High-isolation antenna applied to millimeter wave multichannel near field communication

Abstract

The invention provides a high-isolation antenna applied to millimeter wave multi-channel near field communication. The high-isolation antenna applied to millimeter wave multi-channel near field communication comprises an antenna main body and a wave absorbing layer, the antenna main body is provided with a plurality of horn structure cavities and accommodating cavities, the accommodating cavities are in one-to-one correspondence with the horn structure cavities, each horn structure cavity corresponds to one transmission channel, each horn structure cavity comprises an opening part, an extending part and a connecting part, the accommodating cavities are arranged at the bottoms of the horn structure cavities, and the connecting parts are arranged at the bottoms of the horn structure cavities. The accommodating cavity is communicated with the connecting part of the horn structure cavity, and a patch probe is arranged in the accommodating cavity; the top of the wave absorbing layer is provided with openings, the openings are in one-to-one correspondence with the horn structure cavities, and the openings are communicated with the opening parts. According to the scheme, the problem that a traditional non-contact connector is short in transmission distance is solved, meanwhile, the blank of the non-contact connector in multichannel communication is filled up, and a way is provided for implementation of the millimeter wave non-contact connector.

Description

Technical Field

[0001] The present invention relates to the technical field of contactless connectors, and in particular to a high-isolation antenna used for millimeter-wave multi-channel short-range communication. Background Art

[0002] With the continuous development of data transmission technology, the frequency and scale of data exchange have increased significantly. In the field of aerospace, contact connectors such as GF3A and GFB high-speed connectors are often used for data transmission of high-speed signals between boards. However, the misalignment, vibration and frequent disassembly between the motherboard and the plugboard between the connectors often cause wear of the connectors, which in turn affects the transmission of data signals. Therefore, in special and harsh application environments such as misalignment between the motherboard and the plugboard, strong mechanical vibration and high temperature, it is particularly important to choose a suitable and reliable data connector. Contactless connectors provide an effective solution for this type of application. First of all, contactless connectors can achieve data transmission over a certain distance without physical contact, ensuring the reliability of data transmission in misalignment and strong mechanical vibration environments.

[0003] There are many research results in contactless connector technology, but the contactless connectors in the existing technology are often single-channel transmission, with low data transmission efficiency, and lack of multi-channel contactless connectors. Summary of the invention

[0004] In view of this, an embodiment of the present invention provides a high-isolation antenna applied to millimeter-wave multi-channel short-range communication to eliminate or improve one or more defects existing in the prior art.

[0005] One aspect of the present invention provides a high isolation antenna for millimeter wave multi-channel short-range communication, the high isolation antenna for millimeter wave multi-channel short-range communication comprising an antenna body and a wave absorbing layer;

[0006] The antenna body is provided with a plurality of speaker structure cavities and accommodating cavities, the accommodating cavities correspond to the speaker structure cavities one by one, each speaker structure cavity corresponds to a transmission channel, the speaker structure cavity comprises an opening portion, an extension portion and a connecting portion, the accommodating cavity is provided at the bottom of the speaker structure cavity, and is communicated with the connecting portion of the speaker structure cavity, and a patch probe is provided in the accommodating cavity;

[0007] The wave absorbing layer is provided with an opening at the top, the opening corresponds to the cavity of the speaker structure one by one, and the opening is connected to the opening portion.

[0008] The above scheme is adopted. This scheme adopts the mode of multi-channel communication antenna to design high-isolation antenna, constitutes multiple transmitting channels and multiple receiving channels and transmitting channels, realizes multi-channel communication of signal transmission and reception, and absorbs surface waves and reflected waves between transmitting and receiving high-isolation antennas by adding absorbing materials, thereby greatly improving the isolation performance of transmitting and receiving antennas. This scheme solves the problem of short transmission distance of traditional contactless connector technology, and also fills the gap of contactless connector in the field of multi-channel communication, and provides a technical approach for the realization of millimeter-wave contactless connectors.

[0009] In some embodiments of the present invention, the polarization direction of the transmission channel corresponding to the speaker structure cavity is perpendicular to the length direction of the cross section of the corresponding connecting portion.

[0010] In some embodiments of the present invention, the antenna body is provided with four horn structure cavities, the cross-section of the antenna body is rectangular, the four horn structure cavities are respectively arranged at the four corners of the cross-section of the antenna body, and the polarization direction of the transmission channel corresponding to the horn structure cavity is perpendicular to the polarization direction of the transmission channel corresponding to the adjacent horn structure cavity, and is the same as the polarization direction of the transmission channel corresponding to the horn structure cavity at the diagonal position.

[0011] In some embodiments of the present invention, a ceramic sealing member is provided at the opening to allow electromagnetic waves to radiate to the outside after passing through the ceramic medium.

[0012] In some embodiments of the present invention, the patch probe extends upward from the bottom and is layered with a first metal layer, a second metal layer, a third metal layer, a fourth metal layer, a fifth metal layer and a sixth metal layer, and a high-frequency laminate is arranged between adjacent metal layers.

[0013] In the specific implementation process, the high-frequency laminate is Rogers RO3003 high-frequency laminate, which is a ceramic-filled PTFE composite material. Rogers RO3003 high-frequency laminate still has excellent dielectric constant (Dk) stability at different temperatures and frequencies. The unique design makes the material have excellent stability, eliminating the step change of the dielectric constant of general PTFE materials at room temperature.

[0014] In some embodiments of the present invention, the first metal layer is a metal strip, one end of the metal strip is arranged at one side in the length direction of the patch probe, and the metal strip is arranged in the middle in the width direction of the patch probe.

[0015] In some embodiments of the present invention, the second metal layer and the fifth metal layer are both metal plates provided with a hole, the third metal layer and the fourth metal layer are both multi-branch annular chokes, and the multi-branch annular choke comprises a metal ring and a plurality of outer branches, one end of the outer branch is laterally connected to the outer side of the metal ring, and the other end extends outward.

[0016] In some embodiments of the present invention, the sixth metal layer includes an outer metal plate and an inner metal plate, the outer metal plate is provided with a window, the inner metal plate is arranged in the window, and the width of one end of the inner metal plate is greater than that of the other end.

[0017] In some embodiments of the present invention, the patch probe includes a first through hole, a second through hole and a third through hole, the first through hole extending from the upper surface of the first metal layer to the lower surface of the sixth metal layer, one end of the first through hole is arranged on the side of the first metal layer away from the edge of the patch probe, the first through hole passes through the setting holes of the second metal layer and the fifth metal layer, the first through hole passes through the inner ring of the metal ring of the third metal layer and the fourth metal layer, and the first through hole extends to the narrow side of the inner metal plate of the sixth metal layer; the second through hole extends from the upper surface of the third metal layer to the lower surface of the fourth metal layer, the opening of the second through hole is the inner ring of the metal ring, and is evenly distributed along the inner ring of the metal ring; the third metal hole extends from the upper surface of the fifth metal layer to the lower surface of the sixth metal layer, and multiple third metal holes are arranged along the edge of the window of the outer metal plate.

[0018] In some embodiments of the present invention, the absorbing layer is made of absorbing material.

[0019] In the specific implementation process, the absorbing material can be a silicone rubber flat material, a rubber flat material or a polyurethane foam flat material;

[0020] In some embodiments of the present invention, the absorbing material is a silicone rubber flat plate material with a model number of RATG-24 / 77GHz-1mm. The material is resistant to high temperatures and can effectively absorb electromagnetic waves in the frequency band of 56GHz to 64GHz.

[0021] Additional advantages, purposes, and features of the present invention will be described in part in the following description, and will become apparent to those skilled in the art after studying the following, or may be learned from the practice of the present invention. The purposes and other advantages of the present invention can be specifically pointed out and obtained in the specification and the accompanying drawings.

[0022] Those skilled in the art will appreciate that the objectives and advantages that can be achieved with the present invention are not limited to the above specific description, and the above and other objectives that can be achieved by the present invention will be more clearly understood from the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The drawings described herein are used to provide a further understanding of the present invention, constitute a part of this application, and do not constitute a limitation of the present invention.

[0024] Figure 1 This is a schematic diagram of an implementation method of the present invention;

[0025] Figure 2 This is a perspective schematic diagram of the scheme;

[0026] Figure 3 This is a schematic diagram of the top view structure of this solution without the ceramic sealing parts and patch probes;

[0027] Figure 4 A perspective schematic diagram of the present invention with the absorbing layer, ceramic sealing member and patch probe removed;

[0028] Figure 5 is a schematic diagram of the speaker structure cavity;

[0029] Figure 6 A schematic diagram of a side view of the speaker structure cavity;

[0030] Figure 7 A schematic diagram of the speaker structure cavity from another side view angle;

[0031] Figure 8 is a schematic diagram of the structure of the patch probe;

[0032] Fig. 9 A schematic diagram of a patch probe from a side view angle;

[0033] Fig.10 A schematic diagram of the patch probe from another side view angle;

[0034] Fig.11 is a schematic diagram of the first metal layer;

[0035] Fig.12 is a schematic diagram of a second metal layer and a fifth metal layer;

[0036] Fig.13 is a schematic diagram of a third metal layer and a fourth metal layer;

[0037] Fig.14 is a schematic diagram of the sixth metal layer;

[0038] Fig.15 It is a schematic diagram of the metal layer and metal through-hole structure of the patch probe;

[0039] Fig.16 A schematic diagram of a metal layer and a metal through-hole structure of a patch probe from a side view angle;

[0040] Fig.17 is a schematic diagram of another side view angle of the metal layer and metal through hole structure of the patch probe;

[0041] Fig.18 It is a schematic diagram of the combined structure of the speaker structure cavity and the patch probe;

[0042] Fig.19 The schematic diagram of the structure of this scheme including polarization direction;

[0043] Fig. 20 This is a combined schematic diagram of the first transceiver scenario of the high isolation antenna of this solution;

[0044] Fig.21 This is a schematic diagram of the layout of the first sending and receiving scenario;

[0045] Fig. 22 This is a combined schematic diagram of the second transceiver scenario of the high isolation antenna of this solution;

[0046] Fig.23 This is a schematic diagram of the layout of the second transceiver scenario;

[0047] Fig.24 Schematic diagram of transmission coefficients for the first transceiver scenario;

[0048] Fig.25 This is a schematic diagram of the isolation between antenna ATX1 and antenna BRX0 in the first transceiver scenario;

[0049] Fig.26 Schematic diagram of the isolation between antenna BTX0 and antenna BRX0 in the first transceiver scenario;

[0050] Fig. 27 Schematic diagram of the isolation between antenna BTX1 and antenna BRX0 in the first transceiver scenario;

[0051] Fig.28 It is a schematic diagram of the transmission coefficient of the second transmission and reception scenario;

[0052] Fig.29 This is a schematic diagram of the isolation between antenna ATX1 and antenna BRX0 in the second transceiver scenario;

[0053] Fig.30 Schematic diagram of the isolation between antenna BTX0 and antenna BRX0 in the second transceiver scenario;

[0054] Fig.31 Schematic diagram of the isolation between antenna BTX1 and antenna BRX0 in the second transceiver scenario;

[0055] Fig.32 This is a schematic diagram of the electric field distribution between parallel plates without adding an absorbing layer in this solution;

[0056] Fig.33 Schematic diagram of the electric field distribution between parallel plates with an absorbing layer added for this scheme.

[0057] Description of Reference Numerals

[0058] 1. Antenna body; 11. Horn structure cavity; 111. Opening; 112. Extension; 113. Connection; 12. Accommodation cavity; 13. Ceramic sealing member; 2. Absorbing layer; 3. Patch probe; 31. First metal layer; 32. Second metal layer; 33. Third metal layer; 34. Fourth metal layer; 341. Metal ring; 342. External branch; 35. Fifth metal layer; 36. Sixth metal layer; 361. External metal plate; 362. Internal metal plate; 363. Window; 37. First through hole; 38. Second through hole; 39. Third through hole. DETAILED DESCRIPTION

[0059] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the embodiments and the accompanying drawings. Here, the illustrative embodiments of the present invention and their descriptions are used to explain the present invention, but are not intended to limit the present invention.

[0060] It should also be noted that, in order to avoid obscuring the present invention due to unnecessary details, only structures and / or processing steps closely related to the solutions according to the present invention are shown in the accompanying drawings, while other details that are not closely related to the present invention are omitted.

[0061] like Figures 1 to 8 As shown, the present invention proposes a high isolation antenna for millimeter wave multi-channel short-range communication, and the high isolation antenna for millimeter wave multi-channel short-range communication includes an antenna body 1 and an absorbing layer 2;

[0062] The antenna body 1 is provided with a plurality of speaker structure cavities 11 and accommodating cavities 12, the accommodating cavities 12 correspond to the speaker structure cavities 11 one by one, each speaker structure cavity 11 corresponds to a transmission channel, the speaker structure cavity 11 includes an opening portion 111, an extension portion 112 and a connecting portion 113, the accommodating cavity 12 is provided at the bottom of the speaker structure cavity 11, and is communicated with the connecting portion 113 of the speaker structure cavity 11, and a patch probe 3 is provided in the accommodating cavity 12;

[0063] The absorbing layer 2 is provided with an opening at the top, the opening corresponds to the speaker structure cavity 11 one by one, and the opening is connected to the opening portion 111 .

[0064] In the specific implementation process, by reasonably designing the structural dimensions of the horn antenna, the horn antenna structure can transmit the electromagnetic waves radiated by the patch probe 3 from the rectangular waveguide in the form of TE10 mode to the quadrangular pyramidal horn sealed by a cylindrical ceramic. The cylindrical ceramic is pressed at the mouth of the quadrangular pyramidal horn by a circle of metal rings. The electromagnetic waves pass through the ceramic medium and then radiate to the outside world.

[0065] In the specific implementation process, the absorbing layer 2 reasonably designs the size of the absorbing material, selects absorbing materials that can absorb electromagnetic waves in the working frequency band, reserves the required position of the horn antenna mouth, and then adheres to the surface of the high isolation antenna to absorb the surface waves and reflected waves generated by the parallel plate structure.

[0066] The above scheme is adopted. This scheme adopts the mode of multi-channel communication antenna to design high-isolation antenna, constitutes multiple transmitting channels and multiple receiving channels and transmitting channels, realizes multi-channel communication of signal transmission and reception, and absorbs surface waves and reflected waves between transmitting and receiving high-isolation antennas by adding absorbing materials, thereby greatly improving the isolation performance of transmitting and receiving antennas. This scheme solves the problem of short transmission distance of traditional contactless connector technology, and also fills the gap of contactless connector in the field of multi-channel communication, and provides a technical approach for the realization of millimeter-wave contactless connectors.

[0067] like Fig.18 and 19 As shown, in some embodiments of the present invention, the polarization direction of the transmission channel corresponding to the speaker structure cavity 11 is perpendicular to the length direction of the cross section of the corresponding connecting portion 113 .

[0068] In some embodiments of the present invention, the patch probe 3 connected to the RF chip through a coaxial structure radiates and feeds electromagnetic waves to the rectangular waveguide, and the electromagnetic waves are transmitted in the rectangular waveguide in the form of TE10 mode, and then the electromagnetic waves penetrate the ceramic in a direction perpendicular to the long side of the rectangular waveguide, that is, Fig.18 The center is the y direction, and the linear polarized wave radiates to the outside. The ceramic loaded horn antenna design enables the antenna to work efficiently in high temperature and strong impact environments.

[0069] like Figures 1 to 4 As shown, in some embodiments of the present invention, the antenna body 1 is provided with four speaker structure cavities 11, the cross-section of the antenna body 1 is rectangular, and the four speaker structure cavities 11 are respectively arranged at the four corners of the cross-section of the antenna body 1, and the polarization direction of the transmission channel corresponding to the speaker structure cavity 11 is perpendicular to the polarization direction of the transmission channel corresponding to the adjacent speaker structure cavity 11, and is the same as the polarization direction of the transmission channel corresponding to the speaker structure cavity 11 at the diagonal position.

[0070] In the specific implementation process, four patch probes 3 are connected below the horn structure cavity 11 with the same arrangement with rotational symmetry about the central axis of the high isolation antenna. After the absorbing layer 2 reserves the required position for the horn antenna opening, it is attached to the surface of the high isolation antenna.

[0071] like Figures 1 to 4 As shown, in some embodiments of the present invention, a ceramic sealing member 13 is provided at the opening 111 to allow electromagnetic waves to radiate to the outside after passing through the ceramic medium.

[0072] In some embodiments of the present invention, the ceramic sealing member 13 is made of quartz fiber reinforced quartz composite ceramic material (SiO2f / SiO2), and adopts the sol-gel method, with quartz fiber braid as the reinforcement, and is processed through multiple rounds of impregnation-sintering-processing, and has excellent properties such as high temperature resistance, impact resistance, low dielectric and low loss performance, and low thermal conductivity.

[0073] like Fig. 9 and 10 As shown, in some embodiments of the present invention, the patch probe 3 extends upward from the bottom and is layered with a first metal layer 31, a second metal layer 32, a third metal layer 33, a fourth metal layer 34, a fifth metal layer 35 and a sixth metal layer 36, and a high-frequency laminate is arranged between adjacent metal layers.

[0074] In a specific implementation process, the first metal layer 31 , the second metal layer 32 , the third metal layer 33 , the fourth metal layer 34 , the fifth metal layer 35 and the sixth metal layer 36 are all made of copper.

[0075] like Fig. 9 and 11 In some embodiments of the present invention, the first metal layer 31 is a metal strip, one end of the metal strip is arranged on one side of the patch probe 3 in the length direction, and the metal strip is arranged in the middle of the patch probe 3 in the width direction.

[0076] In the specific implementation process, the metal strip of the first metal layer 31 is a 50-ohm microstrip line. Specifically, the RF chip is connected to the patch probe 3 through the metal strip of the first metal layer 31, and the microstrip probe of the sixth metal layer 36 is fed through the microstrip line-coaxial line-microstrip line conversion structure, thereby realizing the feeding of the horn antenna.

[0077] like Fig.12 and 13As shown, in some embodiments of the present invention, the second metal layer 32 and the fifth metal layer 35 are both metal plates provided with a hole, the third metal layer 33 and the fourth metal layer 34 are both multi-branch annular chokes, and the multi-branch annular choke includes a metal ring 341 and a plurality of outer branches 342, one end of the outer branch 342 is laterally connected to the outer side of the metal ring 341, and the other end extends outward.

[0078] like Fig.14 As shown, in some embodiments of the present invention, the sixth metal layer 36 includes an outer metal plate 361 and an inner metal plate 362, the outer metal plate 361 is provided with a window 363, the inner metal plate 362 is arranged in the window 363, and the width of one end of the inner metal plate 362 is greater than that of the other end.

[0079] In a specific implementation process, the sixth metal layer 36 is used as a probe.

[0080] like Fig. 9 , 10 , 15, 16 and 17, in some embodiments of the present invention, the patch probe 3 includes a first through hole 37, a second through hole 38 and a third through hole 39, the first through hole 37 extends from the upper surface of the first metal layer 31 to the lower surface of the sixth metal layer 36, one end of the first through hole 37 is arranged on the side of the first metal layer 31 away from the edge of the patch probe 3, the first through hole 37 passes through the setting holes of the second metal layer 32 and the fifth metal layer 35, and the first through hole 37 passes through the third metal layer 33 and the inner ring of the metal ring 341 of the fourth metal layer 34, the first through hole 37 extends to the narrow side of the inner metal plate 362 of the sixth metal layer 36; the second through hole 38 extends from the upper surface of the third metal layer 33 to the lower surface of the fourth metal layer 34, the opening of the second through hole 38 is the inner ring of the metal ring 341, and is evenly distributed along the inner ring of the metal ring 341; the third metal hole extends from the upper surface of the fifth metal layer 35 to the lower surface of the sixth metal layer 36, and a plurality of third metal holes are arranged along the edge of the window 363 of the outer metal plate 361.

[0081] Using the above scheme, the second metal layer 32 and the fifth metal layer 35 are the ground planes of the microstrip line and the probe respectively. Since the core board between the second metal layer 32 and the fifth metal layer 35 needs to be processed with a coaxial structure via, but the core boards between the second metal layer 32 and the third metal layer 33 and the fourth metal layer 34 and the fifth metal layer 35 are too thin to be processed with vias, a multi-branch annular choke is designed between the third metal layer 33 and the fourth metal layer 34 to replace the metal vias of the coaxial structure to avoid impedance mismatch caused by wave leakage between the core boards. At the same time, metal vias are processed around the patches of the fifth metal layer 35 and the sixth metal layer 36 to avoid wave transmission between the substrate media.

[0082] In some embodiments of the present invention, the wave absorbing layer 2 is made of wave absorbing material.

[0083] In the specific implementation process, the absorbing material can be a silicone rubber flat material, a rubber flat material or a polyurethane foam flat material;

[0084] In some embodiments of the present invention, the absorbing material is a silicone rubber flat plate material with a model number of RATG-24 / 77GHz-1mm. The material is resistant to high temperatures and can effectively absorb electromagnetic waves in the frequency band of 56GHz to 64GHz.

[0085] In the specific implementation process, the patch probe 3 of this scheme feeds the microstrip probe through the microstrip line-coaxial line-waveguide conversion structure, thereby realizing the feeding of the quadrangular pyramid horn antenna. At the same time, combined with the characteristics of absorbing electromagnetic waves by absorbing materials, the surface waves and reflected waves between the transmitting and receiving antennas are absorbed, thereby improving the isolation performance of the transmitting and receiving antennas from the perspective of eliminating multipath.

[0086] The above scheme is adopted. In order to improve the data transmission rate, this scheme adopts the mode of multi-channel communication antenna to design a high isolation antenna with dual transmission and dual reception. The introduction of multiple channels requires a high degree of isolation between the four communication channels. By reasonably designing the structural dimensions of the high isolation antenna, the antenna is able to pass through four horn antennas designed with axisymmetric rotation within the working frequency band. The transmitting antenna and the receiving antenna are arranged on the diagonal respectively, forming two transmitting channels and two receiving channels and the transmitting channel, realizing multi-channel communication of signal transmission and reception, and absorbing the surface waves and reflected waves between the transmitting and receiving high isolation antennas by adding absorbing materials, which greatly improves the isolation performance of the transmitting and receiving antennas. This patent solves the problem of short transmission distance of traditional contactless connector technology, and also fills the gap of contactless connectors in the field of multi-channel communication, providing a technical approach for the realization of millimeter wave contactless connectors.

[0087] This solution includes four patch probes 3 structures connected below the horn antenna structure with the same arrangement, with rotational symmetry about the central axis of the high isolation antenna. After the absorbing layer 2 reserves the required position for the horn antenna port, it is attached to the surface of the high isolation antenna. Due to the uniqueness of the distribution of the patch probes 3 and the horn antenna, after the patch probes 3 are fed, the polarization modes of the two adjacent antennas are orthogonal, and the polarization modes of the two antennas in the diagonal direction are the same. The antennas with the same polarization modes are set as the transmitting channel or the receiving channel, thereby forming two transmitting channels and two receiving channels. The structure and layout of the transmitting and receiving antennas are shown in the figure. Fig. 20 and 21As shown, antenna ATX0 transmits signals, and antenna BRX0 receives signals; antenna ATX1 transmits signals, and antenna BRX1 receives signals; antenna BTX0 transmits signals, and antenna ARX0 receives signals; antenna BTX1 transmits signals, and antenna ARX1 receives signals. At the same time, in order to weaken the surface waves and reflected waves formed by the parallel plate structure of the transceiver antenna, which will deteriorate the isolation of the transceiver antenna, absorbing materials are added to the antenna surface to absorb surface waves and reflected waves, thereby improving the isolation performance of the transceiver antenna from the perspective of suppressing multipath.

[0088] The RF chip of this scheme is connected and fed through the microstrip line structure, i.e., the first metal layer 31 and the coaxial structure, i.e., the first through hole 37, and the patch structure, i.e., the sixth metal layer 36. The patch of the sixth metal layer 36 radiates electromagnetic waves to the outside. Among them, the second through hole 38 of the third metal layer 33 and the fourth metal layer 34 prevents the electromagnetic waves transmitted by the coaxial structure from spreading to the surroundings, ensuring the efficient transmission of the electromagnetic waves on the coaxial structure; the third through hole 39 of the fifth metal layer 35 and the sixth metal layer 36 prevents the electromagnetic waves transmitted to the probe from spreading to the surroundings, ensuring the efficient radiation of the electromagnetic waves to the outside through the probe; the multi-branch annular choke of the third metal layer 33 and the fourth metal layer 34 ensures that the electromagnetic waves transmitted by the coaxial structure between the extremely thin core plates do not spread to the outside, while achieving impedance matching and efficient energy transmission of the patch probe 3, the processing difficulty of the patch probe 3 is greatly reduced.

[0089] Experimental example:

[0090] For this solution, a high isolation antenna with a working frequency band of 59.7 GHz to 61.2 GHz was designed in the experimental example. The high isolation transceiver antenna was simulated and verified under the communication conditions of 18 mm communication spacing, 0 mm misalignment, and 0° offset. Fig. 20 and 21 The simulation results are shown in Figures 24 to 27 As shown in the figure, when the signal transmitted by antenna ATX0 is received by antenna BRX0, the signals transmitted by antennas ATX1, BTX0, and BTX1 will interfere with antenna BRX0; simulation verification is performed under the communication conditions of 18mm communication spacing, 8mm misalignment, and 10° offset. Fig. 22 and 23 As shown, the simulation results are as follows Figures 28 to 31As shown in the figure, when the signal transmitted by antenna ATX0 is received by antenna BRX0, the signals transmitted by antennas ATX1, BTX0, and BTX1 will interfere with antenna BRX0. Under the conditions of 18mm communication distance, 0mm misalignment, and 0° offset, within the operating frequency range of 59.7GHz to 61.2GHz, the transmission coefficient is ≥-15dB; the worst isolation between simulated antennas ATX1, BTX0, and BTX1 and antenna BRX0 is ≥38dB; under the conditions of 25mm communication distance, 8mm misalignment, and 10° offset, within the operating frequency range of 59.7GHz to 61.2GHz, the transmission coefficient is ≥-26dB; the worst isolation between simulated antennas ATX1, BTX0, and BTX1 and antenna BRX0 is ≥25dB.

[0091] In the specific implementation process, the antenna polarization direction is first distinguished by rotating the ceramic loaded horn antenna by 90 degrees. The electromagnetic waves with two polarization directions perpendicular to each other are orthogonal to each other. On this basis, a high-isolation communication channel is established (with little mutual interference between channels).

[0092] Now Fig. 20 and 21 The layout of the transmitting and receiving antennas describes the working principle of the high isolation antenna. The high isolation antenna establishes a dual-transmit and dual-receive communication channel through four ceramic-loaded horn antennas: ATX0 transmits and BRX0 receives, ATX1 transmits and BRX1 receives, BTX0 transmits and ARX0 receives, and BTX1 transmits and ARX1 receives. The electromagnetic waves transmitted / received by the diagonal horn antennas are orthogonal to each other. The two horn antennas on the diagonal have the same polarization mode, but the distance between the antennas is relatively increased by the diagonal layout, thereby improving the isolation of the two channels on the diagonal. Due to the relative placement of the transmitting and receiving antennas, a parallel plate structure is formed between the transmitting and receiving antennas. In the case of adding absorbing materials, the electromagnetic waves radiated by the antennas will be reflected by the metal, and then the surface waves and reflected waves will be introduced to cause multipath interference to the communication channel, reducing the isolation between channels. Therefore, by attaching absorbing materials to the surface of the high isolation antenna to absorb the surface waves and reflected waves, multipath interference can be suppressed to improve the isolation between channels.

[0093] The design of PCB patch probe 3 enables efficient energy transmission between the RF chip and the horn antenna. The first proposal of the multi-branch ring choke between boards solves the leakage problem caused by the difficulty in processing through holes in the traditional double-layer thin core board; the ceramic-loaded metal horn design enables the high-isolation antenna to work efficiently under high temperature and strong impact environment; the special polarization layout and antenna aperture design ensure that the antenna aperture field has phase consistency and high isolation within a certain range, so that the high-isolation antenna can achieve signal transmission with efficient near-field coupling and high channel isolation under the conditions of limited space, high temperature, strong impact, antenna angle and position offset.

[0094] Fig.32 and 33 The electric field distribution between the high-isolation transmitting and receiving antennas described in the present invention with or without an absorbing surface verifies that the absorbing material has a certain absorption effect on the surface waves and reflected waves formed by the parallel plate structure.

[0095] It should be understood by those skilled in the art that the exemplary components, systems and methods described in conjunction with the embodiments disclosed herein can be implemented in hardware, software or a combination of the two. Whether it is performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention. When implemented in hardware, it can be, for example, an electronic circuit, an application specific integrated circuit (ASIC), appropriate firmware, a plug-in, a function card, etc. When implemented in software, the elements of the present invention are programs or code segments used to perform the required tasks. The program or code segment can be stored in a machine-readable medium, or transmitted on a transmission medium or a communication link via a data signal carried in a carrier.

[0096] It should be clear that the present invention is not limited to the specific configuration and processing described above and shown in the figures. For the sake of simplicity, a detailed description of the known method is omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of the present invention is not limited to the specific steps described and shown, and those skilled in the art can make various changes, modifications and additions, or change the order between the steps after understanding the spirit of the present invention.

[0097] In the present invention, features described and / or illustrated for one embodiment may be used in the same or similar manner in one or more other embodiments, and / or combined with features of other embodiments or replace features of other embodiments.

[0098] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the embodiments of the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A high isolation antenna for millimeter wave multi-channel short-range communication, characterized in that: The high isolation antenna applied to millimeter wave multi-channel short-range communication comprises an antenna body (1) and a wave absorbing layer (2); The antenna body (1) is provided with a plurality of speaker structure cavities (11) and accommodating cavities (12); the accommodating cavities (12) correspond to the speaker structure cavities (11) one by one; each speaker structure cavity (11) corresponds to a transmission channel; the speaker structure cavity (11) comprises an opening portion (111), an extension portion (112) and a connecting portion (113); the accommodating cavity (12) is arranged at the bottom of the speaker structure cavity (11) and is connected to the connecting portion (113) of the speaker structure cavity (11); and a patch probe (3) is arranged in the accommodating cavity (12); The wave absorbing layer (2) is provided with an opening at the top, the opening corresponds to the loudspeaker structure cavity (11) one by one, and the opening is connected to the opening portion (111).

2. The high isolation antenna for millimeter wave multi-channel short-range communication according to claim 1, characterized in that: The polarization direction of the transmission channel corresponding to the speaker structure cavity (11) is perpendicular to the length direction of the cross section of the corresponding connecting portion (113).

3. The high isolation antenna for millimeter wave multi-channel short-range communication according to claim 1 or 2, characterized in that: The antenna body (1) is provided with four speaker structure cavities (11); the cross section of the antenna body (1) is rectangular; the four speaker structure cavities (11) are respectively arranged at four corners of the cross section of the antenna body (1); the polarization direction of the transmission channel corresponding to the speaker structure cavity (11) is perpendicular to the polarization direction of the transmission channel corresponding to the adjacent speaker structure cavity (11), and is the same as the polarization direction of the transmission channel corresponding to the speaker structure cavity (11) at the diagonal position.

4. The high isolation antenna for millimeter wave multi-channel short-range communication according to claim 1, characterized in that: A ceramic sealing member (13) is provided at the opening (111) so that electromagnetic waves can be radiated to the outside world after passing through the ceramic medium.

5. The high isolation antenna for millimeter wave multi-channel short-range communication according to claim 1, characterized in that: The patch probe (3) extends upward from the bottom and is provided with a first metal layer (31), a second metal layer (32), a third metal layer (33), a fourth metal layer (34), a fifth metal layer (35) and a sixth metal layer (36) layer by layer, and a high-frequency laminate is provided between adjacent metal layers.

6. The high isolation antenna for millimeter wave multi-channel short-range communication according to claim 5, characterized in that: The first metal layer (31) is a metal strip, one end of which is arranged on one side of the patch probe (3) in the length direction, and the metal strip is arranged in the middle of the patch probe (3) in the width direction.

7. The high isolation antenna for millimeter wave multi-channel short-range communication according to claim 6, characterized in that: The second metal layer (32) and the fifth metal layer (35) are both metal plates provided with a hole, and the third metal layer (33) and the fourth metal layer (34) are both multi-branch annular chokes, and the multi-branch annular chokes include a metal ring (341) and a plurality of outer branches (342), one end of the outer branch (342) is laterally connected to the outer side of the metal ring (341), and the other end extends outward.

8. The high isolation antenna for millimeter wave multi-channel short-range communication according to claim 7, characterized in that: The sixth metal layer (36) includes an outer metal plate (361) and an inner metal plate (362), wherein the outer metal plate (361) is provided with a window (363), and the inner metal plate (362) is arranged in the window (363), and the width of one end of the inner metal plate (362) is greater than that of the other end.

9. The high isolation antenna for millimeter wave multi-channel short-range communication according to claim 8, characterized in that: The patch probe (3) comprises a first through hole (37), a second through hole (38) and a third through hole (39), wherein the first through hole (37) extends from the upper surface of the first metal layer (31) to the lower surface of the sixth metal layer (36), one end of the first through hole (37) is arranged on a side of the first metal layer (31) away from the edge of the patch probe (3), the first through hole (37) passes through holes in the second metal layer (32) and the fifth metal layer (35), and the first through hole (37) passes through metal holes in the third metal layer (33) and the fourth metal layer (34). The inner ring of the ring (341), the first through hole (37) extends to the narrow side of the inner metal plate (362) of the sixth metal layer (36); the second through hole (38) extends from the upper surface of the third metal layer (33) to the lower surface of the fourth metal layer (34), the opening of the second through hole (38) is the inner ring of the metal ring (341), and is evenly distributed along the inner ring of the metal ring (341); the third metal hole extends from the upper surface of the fifth metal layer (35) to the lower surface of the sixth metal layer (36), and a plurality of the third metal holes are arranged along the edge of the window (363) of the outer metal plate (361).

10. The high isolation antenna for millimeter wave multi-channel short-range communication according to claim 1, characterized in that: The wave absorbing layer (2) is made of wave absorbing material.

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