Tail plug structure of Bluetooth earphone and manufacturing method thereof

Abstract

The invention discloses a tail plug structure of a Bluetooth headset and a manufacturing method thereof, the tail plug structure of the Bluetooth headset comprises an insulating seat body and a terminal which are integrally formed through double-shot injection molding, a conductive coating is formed on the surface of the terminal, and the terminal is electrically connected with an external charging device and a circuit board through the conductive coating. According to the invention, the metal PAD does not need to be assembled through assembly processes such as dispensing and pressing, so that the problem that pseudo soldering is easily caused or the sealing protection performance is poor can be solved.

Description

Technical Field

[0001] The present application relates to the technical field of Bluetooth headsets, and in particular to a tail plug structure of a Bluetooth headset and a manufacturing method thereof. Background Art

[0002] Bluetooth headsets are a popular type of headset recently. Compared with wired headsets, they have greatly improved the experience, convenience, and sense of technology. However, current Bluetooth headsets have the following problems in charging:

[0003] The tail plug structure of existing Bluetooth headsets generally uses a metal PAD to weld with the charging pad on the circuit board to achieve electrical connection. When charging is needed, the metal PAD is connected to an external charging device for charging. However, the metal PAD needs to be assembled through assembly processes such as dispensing and pressing. The process is complicated and may cause problems such as glue overflow, assembly gap and breakage, and glue scraping is required, which may easily lead to cold solder joints or poor sealing protection. Summary of the invention

[0004] The purpose of the present application is to provide a tail plug structure of a Bluetooth headset and a manufacturing method thereof, which can solve the technical problems that easily lead to cold solder joints or poor sealing protection.

[0005] To achieve the above object, the present application provides a method for manufacturing a tail plug structure of a Bluetooth headset, which comprises:

[0006] providing a first material and a second material;

[0007] The insulating seat body and the terminal are integrally molded by two-color injection molding, wherein the insulating seat body is injection molded by a first material, and the terminal is injection molded by a second material;

[0008] After the two-color injection molding is completed, a plating treatment is performed on the surface of the terminal to form a conductive plating layer.

[0009] Optionally, the melting point of the first material is higher than the melting point of the second material;

[0010] The method of integrally molding the insulating seat body and the terminal by two-color injection molding comprises:

[0011] Using the first material to form the insulating base;

[0012] The terminal is formed on the insulating base by using the second material.

[0013] Optionally, the insulating seat body comprises an outer wall, a terminal forming position penetrating inside and outside is formed on the outer wall, and the terminal is formed at the terminal forming position and sealedly connected to the outer wall.

[0014] Optionally, the first material is polycarbonate, and the second material is acrylonitrile-butadiene-styrene copolymer.

[0015] Optionally, the conductive plating layer includes a copper layer, a palladium-gold layer and a rhodium-ruthenium layer arranged in sequence from the inside to the outside.

[0016] Optionally, the conductive plating layer has a contact surface electrically connected to an external charging device and a welding area welded to a circuit board, and the conductive plating layer includes a gold-plated layer located on the outermost layer in the welding area.

[0017] To achieve the above-mentioned purpose, the present application also provides a tail plug structure of a Bluetooth headset, which includes: an insulating seat body and a terminal formed as one piece by two-color injection molding, a conductive coating is formed on the surface of the terminal, the conductive coating has a contact surface and a welding area, the contact surface is exposed to the outside to be electrically connected to an external charging device, and the welding area is used for welding to a circuit board.

[0018] Optionally, the conductive plating layer includes a copper layer, a palladium-gold layer and a rhodium-ruthenium layer arranged in sequence from the inside to the outside.

[0019] Optionally, the conductive plating layer includes a gold plating layer located on the outermost layer in the welding area.

[0020] Optionally, the tail plug structure of the Bluetooth headset also includes the circuit board, and the circuit board is arranged on the insulating seat.

[0021] In the embodiment of the present application, the tail plug structure of the Bluetooth headset includes an insulating seat body and a terminal formed by two-color injection molding, a conductive coating is formed on the surface of the terminal, and the terminal is electrically connected to an external charging device and a circuit board by the conductive coating. The present application does not need to assemble the metal PAD through assembly processes such as dispensing and pressing, thereby solving the problem of easy cold soldering or poor sealing protection caused by this. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a flow chart of the manufacturing method of the tail plug structure of the Bluetooth headset in the embodiment of the present application.

[0023] Figure 2 It is a three-dimensional structural schematic diagram of the tail plug structure of the Bluetooth headset in an embodiment of the present application.

[0024] Figure 3 It is a schematic diagram of the three-dimensional structure of the tail plug structure of the Bluetooth headset in the embodiment of the present application from another perspective.

[0025] Figure 4 It is a schematic diagram of the exploded structure of the tail plug structure of the Bluetooth headset in the embodiment of the present application.

[0026] Figure 5It is a three-dimensional structural schematic diagram of the tail plug structure of the Bluetooth headset in the embodiment of the present application (part of the circuit board is removed).

[0027] Figure 6 It is a schematic diagram of the three-dimensional structure of the Bluetooth headset in the embodiment of the present application.

[0028] Figure 7 It is a schematic diagram of the decomposed structure of the Bluetooth headset in the embodiment of the present application. DETAILED DESCRIPTION

[0029] In order to explain the technical content, structural features, achieved objectives and effects of the present application in detail, the following is a detailed description in conjunction with the implementation methods and the accompanying drawings.

[0030] Embodiment 1

[0031] See also Figures 1 to 5 The present application embodiment discloses a method for manufacturing a tail plug structure 100 of a Bluetooth headset, which includes:

[0032] S1. Provide a first material and a second material. Specifically, the first material and the second material have different melting points.

[0033] S2. The insulating base body 1 and the terminal 2 are integrally molded by two-color injection molding. The insulating base body 1 is injection molded by a first material, and the terminal 2 is injection molded by a second material.

[0034] S3 . After the two-color injection molding is completed, a coating process is performed on the surface of the terminal 2 to form a conductive coating 20 .

[0035] In the embodiment of the present application, the insulating seat body 1 and the terminal 2 are formed into one piece by two-color injection molding, and then a conductive coating 20 is formed on the surface of the terminal 2. The terminal 2 is electrically connected to the external charging device and the circuit board 3 by the conductive coating 20. The present application does not need to assemble the metal PAD through assembly processes such as dispensing and pressing, thereby solving the problem of easy cold welding or poor sealing protection caused by this, and is also conducive to improving production efficiency. At the same time, compared with the use of MIM (metal injection molding) metal PAD, it is conducive to reducing costs.

[0036] Specifically, the Bluetooth headset involved in this embodiment is a TWS (wireless stereo) headset, but is not limited to this.

[0037] In some embodiments, the melting point of the first material is higher than the melting point of the second material;

[0038] The insulating seat body 1 and the terminal 2 are integrally molded by two-color injection molding, including:

[0039] Using the first material to form an insulating base body 1;

[0040] The terminal 2 is formed on the insulating base body 1 by using the second material.

[0041] Since the volume of the insulating base body 1 is much larger than that of the terminal 2 , the insulating base body 1 is formed first to facilitate forming the terminal 2 on the insulating base body 1 .

[0042] Specifically, the insulating seat body 1 includes an outer wall 11, on which a terminal forming position 12 is formed to penetrate inside and outside, and the terminal 2 is formed at the terminal forming position 12 and is sealed and connected to the outer wall 11. Since the terminal 2 is formed at the terminal forming position 12 and is sealed and connected to the outer wall 11, the sealing protection of the tail plug structure 100 of the Bluetooth headset is better.

[0043] In some embodiments, the number of the terminals 2 is two, and terminal forming positions 12 penetrating inside and outside are formed on opposite sides of the outer wall 11 , respectively. The two terminals 2 are respectively formed at the terminal forming positions 12 and sealedly connected to the outer wall 11 .

[0044] In some embodiments, the first material is polycarbonate (PC) and the second material is acrylonitrile-butadiene-styrene copolymer (ABS). The use of PC and ABS, two materials with different melting points and good bonding properties, for two-color injection molding can make the tail plug structure 100 of the Bluetooth headset stable in structure and have good sealing protection, which is conducive to avoiding problems such as overflow glue, assembly gap and break caused by traditional assembly processes, and PC and ABS materials have strong high temperature resistance and deformation resistance, ensuring the reliable transmission of current during charging. Of course, the first material is not limited to PC, and the second material is not limited to ABS, and can also be other materials, such as the first material is polypropylene (PP) and the second material is thermoplastic elastomer (TPE), which is not limited here.

[0045] In some embodiments, the conductive coating 20 includes a copper layer, a palladium-gold layer, and a rhodium-ruthenium layer sequentially arranged from the inside to the outside. In order to ensure the electrolysis and corrosion resistance of the conductive coating 20, the conductive coating 20 formed on the surface of the terminal 2 is a composite coating, the first coating (bottom layer) is selected as a copper layer, the second coating (functional layer) is selected as a palladium-gold layer, and the third coating (appearance layer) is selected as a rhodium-ruthenium layer. Exemplarily, the thickness of the first coating can be set to about 50um, and the total thickness of the conductive coating 20 can be set to about 55-60um, which is of course not limited to this. The design scheme of the conductive coating 20 (material type, coating thickness, etc.) can be selected according to functional requirements or usage scenarios, and is not limited here.

[0046] Specifically, the conductive plating layer 20 is formed on the surface of the terminal 2 by water plating, but is not limited thereto.

[0047] In some embodiments, the conductive coating 20 has a contact surface 21 electrically connected to an external charging device and a welding area 22 welded to the circuit board 3, and the conductive coating 20 includes a gold-plated layer located at the outermost layer in the welding area 22. The outermost layer of the welding area 22 is a gold-plated layer, which can improve the conductivity and corrosion resistance of the welding area 22 and enhance the reliability of welding. Since gold reacts slowly with oxygen, water and other substances in the environment, it can effectively slow down the formation of the surface oxide layer, thereby maintaining a good electrical connection. Of course, it is not limited to this, and the outermost coating material of the welding area 22 can also be other materials.

[0048] Specifically, the welding area 22 of the conductive coating 20 on the surface of the terminal 2 is located inside the insulating base 1, so as to facilitate welding between the welding area 22 and the circuit board 3. However, the present invention is not limited thereto, and the welding area 22 may also be disposed at other locations.

[0049] Embodiment 2

[0050] See also Figures 2 to 5 The present application discloses a tail plug structure 100 of a Bluetooth headset, which includes an insulating seat body 1 and a terminal 2 that are integrated by two-color injection molding. A conductive coating 20 is formed on the surface of the terminal 2. The conductive coating 20 has a contact surface 21 and a welding area 22. The contact surface 21 is exposed to the outside and is used to be electrically connected to an external charging device. The welding area 22 is used to be welded to a circuit board 3.

[0051] In the embodiment of the present application, the insulating seat body 1 and the terminal 2 are formed into one piece by two-color injection molding, and then a conductive coating 20 is formed on the surface of the terminal 2. The terminal 2 is electrically connected to the external charging device and the circuit board 3 by the conductive coating 20. The present application does not need to assemble the metal PAD through assembly processes such as dispensing and pressing, thereby solving the problem of easy cold welding or poor sealing protection caused by this, and is also conducive to improving production efficiency. At the same time, compared with the use of MIM (metal injection molding) metal PAD, it is conducive to reducing costs.

[0052] Specifically, the Bluetooth headset involved in this embodiment is a TWS headset, but is not limited to this.

[0053] In some embodiments, the insulating seat body 1 is injection molded by PC, and the terminal 2 is injection molded by ABS. The use of PC and ABS, two materials with different melting points and good bonding properties, for two-color injection molding can make the tail plug structure 100 of the Bluetooth headset stable in structure and have good sealing protection, which is conducive to avoiding problems such as overflow, assembly gap and break caused by traditional assembly processes, and PC and ABS materials have strong high temperature resistance and deformation resistance, ensuring the reliable transmission of current during charging. Of course, the insulating seat body 1 is not limited to being injection molded by PC, and the terminal 2 is not limited to being injection molded by ABS, but can also be other materials, such as the first material is polypropylene (PP) and the second material is thermoplastic elastomer (TPE), which is not limited here.

[0054] In some embodiments, the insulating seat body 1 includes an outer wall 11, and a terminal forming position 12 is formed on the outer wall 11 to penetrate inside and outside, and the terminal 2 is formed at the terminal forming position 12 and is sealed and connected to the outer wall 11. Since the terminal 2 is formed at the terminal forming position 12 and is sealed and connected to the outer wall 11, the sealing protection of the tail plug structure 100 of the Bluetooth headset is better.

[0055] In some embodiments, the number of terminals 2 is two, and terminal forming positions 12 penetrating inside and outside are formed on opposite sides of the outer wall 11 of the insulating seat body 1, and the two terminals 2 are respectively formed at the terminal forming positions 12 and sealedly connected to the outer wall 11. The contact surfaces 21 of the conductive coatings 20 on the surfaces of the two terminals 2 are exposed to the outside to be electrically connected to the external charging device, and the welding areas 22 are respectively welded to the positive and negative electrodes of the circuit board 3 to realize the electrical connection between the external charging device and the circuit board 3.

[0056] In some embodiments, the conductive coating 20 includes a copper layer, a palladium-gold layer, and a rhodium-ruthenium layer sequentially arranged from the inside to the outside. In order to ensure the electrolysis and corrosion resistance of the conductive coating 20, the conductive coating 20 formed on the surface of the terminal 2 is a composite coating, the first coating (bottom layer) is selected as a copper layer, the second coating (functional layer) is selected as a palladium-gold layer, and the third coating (appearance layer) is selected as a rhodium-ruthenium layer. Exemplarily, the thickness of the first coating can be set to about 50um, and the total thickness of the conductive coating 20 can be set to about 55-60um, which is of course not limited to this. The design scheme of the conductive coating 20 (material type, coating thickness, etc.) can be selected according to functional requirements or usage scenarios, and is not limited here.

[0057] Specifically, the conductive plating layer 20 is formed on the surface of the terminal 2 by water plating, but is not limited thereto.

[0058] In some embodiments, the conductive plating layer 20 includes a gold-plated layer at the outermost layer in the welding area 22. The outermost layer of the welding area 22 is a gold-plated layer, which can improve the conductivity and corrosion resistance of the welding area 22 and enhance the reliability of welding. Since gold reacts slowly with oxygen, water and other substances in the environment, it can effectively slow down the formation of the surface oxide layer, thereby maintaining a good electrical connection. Of course, it is not limited to this, and the outermost plating material of the welding area 22 can also be other materials.

[0059] In some embodiments, the tail plug structure 100 of the Bluetooth headset further includes a circuit board 3 , and the circuit board 3 is disposed on the insulating base body 1 .

[0060] Specifically, the welding area 22 of the conductive plating layer 20 on the surface of the terminal 2 is located on the inner side of the insulating base 1. More specifically, a portion of the circuit board 3 is located on the inner side of the insulating base 1, and the welding area 22 is located on the inner side of the insulating base 1, which can facilitate welding between the welding area 22 and the circuit board 3. However, this is not limited to this, the circuit board 3 can also be set at other positions, and the welding area 22 is not limited to being located on the inner side of the insulating base 1.

[0061] Specifically, the appearance of the tail plug structure 100 is approximately hemispherical, but is not limited thereto.

[0062] Embodiment 3

[0063] Please combine Figure 6 to Figure 7 The present application also discloses a Bluetooth headset, including the tail plug structure 100 described in the second embodiment. The Bluetooth headset includes a housing 200, and the tail plug structure 100 is assembled and connected to the bottom of the housing 200.

[0064] Specifically, the Bluetooth headset involved in this embodiment is a TWS headset, but is not limited to this.

[0065] The above disclosure is only a preferred example of the present application, and its role is to facilitate the technical personnel in this field to understand and implement it. Of course, it cannot be used to limit the scope of rights of the present application. Therefore, equivalent changes made according to the scope of the patent application of the present application still fall within the scope covered by the present application.

Claims

1. A method for manufacturing a tail plug structure of a Bluetooth headset, characterized in that: include: providing a first material and a second material; The insulating seat body and the terminal are integrally molded by two-color injection molding, wherein the insulating seat body is injection molded by a first material, and the terminal is injection molded by a second material; After the two-color injection molding is completed, a plating treatment is performed on the surface of the terminal to form a conductive plating layer.

2. The manufacturing method according to claim 1, characterized in that: The melting point of the first material is higher than the melting point of the second material; The method of integrally molding the insulating seat body and the terminal by two-color injection molding comprises: Using the first material to form the insulating base; The terminal is formed on the insulating base by using the second material.

3. The manufacturing method according to claim 2, characterized in that: The insulating seat body comprises an outer wall, a terminal forming position penetrating inside and outside is formed on the outer wall, and the terminal is formed at the terminal forming position and sealedly connected to the outer wall.

4. The manufacturing method according to claim 1, characterized in that: The first material is polycarbonate, and the second material is acrylonitrile-butadiene-styrene copolymer.

5. The manufacturing method according to claim 1, characterized in that: The conductive plating layer comprises a copper layer, a palladium-gold layer and a rhodium-ruthenium layer which are sequentially arranged from the inside to the outside.

6. The manufacturing method according to claim 1 or 5, characterized in that: The conductive plating layer has a contact surface electrically connected to an external charging device and a welding area welded to a circuit board, and the conductive plating layer includes a gold-plated layer located on the outermost layer in the welding area.

7. A tail plug structure of a Bluetooth headset, characterized in that: include: The insulating seat and the terminal are formed into one piece by two-color injection molding, and a conductive coating is formed on the surface of the terminal. The conductive coating has a contact surface and a welding area. The contact surface is exposed to the outside to be electrically connected to an external charging device, and the welding area is used for welding to a circuit board.

8. The tail plug structure according to claim 7, characterized in that: The conductive plating layer comprises a copper layer, a palladium-gold layer and a rhodium-ruthenium layer which are sequentially arranged from the inside to the outside.

9. The tail plug structure according to claim 7, characterized in that: The conductive plating layer includes a gold plating layer located on the outermost layer in the welding area.

10. The tail plug structure according to claim 7, characterized in that: The circuit board is also included, and the circuit board is arranged on the insulating base.

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