Processing method of optical waveguide chip, chip, assembly process and device

Abstract

The invention particularly relates to a processing method of an optical waveguide chip, a chip, an assembly process and a device, and the processing method comprises the steps: S10, processing a waveguide region with an optical waveguide inside through a three-dimensional laser direct writing technology, and enabling the waveguide region to extend outwards with a first junction point at one end of the optical waveguide as a reference to form a passive coupling region; s20, setting a Mark point by taking the first connecting point as a positioning reference; and S30, based on the positioning of the Mark point, machining a passive coupling V groove on the surface of the passive coupling area. The three-dimensional laser direct writing technology and the high-precision machining technology are integrated through the effect of the Mark points, the optical waveguide chip capable of being in passive butt joint coupling with a common single-mode optical fiber is prepared, the coupling complexity of a multi-core optical fiber and the common single-mode optical fiber is reduced, and the application compatibility of the multi-core optical fiber is further improved.

Description

Technical Field

[0001] The present invention relates to the field of optical communication technology, and in particular to a processing method of an optical waveguide chip, a chip and an assembly process and a device. Background Art

[0002] With the development of applications such as 5G, AIGC, and cloud computing, the demand for optical fiber transmission capacity in computer networks is also increasing. Since the transmission capacity of ordinary single-mode optical fiber is limited by the nonlinear Shannon limit (the maximum theoretical capacity of optical cable), the growth of optical network capacity is limited. Multi-core optical fiber with space division multiplexing technology is expected to become the best choice to break through the nonlinear Shannon limit. Multi-core optical fiber can integrate multiple optical channels into one optical fiber. It has the advantages of high integration and large transmission capacity, and is expected to solve the problem of future optical communication capacity expansion. For example, the common 4-core MCF optical fiber, that is, four "cores" are integrated in an optical fiber with a diameter of only 125 microns, which greatly increases the transmission capacity of the optical fiber while reducing the cost per bit. However, the application of multi-core optical fiber requires solving the problem of how to connect multi-core optical fiber with ordinary single-core optical fiber.

[0003] In addition, the currently popular AI parallel computing requires the use of parallel fiber optic transceiver modules. Taking the 400G DR4 optical module as an example, the 400G DR4 data center cabling solution In the data center cabling, 400G DR4 usually uses MPO / MTP fiber optic jumpers, specifically using 8-core single-mode fiber optic jumpers to achieve a transmission distance of 500 meters. The cabling solution includes the core layer and the leaf layer. The core layer uses a 400G DR4 interface spine switch, and the leaf layer uses a 100G DR switch, using a single-mode ultra-low loss Base8 MTP connection. A single 400G module requires eight fiber optic cabling channels. Taking Chat GPT as an example, 100,000 400G DR4 / 800G DR8 modules are required to support its computing power. The number of fiber optic cabling between switches is huge, which is also a challenge for cabling design and operation and maintenance. Summary of the invention

[0004] In view of the technical problems in the prior art such as long wiring time and high operation and maintenance costs caused by the huge number of optical fiber wiring in data centers and AI switches, the present invention provides a processing method for an optical waveguide chip, a chip and an assembly process and a device for realizing fast plug-in and unplugging of multi-core optical fibers and ordinary single-mode optical fibers, which greatly reduces the number of wirings, makes the layout of data centers and AI switches simpler, and reduces the operation and maintenance costs.

[0005] First aspect The present invention provides a method for processing an optical waveguide chip, comprising: S10, processing a waveguide region having an optical waveguide therein by a three-dimensional laser direct writing technology, and extending outwards based on a first connection point at one end of the optical waveguide to form a passive coupling region; S20, setting a Mark point with the first connection point as a positioning reference; S30, based on the positioning of the Mark point, a passive coupling V-groove is machined on the surface of the passive coupling area.

[0006] Specifically, one of the main concepts of the present invention is to utilize the role of Mark points to integrate three-dimensional laser direct writing technology with high-precision machining technology to prepare an optical waveguide chip that can be passively docked with ordinary single-mode optical fibers, thereby reducing the coupling complexity between multi-core optical fibers and ordinary single-mode optical fibers and further improving the application compatibility of multi-core optical fibers.

[0007] Furthermore, step S10 includes: S11. Further extending the side end of the passive coupling region outward to form a supporting region lower than the passive coupling region.

[0008] Second aspect The present invention provides an optical waveguide chip, which is processed by the optical waveguide chip processing method provided by any possible embodiment of the first aspect, comprising: The waveguide region and the passive coupling region are integrally formed; The waveguide region includes a plurality of groups of optical waveguides; toward the side end of the passive coupling region, the optical waveguides are arranged side by side and expose the first connection point, and the optical waveguides at the other side end are arranged in a ring shape and expose the second connection point; The passive coupling region includes a first step surface, and the first step surface includes a plurality of groups of passive coupling V-grooves arranged side by side, and the passive coupling V-grooves are spatially aligned with the first connection point.

[0009] Specifically, the optical waveguide chip is manufactured based on three-dimensional laser direct writing technology and high-precision machining, so that the machining error between the geometric center of the first connection point and the geometric center of the passive coupling V-groove is extremely small, thereby enabling ordinary single-mode optical fiber to be directly coupled to the first connection point of the optical waveguide through the passive coupling V-groove.

[0010] Furthermore, the optical waveguide chip includes a supporting area, and the supporting area is arranged at a side end of the passive coupling area; The supporting area includes a second step surface, and the horizontal plane of the second step surface is lower than the horizontal plane of the first step surface.

[0011] Specifically, the second step surface of the supporting area is used to protect the common single-mode optical fiber engaged in the passive coupling V-groove and limit the movement of the common optical fiber to improve the reliability of the passive coupling between the single-mode optical fiber and the optical waveguide.

[0012] Furthermore, the alignment error between the geometric center of the first connection point and the geometric center of the passive coupling V-groove is ≤0.5um.

[0013] The third aspect The present invention provides an assembly process based on an optical waveguide chip, which is used for an optical waveguide chip as provided in any possible embodiment of the second aspect, comprising: S100, stripping one side end of the single-mode optical fiber to expose the fiber core, and engaging the fiber core to the passive coupling V-groove; S200, applying adhesive between the fiber core and the passive coupling V-groove, and then covering with a cover plate.

[0014] Further, including: after S200, including: S300, polishing the other side end of the single-mode optical fiber at different preset angles to form a transmitting end optical fiber or a receiving end optical fiber respectively; S400, actively coupling the adapting capillary component to the second connection point, and fixing it after the coupling is completed.

[0015] Specifically, through steps S100 to S400, the optical waveguide chips are assembled into a FA component (Fiber Array), which can be applicable to various application scenarios of interconnecting multi-core optical fibers with single-mode optical fibers.

[0016] Furthermore, step S400 includes: S410, fixing the optical waveguide chip to a coupling platform, and detecting the optical power at the other end of the single-mode optical fiber; S420, fixing the adapting capillary component to the coupling platform with a loading accuracy within 3°; S430, traversing and moving the capillary at the side end of the waveguide region with a preset movement step length, and completing the rough alignment when the optical power meets the coupling threshold; the movement step length refers to the movement step length given within the XY plane range of the side end of the waveguide region away from the passive coupling region; S440, fine-tuning the coupling stage so that the optical power of the second connection point reaches an optimal value; S450, taking the annular center of the second connection point as a reference, continuously rotating the capillary at a first preset angle, and completing the coarse coupling when the optical powers of one second connection point and another second connection point adjacent to it both reach the optimal value; S460, continuously rotating the capillary at a second preset angle, and when the optical powers of one second connection point and another second connection point arranged relative thereto both reach the optimal value, the fine-tuning coupling is completed.

[0017] Specifically, another main concept of the present invention is to improve the coupling accuracy between the multi-core optical fiber and the single-mode optical fiber and reduce the coupling insertion loss through the above-mentioned coupling method.

[0018] The fourth aspect The present invention provides a device based on an optical waveguide chip, which is prepared by an assembly process based on an optical waveguide chip as provided in any possible embodiment of the third aspect, comprising: an optical waveguide chip, an adapting capillary component coupled to the optical waveguide chip, a single-mode optical fiber with a passive coupling V-groove fixed to the optical waveguide chip, a transmitting end component, a receiving end component and a substrate; The optical waveguide chip, the transmitting end component and the receiving end component are all arranged on the substrate; The single-mode optical fiber processed into a transmitting end optical fiber is connected to the transmitting end component; The single-mode optical fiber processed into a receiving-end optical fiber is connected to the receiving-end component.

[0019] Specifically, the above components form a pluggable silicon photonic engine, which can be applied to data centers and AI computing, reducing the wiring complexity and operation and maintenance costs of data centers and AI computing.

[0020] Furthermore, the device comprises: a bottom shell, a housing forming a receiving cavity with the bottom shell, and an optical fiber connector; The substrate is mounted on the bottom shell and accommodated in the accommodating cavity; The optical fiber connector is connected to the adapter of the matching capillary component.

[0021] In summary, the present invention provides a method for processing an optical waveguide chip, a chip and an assembly process and a device, which have at least the following advantages: 1. The present invention integrates the three-dimensional laser direct writing technology and the high-precision machining technology by utilizing the function of the Mark point, and prepares an optical waveguide chip that can be passively coupled with an ordinary single-mode optical fiber, thereby reducing the coupling complexity between the multi-core optical fiber and the ordinary single-mode optical fiber, and further improving the application compatibility of the multi-core optical fiber; 2. The optical waveguide chip of the present invention includes a supporting area, and the second step surface of the supporting area is used to protect the common single-mode optical fiber engaged in the passive coupling V-groove and limit the movement of the common optical fiber, so as to improve the reliability of the passive coupling between the single-mode optical fiber and the optical waveguide; 3. The present invention provides a pluggable silicon optical engine, which can be applied to data centers and AI computing, reducing the wiring complexity and operation and maintenance costs of data centers and AI computing. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention will be further described in detail below in conjunction with the accompanying drawings and preferred embodiments, but those skilled in the art will appreciate that these drawings are drawn only for the purpose of explaining the preferred embodiments and therefore should not be used as a limitation on the scope of the present invention. In addition, unless otherwise specified, the drawings are only schematically representing the composition or structure of the described objects and may contain exaggerated displays, and the drawings are not necessarily drawn to scale.

[0023] Figure 1 A schematic flow chart of a method for processing an optical waveguide chip provided by one embodiment of the present invention; Figure 2 A schematic structural diagram of an optical waveguide chip provided by an embodiment of the present invention; Figure 3 A schematic diagram of a process flow of an optical waveguide chip assembly process provided by an embodiment of the present invention; Figure 4 A schematic diagram of a process flow of an assembly process based on an optical waveguide chip provided by another embodiment of the present invention; Figure 5 A schematic structural diagram of a device based on an optical waveguide chip provided by an embodiment of the present invention; Figure 6 A schematic diagram of the end face structure of an eight-core optical fiber provided by an embodiment of the present invention; Figure 7 A schematic structural diagram of a device based on an optical waveguide chip provided by another embodiment of the present invention; Figure 8 A schematic structural diagram of a device based on an optical waveguide chip provided by another embodiment of the present invention; Fig. 9 A schematic diagram of the structure of a data center provided by an embodiment of the present invention; 1. Optical waveguide chip; 2. Mark point; 3. Adaptive capillary component; 4. Cover plate; 5. Transmitter component; 6. Receiver component; 7. Substrate; 8. Electrical port; 9. Silicon photonic driver chip; 10. Silicon photonic chip; 11. Coupling optical path; 12. Photodetector; 13. Bottom shell; 14. Shell; 15. Accommodation cavity; 16. Optical fiber connector; 18. Single-mode optical fiber; 101. Waveguide area; 102. Passive coupling area; 103 , supporting area; 101a, optical waveguide; 101b, first connection point; 101c, second connection point; 21, passive coupling V-groove; 31, adapter; 32, multi-core optical fiber; 33, capillary; 321, first fiber core; 322, second fiber core; 323, third fiber core; 324, fourth fiber core; 325, fifth fiber core; 326, sixth fiber core; 327, seventh fiber core; 328, eighth fiber core; 329, cladding material. DETAILED DESCRIPTION

[0024] The following is combined with Figures 1 to 9 , the present invention is described in detail.

[0025] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0026] The main idea of ​​the present invention is to integrate the waveguide area 101 and the passive coupling area 102 of the optical waveguide chip 1 into one, and under the positioning effect of the Mark point 2, combine mechanical processing with three-dimensional laser direct writing technology, so that the geometric center error between the passive coupling V-groove 21 and the optical waveguide 101a is minimized, and then the single-mode optical fiber 18 can be directly placed into the passive coupling V-groove 21 to complete the passive coupling of the single-mode optical fiber 18 and the optical waveguide 101a, thereby reducing the complexity of the transfer from the multi-core optical fiber 32 to the single-mode optical fiber 18 and improving the efficiency of production and assembly. Furthermore, based on the above technical concept, the optical waveguide chip 1 provided by the present invention can be applied to data centers and AI parallel computing, and is used to reduce the wiring complexity of data centers and AI parallel computing and reduce operation and maintenance costs.

[0027] See also Figure 1 FIG. 1 is a schematic flow chart of a method for processing an optical waveguide chip provided in accordance with an embodiment of the present invention. Example 1

[0028] First, the waveguide region 101 having the optical waveguide 101a inside is processed by the three-dimensional laser direct writing technology through step S10, and the passive coupling region 102 is extended outwardly based on the first connection point 101b at one end of the optical waveguide 101a, that is, the waveguide region 101 having the optical waveguide 101a inside and the passive coupling region 102 extending outward are directly processed by the laser direct writing technology in one piece; then, the Mark point 2 is set based on the first connection point 101b as the positioning reference through step S20; finally, the passive coupling V-groove 21 is mechanically processed on the surface of the passive coupling region 102 based on the positioning of the Mark point 2 through step S30.

[0029] Since the waveguide area 101 and the passive coupling area 102 are integrally formed by three-dimensional laser direct writing technology, they have good consistency, and under the marking effect of Mark point 2, the passive coupling V-groove 21 is processed by mechanical processing technology. Since Mark point 2 is based on the first connection point 101b at one side end of the optical waveguide 101a, the geometric center of the optical waveguide 101a and the geometric center of the passive coupling V-groove 21 can be controlled within a very small error, thereby realizing the passive coupling of the single-mode optical fiber 18 with the optical waveguide 101a through the passive coupling V-groove 21. Example 2

[0030] In step S10 , through step S11 , the side end of the passive coupling region 102 is further extended outward to form a supporting region 103 lower than the passive coupling region 102 .

[0031] Specifically, although the single-mode optical fiber 18 is passively coupled with the optical waveguide 101a through the passive coupling V-groove 21, since the single-mode optical fiber 18 is coupled to the passive coupling V-groove 21 through its core, it is necessary to expose the core of the single-mode optical fiber 18 at the passive coupling V-groove 21, so that its coupling accuracy and the integrity of the cladding material 329 may be affected by the rotation of the single-mode optical fiber 18, and the supporting area 103 can solve the interference of the above problem.

[0032] For further information, see Figure 2 FIG. 1 is a schematic structural diagram of an optical waveguide chip provided in accordance with an embodiment of the present invention. Example 3

[0033] The optical waveguide chip 1 includes an integrally formed waveguide region 101 and a passive coupling region 102. The waveguide region 101 includes a plurality of optical waveguides 101a. The optical waveguides 101a are arranged side by side at the side end close to the passive coupling region 102, and expose the first connection point 101b for docking with the single-mode optical fiber 18. The other side ends of the plurality of optical waveguides 101a are arranged in a ring shape, and expose the second connection point 101c for docking with the multi-core optical fiber 32. The passive coupling region 102 includes a first step surface, the geometric center of the first step surface and the first connection point 101b are in the same horizontal plane, and a plurality of passive coupling V-grooves 21 are arranged thereon, and the passive coupling V-grooves 21 are spatially aligned with the first connection point 101b.

[0034] The optical waveguides 101a of the optical waveguide chip 1 can be 4 groups, 5 groups, 6 groups, 7 groups, 8 groups, etc., to adapt to multi-core optical fibers 32 of different specifications on the market. It is worth noting that the present invention takes 8 groups of optical waveguides 101a as an example to adapt to 8 cores, and the following is an example of 8 groups of optical waveguides 101a. Example 4

[0035] On the basis of Example 3, a supporting area 103 is further provided at the side end of the passive coupling V-groove 21, and the supporting area 103 is used to support the core of the single-mode optical fiber 18 close to the passive coupling V-groove 21, so as to achieve the transition between the core segment and the optical fiber segment of the single-mode optical fiber 18. It is worth explaining that the second step surface of the supporting area 103 is lower than the first step surface, so as to support the cladding material 329 of the single-mode optical fiber 18, thereby improving the reliability of the optical waveguide chip 1.

[0036] For further information, see Figure 3 FIG. 1 is a schematic diagram of a process flow of an optical waveguide chip assembly process according to an embodiment of the present invention. Example 5

[0037] First, through step S100, one side end of the single-mode optical fiber 18 is stripped to expose the core, and the core is engaged with the passive coupling V-groove 21 to complete the passive coupling of the single-mode optical fiber 18 and the optical waveguide 101a; then through step S200, adhesive is applied between the core and the passive coupling V-groove 21, and then the cover plate 4 is covered to harden and fix the single-mode optical fiber 18 placed in the passive coupling V-groove 21.

[0038] Optionally, in an application scenario where the optical waveguide chip 1 has a supporting area 103 , after the single-mode optical fiber 18 is hardened and fixed by the cover plate 4 , a protective coating is applied to the second step surface of the supporting area 103 to provide transitional protection for the single-mode optical fiber 18 . Example 6

[0039] After step S200 , step S210 is performed to apply a curing agent between the cladding material 329 of the single-mode optical fiber 18 and the supporting area 103 for transition between the core segment and the optical fiber segment of the single-mode optical fiber 18 . Example 7

[0040] After step S200 or step S210, step S300 is performed to polish the other side of the single-mode optical fiber 18 at different preset angles to form a transmitting end optical fiber and a receiving end optical fiber, respectively, to respectively adapt to the transmitting end component 5 and the receiving end component 6, and finally step S400 is performed to actively couple the adapting capillary component 3 to the second connection point 101c of the plurality of optical waveguides 101a, and fix them after the coupling is completed. Thus, the manufacturing of the FA component based on the optical waveguide chip 1 provided by the present invention is completed.

[0041] Optionally, the assembly steps of the adapter capillary component 3 are as follows: the two ends of the 8-core optical fiber are respectively passed through the internal core of the adapter 31 and the capillary 33 according to the designed angle direction, and then the end faces are ground and polished, and then the fixed structural parts are assembled to complete the preparation of the adapter capillary component 3.

[0042] Optionally, the transmitting end optical fiber is obtained by 0° polishing, and the receiving end optical fiber is obtained by 42.5° polishing.

[0043] For further information, see Figure 4 FIG. 1 is a schematic flow chart of an assembly process based on an optical waveguide chip provided by yet another embodiment of the present invention. Example 8

[0044] The step S400 includes: firstly, through step S410, fixing the optical waveguide chip 1 to the coupling platform, and detecting the optical power at the other end of the single-mode optical fiber 18; then, through step S420, fixing the adaptor capillary component 3 to the coupling platform with a loading accuracy within 3°, completing the preparation work before coupling the multi-core optical fiber 32 with the optical waveguide chip 1; and then, through step S430, traversing and moving the capillary 33 at the side end of the waveguide region 101 (the end where the second connection point 101c is located) with a preset movement step length, and completing the rough alignment when the optical power meets the coupling threshold; the movement step length refers to a given movement within the XY plane range of the side end of the waveguide region away from the passive coupling region. step length; then through step S440, the coupling stage is finely adjusted so that the optical power of the second connection point 101c reaches the optimal value; then through step S450, the capillary 33 is continuously rotated at a first preset angle with the annular center of the second connection point 101c as a reference, and when the optical powers of the second connection point 101c and another second connection point 101c adjacent to it reach the optimal value, the coarse adjustment coupling is completed; finally, through step S460, the capillary 33 is continuously rotated at a second preset angle, and when the optical powers of the second connection point 101c and another second connection point 101c arranged relative to it reach the optimal value, the fine adjustment coupling is completed.

[0045] Specifically, through the above coupling process, the coupling accuracy between the 8-core optical fiber and the optical waveguide chip 1 can be optimized.

[0046] Optionally, the input light power is 0dmb and the coupling threshold is -25dmb.

[0047] Optionally, the first preset angle is 0.1°.

[0048] Optionally, the second preset angle is 0.02°.

[0049] Further, after step 460, the following steps are included: S470 , detecting the insertion loss of the multi-core optical fiber 32 , and when the insertion loss is less than or equal to the insertion loss threshold, completing the coupling between the multi-core optical fiber 32 and the optical waveguide chip 1 .

[0050] Optionally, the insertion loss threshold is 0.5dB.

[0051] Optionally, the capillary 33 and the optical waveguide chip 1 are first pre-fixed by UV glue and then reinforced by structural glue.

[0052] For further information, see Figure 5 FIG. 1 is a schematic structural diagram of a device based on an optical waveguide chip 1 provided in one embodiment of the present invention. Example 9

[0053] The present invention provides an FA component based on an optical waveguide chip 1, which comprises an adapting capillary component 3, an optical waveguide chip 1, a single-mode optical fiber 18, a receiving end component 6 and a transmitting end component 5 in sequence. The adapting capillary component 3 is actively coupled to the optical waveguide chip 1 through the assembly process provided in Example 7, and is fixed to the passive coupling V-groove 21 through the hardened glue and the cover plate 4. The single-mode optical fiber 18 is passively coupled to the optical waveguide chip 1 through the assembly process provided in Example 5 or Example 6, and the single-mode optical fiber 18 is polished into a transmitting end optical fiber and a receiving end optical fiber respectively through the assembly process provided in Example 7, so as to be connected to the transmitting end component 5 and the receiving end component 6 respectively, thereby forming a complete FA component.

[0054] The adapting capillary component 3 includes a multi-core optical fiber 32 and an adapter 31 and a capillary 33 respectively arranged at both sides of the multi-core optical fiber 32 . The adapter 31 is used to adapt to an external interface, and the capillary 33 is used to couple and dock with the optical waveguide chip 1 .

[0055] For further information, see Figure 6 FIG. 4 is a schematic diagram of the end face structure of an eight-core optical fiber provided in accordance with an embodiment of the present invention.

[0056] To further understand Example 8, the 8-core optical fiber (multi-core optical fiber 32) includes a first fiber core 321, a second fiber core 322, a third fiber core 323, a fourth fiber core 324, a fifth fiber core 325, a sixth fiber core 326, a seventh fiber core 327, an eighth fiber core 328 and a cladding material 329 for covering the fiber cores. During the active coupling process of the capillary 33 and the optical waveguide chip 1, the first fiber core 321 is first optimally coupled with a second connection point 101c, that is, the fine adjustment in step S440 is completed, and then the first preset angle is rotated until the first fiber core 321 and a second connection point 101c, and the second fiber core 322 or the eighth fiber core 328 and another second connection point 101c are optimally coupled, that is, the coarse adjustment coupling in step S450 is completed, and then the second preset angle is rotated until the first fiber core 321 and a second connection point 101c, and the fifth fiber core 325 or the sixth fiber core 326 opposite to the first fiber core 321 and another second connection point 101c are optimally coupled, that is, the fine adjustment coupling in step S460 is completed.

[0057] For further information, see Figure 7 FIG. 1 is a schematic structural diagram of a device based on an optical waveguide chip 1 provided in yet another embodiment of the present invention. Example 10

[0058] Based on Example 9, the present invention further provides a pluggable silicon photonic chip 10 engine, including a substrate 7 for providing installation of various components, the substrate 7 is used for installing the adapter capillary component 3, the optical waveguide chip 1, the silicon photonic driver chip 9, the silicon photonic chip 10, the coupling optical path 11, the photodetector 12, the transmitting end component 5 and the receiving end component 6, and is powered through the electrical port 8 set on the end side of the substrate 7.

[0059] Optionally, the working principle of the transmitting end is as follows: four-channel 4×100Gbps PAM4 electrical signals enter the silicon photonic driver chip 9 from the electrical port 8, the signal amplitude is amplified and loaded on the silicon photonic chip 10, the silicon photonic coupling optical path 11 is responsible for inputting continuous laser to the silicon photonic chip 10, the silicon photonic chip 10 converts the 4×100Gbps PAM4 electrical signals into 4×100Gbps PAM4 optical signals, enters the four optical fiber channels of the 0-degree polished end face transmitting end optical fiber, the 4-channel optical signals enter the multi-core optical fiber 32 through the optical waveguide chip 1, and the optical signals are output from the adapter 31 of the multi-core optical fiber 32.

[0060] The working principle of the receiving end is as follows: the external optical signal 4×100Gbps PAM4 enters the optical waveguide chip 1 from the optical fiber connector 16 and fans out into 4 parallel optical signals, and enters the photodetector 12 through the receiving end optical fiber with a 42.5-degree polished end face. The photodetector 12 converts the optical signal into an amplified 4×100Gbps PAM4 voltage signal and outputs it to the electrical port 8.

[0061] For further information, see Figure 8 FIG. 1 is a schematic structural diagram of a device based on an optical waveguide chip 1 provided in another embodiment of the present invention. Embodiment 11

[0062] On the basis of Example 10, the present invention further provides a silicon photonic module, including a bottom shell 13, an outer shell 14, and a receiving cavity 15 and an optical fiber connector 16 between the bottom shell 13 and the outer shell 14. The silicon photonic chip 10 engine is received in the receiving cavity 15 by arranging the substrate 7 in the bottom shell 13, and the optical fiber connector 16 is connected to the adapter 31. The silicon photonic module provided by the present invention can be used for wiring of data centers and AI parallel computing.

[0063] For further information, see Fig. 9 Shown is a structural schematic diagram of a data center provided by an embodiment of the present invention. Example 12

[0064] The data center includes spine switches, leaf switches and servers. The spine switches and leaf switches are wired through the silicon photonic modules provided in the embodiment, which can greatly reduce the wiring complexity between the two and further reduce the operation and maintenance costs of the data center.

[0065] Specifically, for the transmission of single-wavelength 100Gbps optical signals, when the transmission distance between the spine switch and the leaf switch exceeds 100 meters, the optical fiber wiring between the two needs to use single-mode optical fiber 18. For AI artificial intelligence parallel computing applications, the transmission of 400G signals requires the use of parallel eight-channel single-mode optical fibers 18 for 4-channel signal transmission and 4-channel signal reception. The silicon photonic module provided by the present invention can well complete the conversion of 8-core optical fibers to parallel eight-channel single-mode optical fibers 18, and realize 4-channel signal transmission and 4-channel signal reception, thereby simplifying the wiring of the spine switches and leaf switches in the above-mentioned application scenarios and reducing operation and maintenance costs.

[0066] The present invention is described in detail above. The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the present invention and its core ideas. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present invention, the present invention can also be improved and modified in a number of ways, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A method for processing an optical waveguide chip, characterized in that: include: S10, processing a waveguide region (101) having an optical waveguide therein by means of a three-dimensional laser direct writing technique, and extending outwards based on a first connection point (101b) at one end of the optical waveguide to form a passive coupling region (102); S20, using the first connection point (101b) as a positioning reference, setting a Mark point (2); S30, based on the positioning of the Mark point (2), a passive coupling V-groove (21) is machined on the surface of the passive coupling region (102).

2. A method for processing an optical waveguide chip as claimed in claim 1, characterized in that: Before step S20, the method further includes: S11. Further extending the side end of the passive coupling region (102) outward to form a supporting region (103) lower than the passive coupling region (102).

3. An optical waveguide chip, characterized in that: The optical waveguide chip (1) is processed by the processing method of claim 1, wherein the optical waveguide chip (1) comprises: The waveguide region (101) and the passive coupling region (102) are integrally formed; The waveguide region (101) comprises a plurality of groups of optical waveguides (101a) inside; towards the side end of the passive coupling region (102), the optical waveguides (101a) are arranged side by side and expose the first connection point (101b); and at the other side end, the optical waveguides (101a) are arranged in a ring shape and expose the second connection point (101c); The passive coupling region (102) comprises a first step surface, the first step surface comprises a plurality of groups of passive coupling V-grooves (21) arranged side by side, and the passive coupling V-grooves (21) are spatially aligned with the first connection point (101b).

4. An optical waveguide chip as claimed in claim 3, characterized in that: The optical waveguide chip (1) comprises a supporting region (103), wherein the supporting region (103) and the passive coupling region (102) are integrally formed; the passive coupling region (102) is located between the waveguide region (101) and the supporting region (103); The supporting area (103) comprises a second step surface, and the horizontal plane of the second step surface is lower than the horizontal plane of the first step surface.

5. An optical waveguide chip as claimed in claim 3, characterized in that: The alignment error between the geometric center of the first connection point (101b) and the geometric center of the passive coupling V-groove (21) is ≤0.5um.

6. An assembly process based on an optical waveguide chip, characterized in that: An optical waveguide chip as claimed in any one of claims 3 to 5, comprising: S100, stripping one side end of the single-mode optical fiber (18) to expose the fiber core, and engaging the fiber core with the passive coupling V-groove (21); S200, applying adhesive between the fiber core and the passive coupling V-groove (21), and then covering with a cover plate (4).

7. An assembly process based on an optical waveguide chip as claimed in claim 6, characterized in that: After step S200, the method further includes: S300, polishing the other side end of the single-mode optical fiber (18) at different preset angles to form a transmitting end optical fiber and a receiving end optical fiber respectively; S400, actively coupling the adapting capillary component (3) to the second connection point (101c) of each of the optical waveguides (101a), and fixing it after the coupling is completed.

8. The optical waveguide chip assembly process according to claim 7, characterized in that: Step S400 includes: S410, fixing the optical waveguide chip (1) to a coupling platform, and detecting the optical power at the other end of the single-mode optical fiber (18); S420, fixing the adapting capillary component (3) to the coupling platform with a loading accuracy within 3°; S430, traversing the moving capillary (33) at the side end of the waveguide region (101) with a preset movement step length, and completing the rough alignment when the optical power meets the coupling threshold; the movement step length refers to a movement step length given within the XY plane range of the side end of the waveguide region (101) away from the passive coupling region; S440, fine-tuning the coupling stage so that the optical power of the second connection point (101c) reaches an optimal value; S450, taking the annular center of the second connection point (101c) as a reference, continuously rotating the capillary (33) at a first preset angle, and completing the coarse coupling when the optical powers of one second connection point (101c) and another adjacent second connection point (101c) both reach the optimal value; S460, continuously rotating the capillary (33) at a second preset angle, and when the optical powers of one second connection point (101c) and another second connection point (101c) arranged opposite thereto both reach the optimal value, the fine-tuning coupling is completed.

9. A device based on an optical waveguide chip, characterized in that: Prepared by an assembly process based on an optical waveguide chip (1) as claimed in any one of claims 6 to 8, comprising: an optical waveguide chip (1), an adapting capillary component (3) coupled to the optical waveguide chip (1), a single-mode optical fiber (18) fixed to a passive coupling V-groove (21) of the optical waveguide chip (1), a transmitting end component (5), a receiving end component (6) and a substrate (7); The optical waveguide chip (1), the transmitting end component (5) and the receiving end component (6) are all arranged on the substrate (7); The single-mode optical fiber (18) processed into a transmitting end optical fiber is connected to the transmitting end component (5); The single-mode optical fiber (18) processed into a receiving-end optical fiber is connected to the receiving-end component (6).

10. The device based on an optical waveguide chip according to claim 9, characterized in that: Also includes: A bottom shell (13), an outer shell (14) forming a receiving cavity (15) with the bottom shell (13), and an optical fiber connector (16); The substrate (7) is mounted on the bottom shell (13) and accommodated in the accommodating cavity (15); The optical fiber connector (16) is connected to the adapter (31) of the adapting capillary component (3).

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