Cooling device for power module

Abstract

The present invention relates to a cooling device for a power module, which includes a manifold cover and fins, and generates a vertical turbulent flow of a cooling fluid using heat dissipation fins of the fins arranged in the longitudinal and vertical directions of the manifold cover, thereby vertically spraying the cooling fluid onto a heat-generating surface, which ensures cooling efficiency, and improves heat dissipation efficiency. And meanwhile, the flow velocity loss caused by vertical turbulence is minimized by improving the flow efficiency of the cooling fluid. The manifold cover is provided with a plurality of flow paths for circulation of the cooling fluid, the plurality of flow paths having different directions for inflow and circulation of the cooling fluid, respectively, and having different volumes or widths, thereby minimizing pressure loss during fluid circulation, and solving the problem of cooling imbalance through the heat dissipation fins.

Description

Technical Field

[0001] The present invention relates to a power module cooling device for cooling a power module using a cooling fluid. Background Art

[0002] Power modules are used in electric vehicles and other applications to control high voltages and high currents. As a result, power modules generate a lot of heat and therefore require proper cooling to maintain performance and durability. To achieve this, cooling fluids are used to cool the power modules, and waste heat from the power modules is used for mobile heating.

[0003] Generally, for cooling purposes, it is common to connect a cooling device to one side of the power module and circulate a cooling fluid through the cooling device. However, conventional cooling devices that generally adopt a simple tube structure or a fin structure have a problem of limited cooling efficiency.

[0004] When there are multiple power modules, the cooling efficiency of the power modules that are cooled later is reduced compared to the power modules that are cooled first. This cooling imbalance in the power modules may lead to a decrease in the performance of the power modules.

[0005] Therefore, the cooling efficiency of electric vehicles and other mobile devices is closely related to the overall energy efficiency of the mobile device, and it also has a significant impact on the durability and performance maintenance of the power module, so it is necessary to improve the cooling efficiency of the power module through a new cooling structure.

[0006] The information included in the Background of the Invention is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgment or any form of suggestion that this information forms the prior art already known to a person skilled in the art. Summary of the invention

[0007] Various aspects of the present invention are directed to providing a cooling device for a power module, which generates vertical turbulence of a cooling fluid by heat dissipation fins of a fin plate arranged in the longitudinal and vertical directions of a manifold cover to vertically spray the cooling fluid onto a heat-generating surface, thereby ensuring cooling efficiency while minimizing the flow velocity loss caused by the vertical turbulence by improving the flow efficiency of the cooling fluid.

[0008] In order to achieve the above-mentioned purpose, a cooling device for a power module according to an exemplary embodiment of the present invention includes: a manifold cover, which is configured to circulate a cooling fluid and accommodate a power module and a cooling channel portion matched with the power module, the cooling channel portion including a plurality of guide flow paths, in which a first flow path is formed to have an end opened on the upstream side and a cross-sectional area decreasing toward the downstream side, and a second flow path is formed to have an end opened on the downstream side and a cross-sectional area increasing toward the downstream side; a fin plate, which is accommodated in the manifold cover, contacts the power module, and includes heat dissipation fins facing the cooling channel portion and extending in a second direction intersecting the first direction, so that the cooling fluid entering the first flow path flows between the heat dissipation fins and is then discharged through the second flow path.

[0009] The first flow path of the cooling channel portion is formed with one end opened on the upstream side and the other end closed on the downstream side, so that the cooling fluid enters from the open end and circulates through the heat dissipation fins, and the second flow path is formed with one end closed on the upstream side and the other end opened on the downstream side, so that the cooling fluid entering through the heat dissipation fins circulates toward the downstream side.

[0010] The height of the first flow path of the cooling passage portion decreases toward the downstream side, and the height of the second flow path increases toward the downstream side.

[0011] The width of the first flow path of the cooling passage portion decreases toward the downstream side, and the width of the second flow path increases toward the downstream side.

[0012] The manifold cover includes a barrier portion formed between the first flow path and the second flow path, the barrier portion separating the first flow path and the second flow path.

[0013] The manifold cover accommodates a plurality of power modules and a plurality of cooling channel portions corresponding to the power modules, the cooling channel portion including a connecting pipe connecting a second flow path of the cooling channel portion located on an upstream side and a first flow path of the cooling channel portion located on a downstream side to be fluidly connected to each other.

[0014] The connecting pipe includes an inlet portion and an outlet portion, the inlet portion being formed on the downstream side and connected to the second flow path of the cooling channel portion, the outlet portion branching from the inlet portion and extending diagonally and connected to at least two of the first flow paths to merge the outlet portions of different connecting pipes with one of the first flow paths.

[0015] The connection pipe forms a triangular shape at a branch point from the inlet portion to the outlet portion.

[0016] The manifold cover accommodates a first power module, a second power module and a third power module, the cooling channel portion includes a first cooling channel portion, a second cooling channel portion and a third cooling channel portion, and the volume of the guide flow path of the third cooling channel portion is smaller than the volume of the guide flow path of the first cooling channel portion and the second cooling channel portion.

[0017] The advantage of the cooling device for a power module constructed as described above is that vertical turbulence of the cooling fluid is generated by the heat dissipation fins of the fin plate arranged in the longitudinal and vertical directions of the manifold cover to vertically spray the cooling fluid onto the heat-generating surface, thereby ensuring the cooling efficiency, while minimizing the flow velocity loss caused by the vertical turbulence by improving the flow efficiency of the cooling fluid.

[0018] The manifold cover is provided with a plurality of flow paths for circulation of cooling fluid, the plurality of flow paths having different directions for inflow and circulation of cooling fluid respectively and having different volumes or widths, thereby minimizing pressure loss during fluid circulation and solving the problem of cooling imbalance through heat dissipation fins.

[0019] The methods and apparatus of the present invention have other features and advantages, which will be apparent from the accompanying drawings and the following detailed description incorporated herein, or will be described in more detail in the accompanying drawings and the following detailed description incorporated herein, which together are used to explain the specific principles of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is an exploded perspective view of a cooling device for a power module according to various exemplary embodiments of the present invention;

[0021] Figure 2 It shows Figure 1 A schematic diagram of a cooling channel portion of a manifold cover of a cooling device for a power module;

[0022] Figure 3 is a schematic diagram showing an impact injection effect in a cooling device for a power module according to an exemplary embodiment of the present invention;

[0023] Figure 4 is a schematic diagram showing a first flow path of a cooling device for a power module according to an exemplary embodiment of the present invention; and

[0024] Figure 5 is a schematic diagram illustrating a second flow path of a cooling device for a power module according to an exemplary embodiment of the present invention.

[0025] It is to be understood that the accompanying drawings are not necessarily drawn to scale, but are appropriately simplified drawings of various features presented to illustrate the basic principles of the present invention. The specific design features of the present invention included herein (including, for example, specific size, direction, position and shape) will be determined in part by the specific environment to be applied and used.

[0026] In the drawings, like reference numbers refer to the same or equivalent parts of the present invention throughout the several figures of the drawing. DETAILED DESCRIPTION

[0027] Reference will now be made in detail to various embodiments of the present invention, examples of which are shown in the accompanying drawings and described below. Although the present invention will be described in conjunction with exemplary embodiments of the present invention, it will be understood that this specification is not intended to limit the present invention to those exemplary embodiments of the present invention. On the other hand, the present invention is intended to cover not only the exemplary embodiments of the present invention, but also various alternative embodiments, modified embodiments, equivalent embodiments or other embodiments that may be included in the spirit and scope of the present invention as defined by the appended claims.

[0028] Hereinafter, exemplary embodiments included in the present specification are described with reference to the accompanying drawings, in which the same reference numerals are given to refer to the same or similar components and redundant descriptions thereof are omitted.

[0029] As used in the following description, the suffixes 'module' and 'unit' may be permitted or used interchangeably considering ease of description, but themselves include no distinguished meanings or roles.

[0030] In addition, detailed descriptions of known technologies related to the exemplary embodiments included in this specification may be omitted to avoid obscuring the subject matter of the exemplary embodiments included in this specification. In addition, the attached drawings are only used to facilitate understanding of the exemplary embodiments included in this specification, and do not limit the technical spirit included herein, and it should be understood that the exemplary embodiments include all modified embodiments, equivalent embodiments, or alternative embodiments within the spirit and scope of the present invention.

[0031] As used herein, terms including ordinal numbers such as "first" and "second" may be used to describe various components without limiting the components. These terms are only used to distinguish one component from another.

[0032] It will be understood that when a component is referred to as being "connected to" or "coupled to" another component, it may be directly connected to or coupled to the other component, or intervening components may be present. Conversely, when a component is referred to as being "directly connected to" or "directly coupled to" another component, there are no intervening components.

[0033] As used herein, singular forms are intended to include plural forms as well, unless the context clearly indicates otherwise.

[0034] It will be further understood that when the terms “include” or “have” are used in this specification, it means the presence of the described features, values, steps, operations, components, elements or a combination thereof, but does not exclude the presence or addition of one or more other features, values, steps, operations, components, elements or a combination thereof.

[0035] Hereinafter, a cooling apparatus for a power module according to various exemplary embodiments of the present invention is described with reference to the accompanying drawings.

[0036] like Figure 1 and Figure 2 As shown, a cooling device for a power module according to an exemplary embodiment of the present invention includes a manifold cover 200 and a fin plate 300, wherein the manifold cover 200 is configured to circulate a cooling fluid and accommodate a power module 100 and a cooling channel portion 210 matched with the power module 100, wherein the cooling channel portion 210 includes a plurality of guide flow paths 220, wherein a first flow path 221 is formed to have an end portion opened on one side thereof and a cross-sectional area gradually decreasing toward the other side thereof, and a second flow path 222 is formed to have an end portion opened on the other side and a cross-sectional area gradually increasing toward the other side; the fin plate 300 is accommodated in the manifold cover 200, contacts the power module 100, and includes heat dissipation fins 310 facing the cooling channel portion 210 and extending along a second direction intersecting the first direction, so that the cooling fluid entering the first flow path 221 can flow between the heat dissipation fins 310 and then be discharged through the second flow path 222.

[0037] The manifold cover 200 is formed to enable cooling fluid to circulate inside, and includes an inlet port 240 for inletting the cooling fluid and an outlet port 250 for exhausting the cooling fluid passing through the power module 100 .

[0038] In the manifold cover 200, the cooling channel portion 210 is formed to match the power module 100, so that the cooling fluid can circulate through the cooling channel portion 210, which causes heat exchange between the cooling fluid and the power module 100 through the cooling channel portion 210, thereby cooling the power module 100. The cooling channel portion 210 includes a plurality of guide flow paths 220, and the guide flow paths 220 include a first flow path 221 and a second flow path 222 designed to change the direction of fluid circulation.

[0039] The fin plate 300 accommodated in the manifold cover 200 includes heat dissipation fins 310 facing the cooling channel portion 210 .

[0040] The first flow path 221 has one end that is open on one side and the other end that is closed on the other side, so that the fluid can enter from one side and circulate through the heat sink fins 310, and the second flow path 222 has one end that is closed on one side and the other end that is open on the other side, so that the fluid entering through the heat sink fins 310 can circulate toward the other side.

[0041] Therefore, the cooling fluid circulating in the manifold cover 200 flows through the heat sink fins 310 through the first flow path 221 and is then discharged through the second flow path 222. In addition, the first flow path 221 and the second flow path 222 extend in the first direction and are alternately arranged in the second direction, thereby forming an impingement jet cooling structure when the cooling fluid passes through the heat sink fins 310 in the first flow path 221 and enters the second flow path 222.

[0042] That is, the cooling channel portion 210 includes a plurality of guide flow paths 220 extending along a first direction, wherein the guide flow paths 220 include a first flow path 221 having one end open to allow fluid to enter and the other end closed, and a second flow path 222 having one end closed and the other end open to allow fluid to discharge, and the first flow paths 221 and the second flow paths 222 are alternately arranged.

[0043] The heat dissipation fins 310 of the fin plate 300 are in contact with the first flow path 221 and the second flow path 222 in the cooling channel portion 210 , so that cooling fluid communication can be achieved between the first flow path 221 and the second flow path 222 .

[0044] like Figure 3 As shown, the heat dissipating fins 310 of the fin plate 300 are formed to extend in a second direction perpendicular to the first direction, and the first direction extends in the direction of the guide flow path 220 extending in the first direction.

[0045] In other words, the first flow path 221 and the second flow path 222 extend in the first direction, and the heat sink fins 310 extend in the second direction, so that the cooling fluid can flow from the first flow path 221 to the second flow path 222 through the heat sink fins 310. In this way, during the circulation process from the first flow path 221 to the second flow path 222, the cooling fluid causes turbulence due to the velocity component in the vertical direction, thereby forming an impingement jet cooling structure.

[0046] As a result, the cooling fluid circulating in the manifold cover 200 is distributed to the plurality of first flow paths 221 (which are open on one side of the direction in which the cooling fluid flows in and are closed on the other side), so that the cooling fluid can flow between the heat dissipation fins 310 of the fin plate 300, and then circulates to the second flow paths 222. The second flow paths 222 are open on the other side of the direction in which the cooling fluid is discharged and are closed on one side, so that the cooling fluid entering the second flow paths 222 can be discharged to the outside of the manifold cover 200.

[0047] In this way, the impingement jet cooling structure formed by the cooling fluid flow according to the exemplary embodiment of the present invention improves the cooling performance of the power module 100. Impingement jet cooling is a cooling technology that injects cooling air directly into a high-temperature surface to remove heat, thereby producing a local high heat transfer effect. In order to effectively achieve the impingement jet cooling effect of the present invention, it is necessary to utilize turbulent flow rather than laminar flow. Turbulence refers to a flow with a velocity component in a direction perpendicular to the flow direction, that is, an irregular diffusion flow with three-dimensional (3D) vortices in the upward, downward, left and right directions in addition to the flow direction. When turbulence exists around an object, the cooling area increases and the agitation of the cooling fluid increases, thereby improving the cooling efficiency.

[0048] Hereinafter, the jet impingement cooling will be described in detail. Figure 3 is a schematic diagram showing a microchannel of a cooling device for a power module 100 according to various exemplary embodiments of the present invention. Figure 3 As shown, the cooling fluid is introduced from the inlet and forms an inlet space (inlet plenum) as a combination of narrow water flows. The cooling fluid entering the first flow path 221 or the second flow path 222 of the manifold cover 200 flows through a plurality of heat sink fins 310. That is, when the cooling fluid enters the first flow path 221 and encounters an obstacle on the outlet side, it flows through the heat sink fins 310 and then enters the second flow path 222, generating turbulence in the process. In addition, the second flow path 222 closed on the inlet side enables the cooling fluid to flow to the outlet side, pass through the heat sink fins 310, and be discharged. As a result, the cooling fluid exhibiting higher irregularity and diffusivity produces a more significant impact jet cooling effect. Therefore, the present invention ensures the cooling performance of the power module 100 by the impact jet cooling effect achieved by the cooling channel portion 210 of the manifold cover 200 and the heat sink fins 310 of the fin plate 300.

[0049] The manifold cover 200 according to the exemplary embodiment of the present invention enhances the circulation flow of the cooling fluid by forming the first flow path 221 and the second flow path 222 of the guide flow path 220 forming the cooling channel portion 210 .

[0050] That is, since the first flow path 221 is formed to have a cross-sectional area that gradually decreases toward the other side, the flow of the cooling fluid is guided in the direction in which the cooling fluid needs to circulate. This is achieved through a phenomenon called vena contracta, in which the cross section of the first flow path 221 gradually narrows toward the other side, causing the cooling fluid to contract and flow smoothly toward the outlet side, thereby enabling the cooling fluid to circulate efficiently.

[0051] In addition, since the second flow path 222 is formed to have a cross-sectional area that gradually increases toward the other side, the flow of the cooling fluid is guided in the direction in which the cooling fluid needs to circulate. That is, in the case of the second flow path 222, when the cooling fluid circulates from one side to the other side, the pressure decreases due to the increase in the cross-sectional area, so that the cooling fluid entering the second flow path 222 through the heat dissipation fins 310 circulates smoothly toward the other side thereof.

[0052] According to an exemplary embodiment of the present invention, the cooling passage portion 210 may be formed such that a height of the first flow path 221 gradually decreases toward the other side and a height of the second flow path 222 gradually increases toward the other side thereof.

[0053] By forming the first flow path 221 with a downward slope toward the other side, the height is gradually reduced, thereby improving the flow circulation of the cooling fluid due to the contraction flow section effect. The first flow path 221 can include an inclination angle of about 3° to 8° at the top, and the inclination angle can be adjusted by experiments conducted on the flow of the cooling fluid.

[0054] By forming the second flow path 222 with an upward slope toward the other side, the height gradually increases, thereby enabling the cooling fluid to circulate smoothly in the second flow path 222 due to the pressure difference between one side and the other side. According to the flow of the cooling fluid, the second flow path 222 may be formed at the top with a slope of about 3° to 8°, which is the same as the angle of the first flow path 221, or a different slope, to enhance the circulation flow of the cooling fluid.

[0055] In another exemplary embodiment of the present invention, the first cooling channel portion 210 a may be formed such that the width of the first flow path 221 becomes narrower toward the other side and the height of the second flow path 222 gradually increases toward the other side thereof.

[0056] In another exemplary embodiment of the present invention, by forming the first flow path 221 with a gradually narrowing width and height on both sides toward the other side, the circulation flow of the cooling fluid due to the contraction flow section can be enhanced. By forming the second flow path 222 with a gradually widening width and height on both sides toward the other side, the pressure difference between one side and the other side can promote the flow of the cooling fluid.

[0057] The manifold cover 200 in the exemplary embodiment of the present invention is formed with the first flow path 221 and the second flow path 222 whose cross-sectional area, height and width gradually decrease or increase, thereby minimizing the circulation loss of the cooling fluid, improving the flow, increasing the flow efficiency, and ultimately improving the cooling performance.

[0058] Meanwhile, the manifold cover 200 may include a barrier portion 230 formed between the first flow path 221 and the second flow path 222 for separation.

[0059] The barrier portion 230 is located between the plurality of first flow paths 221 and the second flow paths 222 within the manifold cover 200 , thereby generating a dead zone in which the cooling fluid circulates only through the heat sink fins 310 .

[0060] As a result, the cooling fluid circulating in the manifold cover 200 causes turbulence due to the vertical component in the first flow path 221, thereby causing the formation of an impingement jet cooling structure. In addition, the presence of the barrier portion 230 between the first flow path 221 and the second flow path 222 increases the residence time of the cooling fluid in contact with the heat sink fins 310, thereby enabling effective heat exchange.

[0061] In addition, since the manifold cover 200 accommodates multiple power modules 100, the cooling channel portion 210 is correspondingly configured to match each power module 100, and a connecting pipe 260 is provided to establish a connection and fluid communication between the second flow path 222 of the cooling channel portion 210 located on one side and the first flow path 221 of the cooling channel portion 210 located on the other side thereof.

[0062] A plurality of power modules 100 may be arranged in series within the inner space of the manifold cover 200 , and the cooling channel portions 210 may be arranged in series along an alignment direction of the power modules 100 .

[0063] Each cooling channel portion 210 is provided with a connecting pipe 260 , so that connection and fluid communication between the first flow paths 221 and the second flow paths 222 of different cooling channel portions 210 can be achieved through the connecting pipe 260 .

[0064] like Figure 2 As shown, the other end of the second flow path 222 of the cooling channel portion 210 located on one side can be connected to the one end of the first flow path 221 of the cooling channel portion 210 located on the other side through the connecting pipe 260. That is, by connecting the other end of the second flow path 222 opened on the outlet side to the one end of the first flow path 221 opened on the inlet side through the connecting pipe 260, the cooling fluid can circulate in each cooling channel portion 210.

[0065] In detail, the connecting pipe 260 is connected to the second flow path 222 of the cooling channel portion 210 at its inlet portion 261 located on one side, and is connected to at least two of the first flow paths 221 of the cooling channel portion 210 located on the other side at its forked and diagonally extending outlet portion 262, so that the outlet portions 262 of different connecting pipes 260 can merge with one of the first flow paths 221.

[0066] That is to say, Figure 2As shown, a plurality of cooling channel portions 210 are provided with a first flow path 221 and a second flow path 222, and the first flow path 221 and the second flow path 222 in each cooling channel portion 210 are arranged at the same position along the same direction. Accordingly, the connecting pipe 260 is formed to extend diagonally, wherein the inlet portion 261 is connected to the second flow path 222 of the cooling channel portion 210 located on one side, and the outlet portion 262 is connected to the first flow path 221 of the cooling channel portion 210 located on the other side, so that the first flow path 221 and the second flow path 222 of each cooling channel portion 210 can be fluidically connected.

[0067] In addition, the connection pipe 260 in the exemplary embodiment of the present invention may be configured with an inlet portion 261 and two outlet portions 262. That is, the inlet portion 261 of the connection pipe 260 is connected to the second flow path 222 of the cooling channel portion 210 located on one side, and the outlet portion 262 extends diagonally and is connected to the two first flow paths 221 of the cooling channel portion 210 located on the other side, thereby enabling the cooling fluid to be dispersed and recombined when circulating between different cooling channel portions 210.

[0068] As described above, the connection pipe 260 is formed into a triangular shape at the branching point from the inlet portion 261 to the outlet portion 262, thereby reducing the flow resistance of the cooling fluid circulating through the different cooling channel portions 210. This utilizes a pressure loss reduction structure based on the contraction flow phenomenon, thereby maintaining a constant diameter of the flow path through the triangular shape in the connection pipe (260) to minimize pressure loss.

[0069] Furthermore, the second flow path 222 is formed to include an increased cross-sectional area and the first flow path 221 is formed to include a reduced cross-sectional area toward the other side in the circulation direction of the cooling fluid, which can reduce pressure loss due to the contraction section.

[0070] At the same time, the manifold cover 200 can accommodate the first power module 100a, the second power module 100b and the third power module 100c, and the cooling channel portion 210 may include the first cooling channel portion 210a, the second cooling channel portion 210b and the third cooling channel portion 210c, and the third cooling channel portion 210c is formed to have a volume smaller than the volume of the first cooling channel portion 210a and the second cooling channel portion 210b.

[0071] The first power module 100a may be configured with U-phase electricity, the second power module 100b may be configured with V-phase electricity, and the third power module 100c may be configured with W-phase electricity, so that each power module 100 can provide three-phase AC power to an external system.

[0072] Accordingly, the cooling channel portion 210 of the manifold cover 200 may be configured with a first cooling channel portion 210a for cooling the first power module 100a, a second cooling channel portion 210b for cooling the second power module 100b, and a third cooling channel portion 210c for cooling the third power module 100c.

[0073] However, as the cooling fluid circulates while sequentially cooling the first, second, and third power modules 100a, 100b, and 100c, the cooling efficiency of the third power module 100c may be reduced because the cooling fluid is heated by the preceding power modules and exchanges heat.

[0074] Therefore, according to an exemplary embodiment of the present invention, the first flow path 221 and the second flow path 222 of the third cooling channel portion 210c are formed with a smaller volume compared with the volumes of the first cooling channel portion 210a and the second cooling channel portion 210b, so that compared with the previous cooling channel portion 210, a higher cooling flow rate can be achieved in the third cooling channel portion 210c where the cooling fluid arrives last along the direction of fluid circulation due to the enhanced contraction flow section.

[0075] As a result, the cooling performance of the third cooling passage portion 210 c is ensured, and a temperature distribution balance with other cooling passage portions 210 can be achieved.

[0076] The cooling device for the power module 100 constructed as described above ensures cooling efficiency by generating vertical turbulence of the cooling fluid through the heat dissipation fins 310 of the fin plate 300 arranged in a direction perpendicular to the manifold cover 200, thereby enabling the cooling fluid to be vertically sprayed onto the heat-generating surface and improving the flow efficiency of the cooling fluid, thereby minimizing the flow loss associated with the vertical turbulence.

[0077] The plurality of flow paths through which the cooling fluid circulates in the manifold cover 200 are respectively arranged along the fluid inflow direction and the fluid circulation direction and are formed with different volumes or widths, thereby minimizing pressure loss during fluid circulation and solving cooling imbalance through the heat dissipation fins 310 .

[0078] In an exemplary embodiment of the present invention, a vehicle may be referred to as being based on a concept including various vehicles. In some cases, a vehicle may be interpreted as being based on a concept that includes not only various land vehicles (e.g., cars, motorcycles, trucks, and buses) traveling on a road, but also various vehicles such as airplanes, drones, ships, and the like.

[0079] For ease of interpretation and accurate definition in the appended claims, the terms "upper", "lower", "inner", "outer", "upward", "downward", "upwardly", "downwardly", "front", "rear", "back", "inside", "outside", "inwardly", "outwardly", "inner", "external", "inwardly", "outwardly", "forward" and "rearward" are used to describe the features of the exemplary embodiments with reference to the positions of such features as shown in the accompanying drawings. It will be further understood that the term "connected" or its derivatives refer to both direct and indirect connections.

[0080] The term "and / or" may include a combination of multiple related listed items or any one of multiple related listed items. For example, "A and / or B" includes all three situations such as "A", "B" and "A and B".

[0081] In this specification, unless otherwise stated, a singular expression includes a plural expression unless the context clearly indicates otherwise.

[0082] In an exemplary embodiment of the present invention, “at least one of A and B” may refer to “at least one of A or B” or “at least one of a combination of at least one of A and B”. Furthermore, “one or more of A and B” may refer to “one or more of A or B” or “one or more of a combination of one or more of A and B”.

[0083] In the exemplary embodiments of the present invention, it should be understood that terms such as "include" or "have" are intended to indicate the presence of features, values, steps, operations, elements, parts, or a combination thereof described in the specification, and do not exclude the possibility of adding or existing one or more other features, values, steps, operations, elements, parts, or a combination thereof.

[0084] The foregoing descriptions of specific exemplary embodiments of the present invention are presented for the purpose of illustration and description. These descriptions are not intended to be exhaustive or to limit the present invention to the precise form disclosed, and it is apparent that many modifications and changes may be made in light of the foregoing teachings. Exemplary embodiments are selected and described to explain the specific principles of the present invention and their practical application, so that other persons skilled in the art can implement and utilize various exemplary embodiments of the present invention and various alternative and modified embodiments thereof. The scope of the present invention is intended to be limited by the appended claims and their equivalents.

Claims

1. A cooling device for a power module, the device comprising: Cooling channel section; a manifold cover configured to circulate a cooling fluid and to accommodate a power module and a cooling channel portion matched with the power module, wherein the cooling channel portion includes a plurality of guide flow paths, in which a first flow path is formed in a first direction to have a first end opened on an upstream side and a cross-sectional area decreasing toward a downstream side, and a second flow path is formed in the first direction to have a first end opened on a downstream side and a cross-sectional area increasing from a second end of the second flow path toward the downstream side; as well as A fin plate is housed in the manifold cover, contacts the power module, and includes heat dissipation fins facing the cooling channel portion and extending in a second direction intersecting the first direction, so that the cooling fluid entering the first flow path can flow between the heat dissipation fins and then be discharged through the second flow path.

2. The cooling device for a power module according to claim 1, wherein: The first flow path of the cooling channel portion is formed with a first end portion opened on the upstream side and a second end portion closed on the downstream side, so that the cooling fluid enters from the first end portion opened by the first flow path and circulates through the heat dissipation fins. The second flow path is formed with a second end portion closed on the upstream side and a first end portion opened on the downstream side so that the cooling fluid entering through the heat dissipation fins circulates toward the downstream side.

3. The cooling device for a power module according to claim 1, wherein: The height of the first flow path of the cooling passage portion decreases toward the downstream side.

4. The cooling device for a power module according to claim 3, wherein: The height of the second flow path increases toward the downstream side.

5. The cooling device for a power module according to claim 3, wherein: The width of the second flow path increases toward the downstream side.

6. The cooling device for a power module according to claim 1, wherein: The width of the first flow path decreases toward the downstream side.

7. The cooling device for a power module according to claim 6, wherein: The height of the second flow path increases toward the downstream side.

8. The cooling device for a power module according to claim 6, wherein: The width of the second flow path increases toward the downstream side.

9. The cooling device for a power module according to claim 1, wherein: The manifold cover includes a barrier portion formed between the first flow path and the second flow path, the barrier portion separating the first flow path and the second flow path.

10. The cooling device for a power module according to claim 1, wherein: The power modules are in plural numbers and the manifold cover accommodates the plurality of power modules, the cooling channel portions are in plural numbers and the plurality of cooling channel portions correspond to the plurality of power modules, The plurality of cooling channel portions include a connecting pipe connecting a second flow path of a first cooling channel portion located on an upstream side among the plurality of cooling channel portions and a first flow path of a second cooling channel portion located on a downstream side among the plurality of cooling channel portions to be fluidly connected with each other.

11. The cooling device for a power module according to claim 10, wherein: The connecting pipeline comprises: an inlet portion formed on the downstream side and connected to the second flow path of the first cooling passage portion; and An outlet portion diverges from the inlet portion and extends diagonally and is connected to at least two of the first flow paths of the second cooling channel portion to merge the outlet portions of different connection pipes with one of the first flow paths of the adjacent cooling channel portion.

12. The cooling device for a power module according to claim 11, wherein: The connection pipe forms a triangular shape at a branch point from the inlet portion to the outlet portion.

13. The cooling device for a power module according to claim 1, wherein: The power modules are plural and the plurality of power modules include a first power module, a second power module and a third power module along a first direction. The manifold cover accommodates a first power module, a second power module, and a third power module along a first direction, The cooling channel portion includes a first cooling channel portion, a second cooling channel portion, and a third cooling channel portion along a first direction.

14. The cooling device for a power module according to claim 13, wherein: The volume of the guide flow path of the third cooling channel portion is smaller than the volumes of the guide flow paths of the first cooling channel portion and the second cooling channel portion.

15. The cooling device for a power module according to claim 13, wherein: The first power module is configured with U-phase electricity, the second power module is configured with V-phase electricity, and the third power module is configured with W-phase electricity.

Images