Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel and a preparation method thereof and a display device.The display panel is provided with a display area and a non-display area at least partially surrounding the display area, the non-display area comprises a first non-display sub-area and a bending area which are located on at least one side of the display area, and the bending area is located on the side, away from the display area, of the first non-display sub-area. The display panel includes a substrate extending from a display area to a bending area; the conducting layer is located on one side of the substrate, and at least part of the conducting layer is located in the bending area; at least part of the adjusting layer is located in the bending area, and the adjusting layer is located between the substrate and the conductive layer; the first film layer is located on the side, away from the substrate, of the conducting layer, and at least part of the first film layer is located in the bending area; the thickness of the substrate in the bending area is smaller than that of the substrate in the display area and / or the first sub-non-display area. According to the technical scheme, the extremely small bending radius can be achieved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same, and a display device. Background Art

[0002] With the development of display technology, users have higher and higher requirements for display devices such as high resolution and high screen-to-body ratio. With people's extreme pursuit of screen-to-body ratio, display panels with narrow borders or no borders have received widespread attention. Usually, the border area of ​​the display panel of a display device can be bent to its back to achieve a narrow border or no border. However, due to the structural characteristics of the display panel itself, bending damage is prone to occur during the process of bending the display panel, or it is difficult to achieve a smaller bending radius, and the border area cannot be further reduced. Summary of the invention

[0003] In order to solve the above problems, embodiments of the present application provide a display panel and a method for manufacturing the same, and a display device.

[0004] In a first aspect, an embodiment of the present application provides a display panel, comprising a display area and a non-display area at least partially surrounding the display area, wherein the non-display area comprises a first sub-non-display area and a bending area located on at least one side of the display area, wherein the bending area is located on a side of the first sub-non-display area away from the display area, and the display panel comprises: a substrate, extending from the display area to the bending area; a conductive layer, located on one side of the substrate, wherein the conductive layer is at least partially located in the bending area; an adjustment layer, wherein at least a portion of the adjustment layer is located in the bending area, and the adjustment layer is located between the substrate and the conductive layer; a first film layer, located on a side of the conductive layer away from the substrate, wherein the first film layer is at least partially located in the bending area; a thickness of the substrate located in the bending area is less than a thickness of the substrate located in the first sub-non-display area and / or the display area.

[0005] In combination with the first aspect, the display panel also includes a binding area, wherein the bending area is located between the binding area and the first sub-non-display area and connects the first sub-non-display area and the binding area, the substrate extends from the display area to the binding area, and in the bending area, the substrate is provided with a groove on the side facing the adjustment layer, and the adjustment layer fills the groove.

[0006] In combination with the first aspect, the base includes a first substrate and a second substrate stacked in sequence, at least a portion of the second substrate is located between the first substrate and the conductive layer, and the opening of the groove is flush with the surface of the second substrate facing away from the first substrate; preferably, the bottom wall of the groove is located in the second substrate, or in the first substrate, or at the interface between the first substrate and the second substrate; preferably, the base also includes a barrier layer, at least a portion of the barrier layer is located between the first substrate and the second substrate; preferably, the bottom wall of the groove is located in the barrier layer.

[0007] In combination with the first aspect, the display panel also includes a binding area, wherein the bending area is located between the binding area and the first sub-non-display area and connects the first sub-non-display area and the binding area, the substrate extends from the display area to the binding area, the conductive layer is at least partially located in the binding area, the adjustment layer extends from the bending area to the binding area, and the thickness of the substrate located in the binding area is the same as the thickness of the substrate located in the bending area.

[0008] In combination with the first aspect, the substrate includes a first substrate and a second substrate stacked in sequence, at least a portion of the second substrate is located between the first substrate and the conductive layer, the first substrate extends from the display area to the binding area, and the second substrate extends from the display area to at least a portion of the first sub-non-display area; preferably, the thickness of at least the first substrate located in the bending area is the same as the thickness of the first substrate located in the first sub-non-display area; or, the thickness of at least the first substrate located in the bending area is less than the thickness of the first substrate located in the first sub-non-display area; preferably, the substrate also includes a blocking layer, at least a portion of the blocking layer is located between the first substrate and the second substrate, the blocking layer extends from the display area to at least a portion of the first sub-non-display area, or the blocking layer extends from the display area to the binding area; preferably, the end face of the second substrate close to the bending area is perpendicular or obliquely intersecting with the surface of the second substrate facing away from the first substrate.

[0009] In combination with the first aspect, the base includes a first substrate and a second substrate stacked in sequence, at least a portion of the second substrate is located between the first substrate and the conductive layer, and at least the distance between the conductive layer in the bending area and the side of the first substrate facing away from the conductive layer is smaller than the distance between the conductive layer in the first sub-non-display area and / or the display area and the side of the first substrate facing away from the conductive layer.

[0010] In combination with the first aspect, at least the thickness of the conductive layer located in the bending area is greater than or equal to the thickness of the conductive layer located in the first sub non-display area.

[0011] In combination with the first aspect, the Young's modulus of the adjustment layer is smaller than the Young's modulus of the substrate; preferably, the Young's modulus of the adjustment layer is greater than or equal to 500 MPa and less than or equal to 3000 MPa; preferably, in a direction perpendicular to the substrate, the thickness of the adjustment layer is greater than or equal to 2 um and less than or equal to 9 um; preferably, the adjustment layer comprises an organic material; preferably, the material of the adjustment layer comprises photosensitive polyimide; preferably, the display panel further comprises a second film layer, the second film layer is located between the conductive layer and the substrate, and the adjustment layer and the second film layer are prepared in the same layer and have the same material; preferably, the adjustment layer The Young's modulus of the whole layer is smaller than the Young's modulus of the second film layer; preferably, the first film layer includes at least one of a first planarization layer, a pixel definition layer, and a spacer layer; preferably, the display panel also includes an optical adhesive layer and a cover plate, which are successively located on the side of the first film layer away from the substrate; preferably, the display panel also includes a supporting layer, which is arranged on the side of the substrate away from the conductive layer; preferably, the display panel also includes a composite adhesive layer, which is located on the side of the supporting layer away from the substrate; preferably, the display panel also includes a padding block, which is located on the side of the composite adhesive layer away from the substrate.

[0012] In a second aspect, an embodiment of the present application provides a display panel, comprising a display area and a non-display area at least partially surrounding the display area, the non-display area comprising a first sub-non-display area and a bending area located on at least one side of the display area, the bending area being located on a side of the first sub-non-display area away from the display area, the display panel comprising: a substrate extending from the display area to the bending area; a conductive layer located on one side of the substrate, the conductive layer being at least partially located in the bending area; an adjustment layer, at least a portion of the adjustment layer being located in the bending area, the adjustment layer being located on a side of the conductive layer away from the substrate; a distance between at least the conductive layer located in the bending area and the side of the substrate away from the conductive layer being smaller than a distance between the conductive layer located in the first sub-non-display area and / or the display area and the side of the substrate away from the conductive layer; a thickness of at least the substrate located in the bending area is smaller than a thickness of the substrate located in the first sub-non-display area and / or the display area.

[0013] In combination with the second aspect, it also includes a binding area, wherein the bending area is located between the binding area and the first sub-non-display area and connects the first sub-non-display area and the binding area, the substrate extends from the display area to the binding area, the conductive layer is at least partially located in the binding area, the adjustment layer extends from the bending area to the binding area, and the thickness of the substrate located in the binding area is the same as the thickness of the substrate located in the bending area.

[0014] In combination with the second aspect, the substrate includes a first substrate and a second substrate stacked in sequence, at least a portion of the second substrate is located between the first substrate and the conductive layer, the first substrate extends from the display area to the binding area, and the second substrate extends from the display area to at least a portion of the first sub-non-display area; preferably, the thickness of at least the first substrate located in the bending area is the same as the thickness of the first substrate located in the first sub-non-display area; or, the thickness of at least the first substrate located in the bending area is less than the thickness of the first substrate located in the first sub-non-display area; preferably, the substrate also includes a blocking layer, at least a portion of the blocking layer is located between the first substrate and the second substrate, the blocking layer extends from the display area to at least a portion of the first sub-non-display area, or the blocking layer extends from the display area to the binding area; preferably, the end surface of the second substrate close to the bending area is perpendicular to the first substrate or inclined relative to the first substrate.

[0015] In combination with the second aspect, the Young's modulus of the adjustment layer is smaller than the Young's modulus of the substrate; preferably, the Young's modulus of the adjustment layer is greater than or equal to 500MPa and less than or equal to 3000MPa; preferably, in the direction perpendicular to the substrate, the thickness of the adjustment layer is greater than or equal to 2um and less than or equal to 9um; preferably, the adjustment layer comprises an organic material; preferably, the material of the adjustment layer comprises photosensitive polyimide; preferably, the display panel further comprises a first film layer, and the first film layer is located on the side of the conductive layer away from the substrate; the first film layer comprises at least one of a first planarization layer, a pixel definition layer, and a spacer layer; the adjustment layer is prepared on the same layer as at least part of the first film layer and has the same material; the adjustment layer is prepared on the same layer as at least one of the first planarization layer, the pixel definition layer, and the spacer layer.

[0016] In a third aspect, an embodiment of the present application provides a method for preparing a display panel, wherein the display panel comprises a display area and a non-display area at least partially surrounding the display area, wherein the non-display area comprises a first sub-non-display area and a bending area located on one side of the display area, wherein the bending area is located on a side of the first sub-non-display area away from the display area, and the method comprises: forming a substrate on a substrate, wherein the thickness of the substrate located in the bending area is less than the thickness of the substrate located in the first sub-non-display area and / or the display area; forming an adjustment layer at least on a side of the substrate located in the bending area away from the substrate; forming a conductive layer at least on a side of the adjustment layer away from the substrate; and forming a first film layer at least on a side of the conductive layer away from the substrate.

[0017] In combination with the third aspect, a base is formed on a substrate, including: forming a first substrate, a barrier layer, and a second substrate in sequence on the substrate; in a bending area, etching at least the second substrate from a side of the second substrate away from the substrate to form a groove to obtain a base, wherein the bottom wall of the groove is located in the second substrate, or in the first substrate, or in the barrier layer.

[0018] In combination with the third aspect, a base is formed on a substrate, including: forming a first substrate and a barrier layer on the substrate in sequence, and etching the barrier layer in a bending region from a side of the barrier layer away from the substrate to at least remove the barrier layer located in the bending region; forming a second substrate on a side of the barrier layer or the first substrate away from the substrate, and etching at least the second substrate in a bending region from a side of the second substrate away from the substrate to form a groove to obtain a base, wherein the bottom wall of the groove is located in the second substrate or in the first substrate; preferably, forming a first substrate and a barrier layer on the substrate in sequence, and etching the barrier layer in a bending region from a side of the barrier layer away from the substrate to remove the barrier layer and at least part of the first substrate located in the bending region; forming a second substrate on a side of the first substrate away from the substrate, and etching at least the second substrate in a bending region from a side of the second substrate away from the substrate to form a groove to obtain a base, wherein the bottom wall of the groove is located in the second substrate or in the first substrate.

[0019] In combination with the third aspect, the display panel also includes a binding area, which is located on the side of the bending area away from the first sub-non-display area, and the bending area connects the first sub-non-display area and the binding area; a base is formed on the substrate, including: forming a first substrate on the substrate, the first substrate extending from the display area to the binding area; in the display area and at least part of the first sub-non-display area, a blocking layer and a second substrate are sequentially formed on the side of the first substrate away from the substrate to obtain a base; preferably, the first substrate is formed on the substrate, including: in the bending area and the binding area, the first substrate is etched from the side of the first substrate away from the substrate to remove part of the first substrate; or, the first substrate and the blocking layer are sequentially formed on the substrate, the first substrate and the blocking layer extend from the display area to the binding area; in the display area and at least part of the first sub-non-display area, a second substrate is formed on the side of the blocking layer away from the substrate to obtain a base.

[0020] In combination with the third aspect, at least before forming a conductive layer on the side of the adjustment layer facing away from the substrate, the method also includes: forming a second film layer on at least the side of the adjustment layer facing away from the substrate; preferably, the adjustment layer and the second film layer are prepared in the same layer and have the same material; preferably, the method also includes: removing the substrate; preferably, removing the substrate includes, at the same time or after removing the substrate, thinning the side of the base close to the substrate.

[0021] In a fourth aspect, an embodiment of the present application provides a method for preparing a display panel, wherein the display panel includes a display area and a non-display area that at least partially surrounds the display area, wherein the non-display area includes a first sub-non-display area and a bending area located on at least one side of the display area, and the bending area is located on a side of the first sub-non-display area away from the display area. The method includes: forming a base on a substrate, wherein the thickness of at least the base located in the bending area is less than the thickness of the base located in the display area and / or the first sub-non-display area; forming a conductive layer at least on a side of the base located in the bending area facing away from the substrate; and forming an adjustment layer at least on a side of the conductive layer located in the bending area facing away from the substrate.

[0022] In combination with the fourth aspect, the display panel also includes a binding area, and the bending area is located between the binding area and the first sub-non-display area and connects the first sub-non-display area and the binding area; a base is formed on the substrate, including: forming a first substrate on the substrate, the first substrate extending from the display area to the binding area; in the display area and at least part of the first sub-non-display area, a barrier layer and a second substrate are sequentially formed on the side of the first substrate away from the substrate to obtain a base; preferably, the first substrate is formed on the substrate, including: in the bending area and the binding area, the first substrate is etched from the side of the first substrate away from the substrate to remove part of the first substrate; or, the first substrate and the barrier layer are sequentially formed on the substrate, the first substrate and the barrier layer extend from the display area to the binding area; in the display area and at least part of the first sub-non-display area, a second substrate is formed on the side of the barrier layer away from the substrate to obtain a base.

[0023] In combination with the fourth aspect, after forming a conductive layer on at least the side of the base located in the bending zone facing away from the substrate, the method further includes: forming a first film layer on at least the side of the conductive layer facing away from the substrate; preferably, the adjustment layer and at least part of the first film layer are prepared in the same layer and have the same material; preferably, the first film layer includes at least one of a first planarization layer, a pixel definition layer, and a spacer layer, and the adjustment layer is prepared in the same layer as at least one of the first planarization layer, the pixel definition layer, and the spacer layer; preferably, the method further includes: removing the substrate; preferably, removing the substrate includes, at the same time or after removing the substrate, thinning the side of the substrate close to the substrate.

[0024] In a fifth aspect, an embodiment of the present application provides a display device, comprising the above-mentioned display panel, or comprising a display panel prepared according to the above-mentioned method.

[0025] Through the above technical solution, the substrate is thinned, and an adjustment layer is arranged between the substrate and the conductive layer. In practical applications, the thickness of the substrate and the adjustment layer is adjusted so that the stress-neutral layer in the bending zone is located in the conductive layer. In this way, the conductive layer is neither subjected to tension nor pressure, and the conductive layer can be prevented from breaking when bending. In addition, the adjustment layer is arranged between the thinned substrate and the conductive layer, and the thickness of the bending zone is not increased, so that an extremely small bending radius can be achieved, and the bending radius can reach 0.1 mm, thereby reducing the border of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the structure of a display panel provided in one embodiment of the present application.

[0027] Figure 2 yes Figure 1 An exemplary cross-sectional schematic diagram of a display panel at area C is shown.

[0028] Figure 3 yes Figure 2 The cross-sectional schematic diagram of the display panel in a bent state is shown.

[0029] Figure 4 yes Figure 1 Another exemplary cross-sectional schematic diagram of a display panel at area C is shown.

[0030] Figure 5 yes Figure 1 Another exemplary cross-sectional schematic diagram of a display panel at area C is shown.

[0031] Figure 6 yes Figure 1 Another exemplary cross-sectional schematic diagram of a display panel at area C is shown.

[0032] Figure 7 yes Figure 1 Another exemplary cross-sectional schematic diagram of a display panel at area C is shown.

[0033] Figure 8 yes Figure 1 Another exemplary cross-sectional schematic diagram of a display panel at area C is shown.

[0034] Fig. 9 yes Figure 1 Another exemplary cross-sectional schematic diagram of a display panel at area C is shown.

[0035] Fig.10 yes Figure 1 Another exemplary cross-sectional schematic diagram of a display panel at area C is shown.

[0036] Fig.11 yes Figure 1 Another exemplary cross-sectional schematic diagram of a display panel at area C is shown.

[0037] Fig.12 yes Figure 1 Another exemplary cross-sectional schematic diagram of a display panel at area C is shown.

[0038] Fig.13 yes Figure 1 Another exemplary cross-sectional schematic diagram of a display panel at area C is shown.

[0039] Fig.14 yes Figure 1 Another exemplary cross-sectional schematic diagram of a display panel at area C is shown.

[0040] Fig.15 yes Figure 1 Another exemplary cross-sectional schematic diagram of a display panel at area C is shown.

[0041] Fig.16A yes Figure 1 Another exemplary cross-sectional schematic diagram of a display panel at area C is shown.

[0042] Fig. 16B yes Figure 1 Another exemplary cross-sectional schematic diagram of a display panel at area C is shown.

[0043] Fig.17 yes Figure 1 Another exemplary cross-sectional schematic diagram of a display panel at area C is shown.

[0044] Fig.18 yes Figure 1 Another exemplary cross-sectional schematic diagram of a display panel at area C is shown.

[0045] Fig.19 4 is a cross-sectional schematic diagram of a display panel in a bent state provided by another embodiment of the present application.

[0046] Fig. 20 It is a schematic diagram of a process of manufacturing a display panel provided in one embodiment of the present application.

[0047] Figures 21A-21H A schematic diagram of the structure of preparing a substrate provided in an embodiment of the present application.

[0048] Fig. 22 It is a schematic flow chart of a method for preparing a display panel provided in yet another embodiment of the present application.

[0049] Fig.23 It is a schematic diagram of the structure of a display device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0050] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0051] With the development of flexible display panel technology, in order to achieve a narrow frame of the display panel, part of the display panel (for example, the binding area) can be bent to the back. When the display panel is bent, stress will be generated. If the stress on both sides of the wiring layer is not equal, the wiring will be stretched or broken due to the force, resulting in poor signal. In the related art, due to the different thicknesses and materials on both sides of the wiring layer, the stresses on both sides of the wiring layer are different. Therefore, it is usually necessary to apply a bending protect layer (BPL) glue on one side of the wiring layer for reinforcement so that the stresses on both sides of the wiring layer are the same. However, the coating of BPL glue increases the thickness of the bending area, the bending radius is larger, and it is difficult to reduce the frame. The bending radius in the prior art is usually designed to be 0.2mm or 0.25mm (R0.2 or R0.25), which is difficult to achieve an extremely small bending radius, resulting in the inability to further reduce the frame.

[0052] In view of the above technical problems, in the first aspect, an embodiment of the present application provides a display panel. The display panel has a display area and a non-display area that at least partially surrounds the display area. The non-display area includes a first sub-non-display area and a bending area located at least on one side of the display area. The bending area is located on the side of the first sub-non-display area away from the display area. The display panel includes a substrate, a conductive layer, an adjustment layer and a first film layer. The substrate extends from the display area to the bending area. The conductive layer is located on one side of the substrate, and the conductive layer is at least partially located in the bending area. The adjustment layer, at least part of the adjustment layer is located in the bending area, and the adjustment layer is located between the substrate and the conductive layer. The first film layer is located on the side of the conductive layer away from the substrate, and the first film layer is at least partially located in the bending area. The thickness of the substrate located in the bending area is less than the thickness of the substrate located in the first sub-non-display area and / or the display area. In an embodiment of the present application, at least the substrate of the bending zone is thinned, and an adjustment layer is provided between the substrate and the conductive layer. In practical applications, the thickness of the substrate and the adjustment layer is adjusted so that the stress-neutral layer of the bending zone is located in the conductive layer. In this way, the conductive layer is neither subjected to tension nor pressure, and the conductive layer can be prevented from breaking when bending. In addition, the adjustment layer is provided between the thinned substrate and the conductive layer without increasing the thickness of the bending zone, so that an extremely small bending radius of up to 0.1 mm can be achieved, thereby reducing the border of the display panel. It should be noted that the "stress-neutral layer" is a virtual layer, and on the stress-neutral layer, the object is neither subjected to pressure nor tension.

[0053] Figure 1 It is a schematic diagram of the structure of a display panel in a flat state provided by an embodiment of the present application. Figure 2 yes Figure 1 An exemplary cross-sectional schematic diagram of a display panel at area C is shown. Figure 3 yes Figure 2 The cross-sectional view of the display panel in a bent state is shown in FIG. Figures 1 to 3As shown, the display panel includes a display area AA and a non-display area NA at least partially surrounding the display area AA, and the non-display area NA includes a first sub-non-display area L1 located at least on one side of the display area AA and a bending area L2 located on a side of the first sub-non-display area L1 away from the display area AA. The display panel includes a substrate 100, a conductive layer 200, an adjustment layer 300 and a first film layer 400. The conductive layer 200 is located on one side of the substrate 100, the adjustment layer 300 is located between the substrate 100 and the conductive layer 200, and the first film layer 400 is located on the side of the conductive layer 200 away from the substrate 100. In order to facilitate the description of the solution of the embodiment of the present application, Figure 2 Only at least part of the non-display area NA (for example, the first sub-non-display area L1, the bending area L2 and the binding area L3) is shown. In the embodiment of the present application, the substrate 100 extends from the display area AA to the bending area L2, the conductive layer 200 and / or the first film layer 400 are at least partially located in the bending area L2, and the adjustment layer is located in the bending area L2. Optionally, the conductive layer 200 can also be located in the display area AA, and the conductive layer 200 located in the display area AA is connected to the conductive layer located in the bending area L2 through a via. The first film layer 400 can also be located in the display area AA, and the first film layer can extend directly from the display area AA to the bending area L2. It can be understood that the adjustment layer 300 can also be located in an area outside the bending area L2, for example, the adjustment layer 300 extends to a part of the first non-display area L1, and the present application does not limit it. In the embodiment of the present application, the thickness of the substrate 100 located in the bending area L2 is less than the thickness of the substrate 100 located in the first sub-non-display area L1 and / or the display area AA. Usually, the stress neutral layer is located on the side of the conductive layer 200 close to the substrate 100 (for example, located inside the substrate 100). By providing the adjustment layer 300 and adjusting the thickness of the substrate 100 and the adjustment layer 300, the stress neutral layer can be moved to the side close to the conductive layer 200 until the stress neutral layer is located in the conductive layer 200. Figure 3 As shown, the stress-neutral layer A is located in the conductive layer 200, which can prevent the conductive layer 200 (for example, the wiring in the conductive layer 200) from breaking when bending, and can achieve a very small bending radius, reducing the frame of the display panel. Optionally, in the direction perpendicular to the substrate 100, the thickness of the adjustment layer 300 (or the thickness of the substrate thinned in the bending area) is greater than or equal to 2um and less than or equal to 9um. Exemplarily, the thickness of the adjustment layer 300 is 2um, 4um, 5um, 7um, 8um, 9um.

[0054] In the embodiment of the present application, the Young's modulus of the adjustment layer 300 is less than the Young's modulus of the substrate 100. Optionally, the Young's modulus of the adjustment layer 300 is greater than or equal to 500 MPa and less than or equal to 3000 MPa. For example, the Young's modulus of the adjustment layer 300 is 500 MPa, 800 MPa, 1200 MPa, 1500 MPa, 1800 MPa, 2000 MPa, 2200 MPa, 2500 MPa, 3000 MPa. Therefore, by thinning the substrate 100 in the bending area and filling the adjustment layer 300 in the thinned area, the stress-neutral layer A can be moved to the side close to the conductive layer 200 until the stress-neutral layer is located in the conductive layer 200. In the embodiment of the present application, the adjustment layer 300 includes an organic material. Exemplarily, the material of the adjustment layer 300 includes photosensitive polyimide or other organic materials.

[0055] Continue to refer Figure 1 or Figure 2 The display panel further includes a binding area L3, and the bending area L2 is located between the binding area L3 and the first sub non-display area L1 and connects the binding area L3 and the first sub non-display area L1. The binding area L3 is provided with a terminal for connecting a chip or a flexible circuit board (not shown in the figure). In actual use, the binding area L3 is bent to the back of the display panel, thereby reducing the frame of the display panel, such as Figure 3 shown.

[0056] In the embodiment of the present application, the substrate 100 extends from the display area AA to the binding area L3. In the bending area L2, a groove P1 is provided on the side of the substrate 100 facing the adjustment layer 300, and the adjustment layer 300 fills the groove P1. By controlling the depth of the groove P1 and the thickness of the filled adjustment layer 300, the stress-neutral layer A can be moved toward the side close to the conductive layer 200 until the stress-neutral layer A is located in the conductive layer 200.

[0057] Optionally, the substrate 100 includes a first substrate and a second substrate stacked in sequence, at least a portion of the second substrate is located between the first substrate and the conductive layer 200, and the opening of the groove P1 is flush with the surface of the second substrate facing away from the first substrate 101. The depth of the groove P1 is determined according to actual conditions. Optionally, the bottom wall of the groove P1 is located in the second substrate, or in the first substrate, or at the interface between the first substrate and the second substrate. In an embodiment of the present application, the substrate 100 also includes a barrier layer, at least a portion of the barrier layer is located between the first substrate and the second substrate. Optionally, the bottom wall of the groove P1 is located in the barrier layer.

[0058] For example, Figures 4 to 6 They are Figure 1 An exemplary cross-sectional schematic diagram of a display panel at area C is shown. Figures 4 to 6 The display panel shown is Figure 2The difference between the display panel shown is that the base 100 includes a first substrate 101, a barrier layer 102 and a second substrate 103 stacked in sequence, at least part of the barrier layer 102 is located between the first substrate 101 and the second substrate 103, and the second substrate 103 is close to the conductive layer 200. Figure 4 In the embodiment, the bottom wall of the groove P1 is located in the second substrate 103; Figure 5 In the embodiment, the bottom wall of the groove P1 is located at the barrier layer 102; Figure 6 In the embodiment, the bottom wall of the groove P1 is located in the first substrate 101. Therefore, the depth of the groove P1 (or the thickness of the substrate 100) can be adjusted according to actual conditions.

[0059] Optionally, the material of the first substrate 101 and the material of the second substrate 103 are the same, both of which are polyimide. The material of the barrier layer 102 includes silicon oxide, silicon nitride, silicon oxynitride, etc. The barrier layer 102 is used to prevent external water vapor from entering the pixel unit of the display panel, and can also serve as an insulating layer to avoid the adverse effects of external static electricity on the display panel. The thickness of the first substrate 101 and the second substrate 103 can be the same or different, and the first substrate 101 and the second substrate 103 of appropriate thickness can be selected according to actual conditions, and this application does not limit it.

[0060] Optionally, in order to adjust the position of the stress-neutral layer, the thickness of the conductive layer 200 may also be changed. Figure 7 yes Figure 1 Another exemplary cross-sectional schematic diagram of a display panel at area C is shown. Figure 7 The display panel shown is Figure 4 The difference of the display panel shown is that the thickness of the conductive layer 200 at least in the bending area L2 is greater than the thickness of the conductive layer 200 in the display area AA and / or the first sub-non-display area L1. Thickening the thickness of the conductive layer 200 in the bending area L2 can, on the one hand, make the stress-neutral layer move to the side close to the conductive layer 200, thereby reducing the stress on the conductive layer 200; on the other hand, it can reduce the resistance of the conductive layer 200 in the bending area L2, thereby reducing the temperature of the bending area L2. It can be understood that the thickness of the conductive layer 200 outside the bending area L2 can also be thickened, for example, the conductive layer 200 in the binding area L3 is thickened, or the conductive layer 200 in part or all of the display area AA and / or the first sub-non-display area L1 is thickened, so that the resistance of the conductive layer 200 can be reduced, heat generation can be reduced, the temperature can be reduced, and the power consumption of the display panel can be reduced. In the embodiment of the present application, a mask plate can be used to achieve local thickening of the conductive layer 200 through an evaporation process.

[0061] Figure 8 yes Figure 1 Another exemplary cross-sectional schematic diagram of a display panel at area C is shown. Figure 8 The display panel shown is Figure 4 The difference of the display panel shown is that the first film layer 400 includes three film layers, namely, a first planarization layer 401, a pixel definition layer 402 and a spacer layer 403 stacked in sequence in a direction away from the conductive layer 200. The first planarization layer 401, the pixel definition layer 402 and the spacer layer 403 are all organic materials. Optionally, the materials of the first planarization layer 401, the pixel definition layer 402 and the spacer layer 403 can be the same or different. Optionally, the first planarization layer 401, the pixel definition layer 402 and the spacer layer 403 are obtained in different preparation steps of the display panel.

[0062] The display panel also includes a second film layer 500, which is located between the conductive layer 200 and the substrate 100 (for example, the second substrate 103), and the adjustment layer 300 is prepared in the same layer as the second film layer 500 and the material is the same. Therefore, there is no need to prepare the adjustment layer 300 separately, which simplifies the preparation process. In an embodiment of the present application, the second film layer 500 is a second planarization layer, and the materials of the second film layer 500 and the adjustment layer 300 include organic materials, such as photosensitive polyimide. Optionally, the adjustment layer 300 and the second film layer 500 are prepared by a coating process. Optionally, the adjustment layer 300 can also select other organic materials, for example, a material with a Young's modulus less than the Young's modulus of the second film layer 500. That is, the Young's modulus of the adjustment layer 300 is less than the Young's modulus of the second film layer 500.

[0063] Optionally, the binding area L3 is less sensitive to water vapor, so the base of the binding area L3 can also be appropriately thinned. Optionally, the thickness of the base 100 of the binding area L3 is the same as the thickness of the base 100 of the bending area L2. For example, Fig. 9 yes Figure 1 Another exemplary cross-sectional schematic diagram of a display panel at area C is shown. Fig. 9 The display panel shown is Figure 2 The difference of the display panel shown is that the adjustment layer 300 extends from the bending area L2 to the binding area L3. In the embodiment of the present application, the conductive layer 200 is at least located in the binding area L3. The thickness of the substrate 100 located in the binding area L3 is the same as the thickness of the substrate 100 located in the bending area L2. With such a configuration, when preparing the substrate, the portions of the substrate 100 located in the bending area L2 and the binding area L3 are thinned at the same time, and the thickness of the adjustment layer 300 is the thickness of the thinned substrate 100, which can simplify the preparation process.

[0064] Optionally, the substrate 100 includes a first substrate and a second substrate stacked in sequence, at least a portion of the second substrate is located between the first substrate and the conductive layer 200, the first substrate extends from the display area AA to the binding area L3, and the second substrate extends from the display area AA to at least a portion of the first sub-non-display area L1. That is, the second substrate does not extend to the bending area L2 and the binding area L3, and therefore, it is only necessary to prepare the second substrate in the display area AA and at least a portion of the first sub-non-display area L1, and the substrate located in the bending area L2 and the binding area L3 may be removed by laser ablation or other etching methods, or the second substrate is only prepared in the display area AA and at least a portion of the first sub-non-display area L1 during preparation, and the embodiment of the present application is not limited thereto. The embodiment of the present application does not limit the thickness of the first substrate and the second substrate, as long as it can meet the use requirements. For example, in order to make the stress neutral layer of the bending area L2 located in the conductive layer, a relatively thin first substrate can be selected, and there is no need to etch the first substrate of the bending area L2 and the binding area L3 to form a groove structure; the second substrate located in the display area AA and / or the first sub-non-display area L1 can be appropriately thickened to meet the requirement of blocking external water vapor. Optionally, the substrate 100 also includes a barrier layer at least partially located between the first substrate and the second substrate. In the embodiment of the present application, the barrier layer can extend from the display area AA to at least part of the first sub-non-display area L1, or the barrier layer extends from the display area AA to the binding area L3. The barrier layer can block external water vapor. Since the pixel unit of the display area AA is sensitive to water vapor, the substrate of the display area AA needs to be provided with a barrier layer; the bending area L2 and the binding area L3 are not sensitive to water vapor, and a barrier layer may not be provided.

[0065] For example, Figures 10 to 12 They are Figure 1 An exemplary cross-sectional schematic diagram of a display panel at area C is shown. Figures 10 to 12 The display panel and Fig. 9 The difference between the display panel shown is that, along the direction close to the conductive layer 200, the base 100 includes a first substrate 101, a barrier layer 102 and a second substrate 103 stacked in sequence. Fig.10 In the embodiment, the first substrate 101 and the barrier layer 102 extend from the display area AA to the binding area L3, the second substrate 103 extends from the display area AA to the first sub non-display area L1, and the thickness of the first substrate 101 in the bending area L2 and the binding area L3 is the same as the thickness of the first substrate 101 in the first sub non-display area L1. Fig.11 In the embodiment, the first substrate 101 extends from the display area AA to the binding area L3, the second barrier layer 102 and the second substrate 103 extend from the display AA to the first sub non-display area L1, and the thickness of the first substrate 101 in the bending area L2 and the binding area L3 is the same as the thickness of the first substrate 101 in the first sub non-display area L1. Fig.12In the embodiment, the first substrate 101 extends from the display area AA to the binding area L3, the second barrier layer 102 and the second substrate 103 extend from the display area AA to the first sub non-display area L1, and the thickness of the first substrate 101 located in the bending area L2 and the binding area L3 is less than the thickness of the first substrate 101 located in the first sub non-display area L1. In the embodiment of the present application, according to the actual use, the thickness of the base 100 located in the bending area L2 and / or the binding area L3 can be reasonably determined so that the stress neutral layer is located in the conductive layer.

[0066] Alternatively, if Figures 10 to 12 As shown, the second substrate 103 extends from the display area AA to the first sub-non-display area L1, and the end surface of the second substrate 103 close to the bending area L2 intersects perpendicularly or obliquely with the surface of the second substrate 103 away from the first substrate 101. In some embodiments, in order to facilitate the deposition of subsequent film layers, such as Fig.13 As shown, the end surface of the second substrate 103 close to the bending area L2 is obliquely intersected with the surface of the second substrate 103 facing away from the first substrate 101, so that the deposition of subsequent film layers can be facilitated and holes or film discontinuities caused by incomplete film deposition can be prevented.

[0067] Optionally, in Figures 9 to 13 In the embodiment, the thickness of the adjustment layer 300 is the same as the thickness of the substrate 100 thinned. Fig.10 In the embodiment, the thickness of the adjustment layer 300 is the same as the thickness of the second substrate 103; Fig.11 In the embodiment, the thickness of the adjustment layer 300 is the same as the thickness of the barrier layer 102 and the second substrate 103; Fig.12 In the embodiment, the thickness of the adjustment layer 300 is the same as the thickness of the barrier layer 102, the second substrate 103 and the first substrate 101 after thinning. Optionally, the filling thickness of the adjustment layer 300 is less than the thickness of the substrate 100 after thinning. Fig.14 As shown. Fig.14In the embodiment, the filling thickness of the adjustment layer 300 is less than the thickness of the second substrate 103. When the conductive layer 200 is deposited, the conductive layer 200 located in the first sub-non-display area L1 covers the second substrate 103, and the conductive layer 200 located in the bending area L2 and the binding area L3 covers the adjustment layer 300. Therefore, the conductive layer 200 located in the bending area L2 and the binding area L3 is closer to the first substrate 101 than the conductive layer 200 located in the first sub-non-display area L1, that is, the distance between the conductive layer 200 located in the bending area L2 and the binding area L3 and the side of the first substrate 101 away from the conductive layer 200 is less than the distance between the conductive layer 200 located in the first sub-non-display area L1 and / or the display area AA and the side of the first substrate 101 away from the conductive layer 200. In this case, there is a height difference in the conductive layer 200 at the junction of the first sub non-display area L1 and the bending area L2. In order to ensure that the conductive layer 200 is deposited with sufficient thickness at this location, the end surface of the second substrate 103 close to the bending area L2 is designed to obliquely intersect with the surface of the second substrate 103 away from the first substrate 101, such as Fig.14 In the embodiment of the present application, since the thickness of the adjustment layer 300 is less than the thickness of the second substrate 103, the position of the conductive layer 200 located in the bending area L2 and the binding area L3 is changed and is closer to the first substrate 101. Therefore, on the one hand, by adjusting the position of the conductive layer 200 in the bending area L2, and on the other hand, by adding the adjustment layer 300, the stress neutral layer is located in the conductive layer 200.

[0068] Understandably, Figures 9 to 14 In the embodiment of the present invention, the display panel further includes a second film layer 500, and the second film layer 500 is located between the substrate 100 and the conductive layer 200. In the direction away from the conductive layer 200, the first film layer 400 includes a first planarization layer 401, a pixel definition layer 402, and a spacer layer 403 stacked in sequence. For more descriptions of the first film layer 400 and the second film layer 500, please refer to the descriptions in other embodiments of the present application, which will not be repeated here.

[0069] In the second aspect, an embodiment of the present application provides a display panel, which has a display area and a non-display area that at least partially surrounds the display area, wherein the non-display area includes a first sub-non-display area and a bending area located at least on one side of the display area, and the bending area is located on one side of the display area of ​​the first sub-non-display area. The display panel includes a substrate extending from the display area to the bending area; a conductive layer located on one side of the substrate, and the conductive layer is at least partially located in the bending area; an adjustment layer, at least part of the adjustment layer is located in the bending area, and the adjustment layer is located on the side of the conductive layer away from the substrate; the distance between the conductive layer at least located in the bending area and the side of the substrate away from the conductive layer is less than the distance between the conductive layer located in the first sub-non-display area and / or the display area and the side of the substrate away from the conductive layer; the thickness of the substrate at least located in the bending area is less than the thickness of the substrate located in the first sub-non-display area and / or the display area. In the embodiment of the present application, the adjustment layer is located on the side of the conductive layer away from the substrate, and the conductive layer in the bending area is close to the substrate. In this way, on the one hand, by adjusting the position of the conductive layer, and on the other hand, by adding the adjustment layer, the stress neutral layer is located in the conductive layer.

[0070] Optionally, the display panel also includes a binding area, the bending area is located between the binding area and the first sub-non-display area and connects the first sub-non-display area and the binding area, the substrate extends from the display area to the binding area, the conductive layer is at least partially located in the binding area, the adjustment layer extends from the bending area to the binding area, and the thickness of the substrate located in the binding area is the same as the thickness of the substrate located in the bending area.

[0071] Fig.15 yes Figure 1 FIG. 4 is another exemplary cross-sectional schematic diagram of a display panel at region C. Fig.15As shown, the display panel includes a substrate 100, a conductive layer 200 and an adjustment layer 300, and the substrate 100 extends from the display area AA to the binding area L3. The conductive layer 200 is located on one side of the substrate 100, and the conductive layer 200 is at least partially located in the bending area L2 and the binding area L3. The adjustment layer 300 is located in the bending area L2 and the binding area L3, and the adjustment layer 300 is located on the side of the conductive layer 200 away from the substrate 100. The distance between the conductive layer 200 located in the bending area L2 and the binding area L3 and the side of the substrate 100 away from the conductive layer 200 is smaller than the distance between the conductive layer 200 located in the first sub non-display area L1 and the side of the substrate 100 away from the conductive layer 200. The thickness of the substrate 100 located in the bending area L2 and the binding area L3 is smaller than the thickness of the substrate 100 located in the first sub non-display area L1. In the bending zone L2, the thickness of the substrate 100 and the thickness of the adjustment layer 300 are designed so that the stress neutral layer of the bending zone L2 is located in the conductive layer 200. Optionally, in the direction perpendicular to the substrate 100, the thickness of the adjustment layer 300 is greater than or equal to 2um and less than or equal to 9um. Exemplarily, the thickness of the adjustment layer 300 is 2um, 4um, 5um, 7um, 8um, 9um. In an embodiment of the present application, the Young's modulus of the adjustment layer 300 is less than the Young's modulus of the substrate 100. Optionally, the Young's modulus of the adjustment layer 300 is greater than or equal to 500MPa and less than or equal to 3000MPa. For example, the Young's modulus of the adjustment layer 300 is 500MPa, 800MPa, 1200MPa, 1500MPa, 1800MPa, 2000MPa, 2200MPa, 2500MPa, 3000MPa. Optionally, the adjustment layer includes an organic material, for example, photosensitive polyimide, or other organic materials.

[0072] In the embodiment of the present application, the adjustment layer 300 is located on the side of the conductive layer 200 away from the substrate 100. After the substrate 100 is thinned in the bending area L2 and the binding area L3, the conductive layer 200 will move closer to the substrate 100. In this way, on the one hand, by adjusting the position of the conductive layer 200, and on the other hand, by adding the adjustment layer 300, the stress neutral layer is located in the conductive layer 200. In this embodiment, since the position of the conductive layer 200 in the bending area L2 is adjusted, it is necessary to ensure that the conductive layer 200 has a sufficient deposition thickness at the junction of the first sub-non-display area L1 and the bending area L2.

[0073] Continue to refer Fig.15, the display panel further includes a first film layer 400, and the first film layer 400 is located on the side of the conductive layer 200 away from the substrate 100. The adjustment layer 300 is prepared in the same layer as at least part of the first film layer 400 and is made of the same material. Optionally, the first film layer 400 includes a first planarization layer 401, a pixel definition layer 402 and a spacer layer 403. Optionally, the adjustment layer 300 is prepared in the same layer as at least one of the first planarization layer 401, the pixel definition layer 402 and the spacer layer 403. Preferably, the adjustment layer 300 and the first planarization layer 401 are prepared in the same layer, and illustratively, the adjustment layer 300 and the first planarization layer 401 are prepared by a coating process.

[0074] Optionally, the base includes a first substrate and a second substrate stacked in sequence, at least a portion of the second substrate is located between the first substrate and the conductive layer, the first substrate extends from the display area to the binding area, and the second substrate extends from the display area to at least a portion of the first sub-non-display area.

[0075] Optionally, at least the thickness of the first substrate in the bending area is the same as the thickness of the first substrate in the first sub non-display area; or, at least the thickness of the first substrate in the bending area is less than the thickness of the first substrate in the first sub non-display area.

[0076] Optionally, the base further includes a barrier layer, at least part of the barrier layer is located between the first substrate and the second substrate, the barrier layer extends from the display area to at least part of the first sub-non-display area, or the barrier layer extends from the display area to the binding area.

[0077] Optionally, an end surface of the second substrate close to the bending region is perpendicular to the first substrate or inclined relative to the first substrate.

[0078] Optionally, Fig.16A yes Figure 1 Another exemplary cross-sectional schematic diagram of the display panel at area C is shown. Fig.16A The display panel shown is Fig.15 The difference of the display panel shown is that, along the direction close to the conductive layer 200, the base 100 includes a first substrate 101, a barrier layer 102 and a second substrate 103. The first substrate 101 and the barrier layer 102 extend from the display area AA to the binding area L3, and the second substrate 103 extends from the display area AA to at least part of the first sub-non-display area L1. The thickness of the first substrate 101 located in the bending area L2 and the binding area L3 is the same as the thickness of the first substrate 101 located in the first sub-display area L1. The thickness of the adjustment layer 300 is the same as the thickness of the second substrate 103. Fig. 16B yes Figure 1 Another exemplary cross-sectional schematic diagram of a display panel at area C is shown. Fig. 16B The display panel shown is Fig.16AThe difference of the display panel shown is that the display panel also includes a second film layer 500 located between the substrate 100 and the conductive layer 200, and the second film layer includes a second planarization layer. For the description of the second film layer 500, please refer to the description of other parts of the application, which will not be repeated here.

[0079] In other embodiments, to adjust the stress-neutral layer, such as Fig.17 As shown, the thickness of the adjustment layer 300 is less than the thickness of the second substrate 103. In this embodiment, the thickness of the first film layer 400 located in the bending area L2 and the binding area L3 is greater than the thickness of the first film layer 400 located in the first sub non-display area L1. In this way, the display panel is ensured to have the same thickness in different areas without increasing the thickness of the bending area. Fig.18 As shown, the thickness of the first film layer 400 located in the bending area L2 and the binding area L3 is the same as the thickness of the first film layer 400 located in the first sub-non-display area L1. In this way, the thickness of the display panel located in the bending area L2 and the binding area L3 is smaller than the thickness of the display panel located in the first sub-non-display area L1. The thickness of the bending area L2 is thinned, and it is easier to achieve an extremely small bending radius.

[0080] Optionally, in order to adjust the stress neutral layer, the thickness of the first substrate 101 located in the bending area L2 and the binding area L3 is less than the thickness of the first substrate 101 located in the first sub non-display area L1, that is, the first substrate 101 located in the bending area L2 and the binding area L3 is thinned. Alternatively, the barrier layer 102 extends from the display area AA to at least part of the first sub non-display area L1, and does not extend to the bending area L2 and the binding area L3. For more description, please refer to the description of other parts of this application, which will not be repeated here.

[0081] Fig.19 FIG. 1 is a cross-sectional schematic diagram of a display panel in a bent state provided by another embodiment of the present application. Fig.19 As shown, the display panel further includes an optical adhesive layer 610 and a cover plate 620 located on the side of the first film layer 400 away from the substrate 100. The cover plate 620 is attached to the display panel through the optical adhesive layer 610.

[0082] The display panel also includes a support layer 710 and a composite adhesive layer 720 located on the side of the substrate 100 away from the conductive layer 200. The support layer 710 is arranged on the side of the substrate 100 away from the conductive layer 200, and the composite adhesive layer 720 is located on the side of the support layer 710 away from the substrate 100. The composite adhesive layer 720 and the portion of the support layer 710 located in the bending area L2 can be cut off to reduce the bending radius. In an embodiment of the present application, the composite adhesive layer 720 includes at least one of a heat dissipation layer, a buffer layer, and an adhesive layer. The display panel also includes a padding block 730, which is located on the side of the composite adhesive layer 720 away from the substrate 100. As Fig.19As shown, a pad 730 can be provided between the composite adhesive layer 720 located in the first sub non-display area L1 and the composite adhesive layer 720 located in the binding area L3 to adjust the bending radius and support the bending area L2 to fix the relative position of the bending area L2.

[0083] It should be noted that the solutions in the embodiments of the present application can be combined or replaced. For example, Figure 7 The solution of thickening the conductive layer 200 at least in the bending area L2 is also applicable to other embodiments of the present application. Figure 8 The description of the first film layer 400 and the second film layer 500 shown in the figure is also applicable to other embodiments of the present application. Fig.19 The optical adhesive layer 610 , cover plate 620 , support layer 710 , composite adhesive layer 720 and spacer block 730 of the display panel shown are also applicable to other embodiments of the present application.

[0084] In a third aspect, the present application provides a method for preparing a display panel. Figures 2 to 14 The display panel shown.

[0085] Fig. 20 The present invention is a flow chart of a method for preparing a display panel provided in an embodiment of the present application. The display panel includes a display area and a non-display area at least partially surrounding the display area, the non-display area includes a first sub-non-display area located on at least one side of the display area, a bending area and a binding area, the bending area is located between the first sub-non-display area and the binding area and connects the first sub-non-display area and the binding area, and the method includes the following steps.

[0086] Step S2010, forming a base on the substrate.

[0087] In the embodiment of the present application, the substrate includes a glass substrate.

[0088] In the embodiment of the present application, the thickness of the substrate located in the bending area is smaller than the thickness of the substrate located in the first sub non-display area and / or the display area.

[0089] Alternatively, if Fig.21A As shown, a first substrate 101, a barrier layer 102, and a second substrate 103 are sequentially formed on a substrate 10. In a bending region L2, at least the second substrate 103 is etched (for example, by laser ablation) from a side of the second substrate 103 away from the substrate 10 to form a groove P1, thereby obtaining a base 100. The etching depth of the groove P1 varies according to actual conditions. Fig.21A As shown, the bottom wall of the groove P1 is located in the second substrate 103; Fig. 21B As shown, the bottom wall of the groove P1 is located at the barrier layer 102; Fig. 21C As shown, the bottom wall of the groove P1 is located in the first substrate 101 .

[0090] Since the barrier layer 102 is an inorganic material, and the first substrate 101 and the second substrate 103 are organic materials, during laser ablation, the laser energy required for the barrier layer 102 is higher than the laser energy of the first substrate 101 and / or the second substrate 103. When the depth of laser ablation required for the groove P1 is required to etch away the barrier layer 102, it is difficult to regulate the laser energy and control the ablation accuracy. Optionally, first, the first substrate 101 and the barrier layer 102 are sequentially formed on the substrate 10, and in the bending zone L2, the barrier layer 102 is etched (for example, laser ablated) from the side of the barrier layer 102 away from the substrate 10 to at least remove the barrier layer 102 located in the bending zone L2. Optionally, in the bending zone L2, the barrier layer 102 is etched from the side of the barrier layer 102 away from the substrate 10 to remove the barrier layer 102 and at least a portion of the first substrate 101 located in the bending zone L2, to form a groove P2, such as Fig.21D As shown. A second substrate 103 is formed on the side of the barrier layer 102 or the first substrate 101 facing away from the substrate 10, and the second substrate 103 fills the groove P2 formed on the barrier layer 102 and / or the first substrate 101. In the bending area L2, at least the second substrate 103 is etched (for example, laser ablated) from the side of the second substrate 103 facing away from the substrate 10 to form a groove P1, thereby obtaining the base 100. In the embodiment of the present application, the bottom wall of the groove P1 is located in the second substrate 103, as shown in FIG. Fig.21E or the bottom wall of the groove P1 is located in the first substrate 101, as shown; Fig. 21C shown.

[0091] Alternatively, if Fig.11 As shown, the first substrate 101 extends from the display area AA to the binding area L3, and the second substrate 103 and the barrier layer 102 extend from the display area AA to at least a portion of the first sub non-display area L1. In order to obtain this structure, optionally, as Fig.21F As shown, a first substrate 101 is formed on the substrate 10, and the first substrate 101 extends from the display area AA to the binding area L3. In the display area AA and at least part of the first sub-non-display area L1, a barrier layer 102 and a second substrate 103 are sequentially formed on the side of the first substrate 101 away from the substrate 10. Optionally, the barrier layer 102 and the second substrate 103 may be formed on the first substrate 101, and then the barrier layer 102 and the second substrate 103 located in the bending area L2 and the binding area L3 may be removed by etching (for example, laser ablation). Alternatively, the barrier layer 102 and the second substrate 103 are formed only in the display area L1, and this application does not limit this.

[0092] Alternatively, if Fig.12As shown in FIG. 1 , the first substrate 101 at the side of the bending region L2 and the binding region L3 away from the substrate 10 is thinned. To obtain the structure, optionally, after the first substrate 101 is formed on the substrate 10, the first substrate 101 is etched (for example, laser ablated) at the bending region L2 and the binding region L3 from the side of the first substrate 101 away from the substrate 10 to remove part of the first substrate, as shown in FIG. Figure 21G shown.

[0093] Alternatively, if Fig.10 As shown, the first substrate 101 and the barrier layer 102 extend from the display area AA to the binding area L3, and the second substrate 103 extends from the display area AA to at least a portion of the first sub-non-display area L1. In order to obtain this structure, optionally, as Fig.21H As shown, a first substrate 101 and a barrier layer 102 are sequentially formed on a substrate 10, and the first substrate 101 and the barrier layer 102 extend from the display area AA to the binding area L3. In the display area AA and at least part of the first sub-non-display area L1, a second substrate 103 is formed on the side of the barrier layer 102 away from the substrate 10 to obtain a base 100. Optionally, the second substrate 103 may be formed on the side of the barrier layer 102 away from the substrate 10, and then the second substrate 103 located in the bending area L2 and the binding area L3 is removed by etching (for example, laser ablation). Alternatively, the second substrate 103 is formed only in the display area and at least part of the first sub-non-display area L1, and this application does not limit this.

[0094] Step S2020, forming an adjustment layer at least on the side of the substrate in the bending region away from the base plate. In the embodiment of the present application, in the bending region, the thickness of the substrate and the thickness of the adjustment layer are designed so that the stress neutral layer in the bending region is located in the conductive layer.

[0095] Optionally, when the substrate is FIG. 21A to FIG. 21E When the substrate 100 is shown, the adjustment layer 300 is formed on the substrate 100 located in the bending area L2. Figures 21F to 21H In the substrate 100 shown in FIG. 1 , the adjustment layer 300 is formed on the substrate 100 located in the bending area L2 and the binding area L3 .

[0096] Optionally, the material of the adjustment layer 300 includes an organic material, and the adjustment layer 300 is formed by a coating process.

[0097] Optionally, the display panel further includes a second film layer 500 located between the conductive layer 200 and the substrate 100. After the adjustment layer 300 is formed and before the conductive layer 200 is prepared, the second film layer 500 is formed on the substrate 100 or the side of the adjustment layer 300 facing away from the substrate 100. Optionally, the second film layer 500 is a planarization layer, and the material of the second film layer 500 includes an organic material. Optionally, the adjustment layer 300 and the second film layer 500 are prepared at the same layer and have the same material.

[0098] Step S2030: forming a conductive layer at least on a side of the adjustment layer facing away from the substrate.

[0099] Optionally, the conductive layer 200 is formed by an evaporation process, and the conductive layer 200 is at least located in the bending area L2. In some embodiments, a mask is used to evaporate a layer of conductive material on the conductive layer 200 at least in the bending area L2, so that the thickness of the conductive layer 200 at least in the bending area L2 is thicker than that in the display area AA and / or the first sub-non-display area L1.

[0100] Step S2040, forming a first film layer at least on a side of the conductive layer facing away from the substrate.

[0101] Optionally, the material of the first film layer 400 includes an organic material. Exemplarily, the first film layer 400 includes multiple film layers, for example, a first planarization layer, a pixel definition layer, and a spacer layer, and different film layers are formed in different preparation steps of the display panel.

[0102] It can be understood that the method for preparing the display panel also includes the step of removing the substrate. In an embodiment of the present application, while removing the substrate 10 or after removing the substrate 10, the side of the base 100 close to the substrate 10 is thinned. Optionally, the side of the first substrate 101 away from the second substrate 103 is thinned. Optionally, while removing the substrate 10 or after removing the substrate 10, at least in the bending area L2 and the binding area L3, the first substrate 101 is etched (for example, laser ablation) from the side of the first substrate 101 away from the second substrate 103 to remove part of the first substrate 101. In this way, the thickness of the first substrate 101 can be reduced, which is beneficial to adjust the stress neutral layer.

[0103] In a fourth aspect, the present application provides another method for preparing a display panel, which is used to prepare the above-mentioned Figures 15 to 18 The display panel shown.

[0104] Fig. 22 : is a flow chart of a method for preparing a display panel provided by another embodiment of the present application. The display panel includes a display area and a non-display area at least partially surrounding the display area, the non-display area includes a first sub-non-display area located at least on one side of the display area and a bending area, the bending area is located on the side of the first sub-non-display area away from the display area. Fig. 22 As shown, the method includes the following steps.

[0105] Step S2210, forming a base on the substrate.

[0106] In the embodiment of the present application, at least the thickness of the substrate in the bending area is less than the thickness of the substrate in the display area and / or the first sub-non-display area. Fig. 20The process is the same as step S2010 in , and will not be repeated here.

[0107] Step S2220, forming a conductive layer at least on a side of the base located in the bending region away from the base plate.

[0108] In the embodiment of the present application, the conductive layer 200 is formed by an evaporation process, and the conductive layer is at least located in the bending area L2. Optionally, a mask is used to evaporate another layer of conductive material on the conductive layer 200 at least in the bending area L2, so that the thickness of the conductive layer 200 at least in the bending area L2 is thicker than that in the display area AA and / or the first sub-non-display area L1.

[0109] Step S2230, forming an adjustment layer at least on the side of the conductive layer in the bending region away from the substrate. In the embodiment of the present application, in the bending region, the thickness of the substrate and the thickness of the adjustment layer are designed so that the stress neutral layer in the bending region is located in the conductive layer.

[0110] Optionally, in the embodiment of the present application, the substrate is Figures 21F to 21H In the substrate 100 shown, an adjustment layer 300 is formed on the substrate 100 located in the bending area L2 and the binding area L3. Optionally, the material of the adjustment layer 300 includes an organic material, and the adjustment layer 300 is formed by a coating process.

[0111] Optionally, the display panel further includes a first film layer 400 located on the side of the conductive layer 200 away from the substrate 100. After the conductive layer 200 is formed, the first film layer 400 is formed at least on the side of the conductive layer 200 away from the substrate 10. Optionally, the material of the first film layer 400 includes an organic material, and the first film layer 400 includes a plurality of film layers, for example, a first planarization layer 401, a pixel definition layer 402, and a spacer layer 403, and different film layers are formed in different preparation steps of the display panel. Optionally, the adjustment layer 300 is prepared in the same layer as at least part of the first film layer 400 and the material is the same. The adjustment layer 300 can be prepared in the same layer as at least one of the first planarization layer 401, the pixel definition layer 402, and the spacer layer 403. For example, the adjustment layer is prepared in the same layer as the first planarization layer in the first film layer 400 and the material is the same.

[0112] It can be understood that the method for preparing the display panel also includes the step of removing the substrate. In an embodiment of the present application, while removing the substrate 10 or after removing the substrate 10, the side of the base 100 close to the substrate 10 is thinned. Optionally, the side of the first substrate 101 away from the second substrate 103 is thinned. Optionally, while removing the substrate 10 or after removing the substrate 10, at least in the bending area L2 and the binding area L3, the first substrate 101 is etched (for example, laser ablation) from the side of the first substrate 101 away from the second substrate 103 to remove part of the first substrate 101. In this way, the thickness of the first substrate 101 can be reduced, which is beneficial to adjust the stress neutral layer.

[0113] In a fifth aspect, an embodiment of the present application provides a display device, including the above-mentioned display panel, or a display panel prepared according to the above-mentioned method.

[0114] Fig.23 is a schematic diagram of the structure of a display device provided by an embodiment of the present application. Fig.23 As shown, the display device 2300 includes the display panel provided by any of the above embodiments.

[0115] The display device 2300 is a product with an image display function. For example, the display device 2300 can be used to display static images, such as pictures or photos. The display device 2300 can also be used to display dynamic images, such as videos.

[0116] The display device 2300 can be a laptop computer, a mobile phone, a handheld or portable computer, a camera, a camcorder, a vehicle-mounted smart central control screen, a calculator, a smart watch, a GPS navigator, an electronic photo, an electronic billboard or sign, a projector, etc.

[0117] In addition, the display device 2300 may also have functions such as taking photos, recording videos, fingerprint recognition, and face recognition. Accordingly, the display device 2300 also includes at least one functional module for implementing the above functions, such as an under-screen camera, an under-screen fingerprint recognition sensor, and the like.

[0118] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0119] The block diagrams of the devices, apparatuses, equipment, and systems involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagram. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open words, referring to "including but not limited to", and can be used interchangeably with them. The words "or" and "and" used here refer to the words "and / or" and can be used interchangeably with them, unless the context clearly indicates otherwise. The words "such as" used here refer to the phrase "such as but not limited to", and can be used interchangeably with them.

[0120] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0121] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0122] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A display panel, characterized in that: A display panel having a display area and a non-display area at least partially surrounding the display area, wherein the non-display area includes a first sub-non-display area and a bending area located at at least one side of the display area, wherein the bending area is located at a side of the first sub-non-display area away from the display area, and the display panel comprises: A substrate extending from the display area to the bending area; A conductive layer, located on one side of the substrate, wherein at least a portion of the conductive layer is located in the bending region; an adjustment layer, at least a portion of the adjustment layer is located in the bending region, and the adjustment layer is located between the substrate and the conductive layer; A first film layer, located on a side of the conductive layer away from the substrate, wherein at least a portion of the first film layer is located in the bending region; The thickness of the substrate located in the bending area is smaller than the thickness of the substrate located in the first sub non-display area and / or the display area.

2. The display panel according to claim 1, characterized in that: It also includes a binding area, wherein the bending area is located between the binding area and the first sub-non-display area and connects the first sub-non-display area and the binding area, the substrate extends from the display area to the binding area, and in the bending area, the substrate is provided with a groove on the side facing the adjustment layer, and the adjustment layer fills the groove.

3. The display panel according to claim 2, wherein the base comprises a first substrate and a second substrate stacked in sequence, at least a portion of the second substrate is located between the first substrate and the conductive layer, and an opening of the groove is flush with a surface of the second substrate facing away from the first substrate; Preferably, the bottom wall of the groove is located in the second substrate, or in the first substrate, or at the interface between the first substrate and the second substrate; Preferably, the substrate further comprises a barrier layer, at least a portion of which is located between the first substrate and the second substrate; Preferably, the bottom wall of the groove is located on the barrier layer.

4. The display panel according to claim 1, characterized in that: It also includes a binding area, wherein the bending area is located between the binding area and the first sub-non-display area and connects the first sub-non-display area and the binding area, the substrate extends from the display area to the binding area, the conductive layer is at least partially located in the binding area, the adjustment layer extends from the bending area to the binding area, and the thickness of the substrate located in the binding area is the same as the thickness of the substrate located in the bending area.

5. The display panel according to claim 4, characterized in that: The substrate comprises a first substrate and a second substrate stacked in sequence, at least a portion of the second substrate is located between the first substrate and the conductive layer, the first substrate extends from the display area to the binding area, and the second substrate extends from the display area to at least a portion of the first sub-non-display area; Preferably, at least the thickness of the first substrate located in the bending area is the same as the thickness of the first substrate located in the first sub-non-display area; or at least the thickness of the first substrate located in the bending area is smaller than the thickness of the first substrate located in the first sub-non-display area; Preferably, the substrate further comprises a barrier layer, at least a portion of the barrier layer is located between the first substrate and the second substrate, the barrier layer extends from the display area to at least a portion of the first sub-non-display area, or the barrier layer extends from the display area to the binding area; Preferably, an end surface of the second substrate close to the bending region intersects perpendicularly or obliquely with a surface of the second substrate facing away from the first substrate.

6. The display panel according to claim 1, characterized in that: The base includes a first substrate and a second substrate stacked in sequence, at least a portion of the second substrate is located between the first substrate and the conductive layer, and at least the distance between the conductive layer in the bending area and the side of the first substrate facing away from the conductive layer is smaller than the distance between the conductive layer in the first sub-non-display area and / or the display area and the side of the first substrate facing away from the conductive layer.

7. The display panel according to any one of claims 1 to 6, characterized in that: At least the thickness of the conductive layer located in the bending area is greater than or equal to the thickness of the conductive layer located in the first sub-non-display area.

8. The display panel according to any one of claims 1 to 6, characterized in that: The Young's modulus of the adjustment layer is smaller than the Young's modulus of the substrate; Preferably, the Young's modulus of the adjustment layer is greater than or equal to 500 MPa and less than or equal to 3000 MPa; Preferably, in a direction perpendicular to the substrate, the thickness of the adjustment layer is greater than or equal to 2 um and less than or equal to 9 um; Preferably, the adjustment layer comprises an organic material; Preferably, the material of the adjustment layer includes photosensitive polyimide; Preferably, the display panel further comprises a second film layer, wherein the second film layer is located between the conductive layer and the substrate; Preferably, the adjustment layer and the second film layer are prepared in the same layer and made of the same material; Preferably, the Young's modulus of the adjustment layer is smaller than the Young's modulus of the second film layer; Preferably, the first film layer includes at least one of a first planarization layer, a pixel definition layer, and a spacer layer; Preferably, the display panel further comprises an optical adhesive layer and a cover plate, wherein the optical adhesive layer and the cover plate are sequentially located on a side of the first film layer away from the substrate; Preferably, the display panel further comprises a supporting layer, which is arranged on a side of the substrate away from the conductive layer; Preferably, the display panel further comprises a composite adhesive layer, and the composite adhesive layer is located on a side of the support layer away from the substrate; Preferably, the display panel further comprises a padding block, and the padding block is located on a side of the composite adhesive layer away from the substrate.

9. A display panel, characterized in that: A display panel having a display area and a non-display area at least partially surrounding the display area, wherein the non-display area includes a first sub-non-display area and a bending area located at at least one side of the display area, wherein the bending area is located at a side of the first sub-non-display area away from the display area, and the display panel comprises: A substrate extending from the display area to the bending area; A conductive layer, located on one side of the substrate, wherein at least a portion of the conductive layer is located in the bending region; an adjustment layer, at least a portion of the adjustment layer is located in the bending region, and the adjustment layer is located on a side of the conductive layer away from the substrate; The distance between the conductive layer at least in the bending area and the side of the substrate away from the conductive layer is smaller than the distance between the conductive layer in the first sub-non-display area and / or the display area and the side of the substrate away from the conductive layer; At least the thickness of the substrate located in the bending area is smaller than the thickness of the substrate located in the first sub non-display area and / or the display area.

10. The display panel according to claim 9, characterized in that: It also includes a binding area, wherein the bending area is located between the binding area and the first sub-non-display area and connects the first sub-non-display area and the binding area, the substrate extends from the display area to the binding area, the conductive layer is at least partially located in the binding area, the adjustment layer extends from the bending area to the binding area, and the thickness of the substrate located in the binding area is the same as the thickness of the substrate located in the bending area.

11. The display panel according to claim 10, characterized in that: The substrate comprises a first substrate and a second substrate stacked in sequence, at least a portion of the second substrate is located between the first substrate and the conductive layer, the first substrate extends from the display area to the binding area, and the second substrate extends from the display area to at least a portion of the first sub-non-display area; Preferably, at least the thickness of the first substrate located in the bending area is the same as the thickness of the first substrate located in the first sub-non-display area; or at least the thickness of the first substrate located in the bending area is smaller than the thickness of the first substrate located in the first sub-non-display area; Preferably, the substrate further comprises a barrier layer, at least a portion of the barrier layer is located between the first substrate and the second substrate, the barrier layer extends from the display area to at least a portion of the first sub-non-display area, or the barrier layer extends from the display area to the binding area; Preferably, an end surface of the second substrate close to the bending region is perpendicular to the first substrate or inclined relative to the first substrate.

12. The display panel according to claim 9, characterized in that: The Young's modulus of the adjustment layer is smaller than the Young's modulus of the substrate; Preferably, the Young's modulus of the adjustment layer is greater than or equal to 500 MPa and less than or equal to 3000 MPa; Preferably, in a direction perpendicular to the substrate, the thickness of the adjustment layer is greater than or equal to 2 um and less than or equal to 9 um; Preferably, the adjustment layer comprises an organic material; Preferably, the material of the adjustment layer includes photosensitive polyimide; Preferably, the display panel further comprises a first film layer, and the first film layer is located on a side of the conductive layer away from the substrate; Preferably, the first film layer includes at least one of a first planarization layer, a pixel definition layer, and a spacer layer; Preferably, the adjustment layer is prepared in the same layer as at least part of the first film layer and is made of the same material; Preferably, the adjustment layer is prepared in the same layer as at least one of the first planarization layer, the pixel definition layer, and the spacer layer.

13. A method for preparing a display panel, characterized in that: The display panel comprises a display area and a non-display area at least partially surrounding the display area, the non-display area comprises a first sub-non-display area and a bending area located at at least one side of the display area, the bending area is located at a side of the first sub-non-display area away from the display area, and the method comprises: forming a base on the substrate, wherein the thickness of the base located in the bending area is smaller than the thickness of the base located in the first sub-non-display area and / or the display area; forming an adjustment layer at least on a side of the base located in the bending region away from the substrate; forming a conductive layer at least on a side of the adjustment layer facing away from the substrate; A first film layer is formed at least on a side of the conductive layer facing away from the substrate.

14. The method according to claim 13, characterized in that The step of forming a base on a substrate comprises: forming a first substrate, a barrier layer, and a second substrate in sequence on the substrate; In the bending region, at least the second substrate is etched to form a groove from a side of the second substrate away from the base plate to obtain the base, and the bottom wall of the groove is located in the second substrate, or in the first substrate, or in the barrier layer.

15. The method according to claim 13, characterized in that The step of forming a base on a substrate comprises: A first substrate and a barrier layer are sequentially formed on the substrate, and the barrier layer is etched at the bending region from a side of the barrier layer away from the substrate to at least remove the barrier layer at the bending region; A second substrate is formed on the side of the barrier layer or the first substrate facing away from the base plate, and at least the second substrate is etched to form a groove from the side of the second substrate facing away from the base plate in the bending region to obtain the base, wherein the bottom wall of the groove is located in the second substrate or in the first substrate; Preferably, a first substrate and a barrier layer are sequentially formed on the substrate, and the barrier layer is etched at the bending region from a side of the barrier layer away from the substrate to remove the barrier layer and at least a portion of the first substrate located at the bending region; A second substrate is formed on the side of the first substrate away from the base plate. In the bending region, at least the second substrate is etched to form a groove from the side of the second substrate away from the base plate to obtain the base. The bottom wall of the groove is located in the second substrate or in the first substrate.

16. The method according to claim 13, characterized in that The display panel further includes a binding area, the binding area is located at a side of the bending area away from the first sub-non-display area, and the bending area connects the first sub-non-display area and the binding area; The step of forming a base on a substrate comprises: forming a first substrate on the substrate, wherein the first substrate extends from the display area to the binding area; In the display area and at least part of the first sub-non-display area, a barrier layer and a second substrate are sequentially formed on a side of the first substrate away from the base plate to obtain the base; Preferably, forming the first substrate on the substrate comprises: etching the first substrate from a side of the first substrate away from the substrate in the bending area and the binding area to remove a portion of the first substrate; or forming a first substrate and a barrier layer in sequence on the substrate, wherein the first substrate and the barrier layer extend from the display area to the binding area; In the display area and at least a portion of the first sub-non-display area, a second substrate is formed on a side of the barrier layer away from the substrate to obtain the base.

17. The method according to claim 13, characterized in that At least before forming a conductive layer on the side of the adjustment layer facing away from the substrate, the method further comprises: forming a second film layer at least on a side of the adjustment layer facing away from the substrate; Preferably, the adjustment layer and the second film layer are prepared in the same layer and made of the same material; Preferably, the method further comprises: removing the substrate; Preferably, the removing of the substrate comprises, while removing the substrate or after removing the substrate, performing a thinning process on a side of the base close to the substrate.

18. A method for preparing a display panel, characterized in that: The display panel comprises a display area and a non-display area at least partially surrounding the display area, the non-display area comprises a first sub-non-display area and a bending area located at at least one side of the display area, the bending area is located at a side of the first sub-non-display area away from the display area, and the method comprises: forming a base on the substrate, wherein at least the thickness of the base located in the bending area is smaller than the thickness of the base located in the display area and / or the first sub-non-display area; forming a conductive layer at least on a side of the base located in the bending region away from the substrate; An adjustment layer is formed at least on a side of the conductive layer in the bending region away from the substrate.

19. The method according to claim 18, characterized in that The display panel further includes a binding area, and the bending area is located between the binding area and the first sub non-display area and connects the first sub non-display area and the binding area; The step of forming a base on a substrate comprises: forming a first substrate on the substrate, wherein the first substrate extends from the display area to the binding area; In the display area and at least part of the first sub-non-display area, a barrier layer and a second substrate are sequentially formed on a side of the first substrate away from the base plate to obtain the base; Preferably, forming the first substrate on the substrate comprises: etching the first substrate from a side of the first substrate away from the substrate in the bending area and the binding area to remove a portion of the first substrate; or forming a first substrate and a barrier layer in sequence on the substrate, wherein the first substrate and the barrier layer extend from the display area to the binding area; In the display area and at least a portion of the first sub-non-display area, a second substrate is formed on a side of the barrier layer away from the substrate to obtain the base.

20. The method according to claim 18, characterized in that After forming a conductive layer at least on a side of the base located in the bending region away from the substrate, the method further comprises: forming a first film layer at least on a side of the conductive layer facing away from the substrate; Preferably, the adjustment layer and at least a portion of the first film layer are prepared in the same layer and made of the same material; Preferably, the first film layer includes at least one of a first planarization layer, a pixel definition layer, and a spacer layer, and the adjustment layer is prepared in the same layer as at least one of the first planarization layer, the pixel definition layer, and the spacer layer; Preferably, the method further comprises: removing the substrate; Preferably, the removing of the substrate comprises, while removing the substrate or after removing the substrate, performing a thinning process on a side of the base close to the substrate.

21. A display device, characterized in that: A display panel comprising any one of claims 1 to 12, or a display panel prepared by the method according to any one of claims 13 to 20.

Images