Calibration mechanism suitable for wafer appearance detection

Abstract

The invention relates to the technical field of wafer appearance detection, in particular to a wafer appearance detection calibration mechanism which comprises a supporting frame, a table top is fixedly mounted at the top of the supporting frame, a first mounting block is movably mounted at the top of the table top, and a second mounting block is slidably mounted at the top of the first mounting block. A clamping assembly is installed at the top of the second installation block, a wafer body is installed in the clamping assembly in a clamped mode, a rotating assembly is installed between the second installation block and the wafer body, and an infrared spotlight is installed on the side, away from the first installation block, of the top of the table top. According to the invention, the clamping assembly is arranged to stably clamp the wafer, so that the functions of rotation, translation and overturning during detection are facilitated; whether the wafer is normal or not is judged by setting a detection function; and the auxiliary detection assembly is arranged to accurately detect the problem position when the appearance of the wafer has a problem, so that the efficiency, accuracy and comprehensiveness of wafer appearance detection are greatly improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer appearance detection, and in particular to a calibration mechanism suitable for wafer appearance detection. Background Art

[0002] With the development of society, the position of wafers in the semiconductor industry is becoming increasingly important. Wafers refer to silicon wafers used in the manufacture of silicon semiconductor integrated circuits. Due to their extremely high purity and uniform crystal structure, they have become the basic material for manufacturing various electronic components. A large number of chips can be integrated on a wafer. These chips are widely used in many fields such as computers, mobile phones, and automotive electronics. Their quality and performance directly affect the reliability and stability of electronic products. Therefore, accurate and efficient appearance inspection of wafers is crucial.

[0003] However, there are some problems with the existing wafer appearance inspection technology. During the inspection process, it is impossible to quickly detect the chips in the wafer. This is because the existing inspection method usually requires the use of a suction cup to clamp the wafer. After inspecting one side, the wafer is removed and turned over to inspect the back side, which is very inconvenient. This method is not only inefficient, but also easy to damage the wafer. In addition, due to the large number of chips on the wafer and their dense distribution, it is difficult for traditional inspection methods to comprehensively and quickly detect the appearance quality of each chip. Summary of the invention

[0004] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a calibration mechanism suitable for wafer appearance inspection.

[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a mechanism suitable for wafer appearance inspection and calibration, comprising a support frame, a desktop is fixedly installed on the top of the support frame, a first mounting block is movably installed on the top of the desktop, a second mounting block is slidably installed on the top of the first mounting block, a clamping assembly is installed on the top of the second mounting block, a wafer body is clamped and installed inside the clamping assembly, a rotating assembly is installed between the second mounting block and the wafer body, an infrared spotlight is installed on the side of the top of the desktop away from the first mounting block, the irradiation direction of the infrared spotlight is toward the wafer body, an infrared receiver is installed on the side of the top of the desktop close to the infrared spotlight, the angles of the infrared spotlight and the infrared receiver are both inclined, an auxiliary detection assembly is installed on the top of the desktop, and the auxiliary detection assembly is located between the wafer body and the infrared spotlight;

[0006] The clamping assembly includes a bidirectional screw, a second slider, a second support rod, an annular clamping block and a roller. The bidirectional screw is movably installed inside the second mounting block. The second slider has two sliding parts installed inside the second mounting block. The second slider has screw holes corresponding to the bidirectional screw. The second support rod is fixedly connected to the top of the second slider. The annular clamping block is fixedly connected to the top of the second support rod. There are multiple rollers movably installed inside the annular clamping block. The rollers are located on both sides of the wafer body.

[0007] Further: a one-way screw is movably installed inside the first mounting block, a first drive motor is fixedly installed on one side of the first mounting block, the one-way screw is fixedly installed on the output end of the first drive motor, a first sliding block is fixedly connected to the bottom of the second mounting block, and a screw hole corresponding to the one-way screw is opened inside the first sliding block.

[0008] Further: a turning handle is fixedly connected to one side of the bidirectional screw rod, the turning handle is located on the outside of the second mounting block, and a first slot is formed on the outer surface of the roller.

[0009] Further: the rotating assembly includes a first protective cover, a second drive motor, a drive wheel and a second slot, the first protective cover is fixedly connected to the outer wall of the second mounting block, the second drive motor is fixedly installed inside the first protective cover, the drive wheel is fixedly installed at the output end of the second drive motor, the drive wheel is located at the bottom of the wafer body, and the second slot is opened on the outer surface of the drive wheel.

[0010] Further: a rotating shaft is fixedly connected to the bottom of the first mounting block, a rotating hole is opened on the top of the table top, the rotating shaft is movably installed inside the rotating hole, a first movable ear plate is fixedly connected to the outer wall of the first mounting block, a limit pin is slidably installed inside the first movable ear plate, a pull ring is fixedly connected to the top of the limit pin, a spring is fixedly installed between the pull ring and the first movable ear plate, the spring is sleeved on the limit pin, a limit slot is opened inside the table top, there are two limit slots, and the limit slots can correspond to each other with the limit pins.

[0011] Further: the auxiliary detection component includes an outer gear ring, an acrylic plate, a connecting block and a detection camera, the outer gear ring is movably located on the top of the desktop, the acrylic plate is fixedly connected to the front end of the outer wall of the outer gear ring, the connecting block is fixedly connected to the side of the front end of the outer wall of the outer gear ring away from the acrylic plate, the detection camera is fixedly installed on the outer wall of the connecting block, and the camera head of the detection camera is facing the direction of the acrylic plate.

[0012] Further: the outer wall of the outer gear ring is meshed with a supporting gear, and the number of the supporting gears is three. The top of the table top is fixedly connected to a supporting block, and the number of the supporting blocks is two. The two top supporting gears are both installed inside the supporting block. The top of the table top is fixedly connected to a second movable ear plate, and the bottom supporting gear is movably installed on the second movable ear plate. The top of the table top is fixedly connected to a second protective cover, and a third drive motor is fixedly installed inside the second protective cover, and the bottom supporting gear is fixedly installed on the output end of the third drive motor.

[0013] Further: the top of the tabletop is fixedly connected with a first support rod, the number of the first support rods is two, and the infrared spotlight and the infrared receiver are fixedly installed on the top of the two first support rods.

[0014] Further: a recording camera is fixedly installed on the top of the table, the recording camera is located at the front end of the outer gear ring, and the camera head of the recording camera is aimed at the direction of the wafer body.

[0015] Further: a universal wheel is fixedly connected to the bottom of the support frame, and there are multiple universal wheels.

[0016] The present invention has the following beneficial effects:

[0017] 1. Compared with the prior art, by setting a bidirectional screw, a handle, a second support rod, an annular clamping block, rollers and a wafer body, firstly, by turning the handle, the bidirectional screw is driven to rotate, and the two second sliders on the bidirectional screw will move toward or away from each other, and the second support rod at the top of the second slider will move accordingly, so that the annular clamping block fixedly connected to the top of the second support rod approaches or moves away from the wafer body. When the annular clamping block approaches the wafer body, the multiple rollers inside the annular clamping block contact the wafer body to clamp the wafer body. Stable clamping of the wafer is achieved, which is convenient for rotating, translating and flipping the wafer during detection, and improving detection efficiency.

[0018] 2. Compared with the prior art, by setting a first mounting block, a one-way screw, a first drive motor, a first sliding block, a limit pin, a pull ring, a limit groove, a second mounting block and a wafer body, when in use, the one-way screw can be driven to rotate by the first drive motor, so that the first sliding block can slide on the first mounting block, thereby driving the second mounting block and the wafer body to translate, so as to realize the detection of different areas of the wafer body. If it is necessary to detect the back of the wafer body, the pull ring can be pulled upward to pull the limit pin out of the limit groove, and then the first mounting block can be rotated to flip the wafer body 180°, and then the pull ring can be released to insert the limit pin into another limit groove to fix the first mounting block. The function of controlling the rotation, translation and flipping of the wafer is realized, which is convenient for detecting chips in different areas of the wafer.

[0019] 3. Compared with the prior art, by setting the wafer body, infrared spotlight and infrared receiver, when in use, the infrared spotlight is started to emit inclined infrared rays to illuminate the chip on the wafer body. If there is no protrusion or depression on the chip appearance, the light will be refracted to the infrared receiver. Through the principle of light refraction, the accuracy, reliability and convenience of detection can be improved.

[0020] 4. Compared with the prior art, by setting the wafer body, infrared receiver, outer gear ring, acrylic plate, connecting block, detection camera, support gear and third drive motor, if there is a problem with the chip appearance, the infrared light cannot be refracted onto the infrared receiver, but is refracted onto the acrylic plate. The detection camera on the connecting block records the light refracted onto the acrylic plate to determine the location of the problem on the wafer body. If the refracted light cannot be directly captured by the detection camera, the third drive motor can be used to drive the support gear to rotate, so that the outer gear ring rotates, and the acrylic plate and the detection camera are driven to find the light, ensuring that the location of the problem on the wafer body can be accurately detected. When a problem with the appearance of the wafer is found, the problem location can be determined in time, which provides convenience for subsequent maintenance and processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the structure of the present invention from a first viewing angle;

[0022] Figure 2 It is a schematic diagram of the structure of the second viewing angle of the present invention;

[0023] Figure 3 It is a schematic diagram of the exploded structure of the clamping assembly and the rotating assembly in the present invention;

[0024] Figure 4 for Figure 3 The enlarged structural diagram at A in the middle;

[0025] Figure 5 for Figure 3 The enlarged structural diagram at B in the middle;

[0026] Figure 6 It is a schematic diagram of the explosion structure of the auxiliary detection component in the present invention;

[0027] Figure 7 for Figure 6 The enlarged structural diagram at C in the middle;

[0028] Figure 8 It is a schematic diagram of the angle of light refraction when the wafer chip has a protrusion on its surface when the present invention is used.

[0029] Legend:

[0030] 1. Support frame; 101. Universal wheel; 2. Desktop; 201. First support rod; 3. First mounting block; 301. One-way screw rod; 302. First drive motor; 303. First sliding block; 304. First movable ear plate; 305. Limit pin; 306. Pull ring; 307. Spring; 308. Limit groove; 309. Rotating shaft; 310. Rotating hole; 4. Second mounting block; 5. Clamping assembly; 501. Two-way screw rod; 502. Turn handle; 503. Second sliding block; 504. Second support rod; 505. Annular clamping block; 506. Roller; 507, first card slot; 6, wafer body; 7, rotating assembly; 701, first protective cover; 702, second drive motor; 703, drive wheel; 704, second card slot; 8, infrared spotlight; 9, infrared receiver; 10, auxiliary detection assembly; 1001, outer gear ring; 1002, acrylic plate; 1003, connecting block; 1004, detection camera; 1005, supporting gear; 1006, supporting block; 1007, second protective cover; 1008, third drive motor; 1009, second movable ear plate; 11, recording camera. DETAILED DESCRIPTION

[0031] Reference Figure 1-8 The present invention provides a wafer appearance inspection and calibration mechanism: comprising a support frame 1, a tabletop 2 is fixedly installed on the top of the support frame 1, a first mounting block 3 is movably installed on the top of the tabletop 2, a second mounting block 4 is slidably installed on the top of the first mounting block 3, a clamping assembly 5 is installed on the top of the second mounting block 4, a wafer body 6 is clamped and installed inside the clamping assembly 5, a rotating assembly 7 is installed between the second mounting block 4 and the wafer body 6, an infrared spotlight 8 is installed on the side of the top of the tabletop 2 away from the first mounting block 3, the irradiation direction of the infrared spotlight 8 is toward the wafer body 6, an infrared receiver 9 is installed on the side of the top of the tabletop 2 close to the infrared spotlight 8, the angles of the infrared spotlight 8 and the infrared receiver 9 are both inclined, and the top of the tabletop 2 is installed An auxiliary detection component 10 is installed, and the auxiliary detection component 10 is located between the wafer body 6 and the infrared spotlight 8; the clamping component 5 includes a bidirectional screw 501, a second slider 503, a second support rod 504, an annular clamping block 505 and a roller 506, the bidirectional screw 501 is movably installed inside the second mounting block 4, the second slider 503 has two sliding parts installed inside the second mounting block 4, the second slider 503 has a screw hole corresponding to the bidirectional screw 501, the second support rod 504 is fixedly connected to the top of the second slider 503, the annular clamping block 505 is fixedly connected to the top of the second support rod 504, and a plurality of rollers 506 are movably installed inside the annular clamping block 505, and the rollers 506 are located on both sides of the wafer body 6.

[0032] When in use, first turn the handle 502 to drive the bidirectional screw rod 501 to rotate, and the two second sliders on the bidirectional screw rod 501 will move toward or away from each other, and the second support rod 504 on the top of the second slider 503 will move accordingly, so that the annular clamping block 505 fixedly connected to the top of the second support rod 504 is close to or away from the wafer body 6. When the annular clamping block 505 is close to the wafer body 6, the multiple rollers 506 inside the annular clamping block 505 contact the wafer body 6 to clamp the wafer body 6; after clamping, start the infrared spotlight 8 to emit inclined infrared rays to irradiate the chip on the wafer body 6. If there is no protrusion or depression on the surface of the chip, the light will be refracted onto the infrared receiver 9. If there is a protrusion or depression on the surface of the chip, it cannot be refracted onto the infrared receiver 9, and then it is re-detected through the auxiliary detection component 10.

[0033] A one-way screw rod 301 is movably installed inside the first mounting block 3, a first driving motor 302 is fixedly installed on one side of the first mounting block 3, the one-way screw rod 301 is fixedly installed on the output end of the first driving motor 302, and a first sliding block 303 is fixedly connected to the bottom of the second mounting block 4, and a screw hole corresponding to the one-way screw rod 301 is opened inside the first sliding block 303.

[0034] During detection, after the first drive motor 302 is started, it drives the one-way screw 301 to rotate, which is achieved through the first sliding block 303 at the bottom of the second mounting block 4, so that the second mounting block 4 can slide horizontally on the top of the first mounting block 3, thereby detecting different areas of the wafer body 6 and improving the comprehensiveness of the detection.

[0035] A turning handle 502 is fixedly connected to one side of the bidirectional screw rod 501 . The turning handle 502 is located outside the second mounting block 4 . A first slot 507 is formed on the outer surface of the roller 506 .

[0036] By rotating the handle 502, the bidirectional screw 501 can be directly driven to rotate, thereby controlling the clamping and releasing of the wafer body 6 by the clamping assembly 5; wherein the first clamping groove 507 enables the roller 506 to clamp and fix the wafer body 6 better.

[0037] The rotating assembly 7 includes a first protective cover 701, a second drive motor 702, a drive wheel 703 and a second slot 704. The first protective cover 701 is fixedly connected to the outer wall of the second mounting block 4. The second drive motor 702 is fixedly installed inside the first protective cover 701. The drive wheel 703 is fixedly installed at the output end of the second drive motor 702. The drive wheel 703 is located at the bottom of the wafer body 6. The second slot 704 is opened on the outer surface of the drive wheel 703.

[0038] When in use, after the second driving motor 702 is started, the driving wheel 703 at its output end rotates. The driving wheel 703 is located at the bottom of the wafer body 6, and the wafer body 6 is rotated by the friction force with the bottom of the wafer body 6, so that the infrared spotlight 8 and the infrared receiver 9 can detect the appearance of the chip at different positions on the wafer body 6, thereby improving the accuracy and reliability of the detection.

[0039] A rotating shaft 309 is fixedly connected to the bottom of the first mounting block 3, a rotating hole 310 is provided on the top of the desktop 2, and the rotating shaft 309 is movably installed inside the rotating hole 310. A first movable ear plate 304 is fixedly connected to the outer wall of the first mounting block 3, and a limiting pin 305 is slidably installed inside the first movable ear plate 304. A pull ring 306 is fixedly connected to the top of the limiting pin 305, and a spring 307 is fixedly installed between the pull ring 306 and the first movable ear plate 304. The spring 307 is sleeved on the limiting pin 305. A limiting groove 308 is provided inside the desktop 2, and there are two limiting grooves 308, which can correspond to the limiting pin 305.

[0040] When the wafer body 6 needs to be turned over, the pull ring 306 is pulled upward to drive the limit pin 305 to be pulled out of the limit groove 308. At this time, the first mounting block 3 can be rotated. After rotating 180°, the pull ring 306 is released. Under the action of the spring 307, the limit pin 305 is inserted into another limit groove 308 to fix the first mounting block 3, thereby completing the flipping of the wafer body 6 and improving the efficiency and comprehensiveness of the detection.

[0041] The auxiliary detection component 10 includes an outer gear ring 1001, an acrylic plate 1002, a connecting block 1003 and a detection camera 1004. The outer gear ring 1001 is movably located on the top of the desktop 2. The acrylic plate 1002 is fixedly connected to the front end of the outer wall of the outer gear ring 1001. The connecting block 1003 is fixedly connected to the side of the front end of the outer wall of the outer gear ring 1001 away from the acrylic plate 1002. The detection camera 1004 is fixedly installed on the outer wall of the connecting block 1003, and the camera head of the detection camera 1004 is facing the direction of the acrylic plate 1002.

[0042] When there is a problem with the appearance of the chip on the wafer body 6, the infrared rays cannot be refracted onto the infrared receiver 9, but will be refracted onto the acrylic plate 1002. At this time, the camera is facing the direction of the acrylic plate 1002, and can shoot the infrared rays refracted onto the acrylic plate 1002 to record the problem location.

[0043] The outer wall of the outer gear ring 1001 is meshed with a support gear 1005, and there are three support gears 1005. The top of the desktop 2 is fixedly connected to a support block 1006, and there are two support blocks 1006. The two top support gears 1005 are both installed inside the support block 1006. The top of the desktop 2 is fixedly connected to a second movable ear plate 1009, and the bottom support gear 1005 is movably installed on the second movable ear plate 1009. The top of the desktop 2 is fixedly connected to a second protective cover 1007, and a third drive motor 1008 is fixedly installed inside the second protective cover 1007, and the bottom support gear 1005 is fixedly installed at the output end of the third drive motor 1008.

[0044] When in use, three support gears 1005 provide support for the outer gear ring 1001, and then the third driving motor 1008 is turned on to drive the bottom support gear 1005 to rotate. The support gear 1005 is meshed with the outer gear ring 1001, so that the outer gear ring 1001 rotates, driving the acrylic plate 1002 and the detection camera 1004 to find the refracted and deflected light.

[0045] The top of the table top 2 is fixedly connected with a first support rod 201 , and there are two first support rods 201 . The infrared spotlight 8 and the infrared receiver 9 are both fixedly mounted on the top of the two first support rods 201 .

[0046] When in use, the two first support rods 201 provide stable support for the infrared spotlight 8 and the infrared receiver 9, thereby ensuring the accuracy of detection.

[0047] A recording camera 11 is fixedly installed on the top of the table 2 . The recording camera 11 is located at the front end of the outer gear ring 1001 . The camera head of the recording camera 11 is pointed in the direction of the wafer body 6 .

[0048] During the detection process, the recording camera 11 records the entire detection process of the wafer body 6 to provide a basis for subsequent analysis and processing.

[0049] A universal wheel 101 is fixedly connected to the bottom of the support frame 1 , and there are multiple universal wheels 101 .

[0050] The universal wheels 101 can flexibly move the entire device to different working positions, thereby improving the flexibility and convenience of the device and making it convenient to use in different workplaces.

[0051] The infrared spotlight 8 emits inclined infrared rays, which illuminate the chip on the wafer body 6. The light follows the Fermat principle during propagation, that is, the light always propagates along the path with the extreme value (minimum, maximum or constant value) of the optical path. When the chip appearance is normal, the light will be refracted to the infrared receiver 9. This is because the wafer surface and the chip surface have relatively uniform optical properties under normal circumstances. The light follows Snell's law (n1sinθ1=n2sinθ2, where n1 and n2 are the refractive indexes of the two media, and n1 and n2 are the incident angle and refraction angle) for refraction, so that it can be received by the infrared receiver 9. If the chip appearance has convex or concave, when the chip appearance has convex or concave, the optical path changes according to the Fermat principle, and the light will choose a new path to satisfy the Fermat principle, resulting in the refraction path of the light deviating from the normal direction and unable to be refracted to the infrared receiver.

[0052] Calculation of light refraction angle when there are bumps on the surface of the wafer chip:

[0053] ∠Y=infrared irradiation angle.

[0054] ∠X = the protruding angle of the wafer chip.

[0055] ∵The wall and the vertical line are perpendicular to the ground.

[0056] ∴∠X=∠a, 180°-∠a=∠b.

[0057] The sum of the three interior angles of a triangle is 180°

[0058] ∴180°-∠Y-∠b=∠c,∠c=∠d,

[0059] 180°-∠X-∠d=∠Z.

[0060] Working principle: During the inspection, the wafer body 6 is first placed between the two annular clamping blocks 505, and then the annular clamping blocks 505 are clamped on the wafer body 6 by turning the turning handle 502. Then, the infrared spotlight 8 is started to emit inclined infrared rays to illuminate the chip on the wafer body 6. If there is no protrusion or depression on the appearance of the chip, the light will be refracted onto the infrared receiver 9; if there is a problem, it cannot be refracted onto the infrared receiver 9, but refracted onto the acrylic plate 1002. At this time, the detection camera 1004 on the connecting block 1003 shoots and records the light refracted onto the acrylic plate 1002 to determine the location of the problem on the wafer body 6.

[0061] If the refracted light cannot be directly captured by the detection camera 1004, the third drive motor 1008 can be used to drive the support gear 1005 to rotate, causing the outer gear ring 1001 to rotate, driving the acrylic plate 1002 and the detection camera 1004 to search for light, thereby ensuring that the location where the problem occurs on the wafer body 6 can be accurately detected.

[0062] During the detection process, the first drive motor 302 can drive the one-way screw 301 to rotate, so that the first sliding block 303 slides on the first mounting block 3, thereby driving the second mounting block 4 and the wafer body 6 to translate, thereby realizing the detection of different areas of the wafer body 6. At the same time, the second drive motor 702 can drive the drive wheel 703 to rotate, so that the wafer body 6 rotates, further improving the comprehensiveness of the detection.

[0063] If it is necessary to inspect the back side of the wafer body 6, the pull ring 306 can be pulled upward to pull the limit pin 305 out of the limit groove 308, and then the first mounting block 3 can be rotated to flip the wafer body 6 180°, and then the pull ring 306 can be released to insert the limit pin 305 into another limit groove 308 to fix the first mounting block 3.

[0064] During the detection process, the recording camera 11 records the entire detection process of the wafer body 6 to provide a basis for subsequent analysis and processing.

[0065] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer appearance inspection and calibration mechanism, comprising a support frame (1), characterized in that: A desktop (2) is fixedly mounted on the top of the support frame (1); a first mounting block (3) is movably mounted on the top of the desktop (2); a second mounting block (4) is slidably mounted on the top of the first mounting block (3); a clamping assembly (5) is mounted on the top of the second mounting block (4); a wafer body (6) is clamped and mounted inside the clamping assembly (5); a rotating assembly (7) is mounted between the second mounting block (4) and the wafer body (6); an infrared spotlight (8) is mounted on the top of the desktop (2) away from the first mounting block (3); the irradiation direction of the infrared spotlight (8) is toward the wafer body (6); an infrared receiver (9) is mounted on the top of the desktop (2) close to the infrared spotlight (8); the angles of the infrared spotlight (8) and the infrared receiver (9) are both inclined; an auxiliary detection assembly (10) is mounted on the top of the desktop (2); the auxiliary detection assembly (10) is located between the wafer body (6) and the infrared spotlight (8); The clamping assembly (5) comprises a bidirectional screw (501), a second slider (503), a second support rod (504), an annular clamping block (505) and a roller (506); the bidirectional screw (501) is movably mounted inside the second mounting block (4); the second slider (503) has two slides mounted inside the second mounting block (4); a screw hole corresponding to the bidirectional screw (501) is provided inside the second slider (503); the second support rod (504) is fixedly connected to the top of the second slider (503); the annular clamping block (505) is fixedly connected to the top of the second support rod (504); a plurality of rollers (506) are movably mounted inside the annular clamping block (505); and the rollers (506) are located on both sides of the wafer body (6).

2. The wafer appearance inspection and calibration mechanism according to claim 1, characterized in that: A one-way screw rod (301) is movably installed inside the first mounting block (3); a first drive motor (302) is fixedly installed on one side of the first mounting block (3); the one-way screw rod (301) is fixedly installed on the output end of the first drive motor (302); a first sliding block (303) is fixedly connected to the bottom of the second mounting block (4); a screw hole corresponding to the one-way screw rod (301) is opened inside the first sliding block (303).

3. The wafer appearance inspection and calibration mechanism according to claim 1, characterized in that: A turning handle (502) is fixedly connected to one side of the bidirectional screw rod (501), and the turning handle (502) is located outside the second mounting block (4). A first clamping groove (507) is provided on the outer surface of the roller (506).

4. The wafer appearance inspection and calibration mechanism according to claim 1, characterized in that: The rotating assembly (7) comprises a first protective cover (701), a second drive motor (702), a drive wheel (703) and a second slot (704), wherein the first protective cover (701) is fixedly connected to the outer wall of the second mounting block (4), the second drive motor (702) is fixedly mounted inside the first protective cover (701), the drive wheel (703) is fixedly mounted at the output end of the second drive motor (702), the drive wheel (703) is located at the bottom of the wafer body (6), and the second slot (704) is provided on the outer surface of the drive wheel (703).

5. The wafer appearance inspection and calibration mechanism according to claim 1, characterized in that: The bottom of the first mounting block (3) is fixedly connected with a rotating shaft (309), the top of the table top (2) is provided with a rotating hole (310), the rotating shaft (309) is movably installed inside the rotating hole (310), the outer wall of the first mounting block (3) is fixedly connected with a first movable ear plate (304), the interior of the first movable ear plate (304) is slidably provided with a limit pin (305), the top of the limit pin (305) is fixedly connected with a pull ring (306), a spring (307) is fixedly installed between the pull ring (306) and the first movable ear plate (304), the spring (307) is sleeved on the limit pin (305), the interior of the table top (2) is provided with a limit groove (308), the number of the limit grooves (308) is two, and the limit grooves (308) can correspond to each other with the limit pin (305).

6. The wafer appearance inspection and calibration mechanism according to claim 1, characterized in that: The auxiliary detection component (10) comprises an outer gear ring (1001), an acrylic plate (1002), a connecting block (1003) and a detection camera (1004); the outer gear ring (1001) is movably located on the top of the desktop (2); the acrylic plate (1002) is fixedly connected to the front end of the outer wall of the outer gear ring (1001); the connecting block (1003) is fixedly connected to the side of the front end of the outer wall of the outer gear ring (1001) away from the acrylic plate (1002); the detection camera (1004) is fixedly mounted on the outer wall of the connecting block (1003); and the camera head of the detection camera (1004) faces the direction of the acrylic plate (1002).

7. The wafer appearance inspection and calibration mechanism according to claim 6, characterized in that: The outer wall of the outer gear ring (1001) is meshed with a support gear (1005), and the number of the support gears (1005) is three. The top of the table top (2) is fixedly connected to a support block (1006), and the number of the support blocks (1006) is two. The two support gears (1005) at the top are both installed inside the support block (1006). The top of the table top (2) is fixedly connected to a second movable ear plate (1009), and the support gear (1005) at the bottom is movably installed on the second movable ear plate (1009). The top of the table top (2) is fixedly connected to a second protective cover (1007), and a third drive motor (1008) is fixedly installed inside the second protective cover (1007). The support gear (1005) at the bottom is fixedly installed at the output end of the third drive motor (1008).

8. The wafer appearance inspection and calibration mechanism according to claim 1, characterized in that: The top of the table top (2) is fixedly connected to a first support rod (201), there are two first support rods (201), and the infrared spotlight (8) and the infrared receiver (9) are both fixedly mounted on the tops of the two first support rods (201).

9. The wafer appearance inspection and calibration mechanism according to claim 1, characterized in that: A recording camera (11) is fixedly mounted on the top of the tabletop (2). The recording camera (11) is located at the front end of the outer gear ring (1001). The camera head of the recording camera (11) is aimed in the direction of the wafer body (6).

10. The wafer appearance inspection and calibration mechanism according to claim 1, characterized in that: A universal wheel (101) is fixedly connected to the bottom of the support frame (1), and there are a plurality of universal wheels (101).

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