Method for manufacturing loading member and loading stable, loading member, loading stable, and thinning system

Abstract

The embodiment of the invention provides a manufacturing method of a loading piece and a wafer loading table, the loading piece, the wafer loading table and a wafer thinning system. The loading part is used for adsorbing a wafer, and comprises the following steps: adding a porous material into a mold, and sintering to form the adsorption part with a breathable porous structure; and manufacturing a blocking part with a non-breathable structure in an area, corresponding to the notch of the wafer, of the adsorption part, and enabling the blocking part and the adsorption part to form an integrated structure so as to prevent particulate matters from entering the adsorption part from the notch of the wafer. According to the manufacturing method of the loading part, the yield of the loading part can be increased, machining is easy, and the rejection rate is reduced.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of wafer thinning technology, and in particular to a method for manufacturing a loading component and a wafer loading platform, and a loading component, a wafer loading platform, and a wafer thinning system. Background Art

[0002] The integrated circuit industry is the core of the information technology industry and plays a key role in promoting the transformation and upgrading of the manufacturing industry towards digitalization and intelligence. Chips are the carriers of integrated circuits, and chip manufacturing involves process flows such as integrated circuit design, wafer manufacturing, wafer processing, electrical measurement, cutting packaging and testing.

[0003] In the back-end process stage of integrated circuit manufacturing, in order to reduce the package mounting height, reduce the chip package volume, improve the chip's thermal diffusion efficiency, electrical performance, mechanical properties, and reduce the chip processing volume, the wafer needs to be back-ground before subsequent packaging to thin the wafer to a predetermined thickness; the chip thickness after back-ground can even be less than 5% of the initial thickness.

[0004] The wafer thinning process is performed on a thinning device, wherein a wafer chuck table is one of the key components of the wafer thinning device, and is used to hold the wafer to be ground.

[0005] The wafer loading platform usually includes a porous suction cup (ceramic suction cup) which holds the wafer to be ground by vacuum adsorption. Therefore, vacuum is a necessary condition for the wafer loading platform to adsorb the substrate.

[0006] For the convenience of positioning, a notch is set on the periphery of a large-sized wafer. The wafer placed on the wafer loading platform is adsorbed by the negative pressure formed between the porous suction cup and the wafer. Usually, since the notch of the wafer is connected to the external atmosphere, some air leakage will occur, which will affect the vacuum between the porous suction cup and the wafer, and thus affect the reliability of wafer adsorption; in addition, particles and other grinding debris generated by wafer grinding will enter the interior of the porous suction cup along the notch, which will affect the flatness of the porous suction cup, or a large amount of particles will accumulate at the notch, increasing the difficulty of wafer cleaning. Summary of the invention

[0007] In view of this, the embodiments of the present application provide a method for manufacturing a loading component and a wafer loading platform, and a loading component, a wafer loading platform, and a wafer thinning system, which can improve the yield of the loading component, simplify processing, and reduce the scrap rate.

[0008] According to the first aspect of the present invention, a method for manufacturing a loading part is provided, wherein the loading part is used for adsorbing wafers, comprising: adding porous material into a mold to sinter to form an adsorption part with an air-permeable porous structure; manufacturing a sealing part with a non-air-permeable structure in an area of ​​the adsorption part corresponding to the notch of the wafer, and forming the sealing part and the adsorption part into an integral structure to prevent particulate matter from entering the adsorption part through the notch of the wafer.

[0009] Optionally, a sealing portion with a non-air-permeable structure is manufactured in the area of ​​the adsorption portion corresponding to the notch of the wafer, and the sealing portion and the adsorption portion are formed into an integrated structure, including: pouring a dense filling slurry in the area of ​​the adsorption portion corresponding to the notch of the wafer to manufacture the sealing portion.

[0010] Optionally, a sealing part with a non-air-permeable structure is manufactured in the area of ​​the adsorption part corresponding to the notch of the wafer, and the sealing part and the adsorption part are formed into an integrated structure, including: using a porous material in the area corresponding to the sealing part, and removing the pore-forming agent to form the sealing part.

[0011] Optionally, a sealing portion with a non-air-permeable structure is manufactured in the area of ​​the adsorption portion corresponding to the notch of the wafer, so that the sealing portion and the adsorption portion are formed into an integrated structure, including: opening a matching groove in the area of ​​the adsorption portion corresponding to the notch of the wafer; manufacturing the sealing portion, and setting the sealing portion in the matching groove to form the sealing portion and the adsorption portion into an integrated structure.

[0012] Optionally, the step of adding raw materials into the mold to sinter to form the adsorption part with a breathable structure includes: adding raw materials into the mold to sinter to form the adsorption part with a matching groove; the step of forming the sealing part and the adsorption part into an integrated structure includes: manufacturing the sealing part, and bonding or sintering the sealing part and the adsorption part into an integrated structure.

[0013] Optionally, manufacturing the blocking portion and setting the blocking portion in the matching groove includes: manufacturing a block-shaped blocking portion matching the shape of the matching groove, and assembling the blocking portion into the matching groove.

[0014] Optionally, the manufacturing of the plugging portion and setting the plugging portion in the matching groove includes: applying a dense filling slurry on the surface of the matching groove to form a layered plugging portion.

[0015] Optionally, a sealing portion with a non-air-permeable structure is arranged in the area of ​​the adsorption portion corresponding to the notch of the wafer, including: along the area of ​​the adsorption portion corresponding to the notch of the wafer, a sealing portion extending along the thickness direction of the adsorption portion is arranged on the contour on the horizontal plane where the adsorption portion and the wafer are bonded, the sealing portion forms a separation interface extending along the thickness direction of the adsorption portion to prevent particles from entering from the side of the sealing portion facing the notch of the wafer to the side of the sealing portion facing away from the notch of the wafer.

[0016] Optionally, a sealing portion extending along the thickness direction of the adsorption portion is provided along the contour of the area along the adsorption portion corresponding to the notch of the wafer on the horizontal plane where the adsorption portion and the wafer are bonded, including: along the area along the adsorption portion corresponding to the notch of the wafer, along the contour of the area along the adsorption portion on the horizontal plane where the adsorption portion and the wafer are bonded, a dense filling slurry is injected along the thickness direction of the adsorption portion by pressurized injection to form the sealing portion.

[0017] Optionally, the depth of the blocking portion along the thickness direction of the adsorption portion is not less than the wear amount of the loading member in the thickness direction during use.

[0018] Optionally, the depth of the mating groove is not less than 2 mm.

[0019] According to the second aspect of the present invention, the method for manufacturing a wafer loading platform includes: manufacturing a support member and opening a placement groove in the middle of the support member; manufacturing a loading member coupled to the placement groove; the loading member and the support member form the wafer loading platform.

[0020] Optionally, the manufacturing of the loading part to be combined with the placement groove includes: manufacturing an adsorption portion of the loading part that matches the shape of the placement groove, and setting the adsorption portion in the placement groove to be bonded to the support member as a whole; manufacturing a sealing portion with a non-air-permeable structure in the area of ​​the adsorption portion corresponding to the notch of the wafer, and forming the sealing portion and the adsorption portion into an integrated structure.

[0021] Optionally, a sealing portion with a non-air-permeable structure is manufactured in the area of ​​the adsorption portion corresponding to the notch of the wafer, and the sealing portion and the adsorption portion are formed into an integrated structure, including: opening a matching groove in the area of ​​the adsorption portion corresponding to the notch of the wafer; manufacturing the sealing portion, and setting the sealing portion in the matching groove to form the sealing portion and the adsorption portion into an integrated structure.

[0022] Optionally, manufacturing the blocking portion and setting the blocking portion in the matching groove includes: manufacturing a block-shaped blocking portion matching the shape of the matching groove, and assembling the blocking portion into the matching groove.

[0023] Optionally, the manufacturing of the plugging portion and setting the plugging portion in the matching groove includes: applying a dense filling slurry to the surface of the matching groove to form a layered plugging portion.

[0024] Optionally, manufacturing a loading part to be combined into the placement groove includes: manufacturing the adsorption part and the blocking part of the loading part, and forming the blocking part and the adsorption part into an integrated structure; and setting both the adsorption part and the blocking part into the placement groove.

[0025] Optionally, the blocking portion is formed by pouring a dense filling slurry in a region of the adsorption portion corresponding to the notch of the wafer.

[0026] Optionally, the blocking portion is formed by using a porous material in a region corresponding to the blocking portion and removing a pore-forming agent.

[0027] Optionally, the plugging portion is a layered plugging portion formed by applying a dense filling slurry on the surface of the matching groove.

[0028] Optionally, when the wafer loading platform adsorbs the wafer, the blocking portion blocks particles from entering the adsorption portion from a position where the notch of the wafer overlaps with the loading member.

[0029] Optionally, a ventilation pipeline is provided inside the supporting member, and the ventilation pipeline is communicated with the loading member.

[0030] According to a third aspect of the present invention, a loading part is manufactured by the manufacturing method of the loading part of the first aspect, and the loading part includes an adsorption part with an air-permeable structure and a sealing part with a non-air-permeable structure, and the two can form an integrated structure. The adsorption part can adsorb the wafer; the sealing part is arranged to correspond to the notch position of the wafer when the wafer is arranged on the loading part, so as to inhibit the airflow from connecting with the outside through the notch of the wafer, and at the same time, inhibit particulate matter from entering the adsorption part through the notch of the wafer.

[0031] Optionally, the adsorption part is formed of porous ceramics, and the blocking part is formed by pouring a dense filling slurry into a region of the adsorption part corresponding to the notch of the wafer.

[0032] Optionally, a matching groove corresponding to the notch of the wafer is opened at the edge of the adsorption part, and the blocking part is arranged at the matching groove. The adsorption part and the blocking part can be formed into an integrated structure by bonding or sintering.

[0033] Optionally, the adsorption portion is formed of porous ceramics, and the blocking portion is formed of dense ceramics.

[0034] Optionally, a dense filling slurry is applied on the surface of the matching groove to form a layered sealing portion.

[0035] Optionally, the cross-sectional area of ​​the layered blocking portion increases from bottom to top along the thickness direction of the loading component.

[0036] Optionally, the blocking portion is formed by sintering a porous material without adding a pore-forming agent; or the blocking portion is formed by sintering a dense adhesive slurry.

[0037] Optionally, the dense filling slurry includes at least one of silicate, silicon oxide, aluminum oxide and organic glue.

[0038] Optionally, a position where the notch of the wafer overlaps with the loading member is covered by the sealing portion.

[0039] According to the fourth aspect of the present invention, the wafer loading platform includes: a support member, a surface of one side of which is provided with a placement groove, and the interior of the support member is provided with a ventilation pipe; a loading member, which is the loading member described in the first aspect, and the loading member is arranged in the placement groove of the support member; when the wafer is set on the wafer loading platform, the adsorption part of the loading member can be vacuumed through the ventilation pipe to adsorb the wafer.

[0040] According to the fifth aspect of the present invention, the wafer thinning system includes: a turntable; a wafer loading table, which is the wafer loading table described in the fourth aspect, arranged on the upper part of the turntable for carrying the wafer; and a grinding module, arranged above the wafer loading table for grinding the wafer.

[0041] According to the manufacturing method of the loading part and the loading platform of the present application, the loading part, the loading platform, and the thinning system have the following

[0042] Beneficial effects:

[0043] 1. Add porous material to the mold and sinter to form an adsorption part. The adsorption part thus formed is also a porous structure, so it has air permeability. Therefore, air can be pumped through the porous position to form a negative pressure, thereby stably adsorbing the wafer.

[0044] 2. A blocking part, i.e., a non-air-permeable structure, is formed on the adsorption part at a position corresponding to the notch of the wafer. As a result, particles generated during the grinding of the wafer can be blocked by the blocking part when passing through the notch of the wafer, thereby preventing them from entering the adsorption part, thereby ensuring the adsorption capacity of the carrier for the wafer and preventing particles from entering the adsorption part and causing damage to the carrier.

[0045] 3. The sealing part corresponds to the notch position of the wafer, which can prevent the load part from reducing its ability to adsorb the wafer due to air leakage at the notch position of the wafer when adsorbing the wafer, resulting in unstable wafer adsorption. Therefore, by making the sealing part correspond to the notch of the wafer, air leakage can be prevented when the load part adsorbs the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0047] Figure 1 A flowchart of the steps of the method for manufacturing a loading member according to the first aspect of the present invention;

[0048] Figure 2 A step-by-step flow chart of an embodiment of step S2 of the method for manufacturing a loading member according to the first aspect of the present invention;

[0049] Figure 3 A step-by-step flow chart of another embodiment of step S2 of the method for manufacturing a loading component according to the first aspect of the present invention;

[0050] Figure 4 A step-by-step flow chart of another embodiment of step S2 of the method for manufacturing a loading member according to the first aspect of the present invention;

[0051] Figure 5 A step-by-step flow chart of an embodiment of step S205 of the method for manufacturing a loading component according to the first aspect of the present invention;

[0052] Figure 6 A step-by-step flow chart of another embodiment of step S205 of the method for manufacturing a loading component according to the first aspect of the present invention;

[0053] Figure 7 A step-by-step flow chart of an embodiment of step S1 of the method for manufacturing a loading component according to the first aspect of the present invention;

[0054] Figure 8 A step-by-step flow chart of another embodiment of step S2 of the method for manufacturing a loading member according to the first aspect of the present invention;

[0055] Fig. 9 A step-by-step flow chart of another embodiment of step S2 of the method for manufacturing a loading member according to the first aspect of the present invention;

[0056] Fig.10A step-by-step flow chart of an embodiment of step S207 of the method for manufacturing a loading component according to the first aspect of the present invention;

[0057] Fig.11 A step-by-step flow chart of another embodiment of step S1 of the method for manufacturing a loading component according to the first aspect of the present invention;

[0058] Fig.12 A step-by-step flow chart of another embodiment of step S2 of the method for manufacturing a loading member according to the first aspect of the present invention;

[0059] Fig.13 A step-by-step flow chart of another embodiment of step S2 of the method for manufacturing a loading member according to the first aspect of the present invention;

[0060] Fig.14 A flowchart of the steps of a method for manufacturing a wafer loading platform according to a second aspect of the present invention;

[0061] Fig.15 A step-by-step flow chart of an embodiment of step S20 of the method for manufacturing a wafer loading platform according to the second aspect of the present invention;

[0062] Fig.16 A step-by-step flow chart of step S22 of the method for manufacturing a wafer loading platform according to the second aspect of the present invention;

[0063] Fig.17 A step-by-step flow chart of an embodiment of step S222 of the method for manufacturing a wafer loading platform according to the second aspect of the present invention;

[0064] Fig.18 A step-by-step flow chart of another embodiment of step S222 of the method for manufacturing a wafer loading platform according to the second aspect of the present invention;

[0065] Fig.19 A step-by-step flow chart of another embodiment of step S20 of the method for manufacturing a wafer loading platform according to the second aspect of the present invention;

[0066] Fig. 20 It is a schematic diagram of a wafer loading platform, which is not provided with a matching groove and a blocking portion;

[0067] Fig.21 is a schematic diagram of a wafer loading station having a matching groove and a blocking portion;

[0068] Fig. 22 A schematic diagram of a wafer loading platform in which a matching groove is formed and a sealing portion is filled in the matching groove;

[0069] Fig.23 A top view of an embodiment of a loading member according to a third aspect of the present invention;

[0070] Fig.24 A top view of an embodiment of the adsorption portion of the loading member according to the third aspect of the present invention;

[0071] Fig.25 A schematic structural diagram of an embodiment of a blocking portion of a loading member according to a third aspect of the present invention;

[0072] Fig.26 A top view of another embodiment of a loading member according to the third aspect of the present invention;

[0073] Fig. 27 A side cross-sectional view of another embodiment of the blocking portion of the loading member according to the third aspect of the present invention;

[0074] Fig.28 A side cross-sectional view of another embodiment of the blocking portion of the loading member according to the third aspect of the present invention;

[0075] Fig.29 A top view of another embodiment of the blocking portion of the loading member according to the third aspect of the present invention;

[0076] Fig.30 A side cross-sectional view of another embodiment of the blocking portion of the loading member according to the third aspect of the present invention;

[0077] Fig.31 is a top view of an embodiment of a wafer loading station according to the fourth aspect of the present invention, in which case no blocking portion is formed on the loading member;

[0078] Fig.32 is a side cross-sectional view of a wafer loading platform according to the fourth aspect of the present application, wherein no blocking portion is formed on the loading member;

[0079] Fig.33 A top view of another embodiment of a wafer loading station according to the fourth aspect of the present invention, in which the loading member is provided with a matching groove;

[0080] Fig.34 is a side cross-sectional view of a wafer loading station according to a fourth aspect of the present invention, in which the loading member is provided with a matching groove;

[0081] Fig.35 A top view of a wafer adsorbed when the wafer loading platform according to the fourth aspect of the present invention is not provided with a blocking portion;

[0082] Fig.36 A top view of a wafer loading platform according to a fourth aspect of the present invention when a blocking portion is provided on the loading member;

[0083] Fig.37 A side cross-sectional view of a wafer loading platform according to a fourth aspect of the present invention when a blocking portion is provided at a matching groove of a loading member;

[0084] Fig.38 A top view of a wafer loading platform according to a fourth aspect of the present invention having a loading member provided with a blocking portion and adsorbing a wafer;

[0085] Fig.39 for Fig.38 A local enlarged view of point A in FIG.

[0086] Fig.40 A top view of a support member of a wafer loading platform according to a fourth aspect of the present invention;

[0087] Fig.41 A side cross-sectional view of a support member of a wafer loading platform according to a fourth aspect of the present invention;

[0088] Fig.42 is a top view of another embodiment of the wafer loading platform according to the fourth aspect of the present invention, in which the blocking portion is directly connected to the supporting member;

[0089] Fig.43 A top view of another embodiment of a wafer loading station according to the fourth aspect of the present invention;

[0090] Fig.44 A top view of another embodiment of a wafer loading station according to the fourth aspect of the present invention;

[0091] Fig.45 A top view of another embodiment of a wafer loading station according to the fourth aspect of the present invention;

[0092] Fig.46 A side cross-sectional view of a wafer loading station according to a fourth aspect of the present invention;

[0093] Fig.47 A schematic side cross-sectional view of a wafer loading station according to a fourth aspect of the present invention;

[0094] Fig.48 A perspective side view of a wafer loading station of a wafer thinning system according to a fifth aspect of the present invention;

[0095] Fig.49 A schematic diagram of the three-dimensional structure of a wafer thinning system according to a fifth aspect of the present invention;

[0096] Fig.50 It is a side view of a turntable, a grinding module and a wafer loading station of a wafer thinning system according to a fifth aspect of the present invention.

[0097] Description of reference numerals:

[0098] Wafer Thinning System 1000;

[0099] Turntable 200; Grinding module 300;

[0100] Wafer loading station 100;

[0101] Support member 10; placement groove 11; ventilation pipeline 12;

[0102] The loading member 20 ; the adsorption portion 21 ; the matching groove 211 ; the blocking portion 22 ; and the separation interface 23 . DETAILED DESCRIPTION

[0103] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the embodiments of the present application should fall within the scope of protection of the embodiments of the present application.

[0104] As mentioned earlier, the integrated circuit industry is the core of the information technology industry and plays a key role in promoting the transformation and upgrading of the manufacturing industry towards digitalization and intelligence. Chips are the carriers of integrated circuits, and chip manufacturing involves process flows such as integrated circuit design, wafer manufacturing, wafer processing, electrical measurement, cutting packaging and testing.

[0105] In the back-end process stage of integrated circuit manufacturing, in order to reduce the package mounting height, reduce the chip package volume, improve the chip's thermal diffusion efficiency, electrical performance, mechanical properties, and reduce the chip processing volume, the wafer needs to be back-ground before subsequent packaging to thin the wafer to a predetermined thickness; the chip thickness after back-ground can even be less than 5% of the initial thickness.

[0106] The wafer thinning process is performed on the wafer thinning device, wherein the wafer loading table 100 (chuck table) is one of the key components of the wafer thinning device, which is used to hold the wafer to be ground.

[0107] The wafer loading platform 100 usually includes a porous suction cup (ceramic suction cup), which is equivalent to the loading part 20 in the present application. The porous suction cup holds the wafer to be ground by vacuum adsorption. Therefore, vacuum is a necessary condition for the wafer loading platform 100 to adsorb the wafer.

[0108] For easy positioning, a notch is set on the periphery of a large-sized wafer. Fig. 20The structure of a current wafer loading platform 100 is shown. When the wafer is set to the wafer loading platform 100, it is adsorbed by the negative pressure formed between the porous suction cup and the wafer. The wafer loading platform 100 is not provided with a blocking portion 22. Usually, since the notch of the wafer is connected to the external atmosphere, it will partially leak and affect the vacuum between the porous suction cup and the wafer, thereby affecting the reliability of wafer adsorption. In addition, grinding chips such as particles generated by wafer grinding will enter the interior of the porous suction cup along the notch, causing clogging of the porous suction cup, affecting the adsorption effect and flatness of the porous suction cup, or a large amount of particles will accumulate at the notch and increase the difficulty of wafer cleaning.

[0109] After the wafer loading platform 100 absorbs the wafer, it will rotate. In order to distinguish the direction of the rotating wafer, a notch will be opened on the wafer as mentioned above. Fig.38 and Fig.39 As shown in . However, after the notch is opened on the wafer, when the adsorption part 21 adsorbs the wafer, air will leak through the notch of the wafer, which will cause airflow leakage when the adsorption part 21 (the adsorption part 21 in this application is the porous suction cup mentioned above) adsorbs the wafer, resulting in unstable vacuum, and thus the effect of adsorbing the wafer is not good. In other words, after the wafer is adsorbed on the adsorption part 21, since the notch of the wafer and the position corresponding to the adsorption part 21 are not covered, the airflow will leak from the notch 21 of the wafer. A sealing part 22 with a non-air-permeable structure is formed at the position of the adsorption part 21 corresponding to the notch of the wafer, which can block the notch of the wafer to inhibit the airflow from passing therethrough, so that the adsorption part 21 can stably adsorb the wafer, and its structure is as shown in Fig.21 or Fig. 22 shown.

[0110] The present invention provides a method for manufacturing a loading part 20, which is used for stably processing and forming the loading part 20, and can make the loading part 20 have the following characteristics: Fig.23 The suction part 21 and the sealing part 22 shown in the figure, at the same time, the sealing part 22 can cooperate with the suction part 21, and the sealing part 22 corresponds to the notch position of the wafer, which can not only ensure that the loading part 20 stably adsorbs the wafer, but also prevent the particles or dust formed by grinding from entering the suction part 21 through the notch position of the wafer. At the same time, the size of the formed sealing part 22 matches that of the suction part 21. And further, the loading part 20 formed by processing can be formed with the support part 10 through a manufacturing method of a wafer loading platform proposed by the present invention. Fig.36 Therefore, first combine the instructions attached to Figure 1-Figure 13 The illustrated sequence describes a method for producing a carrier 20 .

[0111] A method for manufacturing a loading member 20 according to a first aspect of the present invention is as follows: Figure 1As shown, including:

[0112] Step S1: adding porous material into a mold to sinter the adsorption part 21 with a porous air-permeable structure;

[0113] Specifically, in this step, a porous material is added to the mold and sintered to form the adsorption part 21. The adsorption part 21 thus formed is also a porous structure, so it has air permeability. Therefore, the air can be pumped through the porous position to form a negative pressure, thereby adsorbing the wafer. Fig.31 The adsorption portion 21 shown may be a complete disc structure, and may be formed into various shapes through subsequent processing. Fig.31 As shown in FIG. 1 , after the adsorption portion 21 of the loading member 20 is disposed on the supporting member 10, a wafer loading platform 100 can be formed. Fig.32 shown.

[0114] Step S2: manufacturing a non-air-permeable sealing portion 22 in the region of the adsorption portion 221 corresponding to the notch of the wafer, and forming the sealing portion 22 and the adsorption portion 21 into an integrated structure to prevent particles from entering the adsorption portion 21 through the notch of the wafer.

[0115] Specifically, in this step, Fig.23 As shown, on the basis of the formed adsorption part 21, a blocking part 22 is formed at a position on the adsorption part 21 corresponding to the notch of the wafer, that is, a non-air-permeable structure. The structure of the blocking part 22 is as shown in FIG. Fig.25 As shown. Therefore, when particles generated during the grinding of the wafer pass through the notch of the wafer, they can be blocked by the blocking portion 22, thereby preventing them from entering the adsorption portion 21, thereby ensuring the adsorption capacity of the carrier 20 for the wafer and preventing particles from entering the adsorption portion 21 and causing damage to the carrier 20.

[0116] Furthermore, the blocking portion 22 corresponds to the notch position of the wafer, which can prevent the carrier 20 from losing its ability to absorb the wafer due to air leakage at the notch position of the wafer when the carrier 20 absorbs the wafer, resulting in unstable wafer absorption. Therefore, by making the blocking portion 22 correspond to the notch of the wafer, air leakage is prevented when the carrier 20 absorbs the wafer. The blocking portion 22 can be formed in various forms on the absorption portion 21, which will be described later.

[0117] According to the manufacturing method of the loading part provided by the embodiment of the first aspect of the present application, a porous material is added to the mold and sintered to form an adsorption part 21, and the adsorption part 21 thus formed is also a porous structure, so that it has air permeability. Therefore, the subsequent vacuum can be formed through the porous position to stabilize the adsorption of the wafer. A blocking part 22 is formed at the position corresponding to the notch of the wafer on the adsorption part 21, that is, a non-permeable structure. Therefore, the particles generated during the grinding of the wafer can be blocked by the blocking part 22 when passing through the notch position of the wafer, thereby avoiding entering the adsorption part 21, ensuring the adsorption capacity of the loading part 20 for the wafer, and avoiding the particles from entering the adsorption part 21 and causing damage to the loading part 20. In addition, the blocking part 22 corresponds to the notch position of the wafer, which can prevent the loading part 20 from reducing the ability of the loading part 20 to adsorb the wafer due to leakage at the notch position of the wafer, resulting in unstable wafer adsorption, so by enabling the blocking part 22 to correspond at the notch of the wafer, it is prevented from leaking when the loading part 20 adsorbs the wafer.

[0118] In some embodiments of the present invention, Figure 2 As shown, step S2 includes:

[0119] Step S201: pouring dense filling slurry in the area where the adsorption part 21 corresponds to the notch of the wafer to manufacture the blocking part 22.

[0120] Specifically, in this step, the position of the adsorption part 21 corresponding to the notch of the wafer is filled with dense slurry by pouring, such as Fig. 27 As shown, the dense filling slurry enters the area of ​​the adsorption part 21 corresponding to the notch position of the wafer, thereby forming a sealing part 22 with a non-air-permeable structure in the area, thereby preventing particles generated during the wafer grinding process from entering the adsorption part 21.

[0121] In some embodiments of the present invention, Figure 3 As shown, step S2 includes:

[0122] Step S202 : using a porous material in a region corresponding to the blocking portion 22 and removing the pore-forming agent to form the blocking portion 22 .

[0123] Specifically, in this step, the blocking part 22 and the adsorption part 21 can be made in a variety of ways. Among them, the adsorption part 21 and the blocking part 22 can be made of porous materials as raw materials. A pore-forming agent is added to the raw material corresponding to the adsorption part 21, so that the adsorption part 21 formed after sintering is a permeable structure. No pore-forming agent is added to the area corresponding to the blocking part 22, so that a non-permeable structure is formed after sintering. In this way, the formed loading part 20 can have good consistency, reduce the difficulty of processing, and avoid the adsorption part 21 being broken after the adsorption part 21 is sintered and the matching groove 211 is processed again.

[0124] It should be noted here that, with respect to the processing method of the matching groove 211 , the adsorption portion 21 is partially processed by a milling process.

[0125] In some embodiments of the present invention, Figure 4 As shown, step S2 includes:

[0126] Step S204: opening a matching groove 211 in the area of ​​the adsorption portion 21 corresponding to the notch of the wafer;

[0127] Specifically, in this step, a matching groove 211 is opened on the adsorption portion 21 of the carrier 20 at a position corresponding to the notch of the wafer. The matching groove 211 corresponds to the notch of the wafer, so that particles generated during the grinding process of the wafer will pass through the matching groove 211.

[0128] In some embodiments of the present invention, Fig.33 As shown, the matching groove 211 can be opened after the loading member 20 is set to the supporting member 10. Fig.24 As shown, the adsorption portion 21 of the loading member 20 can be provided with a matching groove 211, and then the adsorption portion 21 is set to the supporting member 10. Fig.34 The figure is a side cross-sectional view of the loading member 20 with the matching groove 211 disposed on the supporting member 10 .

[0129] Step S205 : manufacturing the blocking portion 22 , and disposing the blocking portion 22 in the matching groove 211 , so that the blocking portion 22 and the adsorption portion 21 form an integrated structure.

[0130] Specifically, in this step, by setting the blocking portion 22 into the matching groove 211, the blocking portion 22 can block the position on the adsorption portion 21 corresponding to the notch of the wafer. The size of the blocking portion 22 and the matching groove 211 of the adsorption portion 21 is ensured to correspond, and the processing difficulty is reduced. Compared with the method of processing the blocking portion 22 on the support member 10 after processing the placement groove 11 on the support member 10, it can avoid damage to the support member 10 due to stress concentration during the processing of the blocking portion 22.

[0131] In some embodiments of the present invention, Figure 5 As shown, step S205 includes:

[0132] Step S2051: manufacturing a block-shaped blocking portion 22 that matches the shape of the matching groove 211, and assembling the blocking portion 22 into the matching groove 211;

[0133] Specifically, the blocking part 22 can be manufactured to match the shape of the matching groove 211, and the blocking part 22 is a block-shaped integral structure, which is easy to process, and is arranged in the matching groove 211. The blocking part 22 and the wall surface of the matching groove 211 can be connected by using an adhesive to make the connection between the blocking part 22 and the adsorption part 21 tighter, so as to prevent the blocking part 22 from falling off from the inside of the matching groove 211 during the use of the loading part 20.

[0134] In some embodiments of the present invention, Figure 6 As shown, step S205 includes:

[0135] Step S2052 : applying dense filling slurry on the surface of the matching groove 211 to form a layered sealing portion 22 .

[0136] Specifically, a matching groove 211 is provided at a position corresponding to the notch of the adsorption part 21 and the wafer, and a non-permeable slurry can be coated on the wall of the matching groove 211, and after the non-permeable slurry is cured, a non-permeable surface structure can be formed on the wall of the matching groove 211, that is, the interior of the matching groove 211 can be understood as forming a non-permeable shell structure stably connected to the matching groove 211, and the non-permeable shell structure is consistent with the wall of the matching groove 211. Therefore, even if the position is a groove-shaped structure, during the grinding process of the wafer, the particles formed fall into the matching groove 211, and cannot enter the interior of the adsorption part 21 due to the shell-shaped blocking part 22 formed on the surface.

[0137] In some embodiments of the present invention, the blocking portion 22 may be an adhesive, a coating, or other reagents that are coated on the walls of the matching groove 211 by coating.

[0138] In some embodiments of the present invention, Figure 7 As shown, step S1 includes:

[0139] Step S101: adding raw materials into a mold to sinter and form an adsorption portion 21 having a matching groove 211;

[0140] Specifically, in this step, the adsorption part 21 having the matching groove 211 corresponding to the notch position of the wafer is formed by sintering. Thus, the blocking part 22 can be subsequently provided in the matching groove 211 to ensure a stable connection between the blocking part 22 and the adsorption part 21.

[0141] At the same time, correspondingly, Figure 8 As shown, step S2 includes:

[0142] Step S206: manufacturing the blocking portion 22. The structure of the blocking portion 22 is as follows: Fig.25As shown. The blocking part 22 and the adsorption part 21 are bonded or sintered to form an integrated structure. The blocking part 22 and the adsorption part 21 are bonded or sintered to form an integrated structure so that the two are stably connected. The blocking part 22 can also effectively inhibit the passage of airflow or particles, ensure the air permeability of the adsorption part 21 of the loading part 20, and the non-air permeability of the blocking part 20, and can effectively adsorb the wafer.

[0143] In some embodiments of the present invention, the sealing portion 22 can be made of dense ceramic, and its shape can be a block-shaped integral structure matching the shape of the matching groove 211, or it can be a hollow shell structure matching the wall shape of the groove of the matching groove 211.

[0144] In some embodiments of the present invention, the adsorption portion 21 can be sintered together with the blocking portion 22 to make the overall structure more stable.

[0145] In some embodiments of the present invention, the blocking portion 22 may be bonded to the adsorption portion 21 , thereby forming an integrated structure quickly and conveniently, and facilitating later replacement.

[0146] In some embodiments of the present invention, the blocking portion 22 may be first bonded to the adsorption portion 21 to facilitate assembly and positioning, and then the two may be sintered into an integrated structure, so that the overall structure is more stable.

[0147] In some embodiments of the present invention, the adsorption part 21 and the blocking part 22 of the loading part 20 are directly sintered in the mold, avoiding the need to later set an opening at the edge of the adsorption part 21 to be assembled with the blocking part 22, thereby avoiding the loading part 20 from being broken during the later groove opening of the edge of the adsorption part 21. This reduces the difficulty of processing, improves the processing accuracy, and improves the dimensional consistency of the two.

[0148] It is possible to form an adsorption portion 21 that has the function of adsorbing wafers, and at the same time avoid the step of further processing to form the matching groove 211 after sintering the adsorption portion 21. This can avoid the adsorption portion 21 being damaged and scrapped when processing the matching groove 211. The waste of raw materials also reduces the yield. At the same time, since it is difficult to process the matching groove of the adsorption portion 21 alone, the method of the present application can effectively reduce the processing difficulty. By adding raw materials to the mold, the sealing portion 22 can be sintered to form the sealing portion 22, which can ensure that the size between the matching groove 211 and the sealing portion 22 is consistent. By processing the sealing portion 22 and the adsorption portion 21 as one, a complete loading part can be formed, and the overall molding is convenient and quick. There is no need to process the matching groove 211 after the adsorption portion 21 is sintered, which also improves the yield of the overall loading part 20. Reduce the scrap rate. At the same time, reduce raw material consumption.

[0149] In some embodiments of the present invention, Fig. 9 As shown, step S2 includes:

[0150] Step S207: Along the area of ​​the adsorption portion 21 corresponding to the notch of the wafer, a sealing portion 22 extending along the thickness direction of the adsorption portion 21 is provided on the contour on the horizontal plane where the adsorption portion 21 and the wafer are bonded. The sealing portion 22 forms a separation interface 23 extending along the thickness direction of the adsorption portion 21 to prevent particles from entering from the side of the sealing portion 22 facing the notch of the wafer to the side of the sealing portion facing away from the notch of the wafer.

[0151] Specifically, in this step, the adsorption part 21 is bonded to the wafer to adsorb the wafer, and the wafer has a notch. At the position on the adsorption part 21 corresponding to the notch of the wafer, a dense filling slurry can be filled along the thickness direction of the adsorption part 21, and the dense filling slurry can be made to penetrate into the interior of the adsorption part 21 from top to bottom along the thickness direction of the adsorption part 21. In addition, the dense filling slurry can be simultaneously filled downward along the edge contour of the area on the surface of the adsorption part 21 corresponding to the notch position of the wafer. The surface where the adsorption part 21 is bonded to the wafer is the horizontal surface of the adsorption part 21. Therefore, filling the dense filling slurry can form a separation interface 23 inside the adsorption part, and the separation interface 23 corresponds to the notch of the wafer.

[0152] In other words, at a position where the adsorption portion 21 of the loading part 20 corresponds to the notch contour of the wafer, a separation interface 23 is formed along the thickness direction of the adsorption portion 21. The separation interface 23 separates the adsorption portion 21 into two areas. The area corresponding to the adsorption portion 21 and the wafer serves as the adsorption portion 21 to adsorb the wafer. Contaminants will enter the area corresponding to the notch position of the adsorption portion 21, but due to the separation effect of the separation interface 23, the contaminants cannot pass through the separation interface 23 and flow to other areas of the adsorption portion 21.

[0153] Meanwhile, on the horizontal plane, ie, the plane where the surface of the carrier 20 is located, after the carrier 20 adsorbs the wafer, the contour of the separation interface 23 on the plane is larger than the contour range of the notch of the wafer on the adsorption portion 21 .

[0154] It can be seen that during the wafer grinding process, the particles generated enter the adsorption part 21 through the notch of the wafer and further enter the isolation area surrounded by the separation interface 23 , thereby being suppressed from entering other areas of the adsorption part 21 .

[0155] Further, in some embodiments of the present invention, Fig.10 As shown, step S206 may also include:

[0156] Step S2071: along the area of ​​the adsorption part 21 corresponding to the notch of the wafer, on the contour of the horizontal plane where the adsorption part 21 and the wafer are bonded, a dense filling slurry is injected along the thickness direction of the adsorption part by pressurized injection to form a blocking part 22.

[0157] Specifically, in this step, in order to form the plugging portion 22, at the position of the adsorption portion 21 corresponding to the notch of the wafer, the dense filling slurry can be injected from top to bottom into the interior of the adsorption portion 21 by pressurizing at this position, so that the plugging portion 22 corresponding to the notch of the wafer can be formed inside the adsorption portion 21. In addition, the dense filling slurry serving as the plugging portion 22 can also be formed by directly inserting or embedding the area on the adsorption portion 21 corresponding to the notch of the wafer. At the same time, on the horizontal plane, that is, the plane where the surface of the loading part 20 is located, after the loading part 20 adsorbs the wafer, the projection of the plugging portion 22 on the plane covers the area of ​​the notch of the wafer. That is, the plugging portion 22 is larger than the contour range of the notch of the wafer.

[0158] The depth of the injected dense filling slurry, i.e. the penetration depth, can exceed the wear of the carrier 20 during its service life, for example, it can exceed 10%. For example, the wear of the carrier 20 during use is 0.5 mm. Then the depth of the dense filling slurry needs to be greater than 0.5 mm. This ensures that after the carrier 20 is worn during use, there is still a blocking portion 22 to ensure that the carrier 20 can stably adsorb the wafer, and can prevent particles generated during the wafer grinding process from entering the adsorption portion 21.

[0159] In some embodiments of the present invention, the injected dense filling slurry may be an adhesive, such as a sealant or mastic, an organic adhesive or a resin (such as epoxy resin, polyurethane, etc.) to fill the gaps and seal the pores after curing.

[0160] In some embodiments of the present invention, the dense filling slurry to be injected can also be a ceramic slurry or other slurry compatible with the chemical properties of porous ceramics. Ceramic raw material powder (with a particle size smaller than the size of the pores of the porous ceramic of the carrier 20) is mixed with a solvent (water or an organic solvent) to form a ceramic slurry, and the ceramic slurry is then infiltrated and filled into the porous ceramic of the carrier 20 by dipping, pressure injection, or brushing, and then cured by pressurization and / or heating (high temperature of several hundred degrees).

[0161] In some embodiments of the present invention, short-cut fibers or fiber meshes may be used to fill the pores of the injected dense filling slurry. The fibers may be, for example, ceramic fibers, glass fibers, or carbon fibers.

[0162] In some embodiments of the present invention, the depth of the blocking portion 22 along the thickness direction of the adsorption portion 21 is not less than the wear amount of the loading member 20 in the thickness direction during use.

[0163] Specifically, after the carrier 20 adsorbs the wafer, the wafer can be ground, so the carrier 20 may be worn, resulting in a gradual decrease in the thickness of the carrier 20. Therefore, in order to ensure that the carrier 20 can continue to maintain a stable adsorption capacity when adsorbing the wafer, and to prevent particles from entering the adsorption part 21. Therefore, the thickness of the blocking part 22 needs to be no less than the wear of the carrier 20. For example, if the wear of the carrier 20 exceeds 2mm, it can be defined as needing to be replaced. Therefore, the thickness of the blocking part 22 is no less than 2mm.

[0164] Furthermore, for the structural form in which the blocking portion 22 is disposed in the matching groove 211, the depth of the matching groove 211 may exceed the wear amount of the loading member 20. For example, it may exceed 10%. The thickness of the matching groove 211 may also be the same as the thickness of the loading member 20.

[0165] In some embodiments of the present invention, Fig.11 As shown, step S1 of adding porous material into the mold to sinter to form the adsorption part 21 with a permeable porous structure includes:

[0166] Step S102 : adding raw materials into the mold and sintering to form the adsorption portion 21 with a matching groove 211 at the edge, and applying dense filling slurry on the matching groove 211 to form a separation interface 23 .

[0167] Specifically, in this step, the adsorption part 21 can be separated from the blocking part 22 by setting a separation interface 23 at the matching groove 211. When glue is subsequently dripped on the blocking part 22 to form a non-air-permeable structure, the separation interface can prevent glue from entering the adsorption part 21.

[0168] In some embodiments of the present invention, the separation interface 23 may be formed of at least one of silicate, silicon oxide, aluminum or organic glue, thereby making it possible to form the separation interface 23 at a low cost and to facilitate material acquisition.

[0169] In some embodiments of the present invention, Fig.12 As shown, step S2 of manufacturing a blocking portion 22 of a non-air-permeable structure in the area of ​​the adsorption portion 21 corresponding to the notch of the wafer, and forming the blocking portion 22 and the adsorption portion 21 into an integrated structure to prevent particles from entering the adsorption portion 21 from the notch of the wafer, includes:

[0170] Step S208: using a porous material to manufacture the blocking portion 22, and sintering the blocking portion 22 and the adsorption portion 21 into an integrated structure;

[0171] Step S209: dripping sealant onto the blocking portion 22 to form the blocking portion 22 into a non-air-permeable structure.

[0172] Specifically, the plugging portion 22 is sintered from a porous material to form a porous plugging portion 22. The plugging portion 22 and the adsorption portion 21 can also be sintered from porous materials at the same time. This can facilitate the manufacturing and processing of the adsorption portion 21 and the plugging portion 22 and increase the consistency of the two. The subsequent dripping of sealant to the plugging portion 22 can form a non-air-permeable structure for the plugging portion 22. This can ensure that the loading part 20 can stably adsorb the wafer. It can also prevent particles generated by polishing the wafer from entering the interior of the loading part 20 through the plugging portion 22.

[0173] In some embodiments of the present invention, Fig.13 As shown, step S2 of manufacturing a blocking portion 22 of a non-air-permeable structure in an area of ​​the adsorption portion 21 corresponding to the notch of the wafer includes:

[0174] Step S210: using dense ceramic to manufacture the blocking part 22, and bonding the blocking part 22 and the adsorption part 21 into an integrated structure.

[0175] Specifically, the blocking portion 22 is formed by sintering a dense ceramic material, which can ensure the non-air-permeable structure of the blocking portion 22. The blocking portion 22 and the adsorption portion 21 are bonded into an integral structure, which can effectively inhibit the passage of airflow or particles through the blocking portion 22, ensure the air permeability of the adsorption portion 21 of the carrier 20, and the non-air permeability of the blocking portion 20, and can effectively adsorb the wafer.

[0176] The following is attached to the instruction manual Figure 14-Figure 19 The manufacturing method of the wafer loading platform 100 according to the second aspect of the present invention is described. Fig.14 As shown, the wafer loading platform 100 manufacturing method is used to manufacture the wafer loading platform 100, comprising:

[0177] Step S10: manufacturing a support member 10, and opening a placement groove 11 in the middle of the support member 10;

[0178] Step S20: manufacturing a loading member 20 coupled to the placement groove 11, so that the loading member 20 and the supporting member 10 form a wafer loading platform 100;

[0179] Step S30 : the loading member 20 and the supporting member 10 form a wafer loading platform 100 .

[0180] Specifically, a placement groove 11 is provided in the middle of the support member 10. A loading member 20 that can be placed in the placement groove 11 is manufactured, so that the loading member 20 and the support member 10 form a wafer loading platform 100. This can avoid processing the groove, i.e., the placement groove 11, again after processing the support member 10. And after the placement groove 11 is processed, the loading member 20 can be directly set in the placement groove 11. Compared with the form of processing the blocking portion 22 on the support member 10 after the placement groove 11 is processed, it can avoid the support member 10 from being broken due to stress concentration caused by processing the blocking portion 22.

[0181] According to the manufacturing method of the wafer loading platform 100 of the second aspect of the present invention, a porous material is added to the mold and sintered to form an adsorption part 21, and the adsorption part 21 thus formed is also a porous structure, so that it has air permeability. Therefore, the air can be pumped through the porous position to form a negative pressure, so as to stably adsorb the wafer. A blocking part 22 is formed at a position corresponding to the notch of the wafer on the adsorption part 21, that is, a non-air-permeable structure. Therefore, the particles generated during the grinding of the wafer can be blocked by the blocking part 22 when passing through the notch position of the wafer, thereby avoiding entering the adsorption part 21, ensuring the adsorption capacity of the loading part 20 for the wafer, and avoiding particles from entering the adsorption part 21 and causing damage to the loading part 20. In addition, the blocking part 22 corresponds to the notch position of the wafer, which can prevent the loading part 20 from reducing the ability of the loading part 20 to adsorb the wafer due to leakage at the notch position of the wafer when the loading part 20 adsorbs the wafer, resulting in unstable wafer adsorption. Therefore, by enabling the blocking part 22 to correspond at the notch of the wafer, air leakage is prevented when the loading part 20 adsorbs the wafer.

[0182] In some embodiments of the present invention, Fig.15 As shown, step S20 includes:

[0183] Step S21: manufacturing the adsorption portion 21 of the loading member 20 matching the shape of the placement groove 11, and setting the adsorption portion 21 into the placement groove 11 to be bonded to the support member 10 as a whole;

[0184] Specifically, in this step, the adsorption portion 21 matching the shape of the placement groove 11 is manufactured, and the adsorption portion 21 and the support member 10 are bonded together to ensure a stable connection between the support member 10 and the adsorption portion 21 .

[0185] Step S22 : manufacturing a sealing portion 22 of a non-air-permeable structure in a region of the adsorption portion 21 corresponding to the notch of the wafer, and forming the sealing portion 22 and the adsorption portion 21 into an integrated structure.

[0186] Specifically, after the adsorption part 21 is disposed inside the placement groove 11 , by forming the blocking part 22 on the adsorption part 21 , the blocking part 22 and the adsorption part 21 can be combined into an integrated structure, and the sizes of the blocking part 22 and the adsorption part 21 can be made consistent.

[0187] In some embodiments of the present invention, Fig.16 As shown, step S22 includes:

[0188] Step S221: opening a matching groove 211 in the area of ​​the adsorption portion 21 corresponding to the notch of the wafer;

[0189] Specifically, in this step, a matching groove 211 is provided in the region of the adsorption part 21 corresponding to the notch of the wafer, thereby facilitating the processing of the matching groove 211 of the adsorption part 21. The matching groove 211 can be provided by designing the matching groove 211 during the stage of mold processing of the adsorption part 21, so that the adsorption part 21 having the matching groove 211 can be integrally formed. Compared with the method of processing the adsorption part 21 to form the matching groove 211 at a later stage, the processing efficiency can be improved and the processing difficulty can be reduced.

[0190] Step S222 : manufacturing the blocking portion 22 , and disposing the blocking portion 22 in the matching groove 211 , so that the blocking portion 22 and the adsorption portion 21 form an integrated structure.

[0191] Specifically, in this step, the sealing portion 22 is manufactured and set in the matching groove 211, which can facilitate the improvement of the processing accuracy of the sealing portion 22, so that the size between the matching groove 211 and the sealing portion 22 is consistent, so that after the sealing portion 22 is processed and set in the matching groove 211, it can be consistent with the size of the matching groove 211, thereby achieving the sealing effect, that is, the consistent airflow passing mentioned above. And it can prevent particles from entering the adsorption portion 21 through the notch of the wafer during the wafer grinding process. At the same time, the sealing portion 22 is processed separately, and compared with the method of processing the sealing portion 22 on the support member 10, it can avoid the support member 10 from being broken due to the stress concentration at some positions caused by the processing of the sealing portion 22.

[0192] In some embodiments of the present invention, Fig.17 As shown, step S222 includes:

[0193] Step S2221 : manufacturing a block-shaped blocking portion 22 that matches the shape of the matching groove 211 , and assembling the blocking portion 22 into the matching groove 211 .

[0194] Specifically, in this step, a block-shaped sealing portion 22 is manufactured, so that the sealing portion 22 can be directly set in the matching groove 211, thereby forming a non-air-permeable structure in the area corresponding to the notch of the wafer, inhibiting the passage of airflow and preventing particulate matter from entering the interior of the adsorption portion 21 from this position.

[0195] In some embodiments of the present invention, Fig.18 As shown, step S222 includes:

[0196] Step S2222 : Apply dense filling slurry on the surface of the matching groove 211 to form a layered sealing portion 22 .

[0197] Specifically, in this step, a matching groove 211 is opened at the position of the adsorption part 21 corresponding to the notch of the wafer, and at the same time, a non-permeable slurry, that is, a dense filling slurry, can be coated on the wall surface of the matching groove 211. In this way, a non-permeable surface structure can be formed on the wall surface of the matching groove 211, that is, the interior of the matching groove 211 can be understood as forming a non-permeable shell structure that is stably connected to the matching groove 211, and the non-permeable shell structure is consistent with the wall surface of the matching groove 211. Therefore, even if this position is a groove-shaped structure, during the process of grinding the wafer, the particles formed fall into the matching groove 211, and cannot enter the interior of the adsorption part 21 due to the shell-shaped blocking part 22 formed on the surface.

[0198] In some embodiments of the present invention, Fig.19 As shown, step S20 includes:

[0199] Step S23: manufacturing the adsorption part 21 and the blocking part 22 of the loading part 20, and forming the blocking part 22 and the adsorption part 21 into an integrated structure;

[0200] Specifically, in this step, a loading part 20 having an adsorption part 21 and a sealing part 22 can be simultaneously formed in a mold, thereby ensuring the dimensional consistency between the adsorption part 21 and the sealing part 22 and making the structural connection between the adsorption part 21 and the sealing part 22 more stable.

[0201] Step S24 : placing the adsorption portion 21 and the blocking portion 22 in the placement groove 11 .

[0202] Specifically, in this step, after the adsorption part 21 and the blocking part 22 form an integrated structure, they are directly placed in the placement groove 11, so that the loading part 20 can be stably connected to the support part 10. At the same time, the blocking part 22 is formed integrally with the adsorption part 21, which can avoid the support part 10 being broken due to stress concentration at some positions caused by machining the blocking part 22, compared with the method of machining the blocking part 22 on the support part 10.

[0203] In some embodiments of the present invention, the blocking portion 22 is formed by pouring a dense filling slurry in the area of ​​the adsorption portion 21 corresponding to the notch of the wafer.

[0204] Specifically, the position of the adsorption part 21 corresponding to the notch of the wafer is poured with dense filling slurry, so that the dense filling slurry enters the area corresponding to the notch of the adsorption part 21 and the wafer, thereby forming a sealing part 22 with a non-air-permeable structure in the area, thereby preventing particles generated during the wafer grinding process from entering the interior of the adsorption part 21.

[0205] In some embodiments of the present invention, the blocking portion 22 is formed by using a porous material in a region corresponding to the blocking portion 22 and removing a pore-forming agent.

[0206] Specifically, both the adsorption part 21 and the blocking part 22 can be made of porous materials as raw materials. A pore-forming agent is added to the raw materials corresponding to the adsorption part 21, so that the adsorption part 21 formed after sintering is a permeable structure. However, no pore-forming agent is added to the area corresponding to the blocking part 22, so that a non-permeable structure is formed after sintering. In this way, the formed loading part 20 can have good consistency, reduce the processing difficulty, and avoid the adsorption part 21 being broken by processing the matching groove 211 again after sintering to form the adsorption part 21.

[0207] In some embodiments of the present invention, the blocking portion 22 is a layered blocking portion 22 formed by applying a dense filling slurry on the surface of the matching groove 211 .

[0208] Specifically, the adsorption part 21 is bonded to the wafer to adsorb the wafer, and the wafer has a notch. The position of the adsorption part 21 corresponding to the notch of the wafer can be filled with dense filling slurry along the thickness direction of the adsorption part 21, and the dense filling slurry can penetrate into the interior of the adsorption part 21 from top to bottom along the thickness direction of the adsorption part 21. In addition, the dense filling slurry can be simultaneously filled downward along the edge contour of the area on the surface of the adsorption part 21 corresponding to the notch position of the wafer. The surface where the adsorption part 21 is bonded to the wafer is the horizontal surface of the adsorption part 21. Therefore, filling the dense filling slurry can form a separation interface 23 inside the adsorption part, and the separation interface 23 corresponds to the notch of the wafer.

[0209] It can be seen that during the wafer grinding process, the particles generated enter the adsorption part 21 through the notch of the wafer and further enter the isolation area surrounded by the separation interface 23 , thereby being suppressed from entering other areas of the adsorption part 21 .

[0210] In some embodiments of the present invention, when the wafer loading platform 100 adsorbs the wafer, the blocking portion 22 blocks particles from entering the adsorption portion 21 from the position where the notch of the wafer overlaps with the loading member 20 .

[0211] Specifically, the blocking portion 22 can prevent particles generated during the wafer grinding process from entering the adsorption portion 21 .

[0212] In some embodiments of the present invention, a ventilation pipeline 12 is provided inside the support member 10 , and the ventilation pipeline 12 is communicated with the loading member 20 .

[0213] Specifically, the synchronous pipeline 12 inside the supporting member 10 is communicated with the adsorption portion 21 of the loading member 20 , so that the adsorption portion 21 can be vacuumed to adsorb the wafer.

[0214] The following is attached to the instruction manual Figure 23-Figure 30 The partial drawings of the wafer loading station 100 of the fourth aspect of the present application describe the loading member 20 of the third aspect of the present application. Fig.31 As shown, a loading part 20 according to an embodiment of the present invention is manufactured by the manufacturing method of the loading part 20 of the first embodiment. Fig.23 and Figure 26-Figure 30 As shown, the carrier 20 includes an adsorption portion 21 of an air-permeable structure and a blocking portion 22 of an air-impermeable structure, which can be formed into an integrated structure, and the adsorption portion can adsorb the wafer.

[0215] It should be noted here that in this article, the adsorption part 21 and the sealing part 22 form an integrated structure, which means that the two can be formed into an integral structure through processing technology. The specific method can be to directly form an integral whole through mold processing, or to perform secondary processing of two independent structures into a whole through bonding or sintering.

[0216] The adsorption part 21 can adsorb the wafer, and the blocking part 22 is arranged to correspond to the notch position of the wafer when the wafer is arranged on the carrier 20, so as to inhibit the airflow from communicating with the outside through the notch of the wafer, and at the same time, inhibit particulate matter from entering the adsorption part 21 through the notch of the wafer.

[0217] According to the loading part 20 of the embodiment of the present invention, a porous material is added to the mold and sintered to form an adsorption part 21. The adsorption part 21 formed thereby is also a porous structure, so that it has air permeability. Therefore, the air can be evacuated through the porous position to form a negative pressure, thereby stably adsorbing the wafer. A blocking part 22 is formed at a position corresponding to the notch of the wafer on the adsorption part, that is, a non-air-permeable structure. Therefore, the particles generated during the grinding of the wafer can be blocked by the blocking part 22 when passing through the notch position of the wafer, thereby avoiding entering the adsorption part 21, ensuring the adsorption capacity of the loading part 20 for the wafer, and avoiding particles from entering the adsorption part 21 and causing damage to the loading part 20. The blocking part corresponds to the notch position of the wafer, which can prevent the loading part 20 from reducing the ability of the loading part 20 to adsorb the wafer due to leakage at the notch position of the wafer when the loading part 20 adsorbs the wafer, resulting in unstable wafer adsorption. Therefore, by enabling the blocking part 22 to correspond to the notch of the wafer, air leakage is prevented when the loading part 20 adsorbs the wafer.

[0218] In some embodiments of the present invention, Fig.31 As shown, the surface of the loading member 20 is not processed and is a complete circular plane. Fig.24 and Fig.28 As shown, the edge of the adsorption portion 21 is provided with a matching groove 211 corresponding to the notch of the wafer. Fig.35 , Fig.38 and Fig.39As shown in FIG. 1 , it is a schematic diagram of the wafer loading platform 100 having the loading member 20 adsorbing the wafer W. Figure 36-Figure 39 As shown, the blocking portion 22 is disposed at the matching groove 211. The adsorption portion 21 and the blocking portion 22 can be formed into an integral structure by bonding and / or sintering.

[0219] In some embodiments of the present invention, Fig.33 As shown, the matching groove 211 can be opened after the loading member 20 is set to the supporting member 10. Fig.24 As shown, the adsorption portion 21 of the loading member 20 can be provided with a matching groove 211, and then the adsorption portion 21 is set to the supporting member 10. Fig.34 The figure is a side cross-sectional view of the loading member 20 with the matching groove 211 disposed on the supporting member 10 .

[0220] like Fig.38 As shown, when the wafer is placed on the loading member 20, the wafer is as shown in FIG. Fig.31 As shown in W. Fig.38 and Fig.39 As shown, the blocking portion 22 is opposite to the notch of the wafer to prevent the airflow from communicating with the outside through the blocking portion 22 , and at the same time, prevent particles from entering the adsorption portion 21 through the blocking portion 22 .

[0221] Specifically, Fig.23 and Fig.26 As shown, the carrier 20 has a suction portion 21 and a blocking portion 22. The suction portion 21 is a breathable structure that allows airflow to pass through, and the blocking portion 22 is a non-breathable structure. That is, the suction portion 21 can be evacuated through the ventilation pipe 12 to suction the wafer.

[0222] In some embodiments of the present invention, the adsorption part 21 and the sealing part 22 are formed into an integral structure by bonding or sintering. That is, the sintering raw materials of the two are added to the mold and directly formed by sintering. It is also possible to add the raw materials of the two into the mold at the same time, sinter them into two structures, and connect them into one by bonding in the later stage. In addition, after the sealing part 22 and the adsorption part 21 are formed by sintering, the two structures are bonded, and then sintered into an integral structure, so as to ensure the stability of the formed loading part 20. After sintering, the adsorption part 21 of the loading part 20 can be directly formed with a matching groove 211 at the edge to facilitate the correspondence with the notch position of the wafer. Thereby avoiding the loading part 20 from being broken and causing material waste when the matching groove 211 is processed on the edge of the loading part 20 after sintering. Furthermore, by sintering the adsorption part 21 and the sealing part 22, raw materials can be directly added to the matching groove 211 of the adsorption part 21 to sinter and form the sealing part 22. Thus, the sizes of the two formed after sintering are well matched, and there is no need to adjust the sizes, thereby improving the size consistency of the two.

[0223] Specifically, when the blocking portion 22 is opposite to the notch position of the wafer, the adsorption portion 21 of the carrier 20 overlaps with the wafer to inhibit the airflow and / or particulate matter from being connected to the ventilation duct 12 via the adsorption portion 21. The notch position of the wafer is the notch (groove mark) position mentioned above. When the notch position of the wafer corresponds to the blocking portion 22, the matching groove 211 position of the adsorption portion 21 coincides with the matching groove 211 position of the wafer, and the adsorption portion 21 is connected to the ventilation duct 12 of the support 10. The blocking portion 22 blocks the opening at the matching groove 211, so that when the ventilation duct 12 is evacuated, a negative pressure is formed at the adsorption portion 21, and the wafer is reliably adsorbed.

[0224] Since the adsorption part 21 overlaps with the wafer, the dust or particles generated by the wafer thinning process are blocked by the wafer, preventing them from entering the ventilation duct 12 through the adsorption part 21. At the same time, due to the effect of the blocking part 22, the particles are also prevented from entering the ventilation duct 12 of the support member 10 through the gap at the matching groove 211. Since the blocking part 22 is a non-air-permeable structure, it can also inhibit the airflow from passing through the ventilation duct 12, so that the adsorption part 21 forms a negative pressure adsorption effect to adsorb the wafer.

[0225] According to the loading part 20 provided in the embodiment of the present application, the adsorption part 21 and the plugging part 22 of the loading part 20 are directly sintered and formed in the mold, thereby avoiding the need to later set an opening at the edge of the adsorption part 21 to be assembled with the plugging part 22, thereby avoiding the loading part 20 from being broken during the later groove opening of the edge of the adsorption part 21. The processing difficulty is reduced and the processing accuracy is improved. The materials of the adsorption part 21 and the plugging part 22 can be selected according to actual needs, and the design is diversified to improve the dimensional consistency of the two.

[0226] In some embodiments of the present invention, Fig. 27 As shown, the adsorption part 21 is formed of porous ceramics, and the blocking part 22 is formed by pouring a dense filling slurry into the area of ​​the adsorption part 21 corresponding to the notch of the wafer.

[0227] Specifically, the position of the adsorption part 21 corresponding to the notch of the wafer is poured with dense filling slurry, so that the dense filling slurry enters the area corresponding to the notch of the adsorption part 21 and the wafer, thereby forming a sealing part 22 with a non-air-permeable structure in the area, thereby preventing particles generated during the wafer grinding process from entering the interior of the adsorption part 21.

[0228] In some embodiments of the present invention, Fig.28 As shown, a dense filling slurry is applied to the surface of the matching groove 211 to form a layered sealing portion 22.

[0229] Specifically, a matching groove 211 is provided at a position corresponding to the notch of the wafer in the adsorption part 21, and a non-permeable slurry, i.e., a dense filling slurry, can be coated on the wall surface of the matching groove 211. In this way, a non-permeable surface structure can be formed on the wall surface of the matching groove 211, i.e., the interior of the matching groove 211 can be understood as forming a non-permeable shell structure stably connected to the matching groove 211, and the non-permeable shell structure is consistent with the wall surface of the matching groove 211. Therefore, even if the position is a groove-shaped structure, during the grinding process of the wafer, the particles formed fall into the matching groove 211, and cannot enter the interior of the adsorption part 21 due to the shell-shaped blocking part 22 formed on the surface.

[0230] In some embodiments of the present invention, the thickness of the blocking portion 22 is not greater than the thickness of the adsorption portion 21 .

[0231] Specifically, the thickness of the blocking portion 22 can be the same as the thickness of the adsorption portion 21, so as to ensure the surface level of the overall structure of the loading part 20. The thickness of the blocking portion 22 can also be less than the thickness of the adsorption portion 21. The thickness of the adsorption portion 21 is at least greater than 5 mm, so that after the chuck surface is ground to form a conical surface, for example, the blocking portion 22 can still cover the adsorption portion 21.

[0232] In some embodiments of the present invention, Fig.24 As shown, the adsorption portion 21 is formed of porous ceramics. Fig.25 As shown, the blocking portion 22 is a blocking portion 22 formed of dense ceramic.

[0233] Specifically, the adsorption part 21 is formed by porous ceramics, so that the adsorption part 21 can be connected to the ventilation pipe 12 inside the support 10, and the wafer is adsorbed by negative pressure, while the blocking part 22 is formed by dense ceramics, that is, the blocking part 22 is a non-air-permeable structure. The material of the blocking part 22 and the support 10 can both be dense ceramics. Fig.42 As shown, the blocking portion 22 can be bonded to the support member 10. Fig.24 As shown, the raw material of the adsorption part 21 can be added into the mold and sintered to form the adsorption part 21. Fig.43 As shown, the adsorption portion 21 and the support member 10 bonded with the blocking portion 22 can be sintered into one body.

[0234] In some embodiments of the present invention, Fig.26 As shown in FIG. 1 , the blocking portion 22 is formed by sintering a porous material without adding a pore-forming agent. Specifically, the blocking portion 22 and the adsorption portion 21 are both added into a mold through a porous material, and then sintered to form a Fig.26 The loading part 20 shown. Fig.26As shown, in the area corresponding to the adsorption part 21, a pore-forming agent can be added to the porous material, while no pore-forming agent is added to the porous material in the area of ​​the blocking part 22. Therefore, the adsorption part 21 formed after the two are sintered has multiple pores, which can allow airflow to pass through. However, no pore-forming agent is added to the area of ​​the blocking part 22, and a non-air-permeable structure is formed after sintering, thereby inhibiting the passage of airflow or particles.

[0235] In some embodiments of the present invention, Fig.26 As shown, the plugging portion 22 is made by sintering a dense adhesive slurry. Specifically, a dense slurry can be used as a raw material for sintering the plugging portion 22, so that after sintering, a Fig.26 The sealing portion 22 is a non-air-permeable structure.

[0236] The dense slurry can be at least one of silicate, silicon oxide, aluminum oxide, organic glue and other filling slurries. This material has the advantages of low cost, easy acquisition and stability after molding.

[0237] Then, the loading member 20 and the supporting member 10 are sintered into one body to form a Fig.45 The structure of the wafer loading platform 100 shown in the figure is integrally formed, and the structural dimensions are consistent, which reduces the difficulty of processing.

[0238] In some embodiments of the present invention, Fig.29 and Fig.45 As shown, the adsorption part 21 and the blocking part 22 are both formed by sintering porous materials, and a filling slurry layer is provided at the matching groove of the adsorption part 21 and the blocking part 22, namely, the separation interface 23 mentioned above.

[0239] Specifically, Fig.29 As shown, both the adsorption part 21 and the sealing part 22 use porous materials as raw materials and are added into the mold. As can be seen from the foregoing, the edge of the adsorption part 21 has a matching groove 211. The sealing part 22 is arranged at the matching groove 211. A separation interface 23 is provided at the connection boundary between the two at the matching groove 211, that is, a dense filling slurry layer is provided at the separation interface 23. The dense filling slurry layer is a non-air-permeable material, so the corresponding airflow passing through the adsorption part 21 cannot pass through the filling slurry layer to enter the sealing part 22. As shown in FIG. Fig.29 As shown, after sintering, a loading component 20 having a filling slurry layer between the adsorption portion 21 and the blocking portion 22 is formed.

[0240] In some embodiments of the present invention, Fig.45As shown, the sintered loading member 20 and the supporting member 10 are sintered to form a complete wafer loading platform 100 structure. Glue can be injected into the blocking portion 22 to block the tiny gaps of the blocking portion 22 sintered by the porous material, so that the blocking portion 22 is formed into a non-air-permeable structure, and due to the effect of the filling slurry layer, the glue can be separated to prevent the glue from entering the adsorption portion 21.

[0241] In some embodiments of the present invention, Fig.30 As shown, after forming the separation interface 23, the separation interface 23 may be formed as follows. Fig.30 The partition wall shown does not require glue dripping treatment at the location of the blocking portion 22. Although particles or contaminants in the wafer grinding process can enter the location of the blocking portion 22, due to the blocking effect of the partition interface 23, the particles or contaminants cannot pass through the partition interface 23 and enter the interior of the adsorption portion 21.

[0242] Furthermore, in some embodiments of the present invention, the filling slurry layer includes at least one of silicate, silicon oxide, aluminum oxide and organic glue, which has low cost, is easy to obtain, and has stable molding after sintering.

[0243] In some embodiments of the present invention, the cross-sectional area of ​​the dense filling slurry layer as the plugging portion 22 increases from bottom to top along the thickness direction of the loading part 20. Specifically, the cross-sectional area of ​​the dense filling slurry layer as the plugging portion 22 is the width of the cross section, which can be understood as the thickness of the layered plugging portion 22 as the separation interface 23. In the direction from bottom to top, the thickness of the layered plugging portion 22 gradually increases, which can enhance the sealing performance and ensure the connectivity between the adsorption portion 21 and the plugging portion 22. During the wafer thinning process, relatively more particles gather on the upper part of the loading part 20, while relatively fewer particles gather on the lower part of the loading part 20; by setting the thickness of the dense filling slurry layer as the plugging portion 22 in this way, the sealing performance of the plugging portion 22 and the adsorption portion 21 at the upper part is enhanced, thereby preventing particles from entering the plugging portion 22 through the adsorption portion 21.

[0244] In some embodiments of the present invention, Fig.38 and Fig.39 As shown, the position where the notch of the wafer overlaps with the carrier 20 is covered by the sealing portion 22 .

[0245] Specifically, the overlapping position of the notch of the wafer and the carrier 20 is covered by the blocking portion 22, which can ensure that the blocking portion 22 can block the notch position of the wafer, thereby stably suppressing the passage of airflow, and at the same time blocking the particles generated by the wafer grinding process from entering the adsorption portion 21 through the notch of the wafer. In other words, on the horizontal plane, that is, on the plane where the surface of the carrier 20 is located, after the carrier 20 adsorbs the wafer, the projection of the blocking portion 22 on the plane covers the area of ​​the notch of the wafer. That is, the blocking portion 22 is larger than the contour range of the notch of the wafer.

[0246] The following is attached to the instruction manual Figure 31-Figure 47 The partial drawings of the loading piece 20 of the third aspect of the present application describe the wafer loading station 100 of the fourth aspect of the present application.

[0247] Specifically, Figure 31-Figure 47 As shown, the wafer loading platform 100 includes a supporting member 10 and a loading member 20. In an embodiment of the present invention, the wafer loading platform 100 can adsorb wafers. The supporting member 10, as the main supporting structure of the wafer loading platform 100, can support the loading member 20, and the loading member 20 is a porous structure for adsorbing wafers.

[0248] like Fig.40 and Fig.41 As shown, the upper surface of the support member 10 is provided with a placement groove 11, and the interior of the support member 10 has Fig.46 and Fig.47 The vent line 12 is shown in the figure. The carrier 20 is arranged in the placement groove 11 of the support 10. Thus, the carrier 20 can be connected with the vent line 12 inside the support 10, so that it can be used as an adsorption plane, and the vent line 12 is used to draw air to form a negative pressure, so that the carrier 20 can adsorb the wafer.

[0249] In other words, the adsorption part 21 of the loading part 20 can cooperate with the ventilation pipe 12 of the supporting part 10 to form a negative pressure to adsorb the wafer. The blocking part 22 can block the ventilation pipe 12 to prevent dust particles from entering the ventilation pipe 12 during the wafer thinning process.

[0250] Furthermore, if Fig.32 , Fig.34 , Fig.37 , Fig.46 and Fig.47 A side cross-sectional view of the wafer loading station 100 is shown. Fig.48The figure shows a side view of the wafer loading platform 100. The loading part 20 is arranged above the supporting part 10, and a plurality of ventilation pipes 12 are arranged inside the supporting part 10 to vacuum the loading part 20 and adsorb the wafer. Through the ventilation pipes 12 of the supporting part 10, cleaning water, such as deionized water (DIW), and compressed gas (CDA) are sprayed toward the loading part 20 to clean the residual contaminants in the loading part 20 and its pipes, thereby ensuring the reliability of the loading part 20.

[0251] According to the wafer loading platform 100 of the fourth embodiment of the present invention, since it has the loading part 20 of the third embodiment, it has the same beneficial effects as the loading part 20 of the third embodiment. By directly sintering the adsorption part 21 and the sealing part 22 of the loading part 20 in the mold, it is avoided that an opening is provided at the edge of the adsorption part 21 to be assembled with the sealing part 22 in the later stage, thereby avoiding the loading part 20 from being broken during the grooving of the edge of the adsorption part 21 in the later stage. Reduce the difficulty of processing and improve the processing accuracy. The materials of the adsorption part 21 and the sealing part 22 can be selected according to actual needs, and the design can be diversified to improve the dimensional consistency of the two.

[0252] According to a fifth aspect of the present invention, a wafer thinning system 1000 is provided. Fig.49 and Fig.50 As shown, the grinding module 300 includes a turntable 200, a wafer loading platform 100 and a grinding module 300. Fig.49 and Fig.50 As shown, the wafer loading platform 100 is the wafer loading platform 100 of the first embodiment described above, which is disposed on the upper part of the turntable 200 and is used to carry the wafer. A driving unit (not shown in the figure) is disposed below the wafer loading platform 100 to drive the loading platform 200 and the wafer adsorbed thereon to rotate. Fig.49 As shown, the grinding module 300 is disposed above the wafer loading platform 100 for grinding the wafer. A rough grinding wheel and / or a fine grinding wheel may be disposed below the grinding module 300 to remove the substrate surface material by grinding.

[0253] According to the wafer thinning system 1000 of the fifth embodiment of the present invention, since it has the loading part 20 of the third embodiment, it has the same beneficial effects as the loading part 20 of the third embodiment. By directly sintering the adsorption part 21 and the sealing part 22 of the loading part 20 in the mold, it is avoided that an opening is provided at the edge of the adsorption part 21 to be assembled with the sealing part 22 in the later stage, thereby avoiding the loading part 20 from being broken during the grooving of the edge of the adsorption part 21 in the later stage. Reduce the difficulty of processing and improve the processing accuracy. The materials of the adsorption part 21 and the sealing part 22 can be selected according to actual needs, and the design can be diversified to improve the dimensional consistency of the two.

[0254] The above implementation methods are only used to illustrate the embodiments of the present application, and are not limitations on the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application. The scope of patent protection of the embodiments of the present application should be limited by the claims.

Claims

1. A method for manufacturing a carrier, wherein the carrier is used to absorb a wafer. It is characterized in that include: Adding porous material into the mold to sinter and form an adsorption portion with a gas-permeable porous structure; A sealing portion with a non-air-permeable structure is manufactured in the area of ​​the adsorption portion corresponding to the notch of the wafer, and the sealing portion and the adsorption portion are formed into an integrated structure to prevent particles from entering the adsorption portion through the notch of the wafer.

2. The method according to claim 1, It is characterized in that The method of manufacturing a blocking portion with a non-air-permeable structure in a region of the adsorption portion corresponding to the notch of the wafer, and forming the blocking portion and the adsorption portion into an integrated structure, comprises: A dense filling slurry is poured in the area where the adsorption part corresponds to the notch of the wafer to manufacture the blocking part.

3. The method according to claim 1, It is characterized in that The method of manufacturing a blocking portion with a non-air-permeable structure in a region of the adsorption portion corresponding to the notch of the wafer, and forming the blocking portion and the adsorption portion into an integrated structure, comprises: A porous material is used in a region corresponding to the plugging portion, and a pore-forming agent is removed to form the plugging portion.

4. The method according to claim 1, It is characterized in that The method of manufacturing a blocking portion with a non-air-permeable structure in a region of the adsorption portion corresponding to the notch of the wafer, and forming the blocking portion and the adsorption portion into an integrated structure, comprises: A matching groove is provided in the area of ​​the adsorption portion corresponding to the notch of the wafer; A blocking portion is manufactured and disposed in the matching groove to form the blocking portion and the adsorption portion into an integrated structure.

5. The method according to claim 1, It is characterized in that The step of adding raw materials into a mold to sinter and form an adsorption portion having an air permeable structure comprises: Adding raw materials into the mold to sinter and form an adsorption portion having a matching groove; The step of forming the blocking portion and the adsorption portion into an integrated structure comprises: The plugging part is manufactured, and the plugging part and the adsorption part are bonded or sintered to form an integrated structure.

6. The method according to claim 4, It is characterized in that The manufacturing of the blocking portion and setting the blocking portion in the matching groove includes: A block-shaped plugging portion matching the shape of the matching groove is manufactured, and the plugging portion is assembled into the matching groove.

7. The method according to claim 4, It is characterized in that The manufacturing of the blocking portion and setting the blocking portion in the matching groove includes: A dense filling slurry is applied to the surface of the matching groove to form a layered plugging portion.

8. The method according to claim 1, It is characterized in that The blocking portion having a non-air-permeable structure is provided in the area of ​​the adsorption portion corresponding to the notch of the wafer, comprising: Along the area of ​​the adsorption portion corresponding to the notch of the wafer, a sealing portion extending along the thickness direction of the adsorption portion is provided on the contour on the horizontal plane where the adsorption portion and the wafer are bonded. The sealing portion forms a separation interface extending along the thickness direction of the adsorption portion to prevent particles from entering from the side of the sealing portion facing the notch of the wafer to the side of the sealing portion facing away from the notch of the wafer.

9. The method according to claim 8, It is characterized in that The contour of the area along the adsorption portion corresponding to the notch of the wafer on the horizontal plane where the adsorption portion and the wafer are attached is provided with a blocking portion extending along the thickness direction of the adsorption portion, including: Along the area of ​​the adsorption part corresponding to the notch of the wafer, on the contour of the horizontal plane where the adsorption part and the wafer are bonded, a dense filling slurry is injected along the thickness direction of the adsorption part by pressurized injection to form the blocking part.

10. The method according to any one of claims 1 to 9, It is characterized in that The depth of the blocking portion along the thickness direction of the adsorption portion is not less than the wear amount of the loading member in the thickness direction during use.

11. The method according to any one of claims 4 to 7, It is characterized in that The depth of the matching groove is not less than 2 mm.

12. A method for manufacturing a wafer loading platform, It is characterized in that include: Manufacturing a support member, and providing a placement groove in the middle of the support member; manufacturing a loading member to be coupled to the placement slot; The loading member and the supporting member form the wafer loading stage.

13. The method according to claim 12, It is characterized in that The method of manufacturing a loading member coupled to the placement slot includes: Manufacturing an adsorption portion of the loading member that matches the shape of the placement groove, and placing the adsorption portion in the placement groove to be bonded to the support member as a whole; A sealing portion having a non-air-permeable structure is manufactured in a region of the adsorption portion corresponding to the notch of the wafer, and the sealing portion and the adsorption portion are formed into an integrated structure.

14. The method according to claim 13, It is characterized in that The method of manufacturing a blocking portion with a non-air-permeable structure in a region of the adsorption portion corresponding to the notch of the wafer, and forming the blocking portion and the adsorption portion into an integrated structure comprises: A matching groove is provided in the area of ​​the adsorption portion corresponding to the notch of the wafer; A blocking portion is manufactured and disposed in the matching groove to form the blocking portion and the adsorption portion into an integrated structure.

15. The method according to claim 14, It is characterized in that The manufacturing of the blocking portion and setting the blocking portion in the matching groove includes: A block-shaped plugging portion matching the shape of the matching groove is manufactured, and the plugging portion is assembled into the matching groove.

16. The method according to claim 14, It is characterized in that The manufacturing of the blocking portion and setting the blocking portion in the matching groove includes: A dense filling slurry is applied to the surface of the matching groove to form a layered plugging portion.

17. The method according to claim 12, It is characterized in that Manufacturing a loading piece to be coupled to the placement slot includes: Manufacturing the adsorption part and the blocking part of the loading part, and forming the blocking part and the adsorption part into an integrated structure; The adsorption part and the blocking part are both arranged in the placement groove.

18. The method according to any one of claims 13 and 17, It is characterized in that The blocking portion is formed by pouring a dense filling slurry in a region of the adsorption portion corresponding to the notch of the wafer.

19. The method according to any one of claims 13 and 17, It is characterized in that The blocking portion is formed by using a porous material in a region corresponding to the blocking portion and removing a pore-forming agent.

20. The method according to any one of claims 13 and 17, It is characterized in that The plugging portion is formed by applying dense filling slurry on the surface of the matching groove to form a layered plugging portion.

21. The method according to claim 12, It is characterized in that When the wafer loading platform adsorbs the wafer, the blocking portion blocks particles from entering the adsorption portion from a position where the notch of the wafer overlaps with the loading member.

22. The method according to claim 12, It is characterized in that The support member has a ventilation pipeline inside, and the ventilation pipeline is communicated with the loading member.

23. A loading piece, It is characterized in that It is manufactured by the manufacturing method of the carrier according to any one of claims 1 to 11, wherein the carrier comprises an adsorption portion with an air-permeable structure and a blocking portion with an air-impermeable structure, the two can be formed into an integrated structure, and the adsorption portion can adsorb the wafer; The blocking portion is arranged to correspond to the notch position of the wafer when the wafer is arranged on the carrier, so as to inhibit the airflow from communicating with the outside through the notch of the wafer and inhibit particulate matter from entering the adsorption portion through the notch of the wafer.

24. The loading element according to claim 23, It is characterized in that The adsorption part is formed of porous ceramics, and the blocking part is formed by pouring a dense filling slurry into the area of ​​the adsorption part corresponding to the notch of the wafer.

25. The loading element according to claim 23, It is characterized in that A matching groove corresponding to the notch of the wafer is formed at the edge of the adsorption part, and the blocking part is arranged at the matching groove. The adsorption part and the blocking part can be formed into an integrated structure by bonding or sintering.

26. The loading element according to claim 25, It is characterized in that The adsorption portion is formed of porous ceramics, and the blocking portion is formed of dense ceramics.

27. The loading element according to claim 25, It is characterized in that A dense filling slurry is applied to the surface of the matching groove to form a layered plugging portion.

28. The loading element according to claim 27, It is characterized in that The cross-sectional area of ​​the layered blocking portion increases from bottom to top along the thickness direction of the loading component.

29. The loading member according to claim 25, It is characterized in that The blocking portion is formed by sintering a porous material without adding a pore-forming agent; or The blocking portion is made by sintering a dense bonding slurry.

30. A loading element according to any one of claims 24 and 29, It is characterized in that The dense filling slurry includes at least one of silicate, silicon oxide, aluminum oxide and organic glue.

31. A loading element according to any one of claims 23 to 30, It is characterized in that The position where the notch of the wafer overlaps with the carrier is covered by the sealing portion.

32. A wafer loading station, It is characterized in that include: A support member, one side surface of which is provided with a placement groove, and the interior of the support member is provided with a ventilation pipeline; A loading member, which is the loading member according to any one of claims 23 to 30, and the loading member is arranged in the placement groove of the supporting member; When the wafer is placed on the wafer loading platform, the adsorption portion of the loading component can be evacuated through the ventilation pipeline to adsorb the wafer.

33. A wafer thinning system, It is characterized in that include: Turntable; a wafer loading platform, which is the wafer loading platform of claim 32, disposed on the upper part of the turntable and used for carrying the wafer; The grinding module is arranged above the wafer loading platform and is used for grinding the wafer.

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