Laser packaging device

Abstract

The invention relates to the technical field of laser packaging, and discloses a laser packaging device. The laser packaging device comprises an optical assembly, the optical assembly comprises a box dam and an optical piece, the optical piece is arranged at the top of the box dam, and a first conductive layer is arranged at the bottom of the box dam; a groove is formed in the substrate, a second conducting layer is arranged on the outer edge of the groove, a third conducting layer is arranged at the bottom of the groove, a fourth conducting layer and a fifth conducting layer are arranged on the back face of the substrate, the second conducting layer is electrically connected with the fourth conducting layer, and the third conducting layer is electrically connected with the fifth conducting layer; the chip is arranged in the groove, the chip comprises a first electrode located at the bottom and a second electrode located at the top, the first electrode is electrically connected with the third conductive layer, and the second electrode is electrically connected with the second conductive layer through the first conductive layer. According to the laser packaging device provided by the invention, a traditional bonding wire electrical connection chip is omitted, space and point positions required by bonding wire welding are saved, and the requirement of miniaturization of a laser is further met.

Description

Technical Field

[0001] The present invention relates to the technical field of laser packaging, and in particular to a laser packaging device. Background Art

[0002] Today, intelligent sensing automation is developing rapidly, and the great contribution of optical sensors is irreplaceable. Among them, laser devices are widely used in high-end consumer, automotive, and industrial products. High reliability and miniaturization are the development trends of laser devices. Existing laser packages, such as high-power VCSEL chips (vertical chips), are packaged in the form of ceramic packages. Specifically, die bonding wires are bonded to the electrical functional area of ​​the chip, and then the optical diffuser is fixed at a certain height directly above the chip to achieve the optical shaping function. However, due to the use of die bonding wires, the chip needs to be electrically connected to the circuit board through bonding wires and pads, and the bonding wires need to leave enough installation space and operation space, so it is difficult to reduce the height and width of the laser device, and it is gradually unable to meet the needs of miniaturization.

[0003] Therefore, the laser device packaging technology in the prior art requires the use of bonding wires for connection, which results in an inability to reduce the size of the device and makes it difficult to meet the demand for miniaturization. Summary of the invention

[0004] In view of the above problems, the present invention aims to provide a laser packaging device that can solve the problem that the laser device packaging technology in the prior art requires the use of bonding wires for connection, which makes it impossible to reduce the size of the device and is difficult to meet the needs of miniaturization.

[0005] The above technical objectives of the present invention are achieved through the following technical solutions:

[0006] A laser packaging device, comprising:

[0007] An optical component, the optical component comprising a dam and an optical component, the optical component is arranged on the top of the dam, and a first conductive layer is arranged on the bottom of the dam;

[0008] A substrate, wherein a groove is provided on the substrate, a second conductive layer is provided on the outer edge of the groove, a third conductive layer is provided on the bottom of the groove, a fourth conductive layer and a fifth conductive layer are provided on the back side of the substrate, the second conductive layer is electrically connected to the fourth conductive layer, and the third conductive layer is electrically connected to the fifth conductive layer;

[0009] A chip is arranged in the groove, the chip comprises a first electrode at the bottom and a second electrode at the top, the first electrode is electrically connected to the third conductive layer, and the second electrode is electrically connected to the second conductive layer through the first conductive layer.

[0010] In a feasible embodiment, the second conductive layer is electrically connected to the fourth conductive layer via a first conductive column penetrating the substrate, and the third conductive layer is electrically connected to the fifth conductive layer via a second conductive column penetrating the substrate.

[0011] In a feasible embodiment, an upper end of the second electrode is flush with an upper end of the second conductive layer.

[0012] In a feasible embodiment, the dam and the substrate are sealed by welding the first conductive layer and the second conductive layer.

[0013] In a feasible embodiment, the optical component is a diffusion plate, and a cavity is formed between the dam, the optical component and the chip.

[0014] In a feasible embodiment, the material of the dam is the same as that of the optical component, and the dam and the optical component are integrally formed.

[0015] In a feasible embodiment, the material of the dam and the optical component is quartz glass.

[0016] In a feasible embodiment, the inner side wall of the dam is provided with a reflective layer; and / or

[0017] The optical component is provided with Fresnel rings or the optical component is in a Lambertian shape.

[0018] The present invention also provides a laser packaging device, comprising:

[0019] An optical component, the optical component comprising a dam and an optical component, the optical component is arranged on the top of the dam, and a first conductive layer and a second conductive layer are arranged in sequence on the bottom of the dam, wherein the first conductive layer and the second conductive layer form a step;

[0020] A chip is arranged in the step, the chip comprises a first electrode at the bottom and a second electrode at the top, the lower end of the first electrode is flush with the lower end of the second conductive layer, and the second electrode is electrically connected to the second conductive layer through the first conductive layer.

[0021] In a feasible embodiment, the first conductive layer and the second conductive layer are integrally formed.

[0022] Due to the adoption of the above technical solution, the present invention has at least the following beneficial effects:

[0023] The laser packaging device provided by the present invention is directly packaged on the outside of the chip through the dam, and the first electrode of the chip is directly electrically connected to the third conductive layer, and the second electrode is electrically connected to the second conductive layer through the first conductive layer, thereby omitting the traditional bonding wire to electrically connect the chip, saving the space and points required for bonding wire welding, and can greatly reduce the overall volume of the laser packaging device, further meeting the demand for miniaturization. At the same time, the chip electrodes are directly connected through the dam, and the heat generated by the chip during operation can be directly transferred to the outside through the dam for heat dissipation. The heat dissipation area is large and the heat dissipation path is short, thereby accelerating the heat dissipation effect and improving the heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a schematic structural diagram of a laser packaging device provided by an embodiment of the present invention;

[0025] Figure 2 is a schematic diagram of the substrate structure provided by an embodiment of the present invention;

[0026] Figure 3 is a schematic diagram of the main cross-sectional structure of the dam provided by an embodiment of the present invention;

[0027] Figure 4 is a schematic diagram of the structure of the enclosure dam provided by an embodiment of the present invention when viewed from above;

[0028] Figure 5 is a schematic structural diagram of another laser packaging device provided by an embodiment of the present invention;

[0029] Figure 6 is a structural schematic diagram of another laser packaging device provided by an embodiment of the present invention;

[0030] Figure 7 It is a schematic structural diagram of another laser packaging device provided in an embodiment of the present invention.

[0031] In the accompanying drawings, 1. optical component; 11. dam; 12. optical part; 13. first conductive layer; 2. substrate; 21. groove; 22. second conductive layer; 23. third conductive layer; 24. fourth conductive layer; 25. fifth conductive layer; 26. first conductive column; 27. second conductive column; 28. cavity; 29. ​​nano-optical layer; 3. chip; 4. step. DETAILED DESCRIPTION

[0032] The following is a clear and complete description of the technical solution of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by technicians in this field without creative work are within the scope of protection of the present invention.

[0033] In the description of the present invention, it should be noted that the orientations or positional relationships indicated by terms such as "center", "up", "down", "left", "right", "vertical", "horizontal", "inside" and "outside" are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0034] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0035] Embodiment 1:

[0036] See also Figure 1 , Figure 1 is a schematic diagram of the structure of a laser packaging device provided in this embodiment. A laser packaging device provided in this embodiment includes:

[0037] An optical component 1, comprising a dam 11 and an optical member 12, wherein the optical member 12 is disposed on the top of the dam 11, and a first conductive layer 13 is disposed on the bottom of the dam 11;

[0038] A substrate 2, wherein a groove 21 is provided on the substrate 2, a second conductive layer 22 is provided on the outer edge of the groove 21, a third conductive layer 23 is provided on the bottom of the groove 21, a fourth conductive layer 24 and a fifth conductive layer 25 are provided on the back of the substrate 2, the second conductive layer 22 is electrically connected to the fourth conductive layer 24, and the third conductive layer 23 is electrically connected to the fifth conductive layer 25;

[0039] The chip 3 is arranged in the groove 21, and the chip 3 includes a first electrode at the bottom and a second electrode at the top, and the first electrode is electrically connected to the third conductive layer 23, and the second electrode is electrically connected to the second conductive layer 22 through the first conductive layer 13.

[0040] It is understandable that the substrate 2 mainly adopts common substrate materials in the prior art, such as ceramics, organic boards, aluminum oxide, aluminum nitride, etc. Specifically, in this embodiment, the substrate 2 can be illustrated and described as a ceramic substrate. Furthermore, it can be understood that the main function of the first conductive layer 13, the second conductive layer 22, the third conductive layer 23, the fourth conductive layer 24, and the fifth conductive layer 25 is to connect the first electrode and the second electrode of the chip 3 to the control circuit corresponding to the PCB board or other components outside the laser packaging device. The first electrode and the second electrode mainly refer to the positive electrode and the negative electrode of the chip 3. The first electrode can be the positive electrode and the second electrode can be the negative electrode, or the first electrode can be the negative electrode and the second electrode can be the positive electrode. Those skilled in the art can make adaptive designs according to the actual chips used. For example, in this embodiment, the first electrode is the negative electrode and the second electrode is the positive electrode. It can be understood that in this embodiment, the chip 3 is preferably a laser chip for emitting laser. In addition, other chips other than the laser chip can be selected according to actual needs, such as LED chips or other ordinary chips. No strict restrictions or further examples are made here. Those skilled in the art can understand and select the settings according to the above description in combination with actual needs. The external PCB board and the corresponding control circuit can be designed by those skilled in the art according to actual needs, and no further description is given here.

[0041] Furthermore, in this embodiment, the electrical connection between the first electrode of the chip 3 and the third conductive layer 23, and between the second electrode and the first conductive layer 13, the second conductive layer 22 refers to direct contact and fixation to form an electrical connection, without the need for indirect connection through bonding wires, conductive wires, etc.

[0042] It is understandable that the dam 11 is mainly used to encapsulate the chip 3 around the chip 3. The material of the dam 11 can be the same as that of the substrate 2, such as ceramic. More details will not be described in detail here. The optical component 12 can be a lens or a common optical element such as an optical diffuser or a diffusion plate. The material can be selected from common materials such as quartz glass and plastic. In this embodiment, a diffusion plate made of quartz glass is used as the optical component 12 as a preferred example. The specific model and material can be selected and set according to actual needs in combination with the existing technology. Specifically, Figure 1 As shown in the figure, a stepped structure is provided at the upper end of the dam 11, so that the optical component 12 is fixed on the stepped structure of the dam 11 by gluing or other conventional materials. The stepped structure can make the contact between the optical component 12 and the dam 11 more closely fitted, and can also make the upper end of the optical component 12 flush with the upper end of the dam 11, thereby preventing the optical component 12 from protruding relative to the dam 11 and being easily scratched and loosened.

[0043] In this embodiment, if Figure 1 and Figure 2 As shown in Figure 2 This is a schematic diagram of the substrate structure provided in this embodiment, wherein the second conductive layer 22 is electrically connected to the fourth conductive layer 24 via a first conductive column 26 penetrating the substrate 2, and the third conductive layer 23 is electrically connected to the fifth conductive layer 25 via a second conductive column 27 penetrating the substrate 2.

[0044] It is understandable that the other side of the substrate 2 opposite to the side where the chip 3 is arranged can be electrically connected to an external PCB board, so as to connect the laser packaging device to an external control circuit and realize the control of the entire laser device. Figure 1 As shown in , the fourth conductive layer 24 and the fifth conductive layer 25 of the substrate 2 are respectively used to electrically connect with the PCB board arranged on the other side of the substrate 2. Specifically, in this embodiment, taking the first electrode of the chip 3 as the negative electrode as an example, one end of the fifth conductive layer 25 is electrically connected to the first electrode (i.e., the negative electrode) of the chip 3 through the second conductive column 27, the third conductive layer 23, and the second conductive layer 22, and the other end of the fifth conductive layer 25 is connected to the negative electrode access point of the preset control circuit on the PCB board; similarly, one end of the fourth conductive layer 24 is electrically connected to the second electrode (i.e., the positive electrode) of the chip 3 through the first conductive column 26 and the first conductive layer 22, and the other end of the fourth conductive layer 24 is connected to the positive electrode access point of the preset control circuit on the PCB board; as a whole, an electrical connection is formed between the laser packaging device and the external PCB board control circuit, and more specific details can be understood by those skilled in the art in combination with the above description and reasonably inferred and realized in combination with the prior art, and no further description is given here.

[0045] It can be understood that in this embodiment, it is equivalent to combining the substrate 2 and the optical component 1 into the outer shell part of the laser packaging device, setting the chip 3 on the substrate 2, and using the substrate 2 as a packaging bracket. The chip 3 is separated from the external PCB board by the substrate 2 so as not to directly contact. The advantage is that the chip 3 and the PCB board inside the laser packaging device can be isolated, which is convenient for subsequent replacement, maintenance, disassembly and assembly operations without directly operating the PCB board or the chip 3, thereby reducing damage to the PCB board or the chip 3.

[0046] It can be understood that for the pads, electrical connections, welding, etc. mentioned in this embodiment, unless otherwise specified, those skilled in the art can select existing technologies for implementation according to actual needs. For example, the first conductive layer 13, the second conductive layer 22, the third conductive layer 23, the fourth conductive layer 24, the fifth conductive layer 25, the first conductive column 26, the second conductive column 27, etc. can be set using conventional materials such as copper, tin, alloys, etc., and the specific description and examples are not further expanded here.

[0047] Furthermore, the shapes of the second conductive layer 22, the third conductive layer 23, the fourth conductive layer 24, and the fifth conductive layer 25 can be selected according to actual needs, for example, they can be configured accordingly according to the shapes of the electrodes or electrode access points of the chip 3 and the external PCB board, and can be circular, square or other shapes to ensure that the above-mentioned conductive layers can form a stable and effective electrical connection with the corresponding electrodes or electrode access points of the chip 3 and the external PCB board, which will not be further illustrated here; for the first conductive column 26 and the second conductive column 27, their shapes and structures can be simply deformed and designed according to the thickness of the substrate 2, for example, they can be cylindrical, polygonal columnar, etc., and the length direction can be linear, or it can be a broken line or other curved arrangement. More simple embodiments will not be further described here.

[0048] In this embodiment, combined with Figure 1 and Figure 2 As shown, the upper end of the second electrode is flush with the upper end of the second conductive layer 22 .

[0049] It can be understood that in order to enable the first conductive layer 13 to better connect the second electrode of the chip 3 and the second conductive layer 22 on the substrate 2 at the same time, the shape and structure of the first conductive layer 13 can be appropriately adjusted. For example, in the present embodiment, the first conductive layer 13 is arranged in a plane. At the same time, it is preferably required that the upper end of the second electrode of the chip 3 and the upper end of the second conductive layer 22 on the substrate 2 are flush, that is, the upper ends of the two are in the same plane, so that the first conductive layer 13 can simultaneously contact the second electrode of the chip 3 and the second conductive layer 22 on the substrate 2 for welding and fixed connection. In addition, in other embodiments, if there is a height difference between the upper end of the second electrode of the chip 3 and the upper end of the second conductive layer 22 on the substrate 2, the first conductive layer 13 or the second conductive layer 22 can be appropriately designed as a stepped structure or a sloped structure, so that the first conductive layer 13 simultaneously contacts the second electrode of the chip 3 and the second conductive layer 22 on the substrate 2, so as to facilitate simultaneous electrical connection. For example, the stepped structure can be understood and implemented with reference to the stepped structure arranged at the upper end of the substrate 2, and will not be further described here.

[0050] It can be understood that the primary function of the first conductive layer 13 is to be able to electrically connect with the second conductive layer 22 on the substrate 2 and the second electrode of the chip 3 when fixed to the substrate 2. The first conductive layer 13 can be preferably set by electroplating a metal layer at the bottom of the dam 11, and can also be set by welding or pasting according to the selection of the material of the substrate 2 to achieve dense fixation. The material of the first conductive layer 13 can be conventional materials such as gold, tin, copper, etc., which will not be further described here.

[0051] It is understandable that the electrical connection between the first conductive layer 13 and the second electrode of the chip 3 and the second conductive layer 22 on the substrate 2 may be achieved by welding and fixing with dielectric materials such as conductive glue, gold, tin, copper, etc.

[0052] In this embodiment, if Figure 3 and Figure 4 As shown, Figure 3 is a schematic diagram of the main cross-sectional structure of the dam provided in this embodiment, Figure 4 is a schematic diagram of the structure of the dam provided in this embodiment, Figure 1 As shown, the dam 11 and the substrate 2 are sealed by welding the first conductive layer 13 and the second conductive layer 22 .

[0053] It is understandable that, taking the second electrode of chip 3 as the positive electrode as an example, the positive electrode of chip 3 is generally distributed on the left and right sides or multiple sides of chip 3. For example, in this embodiment, the second electrode of chip 3 is set on the left and right sides as an example. If the second conductive layer 22 and the first conductive layer 13 are separately set for the second electrodes on both sides of chip 3, the processing difficulty of the dam 11 is increased, and it is difficult to ensure the sealing of the laser packaging device. In this embodiment, Figure 3 and Figure 4 As shown, the contact surface of the lower end of the dam 11 is larger, and the entire lower end is surrounded by a first conductive layer 13. Correspondingly, the second conductive layer 22 is surrounded by the chip 3. When the dam 11 is connected to the substrate 2 through the first conductive layer 13, the first conductive layer 13 can be connected to all the second electrode points of the chip 3 at the same time, and the first conductive layer 13 can form a sealed welding with the second conductive layer 22 around the outside of the chip 3, so that the chip 3 is encapsulated in the dam 11. The structure is more reasonable and can effectively improve the fixed relationship between the dam 11 and the substrate 2, thereby achieving an airtight sealing effect.

[0054] In this embodiment, if Figure 3 and Figure 4 As shown, the dam 11 is composed of side walls connected end to end, the optical element 12 is fixedly arranged at the upper end of the dam 11, and the lower end of the dam 11 is connected to the second conductive layer 22 through the first conductive layer 13 and fixedly arranged on the substrate 2.

[0055] In this embodiment, the optical component 12 is a diffusion plate, and a cavity 28 is formed between the dam 11 , the optical component 12 and the chip 3 .

[0056] It can be understood that the cavity 28 is the main internal space of the chip 3 package, which can package and protect the chip 3 and can also be used as a space for light adjustment. After the bonding wire is removed in this embodiment, the space of the cavity 28 can reduce its cavity height to the minimum according to actual needs, so as to achieve the miniaturization of the laser packaging device. The actual shape of the cavity 28 can be a simple deformation design according to actual needs. For example, in this embodiment, while the dam 11 is designed to be a square shape, the cavity 28 structure is etched or integrally formed on the dam 11, and the shape of the cavity 28 is also a square shape. However, in other embodiments, those skilled in the art can also simply change the shape of the cavity 28 and the dam 11 according to actual conditions, such as a hemispherical shape, a semi-ellipsoidal shape or other polygonal shapes, etc., which will not be further illustrated here.

[0057] In addition, in other embodiments of the present invention, a nano-optical layer 29 may be imprinted or coatings with different light effects may be applied on the side of the optical component 12 facing the cavity 28 to achieve the purpose of optical diffusion or form different light spot shapes and uniform light spot effects. As for the specific operation and setting form of the imprinted nano-optical layer and the coating layer, those skilled in the art can understand and implement them according to actual needs by referring to the prior art, and no further description will be given here.

[0058] When manufacturing the laser packaging device provided in this embodiment, the second conductive layer 22, the third conductive layer 23, the fourth conductive layer 24, the fifth conductive layer 25 and other structures can be first arranged on the substrate 2, and the first conductive layer 13 can be arranged on the dam 11, and then the chip 3 can be arranged on the substrate 2, and the first electrode of the chip 3 can be electrically connected to the third conductive layer 23. The optical component 12 and the dam 11 are further combined into an optical component 1, and the optical component 1 is welded to the substrate 2 through the first conductive layer 13. During welding, the first conductive layer 13 needs to be welded and fixed to the second conductive layer 22 on the substrate 2 and the second electrode of the chip 3 respectively to obtain the laser packaging device provided in this embodiment.

[0059] Due to the adoption of the above technical solution, the present invention has at least the following beneficial effects:

[0060] The laser packaging device provided by the present invention is directly packaged on the outside of the chip 3 through the dam 11, and the first electrode of the chip 3 is directly electrically connected to the third conductive layer 23, and the second electrode is electrically connected to the second conductive layer 22 through the first conductive layer 13, thereby omitting the traditional bonding wire to electrically connect the chip, saving the space and points required for bonding wire welding, and can greatly reduce the overall volume of the laser packaging device, further meeting the demand for miniaturization. At the same time, the chip 3 electrodes are directly connected through the dam 11, and the heat generated by the chip 3 during operation can be directly transferred to the outside through the dam 11 for heat dissipation. The heat dissipation area is large and the heat dissipation path is short, thereby accelerating the heat dissipation effect and improving the heat dissipation performance.

[0061] Embodiment 2:

[0062] In this embodiment, if Figure 5 , which is a schematic diagram of the structure of another laser packaging device provided in this embodiment. The difference from the previous embodiment is that the material of the dam 11 is the same as that of the optical component 12, and the dam 11 and the optical component 12 are integrally formed.

[0063] Specifically, in the present embodiment, the dam 11 and the optical component 12 are made of a common material for the optical component 12, such as quartz glass, so that the optical component 1 (i.e., the dam 11 and the optical component 12) are directly set on the substrate 2 as a whole. Only the welding and fixation between the optical component 12, the substrate 2 and the chip 3 need to be considered. Compared with the traditional method of separately pasting the optical component 12 on the dam 11, the risk of the optical component 12 falling off is avoided and higher reliability is achieved.

[0064] Further, it can be understood that the optical component 1 in the present embodiment can be manufactured by one-piece molding or etching, for example, in the present embodiment, the material of the dam and the optical component is preferably quartz glass. Specifically, in the present embodiment, a groove can be etched on a piece of quartz glass as a cavity 28 structure, and after the groove is leveled, a nano-optical layer 29 can be imprinted or a coating layer can be applied on the bottom surface of the groove (equivalent to the side of the optical component 12 facing the chip 3), and the optical component 12 can be formed on the bottom surface of the groove. More specific operations can also be selected and designed according to actual conditions, mainly to achieve the integrated setting of the optical component 1 required in the present embodiment.

[0065] Further, in this embodiment, the inner side wall of the dam 11 is provided with a reflective layer. Specifically, in the optical component 1 equivalent to the integrated design, except for one side used as the optical component 12, the other sides of the cavity 28 are provided with a reflective layer, and the reflective layer can be an aluminum or DBR reflective coating with a certain reflectivity. The setting of the reflective layer can further reflect and refract the light, and cooperate with the chip 3 to obtain the effect of ultra-high light efficiency and uniform light spot. In addition, the optical component 12 is provided with a Fresnel ring or the optical component 12 is in the shape of a Lambertian body. Specifically, the Fresnel ring can be directly etched on the side of the optical component 12 facing the chip 3, so that the optical component 12 forms a Fresnel lens. The Fresnel lens is composed of a plurality of concentric annular optical surfaces, which are called "Fresnel rings" or "Fresnel surfaces". Each Fresnel ring is a refractive surface of a part of a traditional lens. By decomposing the curvature of the lens into a plurality of small, gradually changing annular surfaces, the Fresnel lens significantly reduces the thickness and weight of the lens, and the overall design makes the lens look thinner and lighter. In addition, the optical element 12 may be designed into a Lambertian shape, and preferably, the side facing the chip 3 may be designed into a Lambertian shape. The Lambertian shape may be understood and implemented with reference to the prior art, and will not be further described here.

[0066] Embodiment 3:

[0067] See also Figure 6 , is a schematic diagram of the structure of another laser packaging device provided in this embodiment. The laser packaging device provided in this embodiment includes:

[0068] An optical component 1, the optical component 1 comprising a dam 11 and an optical element 12, the optical element 12 being arranged on the top of the dam 11, a first conductive layer 13 and a second conductive layer 22 being arranged in sequence on the bottom of the dam 11, the first conductive layer 13 and the second conductive layer 22 forming a step 4;

[0069] The chip 3 is arranged in the step 4, and the chip 3 includes a first electrode at the bottom and a second electrode at the top, the lower end of the first electrode is flush with the lower end of the second conductive layer 22, and the second electrode is electrically connected to the second conductive layer 22 through the first conductive layer 13.

[0070] It should be noted that the step 4 is an inverted step structure, so that the first conductive layer 13 can be pressed on the second electrode of the chip 2 and the upper end surface of the second conductive layer 22 to achieve synchronous contact, thereby facilitating simultaneous electrical connection and forming a restrictive fixed structure for the chip 3.

[0071] Furthermore, the difference from the aforementioned embodiment 1 is that in this embodiment, the laser packaging device does not need to set the chip through the substrate 2 and then electrically connect it to the external PCB board. The substrate 2 is directly omitted, which is equivalent to directly connecting the first electrode of the chip 3 to the external PCB board, and when the dam 11 is directly packaged and set on the PCB board, the second electrode of the chip 3 can be directly connected to the external PCB board through the first conductive layer 13 and the second conductive layer 22. Compared with embodiment 1, the role of the substrate 2 as an intermediate between the chip 3 and the PCB board is directly eliminated, which can further reduce the height and volume of the laser packaging device, better realize miniaturization design, and save the processing and manufacturing of the third conductive layer 23, the fourth conductive layer 24, the fifth conductive layer 25, the first conductive column 26, the second conductive column 27, etc., and the structure is simple and effective, saving product production and processing costs.

[0072] Furthermore, the lower end of the first electrode of the chip 3 is flush with the lower end of the second conductive layer 22, so that when the laser packaging device as a whole is subsequently connected to the external PCB board, it is easy to flush with the corresponding circuit access point of the external PCB board, and the overall equipment installation is more convenient and accurate.

[0073] Furthermore, in this embodiment, the first conductive layer 13 and the second conductive layer 22 are integrally formed, and the two can be made of the same material or different materials.

[0074] It can be understood that, in addition to setting the second conductive layer 13 as an intermediate connecting part between the first conductive layer 13 and the dam 11, the first conductive layer 13 can also be directly made into an integrated step structure design, that is, the first conductive layer 13 and the second conductive layer 22 are integrally formed, so that the first conductive layer 13 can be directly and simultaneously contacted with the second electrode of the chip 3 and the external PCB for electrical connection. The details will not be illustrated here, and those skilled in the art can make simple modifications based on the above description and actual needs.

[0075] It can be understood that, unless otherwise specified in this embodiment, the unmentioned contents can be understood and implemented by referring to the aforementioned embodiments, and will not be further repeated here.

[0076] It is understandable that if Figure 7 As shown, it is a structural schematic diagram of another laser packaging device provided in this embodiment. In the laser packaging device of this embodiment, the dam 11 and the optical component 12 are integrally formed. The specific details can be understood and implemented in conjunction with the aforementioned embodiment 2. The focus is on explaining that the technical solution formed by the combination of the technical features in this embodiment should fall within the protection scope of the present invention.

[0077] Although the present invention has been described in detail above by general description and specific embodiments, it is obvious to those skilled in the art that some modifications or improvements can be made to the present invention. Therefore, these modifications or improvements made without departing from the spirit of the present invention all belong to the scope of protection claimed by the present invention.

Claims

1. A laser packaging device, characterized in that: include: An optical component, the optical component comprising a dam and an optical component, the optical component is arranged on the top of the dam, and a first conductive layer is arranged on the bottom of the dam; A substrate, wherein a groove is provided on the substrate, a second conductive layer is provided on the outer edge of the groove, a third conductive layer is provided on the bottom of the groove, a fourth conductive layer and a fifth conductive layer are provided on the back side of the substrate, the second conductive layer is electrically connected to the fourth conductive layer, and the third conductive layer is electrically connected to the fifth conductive layer; A chip is arranged in the groove, the chip comprises a first electrode at the bottom and a second electrode at the top, the first electrode is electrically connected to the third conductive layer, and the second electrode is electrically connected to the second conductive layer through the first conductive layer.

2. The laser packaging device according to claim 1, characterized in that: The second conductive layer is electrically connected to the fourth conductive layer through a first conductive column penetrating through the substrate, and the third conductive layer is electrically connected to the fifth conductive layer through a second conductive column penetrating through the substrate.

3. The laser packaging device according to claim 1, characterized in that: An upper end of the second electrode is flush with an upper end of the second conductive layer.

4. The laser packaging device according to claim 1, characterized in that: The dam and the substrate are sealed by welding the first conductive layer and the second conductive layer.

5. The laser packaging device according to claim 1, characterized in that: The optical component is a diffusion plate, and a cavity is formed between the dam, the optical component and the chip.

6. The laser packaging device according to claim 1, characterized in that: The material of the dam is the same as that of the optical component, and the dam and the optical component are integrally formed.

7. The laser packaging device according to claim 6, characterized in that: The dam and the optical component are made of quartz glass.

8. The laser packaging device according to claim 1, characterized in that: The inner side wall of the dam is provided with a reflective layer; and / or The optical component is provided with Fresnel rings or the optical component is in a Lambertian shape.

9. A laser packaging device, characterized in that: include: An optical component, the optical component comprising a dam and an optical component, the optical component is arranged on the top of the dam, and a first conductive layer and a second conductive layer are arranged in sequence on the bottom of the dam, wherein the first conductive layer and the second conductive layer form a step; A chip is arranged in the step, the chip comprises a first electrode at the bottom and a second electrode at the top, the lower end of the first electrode is flush with the lower end of the second conductive layer, and the second electrode is electrically connected to the second conductive layer through the first conductive layer.

10. The laser packaging device according to claim 9, characterized in that: The first conductive layer and the second conductive layer are integrally formed.

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