Rotary type silicon wafer blanking sorting machine

Through the design of a rotary silicon wafer cutting and sorting machine, the use of rotary transportation equipment and functional mechanisms to achieve synchronous loading, detection and cleaning of silicon wafers, solving the problems of low efficiency and impurity residues in the existing technology, and improving the silicon wafers Cutting efficiency and inspection quality.

CN119303846AInactive Publication Date: 2025-01-14无锡京运通科技有限公司
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Patent Information

Application Number
CN202411551137.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-01
Publication Date
2025-01-14
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

The existing silicon wafer feeding sorting machines are inefficient in loading, testing and cleaning, resulting in manual fatigue, high detection cost and easy residual impurities in the silicon wafer, affecting the testing efficiency.

Method used

Design a rotary silicon wafer feeding sorting machine, adopting rotary transportation equipment and functional mechanisms, including four suction boxes, optical detectors and belt conveyors, and realizes synchronous loading, detection and cleaning through vacuum suction cups and cleaning brushes. and unload to improve efficiency.

Benefits of technology

It realizes efficient automation of silicon wafer loading, testing and unloading, reduces manual intervention, improves detection quality and production efficiency, and is suitable for batch processing.

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Abstract

The invention relates to the technical field of silicon wafers, in particular to a rotary type silicon wafer discharging sorting machine which comprises rotary conveying equipment installed on an installation frame and used for conveying silicon wafers, and the installation frame is provided with a functional mechanism used in cooperation with the rotary conveying equipment. The rotary transportation equipment comprises a shell, a material suction structure installed outside the shell, and a driving structure arranged in the shell and used for driving the material suction structure to suck the silicon wafers. During use, the four material suction boxes rotate clockwise, when the material suction box on the left side conducts feeding, the material suction box after material suction is rotated to the position below a cleaning brush through a linkage piece, at the moment, the material suction box on the bottom comes to the left side, then silicon wafers are cleaned through a driving structure, the material suction box on the bottom comes to the left side for material suction, the silicon wafers are fed, and the like. The four material suction boxes can synchronously achieve the steps of intermittent material suction, detection, cleaning, discharging and the like, and the discharging efficiency of the silicon wafers is effectively improved.
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Citation Information

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