Split combined type multi-layer heat insulation assembly fixing device and disassembly and assembly method

Abstract

A split combined type multi-layer heat insulation assembly fixing device comprises a pin column head which is in a long cylinder shape and used for penetrating through a multi-layer heat insulation assembly, pressing piece clamping grooves for pressing pieces to be embedded are distributed in the surface of the pin column head from top to bottom at equal intervals, and a column head-base connector is arranged at the bottom of the pin column head; the pressing sheets are circular and are provided with opening grooves extending from the circle point to the circumference, the opening grooves can be inserted into the pressing sheet clamping grooves so that the pressing sheets can be fixed to the pin column head, and a plurality of layers of heat insulation assemblies are arranged between every two pressing sheets; the pin base is fixed to the surface of the spacecraft, provided with a base-column head connector and used for being connected with the column head-base connector in a matched mode so that the pin column head can be fixed to the pin base. According to the invention, random combination can be carried out in an inserting and buckling butt joint mode, the state can be flexibly changed by changing the combination mode of the pin base and the column head, a large amount of processing time and cost are saved, and the use efficiency of the product is improved.

Description

Technical Field

[0001] The invention belongs to the field of aerospace thermal control technology, and specifically relates to a split-assembly type multi-layer thermal insulation component fixing device and a disassembly method. Background Art

[0002] Multilayer thermal insulation components are the most commonly used thermal insulation materials on the surface of spacecraft. They have excellent thermal insulation performance in the high vacuum and weightlessness environment of space. Commonly used methods for fixing multilayer thermal insulation components of spacecraft include nylon net bag tying, nylon buckle lap joint, and pin-pressing assembly.

[0003] The two fixing methods of nylon mesh bag tying and nylon buckle overlap, in addition to the limited tightness and firmness of the material fixing, the nylon material will be destroyed under long-term irradiation and high vacuum environment, resulting in a significant attenuation of mechanical properties.

[0004] The pin in the pin-pressing sheet assembly is divided into two parts: the base and the column head. The base plays a role in fixing the entire assembly, and the column head is used to penetrate the multi-layer insulation assembly and fix the multi-layer insulation assembly by inserting the inner and outer pressing sheets into the column head slot. This fixing method has better stability and reliability.

[0005] With the development of my country's aerospace industry, some high-precision detection payloads require more solid and reliable thermal insulation materials to ensure a more stable temperature environment. Therefore, compared with nylon net bags and nylon buckle overlaps, pin-pressing sheet assemblies are a more suitable fixing method.

[0006] At present, in the traditional pin-pressing assembly, the base and the column head of the pin part are made of the same material as a whole. The base is usually flat and fixed with silicone rubber. This type of assembly will have the following problems:

[0007] 1. The pin column structure is prone to wear and deformation due to repeated installation and disassembly of the pressure plate, and needs to be replaced in time. However, the integrally processed pin cannot achieve column replacement; at the same time, the base is usually fixed with silicone rubber. After the silicone rubber is cured, it is very difficult to disassemble the pin as a whole, and the disassembly process is likely to cause damage to the surface of the spacecraft.

[0008] 2. The overall processing method of the pin can only use one preparation material. When the base is fixed with screws, titanium alloy material is usually selected to ensure mechanical strength. The length of the column head usually ranges from 10mm to 40mm. The processing raw material must meet the overall envelope length of the pin. Therefore, the use of titanium alloy for processing the column head will greatly increase the research and development cost.

[0009] 3. Compared with organic materials such as polyimide, the column head of the pin assembly made of integral titanium alloy leaks more heat, resulting in poor thermal damping performance of the multi-layer insulation assembly to changes in the external environment, thereby reducing the insulation effect of the multi-layer insulation assembly and affecting the temperature stability of the internal load of the spacecraft.

[0010] 4. The fixing device of the multi-layer thermal insulation component will be designed and processed in advance according to the development plan. If the technical status changes in the subsequent development process (for example, the multi-layer thermal insulation component is changed from one piece to multiple overlapping pieces, resulting in changes in the column head length and the number of slots; the installation surface is changed from a flat surface to a curved surface, resulting in changes in the base fitting shape, etc.), the originally processed integrated pin assembly will become unusable and need to be redesigned and processed, which significantly increases the development time and cost.

[0011] 5. The fixed surface features of multi-layer insulation components are varied, such as the cabin plane, the conical surface of the sunshade, the parabola of the antenna, the spherical surface of the tension tank, or the flexible surface that only relies on the overlap of multi-layer insulation components. For positions with large mechanical response, screws are required for fixing. Therefore, the flat base of the pin part does not have good adaptability. Summary of the invention

[0012] In response to the problems of the above-mentioned traditional pin-pressing sheet assembly, the present invention proposes a split-assembly type multi-layer insulation assembly fixing device, by designing and processing the pin base and the pin column head separately, the pin base is made of titanium alloy or polyimide and other materials according to the mechanical environment of the installation position, and the base can be set to different fitting shapes or screw structures according to the characteristics of the installation surface; the pin column head is made of polyimide and other materials and the length and number of slots are designed according to the state of the multi-layer insulation assembly; the base and the column head are connected in any combination in the form of buckles, which is suitable for a variety of fixing scenarios. At the same time, a column head disassembly tool is invented, regardless of whether the pin is fixed on the surface of the spacecraft, the column head can be disassembled quickly, non-destructively and safely.

[0013] The technical solution of the present invention is as follows:

[0014] On the one hand, the present invention provides a split-assembly type multi-layer thermal insulation component fixing device, which is characterized in that it includes:

[0015] The pin column head is in the shape of a long cylinder and is used to penetrate the multi-layer insulation assembly. The surface is provided with pressing slots for pressing sheets to be inserted at equal intervals from top to bottom, and a column head-base interface is provided at the bottom;

[0016] The pressing sheet is circular and has an open slot extending from the point to the circumference. The open slot can be inserted into the pressing sheet slot to fix the pressing sheet to the pin column head. A multi-layer heat insulation component is arranged between every two pressing sheets;

[0017] The pin base is fixed on the surface of the spacecraft and has a base-column interface, which is used for matching and connecting with the column head-base interface so that the pin column head is fixed on the pin base.

[0018] Furthermore, the bottom of the pin base is a base mounting structure for fitting with the spacecraft mounting surface, and the base mounting structure is a plane, parabola or spherical surface that is mounted by curing silicone rubber;

[0019] The upper part of the pin base is a base-column interface, which is used to dock with the pin column head. The base-column interface is in the shape of a hollow tetrahedron, with a reinforcing structure on the outside to improve the interface strength, and the inner wall has two opposite inclined surfaces, which are used to guide the column head assembly docking. The inclined surfaces are at an angle θ (about 20°) relative to the vertical plane. Square grooves of a certain height (H3) are opened on both sides of the bottom of the interface to fix the buckle structure of the pin column head.

[0020] Furthermore, the middle part of the pin column head is the column head body, and the bottom is the column head-base interface. The outer end of the column head-base interface is rounded and has a length of 10 to 40 mm. The front end of the column head-base interface is in a barb shape to form a buckle structure for the base-column interface to be embedded in, thereby realizing the docking of the column head-base interface with the base-column interface (1-2).

[0021] Furthermore, the inner circular hole of the pressing sheet has a diameter of 3 mm, and there is a guide groove with a width of 2.4 mm and a length of 4.1 mm near the inner circular opening, and the outer opening angle of the guide groove is 40°.

[0022] Furthermore, the bottom surface of the pin base is fixed to the spacecraft mounting surface by screws, and the mounting interface in the form of screws can be used as an equipotential grounding interface of the multi-layer thermal insulation assembly.

[0023] Furthermore, the pin column head is made of organic materials such as polyimide, the pressing sheet is made of organic materials such as polyimide, and the pin base is made of materials such as titanium alloy or polyimide.

[0024] Furthermore, the split-assembly multi-layer thermal insulation component fixing device according to any one of claims 1-5 is characterized in that it also includes a column cap disassembly tool, the front end of which has an inclined surface that can be adapted to push the column cap-base interface buckle, and is made of metal material.

[0025] The front end of the column cap disassembly tool contains an inclined surface that can push the column cap-base interface buckle, and the size of the inclined surface matches the size of the barb shape of the column cap-base interface, and can push the buckle from two directions to converge toward the center of the base-column interface, thereby removing it. The rear end of the column cap disassembly tool is a handheld long handle made of metal material with good elasticity.

[0026] On the other hand, a method for installing a split-assembly type multi-layer thermal insulation component fixing device is characterized in that it includes the following steps:

[0027] Step 1. Perform a hole opening operation on the multi-layer insulation assembly positioned by a pin column head as required; pair the pin base and the column head according to the design situation;

[0028] Step 2. Install the pin stud:

[0029] Case 1. For the pin base installed on the fitting surface, use silicone rubber to fix it. Apply silicone rubber evenly on the base and fix it in the installation position for curing. During the curing process, try to keep the pin base in the same direction as gravity. If it cannot be kept in the same direction, use tools to help keep the pin base from slipping;

[0030] Case 2. For screw-type pin bases, apply structural anti-loosening glue on the threads before installation and apply torque as required during installation. For situations where multi-layer insulation components need to be grounded at the same potential, install the grounding plate in advance and lay out the grounding wire routing when the base is fixed;

[0031] Case 3. For the overlapped situation of multiple multi-layer insulation components installed without structural support, the pin column head of the flat base can be inserted from the bottom multi-layer insulation component, and the pin base and the bottom multi-layer insulation component can be fixed with polyimide pressure-sensitive adhesive;

[0032] Step 3. Install the pressing piece on the pin column head: hold the pressing piece and push it into the pressing piece slot corresponding to the pin column head;

[0033] Step 4. Pass the pin studs through the holes on the multi-layer insulation assembly in order, check the matching dimensions of the multi-layer insulation assembly and the pin studs and perform trimming. After trimming, install the external pressing sheet to complete the multi-layer fixation;

[0034] In the case of overlapping two or more multi-layer insulation components, first complete the installation of the bottom multi-layer insulation component as described above, and then install other multi-layer insulation components layer by layer and trim them. After trimming, complete the final sheeting and fixing on the outside;

[0035] Step 5. Perform grounding operation on the multi-layer insulation assembly;

[0036] Step 6. Check the appearance and grounding status of the multi-layer insulation components, and complete the installation after confirming the status.

[0037] Furthermore, the pairing combination of the pin base and the column head according to the design situation is specifically:

[0038] At the beginning of the design, the installation method, curved surface and screw characteristics, and processing materials of the pin base are determined according to the fixed surface status and mechanical requirements; the material, length, and number of slots of the pin column head are determined according to the status of the multi-layer insulation component; and the number of components of the production and processing fixture is determined through process design with a margin.

[0039] Furthermore, the step 5. performs a grounding operation on the multi-layer thermal insulation assembly, specifically:

[0040] For the multi-layer insulation assembly that is fixed by the pin base in a fitting manner, the potential grounding wire must be connected to the entire satellite ground. The potential grounding wire of the multi-layer insulation assembly that is fixed by screws must be connected to the pre-set grounding wire.

[0041] On the other hand, the present invention also provides a method for disassembling and assembling a multi-layer thermal insulation assembly in a fixed state, which is characterized in that it comprises the steps of:

[0042] Step 1. Remove the grounding wire between the multi-layer insulation assembly and the satellite, and remove the pressing sheet above the multi-layer insulation assembly;

[0043] Step 2. According to the overlapping sequence of the multi-layer insulation components, first remove the outermost multi-layer insulation components, and then remove the inner multi-layer insulation components layer by layer;

[0044] A column head replacement operation of a split-assembly multi-layer thermal insulation component fixing device includes:

[0045] Step 1. Remove the grounding wire between the multi-layer insulation assembly and the satellite near the fixture where the column head needs to be replaced, and remove the pressing sheet above the multi-layer insulation assembly;

[0046] Step 2. Remove the multi-layer insulation components near the fixture of the column head that needs to be replaced. According to the overlapping sequence of the multi-layer insulation components, first remove the outermost multi-layer insulation components, and then remove the inner multi-layer insulation components layer by layer;

[0047] Step 3. Use the column cap disassembly tool to remove the pin column cap that needs to be replaced from the pin base to complete the column cap replacement.

[0048] Compared with the prior art, the present invention has the following beneficial effects:

[0049] 1. Compared with the traditional pin structure, the present invention can realize the replacement of the pin column head structure. Regardless of whether the pin base is fixed on the spacecraft, the pin column head can be quickly, non-destructively and safely disassembled and a new column head can be installed using a disassembly tool;

[0050] 2. Compared with the traditional pin structure, the present invention adopts a split design of the pin base and the column head, which can be arbitrarily combined by plug-in docking. The processing material can be selected according to different installation methods and mechanical requirements, thereby greatly saving the development cost;

[0051] 3. Compared with the pins made of titanium alloy or other integral materials, the column head can be made of non-metallic materials such as polyimide with better thermal insulation, thereby reducing the heat leakage of the multi-layer insulation assembly and playing a better role in heat preservation of the internal load;

[0052] 4. The pin base and the column head can be designed as standard parts respectively, and the processing quantity thereof can be allocated according to the actual situation with a margin. When the technical status changes, the present invention can flexibly respond to the changed status by changing the combination mode of the pin base and the column head, thereby saving a lot of processing time and cost;

[0053] 5. It can be processed into various styles of pin bases according to the fixed surface conditions, and can be set to be mounted on the fitting surface or screwed according to the process conditions. The metal screw base can be used as an interface for equipotential grounding of multi-layer thermal insulation components to meet the installation and equipotential grounding requirements of multi-layer thermal insulation components;

[0054] 6. In the present invention, after the development is completed, the used pin stud can be removed from the pin base, and the screw base can also be removed from the surface of the spacecraft. The qualified fixing device can be used in the next model, thereby improving the use efficiency of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] Figure 1 It is a structural schematic diagram of a split-assembly type multi-layer heat insulation component fixing device of the present invention;

[0056] Figure 2 It is a schematic diagram of the structure of the pin base in the present invention, wherein a is a curved base diagram, b is a flat base diagram, and c is a screw base diagram

[0057] Figure 3 It is a cross-sectional schematic diagram of the split-assembly type multi-layer heat insulation component fixing device of the present invention and a buckle size parameter diagram;

[0058] Figure 4 The structure diagram of the pin column head in the present invention is shown in Figure 1. A is a column head diagram of a three-layer multi-layer thermal insulation component, B is a column head diagram of a double-layer multi-layer thermal insulation component, and C is a column head diagram of a single-layer multi-layer thermal insulation component.

[0059] Figure 5 It is a schematic diagram of the fixing state of the multi-layer thermal insulation component in the present invention, a is the fixing state of one multi-layer thermal insulation component, and b is the overlapping and fixing state of multiple multi-layer thermal insulation components.

[0060] Figure 6 Schematic diagram of the disassembly tool structure, a is the disassembly tool, b is the disassembly state of the disassembly tool and the fixing device. DETAILED DESCRIPTION

[0061] The present invention is further described below in conjunction with the accompanying drawings and embodiments, but the protection scope of the present invention should not be limited thereto.

[0062] See also Figure 1 , Figure 1 It is a structural schematic diagram of the split-assembly type multi-layer thermal insulation component fixing device of the present invention. As shown in the figure, it includes three parts: a pin base 1, a pin column head 2, and a pressing sheet 3, and also a column head disassembly tool 4.

[0063] The pin base 1 is used for positioning and fixing, one end of which is fixed on the surface of the spacecraft and the other end is connected to the pin column head 2, and can be made of titanium alloy or polyimide. The pin base 1 is composed of a base mounting structure 1-1 and a base-column interface 1-2.

[0064] Base installation structure 1-1: There are two types of installation interfaces: fitting surface and screws. Figure 2 As shown in the figure, the first type is a base that fits the installation surface of the spacecraft. Typical fitting surface features are plane, parabola, sphere, etc. This base has a diameter of 18mm and an average thickness of about 1.5mm. It is installed by curing silicone rubber and can withstand a horizontal tensile force range of 0 to 100N. The second type is a base installed by screws. This type requires setting screw holes at the installation location and selecting the screw type according to the mechanical environment. The horizontal tensile force range is 0 to 100N. The screw-type installation interface can be used as an equipotential grounding interface for multi-layer insulation components.

[0065] Base-column interface 1-2: This structure is used to connect with the pin column 2. The internal structure section of the interface is as follows Figure 3 As shown, the main body of the structure is in the shape of a hollow tetrahedron, with reinforced structural features on the outside to improve the strength of the interface. The inner wall of the interface has two opposite inclined surfaces for guiding the assembly and docking of the column heads. The inclined surfaces are at an angle θ (about 20°) relative to the vertical plane. Square grooves of a certain height (H3) are opened on both sides of the bottom of the interface to fix the buckle structure of the column head.

[0066] One end of the pin column 2 plays the role of penetrating the multi-layer thermal insulation component and fixing the pressing plate, and the other end is connected to the pin base 1. This structure can be made of materials such as polyimide. The pin column 2 consists of a column body 2-1, a pressing plate slot 2-2 and a column-base interface 2-3. Column body 2-1: used to penetrate the multi-layer thermal insulation component, the column diameter is 4mm, and the outer end of the column is chamfered to facilitate the insertion of the multi-layer thermal insulation component. The length is set in the range of about 10-40mm according to the status of the multi-layer thermal insulation component; Pressing plate slot 2-2: used to fix the pressing plate. For 15-unit multi-layer (one unit consists of a layer of 6μm thick double-sided aluminum-plated polyester perforated film and a layer of mesh), a multi-layer thermal insulation component uses two pressing plates, such as Figure 4 , Figure 5As shown, n multi-layer insulation components are overlapped using n+1 pressing sheets, the inner diameter of the slot is 2.6mm, the center distance of the slot is 5mm, the slot depth is 0.7mm, and the slot width is 1.2mm. The column head-base interface 2-3 is used to connect with the base-column head interface 1-2, and the connection feature is a buckle structure, such as Figure 3 As shown, the front end of the buckle is a barbed hook feature, which can be firmly fixed in the square groove of the 1-2 structure. Its size matches the size of 1-2, and the angle of the bevel at the front end of the socket is the same as the angle of the internal bevel of 1-2, which facilitates the socket structure to be smoothly pushed into the bottom end of 1-2 and fixed.

[0067] The pressing sheet 3 is used to cooperate with the pin column head 2 to fix the multi-layer insulation component. The structure contains an opening feature and is used to be fixed in the pressing sheet slot 2-2. The diameter of the internal circular hole of the pressing sheet is 3mm. There is a guide groove with a width of 2.4mm and a length of 4.1mm near the internal circular opening. The external opening angle of the guide groove is 40°. The pressing sheet can be made of organic materials such as polyimide.

[0068] Column head disassembly tool 4, such as Figure 6 As shown, the front end contains an inclined structural feature that can push the buckle of the column cap-base interface 2-3. The structural size matches the front end size of the buckle described in 2-3. This feature can push the buckle from two directions to converge toward the center of 1-2 to remove it. The rear end is a handheld long handle, and the tool is made of metal material.

[0069] Determine the installation method, curved surface and screw features, processing materials, etc. of the pin base according to the state of the fixing surface and mechanical requirements; determine the material, length, number of slots, etc. of the pin column head according to the state of the multi-layer insulation component; determine the number of each component of the production and processing fixture through process design and leave a margin.

[0070] 3.1 Fixing device operation steps

[0071] (1) Performing a hole opening operation on the multi-layer thermal insulation assembly positioned by a pin stud according to the process requirements;

[0072] (2) After the fixture is processed and accepted, the pin base and column head are matched according to the actual situation, and then the pin is installed:

[0073] 1) For the pin base installed on the fitting surface, use silicone rubber to fix it. Apply silicone rubber evenly on the base and fix it in the installation position for curing. During the curing process, try to keep the pin base in the same direction as gravity. If it cannot be kept in the same direction, use tools to help keep the pin base from slipping;

[0074] 2) For screw-type pin bases, apply structural anti-loosening glue on the threads before installation and apply torque as required during installation. For situations where multi-layer insulation components require equipotential grounding, it is necessary to install grounding plates in advance and lay out the grounding wire routing when the base is fixed.

[0075] 3) In the case of overlapping multiple multi-layer insulation components installed without structural support, the pin column head of the flat base can be inserted into the bottom multi-layer insulation component, and the pin base and the bottom multi-layer insulation component can be fixed with polyimide pressure-sensitive adhesive.

[0076] (3) Install the inner layer pressing sheet of the multi-layer insulation assembly on the pin column head, and the specific operation is to hold the pressing sheet and push it into the corresponding card slot of the pin column head;

[0077] (4) According to the fixing position and installation process requirements, the holes on the multi-layer insulation components are passed through the pin studs in order, the matching dimensions of the multi-layer insulation components and the pin studs are checked and trimmed, and after trimming, the external pressing sheet is installed to complete the multi-layer fixation; for the case where two or more multi-layer insulation components are overlapped, first complete the installation of the bottom multi-layer insulation components as described above, and then install other multi-layer insulation components layer by layer and trim them, and after trimming, complete the final pressing sheet fixation on the outside;

[0078] (5) Perform grounding operation on the multi-layer insulation assembly. For the multi-layer insulation assembly fixed by the pin base in a fitting manner, the equipotential grounding wire must be connected to the entire satellite ground. The equipotential grounding wire of the multi-layer insulation assembly fixed by screws must be connected to the grounding wire set in advance in (2)-2);

[0079] (6) Check the appearance and grounding status of the multi-layer insulation components, and complete the installation after confirming the status.

[0080] (7) If disassembling or assembling a multi-layer insulation assembly, follow the steps in 5-4-3.

[0081] 3.2 Replacement of column head operation

[0082] For the operation of replacing the pin column head, first remove the pressing piece for replacing the pin column head, then disassemble and assemble the multi-layer insulation component near the column head, and after the disassembly and assembly is completed, use the column head disassembly tool (4) to remove the column head from the base and replace and install a new column head, and finally reinstall the multi-layer insulation component and fix it with the pressing piece.

Claims

1. A split-assembly type multi-layer thermal insulation component fixing device, characterized in that: include: The pin column head (2) is in the shape of an elongated cylinder and is used to penetrate the multi-layer heat insulation assembly. The surface is provided with pressing sheet slots (2-2) for inserting the pressing sheet (3) at equal intervals from top to bottom, and a column head-base interface (2-3) is provided at the bottom; The pressing sheet (3) is circular and has an open groove extending from the point to the circumference. The open groove can be inserted into the pressing sheet slot (2-2) to fix the pressing sheet (3) and the pin column head (2). A multi-layer heat insulation component is arranged between every two pressing sheets (3); A pin base (1) is fixed on the surface of a spacecraft and has a base-column interface (1-2) for matching and connecting with the column-base interface (2-3) so that the pin column (2) is fixed on the pin base (1).

2. The split-assembly type multi-layer heat insulation component fixing device according to claim 1 is characterized in that: The bottom of the pin base (1) is a base mounting structure (1-1) for fitting with a spacecraft mounting surface; the base mounting structure (1-1) is a plane, parabola or spherical surface and is mounted by curing silicone rubber; The upper part of the pin base (1) is a base-column interface (1-2) for docking with the pin column head (2). The base-column interface (1-2) is in the shape of a hollow tetrahedron, with a reinforcement structure on the outside to improve the interface strength, and two opposite inclined surfaces on the inner wall for guiding the column head assembly docking, the inclined surfaces are at an angle θ relative to the vertical plane, and square grooves of a certain height (H3) are opened on both sides of the bottom of the interface for fixing the buckle structure of the pin column head (2).

3. The split-assembly type multi-layer heat insulation component fixing device according to claim 1 is characterized in that: The middle part of the pin column head (2) is a column head body (2-1), and the bottom is a column head-base interface (2-3). The outer end of the column head-base interface (2-3) is rounded and has a length of 10 to 40 mm. The front end of the column head-base interface (2-3) is in a barb shape to form a buckle structure for the base-column interface (1-2) to be embedded in, so as to achieve docking of the column head-base interface (2-3) with the base-column interface (1-2).

4. The split-assembly type multi-layer heat insulation component fixing device according to claim 1 is characterized in that: The inner circular hole of the pressing sheet (3) has a diameter of 3 mm, and there is a guide groove with a width of 2.4 mm and a length of 4.1 mm near the inner circular opening, and the outer opening angle of the guide groove is 40°.

5. The split-assembly type multi-layer heat insulation component fixing device according to claim 1 is characterized in that: The bottom surface of the pin base (1) is fixed to the spacecraft installation surface by means of screws, and the installation interface in the form of screws can be used as an equipotential grounding interface of the multi-layer thermal insulation component.

6. The split-assembly type multi-layer heat insulation component fixing device according to any one of claims 1 to 5, characterized in that: The pin column head (2) is made of organic materials such as polyimide, the pressing sheet (3) is made of organic materials such as polyimide, and the pin base (1) is made of materials such as titanium alloy or polyimide.

7. The split-assembly type multi-layer heat insulation component fixing device according to any one of claims 1 to 6, characterized in that: The tool also comprises a column cap disassembly tool (4), the front end of which is adapted to be equipped with an inclined surface capable of pushing the plug buckle of the column cap-base interface (2-3), and is made of metal material; the front end of the column cap disassembly tool (4) comprises an inclined surface capable of pushing the plug buckle of the column cap-base interface (2-3), and the size of the inclined surface matches the size of the barb shape of the column cap-base interface (2-3), and can push the plug buckle from two directions to converge toward the center of the base-column interface (1-2), thereby removing it; the rear end of the column cap disassembly tool (4) is a handheld long handle, and is made of metal material with good elasticity.

8. A method for installing a split-assembly type multi-layer thermal insulation component fixing device, characterized in that: The steps include: Step 1. Perform a hole opening operation on the multi-layer insulation assembly positioned by a pin column head as required; pair the pin base and the column head according to the design situation; Step 2. Install the pin stud: Case 1. For the pin base installed on the fitting surface, use silicone rubber to fix it. Apply silicone rubber evenly on the base and fix it in the installation position for curing. During the curing process, try to keep the pin base in the same direction as gravity. If it cannot be kept in the same direction, use tools to help keep the pin base from slipping; Case 2. For screw-type pin bases, apply structural anti-loosening glue on the threads before installation and apply torque as required during installation. For situations where multi-layer insulation components need to be grounded at the same potential, install the grounding plate in advance and lay out the grounding wire routing when the base is fixed; Case 3. For the overlapped situation of multiple multi-layer insulation components installed without structural support, the pin column head of the flat base can be inserted from the bottom multi-layer insulation component, and the pin base and the bottom multi-layer insulation component can be fixed with polyimide pressure-sensitive adhesive; Step 3. Install the pressing piece on the pin column head: hold the pressing piece and push it into the pressing piece slot (2-2) corresponding to the pin column head; Step 4. Pass the pin studs through the holes on the multi-layer insulation assembly in order, check the matching dimensions of the multi-layer insulation assembly and the pin studs and perform trimming. After trimming, install the external pressing sheet to complete the multi-layer fixation; In the case of overlapping two or more multi-layer insulation components, first complete the installation of the bottom multi-layer insulation component as described above, and then install other multi-layer insulation components layer by layer and trim them. After trimming, complete the final sheeting and fixing on the outside; Step 5. Perform grounding operation on the multi-layer insulation assembly; Step 6. Check the appearance and grounding status of the multi-layer insulation components, and complete the installation after confirming the status.

9. The installation method of the split-assembly type multi-layer thermal insulation component fixing device according to claim 8 is characterized in that: The pairing combination of the pin base and the column head according to the design situation is specifically: At the beginning of the design, the installation method, curved surface and screw characteristics, and processing materials of the pin base are determined according to the fixed surface status and mechanical requirements; the material, length, and number of slots of the pin column head are determined according to the status of the multi-layer insulation component; and the number of components of the production and processing fixture is determined through process design with a margin.

10. The installation method of the split-assembly type multi-layer thermal insulation component fixing device according to claim 8, characterized in that: The step 5. performs grounding operation of the multi-layer thermal insulation assembly, specifically: For the multi-layer insulation components fixed by the pin base using a fitting method, the potential grounding wire needs to be connected to the entire star ground, and the potential grounding wire of the multi-layer insulation components fixed by screws must be connected to the pre-installed grounding wire.

11. A method for disassembling and assembling a multi-layer thermal insulation assembly in a fixed state, characterized in that: Includes steps: Step 1. Remove the grounding wire between the multi-layer insulation assembly and the satellite, and remove the pressing sheet above the multi-layer insulation assembly; Step 2. According to the overlapping sequence of multi-layer insulation components, first remove the outermost multi-layer insulation component, and then remove the inner multi-layer insulation components layer by layer.

12. A column head replacement operation of a split-type multi-layer thermal insulation component fixing device, characterized in that: Includes steps: Step 1. Remove the grounding wire between the multi-layer insulation assembly and the satellite near the fixture where the column head needs to be replaced, and remove the pressing sheet above the multi-layer insulation assembly; Step 2. Remove the multi-layer insulation components near the fixture of the column head that needs to be replaced. According to the overlapping sequence of the multi-layer insulation components, first remove the outermost multi-layer insulation components, and then remove the inner multi-layer insulation components layer by layer; Step 3. Use the column disassembly tool (4) to remove the pin column that needs to be replaced from the pin base to complete the column replacement.

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