the dry aerosol particle beam forms a nanoparticle circuit, and the electric-assisted deposition component assists in adsorbing the charged dry aerosol particles; The laser sintering head sprays a laser beam to sinter the deposited nanoparticle circuit to form a sintered circuit, realizing deposition and sintering in parallel steps, and the heating component assists in sintering the nanoparticle circuit; Step 4: After the deposition and sintering work is completed, the printed circuit is cleaned with a carrier gas flow to remove loose nanoparticles, and multiple ventilation and cleaning cycles are achieved through the cooperation of a three-way solenoid valve and a vacuum pump to remove the remaining nanoparticles from the vacuum deposition chamber.

9. The method for printing and sintering nanoparticles according to claim 8, characterized in that: The particle size of the nanoparticles printed by the dry aerosol printing nozzle is 1-20 nm; The radius of the laser spot of the laser sintering mechanism is 1-3 nm.

10. The method for printing and sintering nanoparticles according to claim 9, characterized in that: The operating pressure of the vacuum deposition chamber is 0.2-1 mbar; The maximum operating temperature of the heating component is 400° C., and the maximum heating rate of the heating component is 5° C. / min.

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