LED packaging device capable of reducing central light emission
By introducing a light barrier layer into the LED package device to block the light output in the central area, the problems of excessive brightness and uneven light distribution in traditional LED package devices are solved, and more uniform light distribution and higher luminous efficiency are achieved .
Patent Information
- Application Number
- CN202411673094.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-21
- Publication Date
- 2025-02-25
AI Technical Summary
Traditional LED packaging devices have problems such as excessive central brightness and uneven light distribution when emitting light, which affects the visual effect and may lead to glare or light pollution.
An LED packaging device including a bracket, an LED chip, a solid crystal adhesive layer, a light barrier layer and a packaging adhesive layer are designed. A light barrier layer is placed above the LED chip to block or reduce light output in the central area and improve light uniformity.
By reducing central light out, the uniformity of light is improved, the risks of glare and light pollution are reduced, the luminous efficiency and visual effect are improved, while the thermal management and protection performance is enhanced.
Smart Images
Figure CN119521890A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of LEDs, in particular to an LED packaging device capable of reducing central light emission. Background Art
[0002] When emitting light, traditional LED package devices often have problems such as excessive central brightness and uneven light distribution, which not only affects the visual effect of the LED device, but also may cause unnecessary glare or light pollution to the surrounding environment. Therefore, how to design an LED package device that can effectively reduce the central light output and improve the uniformity of light has become an urgent problem to be solved in the current LED technology field. Summary of the invention
[0003] In order to overcome the problems existing in the prior art, an object of the present invention is to provide an LED packaging device which reduces the center light emission.
[0004] The technical solution adopted by the present invention to solve the technical problem is: an LED packaging device for reducing central light emission, comprising:
[0005] Bracket, LED chip, solid crystal adhesive layer, light blocking layer and packaging adhesive layer;
[0006] A bowl-shaped cavity is provided in the bracket, and one side of the LED chip is attached to the bottom of the cavity, the other side of the LED chip is attached to one side of the solid crystal glue layer, one side of the solid crystal glue layer is attached to one side of the light blocking layer, and the other side of the encapsulation glue layer faces the opening of the bracket, the encapsulation glue layer covers the surfaces of the LED chip, the solid crystal glue layer and the light blocking layer, and the surface of the encapsulation glue layer is flush with the edge of the bracket opening.
[0007] Main working principle: The LED chip is precisely placed at the bottom of the bowl-shaped cavity in the bracket. This design ensures that the LED chip fits tightly to the bottom of the cavity, which is conducive to heat conduction and initial guidance of light. The bonding layer is applied between the LED chip and the bracket, and between the LED chip and subsequent components to provide a stable connection. The bonding layer not only plays a fixing role, but also can buffer the thermal and mechanical stress generated by the LED chip during operation to a certain extent. The light blocking layer is placed above the LED chip and fits one side of the bonding layer. The design of the light blocking layer is the key. It is used to block or reduce the light output in the center area of the LED chip, thereby improving the uniformity of the light. The encapsulation layer is coated on the surface of the LED chip, the bonding layer and the light blocking layer, and faces the opening of the bracket. The encapsulation layer not only provides additional protection and fixing, but also ensures the sealing and environmental adaptability of the entire packaged device. Finally, the surface of the encapsulation layer is flush with the edge of the bracket opening, forming a smooth appearance.
[0008] When the LED chip is powered on and activated, it emits light. These rays first pass through the material of the LED chip itself, and then encounter the die-bonding layer and the light-blocking layer. The die-bonding layer here mainly plays a light-transmitting role and has little effect on the propagation of light. However, its presence ensures the connection between the LED chip and subsequent components. The light-blocking layer plays a key role. It can block or reduce the light output in the center area of the LED chip. In this way, the central light that may have been too concentrated is dispersed or blocked, thereby improving the light uniformity of the entire packaged device. The light blocked by the light-blocking layer may be reflected back into the LED chip, or finally output from the edge area after multiple reflections inside the encapsulation layer. This design helps to reduce glare and light pollution, and improve the utilization efficiency and visual effect of light.
[0009] The bowl-shaped cavity design of the bracket is not only conducive to the guidance of light, but also provides a good thermal management channel. The LED chip generates heat when working, and this heat can be conducted to the external environment through the cavity and the bracket. The solid crystal glue layer and the encapsulation glue layer also have certain thermal conductivity. They can help disperse the heat generated by the LED chip to a larger area, thereby reducing the operating temperature of the LED chip and improving the reliability of the device. The encapsulation glue layer also provides protection for the LED chip and the entire packaged device. It can prevent external moisture, dust and other contaminants from invading the interior of the packaged device, thereby extending the service life of the device and improving its stability.
[0010] In summary, the LED package device with reduced center light emission achieves effective guidance and blocking of the light emitted by the LED chip through precise structural design and component configuration. This design not only improves the uniformity of light and reduces glare and light pollution, but also improves the thermal management and protection performance of the device.
[0011] Preferably, the bottom of the cavity is hexagonal, and the cavity gradually expands outward along the opening direction.
[0012] Preferably, the LED chip is arranged at the center of the cavity.
[0013] Preferably, the light blocking layer partially covers the surface of the LED chip.
[0014] Preferably, the light blocking layer is parallel to the LED chip and covers the center line of the LED chip, both ends of the bottom of the light blocking layer extend to the edge of the LED chip and are flush with or exceed the edge of the LED chip, and there is a gap between the two sides of the bottom of the light blocking layer and the edge of the LED chip.
[0015] Preferably, the light blocking layer is arranged along a line connecting one pair of corners of the LED chip, and a gap is left between two sides of the light blocking layer and the other pair of corners of the LED chip.
[0016] Preferably, the bottom surface of the light blocking layer is in the shape of a square, a rectangle or a polygon; the three-dimensional structure of the light blocking layer is in the shape of a prism or a prism.
[0017] Preferably, the light blocking layer is made of a transparent thermosetting resin material, filled with a reflective material, and has a reflectivity of 60-70%. The light transmittance of the light blocking layer is 20%-40%.
[0018] Preferably, the encapsulation adhesive layer is a transparent thermosetting resin material or a thermosetting resin material containing fluorescent powder.
[0019] Preferably, the LED chip is a front-mounted chip, a vertical chip or a flip-chip; the shape of the LED chip is a cube or a cuboid.
[0020] Compared with the prior art, the present invention has the following beneficial effects:
[0021] The present invention introduces a light blocking layer, and the packaging device can significantly reduce the light output in the central area of the LED chip, making the light distribution more uniform. This helps to avoid the glare problem caused by excessive central brightness and improve visual comfort. The design of the light blocking layer not only reduces the central light output, but also causes the blocked light to be output from the edge area after multiple reflections inside the packaging device. This design helps to make full use of the light emitted by the LED chip and improve the luminous efficiency. The bowl-shaped cavity design of the bracket and the thermal conductivity of the solid crystal glue layer and the packaging glue layer together constitute an effective thermal management channel. This helps to conduct the heat generated by the LED chip to the external environment in a timely manner, reduce the operating temperature of the device, and improve reliability and service life. The packaging glue layer not only provides a sealing effect on the LED chip and the entire packaging device, but also has a certain mechanical strength and corrosion resistance. This helps to prevent external moisture, dust and other pollutants from invading the interior of the packaging device and protect the device from damage.
[0022] Since the packaged device has excellent performance in light uniformity, luminous efficiency, thermal management performance, protection performance and manufacturing process, it has a wide range of application prospects. It can be used in various occasions that require high-quality lighting, such as indoor lighting, automotive lighting, display backlight, etc.
[0023] In summary, the LED packaging device with reduced central light emission shows significant beneficial effects in many aspects, and has broad market application prospects and important technical value. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.
[0025] Figure 1 A top view of the LED package device with reduced center light emission Figure 1 ;
[0026] Figure 2 A top view of the LED package device with reduced center light emission Figure 2 ;
[0027] Figure 3 The side view of the LED package device with reduced center light emission Figure 1 ;
[0028] Figure 4 The side view of the LED package device with reduced center light emission Figure 2 ;
[0029] Figure 5 A light distribution curve diagram of the LED package device along the short side of the light blocking layer 4;
[0030] Figure 6 It is a light distribution curve diagram of the LED package device along the long side of the light blocking layer 4.
[0031] 1. Bracket; 10. Cavity; 2. LED chip; 3. Solid crystal adhesive layer; 4. Light blocking layer; 5. Encapsulation adhesive layer. DETAILED DESCRIPTION
[0032] In order to more clearly understand the above-mentioned objects, features and advantages of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth in order to fully understand the present invention, and the embodiments described are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in the art without making creative work are within the scope of protection of the present invention.
[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.
[0034] Example 1
[0035] This embodiment discloses an LED packaging device that reduces the center light output, such as Figure 1-Figure 4 As shown, it includes a bracket, an LED chip, a solid crystal adhesive layer, a light blocking layer and an encapsulation adhesive layer. A bowl-shaped cavity is provided in the bracket, one side of the LED chip is attached to the bottom of the cavity, and the other side is attached to one side of the solid crystal adhesive layer. The other side of the solid crystal adhesive layer is attached to one side of the light blocking layer, and the encapsulation adhesive layer covers the surface of the LED chip, the solid crystal adhesive layer and the light blocking layer, and the other side of the encapsulation adhesive layer faces the bracket opening and is flush with the edge of the bracket opening.
[0036] When the LED chip is powered on and activated, it emits light. These rays first pass through the material of the LED chip itself and then encounter the bonding layer. The bonding layer here mainly plays a light-transmitting role and guides the light to the light blocking layer. The light blocking layer is designed to block or reduce the light output in the center area of the LED chip, so that the light is more evenly distributed around the LED package device. The light that is not blocked by the light blocking layer continues to pass through the packaging layer and radiates out from the bracket opening. Through the design of the light blocking layer, the light output in the center area of the LED chip is significantly reduced, avoiding the glare problem caused by excessive brightness in the center. The light blocking layer makes the light more evenly distributed around the LED package device, improving the visual effect. The bonding layer and the packaging layer provide protection and fixation for the LED chip and the light blocking layer, enhancing the stability and reliability of the packaged device.
[0037] For details, please refer to Figure 5 to Figure 6 , Figure 5 This is a light distribution curve diagram of the LED package device along the short side of the light blocking layer of this embodiment. It can be seen that the light intensity of the LED package device along the short side increases from 0 degrees to 60 degrees and then decreases, forming a bat-wing curve. The light output angle can achieve a range of 150 degrees. Figure 6 This is a light distribution curve diagram of the LED package device along the long side of the light blocking layer of the present embodiment. It can be seen that the light output intensity of the LED package device along the long side direction decreases from 0 degrees to 90 degrees, presenting a nearly Lambertian curve, and the light output angle can achieve a range of 130 degrees. While weakening the central light intensity of the LED device, it can also achieve light output in different angle ranges in different horizontal and vertical directions and form different light distribution curves.
[0038] In some optional embodiments, the bottom of the cavity is hexagonal, and the cavity gradually expands outward along the opening direction. The hexagonal cavity bottom design can better match the shape of the LED chip, so that the light is more evenly distributed in the cavity. At the same time, the gradual expansion of the cavity helps the light to spread more evenly from the LED chip to the surroundings, further improving the uniformity of the light.
[0039] In some optional embodiments, the LED chip is arranged at the center of the cavity. Placing the LED chip at the center of the cavity can ensure that light is evenly radiated from the center of the chip to the surroundings. At the same time, the bowl-shaped design of the cavity also helps to evenly distribute the light in the cavity. Placing the LED chip at the center of the cavity simplifies the design and production process of the packaged device.
[0040] In some optional embodiments, the light blocking layer partially covers the surface of the LED chip. The light blocking layer blocks or reduces the light output in the central area by partially covering the surface of the LED chip. The area not covered by the light blocking layer continues to emit light, forming a more uniform light distribution. By adjusting the coverage area and position of the light blocking layer, the light output can be precisely controlled to meet the needs of different application scenarios. The design of the light blocking layer makes the light more evenly distributed around the LED package device, improving the visual effect.
[0041] In some optional embodiments, such as Figure 1 As shown, the light blocking layer is parallel to the LED chip and covers the center line of the LED chip, and the two ends of the bottom extend to the edge of the LED chip or exceed it, leaving gaps on both sides. The light blocking layer is parallel to the LED chip and covers the center line. By adjusting the width and length of the light blocking layer, the light distribution can be precisely controlled. The areas not covered by the light blocking layer continue to emit light, forming a more uniform light distribution. At the same time, the two ends of the bottom of the light blocking layer extend to the edge of the LED chip or exceed it, which can further reduce the center light. By adjusting the width and length of the light blocking layer, the light distribution can be precisely controlled to meet the needs of different application scenarios.
[0042] In some optional embodiments, such as Figure 2 As shown, the light blocking layer is arranged along the line connecting one pair of corners of the LED chip, and a gap is left between the two sides and the other pair of corners. The light blocking layer is arranged along a specific diagonal line to form a specific light distribution pattern. The area not covered by the light blocking layer continues to emit light, forming a more uniform light distribution. At the same time, a gap is left between the two sides of the light blocking layer and the other pair of corners to ensure that there is enough light output in the edge area. By adjusting the position and size of the light blocking layer, different light distribution patterns can be formed to meet the needs of different application scenarios.
[0043] In some optional embodiments, such as Figure 3-Figure 4As shown, the bottom surface of the light blocking layer is in the shape of a square, a rectangle or a polygon, and the three-dimensional structure is a prism or a pyramid. Light blocking layers of different shapes and structures can affect the propagation and distribution of light. The bottom surface shape of a square, a rectangle or a polygon and the three-dimensional structure of a prism or a pyramid can form different light distribution patterns. By selecting different bottom surface shapes and three-dimensional structures, different light distribution patterns can be formed to meet the needs of different application scenarios.
[0044] In some optional embodiments, the light blocking layer is composed of a transparent thermosetting resin material, filled with a reflective material, with a reflectivity of 60-70% and a transmittance of 20%-40%. The transparent thermosetting resin material provides structural support, and the reflective material is used to block and reflect light. The reflectivity is controlled between 60-70%, which can ensure that most of the light is reflected back into the LED chip or diffused to the surroundings; the transmittance is controlled between 20%-40%, which can ensure that part of the light passes through the light blocking layer and radiates out. Through reasonable control of reflectivity and transmittance, efficient light blocking and reflection can be achieved, reducing central light and improving light uniformity. The transparent thermosetting resin material has good stability and durability, which can ensure that the packaged device maintains stable performance during long-term use.
[0045] In some optional embodiments, the encapsulation adhesive layer is a transparent thermosetting resin material or a thermosetting resin material containing fluorescent powder.
[0046] The encapsulation layer not only provides protection and fixation, but also allows phosphors to be added as needed to adjust the color of the light. The transparent encapsulation layer ensures that light can pass through and radiate smoothly; the encapsulation layer containing phosphors can convert the light emitted by the LED chip into light of other colors. By adding different types of phosphors, different colors of light effects can be achieved to meet the needs of different application scenarios.
[0047] In some optional embodiments, the LED chip is one of a forward chip, a vertical chip or a flip chip, and the shape is one of a cube or a cuboid. Different types of LED chips have different luminous properties and packaging requirements. There are differences in luminous efficiency, heat dissipation performance and packaging structure between forward chips, vertical chips and flip chips; the shape of a cube or a cuboid will affect the distribution of light and the appearance of the packaged device. By selecting different types and shapes of LED chips, the requirements of different application scenarios for luminous properties and packaging forms can be met. The same type of LED chips and shapes can optimize the performance of the packaged device and improve luminous efficiency, heat dissipation performance and stability.
[0048] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Therefore, any modification, equivalent change and modification made to the above embodiment according to the technical essence of the present invention without departing from the technical solution of the present invention shall still fall within the scope of the technical solution of the present invention.
Claims
1. An LED package device for reducing central light emission, characterized in that: include: Bracket, LED chip, solid crystal adhesive layer, light blocking layer and packaging adhesive layer; A bowl-shaped cavity is provided in the bracket, and one side of the LED chip is attached to the bottom of the cavity, the other side of the LED chip is attached to one side of the solid crystal glue layer, one side of the solid crystal glue layer is attached to one side of the light blocking layer, and the other side of the encapsulation glue layer faces the opening of the bracket, the encapsulation glue layer covers the surfaces of the LED chip, the solid crystal glue layer and the light blocking layer, and the surface of the encapsulation glue layer is flush with the edge of the bracket opening.
2. The LED package device with reduced central light emission according to claim 1, characterized in that: The bottom of the cavity is hexagonal, and the cavity gradually expands outward along the opening direction.
3. The LED package device with reduced central light emission according to claim 1, characterized in that: The LED chip is disposed at the center of the cavity.
4. The LED package device with reduced central light emission according to claim 1, characterized in that: The light blocking layer partially covers the surface of the LED chip.
5. The LED package device with reduced central light emission according to claim 4, characterized in that: The light blocking layer is kept parallel to the LED chip, and the light blocking layer covers the center line of the LED chip. Both ends of the bottom of the light blocking layer extend to the edge of the LED chip and are flush with or exceed the edge of the LED chip, and there is a gap between the two sides of the bottom of the light blocking layer and the edge of the LED chip.
6. The LED package device with reduced central light emission according to claim 4, characterized in that: The light blocking layer is arranged along a line connecting one pair of corners of the LED chip, and a gap is left between two sides of the light blocking layer and the other pair of corners of the LED chip.
7. The LED package device with reduced central light emission according to claim 1, characterized in that: The bottom surface of the light blocking layer is in the shape of a square, a rectangle or a polygon; the three-dimensional structure of the light blocking layer is in the shape of a prism or a prism.
8. The LED package device with reduced central light emission according to claim 1, characterized in that: The light blocking layer is composed of a transparent thermosetting resin material and is filled with a reflective material, with a reflectivity of 60-70%, and a light transmittance of 20%-40%.
9. The LED package device with reduced central light emission according to claim 1, characterized in that: The encapsulation adhesive layer is a transparent thermosetting resin material or a thermosetting resin material containing fluorescent powder.
10. The LED package device with reduced central light emission according to claim 1, characterized in that: The LED chip is one of a front-mounted chip, a vertical chip or a flip-chip; the shape of the LED chip is one of a cube or a rectangular parallelepiped.