Aerosol electronic device manufacturing platform in microgravity environment and working method thereof

Abstract

The invention provides an aerosol electronic device manufacturing platform in a microgravity environment and a working method of the aerosol electronic device manufacturing platform, and belongs to the technical field of intelligent manufacturing and additive manufacturing. The aerosol electronic device manufacturing platform in the microgravity environment comprises an atomizer and an in-situ sintering platform, the atomizer comprises an ink bin, a piston, a capillary tube array, a carrier gas channel, a discharging channel, an ultrasonic transducer, a sheath gas channel and a nozzle, the ink bin can contain ink, one end of the capillary tube array is communicated with one end of the ink bin, and the other end of the capillary tube array is communicated with the in-situ sintering platform. The piston is arranged at the other end of the ink bin in a sliding mode, the carrier gas channel is communicated with the discharging channel, the other end of the capillary tube array is communicated with the discharging channel, the central axis of the carrier gas channel and the central axis of the discharging channel are located on the same straight line, the ultrasonic transducer is fixedly connected with the capillary tube array, the sheath gas channel is communicated with the discharging channel, and the nozzle is communicated with the discharging channel. And the in-situ sintering platform is positioned below the nozzle. The ink can be captured and conveyed in a microgravity environment, and the over-spraying phenomenon is avoided.

Description

Technical Field

[0001] The present invention belongs to the technical field of intelligent manufacturing and additive manufacturing, and in particular relates to an aerosol electronic device manufacturing platform in a microgravity environment and a working method thereof. Background Art

[0002] As a basic component of electronic equipment, electronic devices are widely used in various space payloads. The extreme environment of space makes electronic devices undergo extreme cold and hot temperature cycles, cosmic high-energy ray radiation, atomic oxygen erosion and other harsh loads, which are more likely to cause electronic components to fail. The failure of a single electronic component will lead to the failure of the entire electronic equipment and even threaten the safety of the entire space system. Ensuring the reliability of electronic components is the key to ensuring the safe and stable operation of space electronic equipment. Therefore, damaged, degraded, and failed electronic components need to be replenished and replaced in a timely manner. In addition, space activities such as astronauts' extravehicular activities and space experiments such as space breeding in space require specific electronic devices to monitor the life and health status of astronauts and the growth of plants. However, at present, any space resources need to be carried by spacecraft. The time cycle of a single launch is long and the cost is huge, which cannot meet the real-time demand for electronic devices in space. This urgently requires the space station to have the ability to manufacture electronic devices.

[0003] The microgravity environment of space poses significant difficulties to the manufacture of electronic devices. Most importantly, materials cannot be deposited by gravity. In addition, the space environment also requires the manufacturing platform to have characteristics such as high resource utilization, miniaturization, lightweight, and high safety.

[0004] Aerosol jet printing is an emerging additive manufacturing method that uses ultrasound to atomize the ink and apply sheath gas. Due to the protection, convergence and collimation of the sheath gas, the ink leaves the nozzle at a relatively high speed (greater than 1m / s) and can be inertially deposited on the substrate, initially capable of overcoming the microgravity environment. In addition, aerosol jet printing can achieve micron-level manufacturing accuracy under the convergence of sheath gas, and is compatible with a variety of material systems such as metal conductive materials, polymer insulating materials, and ceramic materials. It can achieve integrated preparation and packaging integration of a variety of materials, initially capable of additive manufacturing of precision electronic devices and meets the high requirements for resource utilization efficiency in space.

[0005] However, there are two technical bottlenecks in applying aerosol printing to the microgravity environment of space: one is the problem of ink atomization in a microgravity environment. The ink will be suspended in the reservoir, making it difficult to capture and transfer the ink. The second is that overspray is prone to occur, which will cause serious safety hazards. Overspray refers to droplets around the printing track. This printing defect is widely present in aerosol printing, affecting the printing resolution and also bringing the risk of short circuits. In addition, in a microgravity environment, droplets collide with the substrate, splash and float in the air, posing a threat to the safety of electronic equipment and staff in the space station. Summary of the invention

[0006] In view of this, in order to solve the problem that in a microgravity environment, the capture and transmission of ink will be difficult, and overspray is prone to occur, which affects the printing resolution and causes serious safety hazards, the present invention proposes an aerosol electronic device manufacturing platform in a microgravity environment and its working method.

[0007] To achieve the above object, the present invention adopts the following technical solutions:

[0008] An aerosol electronic device manufacturing platform in a microgravity environment includes an atomizer and an in-situ sintering platform, wherein the atomizer includes:

[0009] An ink tank, wherein the ink tank can contain ink;

[0010] A piston and a capillary array, one end of the capillary array is connected to one end of the ink tank, and the piston is slidably disposed at the other end of the ink tank;

[0011] A carrier gas channel and a feed channel, wherein the carrier gas channel and the feed channel are connected, the other end of the capillary array is connected to the feed channel, and the central axes of the carrier gas channel and the feed channel are on the same straight line;

[0012] An ultrasonic transducer, wherein the ultrasonic transducer is fixedly connected to the capillary array;

[0013] a sheath gas channel, the sheath gas channel being in communication with the feed channel;

[0014] A nozzle is connected to the feeding channel, and the in-situ sintering platform is located below the nozzle.

[0015] As a preferred solution of the above-mentioned aerosol electronic device manufacturing platform in a microgravity environment, the nozzle adopts a Luer interface.

[0016] As a preferred solution of the above-mentioned aerosol electronic device manufacturing platform in a microgravity environment, the inner diameter of the nozzle is 100 μm, 150 μm, 200 μm, 300 μm or 450 μm.

[0017] As a preferred solution of the above-mentioned aerosol electronic device manufacturing platform in a microgravity environment, the table top of the in-situ sintering platform is made of alumina ceramic material.

[0018] The present invention also provides a working method of an aerosol electronic device manufacturing platform in a microgravity environment, using the above-mentioned aerosol electronic device manufacturing platform in a microgravity environment, comprising:

[0019] S1: Select ink materials for electronic device preparation;

[0020] S2: preparing ink materials into ink using a solvent;

[0021] S3: injecting ink into the ink tank, and slidingly setting the piston in the ink tank so that the ink is located between the piston and the capillary array;

[0022] S4: turn on the ultrasonic transducer;

[0023] S5: in-situ sintering platform;

[0024] S6: introducing carrier gas into the carrier gas channel and introducing sheath gas into the sheath gas channel;

[0025] S7: The ultrasonic transducer drives the capillary array to vibrate, breaking the ink at the liquid-gas interface at the end of the capillary array to generate aerosol particles;

[0026] S8: Aerosol particles form an aerosol flow under the action of the carrier gas, and are converged and collimated by the sheath gas. After further convergence by the nozzle, the aerosol beam surrounded and protected by the sheath gas is ejected from the nozzle outlet to the in-situ sintering platform.

[0027] As a preferred scheme for the working method of the aerosol electronic device manufacturing platform in the above-mentioned microgravity environment, in S1, the ink material is a metal conductive material, a polymer insulating material, a quantum dot material, a thermoelectric material for energy conversion, or a sensing material for temperature, humidity or pressure sensing.

[0028] As a preferred scheme of the working method of the aerosol electronic device manufacturing platform in the above-mentioned microgravity environment, in S2, the solvent is made of 60-75% deionized water, 5-10% diethylene glycol, 15-20% isopropanol, and 0.5% pineol in volume percentage.

[0029] As a preferred scheme for the working method of the aerosol electronic device manufacturing platform in the above-mentioned microgravity environment, in S4, the input voltage of the ultrasonic transducer is adjusted according to the viscosity of the ink. The higher the viscosity of the ink, the greater the critical atomization voltage required. The input voltage range of the ultrasonic transducer is 10-50V.

[0030] As a preferred solution of the working method of the aerosol electronic device manufacturing platform in the above-mentioned microgravity environment, in S5, the in-situ sintering platform can provide a heating temperature of 30-500°C.

[0031] As a preferred embodiment of the working method of the aerosol electronic device manufacturing platform in the microgravity environment, in S6, the flow rate of the carrier gas introduced into the carrier gas channel is 0-500 sccm; the flow rate of the sheath gas introduced into the sheath gas channel is 0-2000 sccm.

[0032] Compared with the prior art, the aerosol electronic device manufacturing platform and working method in a microgravity environment provided by the present invention have the following beneficial effects:

[0033] 1. The present invention provides an aerosol electronic device manufacturing platform in a microgravity environment and a working method thereof. In the aerosol electronic device manufacturing platform in a microgravity environment, the ink is injected into the ink tank and sealed with a piston. The piston will automatically move as the ink is consumed, and the volume of the ink tank containing the ink will change according to the automatic movement of the piston, thereby avoiding cavitation inside the ink during the consumption process. The capillary array is connected to one end of the ink tank, and the microgravity environment does not affect the action of the capillary force. The ink enters the capillary array under the action of the capillary force. The ultrasonic transducer is fixedly connected to the capillary array and in close contact. Under the action of the alternating voltage, the ultrasonic transducer can drive the capillary array to vibrate, breaking the ink at the liquid-gas interface at the end of the capillary array to produce aerosol particles. The aerosol electronic device manufacturing platform in a microgravity environment uses a piston and a capillary array to capture and transfer ink, and uses the physical direct contact between an ultrasonic transducer and a capillary array to transfer ultrasonic energy to generate aerosol particles. This can solve the problem that ink cannot be atomized in a microgravity environment and is difficult to capture and transfer.

[0034] 2. The present invention provides an aerosol electronic device manufacturing platform in a microgravity environment and a working method thereof. In the aerosol electronic device manufacturing platform in a microgravity environment, the aerosol beam is surrounded and protected by the sheath gas after being ejected from the nozzle, reaches the high-temperature substrate of the in-situ sintering platform and is quickly sintered in-situ. The nanoparticles quickly form a sintering neck under the action of high temperature, thereby avoiding overspray, thereby obtaining a regular printed circuit with extremely low edge roughness. Through the convergence, collimation and protection of the sheath gas, combined with the high-temperature heating provided by the in-situ sintering platform, the overspray phenomenon is solved, the in-situ sintering of the ink material is achieved, the splashing of droplets is avoided, the printing resolution is improved, and the safety of use in a microgravity environment is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The accompanying drawings constituting a part of the present invention are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the accompanying drawings:

[0036] Figure 1 It is a structural schematic diagram of an aerosol electronic device manufacturing platform in a microgravity environment provided by a specific embodiment of the present invention;

[0037] Figure 2 It is the state of aerosol flow of the aerosol electronic device manufacturing platform in a microgravity environment provided by a specific embodiment of the present invention at a lower sheath gas flow rate / carrier gas flow rate value;

[0038] Figure 3 It is the state of aerosol flow of the aerosol electronic device manufacturing platform in a microgravity environment provided by a specific embodiment of the present invention at a higher sheath gas flow rate / carrier gas flow rate value;

[0039] Figure 4 It is the change process of nanoparticles ejected from an aerosol electronic device manufacturing platform in a microgravity environment provided by a specific embodiment of the present invention;

[0040] Figure 5 It is a schematic diagram of the structure of a circuit prepared by the aerosol electronic device manufacturing platform in a microgravity environment provided by a specific embodiment of the present invention when the in-situ sintering platform is not turned on;

[0041] Figure 6 yes Figure 5 Microstructure diagram at A in the middle;

[0042] Figure 7 It is a schematic diagram of the structure of a circuit prepared by the aerosol electronic device manufacturing platform in a microgravity environment provided by a specific embodiment of the present invention after the in-situ sintering platform is turned on;

[0043] Figure 8 yes Figure 7 Microstructure diagram at B in the middle;

[0044] In the figure:

[0045] 1. Ink tank; 2. Piston; 3. Capillary array; 4. Ultrasonic transducer; 5. Carrier gas channel; 6. Feeding channel; 7. Sheath gas channel; 8. Nozzle; 9. Aerosol particles; 10. In-situ sintering platform; 11. Nanoparticles. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely explain the technical solutions in the embodiments of the present invention. It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict, and the described embodiments are only part of the embodiments of the present invention, not all of the embodiments.

[0047] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0048] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0049] In the description of this embodiment, the terms "upper", "lower", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0050] The microgravity environment of space poses significant difficulties to the manufacture of electronic devices. Most importantly, materials cannot be deposited by gravity. In addition, the space environment also requires the manufacturing platform to have the characteristics of high resource utilization, miniaturization, lightweight, and high safety. There are two technical bottlenecks in applying aerosol printing to the microgravity environment of space: First, the problem of ink atomization in a microgravity environment makes it difficult to capture and transmit the ink. Second, overspray is prone to occur, which affects the printing resolution and also brings the risk of short circuits, which can cause serious safety hazards.

[0051] To this end, the present invention provides an aerosol electronic device manufacturing platform in a microgravity environment and a working method thereof. The aerosol electronic device manufacturing platform in a microgravity environment uses a piston and a capillary array to capture and transmit ink, and uses the physical direct contact between an ultrasonic transducer and a capillary array to transmit ultrasonic energy to generate aerosol particles, so as to solve the problem that the ink in a microgravity environment cannot be atomized and it is difficult to capture and transmit the ink. Through the convergence, collimation and protection of the sheath gas, combined with the high-temperature heating provided by the in-situ sintering platform, the overspray phenomenon is solved, the in-situ sintering of the ink material is achieved, the splashing of droplets is avoided, the printing resolution is improved, and the safety of use in a microgravity environment is improved.

[0052] See also Figure 1-8 Specifically describing this embodiment, the present invention provides an aerosol electronic device manufacturing platform in a microgravity environment and a working method thereof, wherein the aerosol electronic device manufacturing platform in a microgravity environment comprises an atomizer and an in-situ sintering platform 10, wherein the atomizer comprises an ink tank 1, a piston 2, a capillary array 3, a carrier gas channel 5, a feed channel 6, an ultrasonic transducer 4, a sheath gas channel 7 and a nozzle 8, the ink tank 1 can contain ink, one end of the capillary array 3 is connected to one end of the ink tank 1, the piston 2 is slidably arranged at the other end of the ink tank 1, the carrier gas channel 5 is connected to the feed channel 6, the other end of the capillary array 3 is connected to the feed channel 6, the central axes of the carrier gas channel 5 and the feed channel 6 are on the same straight line, the ultrasonic transducer 4 is fixedly connected to the capillary array 3, the sheath gas channel 7 is connected to the feed channel 6, the nozzle 8 is connected to the feed channel 6, and the in-situ sintering platform 10 is located below the nozzle 8.

[0053] In the aerosol electronic device manufacturing platform in the microgravity environment, the ink is injected into the ink tank 1 and sealed with a piston 2. The piston 2 will automatically move as the ink is consumed, and the volume of the ink tank 1 containing the ink will change according to the automatic movement of the piston 2, thereby avoiding cavitation inside the ink during the consumption process. The capillary array 3 is connected to one end of the ink tank 1. The microgravity environment does not affect the action of the capillary force, and the ink enters the capillary array 3 under the action of the capillary force. The ultrasonic transducer 4 is fixedly connected to the capillary array 3 and in close contact. Under the action of the alternating voltage, the ultrasonic transducer 4 can drive the capillary array 3 to vibrate, breaking the ink at the liquid-gas interface at the end of the capillary array 3 to produce aerosol particles 9, which enter the feeding channel 6. The carrier gas enters the unloading channel 6 from the carrier gas channel 5. In the unloading channel 6, the aerosol particles 9 form a stable aerosol flow under the action of the carrier gas, and are converged and collimated by the sheath gas entering the unloading channel 6 from the sheath gas channel 7. Finally, after further convergence by the nozzle 8, a high-speed, collimated, sheath-gas protected aerosol beam is ejected from the nozzle 8 outlet and sprayed onto the in-situ sintering platform 10. The atomizer is compatible with a variety of materials such as polymers, metals, semiconductors, etc. and can stably produce aerosol droplets with a particle size of less than 5 microns. After being ejected from the nozzle 8, the aerosol beam is surrounded and protected by the sheath gas, reaches the high-temperature substrate of the in-situ sintering platform 10 and is quickly sintered in situ. The nanoparticles 11 quickly form a sintering neck under the action of the high temperature, thereby avoiding overspray, and obtaining a regular printed circuit with extremely low edge roughness. Moreover, by changing the gas volume flow ratio of the sheath gas to the carrier gas, aerosol beams of different widths can be obtained, thereby adjusting the printing resolution, such as Figure 2 As shown, the lower sheath gas flow rate / carrier gas flow rate brings a larger printing resolution, such as Figure 3 The figure shows a smaller printing resolution due to a higher sheath gas flow rate / carrier gas flow rate. By adjusting the ratio of the carrier gas to sheath gas volume flow rates, an ultra-fine resolution of 5 microns and an ultra-wide resolution range of 5-300 microns can also be obtained.

[0054] Optionally, the nozzle 8 adopts a Luer interface, which can be quickly disassembled and replaced, and nozzles 8 of different sizes can be selected to quickly adapt to circuit printing with different resolutions.

[0055] Optionally, the inner diameter of the nozzle 8 is 100 μm, 150 μm, 200 μm, 300 μm or 450 μm. A suitable inner diameter of the nozzle 8 can be selected according to the target resolution.

[0056] Optionally, the table top of the in-situ sintering platform 10 is made of alumina ceramic material.

[0057] The present invention also provides a working method of an aerosol electronic device manufacturing platform in a microgravity environment, using the above-mentioned aerosol electronic device manufacturing platform in a microgravity environment, comprising:

[0058] S1: Select ink materials for electronic device preparation.

[0059] Among them, the ink materials use metal conductive materials such as nanosilver and nanocopper, polymer insulating materials such as polyimide and polyurethane, quantum dot materials such as CdSe and PbS, thermoelectric materials such as SiGe and BiSb for energy conversion, or sensing materials such as MXene, MOF and graphene for temperature, humidity or pressure sensing.

[0060] The metal conductive material may be in the form of nanoparticles 11, nanosheets or nanowires.

[0061] S2: The ink material is configured into ink using a solvent.

[0062] The solvent is made of 60-75% deionized water, 5-10% diethylene glycol, 15-20% isopropyl alcohol and 0.5% terpineol in volume percentage. The viscosity of the ink is 1-50cp.

[0063] S3: Ink is injected into the ink tank 1 , and the piston 2 is slidably disposed in the ink tank 1 , so that the ink is located between the piston 2 and the capillary array 3 .

[0064] After the ink is injected into the ink tank 1, the piston 2 is used to seal it. The ink automatically wets and enters the capillary array 3. As the ink is consumed, the piston 2 automatically moves to compress the space in the ink tank 1 that holds the ink, so that the ink can be easily captured and transmitted.

[0065] S4: Turn on the ultrasonic transducer 4. Adjust the input voltage of the ultrasonic transducer 4 according to the viscosity of the ink. The higher the viscosity of the ink, the greater the critical atomization voltage required. The input voltage range of the ultrasonic transducer 4 is 10-50V. The frequency of the ultrasonic transducer 4 is 2400KHz.

[0066] S5: In-situ sintering platform 10. The table top of the in-situ sintering platform 10 is alumina ceramic, which can provide a heating temperature of 30-500°C. If the sintering temperature is too low, overspraying cannot be avoided. If the sintering temperature is too high, the aerosol droplets will completely dry before reaching the in-situ sintering platform 10, hindering inertial deposition. The optimal sintering temperature should be the lowest temperature at which the particles just form a sintering neck, which can be obtained by experiment or molecular dynamics simulation calculation.

[0067] S6: introducing carrier gas into the carrier gas channel 5 , and introducing sheath gas into the sheath gas channel 7 .

[0068] Among them, appropriate carrier gas flow rate and sheath gas flow rate are selected according to the target resolution. The carrier gas flow rate introduced into the carrier gas channel 5 is 0-500 sccm; the sheath gas flow rate introduced into the sheath gas channel 7 is 0-2000 sccm. The appropriate process window can be determined by experiments or computational fluid dynamics simulation methods.

[0069] S7: The ultrasonic transducer 4 drives the capillary array 3 to vibrate, breaking the ink at the liquid-gas interface at the end of the capillary array 3 to generate aerosol particles 9.

[0070] The direct physical contact between the ultrasonic transducer 4 and the capillary array 3 can better transmit ultrasonic energy.

[0071] S8: Aerosol particles 9 form an aerosol flow under the action of the carrier gas, and are converged and collimated by the sheath gas. After further convergence by the nozzle 8, the aerosol beam surrounded and protected by the sheath gas is ejected from the outlet of the nozzle 8 to the in-situ sintering platform 10.

[0072] The ink at the liquid-gas interface at the end of the capillary array 3 is vibrated and broken by the ultrasonic transducer 4 to generate aerosol particles 9, which enter the feeding channel 6. The carrier gas enters the feeding channel 6 from the carrier gas channel 5. In the feeding channel 6, the aerosol particles 9 form a stable aerosol flow under the action of the carrier gas, and are converged and collimated by the sheath gas entering the feeding channel 6 from the sheath gas channel 7. Finally, after further convergence by the nozzle 8, a high-speed, collimated aerosol beam surrounded and protected by the sheath gas is ejected from the outlet of the nozzle 8 and sprayed onto the high-temperature substrate of the in-situ sintering platform 10 for rapid in-situ sintering. The nanoparticles 11 quickly form a sintering neck under the action of the high temperature, thereby avoiding overspray.

[0073] The steps for preparing a conductive circuit using the aerosol electronic device manufacturing platform in a microgravity environment are as follows:

[0074] Step 1: Select silver, a conductor material commonly used in electronic devices, in the form of spherical nanoparticles 11 with an average particle size of 45 nm.

[0075] Step 2: Take 1.0g of nanosilver particles and add them to a mixed solvent, which is made of 72% deionized water, 6% diethylene glycol, 21.5% isopropyl alcohol and 0.5% terpineol by volume. Stir at 600r / min for 1h at room temperature, then place in an ultrasonic water bath for ultrasonic dispersion for 0.5h to obtain the desired conductive ink, the viscosity of which is 22cp.

[0076] Step 3: Ink is injected into the ink reservoir 1 , and the ink automatically wets and enters the capillary array 3 .

[0077] Step 4: Turn on the ultrasonic transducer 4. The frequency of the ultrasonic transducer 4 is 2400KHz and the voltage is 32V.

[0078] Step 5: Turn on the in-situ sintering platform 10. The temperature of the in-situ sintering platform 10 is 175°C.

[0079] Step 6: Introduce carrier gas into carrier gas channel 5 and sheath gas into sheath gas channel 7. According to the target resolution of 15 microns, a nozzle 8 with an inner diameter of 150 microns is selected, the carrier gas flow rate is 40 sccm, and the sheath gas flow rate is 165 sccm.

[0080] Step 7: The ultrasonic transducer 4 drives the capillary array 3 to vibrate, breaking up the ink at the liquid-gas interface at the end of the capillary array 3 to generate aerosol particles 9 .

[0081] Step eight: aerosol particles 9 form an aerosol flow under the action of carrier gas, and are converged and collimated by sheath gas. After further convergence by nozzle 8, the aerosol beam surrounded and protected by sheath gas is ejected from the outlet of nozzle 8 to the in-situ sintering platform 10.

[0082] When the in-situ sintering platform 10 is not turned on, a large amount of overspray occurs, such as Figure 5 and 6 As shown, the microscopic morphology of the circuit is separated spherical nanoparticles 11. After the in-situ sintering platform 10 is turned on, the in-situ sintering of the aerosol beam is achieved, avoiding the generation of overspray, as shown in FIG. Figure 7 and 8 As shown, the microscopic morphology of the circuit shows that the spherical nanoparticles 11 form sintering necks to achieve connection. The printed conductive circuit was measured after being kept at 175°C for 1 hour, and the resistivity was 26μΩ·cm, which meets the conductivity requirements of the electronic circuit.

[0083] Obviously, the embodiments of the present invention disclosed above are only used to help illustrate the present invention. The embodiments do not describe all the details in detail, nor do they limit the invention to specific implementation methods. According to the content of this specification, many modifications and changes can be made. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. It is not necessary and impossible to list all the implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the claims of the present invention.

Claims

1. An aerosol electronic device manufacturing platform in a microgravity environment, characterized in that: The invention comprises an atomizer and an in-situ sintering platform (10), wherein the atomizer comprises: An ink tank (1), wherein the ink tank (1) can contain ink; A piston (2) and a capillary array (3), one end of the capillary array (3) being connected to one end of the ink reservoir (1), and the piston (2) being slidably disposed at the other end of the ink reservoir (1); A carrier gas channel (5) and a feed channel (6), wherein the carrier gas channel (5) and the feed channel (6) are in communication, the other end of the capillary array (3) is in communication with the feed channel (6), and the central axes of the carrier gas channel (5) and the feed channel (6) are in the same straight line; An ultrasonic transducer (4), the ultrasonic transducer (4) being fixedly connected to the capillary array (3); a sheath gas channel (7), wherein the sheath gas channel (7) is in communication with the feed channel (6); A nozzle (8), the nozzle (8) is connected to the feed channel (6), and the in-situ sintering platform (10) is located below the nozzle (8).

2. The aerosol electronic device manufacturing platform in a microgravity environment according to claim 1, characterized in that: The nozzle (8) adopts a Luer interface.

3. The aerosol electronic device manufacturing platform in a microgravity environment according to claim 1, characterized in that: The inner diameter of the nozzle (8) is 100 μm, 150 μm, 200 μm, 300 μm or 450 μm.

4. The aerosol electronic device manufacturing platform in a microgravity environment according to claim 1, characterized in that: The table top of the in-situ sintering platform (10) is made of alumina ceramic material.

5. A working method of an aerosol electronic device manufacturing platform in a microgravity environment, characterized in that: An aerosol electronic device manufacturing platform in a microgravity environment according to any one of claims 1 to 4, comprising: S1: Select ink materials for electronic device preparation; S2: preparing ink materials into ink using a solvent; S3: Ink is injected into the ink tank (1), and the piston (2) is slidably disposed in the ink tank (1) so that the ink is located between the piston (2) and the capillary array (3); S4: Turn on the ultrasonic transducer (4); S5: in-situ sintering platform (10); S6: introducing carrier gas into the carrier gas channel (5) and introducing sheath gas into the sheath gas channel (7); S7: the ultrasonic transducer (4) drives the capillary array (3) to vibrate, breaking up the ink at the liquid-gas interface at the end of the capillary array (3) to generate aerosol particles (9); S8: The aerosol particles (9) form an aerosol flow under the action of the carrier gas, and are converged and collimated by the sheath gas. After further convergence by the nozzle (8), the aerosol flow surrounded and protected by the sheath gas is ejected from the outlet of the nozzle (8) to the in-situ sintering platform (10).

6. The working method of the aerosol electronic device manufacturing platform in a microgravity environment according to claim 5, characterized in that: In S1, the ink material is a metal conductive material, a polymer insulating material, a quantum dot material, a thermoelectric material for energy conversion, or a sensing material for temperature, humidity or pressure sensing.

7. The working method of the aerosol electronic device manufacturing platform in a microgravity environment according to claim 5, characterized in that: In S2, the solvent is made of 60-75% deionized water, 5-10% diethylene glycol, 15-20% isopropyl alcohol, and 0.5% terpineol in volume percentage.

8. The working method of the aerosol electronic device manufacturing platform in a microgravity environment according to claim 5, characterized in that: In S4, the input voltage of the ultrasonic transducer (4) is adjusted according to the viscosity of the ink. The higher the viscosity of the ink, the greater the critical atomization voltage required. The input voltage range of the ultrasonic transducer (4) is 10-50V.

9. The working method of the aerosol electronic device manufacturing platform in a microgravity environment according to claim 5, characterized in that: In S5, the in-situ sintering platform (10) can provide a heating temperature of 30-500°C.

10. The working method of the aerosol electronic device manufacturing platform in a microgravity environment according to claim 5, characterized in that: In S6, the flow rate of the carrier gas introduced into the carrier gas channel (5) is 0-500 sccm; the flow rate of the sheath gas introduced into the sheath gas channel (7) is 0-2000 sccm.

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