Electronic device

By designing cushioning structure and colloid sealing technology on the edge of the cover plate of electronic devices, the problem of fragility of the cover plate edge is solved, improving the anti-fall performance and user experience, and avoiding additional weight and scraping problems.

CN119316507APending Publication Date: 2025-01-14VIVO MOBILE COMM CO LTD
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Patent Information

Application Number
CN202411420608.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-12
Publication Date
2025-01-14

AI Technical Summary

Technical Problem

The edges of the cover plate of electronic devices are prone to fragmentation when falling, resulting in insufficient anti-falling performance.

Method used

Design an electronic device, adopting elastic support and colloidal structure, by setting a buffer structure on the edge of the cover plate, it has a certain elastic abduction space, extending the impact time, reducing the impact force, reducing the probability of fragmentation, and passing through the colloidal and Sealing between the frames prevents water and gas from entering.

Benefits of technology

It effectively improves the anti-fall performance of electronic devices, reduces the crack rate of the cover plate, avoids damage to the electrical components inside the frame, and avoids the increase in the frame weight and scraping problems, improving the user experience.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses an electronic device which comprises a frame body, an elastic supporting piece, a panel, a cover plate and a colloid, the elastic supporting piece is arranged on the frame body, a part of the elastic supporting piece is located between the panel and the frame body, and the cover plate is located on the side, away from the elastic supporting piece, of the panel. The colloid is arranged on the elastic supporting piece, and a part of the colloid is located between the edge of the cover plate and the elastic supporting piece.
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Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] In order to improve the quality of use of electronic devices such as mobile phones by users, improving the drop resistance of cover plates in electronic devices has become an improvement direction for current electronic devices.

[0003] When an electronic device falls, the edge of the cover plate is prone to breakage when it is bumped, so how to improve the drop resistance of electronic devices is a common problem in the industry. Summary of the invention

[0004] The present application aims to provide an electronic device, which at least solves the problem in the related art that the edge of the cover plate is prone to breakage when being bumped.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] The present application provides an electronic device, including:

[0007] Frame;

[0008] An elastic support member is arranged on the frame;

[0009] The panel, a part of the elastic support member is located between the panel and the frame;

[0010] A cover plate, the cover plate is located on a side of the panel away from the elastic support member;

[0011] The colloid is arranged on the elastic support member, and a part of the colloid is located between the edge of the cover plate and the elastic support member.

[0012] In the embodiment of the present application, the cover plate is arranged on the side of the panel away from the elastic support member, and the cover plate protects the panel to prevent external objects from directly contacting the panel. For example, the cover plate can be a glass cover plate, and the cover plate covers the panel, thereby further reducing the damage rate of the panel. When the front of the cover plate is subjected to force, the cover plate is pushed toward the panel, and the elastic support member cushions the panel, thereby offsetting the impact force on the panel and reducing the probability of the cover plate breaking.

[0013] The gap between the cover plate and the frame is filled with colloid, which seals the gap between the cover plate and the frame to prevent external moisture from entering the frame, thereby avoiding damage to the electrical components inside the frame.

[0014] When the entire electronic device falls, assuming that its mass and speed remain unchanged, the longer the time it takes to release the impact energy when the cover hits the ground, the smaller the force received by the impact surface of the cover.

[0015] A shock-absorbing structure is designed on the edge of the cover plate so that the edge of the cover plate has a certain elastic retreat space, which can extend the impact time of the cover plate from the moment of hard impact to a soft impact with a certain elastic distance.

[0016] A colloid is arranged between the edge of the cover plate and the elastic support member. When the edge of the cover plate is subjected to an impact force, the impact force on the cover plate will indirectly act on the colloid, thereby forming an extrusion of the colloid. The impact force is transmitted to the elastic support member through the colloid, and the elastic support member plays a role of elastic support for the colloid. As the colloid is extruded, the elastic support member will deform, so that the elastic support member elastically buffers the colloid. Since an elastic support member is arranged between the colloid and the frame, when the colloid is subjected to an extrusion force, the colloid is not likely to be over-extruded so that the thickness of the colloid approaches 0 mm, thereby avoiding the rigid reaction force of the colloid on the cover plate.

[0017] By setting a shock-absorbing structure on the edge of the cover, the hard impact on the cover is turned into a soft impact, and the impact time caused by the shock absorption is prolonged, the impact energy per unit time is reduced, and the probability of the cover breaking is reduced, which is beneficial to improving the drop resistance of the electronic device. In the above case, there is no need to increase the height or thickness of the frame, which can reduce the weight of the whole machine, and the height of the frame protruding from the surface of the cover will not be too large, avoiding the problem of the frame scratching the hand, which is beneficial to improving the user experience.

[0018] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0020] Figure 1 is a schematic diagram of a frame of an electronic device filled with a supporting colloid according to an embodiment of the present application;

[0021] Figure 2 is one of the partial schematic diagrams of an electronic device according to an embodiment of the present application;

[0022] Figure 3 is a schematic diagram of an electronic device according to an embodiment of the present application in which a supporting colloid is not filled in the frame;

[0023] Figure 4 is a schematic diagram of a gap filler being provided between the elastic support member and the frame according to an embodiment of the present application;

[0024] Figure 5is a schematic diagram of a cover plate of an electronic device under stress according to an embodiment of the present application;

[0025] Figure 6 is a schematic diagram of the force on the edge of the cover plate according to an embodiment of the present application;

[0026] Figure 7 is a second partial schematic diagram of an electronic device according to an embodiment of the present application;

[0027] Figure 8 is a third partial schematic diagram of an electronic device according to an embodiment of the present application;

[0028] Fig. 9 is a schematic diagram of the adhesive being attached to the panel and the cover according to an embodiment of the present application;

[0029] Fig.10 is a schematic diagram of a panel and a cover plate provided with adhesive according to an embodiment of the present application;

[0030] Fig.11 is a schematic diagram of a cover plate before being subjected to force according to an embodiment of the present application;

[0031] Fig.12 is a schematic diagram of a cover plate after being subjected to force according to an embodiment of the present application;

[0032] Fig.13 This is one of the schematic diagrams of the force on the side of the frame according to an embodiment of the present application;

[0033] Fig.14 This is a second schematic diagram of the force on the side of the frame according to an embodiment of the present application;

[0034] Fig.15 This is one of the schematic diagrams of the first frame body and the second frame body cooperating with the colloid according to an embodiment of the present application;

[0035] Fig.16 This is a second schematic diagram of the first frame and the plastic frame matching with the colloid according to the embodiment of the present application;

[0036] Fig.17 This is one of the schematic diagrams of the appearance structure of an electronic device according to an embodiment of the present application;

[0037] Fig.18 This is a second schematic diagram of the appearance structure of an electronic device according to an embodiment of the present application;

[0038] Fig.19 is one of the schematic diagrams of a circuit board bottom filled with a filler according to an embodiment of the present application;

[0039] Fig. 20 This is the second schematic diagram of the bottom of the circuit board filled with a filler according to an embodiment of the present application.

[0040] Reference numerals:

[0041] 100 electronic device, 110 frame, 111 first frame, 112 second frame, 113 limiting part, 120 elastic support member, 121 first support part, 122 second support part, 123 gap, 130 panel, 131 corner part, 132 side, 140 cover, 150 colloid, 151 caulking glue, 1511 first part, 1512 second part, 1513 third part, 152 supporting colloid, 160 adhesive, 170 supporting member, 180 circuit board, 190 filling member. DETAILED DESCRIPTION

[0042] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0043] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0044] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0045] Combine the following Figure 1-Figure 20 An electronic device according to an embodiment of the present application is described.

[0046] Combination Figure 1 and Figure 2As shown, according to some embodiments of the present application, the electronic device 100 includes: a frame 110, an elastic support member 120, a panel 130, a cover plate 140 and a colloid 150. The elastic support member 120 is provided on the frame 110, a part of the elastic support member 120 is located between the panel 130 and the frame 110, and the cover plate 140 is located on a side of the panel 130 away from the elastic support member 120. The colloid 150 is provided on the elastic support member 120, and a part of the colloid 150 is located between the edge of the cover plate 140 and the elastic support member 120.

[0047] The elastic support member 120 is installed in the frame 110, and a part of the elastic support member 120 is located between the panel 130 and the frame 110. The frame 110 is not easily deformed, so that the installation position of the elastic support member 120 is not easily changed. The elastic support member 120 can elastically support the panel 130 to avoid rigid contact between the panel 130 and the bottom support structure, thereby reducing the damage rate of the panel 130.

[0048] The cover plate 140 is arranged on a side of the panel 130 away from the elastic support member 120. The cover plate 140 protects the panel 130 and prevents external objects from directly contacting the panel 130. For example, the cover plate 140 may be a glass cover plate 140. The cover plate 140 covers the panel 130, thereby further reducing the damage rate of the panel 130. When the front side of the cover plate 140 is subjected to force, the cover plate 140 is pushed toward the panel 130. At this time, the elastic support member 120 buffers the cover plate 140, thereby offsetting the impact force on the cover plate 140 and reducing the probability of the cover plate 140 breaking.

[0049] A portion of colloid 150 is filled between the cover plate 140 and the frame 110 , and the colloid 150 seals the gap between the cover plate 140 and the frame 110 to prevent external moisture from entering the frame 110 , thereby avoiding damage to electrical components inside the frame 110 .

[0050] In a possible application, a portion of colloid 150 is provided between the side of the cover plate 140 and the frame 110. When the frame 110 is impacted, a portion of the impact force received by the frame 110 will indirectly act on the colloid 150. At this time, the colloid 150 can buffer a portion of the impact force received by the frame 110, thereby offsetting the portion of the impact force, or reduce the impact force acting on the cover plate 140, thereby reducing the damage rate of the cover plate 140.

[0051] From the broken pictures and case analysis of the cover plate 140, it can be seen that, whether it is the display screen or the battery cover, the broken position of the cover plate 140 is generally at the edge of the cover plate 140. Figure 2As shown, during the falling process of the whole machine, only when the cover plate 140 of the whole machine falls at an angle of 0° with the horizontal plane, the entire surface of the cover plate 140 will collide with the ground. In most other cases of 0° to 90°, it is the edge of the cover plate 140 or the middle frame of the whole machine that touches and collides with the ground.

[0052] Figure 2 In the figure, the label a is used to indicate the touch position of the electronic device when it falls from 0° to 90°, and the label b is used to indicate the touch position of the electronic device when it falls from 0°.

[0053] In the energy law: f×t=m×v, f represents force, t represents time, m represents mass of the object, v represents speed of movement, f=(m×v) / t, when the mass m and speed v of the object remain unchanged, the impact force f on the object is inversely proportional to the time t, the longer the impact force is released, the smaller the force, and vice versa. When the entire electronic device 100 falls, under the premise that the mass and speed of the object remain unchanged, when the cover 140 lands, the longer the time for the cover 140 to release the impact energy, the smaller the force on the impact surface of the cover 140.

[0054] like Fig.17 As shown, the position where the cover plate 140 directly touches the ground is mostly at the edge of the cover plate 140, that is, Fig.17 The corner portion 131 and the side edge 132 in the embodiment.

[0055] It can be known from the law of momentum that increasing the impact time of the cover plate 140 can reduce the impact force received by the cover plate 140. Also, the edge of the cover plate 140 is the hardest hit area that is prone to breakage. Therefore, a shock-absorbing structure is designed near the edge of the cover plate 140 so that the edge of the cover plate 140 has a certain elastic retreat space, which can extend the impact time of the cover plate 140 from the moment of hard impact to a soft impact with a certain elastic distance.

[0056] A portion of the colloid 150 is also disposed between the edge of the cover plate 140 and the elastic support member 120. When the edge of the cover plate 140 is subjected to an impact force, the impact force on the cover plate 140 will indirectly act on the colloid 150, thereby forming an extrusion of the colloid 150. The impact force is transmitted to the elastic support member 120 through the colloid 150, and the elastic support member 120 plays a role of elastic support for the colloid 150. As the colloid 150 is extruded, the elastic support member 120 will deform, so that the elastic support member 120 elastically buffers the colloid 150. Since the elastic support member 120 is disposed between the colloid 150 and the frame 110, when the colloid 150 is subjected to an extrusion force, the colloid 150 is not likely to be over-extruded so that the thickness of the colloid 150 approaches 0 mm, thereby preventing the cover plate 140 from being subjected to a rigid reaction force of the colloid 150.

[0057] By setting a shock absorbing structure on the edge of the cover plate 140, the hard impact on the cover plate 140 is turned into a soft impact, and the impact time caused by the shock absorbing is prolonged, and the impact energy per unit time is reduced, thereby reducing the probability of the cover plate 140 breaking, which is beneficial to improving the anti-fall performance of the electronic device. In the above case, there is no need to increase the height or thickness of the frame 110, which can reduce the weight of the whole machine, and the height of the frame 110 protruding from the surface of the cover plate 140 will not be too large, avoiding the problem of the frame 110 scratching the hand, which is beneficial to improving the user experience.

[0058] The impact of the hollow bottom is turned into a "solid bottom", so that the energy originally absorbed by the cover plate 140 is partially transferred to the "solid bottom" support at the bottom, thereby optimizing and improving the problem of the cover plate 140 of the display screen / battery cover being broken.

[0059] The elastic support member 120 may be foam with adhesive on both sides, or may be made of materials such as silicone.

[0060] When the whole machine falls, Fig.17 The edge of the cover plate 140 shown in the figure will be hit. At this time, the impact force of the impact will push the cover plate 140 to sink, and the elastic support member 120 in the middle position of the cover plate 140 will be compressed and sink. The caulking glue 151 at the edge of the cover plate 140 will be deformed and sink with the cover plate 140. The caulking glue 151 squeezes the elastic support member 120 below, causing it to deform and give way.

[0061] Combination Figure 5 and Figure 6 As shown, in this process, the cover plate 140 is impacted and sinks by a distance F (the arrow pointing to the cover plate 140 is used to indicate the force direction, Figure 5 and Figure 6 The dotted box at E in the middle is used to represent the squeezing situation between the caulking glue 151 and the elastic support member 120). When the impact speed is constant, the greater the distance F, the longer the impact time consumed. According to the law of momentum: f = (m×v) / t, the longer the time, the smaller the impact force f (the mass m and the speed v remain unchanged). Therefore, compared with the case where there is no elastic support member 120, when the elastic support member 120 is padded at the bottom of the caulking glue 151, the impact force received by the cover plate 140 is smaller.

[0062] After the impact ends, the impact force disappears, and the elastic support member 120 rebounds to return to its original state.

[0063] like Figure 6At the impact angle shown or close to this angle, when the cover plate 140 impacts the impact surface, when the cover plate 140 sinks to the J value, the impact surface will be blocked by the frame 110, wherein the left side G of the impact surface cannot continue to move forward, and the right side H of the impact surface will continue to move forward due to the impact of the frame 110 on the left side G of the impact surface, but a large part of the impact energy on the surface of the cover plate 140 is absorbed and converted by the frame 110, and the energy borne by the cover plate 140 will be greatly reduced. If there is no elastic support member 120 at the bottom of the caulking glue 151, all the energy of the impact surface will be absorbed by the cover plate 140 when it impacts.

[0064] Because of the above effects, when considering the appearance of the whole machine over its reliability, the height of the frame 110 can be appropriately lowered to improve the appearance and reduce the scratching problem without causing an increase in the breakage rate of the cover 140 .

[0065] Combination Figure 1 , Figure 3 and Figure 4 As shown, in some embodiments, optionally, the colloid 150 includes a caulk 151, a first portion 1511 of the caulk 151 is located between the side of the cover plate 140 and the frame 110, a second portion 1512 of the caulk 151 is located between the edge of the cover plate 140 and the elastic support member 120, and the caulk 151 and the panel 130 are spaced apart.

[0066] The elastic support member 120 is provided with a sealant 151. Specifically, before the cover plate 140 is installed, the sealant 151 is first dripped on the elastic support member 120. That is, the sealant 151 is applied to the elastic support member 120 before the cover plate 140 is assembled. Because the sealant 151 is easily overflowed after accumulation, the height is relatively short. Figure 1 The Z-direction spacing between the middle elastic support member 120 and the cover plate 140 must be smaller than the stacking height of the caulking glue 151. After the glue is dispensed, the cover plate 140 is pressed down for assembly, and the caulking glue 151 is squeezed into the gap between the cover plate 140 and the frame 110 to fill it. Then, the glue outside the gap is wiped off on the exterior surface to achieve a "visually seamless" aesthetic effect between the cover plate 140 and the frame 110.

[0067] When the edge of the cover plate 140 is subjected to an impact force, the impact force exerted on the cover plate 140 will indirectly act on the caulking glue 151, thereby squeezing the caulking glue 151. The impact force is transmitted to the elastic support member 120 through the caulking glue 151. The elastic support member 120 elastically supports the caulking glue 151, thereby making the elastic support member 120 elastically buffer the caulking glue 151 and preventing the thickness of the caulking glue 151 from being squeezed to a thickness close to 0 mm.

[0068] In one embodiment, a certain space needs to be left between the caulking glue 151 and the panel 130. The purpose is to prevent the caulking glue 151 from adhering to the panel 130. Because the caulking glue 151 is too hard, adhering to the panel 130 will cause the panel 130 to be pulled hard when the whole machine is slightly dropped and vibrated, thereby causing the panel 130 to be strained. The caulking glue 151 is set at a distance from the panel 130, which can prevent the caulking glue 151 from causing strain on the panel 130 and reduce the damage rate of the panel 130.

[0069] Combination Figure 1 and Figure 3 As shown, in some embodiments, optionally, the elastic support member 120 includes a first support portion 121 and a second support portion 122, and the second portion 1512 is located between the cover plate 140 and the first support portion 121. A gap 123 is formed between the first support portion 121 and the second support portion 122, a portion of the panel 130 is located between the cover plate 140 and the second support portion 122, and another portion of the panel 130 is arranged opposite to the gap 123.

[0070] The first support portion 121 elastically supports the sealant 151, thereby realizing elastic buffering of the sealant 151 and the cover plate 140. The second support portion 122 elastically supports the panel 130, thereby realizing elastic buffering of the panel 130.

[0071] Figure 3 The dotted frame at C in the middle is used to indicate the portion of the panel 130 extending out of the second support portion 122. The first support portion 121 and the second support portion 122 are arranged at intervals, that is, a gap 123 is arranged between the first support portion 121 and the second support portion 122, and a portion of the panel 130 extends out of the edge of the second support portion 122, so that a portion of the panel 130 is arranged opposite to the gap 123. When the cover plate 140 is damaged, it is necessary to replace the cover plate 140. The cover plate 140 usually needs to be disassembled together with the panel 130. In order to prevent the panel 130 and the elastic support member 120 from being torn due to adhesion, a portion of the panel 130 is extended out of the second support portion 122 so that the end of the panel 130 does not contact the second support portion 122. By applying force to the end of the panel 130, it is easy to disassemble the panel 130 from the second support portion 122, and the probability of the panel 130 being torn can also be reduced.

[0072] When foam adhesive is used as the elastic support member 120, the first support portion 121 and the second support portion 122 can be made in one piece and attached to the frame 110 together, so that no additional parts are needed and no additional assembly costs are required (the two parts are die-cut at the same time and share a release film). Because the foam adhesive has double-sided adhesive, in order to prevent the adhesive on the tape from adhering to the panel 130 and causing it to be torn during the disassembly process, the edge of the panel 130 between the first support portion 121 and the second support portion 122 can be cut out.

[0073] like Figure 1 As shown, in some embodiments, optionally, the colloid 150 further includes: a supporting colloid 152 , the supporting colloid 152 is filled between the caulking glue 151 and the panel 130 , and is filled in the gap 123 .

[0074] The gap filler 151 is spaced from the panel 130, and this space is a "valley" for the cover plate 140. When falling, as long as the outer surface of the "valley" position of the cover plate 140 hits an object, tension will be formed on the lower surface of the "valley" position of the cover plate 140. The cover plate 140 is a brittle material with strong compressive resistance but poor tensile resistance, so the "valley" position becomes a weak point.

[0075] In order to solve the "empty valley" problem, after the first support part 121, the second support part 122, the caulking glue 151 and the cover plate 140 are assembled, glue is poured into the "empty valley" position through the glue pouring holes on the inside of the frame 110, and the supporting colloid 152 is filled in the "empty valley" position. The hardness of the supporting colloid 152 can be set close to that of the caulking glue 151 to ensure that the displacement of the two positions is close during the impact process.

[0076] In a possible application, the adhesive force of the supporting colloid 152 to the object is relatively weak. For example, the adhesive force of the supporting colloid 152 is lower than that of the caulking glue 151 , and the panel 130 will not be damaged if the whole device falls or is pulled.

[0077] like Figure 7 As shown, in some embodiments, optionally, the elastic coefficient of the first support portion 121 is smaller than the elastic coefficient of the second support portion 122 .

[0078] The elastic coefficient of the first support part 121 is relatively small, and the elastic coefficient of the second support part 122 is relatively large. Therefore, when the first support part 121 and the second support part 122 are subjected to the same force, the first support part 121 is more likely to undergo elastic deformation. The first support part 121 is made of a soft material with a very large compression amount, and its compression amount is much greater than that of the second support part 122. In this case, there is no need to fill the "empty valley" position with glue.

[0079] like Figure 8As shown in the figure, although this structure will have a "valley" phenomenon when the original glue-filled position falls, because the elastic force of the first support part 121 is very small, the preload is greater than the preload on one side of the second support part 122, and the "valley" position is no longer the previous phenomenon of left and right support on both sides, and the inner surface under pressure in the middle is tensile stress. It has become an inner support, the outer side is bent downward, and the middle is an "arch" structure, such as Figure 8 The structure shown (the arrow at M indicates the force direction, the arrow at N indicates that the inner surface of the cover plate 140 is under compressive stress rather than tensile stress, and the arrow at O ​​indicates compressive stress). In this way, the original inner tensile stress is converted into the inner bending and extrusion compressive stress. Because the cover plate 140 is a pressure-resistant brittle material, this position does not need to be filled with glue for support, which can also reduce the breakage rate of the cover plate 140.

[0080] like Figure 4 As shown, in some embodiments, optionally, the third portion 1513 in the caulking adhesive 151 is located between the side of the elastic support member 120 and the frame 110 .

[0081] There is a certain gap between the side of the elastic support member 120 and the frame 110, and a part of the caulking glue 151 is filled into the gap between the elastic support member 120 and the frame 110. In order to prevent the elastic support member 120 and the frame 110 from interfering in the X direction and causing extrusion deformation to affect the space of the caulking glue 151, a small gap with a width of D is reserved between the elastic support member 120 and the frame 110 for manufacturing tolerance. It is ensured that the stacking height of the caulking glue 151 is not affected, and the problem of squeezing the caulking glue 151 space due to the assembly extrusion deformation of the elastic support member 120 will not occur.

[0082] like Fig. 9 As shown, in some embodiments, optionally, the colloid 150 is in contact with the panel 130 , a portion of the colloid 150 extends between the panel 130 and the elastic support member 120 , and the bottom surface of the colloid 150 and the bottom surface of the panel 130 are in smooth transition.

[0083] like Fig. 9 As shown, the edge of the cover plate 140 and the side and bottom of the panel 130 are partially coated with hard glue, that is, the above-mentioned glue 150, so that the hard glue, the cover plate 140, and the panel 130 are integrated into a "large module". The lower surface of the injection-molded hard glue and the lower surface of the panel 130 are made into a smooth transition structure, which is conducive to the subsequent bottom foam glue without sudden changes, avoiding local stress concentration and display problems.

[0084] The above-mentioned smooth transition means that the position where the lower surface of the colloid 150 and the lower surface of the panel 130 are connected to each other is relatively smooth, and there is no protrusion or angular structure at the position where the two are connected to each other.

[0085] The colloid 150, the cover plate 140 and the panel 130 are designed as a whole. When the cover plate 140 is subjected to force, the above-mentioned "large module" will drop as a whole, and the elastic support member 120 will provide overall buffering for the above-mentioned "large module", which can not only prevent the colloid 150 from tearing the panel 130, but also reduce the probability of the cover plate 140 breaking.

[0086] like Fig. 9 As shown, in some embodiments, optionally, the position where the colloid 150 and the panel 130 are attached is arranged opposite to the elastic support member 120 .

[0087] In this embodiment, the position where the colloid 150 and the panel 130 are in contact is supported by the elastic support member 120. By extending the elastic support member 120, most of the space at the bottom of the colloid 150 and the panel 130 can be supported by the elastic support member 120, so that the elastic support member 120 changes the projection area of ​​the entire cover plate 140, and there is no longer a valley position at the bottom of the cover plate 140, thereby reducing the damage rate of the cover plate 140.

[0088] like Fig.11 As shown, when the cover plate 140 is not subjected to force, the plane where the upper surface of the cover plate 140 is located is P, and the plane where the lower surface of the elastic support member is located is Q. Fig.12 As shown, when the cover plate 140 is under force, the plane where the upper surface of the cover plate 140 is located is R, and there is a height difference between the plane P and the plane R.

[0089] like Fig.13 As shown, the colloid 150 may be wrapped around a portion of the side of the cover plate 140, or, as shown in FIG. Fig.14 As shown, the glue 150 is wrapped around the entire side of one side of the cover plate 140 .

[0090] Combination Fig. 9 and Fig.10 As shown, in some embodiments, optionally, an adhesive 160 is provided on the cover plate 140 and the panel 130 , and the adhesive 160 is used to bond the colloid 150 to the cover plate 140 and the panel 130 .

[0091] In order to ensure the bonding strength between the colloid 150 and the cover plate 140 and the panel 130 after encapsulation, structural bonding glue, i.e., bonding glue 160, can be brushed on the parts where the two are bonded to the colloid 150 before encapsulation, so as to improve the adhesion of the colloid 150 and the cover plate 140 and the panel 130 after bonding, prevent delamination during impact force, and further reduce the damage rate of the panel 130 and the cover plate 140.

[0092] Combination Fig.15 and Fig.16As shown, in some embodiments, optionally, the frame 110 includes a first frame 111 and a second frame 112 , the second frame 112 is located in the first frame 111 , the hardness of the second frame 112 is less than the hardness of the first frame 111 , and the second frame 112 is disposed between the colloid 150 and the first frame 111 .

[0093] The second frame 112 has a relatively low hardness, so that it can play a buffering role on the colloid 150. Exemplarily, the second frame 112 can be made of a plastic material, and the first frame 111 can be made of a hardware material.

[0094] A full circle of plastic is designed around the matching positions of the frame 110 and the cover 140 to separate the cover 140 from the hardware parts in the frame 110 .

[0095] Because the hardware part of the frame 110 has many sharp edges, burrs, and hard bumps during the processing, the cover plate 140 is easily offset during the assembly process, leaning to one side and leaning against it, and there is a phenomenon of 0mm gap between the cover plate 140 and the frame 110 in some places. Once the cover plate 140 is directly matched with the hardware structure, when the whole machine is hit from the side, the side of the cover plate 140 will directly hit the hardware structure, and the surrounding of the cover plate 140 is the most vulnerable position of the entire cover plate 140. Once a collision occurs, it is more likely to crack than the front surface, especially such a hard collision between hardware structures with high hardness, not to mention that the hardware burrs, bumps, and sharp edges are more likely to cause local stress concentration and puncture the cover plate 140.

[0096] Compared with hardware, plastic is very soft and has a certain elastic modulus. In particular, burrs and bumps caused by processing are easy to eliminate. Therefore, the circle of plastic isolation belt between the first frame 111 and the cover 140 can play a good buffering role. The impact on the cover 140 is changed from a hard impact of hardware to a soft impact, which protects the cover 140 well.

[0097] Because the elastic support member 120 is evenly laid on the bottom of the injection-molded hard rubber, when the cover plate 140 is impacted from the outside, the entire cover plate 140 can simultaneously and evenly compress the elastic support member 120 downward, so as to avoid the imbalance phenomenon of a hollow valley in the middle of the two ends of the support. Therefore, the force of the impact on the cover plate 140 can be evenly distributed to a larger area when it is transmitted to the back, so that the internal surface tension per unit area is reduced, thereby reducing the probability of screen cracking.

[0098] Another advantage of this structure is that after the hard glue wraps the edge of the cover 140 , when there is a side impact with the frame 110 , the lateral squeezing force caused by the glue injection on the edge of the cover 140 is completely blocked and absorbed by the hard glue, thereby protecting the cover 140 well.

[0099] In some embodiments, optionally, a portion of the second frame 112 extends to the bottom of the elastic support member 120 .

[0100] The second frame 112 is disposed at the bottom of the elastic support member 120 , so that the second frame 112 can buffer the bottom of the elastic support member 120 .

[0101] Combination Figure 1 , Fig.17 and Fig.18 As shown, in some embodiments, optionally, the electronic device 100 further includes: a support member 170, the support member 170 is connected to the frame 110, the support member 170 is used to support the cover plate 140, a corner portion 131 is provided on the cover plate 140, the corner portion 131 is located between two adjacent side edges 132 of the cover plate 140, and the support member 170 and the corner portion 131 are staggered.

[0102] During the manufacturing process, the sealant 151 is a fluid. In order to prevent the cover plate 140 from pressing down and squeezing out the fluid, resulting in a lack of sealant, the process will require the design of a Z-axis support bone position at the bottom of the cover plate 140, that is, the support member 170. When this bone position is designed, the cover plate 140 cannot sink downward in the Z direction, which will cause the elastic support member 120 to not function. Considering that the cover plate 140 hits the R corner area of ​​the four corners, that is, the corner part 131 in most cases during use, the R corner area of ​​the four corners requires that the Z-axis support member 170 of the cover plate 140 cannot be designed. The Z-axis support member 170 is designed outside the X / Y range of the R corner area to avoid the elastic support member 120 from not functioning.

[0103] The shock absorbing structure in this embodiment is not only applicable to the four R corner areas of the whole machine, but also to the upper, lower, left and right straight edge areas.

[0104] Combination Fig.19 and Fig. 20 As shown, in some embodiments, optionally, the electronic device 100 further includes: a circuit board 180 and a filling piece 190, wherein the circuit board 180 is located on a side of the panel 130 facing away from the cover plate 140, and the filling piece 190 is located on a side of the circuit board 180 facing away from the panel 130, and the filling piece 190 is used to support the circuit board 180.

[0105] At the position where the circuit board 180 is located below the display screen, the width of the circuit board 180 is relatively wide due to the requirements of the electronic devices and wiring on the circuit board 180. At present, in order to prevent interference between the bottom of the area where the circuit board 180 is located and the frame 110, the bottom is in a "valley" state. When the outer surface of the valley position is hit, a large tensile stress will be generated on the inner side of the cover plate 140. As a brittle material, the cover plate 140 is easily cracked and then broken when subjected to tensile stress.

[0106] In this embodiment, a filler 190 is used to support the unsupported valley position on one side of the circuit board 180. In this solution, a single-sided foam with adhesive can be added at the bottom of the circuit board 180 as the filler 190, and the non-adhesive side after the frame 110 is close to the circuit board 180 or slightly pre-pressed (the foam can also be attached to the circuit board 180 in reverse), and the foam is extended to the bottom of the filler 151, and the filler 151 is applied on the foam to increase the pre-pressing amount of the filler 151.

[0107] The single-sided adhesive foam may also be replaced with glue-filled foam as the filler 190 , and the glue may fill the bottom of the circuit board 180 , so that the original hollow valley may become a glue support.

[0108] With this structure, the bottom of the circuit board 180 is changed from a hollow valley to a well-supported area with foam or glue, which can effectively reduce the inner tensile stress caused by the original hollow position of the cover plate 140 during the impact process, thereby preventing the cover plate 140 from breaking.

[0109] Combination Fig.19 and Fig. 20 As shown, in some embodiments, optionally, a portion of the filling member 190 extends to the bottom of the colloid 150. Alternatively, the filling member 190 and the colloid 150 are staggered.

[0110] Besides that the cover plate 140 is easily broken after the hollowing, the elastic support member 120 at the bottom of the panel 130 has a very small area, which can easily cause the small elastic support member 120 to generate local stress in the supporting area, thereby damaging the panel 130 in a concentrated manner.

[0111] In this embodiment, a filler 190 is used to support the unsupported valley position on one side of the circuit board 180. In this solution, a single-sided foam with adhesive can be added at the bottom of the circuit board 180 as the filler 190, and the non-adhesive side after the frame 110 is close to the circuit board 180 or slightly pre-pressed (the foam can also be attached to the circuit board 180 in reverse), and the foam is extended to the bottom of the filler 151, and the filler 151 is applied on the foam to increase the pre-pressing amount of the filler 151.

[0112] Because the bottom of the panel 130 is supported, the supporting force of the elastic support member 120 in the area outside the circuit board 180 is shared by the foam, so that the stress it receives during impact is reduced.

[0113] Of course, in other embodiments, the filling member 190 and the colloid 150 may be staggered, that is, the filling member 190 does not extend to the bottom of the colloid 150 .

[0114] In some embodiments, optionally, a limiting portion 113 is provided on the frame 110 , and the limiting portion 113 is used to limit the side of the elastic support member 120 and the bottom of the elastic support member 120 .

[0115] Below the edge of the cover plate 140, an elastic support member 120 is provided, and the material does not directly contact the cover plate 140, such as Figure 1 As shown, a Z-direction height A is reserved between the elastic support member 120 and the cover plate 140, and a thickness of the elastic support member 120 is B, or, as Figure 7 As shown, a Z-direction height K is reserved between the elastic support member 120 and the cover plate 140, and the thickness of the elastic support member 120 is L. The frame 110 is provided with a step at the position of the elastic support member 120 and other limiting parts 113 that can provide support for the assembly of the elastic support member 120, provide positioning and fixation for the elastic support member 120, ensure the installation stability of the elastic support member 120, and thus effectively perform elastic buffering on the cover plate 140.

[0116] In the above embodiment, the cover plate 140 can be a glass cover plate 140. This design is not only used for the glass cover plate 140 of the display screen, but can also be a cover plate 140 made of any other material, for example, it can also be a battery cover plate 140 on the back of the whole machine or various parts such as a decorative panel or the like that need to be shock-resistant and drop-resistant.

[0117] In a possible application, the electronic device may be a mobile phone, a tablet computer, an e-book, a smart wearable device, etc.

[0118] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0119] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: Frame; An elastic support member, arranged on the frame; A panel, wherein a portion of the elastic support member is located between the panel and the frame; a cover plate, the cover plate being located on a side of the panel away from the elastic support member; The colloid is arranged on the elastic support member, and a part of the colloid is located between the edge of the cover plate and the elastic support member.

2. The electronic device according to claim 1, characterized in that: The colloid includes a caulking glue, a first portion of the caulking glue is located between the side of the cover plate and the frame, a second portion of the caulking glue is located between the edge of the cover plate and the elastic support member, and the caulking glue and the panel are spaced apart.

3. The electronic device according to claim 2, characterized in that: The elastic support member comprises: a first supporting portion, wherein the second portion is located between the cover plate and the first supporting portion; A second supporting portion, a gap is formed between the first supporting portion and the second supporting portion, a portion of the panel is located between the cover plate and the second supporting portion, and another portion of the panel is arranged opposite to the gap.

4. The electronic device according to claim 3, characterized in that: The colloid also includes: The supporting colloid is filled between the caulking glue and the panel, and is filled in the gap.

5. The electronic device according to claim 3, characterized in that: The elastic coefficient of the first supporting portion is smaller than the elastic coefficient of the second supporting portion.

6. The electronic device according to claim 2, characterized in that: The third portion of the caulking adhesive is located between the side of the elastic support member and the frame.

7. The electronic device according to claim 1, characterized in that: The colloid is in contact with the panel, a part of the colloid extends between the panel and the elastic support member, and the bottom surface of the colloid and the bottom surface of the panel are in smooth transition.

8. The electronic device according to any one of claims 1 to 7, characterized in that: The frame comprises: A first frame; The second frame is located in the first frame. The hardness of the second frame is less than that of the first frame. The second frame is arranged between the colloid and the first frame.

9. The electronic device according to claim 8, characterized in that: A portion of the second frame extends to the bottom of the elastic supporting member.

10. The electronic device according to any one of claims 1 to 7, characterized in that: The electronic device further comprises: A support member is connected to the frame, and is used to support the cover plate. The cover plate is provided with a corner portion, and the corner portion is located between two adjacent side edges of the cover plate. The support member and the corner portion are staggered.