Spherical pipeline detection device and manufacturing method

Abstract

The invention discloses a spherical pipeline detection device and a preparation method, the spherical pipeline detection device comprises a sphere, the sphere comprises a main control board, a charging receiving coil, a first rechargeable battery and an injection molding shell, and the charging receiving coil and the first rechargeable battery are located on the two sides of the main control board respectively and located in the injection molding shell in the middle. The wireless charging module is adopted for achieving wireless charging, the shell of the wireless charging module adopts the integrated injection molding technology, the problem that a traditional pipeline detection device needs to be charged after being opened is solved through the design, the device is more reliable and durable, the sensor is integrated in the ball, and the ball can freely flow in a pipeline and collect data.

Description

Technical Field

[0001] The invention relates to the field of pipeline fluid data collection and leakage detection, and in particular to a spherical pipeline detection device and a manufacturing method. Background Art

[0002] Fluid pipeline systems are widely used to transport various liquids and gases, such as oil, natural gas, water, etc. The safe operation of these pipeline systems is crucial, and pipeline leakage is a common and serious problem that may lead to adverse consequences such as resource waste, environmental pollution, safety accidents, and economic losses. Therefore, the development of effective leak detection technology and devices is of great practical significance.

[0003] Traditional leak detection methods include: manual inspection, pressure monitoring, flow monitoring, etc. Manual inspection is inefficient and difficult to guarantee accuracy, especially for long-distance and complex pipeline systems. Although pressure monitoring and flow monitoring methods can detect leaks to a certain extent, their ability to detect small leaks or leaks under complex working conditions is limited.

[0004] In recent years, with the development of sensor technology, sensor-based leak detection methods have gradually attracted attention. Some existing sensor systems are used for environmental monitoring. For example, US Patent US010653027B2 provides a sensor device that can flow freely in a fluid, which is used to collect fluid data and pipeline data, and is suitable for fluid pipelines of liquid and gas media. The sensor device is designed with a shell, which can maintain structural integrity and pressure resistance in a high-pressure fluid environment, and enhances the durability and reliability of the device. The main disadvantage is that the sensor device needs to be opened for charging, which is troublesome to operate and has a certain impact on the sealing performance. The shell cannot be integrally formed, which further affects the waterproof performance and overall appearance of the device. European Patent EP3677889B1 describes a sensor device for measuring fluid and fluid pipeline properties, which has high pressure resistance and temperature tolerance and is suitable for extreme environments. The power supply is activated by a Hall effect sensor, which provides an activation method without physical contact and increases the flexibility of use. Although the sensor device of the patent can be activated by a Hall effect sensor, it still needs to be opened for charging and does not have a wireless charging function. The device is large in size, which is not conducive to use in a space-constrained environment.

[0005] In view of the above problems, the present invention aims to provide an improved sensor device and manufacturing method for identifying leakage in a fluid pipeline, so as to detect fluid pipeline leakage more accurately and efficiently and overcome many deficiencies in the prior art. Summary of the invention

[0006] The present invention provides a spherical pipeline detection device and a manufacturing method. The present invention adopts a wireless charging module to realize wireless charging. The shell adopts an integrated injection molding process. This design solves the problem that traditional pipeline detection equipment needs to be opened for charging, making the device more reliable and durable. The sensor is integrated inside the sphere, which can flow freely in the pipeline and collect data. See the following description for details:

[0007] A spherical pipeline detection device, the device comprising: a sphere,

[0008] The sphere includes: a main control board, a charging receiving coil, a first rechargeable battery and an injection molded shell. The charging receiving coil and the first rechargeable battery are respectively located on both sides of the main control board and are centrally located inside the injection molded shell.

[0009] The main control board integrates MCU, wireless transmission module, Hall switch, vibration motor, MEMS pickup, three-axis magnetometer, six-axis gyroscope and beacon transmission module;

[0010] The wireless transmission module is used to transmit the data collected by the sphere, the Hall switch is used to wirelessly wake up the sphere in a dormant state; the vibration motor is used to provide a power-on reminder; the MEMS pickup is used to collect sound signals inside the pipeline; the three-axis magnetometer is used to detect defects in the pipeline; the six-axis gyroscope is used to detect the three-dimensional posture and dynamic changes of the sphere; the beacon transmission module inside the sphere is used for real-time positioning and data transmission.

[0011] The wireless transmission module adopts a SDMMC interface or a USB to WIFI method, and the MEMS pickup adopts a MEMS sensor.

[0012] The three-axis magnetometer adopts a magnetic sensor, and the six-axis gyroscope adopts a six-axis inertial motion sensor.

[0013] The beacon transmitting module includes: a class D power amplifier chip, a transmitting coil, an input signal source, a decoupling capacitor and an input capacitor.

[0014] The Class D power amplifier chip connects the GAIN pin to the MCU to adjust the gain to 12dB or 6dB, and the EN pin is connected to the MCU to enable or disable the chip; the inductance value and number of turns of the transmitting coil match the output impedance of the power amplifier chip; the input signal source uses a DAC to convert the digital signal into an analog signal to drive the chip; a 0.1μF decoupling capacitor is placed next to the VDD pin to reduce high-frequency noise.

[0015] A method for detecting a pipeline device, the method comprising:

[0016] Place the charging receiving coil, the second rechargeable battery, the main control board and the first rechargeable battery in sequence, and put the arranged hardware into the first limiting hole in the middle of the fixing bracket;

[0017] Use the bottom hemispherical mold and the mold holder to mold the bottom shell of the sphere, and then mold the upper shell;

[0018] Pour epoxy resin glue into the first molding cavity from above. When the first molding cavity is filled, stop pouring. After the glue is completely cured, remove the fixing bracket. At this time, the lower part of the hardware module is embedded in the glue and cured accordingly.

[0019] Place the top hemispherical mold on the bottom hemispherical mold, and then use the mold upper pressing plate to press on the edge of the top hemispherical mold, ensuring that the third limiting hole on the mold upper pressing plate corresponds to the bottom positioning pin, and the middle second supporting circular surface is just pressed on the outer surface of the second molding cavity to ensure the sealing of the contact surface between the bottom hemispherical mold and the top hemispherical mold;

[0020] The top hemispherical mold is provided with a pouring hole and a vent hole. The second molding cavity is filled with epoxy resin injection molding glue through the pouring hole. After it is completely cured, the mold upper pressure plate and the top hemispherical mold are removed, and the cured sphere is taken out; the excess parts at the pouring hole and the vent hole are polished off, and the production of the injection molded shell is completed.

[0021] When forming the bottom shell of the sphere, the first forming cavity in the middle of the bottom hemisphere mold is placed opposite to the first supporting circular surface in the middle of the mold bracket, and the hardware fixing bracket is placed above the bottom hemisphere mold.

[0022] When placing, ensure that the second limiting hole on the hardware fixing bracket is coaxially matched and fixed with the positioning pin on the mold bracket; the lower half of the hardware module in the middle of the hardware fixing bracket should be located in the middle of the first molding cavity.

[0023] The beneficial effects of the technical solution provided by the present invention are:

[0024] 1. The present invention integrates multiple sensors and modules on the main control board and adopts a spherical structure to minimize the volume and maximize the function, thereby improving the flexibility and accuracy of detection;

[0025] 2. The present invention integrates the charging receiving coil, the second rechargeable battery, the main control board and the first rechargeable battery in an orderly manner through an innovative hardware layout, optimizes the space utilization inside the sphere, and significantly improves the wireless charging efficiency; this design not only enhances the charging performance, but also improves the practicality and user convenience of the sphere;

[0026] 3. The present invention uses a high-precision three-axis magnetometer and a six-axis inertial motion sensor to enable the sphere to accurately detect the internal environment of the pipeline, providing reliable data support for pipeline maintenance and evaluation;

[0027] 4. The present invention adopts a step-by-step molding method to manufacture the injection molded shell, combined with precise mold matching and limit design, to achieve uniformity, accuracy and symmetry of the shell. This process not only improves the quality and appearance of the product, but also enhances the stability and durability of the sphere during use, while improving production efficiency and reducing costs;

[0028] 5. The injection-molded housing of the present invention provides physical protection for the internal hardware module and fixes the module through the internal solid structure, reducing the use of traditional machined parts and enhancing the reliability and stability of the sphere;

[0029] 6. The epoxy resin glue used in the injection molding shell of the present invention is an ideal material for making the outer shell of the pipeline detection sphere due to its excellent adhesion, low shrinkage, high strength, good waterproof sealing, chemical corrosion resistance, high temperature resistance, high mechanical strength and electrical insulation. In addition, the data penetration ability of the epoxy resin injection molding glue ensures the stability and reliability of the transmitted data, and its dyeability facilitates the customization of colors to meet different needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 This is an appearance diagram of a spherical pipeline detection device;

[0031] Figure 2 It is a hardware schematic diagram of a spherical pipeline detection device;

[0032] Figure 3 This is a physical picture of a spherical pipeline detection device;

[0033] Figure 4 It is a schematic diagram for fixing the hardware module;

[0034] Figure 5 This is an exploded view of the bottom casting tooling of a spherical pipeline detection device;

[0035] Figure 6 It is a cross-sectional view of the bottom casting tooling of a spherical pipeline detection device;

[0036] Figure 7 This is an exploded view of the top casting tooling of a spherical pipeline detection device;

[0037] Figure 8 It is a cross-sectional view of the top casting tooling of a spherical pipeline detection device;

[0038] Fig. 9This is a photo of the injection molding of a spherical pipeline detection device.

[0039] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0040] 1: sphere; 2: main control board; 3: charging coil; 4: first rechargeable battery; 40: second rechargeable battery; 5: injection molding shell; 6: hardware fixing bracket; 60: first limiting hole; 61: second limiting hole; 7: mold bracket; 70: positioning pin; 71: first supporting circular surface; 72: mold upper pressure plate; 73: second supporting circular surface; 74: third limiting hole; 8: bottom hemispherical mold; 80: first molding chamber; 9: top hemispherical mold; 90: second molding chamber; 91: casting hole; 92: exhaust hole. DETAILED DESCRIPTION

[0041] In order to make the objectives, technical solutions and advantages of the present invention more clear, the embodiments of the present invention are described in further detail below.

[0042] The embodiment of the present invention provides a spherical pipeline detection device and a manufacturing method. The spherical pipeline detection device is specially designed for detecting fluid and pipeline properties in a fluid pipeline, overcoming the limitations of the pipeline detection equipment in the prior art that it cannot be wirelessly charged and the shell is not integrally formed. The pipeline detection device of the embodiment of the present invention adopts integrated wireless charging technology, so that the shell can be integrally formed, thereby improving the waterproof performance and durability of the device, while simplifying the charging process and enhancing the user's convenience. In addition, the pipeline detection device of the embodiment of the present invention also has an optimized structural design, which enables it to flow freely in the pipeline, accurately collect fluid data, and detect the integrity and potential problems of the pipeline through built-in sensors.

[0043] Example 1

[0044] To achieve the above purpose, see Figures 1 to 7 The embodiment of the present invention provides a pipeline detection device. The main body of the sphere 1 is formed by injection molding. Figure 1 As shown, the sphere 1 includes: a main control board 2, a charging receiving coil 3, a first rechargeable battery 4 and an injection molded shell 5. The charging receiving coil 3 and the first rechargeable battery 4 are respectively located on both sides of the main control board 2 and are centrally located inside the injection molded shell 5. The charging receiving coil 3 is used to receive wireless charging signals to charge the first rechargeable battery 4. In order to increase the power reserve, a second rechargeable battery 40 is added between the main control board 2 and the charging receiving coil 3.

[0045] System hardware solutions such as Figure 2As shown, in addition to the aforementioned charging receiving coil 3 and the first rechargeable battery 4, the main control board 2 also integrates an MCU (microcontroller unit), a wireless transmission module, a Hall switch, a vibration motor, a MEMS pickup, a three-axis magnetometer, a six-axis gyroscope, and a beacon transmission module. Among them, the wireless transmission module is responsible for transmitting the data collected by the sphere 1. The Hall switch is used to wirelessly wake up the sphere 1 in a dormant state. The vibration motor is used to provide a power-on reminder. The MEMS pickup is used to collect sound signals inside the pipeline. The three-axis magnetometer is used to detect defects in the pipeline. The six-axis gyroscope is mainly used to detect the three-dimensional posture of the sphere 1 and its dynamic changes. The beacon transmission module inside the sphere 1 is mainly used for real-time positioning and data transmission. This module can help operators track the position of the sphere 1 in the pipeline and send the detected data back to the ground control station in real time to ensure the continuity of the detection process and the accuracy of the data.

[0046] Due to the need for low power consumption and long endurance, the average current of the beacon of the selected MCU is 80mA (unoptimized state). In an embodiment of the present invention, a low-power series of single-chip microcomputers is preferred. These single-chip microcomputers have many advantages: the core frequency is as high as 125MHz, and DSP and FPU are integrated, with powerful computing and processing capabilities; it has no less than 1MB of flash memory and 256KB of SRAM, which is sufficient to meet storage requirements; it can operate in a voltage range of 1.71V to 3.6V, with high flexibility; it uses QFN packaging and is compact; the standby power consumption is only 42nA, and the power consumption during normal operation is 110μA / MHz, with low power consumption; it also supports 2-channel DAC output, 2-channel SAI audio acquisition interface, 3-channel SPI interface and 2-channel SDMMC interface compatible with multiple specifications, whether it is data processing, signal conversion or external devices, it can be well competent and suitable for application scenarios of various electronic devices.

[0047] In an embodiment of the present invention, the sphere 1 adopts a wireless data transmission solution. Due to the large amount of data, the traditional serial port to Bluetooth transmission speed cannot meet the demand, so the SDMMC interface or USB to WIFI method is selected to increase the data transmission rate. The embodiment of the present invention uses a highly integrated single-frequency (2.4GHz) IEEE 802.11n 1x1 SoC, which is specially designed to support the high throughput data rate of the next generation WLAN products, supports the IEEE 802.11 security protocol, and the IEEE802.11e standard, supports 64 / 128-bit WEP data encryption and WPA-PSK / WPA2-PSK, WPA / WPA2 security mechanism. In terms of audio acquisition, a MEMS sensor is used, with a sensitivity of up to -26dB±3dB and an operating voltage range of 1.62V to 3.6V.

[0048] The three-axis magnetometer uses a high-precision magnetic sensor that can collect magnetic field data with a magnetic field range of ±800 microtesla (uT) and exchange data with the MCU through the SPI interface. The three-axis magnetometer can detect metal loss in the pipeline, such as metal thinning caused by corrosion. When there are no defects in the pipeline wall, the magnetic lines of force are evenly distributed in the pipe wall. However, if there are defects in the pipeline, such as corrosion or dents, the cross-sectional area of ​​the pipe wall is reduced, the magnetic resistance is increased, and the magnetic path is narrowed, causing some magnetic lines of force to pass through the two sides of the pipe wall to form a leakage magnetic field. These leakage magnetic fields are detected by the probe (sensor) close to the pipe wall and generate corresponding induction signals. The processed signal can be used to determine information such as the location, type, shape and size of the defect.

[0049] In terms of acceleration and angle sensing, a six-axis inertial motion sensor is used. The sensor is packaged with MEMS technology and integrates a 16-bit three-axis accelerometer and an ultra-low power three-axis gyroscope. It can output acceleration data (acceleration values ​​detected by the device in the X, Y, and Z axis directions) and gyroscope data (rotation speed of the device around the X, Y, and Z axes). When the accelerometer and gyroscope are running in full-speed mode, their typical power consumption is as low as 950 microamperes (μA). The three-axis angular velocity meter is mainly used to measure the three-dimensional posture and dynamic changes of the sphere 1, such as angular velocity and inclination, which helps to determine the precise position, curvature and direction of the pipeline. This sensor is crucial for trenchless construction, pipeline integrity assessment, and automated monitoring systems. It can improve the accuracy and efficiency of sphere 1 detection while ensuring the safety of the detection process.

[0050] The first rechargeable battery 4 uses a button-type rechargeable battery with a capacity of 120mAh. The approximate power consumption of the sphere 1 is about 20mA. By selecting two rechargeable batteries, a battery life of about 12 hours can be achieved. Due to volume limitations, the size of the charging receiving coil 3 cannot be too large, so its power is also limited. The receiving end uses a 5W wireless charging chip. When charging a 3.7V lithium battery, the wireless charging solution has an output voltage of 5V, a maximum current of 0.6A, a charging efficiency of between 70% and 80%, an operating frequency of 100-200kHz, and a typical value of the coil inductance of 15.8μH. The transmitter uses a 5W wireless transmitter charging IC, which has many excellent features: it is compatible with the WPC v1.2.4 standard and can meet the needs of various application scenarios of 5-10W; it has an input voltage withstand capability of up to 25V, and integrates NMOS full-bridge drive and internal voltage and current demodulation functions; it not only supports FOD (foreign object detection) to ensure safety, but also has static low power consumption (4mA) and high charging efficiency (79%), and supports firmware online upgrades; for the case of insufficient USB power supply, it has dynamic power adjustment function, input overvoltage and overcurrent protection mechanism, and also supports PD3.0 and NTC, using 5mm×5mm0.5pitch QFN32 package, with excellent overall performance and rich functions, providing a reliable solution for wireless charging applications.

[0051] The embodiment of the present invention also designs a low-frequency signal circuit for beacon transmission, which is based on a class D power amplifier chip and combined with components such as a transmitting coil. The circuit includes: a class D power amplifier chip, a transmitting coil, an input signal source (DAC), a decoupling capacitor and an input capacitor, as well as circuit layout and wiring. The class D power amplifier chip adjusts the gain to 12dB or 6dB by connecting the GAIN pin to the MCU, sets the VDD to 3.3V for power supply, and connects the EN pin to the MCU to enable or disable the chip. The transmitting coil is optimized according to the transmitting frequency and power, and its inductance value and number of turns match the output impedance of the power amplifier chip. The input signal source uses a DAC to convert digital signals into analog signals to drive the chip. A 0.1μF decoupling capacitor is placed next to the VDD pin to reduce high-frequency noise. When designing the circuit board, the connection between the power amplifier chip and the transmitting coil should be as short as possible to reduce loss and interference, and avoid wiring sensitive signal lines adjacent to power lines or ground lines.

[0052] Example 2

[0053] The embodiment of the present invention provides a method for manufacturing a pipeline detection device, which mainly describes the molding process of the injection molded housing 5. Figure 3 As shown, a physical picture of the detection device is shown, from which it can be seen that there is no fixed connection between the parts. The injection molded housing 5 not only has to realize the protection function, but also has to realize the relative fixation between the hardware modules.

[0054] Preferably, the injection molded shell 5 is made of epoxy resin injection molding glue. When making the shell of the pipeline detection ball, the epoxy resin injection molding glue shows its excellent bonding performance. It contains a variety of polar groups and highly active epoxy groups, and can form a strong bond with a variety of materials such as metal, glass, cement, plastic, etc. In addition, its low shrinkage rate characteristic helps to maintain the stability of the volume during the curing process. The shrinkage rate is only 1% to 2%, and it can even be reduced to less than 0.2% after adding fillers, thereby ensuring the dimensional accuracy of the pipeline detection ball shell. The high strength and low shrinkage rate of epoxy resin glue also give it good waterproof sealing properties, which can effectively fill gaps and voids to form a sealing layer that prevents moisture penetration. At the same time, the extremely high corrosion resistance of epoxy resin to chemicals such as acids, alkalis, and salts enhances the durability and reliability of the pipeline detection ball in a corrosive environment. The cured epoxy resin is not only resistant to high temperatures, but also has high mechanical strength, including: compressive, tensile and shear strength, which provides the necessary mechanical protection for the pipeline detection ball and can ensure normal operation under high-pressure pipeline conditions. The excellent electrical insulation performance of epoxy resin ensures the safe operation of the electronic components inside the sphere. The dimensional stability and durability of the epoxy resin system ensure that the pipeline detection sphere can still maintain good performance during long-term operation. The data penetration ability of epoxy resin injection molding glue ensures the stability and reliability of transmitted data, and its dyeability allows the color to be easily modified to meet the confidentiality requirements of the internal circuits of different pipeline detection spheres. In the embodiment of the present invention, blue epoxy resin is used. These comprehensive properties make epoxy resin injection molding glue an ideal material for the outer shell of the pipeline detection sphere.

[0055] The specific steps used to make the implementation plan are as follows:

[0056] Step 1: If Figure 3 and Figure 4 As shown, first place the hardware modules together in the order shown in the figure, namely, the charging receiving coil 3, the second rechargeable battery 40, the main control board 2 and the first rechargeable battery 4. Such a layout helps to ensure that the charging receiving coil 3 is closer to the outer surface of the sphere 1, and thus closer to the charging transmitting end, thereby improving the efficiency of wireless charging. After stacking the hardware modules, use the pre-prepared hardware fixing bracket 6 to clamp them. The specific operation is to put the arranged hardware into the first limiting hole 60 in the middle of the hardware fixing bracket 6, as shown in FIG. Figure 4 shown.

[0057] Step 2: If Figure 5 and Figure 6As shown, in order to obtain a spherical surface, an embodiment of the present invention adopts a step-by-step molding method. First, the bottom outer shell of the sphere 1 is molded, and then the upper outer shell is molded. When molding the bottom outer shell, a bottom hemispherical mold 8 and a mold bracket 7 are required. During operation, first place the first molding chamber 80 in the middle of the bottom hemispherical mold 8 opposite the first supporting circular surface 71 in the middle of the mold bracket 7, and place the hardware fixing bracket 6 above the bottom hemispherical mold 8. When placing, ensure that the second limiting hole 61 on the hardware fixing bracket 6 is coaxially fixed with the positioning pin 70 on the mold bracket 7. After fixation, the lower half of the hardware module in the middle of the hardware fixing bracket 6 should be located in the middle of the first molding chamber 80, as shown in FIG. Figure 6 Then, epoxy resin glue is poured into the first molding chamber 80 from above, and the pouring is stopped when the first molding chamber 80 is filled. After the glue is completely cured, the fixing bracket 6 is removed, and the lower part of the hardware module is embedded in the glue and cured accordingly.

[0058] Step 3: If Figure 7 and Figure 8 As shown, after completing the second step, the top hemispherical mold 9 is placed on the bottom hemispherical mold 8 to ensure that the edges are aligned. Then, the mold upper pressing plate 72 is used to press on the edge of the top hemispherical mold 9, ensuring that the third limiting hole 74 on the mold upper pressing plate 72 corresponds to the bottom positioning pin 70, and the middle second supporting circular surface 73 is just pressed on the outer surface of the second molding cavity 90 to ensure the sealing of the contact surface between the bottom hemispherical mold 8 and the top hemispherical mold 9, as shown in FIG. Figure 8 As shown. The top hemispherical mold 9 is provided with a pouring hole 91 and an exhaust hole 92. The pouring hole 91 is used to pour the epoxy resin injection molding glue, and the exhaust hole 92 is used to exhaust. The second molding cavity 90 is filled with the epoxy resin injection molding glue through the pouring hole 91. After it is completely cured, the mold upper pressing plate 72 and the top hemispherical mold 9 are removed, and the cured sphere 1 is taken out. Finally, the excess parts at the pouring hole 91 and the exhaust hole 92 are polished off. At this point, the production of the injection molded shell 5 is completed, and the final effect is as shown. Fig. 9 shown.

[0059] The embodiment of the present invention provides an innovative method for manufacturing a pipeline detection device. The sphere 1 is manufactured by injection molding technology and has an integrated hardware layout and enhanced functionality. The sphere 1 integrates a main control board 2, a charging receiving coil 3, a first rechargeable battery 4, and an additional second rechargeable battery 40, ensuring low power consumption and long battery life of the device. In addition, the sphere 1 is also equipped with an MCU, a wireless transmission module, a Hall switch, a vibration motor, a pickup, a three-axis magnetometer, a three-axis angular velocity meter, and a beacon transmission module. These components together realize data acquisition, processing, storage, and real-time transmission, thereby improving the accuracy and efficiency of detection.

[0060] In terms of material selection, the embodiment of the present invention preferably uses epoxy resin injection molding glue as the material for the injection molding shell 5. This material is an ideal choice for making the shell of the pipeline detection ball due to its excellent bonding performance, low shrinkage rate, high strength, good waterproof sealing, chemical corrosion resistance, high temperature resistance, high mechanical strength and electrical insulation performance. In addition, the data penetration ability and dyeability of epoxy resin injection molding glue further enhance the comprehensive performance of the ball 1.

[0061] During the manufacturing process, the embodiment of the present invention adopts a step-by-step molding method, first molding the bottom shell of the sphere 1, and then molding the upper shell, ensuring the uniformity and accuracy of the shell. Through the carefully designed hardware layout and precise mold matching, the embodiment of the present invention not only improves production efficiency, but also reduces production costs, while ensuring the quality and appearance of the final product.

[0062] In summary, the pipeline detection device of the embodiment of the present invention provides an efficient and reliable pipeline detection solution with its innovative design, optimized material selection and sophisticated manufacturing process. It is suitable for pipeline detection under various environmental conditions and has significant market application potential and industrial value.

[0063] Unless otherwise specified, the models of the components in the embodiments of the present invention are not limited, and any device that can perform the above functions may be used.

[0064] Those skilled in the art will appreciate that the accompanying drawing is only a schematic diagram of a preferred embodiment, and the serial numbers of the embodiments of the present invention are only for description and do not represent the advantages or disadvantages of the embodiments.

[0065] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A spherical pipeline detection device, characterized in that: The device comprises: a sphere, The sphere includes: a main control board, a charging receiving coil, a first rechargeable battery and an injection molded shell. The charging receiving coil and the first rechargeable battery are respectively located on both sides of the main control board and are centrally located inside the injection molded shell.

2. A spherical pipeline detection device according to claim 1, characterized in that: The main control board integrates MCU, wireless transmission module, Hall switch, vibration motor, MEMS pickup, three-axis magnetometer, six-axis gyroscope and beacon transmission module; The wireless transmission module is used to transmit the data collected by the sphere, the Hall switch is used to wirelessly wake up the sphere in a dormant state; the vibration motor is used to provide a power-on reminder; the MEMS pickup is used to collect sound signals inside the pipeline; the three-axis magnetometer is used to detect defects in the pipeline; the six-axis gyroscope is used to detect the three-dimensional posture and dynamic changes of the sphere; the beacon transmission module inside the sphere is used for real-time positioning and data transmission.

3. A spherical pipeline detection device according to claim 1, characterized in that: The wireless transmission module adopts a SDMMC interface or a USB to WIFI mode, and the MEMS pickup adopts a MEMS sensor.

4. A spherical pipeline detection device according to claim 2, characterized in that: The three-axis magnetometer uses a magnetic sensor.

5. A spherical pipeline detection device according to claim 2, characterized in that: The six-axis gyroscope adopts a six-axis inertial motion sensor.

6. A spherical pipeline detection device according to claim 2, characterized in that: The beacon transmission module includes: a class D power amplifier chip, a transmitting coil, an input signal source, a decoupling capacitor and an input capacitor. The Class D power amplifier chip connects the GAIN pin to the MCU to adjust the gain to 12dB or 6dB, and the EN pin is connected to the MCU to enable or disable the chip; the inductance value and number of turns of the transmitting coil match the output impedance of the power amplifier chip; the input signal source uses a DAC to convert the digital signal into an analog signal to drive the chip; a 0.1μF decoupling capacitor is placed next to the VDD pin to reduce high-frequency noise.

7. A method for manufacturing a pipeline detection device according to any one of claims 1 to 6, characterized in that: The method comprises: Place the charging receiving coil, the second rechargeable battery, the main control board and the first rechargeable battery in sequence, and put the arranged hardware into the first limiting hole in the middle of the fixing bracket; Use the bottom hemispherical mold and the mold holder to mold the bottom shell of the sphere, and then mold the upper shell; Pour epoxy resin glue into the first molding cavity from above. When the first molding cavity is filled, stop pouring. After the glue is completely cured, remove the fixing bracket. At this time, the lower part of the hardware module is embedded in the glue and cured accordingly. Place the top hemispherical mold on the bottom hemispherical mold, and then use the mold upper pressing plate to press on the edge of the top hemispherical mold, ensuring that the third limiting hole on the mold upper pressing plate corresponds to the bottom positioning pin, and the middle second supporting circular surface is just pressed on the outer surface of the second molding cavity to ensure the sealing of the contact surface between the bottom hemispherical mold and the top hemispherical mold; The top hemispherical mold is provided with a pouring hole and a vent hole. The second molding cavity is filled with epoxy resin injection molding glue through the pouring hole. After it is completely cured, the mold upper pressure plate and the top hemispherical mold are removed, and the cured sphere is taken out; the excess parts at the pouring hole and the vent hole are polished off, and the production of the injection molded shell is completed.

8. The method according to claim 7, characterized in that When forming the bottom shell of the sphere, the first forming cavity in the middle of the bottom hemisphere mold is placed opposite to the first supporting circular surface in the middle of the mold bracket, and the hardware fixing bracket is placed above the bottom hemisphere mold.

9. The method according to claim 7, characterized in that: When placing, ensure that the second limiting hole on the hardware fixing bracket is coaxially matched and fixed with the positioning pin on the mold bracket; the lower half of the hardware module in the middle of the hardware fixing bracket should be located in the middle of the first molding cavity.

Images