High-temperature-resistant and chemical-resistant base-material-free adhesive tape for wearable electronic product

Abstract

The invention relates to the technical field of pressure-sensitive adhesives, in particular to a high-temperature-resistant chemical-resistant base-material-free adhesive tape for wearable electronic products. The adhesive comprises a synthetic masterbatch, a high-temperature-resistant nano filler and a curing agent, the synthetic masterbatch comprises a mixed solvent, a mixed monomer and an initiator, the adhesive is mainly used for preparing the base-material-free adhesive tape for the flexible sealing ring of the wearable electronic product, and the adhesive tape adhesive is self-made and synthesized, is an acid-free and resin-free polyacrylate adhesive, and has the advantages that the adhesive tape is high in adhesive strength and high in adhesive strength; the prepared masterbatch has the characteristics of good cohesion performance, good chemical resistance, good solvent resistance and the like; the adhesive tape prepared by the invention has better high-temperature range usability, and keeps higher viscoelasticity at 85-105 DEG C.

Description

Technical Field

[0001] The invention relates to the technical field of pressure-sensitive adhesives, in particular to a high-temperature and chemical-resistant sealing substrate-free adhesive tape for wearable electronic products. Background Art

[0002] Chemical resistant acrylic tape is a special tape that uses high-performance acrylic polymer as an adhesive. Its outstanding feature is that it exhibits excellent bonding performance and durability when facing various chemical substances. This tape is usually composed of a substrate (such as polyester film, polyimide film, glass cloth, etc.) and an acrylic pressure-sensitive adhesive covering it. Sometimes a special protective coating or adhesive backing is added to adapt to more demanding use environments.

[0003] The design of chemical-resistant tapes for wearable electronic products must take into account the miniaturization, flexibility, and safety of contact with human skin. Therefore, the materials selected often have the following characteristics: high adhesion, low residue, breathability, softness and comfort, and excellent chemical resistance. These characteristics ensure that the tape can not only fit electronic components of different shapes and sizes tightly, but also will not cause discomfort to the human body. At the same time, it can still maintain a stable functional state when facing sweat, detergents, and chemical components in daily necessities. The following are several typical application scenarios:

[0004] 1. Sensor fixation

[0005] The functions of heart rate monitoring, blood pressure measurement, and exercise tracking integrated in wearable devices such as smart watches and fitness bands rely on precision sensors. In order to accurately capture physiological signals, the sensors need to be close to the skin. At this time, chemical-resistant tape plays an important role. It can permanently fix the sensor in the designated position, and it is not easy to fall off even in the case of sweating during exercise or taking a shower, while ensuring that sensitive skin is not irritated.

[0006] 2. Wireless charging module isolation

[0007] Many wearable devices use wireless charging technology, which requires a compact and efficient internal layout. Using chemical-resistant tape to isolate the wireless charging coil from other electronic components not only prevents electromagnetic interference, but also protects sensitive circuits from damage during daily cleaning or contact with products containing chemical ingredients.

[0008] 3. Sealing between display screen and housing

[0009] The display is an important part of wearable devices, and the edge of the screen is often a weak point for dust and moisture to enter. Using chemical-resistant tape to seal along the perimeter of the display panel can effectively prevent the entry of external pollutants and extend the service life of the device, especially in humid environments such as outdoor sports and swimming. This function is particularly critical.

[0010] In the above circumstances, higher requirements are placed on the chemical resistance, high temperature resistance and waterproofness of the tape.

[0011] In order to solve the above problems, the present invention provides a high temperature and chemical resistant sealing substrate-free adhesive tape for wearable electronic products. Summary of the invention

[0012] The object of the present invention is to provide a high temperature and chemical resistant sealing substrate-free adhesive tape for wearable electronic products to solve the problems raised in the above background technology.

[0013] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0014] A high temperature and chemical resistant sealing tape without substrate for wearable electronic products, comprising a synthetic masterbatch, a high temperature resistant nano filler and a curing agent, wherein the synthetic masterbatch comprises the following components by weight:

[0015] 20 parts of mixed solvent

[0016] Mixed monomer 37.26 parts

[0017] Initiator 0.12 parts;

[0018] The mixed solvent is butyl acetate and ethyl acetate in a ratio of 3:7.

[0019] The mass ratio of the curing agent is 0.5-3%;

[0020] The mass ratio of the high temperature resistant nano filler is 0.01-0.02%.

[0021] More preferably, the curing agent is lysine diisocyanate or toluene diisocyanate or a mixture of the two.

[0022] More optimally, the high temperature resistant nano filler is carbon fiber or a mixture of carbon fiber and potassium titanate.

[0023] More optimally, the mixed monomer is glycidyl methacrylate, tert-butyl acrylate, cyclohexyl methacrylate, cyclohexyl acrylate, isobornyl acrylate, dicyclopentadienyl methacrylate, dicyclopentadienyl acrylate, isooctyl acrylate, hydroxyethyl acrylate, hydroxypropyl acrylate, glycidyl acrylate, cyclohexyl methacrylate, dicyclodecane methyl acrylate, octadecyl methacrylate, ethyl acetoacetate methacrylate, dimethylaminoethyl methacrylate, trifluoroethyl acrylate, acrylonitrile, maleic anhydride, itaconic acid and crotonic acid.

[0024] More optimally, the initiator is azobisisobutyronitrile, azobisisoheptanenitrile and dibenzoyl peroxide.

[0025] The present invention also provides a method for preparing a high temperature and chemical resistant sealing substrate-free adhesive tape for wearable electronic products, comprising the following steps:

[0026] S1, take 6 parts of butyl acetate and 14 parts of ethyl acetate to form a mixed solvent, add it into a four-necked reactor, adjust the temperature to 40±5°C, then take a specified amount of mixed monomers, add them into the four-necked reactor and mix them evenly to form a monomer mixed solution;

[0027] S2, using a 1L four-necked flask, adjusting the water bath temperature to 60-70°C, passing protective gas for 10 minutes, taking 15 parts of the monomer mixed solution obtained in step S1 and adding them to the four-necked flask, adding 0.01 parts of azobisisobutyronitrile, 0.02 parts of azobisisoheptanenitrile, and 0.05 parts of dibenzoyl peroxide, and reacting with the initiator for 1.5 hours, and then dividing the remaining monomer mixed solution into two parts, and adding them to the four-necked flask twice, each time reacting for 30 minutes;

[0028] S3, after the last addition of the monomer mixed solution, 0.01 parts of azobisisobutyronitrile, 0.01 parts of azobisisoheptanenitrile, and 0.02 parts of dibenzoyl peroxide are added, the temperature is raised to 70-75°C, the drop rate is controlled at 5 parts / 1min, and the heating is stopped after keeping warm for 3 hours. During this process, protective gas is continuously introduced, and then refluxed and cooled to room temperature to obtain a synthetic masterbatch, at which the solid content is 39%;

[0029] S4, adding a certain amount of high temperature resistant nano filler and curing agent into the synthetic masterbatch to form an adhesive layer, and adhering it to the silicone release film to obtain a finished product of a high temperature resistant and chemical resistant sealing substrate-free adhesive tape for wearable electronic products.

[0030] More optimally, the mixed monomer includes 5 parts of glycidyl methacrylate, 5 parts of tert-butyl acrylate, 2 parts of cyclohexyl methacrylate, 5 parts of cyclohexyl acrylate, 3.4 parts of isobornyl acrylate, 1.5 parts of dicyclopentadienyl methacrylate, 0.5 parts of dicyclopentadienyl acrylate, 3.3 parts of isooctyl acrylate, 1 part of hydroxyethyl acrylate, 2.7 parts of hydroxypropyl acrylate, 1.0 part of glycidyl acrylate, 0.7 part of cyclohexyl methacrylate, 2.4 parts of dicyclodecane methyl acrylate, 1.3 parts of octadecyl methacrylate, 1.5 parts of ethyl acetoacetate methacrylate, 0.5 parts of dimethylaminoethyl methacrylate, 0.05 parts of trifluoroethyl acrylate, 0.2 parts of acrylonitrile, 0.17 parts of maleic anhydride, 0.02 parts of itaconic acid and 0.02 parts of crotonic acid.

[0031] More optimally, the thickness of the adhesive layer is 100 μm.

[0032] More preferably, the protective gas is nitrogen, argon, helium or carbon dioxide.

[0033] Compared with the prior art, the beneficial effects achieved by the present invention are:

[0034] (1) In the present invention, a substrate-free adhesive tape for a flexible sealing ring of wearable electronic products is mainly prepared. The adhesive of the tape is synthesized by itself and is an acid-free and resin-free polyacrylate adhesive. The prepared masterbatch has good cohesive properties and good chemical resistance, solvent resistance and other properties. The adhesive tape prepared by the present invention has good high temperature range performance and maintains a high viscoelasticity at 85-105°C.

[0035] (2) In the present invention, high temperature resistant nano fillers are added to the masterbatch, which can achieve good heat dissipation performance, with a thermal conductivity coefficient of >1.15;

[0036] (3) In the present invention, the methyl methacrylate added to the mixed monomer forms polymethyl methacrylate (PMMA) after polymerization, which has excellent optical properties and chemical resistance, especially good resistance to weak acids, weak bases and various organic solvents;

[0037] (4) In the present invention, acrylonitrile added to the mixed monomer is often copolymerized with other acrylate monomers to prepare a polymer having excellent chemical resistance and mechanical strength, so as to improve the chemical resistance and mechanical properties of the adhesive tape of the present invention;

[0038] (5) In the present invention, the mixed monomers include acrylate series monomers such as methyl acrylate, ethyl acrylate, butyl acrylate, and isooctyl acrylate, each of which has a different side chain length and polarity. The desired chemical resistance balance can be obtained by adjusting the structure of the side chain. For example, isooctyl acrylate has better hydrolysis resistance and solvent resistance due to its longer alkyl chain.

[0039] (6) In the present invention, the added maleic anhydride can significantly improve the acid and alkali resistance, solvent resistance and thermal stability of the polymer when copolymerized with acrylic acid ester or other monomers;

[0040] (7) In the present invention, itaconic acid and crotonic acid are added, both of which are monomers with special double bond structures, which can introduce additional cross-linking points, thereby enhancing the chemical resistance of the polymer, especially performing well in strong acid or strong base environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0042] Figure 1 It is a line graph of the heat resistance of the masterbatch prepared in Example 3 and Example 4;

[0043] Figure 2is the rheological properties diagram of the masterbatch;

[0044] Figure 3 This is the DMA curve of the composite of competitor film and PET.

[0045] Figure 4 The DMA curve diagram of the composite of the adhesive film and PET prepared by the present invention;

[0046] Figure 5 The figure is a bar graph of thermal conductivity of the adhesive tapes prepared in Example 4 and various comparative examples. DETAILED DESCRIPTION

[0047] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0048] The present invention provides a method for preparing a high temperature resistant and chemical resistant sealing substrate-free adhesive tape for wearable electronic products, comprising the following steps:

[0049] S1, take 6 parts of butyl acetate and 14 parts of ethyl acetate to form a mixed solvent, add it into a four-necked reactor, adjust the temperature to 40±5℃, then take 5 parts of glycidyl methacrylate, 5 parts of tert-butyl acrylate, 2 parts of cyclohexyl methacrylate, 5 parts of cyclohexyl acrylate, 3.4 parts of isobornyl acrylate, 1.5 parts of dicyclopentadienyl methacrylate, 0.5 parts of dicyclopentadienyl acrylate, 3.3 parts of isooctyl acrylate, 1 part of hydroxyethyl acrylate, 2.7 parts of hydroxypropyl acrylate, 1. 0 parts of glycidyl acrylate, 0.7 parts of cyclohexyl methacrylate, 2.4 parts of dicyclodecane methyl acrylate, 1.3 parts of octadecyl methacrylate, 1.5 parts of ethyl acetoacetate methacrylate, 0.5 parts of dimethylaminoethyl methacrylate, 0.05 parts of trifluoroethyl acrylate, 0.2 parts of acrylonitrile, 0.17 parts of maleic anhydride, 0.02 parts of itaconic acid and 0.02 parts of crotonic acid to form a mixed monomer, and add the mixed monomer into a four-necked reactor and mix evenly to form a monomer mixed solution;

[0050] S2, using a 1L four-necked flask, adjusting the water bath temperature to 60-70°C, passing protective gas for 10 minutes, taking 15 parts of the monomer mixed solution obtained in step S1 and adding them to the four-necked flask, adding 0.01 parts of azobisisobutyronitrile, 0.02 parts of azobisisoheptanenitrile, and 0.05 parts of dibenzoyl peroxide, and reacting with the initiator for 1.5 hours, and then dividing the remaining monomer mixed solution into two parts, and adding them to the four-necked flask twice, each time reacting for 30 minutes;

[0051] S3, after the last addition of the monomer mixed solution, 0.01 parts of azobisisobutyronitrile, 0.01 parts of azobisisoheptanenitrile, and 0.02 parts of dibenzoyl peroxide are added, the temperature is raised to 70-75°C, the drop rate is controlled at 5 parts / 1min, and the heating is stopped after keeping warm for 3 hours. During this process, protective gas is continuously introduced, and then refluxed and cooled to room temperature to obtain a synthetic masterbatch, at which the solid content is 39%;

[0052] S4, adding a certain amount of high temperature resistant nano filler and curing agent into the synthetic masterbatch to form an adhesive layer, and adhering it to the silicone release film to obtain a finished product of a high temperature resistant and chemical resistant sealing substrate-free adhesive tape for wearable electronic products.

[0053] In order to verify the performance and effect of the adhesive tape prepared by the present invention, the present invention provides several embodiments and comparative examples for testing and comparison. The basic technical indicators to be achieved are: chemical solvent resistance without viscosity reduction, viscosity residual rate>80%; thermal conductivity>1.15; high temperature peeling force viscosity reduction ratio<100%.

[0054] The materials and sources used in the examples and comparative examples are shown in Table 1.

[0055] Table 1 Materials and sources

[0056]

[0057]

[0058] In each embodiment of the present invention, the contents of the mixed solvent, the mixed monomer and the mixed initiator are the same, that is, the prepared synthetic masterbatch is the same, the thickness of the adhesive layer is 100 μm, and all are designed without substrate adhesive and silicone release film. The difference is:

[0059] Example 1: 0.5% by mass of lysine diisocyanate was added to the synthetic masterbatch.

[0060] Example 2: Add 0.5% by mass of toluene diisocyanate into the synthetic masterbatch.

[0061] Example 3: 0.5% by mass of lysine diisocyanate and 0.5% by mass of toluene diisocyanate were added to the synthetic masterbatch.

[0062] Example 4: 1% by mass of lysine diisocyanate and 0.5% by mass of toluene diisocyanate were added to the synthetic masterbatch.

[0063] Example 5: 2% by mass of lysine diisocyanate and 0.5% by mass of toluene diisocyanate were added to the synthetic masterbatch.

[0064] Example 6: Add 2% by mass of lysine diisocyanate and 1% by mass of toluene diisocyanate into the synthetic masterbatch.

[0065] The masterbatches prepared in several embodiments were tested, and the residual rates of the masterbatches in different solvents were shown in Table 2.

[0066] In the present invention, the test method for the chemical resistance peeling force residual of the prepared adhesive tape is:

[0067] GB / T 2792-2014 "Test method for resistance of adhesive tape to liquid media". The peel force residue is used as the test method;

[0068] Residual rate n% = peeling force of adhesive layer relative to SUS after immersion in solution / peeling force of adhesive layer relative to SUS at room temperature * 100%.

[0069] Table 2 Residual rate of peeling force of masterbatch prepared in different embodiments in different solvents

[0070] project strong acid strong base Oleic acid Isopropyl alcohol Ethanol Sebum Sunscreen CocktailV2 Example 1 45.7％ 85.2％ 87.5％ 65.8％ 75.4％ 84.2％ 88.7％ 66.1％ Example 2 55.8％ 88.6％ 81.4％ 78.3％ 80.4％ 82.7％ 83％ 79.5％ Example 3 84.7％ 81.3％ 84.2％ 88.1％ 88.4％ 82.4％ 90.7％ 82.4％ Example 4 81.2％ 85.8％ 87.7％ 84％ 89.8％ 90.1％ 91.6％ 84.2％ Example 5 87.5％ 83.6％ 88.2％ 79.1％ 82.4％ 83.5％ 83％ 86.6％ Example 6 80.9％ 80.1％ 84.2％ 77.2％ 79.5％ 84.7％ 88.1％ 90.2％

[0071] It can be seen from Table 2 that among several embodiments, the effects of Embodiment 3 and Embodiment 4 are the best, and the residual rates in various solvents are kept above 80%. At the same time, the masterbatch prepared in Embodiment 3 and Embodiment 4 is tested for its temperature resistance, and the results are as follows: Figure 1 As shown, the rheological properties of the masterbatch are Figure 2 shown.

[0072] It can be seen that the high temperature resistance of Example 4 is strong. At the same time, the masterbatch test curve shows that the chemical resistant masterbatch has a higher modulus (>200Mpa) at room temperature and also has a higher modulus (>30Mpa) in the high temperature range, so it has better cohesion and high temperature resistance.

[0073] In addition, the present invention uses the film prepared in Example 4 and the commercially available competitive film to be combined with PET for dynamic thermomechanical analysis, and the DMA curves of the two are as follows: Figure 3 and Figure 4 As shown. Among them, Figure 3 This is the DMA curve of the competitor film. Figure 4 This is the DMA curve of the film prepared in Example 4.

[0074] The DMA curve of the composite film of the synthetic formula of the present invention and PET shows that during the heating process, the modulus E' of the synthetic formula decreases more slowly than that of competing products as the temperature increases. Therefore, the synthetic formula has better resistance to deformation in the high temperature zone and has better sealing performance in the high temperature zone.

[0075] Next, the present invention takes Example 4 as a basis to carry out comparative design of heat resistance of adhesive tape, and the specific scheme is as follows:

[0076] Comparative Example 1: No filler added.

[0077] Comparative Example 2: 0.01% by mass of carbon fiber is used as the high temperature resistant nano filler.

[0078] Comparative Example 3: 0.02% by mass of carbon fiber is used as the high temperature resistant nano filler.

[0079] Comparative Example 4: 0.05% by mass of carbon fiber is used as the high temperature resistant nano filler.

[0080] Example 4: 0.01% carbon fiber and 0.005% potassium titanate in a mass ratio are used as high temperature resistant nano fillers.

[0081] Comparative Example 5: 0.01% carbon fiber and 0.01% potassium titanate were used as high temperature resistant nano fillers in a mass ratio.

[0082] The thermal conductivity of the adhesive tapes prepared in Example 4 and several comparative examples was tested. The results are as follows: Figure 5 As shown, it can be seen that the thermal conductivity of Example 5 is the best, but excessive addition of filler will affect the appearance of the tape, and easily cause the mechanical properties of the tape to decrease, reducing the strength of the tape. Therefore, the best formula in the present invention is Example 4, which has a thermal conductivity of >1.22, a viscosity residual rate of >80%, and a high-temperature peel force viscosity reduction ratio of <100% without affecting the performance and appearance, thus meeting the use requirements of the tape.

[0083] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0084] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A high temperature and chemical resistant sealing tape without substrate for wearable electronic products, characterized in that: The invention comprises a synthetic masterbatch, a high temperature resistant nano filler and a curing agent, wherein the synthetic masterbatch comprises the following components by weight: 20 parts of mixed solvent Mixed monomer 37.26 parts Initiator 0.12 parts; The mixed solvent is butyl acetate and ethyl acetate in a ratio of 3:

7. The mass ratio of the curing agent is 0.5-3%; The mass ratio of the high temperature resistant nano filler is 0.01-0.02%.

2. The high temperature and chemical resistant sealing tape for wearable electronic products according to claim 1, characterized in that: The curing agent is lysine diisocyanate or toluene diisocyanate or a mixture of the two.

3. The high temperature and chemical resistant sealing tape for wearable electronic products according to claim 1, characterized in that: The high temperature resistant nano filler is carbon fiber or a mixture of carbon fiber and potassium titanate.

4. The high temperature and chemical resistant sealing tape for wearable electronic products according to claim 1, characterized in that: The mixed monomers are glycidyl methacrylate, tert-butyl acrylate, cyclohexyl methacrylate, cyclohexyl acrylate, isobornyl acrylate, dicyclopentadienyl methacrylate, dicyclopentadienyl acrylate, isooctyl acrylate, hydroxyethyl acrylate, hydroxypropyl acrylate, glycidyl acrylate, cyclohexyl methacrylate, dicyclodecane methyl acrylate, octadecyl methacrylate, ethyl acetoacetate methacrylate, dimethylaminoethyl methacrylate, trifluoroethyl acrylate, acrylonitrile, maleic anhydride, itaconic acid and crotonic acid.

5. The high temperature and chemical resistant sealing tape for wearable electronic products according to claim 1, characterized in that: The initiator is azobisisobutyronitrile, azobisisoheptanenitrile and dibenzoyl peroxide.

6. A method for preparing a high temperature and chemical resistant sealing substrate-free tape for wearable electronic products, characterized in that: The steps include: S1, take 6 parts of butyl acetate and 14 parts of ethyl acetate to form a mixed solvent, add it into a four-necked reactor, adjust the temperature to 40±5°C, then take a specified amount of mixed monomers, add them into the four-necked reactor and mix them evenly to form a monomer mixed solution; S2, using a 1L four-necked flask, adjusting the water bath temperature to 60-70°C, passing protective gas for 10 minutes, taking 15 parts of the monomer mixed solution obtained in step S1 and adding them to the four-necked flask, adding 0.01 parts of azobisisobutyronitrile, 0.02 parts of azobisisoheptanenitrile, and 0.05 parts of dibenzoyl peroxide, and reacting with the initiator for 1.5 hours, and then dividing the remaining monomer mixed solution into two parts, and adding them to the four-necked flask twice, each time reacting for 30 minutes; S3, after the last addition of the monomer mixed solution, 0.01 parts of azobisisobutyronitrile, 0.01 parts of azobisisoheptanenitrile, and 0.02 parts of dibenzoyl peroxide are added, the temperature is raised to 70-75°C, the drop rate is controlled at 5 parts / 1min, and the heating is stopped after keeping warm for 3 hours. During this process, protective gas is continuously introduced, and then refluxed and cooled to room temperature to obtain a synthetic masterbatch, at which the solid content is 39%; S4, adding a certain amount of high temperature resistant nano filler and curing agent into the synthetic masterbatch to form an adhesive layer, and adhering it to the silicone release film to obtain a finished product of a high temperature resistant and chemical resistant sealing substrate-free adhesive tape for wearable electronic products.

7. The method for preparing a high temperature and chemical resistant sealing substrate-free adhesive tape for wearable electronic products according to claim 6, characterized in that: The mixed monomer includes 5 parts of glycidyl methacrylate, 5 parts of tert-butyl acrylate, 2 parts of cyclohexyl methacrylate, 5 parts of cyclohexyl acrylate, 3.4 parts of isobornyl acrylate, 1.5 parts of dicyclopentadienyl methacrylate, 0.5 parts of dicyclopentadienyl acrylate, 3.3 parts of isooctyl acrylate, 1 part of hydroxyethyl acrylate, 2.7 parts of hydroxypropyl acrylate, 1.0 part of glycidyl acrylate, 0.7 part of cyclohexyl methacrylate, 2.4 parts of dicyclodecane methyl acrylate, 1.3 parts of octadecyl methacrylate, 1.5 parts of ethyl acetoacetate methacrylate, 0.5 parts of dimethylaminoethyl methacrylate, 0.05 parts of trifluoroethyl acrylate, 0.2 parts of acrylonitrile, 0.17 parts of maleic anhydride, 0.02 parts of itaconic acid and 0.02 parts of crotonic acid.

8. The method for preparing a high temperature and chemical resistant sealing substrate-free adhesive tape for wearable electronic products according to claim 6, characterized in that: The thickness of the adhesive layer is 100 μm.

9. The method for preparing a high temperature and chemical resistant sealing substrate-free adhesive tape for wearable electronic products according to claim 6, characterized in that: The protective gas is nitrogen, argon, helium or carbon dioxide.

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