Electronic device, connection structure, and cable

Abstract

The embodiment of the invention provides electronic equipment, a connecting structure and a cable. The electronic equipment comprises a first function module, a second function module and a connecting structure. The connecting structure comprises a cable, and a first connector and a second connector which are connected to two ends of the cable. The first connector is connected with the first function module, and the second connector is connected with the second function module. The cable comprises a fixing part, a plurality of cable cores and a low-loss part. The fixing part wraps the low-loss part and the plurality of cable cores. The plurality of cable cores comprise a signal cable core pair, the signal cable core pair comprises two signal cable cores which are arranged at intervals, the low-loss part is located between the two signal cable cores which are arranged at intervals in the signal cable core pair, and the dielectric constant of the low-loss part is smaller than that of the fixed part. According to the embodiment of the invention, the integrated arrangement of a plurality of cable cores can be realized, and the loss of signals during transmission on the cable can be reduced.

Description

Technical Field

[0001] The present application relates to the field of server technology, and in particular to an electronic device, a connection structure and a cable. Background Art

[0002] Electronic devices usually require multiple cables to interconnect different functional modules. A large number of cables will increase the difficulty of maintaining electronic devices. In addition, multiple cables occupy a large space in the housing of the electronic device, affecting the space utilization rate in the housing. In addition, a large number of cables will hinder the flow of air in the housing of the electronic device, thereby affecting the heat dissipation of the electronic device. Summary of the invention

[0003] The embodiments of the present application provide an electronic device, a connection structure and a cable, which are used to reduce the space occupied by the cable in the electronic device, reduce the difficulty of maintaining the electronic device, improve the space utilization in the housing of the electronic device, and reduce the impact of the cable on the heat dissipation of the electronic device.

[0004] The embodiments of the present application provide the following technical solutions:

[0005] On the one hand, the electronic device includes a first functional module, a second functional module and a connection structure. The connection structure includes a cable and a first connector and a second connector connected at both ends of the cable. The first connector connects the first functional module, and the second connector connects the second functional module. The cable includes a fixed portion, a plurality of cable cores and a low-loss portion, and the fixed portion covers the low-loss portion and the plurality of cable cores. The plurality of cable cores include a signal cable core pair, the signal cable core pair includes two signal cable cores spaced apart, the low-loss portion is located between the two signal cable cores spaced apart in the signal cable core pair, and the dielectric constant of the low-loss portion is less than the dielectric constant of the fixed portion.

[0006] In the embodiment of the present application, a fixing portion is provided to cover a plurality of cable cores, so that the plurality of cable cores can be integrated. Compared with a single-core cable formed by a separate sheath of each cable core, the integrated arrangement of the plurality of cable cores can reduce the number of cables, reduce the difficulty of maintaining the electronic device, and reduce the space occupied by the cables in the housing, thereby improving the space utilization rate in the housing. In addition, it can also reduce the obstruction of the air flow in the housing caused by the cables, which is beneficial to the heat dissipation of the electronic device.

[0007] In addition, the fixed part also covers the low-loss part and multiple cable cores, which can reduce the risk of relative movement between the low-loss part and the multiple cable cores. The low-loss part is arranged between two signal cable cores arranged at intervals in the center of the signal cable core pair, which can reduce the loss of the signal when it is transmitted on the signal cable core, improve signal integrity (SI), support the evolution of the signal to a higher transmission rate, and do not need to change the wire body or material of the cable core, etc., thereby improving the convenience of cable production and reducing costs.

[0008] The connection structure provided by the embodiment of the present application has a higher degree of integration than a single-core cable formed by separate cladding of each cable core, and has a lower loss than a flexible printed circuit board (FPC). That is, the connection structure provided by the embodiment of the present application can take into account the characteristics of high density and low loss. In addition, the fixing portion can include a flexible glue so that the cable can be a flexible structure, improve the flexibility of the relative position between the two components connected by the connection structure, and meet different needs.

[0009] In addition, the connection structure is connected to the first functional module through the first connector and connected to the second functional module through the second connector, which improves the convenience of electrically connecting the connection structure and the functional modules.

[0010] In some possible implementations, the low-loss portion includes a gaseous low-loss medium. This arrangement can reduce the weight of the connection structure and reduce the cost of the connection structure.

[0011] In some possible implementations, the cable includes a hollow tube, and the fixed part covers the hollow tube. The extension direction of the hollow tube is the same as the extension direction of the cable core. The hollow tube encloses a first accommodating space, and the first accommodating space is used for the gaseous low-loss medium. Such an arrangement enables the fixed part to cover the gaseous low-loss medium in the hollow tube, and it is easy to control the distribution of the gaseous low-loss medium on the fixed part, thereby improving the uniformity of the distribution of the gaseous low-loss medium on the fixed part. The extension direction of the hollow tube is the same as the extension direction of the cable core. Along the extension direction of the cable core, the cable cores at different positions can be arranged adjacent to the gaseous low-loss medium in the hollow tube, thereby reducing the loss of the signal when it is transmitted on the signal cable core and improving the integrity of the signal.

[0012] In some possible implementations, the hollow tube includes at least one of a hollow optical fiber or a hollow plastic. This arrangement can improve the flexibility in selecting the hollow tube.

[0013] In some possible implementations, the cable includes a plurality of hollow beads, and the fixed portion covers the plurality of hollow beads. The plurality of hollow beads are arranged along the extension direction of the cable core. The hollow beads surround a second accommodating space, and the second accommodating space is used to accommodate a gaseous low-loss medium. Such an arrangement enables the fixed portion to cover the gaseous low-loss medium in the hollow beads, and it is easy to control the distribution of the gaseous low-loss medium on the fixed portion, thereby improving the uniformity of the distribution of the gaseous low-loss medium on the fixed portion. The arrangement direction of the plurality of hollow beads is the same as the extension direction of the cable core. Along the extension direction of the cable core, the cable cores at different positions can be arranged adjacent to the gaseous low-loss medium in the hollow beads, thereby reducing the loss of the signal when it is transmitted on the signal cable core and improving the integrity of the signal.

[0014] In some possible implementations, the dielectric constant of the fixed portion is less than or equal to 4, and the dielectric constant of the low-loss portion is less than or equal to 2. This configuration enables the dielectric constants of both the fixed portion and the low-loss portion to be low, thereby reducing the loss of the signal when it is transmitted on the signal cable core and improving the signal integrity.

[0015] In some possible implementations, the material of the fixing portion includes silicone. It is understandable that silicone has lower DK and DF. Setting the fixing portion to include silicone can reduce the loss of high-speed signals when they are transmitted on the signal cable core and improve signal integrity.

[0016] In some possible implementations, the multiple cable cores also include a shielded cable core. Along the arrangement direction of the two signal cable cores spaced apart in the signal cable core pair, the two shielded cable cores are located on both sides of the signal cable core pair. Such an arrangement enables the shielded cable core to shield the signal cable core pair to reduce the crosstalk between the signal cable core pair and other signal cables (such as other signal cable core pairs) and improve the transmission reliability of the signal. The low-loss portion is located between the two signal cable cores spaced apart in the signal cable core pair, and along the arrangement direction of the two signal cable cores spaced apart in the signal cable core pair, at least two shielded cable cores are located on both sides of the signal cable core pair, which can reduce the mutual influence between the low-loss portion and the shielded cable core, so that the cable has the characteristics of low loss and low crosstalk.

[0017] In some possible implementations, the diameter of the shielded cable is greater than the diameter of the signal cable. This arrangement can improve the shielding effect of the shielded cable core, reduce crosstalk between the signal cable core pair and other signal cables (such as other signal cable core pairs), and improve signal transmission reliability.

[0018] In some possible implementations, the number of signal cable core pairs is multiple, and along the arrangement direction of two signal cable cores spaced apart in the signal cable core pair, multiple signal cable core pairs are spaced apart to form a signal cable layer. The cable also includes a first shielding layer, and along the thickness direction of the signal cable layer, the first shielding layer is stacked on at least one side of the signal cable layer and is connected to the fixed portion. The thickness direction of the signal cable layer intersects with the arrangement direction of the two signal cable cores spaced apart in the signal cable core pair. With such a configuration, the first shielding layer can shield the signal cable core pair, reduce the crosstalk generated between the signal cable core pair and other cables (such as other signal cable core pairs), and improve the transmission reliability of the signal.

[0019] In some possible implementations, the cable includes a first signal cable layer and a second signal cable layer, and the first signal cable layer and the second signal cable layer are stacked along the thickness direction of the signal cable layer. The first shielding layer is located between the first signal cable layer and the second signal cable layer that are stacked. Such a configuration can improve the integration of the cable. In addition, the first shielding layer is located between the first signal cable layer and the second signal cable layer that are stacked, which can reduce the crosstalk between the first signal cable layer and the second signal cable layer and improve the transmission reliability of the signal.

[0020] In some possible implementations, along the thickness direction of the signal cable layer, two first shielding layers are stacked on both sides of the signal cable layer. The shielded cable core contacts the two first shielding layers on both sides of the signal cable layer. In this way, the shielded cable core and the first shielding layers can form a shielding space, and the signal cable core pair is enclosed in the shielding space, thereby reducing the crosstalk generated between the signal cable core pair and other signal cables (such as other signal cable core pairs) and improving the transmission reliability of the signal.

[0021] In some possible implementations, the signal cable core pair is used to transmit high-speed differential signals. This arrangement enables high-speed differential signals to be transmitted through cables, without the need to set up two single-core cables to transmit two signals with opposite phases, thereby reducing the number of cables, reducing the difficulty of maintaining electronic equipment, and reducing the space occupied by the cables in the housing, thereby improving the space utilization rate in the housing. In addition, it can also reduce the obstruction of the cable to the air flow in the housing, which is beneficial to the heat dissipation of the electronic equipment. It can also reduce the loss and crosstalk of high-speed differential signals during transmission.

[0022] In some possible implementations, the connector includes a substrate and a gold finger, and a receiving groove is provided on the substrate. The gold finger is embedded in the receiving groove and connected to the substrate. The cable core is electrically connected to the gold finger. Along the thickness direction of the substrate, the cross-sectional shape of the gold finger is a trapezoid; or, the gold finger includes a first sub-part and a second sub-part, the first sub-part and the second sub-part are connected, and the first sub-part is away from the surface of the substrate relative to the second sub-part. Along the direction parallel to the substrate, the length of the first sub-part is greater than the length of the second sub-part. It can be understood that the gold finger is embedded in the receiving groove provided in the substrate, and the cross-sectional shape of the gold finger is a trapezoid, or the gold finger includes a first sub-part and a second sub-part, and the length of the first sub-part is greater than the length of the second sub-part along the direction parallel to the substrate, so that the substrate can be clamped with the gold finger, reducing the risk of the gold finger falling off relative to the substrate. In addition, the flexibility of the gold finger in shape setting can also be improved.

[0023] In some possible implementations, the gold finger is electrically connected to the cable core by at least one of welding and electroplating. This arrangement can improve the flexibility and reliability of the electrical connection between the gold finger and the cable core.

[0024] In some possible implementations, at least two gold fingers are arranged along a first direction (the direction of the arrangement of two signal cable cores spaced apart in the center of the signal cable core pair) to form a gold finger layer. The connector includes at least two gold finger layers, and at least two gold finger layers are stacked along the thickness direction of the substrate. Such an arrangement can increase the density of the gold fingers, so that the connection structure can be applied to a variety of different application scenarios.

[0025] In some possible implementations, the substrate includes a second shielding layer, and the second shielding layer is located between two stacked gold finger layers. This arrangement can reduce the crosstalk between the two stacked gold finger layers and improve the transmission reliability of the signal.

[0026] On the other hand, an embodiment of the present application provides a connection structure. The connection structure includes a cable and a first connector and a second connector connected at both ends of the cable. The cable includes a fixed portion, a plurality of cable cores and a low-loss portion, and the fixed portion covers the low-loss portion and the plurality of cable cores. The plurality of cable cores include a signal cable core pair, the signal cable core pair includes two signal cable cores spaced apart, the low-loss portion is located between two signal cable cores spaced apart in the signal cable core pair, and the dielectric constant of the low-loss portion is less than the dielectric constant of the fixed portion.

[0027] In the embodiment of the present application, a fixing portion is provided to cover a plurality of cable cores, so that the plurality of cable cores can be integrated. Compared with a single-core cable formed by a separate sheath of each cable core, the integrated arrangement of the plurality of cable cores can reduce the number of cables, reduce the difficulty of maintaining the electronic device, and reduce the space occupied by the cables in the housing, thereby improving the space utilization rate in the housing. In addition, it can also reduce the obstruction of the air flow in the housing caused by the cables, which is beneficial to the heat dissipation of the electronic device.

[0028] In addition, the fixed part also covers the low-loss part, which can reduce the risk of relative movement between the low-loss part and multiple cable cores. The low-loss part is set between two signal cable cores that are spaced apart in the center of the signal cable core pair, which can reduce the loss of the signal when it is transmitted on the signal cable core, improve signal integrity (SI), support the evolution of the signal to 112G, 224G and higher transmission rates, without changing the cable core wire body or material, etc., which improves the convenience of cable production and reduces costs.

[0029] The connection structure provided by the embodiment of the present application has a higher degree of integration than a single-core cable formed by separate cladding of each cable core, and has a lower loss than a flexible printed circuit board (FPC). That is, the connection structure provided by the embodiment of the present application can take into account the characteristics of high density and low loss. In addition, the fixing portion can include a flexible glue so that the cable can be a flexible structure, improve the flexibility of the relative position between the two components connected by the connection structure, and meet different needs.

[0030] In addition, the connection structure is connected to the first functional module through the first connector and connected to the second functional module through the second connector, which improves the convenience of electrically connecting the connection structure and the functional modules.

[0031] In some possible implementations, the low-loss portion includes a gaseous low-loss medium. This arrangement can reduce the weight of the connection structure and reduce the cost of the connection structure.

[0032] In some possible implementations, the multiple cable cores also include a shielded cable core. Along the arrangement direction of the two signal cable cores spaced apart in the signal cable core pair, the two shielded cable cores are located on both sides of the signal cable core pair. Such an arrangement enables the shielded cable core to shield the signal cable core pair to reduce the crosstalk between the signal cable core pair and other signal cables (such as other signal cable core pairs) and improve the transmission reliability of the signal. The low-loss portion is located between the two signal cable cores spaced apart in the signal cable core pair, and along the arrangement direction of the two signal cable cores spaced apart in the signal cable core pair, at least two shielded cable cores are located on both sides of the signal cable core pair, which can reduce the mutual influence between the low-loss portion and the shielded cable core, so that the cable has the characteristics of low loss and low crosstalk.

[0033] On the other hand, an embodiment of the present application provides a cable. The cable includes a fixed portion, a plurality of cable cores and a low-loss portion, wherein the fixed portion covers the low-loss portion and the plurality of cable cores. The plurality of cable cores include a signal cable core pair, wherein the signal cable core pair includes two signal cable cores arranged at intervals, the low-loss portion is located between the two signal cable cores arranged at intervals in the signal cable core pair, and the dielectric constant of the low-loss portion is less than the dielectric constant of the fixed portion.

[0034] In the embodiment of the present application, a fixing portion is provided to cover a plurality of cable cores, so that the plurality of cable cores can be integrated. Compared with a single-core cable formed by a separate sheath of each cable core, the integrated arrangement of the plurality of cable cores can reduce the number of cables, reduce the difficulty of maintaining the electronic device, and reduce the space occupied by the cables in the housing, thereby improving the space utilization rate in the housing. In addition, it can also reduce the obstruction of the air flow in the housing caused by the cables, which is beneficial to the heat dissipation of the electronic device.

[0035] In addition, the fixed part also covers the low-loss part, which can reduce the risk of relative movement between the low-loss part and multiple cable cores. The low-loss part is set between two signal cable cores that are spaced apart in the center of the signal cable core pair, which can reduce the loss of the signal when it is transmitted on the signal cable core, improve signal integrity (SI), support the evolution of the signal to 112G, 224G and higher transmission rates, without changing the cable core wire body or material, etc., which improves the convenience of cable production and reduces costs.

[0036] The connection structure provided by the embodiment of the present application has a higher degree of integration than a single-core cable formed by separate cladding of each cable core, and has a lower loss than a flexible printed circuit board (FPC). That is, the connection structure provided by the embodiment of the present application can take into account the characteristics of high density and low loss. In addition, the fixing portion can include a flexible glue so that the cable can be a flexible structure, improve the flexibility of the relative position between the two components connected by the connection structure, and meet different needs.

[0037] In some possible implementations, the low-loss portion includes a gaseous low-loss medium. This arrangement can reduce the weight of the connection structure and reduce the cost of the connection structure.

[0038] In some possible implementations, the multiple cable cores also include a shielded cable core. Along the arrangement direction of the two signal cable cores spaced apart in the signal cable core pair, the two shielded cable cores are located on both sides of the signal cable core pair. Such an arrangement enables the shielded cable core to shield the signal cable core pair to reduce the crosstalk between the signal cable core pair and other signal cables (such as other signal cable core pairs) and improve the transmission reliability of the signal. The low-loss portion is located between the two signal cable cores spaced apart in the signal cable core pair, and along the arrangement direction of the two signal cable cores spaced apart in the signal cable core pair, at least two shielded cable cores are located on both sides of the signal cable core pair, which can reduce the mutual influence between the low-loss portion and the shielded cable core, so that the cable has the characteristics of low loss and low crosstalk. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the present application, the following briefly introduces the drawings required to be used in some embodiments of the present application. Obviously, the drawings described below are only drawings of some embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the products involved in the embodiments of the present application, the actual process of the method, the actual timing of the signal, etc.

[0040] Figure 1 A schematic diagram of the structure of an electronic device provided in some embodiments of the present application;

[0041] Figure 2 A schematic diagram of the structure of an electronic device provided in some other embodiments of the present application;

[0042] Figure 3 A schematic diagram of a connection structure provided in some embodiments of the present application;

[0043] Figure 4A schematic diagram of the structure of cables provided in some embodiments of the present application;

[0044] Figure 5 A schematic diagram of the structure of cables provided in other embodiments of the present application;

[0045] Figure 6 A schematic diagram of the structure of cables provided in some other embodiments of the present application;

[0046] Figure 7 A schematic diagram of the structure of cables provided in some other embodiments of the present application;

[0047] Figure 8 A schematic diagram of the structure of cables provided in some other embodiments of the present application;

[0048] Fig. 9 A schematic diagram of the structure of cables provided in some other embodiments of the present application;

[0049] Fig.10 A schematic diagram of the structure of cables provided in some other embodiments of the present application;

[0050] Fig.11 A schematic diagram of the structure of cables provided in some other embodiments of the present application;

[0051] Fig.12 A schematic diagram of the structure of cables provided in some other embodiments of the present application;

[0052] Fig.13 Schematic diagram of connection structures provided for other embodiments of the present application;

[0053] Fig.14 for Fig.13 A schematic cross-sectional view of the connector along the AA direction in some embodiments;

[0054] Fig.15 for Fig.13 A schematic cross-sectional view of the connector along the AA direction in some embodiments;

[0055] Fig.16 A schematic diagram of the connection relationship between the cable core and the gold finger provided in some embodiments of the present application;

[0056] Fig.17 Schematic diagram of the connection relationship between the cable core and the gold finger provided in some other embodiments of the present application. DETAILED DESCRIPTION

[0057] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments provided by the present application, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present application.

[0058] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, unless otherwise specified, "plurality" means two or more.

[0059] Figure 1 This is a schematic diagram of the structure of an electronic device provided in some embodiments of the present application. Figure 1 , an embodiment of the present application provides an electronic device 300. For example, the electronic device 300 can be a server, such as a cabinet server, a rack server, a general-purpose server, a blade server, a high-performance server (high-performance computing, HPC), a CXL (compute express link) server, a supercomputing server (supercomputing server) and a high-density server, etc., suitable for various application scenarios such as air cooling, liquid cooling, and liquid-assisted air cooling (liquid-assisted air cooling, LAAC).

[0060] Alternatively, the electronic device 300 may also be an electronic device other than a server, such as a switch, a desktop computer, a communication device, or the like, which includes many cables as a connection structure.

[0061] The embodiment of the present application does not further limit the specific form of the electronic device 300. The following takes the electronic device 300 as a server as an example to continue the description.

[0062] Figure 2 The following is a schematic diagram of the structure of an electronic device provided in some other embodiments of the present application. Figure 1 As shown, the electronic device 300 includes a housing 301, and the housing 301 can enclose a receiving space. The electronic device 300 also includes multiple functional modules 310 and a connecting structure 200. The multiple functional modules 310 include a first functional module and a second functional module, and the connecting structure 200 connects the first functional module and the second functional module.

[0063] For example, the functional module 310 may include a node board 302, a power module 303, a functional board 304, a management board 305, and a backplane 306 ( Figure 1 Not shown, see Figure 2 ). The types and quantities of the first functional module and the second functional module may be the same or different. Multiple functional modules 310 may be arranged in the housing 301 (the enclosed accommodation space), so that the housing 301 can protect the multiple functional modules 310.

[0064] like Figure 1 As shown, the housing 301 can be divided into three areas, along the length direction of the housing 301, the first area A and the third area C are respectively close to the two sides of the housing 301, and the second area B is located between the first area A and the third area C. The node board 302, the power module 303 and the function board 304 can be arranged in the first area A or the third area C, and the management board 305 and the backplane 306 can be arranged in the second area B.

[0065] The number of back plates 306 may be two, such as Figure 2 As shown, the two back plates 306 include a first back plate 3061 and a second back plate 3062 , and the first back plate 3061 and the second back plate 3062 are arranged at intervals on both sides of the management plate 305 along the length direction of the housing 301 .

[0066] For example, the server configured in the above manner may be referred to as a three-stage server. It is understandable that the node board 302, the power module 303, the function board 304, the management board 305, and the backplane 306 may also be configured in other arrangements within the housing 301, and the embodiment of the present application does not further limit the arrangement of the function module 310 within the housing 301.

[0067] The electronic device 300 may also include other functional modules 310 in addition to the node board 302, the power module 303, the functional board 304, the management board 305 and the backplane 306. The embodiments of the present application do not further limit the specific form of the functional modules 310 included in the electronic device 300.

[0068] Continue to refer to Figure 1, for example, the node board 302 may include a first circuit board 3021 and a memory bar 3022, the first circuit board 3021 may be a printed circuit board (PCB), and the memory bar 3022 may include at least one of a dual inline memory module (DIMM) and a registered dual inline memory module (RDIMM). The memory bar 3022 is disposed on the first circuit board 3021 and is electrically connected to the first circuit board 3021.

[0069] The node board 302 may also include a processor 3023, which may be a central processing unit (CPU). Alternatively, the processor 3023 may also be a platform controller hub (PCH) chip or other chips. The processor 3023 is disposed on the first circuit board 3021 and is electrically connected to the first circuit board 3021. The number of memory bars 3022 may be multiple, such as 8, 16 or 24. Multiple memory bars 3022 are disposed on both sides of the processor 3023.

[0070] The electronic device 300 may include one node plate 302 or may include multiple node plates 302. When the electronic device 300 includes multiple node plates 302, at least two of the multiple node plates 302 may be stacked to improve space utilization in the housing 301.

[0071] Continue to refer to Figure 1 For example, the power module 303 may include a power body 3031 and a second circuit board 3032. The power body 3031 may be a power supply unit (PSU), and the second circuit board 3032 is connected to the power body 3031. The second circuit board 3032 may be a PCB, serving as a power backplane.

[0072] The function board 304 may include a hard disk, a graphics card, a DPU card, an IO expansion card, a disk array card (RAID card), a network card, a riser card, etc. The number of the function board 304 may be multiple, and the types of the multiple function boards 304 may be the same or different.

[0073] The management board 305 may include a third circuit board 3051 and a management module 3052. The third circuit board 3051 may be a PCB, and the management module 3052 may be a baseboard management controller (BMC). The management module 3052 is disposed on the third circuit board 3051 and is electrically connected to the third circuit board 3051.

[0074] The back plate 306 is a PCB. Figure 2 As shown, the backplane 306 may be provided with a high-speed connector 3071 and a low-speed connector 3072 , and the number of the high-speed connector 3071 and the number of the low-speed connector 3072 may be the same or different.

[0075] The connection structure 200 can be used to transmit high-speed signals, or the connection structure 200 can also be used to transmit low-speed signals, or the connection structure 200 can also be used to transmit high-speed signals and low-speed signals. The embodiment of the present application does not further limit the type of signal transmitted by the connection structure 200.

[0076] like Figure 2 As shown, the function board 304 can be electrically connected to the high-speed connector 3071 on the first backplane 3061 through the connection structure 200a for transmitting high-speed signals. In addition, the function board 304 can be electrically connected to the low-speed connector 3072 on the first backplane 3061 through the connection structure 200b for transmitting low-speed signals. At this time, one of the function board 304 and the first backplane 3061 is a first functional module, and the other is a second functional module.

[0077] Continue to refer to Figure 2 , the node board 302 can be electrically connected to the high-speed connector 3071 on the second backplane 3062 through the connection structure 200a for transmitting high-speed signals. In addition, the node board 302 can be electrically connected to the low-speed connector 3072 on the second backplane 3062 through the connection structure 200b for transmitting low-speed signals. At this time, one of the node board 302 and the second backplane 3062 is a first functional module, and the other is a second functional module.

[0078] Continue to refer to Figure 2 , the power module 303 can be electrically connected to the high-speed connector 3071 on the second backplane 3062 (or the first backplane 3061) through the connection structure 200a for transmitting high-speed signals. In addition, the power module 303 can be electrically connected to the low-speed connector 3072 on the second backplane 3062 (or the first backplane 3061) through the connection structure 200b for transmitting low-speed signals. At this time, one of the power module 303 and the second backplane 3062 (or the first backplane 3061) is a first functional module, and the other is a second functional module.

[0079] The node board 302, the power module 303 and the functional board 304 are electrically connected to the backplane 306 respectively by using the connection structure 200. Compared with the node board 302, the power module 303 and the functional board 304 being plugged into the backplane 306 respectively, the relative positions of the node board 302, the power module 303 and the functional board 304 and the backplane 306 can be more flexible.

[0080] Continue to refer to Figure 2 The high-speed connector 3071 on the first backplane 3061 can be electrically connected to the high-speed connector 3071 on the second backplane 3062 through the connection structure 200a for transmitting high-speed signals. At this time, one of the first backplane 3061 and the second backplane 3062 is a first functional module, and the other is a second functional module.

[0081] The connection structure 200 is provided to connect the high-speed connector 3071 of the first backplane 3061 and the second backplane 3062, so that the high-speed signal can be transmitted between the two functional modules 310 (such as the functional board 304 and the node board 302) through the connection structure 200 to achieve the interconnection between the functional modules 310. For example, the connection structure 200 connecting the two backplanes 306 can be attached to the surface of the third circuit board 3051.

[0082] The low-speed connector 3072 on the backplane 306 (the first backplane 3061 and the second backplane 3062) can be electrically connected to the third circuit board 3051 through the connection structure 200b for transmitting low-speed signals, so that the low-speed signal can be transmitted between any one of the node board 302, the power module 303, the functional board 304 and the management module 3052, thereby realizing the monitoring and management of the node board 302, the power module 303 and the functional board 304 by the management module 3052.

[0083] In some examples, the electronic device 300 may not include the third circuit board 6051. In this case, the electronic device 300 may include a carrier board, and the management module 3052 may be arranged on the carrier board in the form of a buckle. The connection structure 200b for transmitting low-speed signals electrically connects the low-speed connector 3072 and the carrier board, so that the low-speed signal can be transmitted between any one of the node board 302, the power module 303, and the function board 304 and the management module 3052.

[0084] For example, two stacked node plates 302 can also be connected by the connection structure 200. In this case, one node plate 302 is a first functional module, and the other node plate 302 is a second functional module. The embodiment of the present application does not further limit the application scenario of the connection structure 200 in the electronic device 300.

[0085] It can be seen that more connection structures 200 are required in the electronic device 300 to connect different functional modules 310. Multiple connection structures 200 are arranged in the housing, which will result in a large number of cables in the housing 301, which is not conducive to the maintenance of the electronic device 200, and will hinder the flow of gas in the housing 301, which is not conducive to the heat dissipation of the electronic device 300.

[0086] Figure 3 A schematic diagram of the connection structure provided for some embodiments of the present application. Figure 4 Schematic diagram of the structure of the cable provided in some embodiments of the present application. It can be understood that in some drawings of the present application, Figure 3 For example, in order to clearly illustrate the cable core 110 and the like, the fixing portion 120 covering the cable core 110 is not shown.

[0087] In some examples, such as Figure 3 As shown, the connection structure 200 includes a cable 100 and a first connector 210a and a second connector 210b connected at both ends of the cable 100. The first connector 210a is connected to a first functional module, and the second connector 210b is connected to a second functional module.

[0088] For example, Figure 3 As shown, the first connector 210a and the second connector 210b are located on both sides of the cable 100 along the extension direction of the cable 100, and are respectively connected to the cable core 110. The connection structure 200 includes the first connector 210a and the second connector 210b, so that the connection structure 200 can be electrically connected to the functional module 310 through the first connector 210a and the second connector 210b, thereby improving the convenience of the connection structure 200 and the functional module 310 when being electrically connected.

[0089] like Figure 4 As shown, the cable 100 includes a fixing portion 120 , a plurality of raw cables 110 , and a low-loss portion 101 . The fixing portion 120 covers the low-loss portion 101 and the plurality of raw cables 110 .

[0090] It is understandable that the cable core 110 is a bare wire without a sheath. For example, the cable core 110 can be a copper wire, a silver wire, a silver-plated copper wire, etc. Alternatively, the cable core 110 can also be other metal bare wires. In some examples, the cable core 110 can be a metal wire of 26awg to 34awg (American wire gauge). The materials and diameters of the multiple cable cores 110 can be the same or different.

[0091] For example, multiple cable cores 110 can all be used to transmit high-speed signals, so that the connection structure 200 can transmit high-speed signals; or, multiple cable cores 110 can all be used to transmit low-speed signals, so that the connection structure 200 can transmit low-speed signals; or, multiple cable cores 110 can be used for high-speed signals and low-speed signals, so that the connection structure 200 can transmit high-speed signals and low-speed signals.

[0092] The fixing portion 120 covers the plurality of cable cores 110, can bond and fix the plurality of cable cores 110, and can protect the plurality of cable cores 110. The fixing portion 120 can be a flexible structure, such as a flexible adhesive. The plurality of cable cores 110 are fixed with a flexible adhesive, so that the cable 100 can be a flexible structure. In some examples, the cable 100 can be called a quasi-flexible PCB structure.

[0093] The fixing portion 120 is provided to cover the plurality of cable cores 110, so that the plurality of cable cores 110 can be integrated. Compared with a single-core cable formed by a separate sheath of each cable core 110, the integrated arrangement of the plurality of cable cores 110 can reduce the number of cables 100, reduce the difficulty of maintaining the electronic device 300, and reduce the space occupied by the cables 100 in the housing 301, thereby improving the space utilization rate in the housing 301. In addition, the obstruction caused by the cables 100 to the air flow in the housing 301 can be reduced, which is beneficial to the heat dissipation of the electronic device 300.

[0094] For example, compared with a single-core cable formed by individually encapsulating each cable core 110 , providing the cable 100 with a plurality of cable cores 110 can reduce the occupied space by about 50%.

[0095] The connector (including the first connector 210a and the second connector 210b) can be a rigid structure, and the cable 100 can be a flexible structure. The connector is connected to the cable 100 so that the rigid connector and the flexible cable 100 can be combined, that is, the connection structure 200 can achieve a soft-rigid combination. In some examples, the flexibility of the connection structure 200 can be better than that of a rigid-flexible circuit board.

[0096] In some examples, a universal cable core 110 suitable for more than one different architecture of the electronic device 300 can be integrated so that the connection structure 200 can be suitable for a variety of different architectures of the electronic device 300, thereby improving the versatility of the connection structure 200 and achieving decoupling between the connection structure 200 and the architecture of the electronic device 300.

[0097] Figure 5 Schematic diagram of the structure of cables provided in other embodiments of the present application. In some examples, such as Figure 4 and Figure 5As shown, the plurality of cable cores 110 include a signal cable core pair 111a, and the signal cable core pair 111a includes two signal cable cores 111 spaced apart. For example, the two signal cable cores 111 spaced apart in the signal cable core pair 111a may be arranged along a first direction X. That is, in the signal cable core pair 111a, the arrangement direction of the two signal cable cores 111 spaced apart is the first direction X.

[0098] In some examples, the signal cable core pair 111 a can be used to transmit high-speed differential signals. For example, one signal cable core 111 in the signal cable core pair 111 a can transmit a Tx signal, and the other signal cable core 111 can transmit an Rx signal.

[0099] In this way, there is no need to set up two single-core cables to transmit two signals with opposite phases respectively, which reduces the number of cables 100, reduces the difficulty of maintaining the electronic device 300, and reduces the space occupied by the cables 100 in the housing 301, thereby improving the space utilization rate in the housing 301. In addition, it can also reduce the obstruction of the cable 100 to the air flow in the housing 301, which is beneficial to the heat dissipation of the electronic device 300.

[0100] It can be understood that the fixing portion 120 covers the low-loss portion 101 and the plurality of cable cores 110, which can reduce the risk of relative movement between the low-loss portion 101 and the plurality of cable cores 110. Figure 4 and Figure 5 The low-loss portion 101 is located between two signal cable cores 111 disposed at intervals in the signal cable core pair 111 a. The dielectric constant (DK) of the low-loss portion 101 is smaller than the dielectric constant of the fixing portion 120 .

[0101] For example, the low-loss portion 101 may include a low-loss medium. The low-loss medium may be a gas, such as air, or may be other solid or liquid media with a low dielectric constant.

[0102] For example, Figure 4 As shown, the low-loss portion 101 may be located between two signal cable cores 111 spaced apart in the signal cable core pair 111a, or, as shown in FIG. Figure 5 As shown, the low-loss portion 101 may also be located at other positions except between two signal cable cores 111 spaced apart in the signal cable core pair 111a. For example, the low-loss portion 101 may surround any one of the signal cables 111 in the signal cable core pair 111a.

[0103] For example, two low-loss portions 101 may be provided between two signal cables 111 spaced apart in the signal cable core pair 111a, and the two low-loss portions 101 may be arranged along the second direction Y. The second direction Y intersects with the first direction X (the arrangement direction of the two signal cable cores 111 spaced apart in the signal cable core pair 111a). For example, the second direction Y may be perpendicular or approximately perpendicular to the first direction X. The extension direction (third direction) Z of the cable core 110 may intersect with the plane (XY plane) in which the first direction X and the second direction Y are located. For example, the extension direction (third direction) Z of the cable core 110 may be perpendicular to the XY plane.

[0104] Alternatively, a greater number of low-loss portions 101 may be provided between two signal cable cores 111 spaced apart in the signal cable core pair 111a. The embodiment of the present application does not further limit the number of low-loss portions 101 provided between two signal cables 111 spaced apart in the signal cable core pair 111a.

[0105] The low-loss portion 101 is arranged between two signal cable cores 111 spaced apart in the signal cable core pair 111a, which can reduce the signal loss during transmission on the signal cable core 111, improve signal integrity (SI), support the evolution of signals to 112G, 224G and higher transmission rates, and is suitable for the V9 architecture. In addition, there is no need to change the wire body or material of the cable core 110, which improves the production convenience of the cable 100 and reduces costs.

[0106] The connection structure 200 provided in the embodiment of the present application has a higher degree of integration than a single-core cable formed by separate cladding of each cable core 110, and has a lower loss than a flexible printed circuit board (FPC). That is, the connection structure 200 provided in the embodiment of the present application can take into account the characteristics of high density and low loss. In addition, the fixing portion 120 can include a flexible glue, so that the cable 100 can be a flexible structure, improve the flexibility of the relative position between the two components connected by the connection structure 200, and meet different needs.

[0107] In some examples, the dielectric constant of the fixed portion 120 is less than or equal to 4, and the dielectric constant of the low-loss portion 101 is less than or equal to 2.

[0108] In this way, the dielectric constants of the fixing portion 120 and the low-loss portion 101 are both low, thereby reducing the loss of the signal when it is transmitted on the signal cable core 111 and improving the signal integrity.

[0109] For example, the dielectric constant of the fixed part 120 can have a value range greater than 2 and less than or equal to 4, and the dielectric constant of the low-loss part 101 can have a value range less than or equal to 2, so that the dielectric constant of the low-loss part 101 can be smaller than the dielectric constant of the fixed part 120.

[0110] In some examples, the material of the fixing portion 120 includes silicone. The DK of silicone is greater than 2 and less than or equal to 4, and the DF is about 0.01, that is, the DK and DF of silicone are both low. Setting the material of the fixing portion 120 to include silicone can reduce the loss of high-speed signals when transmitted on the signal cable core 111 and improve signal integrity.

[0111] It can be understood that the material of the fixing portion 120 may also include other flexible glues with lower DK and DF.

[0112] In some examples, low-loss portion 101 includes a gaseous low-loss medium.

[0113] For example, the gaseous low-loss medium may include air. The DK of air is approximately 1, and the dielectric loss factor (DF) is close to 0. Setting the gaseous low-loss medium to include air can reduce the loss of the signal when it is transmitted on the signal cable core 111 and improve the signal integrity. Alternatively, the gaseous low-loss medium may also include other gases with lower DK and DF.

[0114] It can be understood that the low-loss portion 101 includes a gaseous low-loss medium, which can reduce the weight of the connection structure 200 and reduce the cost of the connection structure 200. Of course, in other embodiments, the low-loss portion 101 also includes a non-gaseous low-loss medium, and the dielectric constant of the non-gaseous low-loss medium can be less than or equal to 2.

[0115] In some examples, the fixing portion 120 may be provided with a plurality of receiving holes, and the receiving holes are used to receive a gaseous low-loss medium, so that the fixing portion 120 can cover the gaseous low-loss medium to reduce the loss of the signal when it is transmitted on the signal cable core 111. For example, the extension direction of the receiving hole may be the same as the extension direction of the cable core 110, or the receiving hole may be a spherical or approximately spherical receiving hole, or the receiving hole may be other irregular shapes.

[0116] Figure 6 The schematic diagram of the structure of the cable provided by some embodiments of the present application. In some examples, such as Figure 6 As shown, the cable 100 further includes a hollow tube 102, and the fixing portion 120 covers the hollow tube 102. The extending direction of the hollow tube 102 is the same as the extending direction of the cable core 110. That is, the hollow tube 102 extends along the third direction Z.

[0117] It can be understood that the length of the hollow tube 102 can be the same as the length of the cable core 110, or the length of the hollow tube 102 can also be less than the length of the cable core 110. When the length of the hollow tube 102 is less than the length of the cable core 110, the plurality of hollow tubes 102 can be arranged along the extension direction Z of the cable core 110 (i.e., the third direction).

[0118] like Figure 6 As shown, the hollow tube 102 encloses a first accommodation space 102a, and the first accommodation space 102a is used to accommodate a gaseous low-loss medium. For example, the first accommodation space 102a can be used to accommodate air. The fixing portion 120 covers the hollow tube 102, so that the fixing portion 120 can cover the gaseous low-loss medium located in the first accommodation space 102a.

[0119] The hollow tube 102 is provided to enclose a first accommodation space 102a, and the first accommodation space 102a is used to accommodate the gaseous low-loss medium, so that the fixing portion 120 can cover the gaseous low-loss medium in the hollow tube 102. By providing the hollow tube 102, the distribution of the gaseous low-loss medium on the fixing portion 120 can be easily controlled, and the distribution uniformity of the gaseous low-loss medium on the fixing portion 120 is improved.

[0120] In addition, the extension direction of the hollow tube 102 is the same as the extension direction of the cable core 110. Along the extension direction of the cable core 110, the cable cores 110 at different positions can be arranged adjacent to the gaseous low-loss medium in the hollow tube 102, thereby reducing the loss of the signal during transmission on the signal cable core 111 and improving the integrity of the signal.

[0121] In some examples, the hollow tube 102 includes at least one of a hollow optical fiber or a hollow plastic. This configuration can improve the flexibility of the hollow tube 102 in selection.

[0122] Figure 7 The schematic diagram of the structure of the cable provided by some embodiments of the present application. In some examples, such as Figure 7 As shown, the cable 100 includes a plurality of hollow beads 104, and the fixing portion 120 covers the plurality of hollow beads 104. The plurality of hollow beads 104 are arranged along the extension direction Z of the cable core 110. For example, the length of the plurality of hollow beads 104 arranged along the extension direction Z of the cable core 110 may be the same as the length of the cable core 110, or the length of the plurality of hollow beads 104 arranged along the extension direction Z of the cable core 110 may also be less than the length of the cable core 110.

[0123] like Figure 7As shown, the hollow bead 104 encloses a second accommodating space 104a, and the second accommodating space 104a is used to accommodate a gaseous low-loss medium. For example, the second accommodating space 104a can be used to accommodate air. The fixing portion 120 covers the hollow bead 104, so that the fixing portion 120 can cover the gaseous low-loss medium located in the second accommodating space 104a.

[0124] The hollow beads 104 are provided to enclose a second accommodation space 104a, and the second accommodation space 104a is used to accommodate the gaseous low-loss medium, so that the fixing portion 120 can cover the gaseous low-loss medium in the hollow beads 104. By providing the hollow beads 104, the distribution of the gaseous low-loss medium on the fixing portion 120 can be easily controlled, and the distribution uniformity of the gas on the fixing portion 120 can be improved.

[0125] In addition, the arrangement direction of the multiple hollow beads 104 is the same as the extension direction of the cable core 110. Along the extension direction of the cable core 110, the cable cores 110 at different positions can be arranged adjacent to the gaseous low-loss medium in the hollow beads 104, thereby reducing the loss of the signal during transmission on the signal cable core 111 and improving the integrity of the signal.

[0126] In some examples, the hollow beads 104 may include hollow plastic beads. Alternatively, the hollow beads 104 may also be hollow beads made of other materials. The embodiments of the present application do not further limit the material of the hollow beads.

[0127] For example, the cable 100 may include only the hollow tube 102 , or the cable 100 may include a plurality of hollow beads 104 , or the cable 100 may include both the hollow tube 102 and a plurality of hollow beads 104 .

[0128] Figure 8 The schematic diagram of the structure of the cable provided by some embodiments of the present application. In some examples, such as Figure 8 As shown, the plurality of cable cores 110 further include a shielded cable core 112. The number of the shielded cable cores 112 can be multiple. The number of the shielded cable cores 112 and the number of the signal cable cores 111 can be the same or different.

[0129] In some examples, such as Figure 8 As shown, along the arrangement direction (first direction) X of the two signal cable cores 111 spaced apart in the signal cable core pair 111 a , the two shielded cable cores 112 are located on both sides of the signal cable core pair 111 a .

[0130] Such a configuration enables the shielded cable core 112 to shield the signal cable core pair 111a, thereby reducing the crosstalk between the signal cable core pair 111a and other signal cables 111 (e.g., other signal cable core pairs 111a), and improving the transmission reliability of the signal. For example, the shielded cable core 112 can be grounded to shield the crosstalk.

[0131] It can be understood that the low-loss portion 101 is located between the two signal cable cores 111 spaced apart in the signal cable core pair 111a, and along the arrangement direction X of the two signal cable cores 111 spaced apart in the signal cable core pair 111a, at least two shielded cable cores 112 are located on both sides of the signal cable core pair 111a, which can reduce the mutual influence between the low-loss portion 101 and the shielded cable core 112, so that the cable 100 has the characteristics of low loss and low crosstalk.

[0132] For example, Figure 8 As shown, one shielded cable core 112 is located on one side of the signal cable core pair 111a along the first direction X, and the other shielded cable core 112 is located on the other side of the signal cable core pair 111a along the first direction X. The distance between the axes of the two shielded cable cores 112 located on both sides of the signal cable core pair 111a is about 1 mm (unit: mm).

[0133] In some examples, such as Figure 8 As shown, the diameter of the shielded cable core 112 is greater than the diameter of the signal cable core 111. This arrangement can improve the shielding effect of the shielded cable core 112, reduce the crosstalk between the signal cable core pair 111a and other signal cables 111 (such as other signal cable core pairs 111a), and improve the transmission reliability of the signal.

[0134] Fig. 9 A schematic diagram of the structure of cables provided in some other embodiments of the present application. Fig.10 A schematic diagram of the structure of cables provided in some other embodiments of the present application.

[0135] In some examples, such as Fig. 9 and Fig.10 As shown, there are multiple signal cable core pairs 111a. Along the arrangement direction of two signal cable cores 111 spaced apart in the signal cable core pair 111a, multiple signal cable core pairs 111a are spaced apart to form a signal cable layer 111b.

[0136] For example, the signal cable layer 111 b may include two, three, four or more signal cable core pairs 111 a . The embodiments of the present application do not further limit the number of the signal cable core pairs 111 a included in the signal cable layer 111 b .

[0137] like Fig. 9 and Fig.10 As shown, in the same signal cable layer 111b, a shielded cable core 112 may be disposed between two adjacent signal cable pairs 111a. The shielded cable core 112 between the two signal cable pairs 111a can isolate the crosstalk between the two signal cable pairs 111a, thereby improving the transmission reliability of the signal.

[0138] The cable 100 may include one signal cable layer 111b or multiple signal cable layers 111b. When the cable 100 includes one signal cable layer 111b, the preparation process of the cable 100 can be simplified and the production yield can be improved. When the cable 100 includes at least two signal cable layers 111b, the integration of the cable 100 can be improved. For example, the thickness of one signal cable layer 111b is about 0.3mm.

[0139] like Fig. 9 and Fig.10 As shown, the cable 110 further includes a first shielding layer 103 , which is stacked on at least one side of the signal cable layer 111 b along the thickness direction (ie, the second direction) Y of the signal cable layer 111 b and connected to the fixing portion 120 .

[0140] The thickness direction (i.e., the second direction) Y of the signal cable layer 111b intersects with the arrangement direction (i.e., the first direction) X of the two signal cable cores 111 spaced apart in the signal cable core pair 111a. For example, the thickness direction (i.e., the second direction) Y of the signal cable layer 111b and the arrangement direction (i.e., the first direction) X of the two signal cable cores 111 spaced apart in the signal cable core pair 111a may be perpendicular or approximately perpendicular.

[0141] The first shielding layer 103 may be a metal layer, such as a copper layer, a silver layer or a gold layer, etc. The first shielding layer 103 may be grounded to shield crosstalk. The first shielding layer 103 may be bonded to the fixing portion 120 to reduce the risk of the first shielding layer 103 being offset relative to the fixing portion 120.

[0142] like Fig. 9 As shown, the first shielding layer 103 can be stacked on one side of the signal cable layer 111b to simplify the structure of the cable 100 and reduce the cost of the cable 100. Fig.10 As shown, the number of the first shielding layers 103 may be two, and the two first shielding layers 103 may be stacked on both sides of the signal cable layer 111 b respectively to improve the shielding effect of the first shielding layer 103 .

[0143] The first shielding layer 103 is stacked on at least one side of the signal cable layer 111b, so that the first shielding layer 103 can shield the signal cable core pair 111a, reduce the crosstalk between the signal cable core pair 111a and other cables (such as other signal cable core pairs 111a), and improve the transmission reliability of the signal.

[0144] Fig.11 A schematic diagram of the structure of cables provided in some other embodiments of the present application. Fig.12 A schematic diagram of the structure of cables provided in some other embodiments of the present application.

[0145] In some examples, such as Fig.11 and Fig.12 As shown, the cable 100 includes a first signal cable layer 111b1 and a second signal cable layer 111b2. The first signal cable layer 111b1 and the second signal cable layer 111b2 are stacked along the thickness direction Y of the signal cable layer 111b. It can be understood that the first signal cable layer 111b1 and the second signal cable layer 111b2 are adjacent.

[0146] The first shielding layer 103 is located between the stacked first signal cable layer 111b1 and the second signal cable layer 111b2. Such a configuration can reduce the crosstalk between the first signal cable layer 111b1 and the second signal cable layer 111b2, thereby improving the transmission reliability of the signal.

[0147] In some examples, such as Fig.11 and Fig.12 As shown, two first shielding layers 103 are stacked on both sides of the signal cable layer 111b along the thickness direction Y of the signal cable layer 111b. The shielding cable core 112 contacts the two first shielding layers 103 on both sides of the signal cable layer 111b.

[0148] Such an arrangement enables the shielded cable core 112 and the first shielding layer 103 to form a shielding space, and enclose the signal cable core pair 111a in the shielding space, thereby reducing the crosstalk between the signal cable core pair 111a and other signal cables 111 (such as other signal cable core pairs 111a), and improving the transmission reliability of the signal.

[0149] In some examples, the cable 100 further includes an outer sheath, for example, the outer sheath may include an insulating material, such as rubber. The outer sheath may cover the cable core 110, the fixing portion 120, and the first shielding layer 103, so as to protect the cable core 110, the fixing portion 120, and the first shielding layer 103.

[0150] In some other examples, the cable 100 may not include an outer sheath. In this case, the fixing portion 120 and the first shielding layer 103 can protect the cable core 110 .

[0151] Fig.13 Schematic diagram of connection structure provided for other embodiments of the present application. Fig.14 for Fig.13 A schematic cross-sectional view of the connector along direction AA in some embodiments. Fig.15 for Fig.13 A schematic cross-sectional view of the connector along direction AA in some embodiments.

[0152] In some examples, such as Fig.13 As shown, the first connector 210a and the second connector 210b both include a substrate 211 and a gold finger 212, and a receiving groove (not shown in the figure) is provided on the substrate 211. Fig.14 and Fig.15 As shown, the gold finger 212 is embedded in the receiving groove and connected to the substrate 211 .

[0153] It is understandable that the structures of the first connector 210a and the second connector 210b may be the same or different. In the embodiment of the present application, the first connector 210a includes a substrate 211 and a gold finger 212 as an example, and the description is continued by way of example.

[0154] For example, the substrate 211 may be a PCB, or the substrate 211 may be an injection molded part. In some examples, the gold finger 212 may be formed in the receiving groove by electroplating. Alternatively, the gold finger 212 may be formed in the receiving groove by other methods.

[0155] It can be understood that arranging the gold finger 212 to be embedded in the receiving groove provided in the substrate 211 can reduce the risk of the gold finger 212 falling off relative to the substrate 211 and improve the reliability of the first connector 210a.

[0156] The cable core 110 is electrically connected to the gold finger 212 . For example, along the extension direction of the cable core 110 , the cable core 110 may protrude from the fixing portion 120 and the first shielding layer 103 , so that the cable core 110 can be electrically connected to the gold finger 212 .

[0157] The number of golden fingers 212 can be multiple. For example, Fig.13 As shown, the plurality of gold fingers 212 may include signal gold fingers 212a and ground gold fingers 212b. The number of the signal gold fingers 212a is equal to the number of the signal cable cores 111, and the plurality of signal gold fingers 212a are electrically connected to the plurality of signal cable cores 111 in a one-to-one correspondence.

[0158] The number of grounding gold fingers 212b can be equal to the number of shielded cable cores 112, and multiple grounding gold fingers 212b are electrically connected to multiple shielded cable cores 112 in a one-to-one correspondence. Alternatively, the number of grounding gold fingers 212b can also be less than the number of shielded cable cores 112, and at least two shielded cable cores 112 can be electrically connected to the same grounding gold finger 212b (see Fig.13 ) to realize the sharing of the grounding gold fingers 212b, thereby reducing the number of the gold fingers 212 and facilitating the miniaturization of the first connector 210a.

[0159] In some examples, the gold finger 212 is electrically connected to the cable core 110 by at least one of welding and electroplating. This arrangement can improve the flexibility and reliability of the electrical connection between the gold finger 212 and the cable core 110.

[0160] like Fig.14 As shown, along the thickness direction of the substrate 211, the cross-sectional shape of the gold finger 212 is a trapezoid. Fig.15 As shown, the gold finger 212 includes a first sub-portion 2121 and a second sub-portion 2122, the first sub-portion 2121 and the second sub-portion 2122 are connected, and the first sub-portion 2121 is farther away from the surface of the substrate than the second sub-portion 2122. Along the direction parallel to the substrate 211, the length of the first sub-portion 2121 is greater than the length of the second sub-portion 2122.

[0161] It can be understood that the thickness direction of the substrate 211 is the same as the thickness direction of the signal cable layer 111b, that is, the second direction Y, and the shape of the gold finger 212 can be a truncated cone, a prism or other irregular shapes, so that the cross-sectional shape of the gold finger 212 along the thickness direction of the substrate 211 can be a trapezoid. Taking the shape of the gold finger 212 as a prism as an example, the upper bottom surface area of ​​the prism is smaller than the lower bottom surface area of ​​the prism. The lower bottom surface of the prism can be away from the outer surface of the substrate 211 relative to the upper bottom surface of the prism.

[0162] The cross-sectional shape of the gold finger 212 along the thickness direction of the substrate 211 is set to be a trapezoid, so that the substrate 211 can be clamped with the gold finger 212, reducing the risk of the gold finger 212 falling off relative to the substrate 211.

[0163] It can be understood that the direction parallel to the substrate 211 can be the first direction X, the third direction Z, or any other direction other than the first direction X and the third direction Z in the plane where the first direction X and the third direction Z are located.

[0164] Along the direction parallel to the substrate 211 , the length of the first sub-portion 2121 is greater than the length of the second sub-portion 2122 , so that the substrate 211 can be engaged with the gold finger 212 , reducing the risk of the gold finger 212 falling off relative to the substrate 211 .

[0165] For example, the first sub-portion 2121 may be a cuboid, a cylinder or a prism, and the second sub-portion 2122 may also be a cuboid, a cylinder or a prism. The shape of the first sub-portion 2121 and the shape of the second sub-portion 2122 may be the same or different.

[0166] It is understandable that the shapes of the plurality of gold fingers 212 may be the same or different. The cross-sectional shape of the gold finger 212 is set to be a trapezoid. Alternatively, the gold finger 212 includes a first sub-portion 2121 and a second sub-portion 2122, and along a direction parallel to the substrate 211, the length of the first sub-portion 2121 is greater than the length of the second sub-portion 2122, which can improve the flexibility of the gold finger 212 in shape setting.

[0167] In some examples, such as Fig.14 and Fig.15 As shown, at least two gold fingers 212 are arranged along the first direction X to form a gold finger layer 212 c. The first connector 210 a includes at least two gold finger layers 212 c, and the at least two gold finger layers 212 c are stacked along the thickness direction Y of the substrate 211 .

[0168] Such a setting can improve the density of the gold finger 212, so that the connection structure 200 can be suitable for double-sided gold finger Ethernet application scenarios such as OSFP (octal small form-factor pluggable), QSFP-DD (quad small formfactor pluggable-double density), OSFP-XD, etc., and can also be used in peripheral component interconnect express (PCIE) application scenarios such as UBC (universal bus connector) and MCIO (mini cooled io, multi-channel input and output), thereby improving the applicability of the connection structure 200.

[0169] Fig.16 A schematic diagram of the connection relationship between the cable core and the gold finger provided in some embodiments of the present application. Fig.17 Schematic diagram of the connection relationship between the cable core and the gold finger provided in some other embodiments of the present application. It can be understood that in order to clearly show the connection relationship between the cable core and the gold finger, Fig.16 and Fig.17 The cross-sectional views of the connector and the cable in the XY plane (the plane where the first direction X and the second direction Y are located) are respectively shown, and the electrical connection relationship between the gold finger and the cable core is shown with a dot-dash line.

[0170] In some examples, such as Fig.16 As shown, the number of the gold finger layer 212c is the same as that of the signal cable layer 111b, and the multiple gold fingers 212 in one gold finger layer 212c are electrically connected to the multiple cable cores 110 in one signal cable layer 111b in a one-to-one correspondence. That is, the first connector 210a can be electrically connected to one cable 100.

[0171] In other examples, such as Fig.17 As shown, the number of the gold finger layers 212c is greater than the number of the signal cable layers 111b. For example, the first connector 210a may include two gold finger layers 212c, and the cable 100 may include one signal cable layer 111b.

[0172] At this time, among the two gold finger layers 212c, the multiple gold fingers 212 of one gold finger layer 212c are electrically connected to the multiple cable cores 110 in the signal cable layer 111b of one cable 100 in a one-to-one correspondence. The multiple gold fingers 212 of the other gold finger layer 212c are electrically connected to the multiple cable cores 110 in the signal cable layer 111b of the other cable 100 in a one-to-one correspondence. That is, the first connector 210a can be electrically connected to at least two cables 100. In this case, at least two cables 100 electrically connected to the same first connector 210a can be stacked.

[0173] Setting the number of gold finger layers 212c included in the first connector 210a to be greater than or equal to the number of signal cable layers 111b included in the cable 100 can improve the flexibility of the electrical connection between the first connector 210a and the cable 100 and meet different requirements.

[0174] In some examples, such as Fig.16 and Fig.17 As shown, the substrate 211 includes a second shielding layer 213, and the second shielding layer 213 is located between two stacked gold finger layers 212c.

[0175] For example, the second shielding layer 213 may be a metal layer. The second shielding layer 213 may be grounded to shield crosstalk. The second shielding layer 213 is arranged between the two stacked gold finger layers 212c, which can reduce the crosstalk between the two stacked gold finger layers 212c and improve the transmission reliability of the signal.

[0176] In summary, the embodiments of the present application have at least the following beneficial effects:

[0177] In the embodiment of the present application, a fixing portion 120 is provided to cover a plurality of cable cores 110, so that the plurality of cable cores 110 can be integrated. Compared with a single-core cable formed by a separate sheath of each cable core 110, the integrated arrangement of the plurality of cable cores 110 can reduce the number of cables 100, reduce the maintenance difficulty of the electronic device 300, and reduce the space occupied by the cables 100 in the housing 301, thereby improving the space utilization rate in the housing 301. In addition, the obstruction of the air flow in the housing 301 caused by the cables 100 can be reduced, which is beneficial to the heat dissipation of the electronic device 300.

[0178] Furthermore, the fixing portion 120 also covers the low-loss portion 101, which can reduce the risk of relative movement between the low-loss portion 101 and the plurality of cable cores 110. The low-loss portion 101 is arranged between two signal cable cores 111 spaced apart in the signal cable core pair 111a, which can reduce the loss of the signal when it is transmitted on the signal cable core 111, improve the signal integrity (SI), support the evolution of the signal to 112G, 224G and higher transmission rates, and is suitable for the V9 architecture. There is no need to change the wire body or material of the cable core 110, etc., which improves the production convenience of the cable 100 and reduces the cost.

[0179] The connection structure 200 provided in the embodiment of the present application has a higher degree of integration than a single-core cable formed by separate cladding of each cable core 110, and has a lower loss than a flexible printed circuit board (FPC). That is, the connection structure 200 provided in the embodiment of the present application can take into account the characteristics of high density and low loss. In addition, the fixing portion 120 can include a flexible glue, so that the cable 100 can be a flexible structure, improve the flexibility of the relative position between the two components connected by the connection structure 200, and meet different needs.

[0180] In addition, the connection structure 200 is connected to the first functional module through the first connector 210a and is connected to the second functional module through the second connector 210b, which improves the convenience of electrically connecting the connection structure 200 and the functional module 310.

[0181] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that a person skilled in the art can think of within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An electronic device, characterized in that: include: The first functional module; The second functional module; as well as, A connection structure, comprising a cable and a first connector and a second connector connected at two ends of the cable; The first connector is connected to the first functional module, and the second connector is connected to the second functional module; the cable includes a fixed part, a plurality of cable cores and a low-loss part, and the fixed part covers the low-loss part and the plurality of cable cores; the plurality of cable cores include a signal cable core pair, and the signal cable core pair includes two signal cable cores arranged at intervals, and the low-loss part is located between the two signal cable cores arranged at intervals in the signal cable core pair, and the dielectric constant of the low-loss part is smaller than the dielectric constant of the fixed part.

2. The electronic device according to claim 1, characterized in that: The low-loss portion includes a gaseous low-loss medium.

3. The electronic device according to claim 2, characterized in that: The cable comprises a hollow tube, and the fixing portion covers the hollow tube; the extension direction of the hollow tube is the same as the extension direction of the cable core; the hollow tube encloses a first accommodating space, and the first accommodating space is used for the gaseous low-loss medium.

4. The electronic device according to claim 2, characterized in that: The cable includes a plurality of hollow beads, and the fixing portion covers the plurality of hollow beads; the plurality of hollow beads are arranged along the extension direction of the cable core; the hollow beads surround a second accommodating space, and the second accommodating space is used to accommodate the gaseous low-loss medium.

5. The electronic device according to any one of claims 1 to 4, characterized in that: The dielectric constant of the fixing portion is less than or equal to 4, and the dielectric constant of the low-loss portion is less than or equal to 2.

6. The electronic device according to any one of claims 1 to 5, characterized in that: The plurality of cable cores further include a shielded cable core. Along the arrangement direction of two of the signal cable cores spaced apart in the pair of signal cable cores, the two shielded cable cores are located on both sides of the pair of signal cable cores.

7. The electronic device according to claim 6, characterized in that: A diameter of the shielded cable is greater than a diameter of the signal cable.

8. The electronic device according to claim 7, characterized in that: The number of the signal cable core pairs is multiple, and along the arrangement direction of two of the signal cable cores spaced apart in the signal cable core pairs, the multiple signal cable core pairs are spaced apart to form a signal cable layer; The cable also includes a first shielding layer, which is stacked on at least one side of the signal cable layer along the thickness direction of the signal cable layer and is connected to the fixed portion; the thickness direction of the signal cable layer intersects with the arrangement direction of the two signal cable cores spaced apart in the center of the signal cable core pair.

9. The electronic device according to any one of claims 1 to 8, characterized in that: The first connector includes a substrate and a gold finger, the substrate is provided with a receiving groove; the gold finger is embedded in the receiving groove and connected to the substrate; the cable core is electrically connected to the gold finger; Along the thickness direction of the substrate, the cross-sectional shape of the gold finger is a trapezoid; or, the gold finger includes a first sub-portion and a second sub-portion, the first sub-portion and the second sub-portion are connected, and the first sub-portion is away from the surface of the substrate relative to the second sub-portion; Along a direction parallel to the substrate, a length of the first subsection is greater than a length of the second subsection.

10. A connection structure, characterized in that: It includes a cable and a first connector and a second connector connected at both ends of the cable; the first connector is connected to a first functional module, and the second connector is connected to a second functional module; the cable includes a fixed part, a plurality of cable cores and a low-loss part, and the fixed part covers the low-loss part and the plurality of cable cores; the plurality of cable cores include a signal cable core pair, the signal cable core pair includes two signal cable cores arranged at intervals, the low-loss part is located between two signal cable cores arranged at intervals in the signal cable core pair, and the dielectric constant of the low-loss part is smaller than the dielectric constant of the fixed part.

11. The connection structure according to claim 10, characterized in that: The low-loss portion includes a gaseous low-loss medium.

12. A cable, characterized in that: It includes a fixed part, a plurality of cable cores and a low-loss part, wherein the fixed part covers the low-loss part and the plurality of cable cores; the plurality of cable cores include a signal cable core pair, the signal cable core pair includes two signal cable cores spaced apart, the low-loss part is located between the two signal cable cores spaced apart in the signal cable core pair, and the dielectric constant of the low-loss part is smaller than the dielectric constant of the fixed part.

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