Display substrate, preparation method thereof and display panel

Abstract

The invention is suitable for the technical field of photoelectricity, and provides a display substrate and a preparation method thereof and a display panel, the display substrate comprises a substrate and a first circuit layer, an isolation layer and a second circuit layer which are arranged on one side of the substrate, the first circuit layer is adjacent to the second circuit layer and is not connected with the second circuit layer, the first circuit layer is provided with at least one first end, and the second circuit layer is provided with at least one second end. The second circuit layer is provided with at least one second end, and one first end and one second end are located on the same side; the isolation layer is arranged between the first end and the second end of at least one side in the direction perpendicular to the substrate and comprises a first sub-isolation layer and a second sub-isolation layer which are connected. The thickness of the first sub-isolation layer in the direction perpendicular to the substrate is larger than that of the second sub-isolation layer in the direction perpendicular to the substrate, and the first sub-isolation layer has contact surfaces with the first end and the second end respectively. According to the display substrate, the serial connection of the first circuit layer and the second circuit layer can be improved through the design of the isolation layer, and the product yield is improved.

Description

Technical Field

[0001] The present application belongs to the field of optoelectronic technology, and in particular, relates to a display substrate and a preparation method thereof, and a display panel. Background Art

[0002] Organic Light Emitting Diode (OLED) display panels have been increasingly studied and applied due to their advantages such as automatic luminescence, wide viewing angle, fast response, thin thickness and high contrast.

[0003] Conventional OLED display panels usually have an isolation layer between two adjacent circuit layers to separate the two layers through the isolation layer, and there is no electrical connection between the two adjacent circuit layers. Since the organic process is simple and usually low in cost, organic materials are often used to make isolation layers. However, organic materials are very easy to absorb gases such as water vapor. These gases may escape into the circuit layer for some reason during the process of OLED display panels, causing circuit corrosion. Moreover, when adjacent circuit layers are corroded, the corrosion derivatives generated can easily break through the isolation layer to overlap each other, causing circuit short circuits (shorts) and other problems, which in turn cause poor display panel driving and cause the display panel to fail to work properly.

[0004] Therefore, there is an urgent need to provide a new type of display panel to solve the above problems. Summary of the invention

[0005] In view of this, the embodiments of the present application provide a display substrate and a preparation method thereof, and a display panel. The display substrate can improve the overlap problem of corrosion derivatives by setting the thickness of the first sub-isolation layer in the isolation layer that overlaps with the first end of the first circuit layer and the second end of the second circuit layer to be greater than the thickness of the second sub-isolation layer that does not overlap with the first end and the second end, thereby reducing the series connection between the first circuit layer and the second circuit layer, alleviating the risk of circuit short circuit, and improving the yield and quality of the display substrate.

[0006] A first aspect of an embodiment of the present application provides a display substrate, the display substrate comprising: a substrate and a first circuit layer, an isolation layer, and a second circuit layer arranged on one side of the substrate, the first circuit layer being arranged between the substrate and the isolation layer, the second circuit layer being arranged on a side of the isolation layer away from the first circuit layer, the first circuit layer being adjacent to and not connected to the second circuit layer, the first circuit layer having at least one first end, the second circuit layer having at least one second end, and one first end and one second end being located on the same side;

[0007] Along a direction perpendicular to the substrate, the isolation layer is arranged between the first end and the second end of at least one side, and the isolation layer includes a first sub-isolation layer and a second sub-isolation layer that are connected, the thickness of the first sub-isolation layer along the direction perpendicular to the substrate is greater than the thickness of the second sub-isolation layer along the direction perpendicular to the substrate, and the first sub-isolation layer has contact surfaces with the first end and the second end respectively.

[0008] In one embodiment, the isolation layer includes a first planar layer and an inorganic film layer, and the first planar layer is disposed between the first circuit layer and the inorganic film layer;

[0009] The first flat layer has a uniform thickness along a direction perpendicular to the substrate, and a side of the first flat layer close to the substrate has a first contact surface with the first end;

[0010] A side of the inorganic film layer away from the substrate has a second contact surface with the second end, and an orthographic projection of the inorganic film layer on the substrate is located within an orthographic projection of the first flat layer on the substrate.

[0011] In one embodiment, along a direction perpendicular to the substrate, the first circuit layer and the second circuit layer have a first overlapping region, and an orthographic projection of a boundary of the first overlapping region on the substrate is located within an orthographic projection of the inorganic film layer on the substrate.

[0012] In one embodiment, the material of the inorganic film layer includes an insulating oxide;

[0013] and / or,

[0014] The thickness of the inorganic film layer along the direction perpendicular to the substrate ranges from 0.01 μm to 0.1 μm;

[0015] and / or,

[0016] Along a direction parallel to the substrate, a distance range between the first sub-isolation layer and the second end includes ±(50 μm to 500 μm).

[0017] In one embodiment, the isolation layer is a second planar layer,

[0018] The second flat layer includes a first sub-flat layer and a second sub-flat layer that are connected, the thickness of the first sub-flat layer along a direction perpendicular to the substrate is greater than the thickness of the second sub-flat layer along a direction perpendicular to the substrate, a side of the first sub-flat layer close to the substrate has a third contact surface with the first end, and a side of the first sub-flat layer away from the substrate has a fourth contact surface with the second end.

[0019] In one embodiment, the thickness of the first sub-planar layer along a direction perpendicular to the substrate is d3, the thickness of the second sub-planar layer along a direction perpendicular to the substrate is d4, and d3=d4+(0.2 μm-0.8 μm).

[0020] In one embodiment, along a direction parallel to the substrate, a distance range between the first sub-planar layer and the second end includes ±(0.1 μm-0.4 μm).

[0021] A second aspect of the embodiments of the present application provides a display panel, comprising an organic light emitting diode device and the above-mentioned display substrate, wherein the organic light emitting diode device is arranged on a side of the second circuit layer away from the substrate.

[0022] A third aspect of an embodiment of the present application provides a method for preparing a display substrate, characterized by comprising:

[0023] providing a substrate;

[0024] forming a first circuit layer on one side of the substrate;

[0025] forming an isolation layer on a side of the first circuit layer away from the substrate;

[0026] A second circuit layer is formed on a side of the isolation layer away from the substrate; wherein the first circuit layer is adjacent to and not connected to the second circuit layer, the first circuit layer has at least one first end, the second circuit layer has at least one second end, and one first end and one second end are located on the same side; along a direction perpendicular to the substrate, the isolation layer is arranged between the first end and the second end on at least one side, the isolation layer includes a first sub-isolation layer and a second sub-isolation layer that are connected, the thickness of the first sub-isolation layer along the direction perpendicular to the substrate is greater than the thickness of the second sub-isolation layer along the direction perpendicular to the substrate, and the first sub-isolation layer has contact surfaces with the first end and the second end respectively.

[0027] In one embodiment, the isolation layer includes a first planar layer and an inorganic film layer, and forming the isolation layer on a side of the first circuit layer away from the substrate includes:

[0028] forming the first planarization layer on a side of the first circuit layer away from the substrate;

[0029] The inorganic film layer is formed on a side of the first flat layer away from the substrate; wherein the first flat layer has a uniform thickness along a direction perpendicular to the substrate, a side of the first flat layer close to the substrate has a first contact surface with the first end, a side of the inorganic film layer away from the substrate has a second contact surface with the second end, and an orthographic projection of the inorganic film layer on the substrate is located within an orthographic projection of the first flat layer on the substrate;

[0030] The forming of a second circuit layer on a side of the isolation layer away from the substrate comprises:

[0031] forming a second circuit layer on a side of the first planar layer and the inorganic film layer away from the substrate;

[0032] In one embodiment, the isolation layer includes a second flat layer, the second flat layer includes a first sub-flat layer and a second sub-flat layer connected to each other, and forming the isolation layer on a side of the first circuit layer away from the substrate includes:

[0033] The first sub-planar layer and the second sub-planar layer are formed on a side of the first circuit layer away from the substrate; wherein the thickness of the first sub-planar layer along a direction perpendicular to the substrate is greater than the thickness of the second sub-planar layer along a direction perpendicular to the substrate, the side of the first sub-planar layer close to the substrate has a third contact surface with the first end, and the side of the first sub-planar layer away from the substrate has a fourth contact surface with the second end;

[0034] The forming of a second circuit layer on a side of the isolation layer away from the substrate comprises:

[0035] A second circuit layer is formed on a side of the first sub-planar layer and the second sub-planar layer away from the substrate.

[0036] The display substrate provided by the first aspect of the embodiment of the present application is configured such that the thickness of the first sub-isolating layer overlapping with the first end of the first circuit layer and the second end of the second circuit layer in the isolation layer is greater than the thickness of the second sub-isolating layer not overlapping with the first end and the second end. Once the first circuit layer and the second circuit layer are corroded to generate corrosion derivatives, the spacing between the first end of the first circuit layer and the second end of the second circuit layer located on the same side is increased by the first sub-isolating layer, so that the spatial distance for the growth of the corrosion derivatives becomes larger. Since the corrosion derivatives will not grow infinitely, the overlapping of the corrosion derivatives can be reduced or even avoided, which effectively improves the series connection between the first circuit layer and the second circuit layer, alleviates the risk of circuit short circuit, and improves the yield and quality of the display substrate. At the same time, the thickness of the second sub-isolating layer is less than the thickness of the first sub-isolating layer, that is, the second sub-isolating layer is not too thick, and the impact on the overall transmittance of the isolation layer is minimized, thereby reducing the impact on the light output rate of the display substrate, greatly improving the user experience.

[0037] The third aspect of the embodiment of the present application provides a method for preparing a display substrate. By designing the thickness of the first sub-isolating layer to be greater than the thickness of the second sub-isolating layer, if the first circuit layer and the second circuit layer are corroded to produce corrosion derivatives, the first sub-isolating layer increases the distance between the first end of the first circuit layer and the second end of the second circuit layer located on the same side, thereby increasing the spatial distance for the growth of the corrosion derivatives, thereby improving or even avoiding the overlap of the corrosion derivatives with each other, effectively improving the series connection between the first circuit layer and the second circuit layer, alleviating the risk of circuit short circuit, and improving the display yield and quality; at the same time, the second sub-isolating layer is not too thick, minimizing the impact on the overall transmittance of the isolation layer, thereby reducing the impact on the light output rate of the display substrate; in addition, the preparation method is simple and easy to implement, has low cost, and is conducive to industrial production.

[0038] It can be understood that the beneficial effects of the second aspect mentioned above can be found in the relevant descriptions of the first and third aspects mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0040] Figure 1 is a structural schematic diagram of a display substrate in a related technology provided in Example 1 of the present application;

[0041] Figure 2is a structural schematic diagram of a display substrate provided in Example 1 of the present application;

[0042] Figure 3 is a schematic structural diagram of another display substrate provided in Embodiment 1 of the present application;

[0043] Figure 4 is a structural schematic diagram of another display substrate provided in Embodiment 1 of the present application;

[0044] Figure 5 is a structural schematic diagram of a display panel provided in Embodiment 2 of the present application;

[0045] Figure 6 is a schematic diagram of the structure of another display panel provided in Embodiment 2 of the present application;

[0046] Figure 7 is a structural schematic diagram of another display panel provided in the second embodiment of the present application;

[0047] Figure 8 is a process flow chart of preparing the first display substrate provided in Example 3 of the present application;

[0048] Fig. 9 is a process flow chart of preparing the second display substrate provided in Example 3 of the present application;

[0049] Fig.10 is a process flow chart of preparing a third display substrate provided in Example 3 of the present application;

[0050] Fig.11 is a process flow chart of preparing the fourth display substrate provided in Example 3 of the present application;

[0051] Fig.12 This is a process flow chart for preparing the fifth display substrate provided in Example 3 of the present application.

[0052] Figure Number:

[0053] 10-substrate, 21-third flat layer, 22-first circuit layer, 23-first flat layer, 24-second circuit layer, 25-fourth flat layer, 221-first corrosion derivative, 241-second corrosion derivative, D1-first end of the first circuit layer, D2-second end of the second circuit layer, 1-isolation layer, B1-first sub-isolation layer, B2-second sub-isolation layer, 41-inorganic film layer, E1-orthographic projection of the inorganic film layer on the substrate, E2-orthographic projection of the first flat layer on the substrate, d1-thickness of the inorganic film layer along the direction perpendicular to the substrate, d2-thickness of the first flat layer along the direction perpendicular to the substrate, h1-first The thickness of the sub-isolating layer along the direction perpendicular to the substrate, h2-the thickness of the second sub-isolating layer along the direction perpendicular to the substrate, E3-the orthographic projection of the boundary of the first overlapping region on the substrate, E4-the orthographic projection of the inorganic film layer on the substrate, k1-the distance between the inorganic film layer and the second end along the direction parallel to the substrate, 26-the second flat layer, 261-the first sub-flat layer, 262-the second sub-flat layer, d3-the thickness of the first sub-flat layer along the direction perpendicular to the substrate, d4-the thickness of the second sub-flat layer along the direction perpendicular to the substrate, k2-the distance between the first sub-flat layer and the second end along the direction parallel to the substrate, 30-organic light emitting diode device. DETAILED DESCRIPTION

[0054] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work should fall within the scope of protection of the present application.

[0055] The term "comprising" in the specification and claims of the present application and the above-mentioned drawings and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method or system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices. In addition, the terms "first", "second" and "third" etc. are used to distinguish different objects, rather than to describe a specific order. The term "at least one" means "one or more than one".

[0056] Embodiment 1

[0057] Figure 1 FIG. 1 shows a schematic diagram of the structure of a display substrate. Figure 1As shown, the display substrate includes a third planarization (PLN) layer 21, a first circuit layer 22, a first planarization layer 23, a second circuit layer 24 and a fourth planarization layer 25 stacked in sequence on a substrate 10, wherein each PLN layer can not only planarize the circuit layer, but also prevent the two adjacent circuit layers from being electrically connected, thereby effectively improving the problem of overlapping the upper and lower adjacent circuit layers connected to the PLN layer. Specifically, Figure 1 As shown, the first planar layer 23 can effectively reduce or avoid the overlap between the first circuit layer 22 and the second circuit layer 24 .

[0058] Please refer to Figure 1 , the first circuit layer 22 has at least a first end D1, and the second circuit layer 24 has at least a second end D2. Exemplarily, the first circuit layer 22 may be a gate line, and the second circuit layer 24 may be a source line. Generally speaking, a Gate line has two ends, and a Source line also has two ends. Here, the first end D1 may refer to one end of the Gate line, and the second end D2 may refer to one end of the Source line.

[0059] Related Technology In the process of preparing the display substrate, it is often inevitable that some gases, such as water vapor, will enter the display substrate. The first end D1 of the first circuit layer 22 and the second end D2 of the second circuit layer 24 are separated by a first flat layer 23. The first flat layer 23 is generally made of organic matter, such as photoresist (Photo Resist, PR), polyimide (Polyimide, PI), etc., but the structure of the organic matter itself is unstable and it is very easy to absorb gases such as water vapor. In this way, in the subsequent process, these gases may escape into the first circuit layer 22 and the second circuit layer 24 due to temperature and humidity, etc., corrode the first circuit layer 22 and the second circuit layer 24 (the material of the first circuit layer 22 and the second circuit layer 24 is usually a low-impedance conductive metal), and cause the metals in the first circuit layer 22 and the second circuit layer 24 to react and produce a large number of products, namely Figure 1 The first corrosion derivative 221 generated at the first end D1 and the second corrosion derivative 241 generated at the second end D2 are easy to break through the first flat layer 23 located between them and overlap each other. Therefore, when the distance between the first corrosion derivative 221 and the second corrosion derivative 241 is close enough, such as Figure 1 As shown, at this time, the first circuit layer 22 and the second circuit layer 24 are connected to form a circuit path, resulting in problems such as circuit short, which in turn causes poor driving of the display substrate and causes it to fail to work normally.

[0060] It should be noted that, since the above-mentioned corrosion derivatives will not grow infinitely, such a problem usually occurs between two adjacent circuit layers.

[0061] Based on the above content, the present application embodiment provides a display substrate, referring to Figure 2-Figure 4 As shown, the display substrate includes:

[0062] Substrate 10.

[0063] A first circuit layer 22, an isolation layer 1, and a second circuit layer 24 are arranged on one side of the substrate 10. The first circuit layer 22 is arranged between the substrate 10 and the isolation layer 1, and the second circuit layer 24 is arranged on a side of the isolation layer 1 away from the first circuit layer 22. The first circuit layer 22 and the second circuit layer 24 are adjacent to each other and are not connected. The first circuit layer 22 has at least one first end D1, and the second circuit layer 24 has at least one second end D2. One first end D1 and one second end D2 are located on the same side. Along a direction perpendicular to the substrate 10 ( Figures 2 to 4 The isolation layer 1 is disposed between the first end D1 and the second end D2 on at least one side, and the isolation layer 1 includes a first sub-isolation layer B1 and a second sub-isolation layer B2 connected to each other. The thickness h1 of the first sub-isolation layer B1 along the direction perpendicular to the substrate 10 is greater than the thickness h2 of the second sub-isolation layer B2 along the direction perpendicular to the substrate 10, and the first sub-isolation layer B1 has a contact surface ( Figure 2-Figure 4 not shown).

[0064] In practical applications, there is no specific limitation on the material of the substrate, which may include a rigid material, such as glass, or a flexible material, such as PI.

[0065] In practical applications, there is no specific limitation on the materials of the first circuit layer and the second circuit layer. Exemplarily, the materials of the first circuit layer and the second circuit layer may include metals, such as molybdenum (Mo), aluminum (Al), titanium (Ti), indium tin oxide (Indium Tin Oxides, ITO), etc.

[0066] The isolation layer in the embodiment of the present application can be used to disconnect the adjacent first circuit layer from the second circuit layer, thereby ensuring the normal operation of the first circuit layer and the second circuit layer.

[0067] It should be understood that the first circuit layer having at least one first end means that the first circuit layer has one first end, or the first circuit layer has multiple first ends, which depends on the actual application. Taking the first circuit layer as a Gate line as an example, the Gate line usually has two ends, namely, two first ends. Figure 1 A first end D1 of the first circuit layer 22 is shown.

[0068] The second circuit layer having at least one second end means that the second circuit layer has one second end, or the second circuit layer has multiple second ends, which is subject to actual application. Taking the second circuit layer as a Source line as an example, the Source line usually has two ends, namely two second ends. Figure 1 A second end D2 of the second circuit layer 24 is shown.

[0069] In practical applications, it should be understood that the isolation layer is disposed between the first end and the second end of at least one side means that the isolation layer can be disposed only between the first end and the second end of at least one side, or the isolation layer can be disposed between the first end and the second end of multiple sides, which is subject to the practical application. In order to achieve better performance of the display substrate, it is preferred that the isolation layer is disposed between the first end and the second end of all sides.

[0070] The isolation layer includes a first sub-isolation layer and a second sub-isolation layer that are connected. Here, there is no specific limitation on the structure, material, width (in the direction parallel to the substrate) and the like of the first sub-isolation layer and the second sub-isolation layer. For example, the first sub-isolation layer and the second sub-isolation layer may be the same in all aspects except for the thickness; or, the first sub-isolation layer and the second sub-isolation layer may be different in structure, material, width and the like in addition to the thickness; or, the first sub-isolation layer and the second sub-isolation layer may be different in structure, material, width and the like in addition to the thickness.

[0071] The first sub-isolating layer having contact surfaces with the first end of the first circuit layer and the second end of the second circuit layer respectively can also be understood as: in the direction perpendicular to the substrate, the first sub-isolating layer overlaps with the first end of the first circuit layer and the second end of the second circuit layer.

[0072] The embodiment of the present application provides a display substrate, in which the thickness of a first sub-isolating layer overlapping with the first end of the first circuit layer and the second end of the second circuit layer is set to be greater than the thickness of a second sub-isolating layer not overlapping with the first end and the second end. Once the first circuit layer and the second circuit layer are corroded to generate corrosion derivatives, the first sub-isolating layer increases the distance between the first end of the first circuit layer and the second end of the second circuit layer on the same side, thereby increasing the spatial distance of the growth of the corrosion derivatives. Since the corrosion derivatives will not grow infinitely, the overlap of the corrosion derivatives can be reduced or even avoided, thereby effectively improving the series connection between the first circuit layer and the second circuit layer, reducing or avoiding the risk of circuit short circuit, and improving the yield and quality of the display substrate. At the same time, the thickness of the second sub-isolating layer is less than the thickness of the first sub-isolating layer, that is, the second sub-isolating layer is not too thick, and the impact on the overall transmittance of the isolation layer is minimized, thereby reducing the impact on the light output rate of the display substrate, greatly improving the user experience.

[0073] In one embodiment, reference Figure 2 and Figure 3 As shown, the isolation layer 1 includes a first flat layer 23 and an inorganic film layer 41, the first circuit layer 22 is arranged between the substrate 10 and the first flat layer 23, and the inorganic film layer 41 is arranged on a side of the first flat layer 23 away from the substrate 10; the first flat layer 23 is perpendicular to the substrate 10 ( Figure 2 and Figure 3 The thickness d2 of the first flat layer 23 in the OY direction) can be uniform and consistent, and the first flat layer 23 has a first contact surface ( Figure 2 and Figure 3 The side of the inorganic film layer 41 away from the substrate 10 has a second contact surface ( Figure 2 and Figure 3 (not shown), the orthographic projection E1 of the inorganic film layer 41 on the substrate 10 is located within the orthographic projection E2 of the first planar layer 23 on the substrate 10 .

[0074] In practical applications, the thickness d1 of the inorganic film layer 41 along the OY direction may be uniform and consistent, or may be inconsistent, depending on the practical application.

[0075] refer to Figure 2 and Figure 3 As shown, the thickness d2 of the first planar layer 23 along the OY direction is uniform and consistent. At this time, the thickness d2 of the first planar layer 23 along the OY direction is the same as the thickness h2 of the second sub-isolating layer B2 along the OY direction.

[0076] There is no specific limitation on the materials of the above-mentioned inorganic film layer. The materials of the inorganic film layer may include insulating oxides, for example, silicon nitride (Si3N4), silicon oxynitride (SiON), silicon oxide (SiO2), aluminum oxide (Al2O3), etc. The molecular structure of these materials is dense, and the interior is a neat lattice arrangement. For example, the silicon (Si) in Si3N4 is filled with four nitrogen (N) around it, and the intervals between molecules are smaller, making it difficult for these materials to adsorb other substances, for example, it is difficult to adsorb gases such as water vapor.

[0077] Furthermore, for each material of the inorganic film layer, since the gaps between the molecules of each material are different, the inorganic film layer formed by it has different effects on the overlap of corrosion derivatives. Exemplarily, the effect of the inorganic film layer on the overlap of corrosion derivatives is ranked from weak to strong as SiO2, SiON to Si3N4, that is, the inorganic film layer formed by Si3N4 has the best effect on the overlap of corrosion derivatives. Specifically, taking Si3N4 as an example, in the inorganic film layer formed by Si3N4, the gaps between Si3N4 molecules are smaller, and water vapor is very difficult to enter the inorganic film layer, so that it can achieve a better effect of isolating water and oxygen.

[0078] The thickness of the above-mentioned inorganic film layer is not specifically limited here. Generally speaking, the thicker the inorganic film layer, the better the effect of hindering the growth of corrosion derivatives and the stronger the barrier property. However, when the inorganic film layer is too thick, its own transmittance will be affected and deteriorate, resulting in affecting the light output rate of the display substrate. Therefore, in the embodiment of the present application, the thickness d1 of the inorganic film layer 41 along the OY direction can range from 0.01μm to 0.1μm, which can not only play a good role in hindering the growth of corrosion derivatives, but also minimize the impact on its own transmittance, thereby reducing the impact on the light output rate of the display substrate. Exemplarily, d1 can be 0.01μm, 0.02μm, 0.04μm, 0.06μm, 0.08μm or 0.1μm, etc.

[0079] That the first flat layer has a first contact surface on one side close to the substrate and the first end can also be understood as: in a direction perpendicular to the substrate, the first flat layer has an overlap on one side close to the substrate and the first end of the first circuit layer.

[0080] That the side of the inorganic film layer away from the substrate has a second contact surface with the second end can also be understood as: in a direction perpendicular to the substrate, the side of the inorganic film layer away from the substrate overlaps with the second end of the second circuit layer.

[0081] It should be understood that the orthographic projection of the inorganic film layer on the substrate is located within the orthographic projection of the first flat layer on the substrate, that is, the inorganic film layer is only provided on the local surface of the first flat layer away from the substrate, so as to achieve local thickening of the isolation layer. In this way, on the one hand, the design of the inorganic film layer can better hinder the growth of corrosion derivatives; on the other hand, the isolation layer as a whole is not too thick, and the impact on the transmittance of the isolation layer itself is minimized; on the other hand, the inorganic film layer has a certain brittleness and is prone to breakage during the bending process. Therefore, by providing an inorganic film layer in a local area, the display substrate is not prone to breakage during the bending process, and the toughness of the display substrate is not affected.

[0082] The embodiment of the present application provides a display substrate, by adding an inorganic film layer between the first flat layer and the second end of the second circuit layer, so that in the subsequent process, when some gases are used in the process of preparing the second circuit layer, although the organic matter in the first flat layer is not arranged in a very neat lattice, it is very easy to adsorb these gases, and these gases will be adsorbed and retained in the first flat layer, but the added inorganic film layer is composed of inorganic materials with dense molecular structure, so that it is difficult for the inorganic film layer to adsorb these gases. At the same time, the inorganic film layer makes the isolation layer as a whole locally thicker, effectively increasing the spatial distance of the growth of corrosion derivatives, and the corrosion derivatives will not grow infinitely, so that the overlap of the corrosion derivatives can be improved or even avoided, and the series connection between the first circuit layer and the second circuit layer can be effectively improved, so that the risk of circuit short circuit can be reduced or avoided, and the yield and quality of the display substrate are improved, and the display substrate has good transmittance and toughness; at the same time, the first flat layer itself without the inorganic film layer will not be too thick, which minimizes the impact on the transmittance of the isolation layer as a whole, thereby reducing the impact on the light output rate of the display substrate, and greatly improving the user experience.

[0083] In one embodiment, reference Figure 3 As shown, along the direction perpendicular to the substrate 10, the first circuit layer 22 and the second circuit layer 24 have a first overlapping region ( Figure 3 (not shown), the orthographic projection E3 of the boundary of the first overlapping region on the substrate 10 is located within the orthographic projection E4 of the inorganic film layer 41 on the substrate.

[0084] The following description will be made by taking the first circuit layer 22 as the Gate line and the second circuit layer 24 as the Source line as an example.

[0085] The Gate line and the Source line are separated by the first flat layer 23 and are independent of each other. The two are not actually connected, but the Gate line and the Source line will overlap in space. For example, if the Gate line is along Figure 3 The Source line extends along the OX direction of Figure 3 When extending in the OY direction, the two can cross each other in space, thereby generating a first overlapping area, and the first overlapping area is also prone to the problem of corrosion derivatives overlapping each other.

[0086] An embodiment of the present application provides a display substrate, which extends an inorganic film layer from the end surfaces of a first circuit layer and a second circuit layer toward the interior of the circuit layer, that is, the inorganic film layer is also arranged in a first overlapping area in space between the first circuit layer and the second circuit layer, so that the overlap of corrosion derivatives can be better improved or even avoided through the added inorganic film layer, and the series connection between the first circuit layer and the second circuit layer is more effectively improved, so that the risk of circuit short circuit can be reduced or avoided, and the yield and quality of the display substrate are significantly improved; at the same time, the first flat layer where the inorganic film layer is not arranged will not be too thick, which minimizes the impact on the overall transmittance of the isolation layer, thereby reducing the impact on the light output rate of the display substrate, and greatly improving the user experience; in addition, the toughness of the display substrate is also good, which greatly improves the user experience.

[0087] In one embodiment, if the distance between the first sub-isolation layer B1 and the second end D2 of the second circuit layer 24 is too large, the first sub-isolation layer B1 accounts for a large proportion of the display substrate, and the toughness of the first sub-isolation layer B1 is not good, which will affect the overall toughness of the display substrate; but if the distance between the first sub-isolation layer B1 and the second end D2 of the second circuit layer 24 is too small, the corrosion derivative overlap problem cannot be improved well. Therefore, refer to Figure 2 and Figure 3 As shown, along the direction parallel to the substrate 10, the distance range between the first sub-isolation layer B1 and the second end D2 of the second circuit layer 24 may include ±(50μm~500μm), that is, the distance range between the first sub-isolation layer B1 and the second end D2 of the second circuit layer 24 may be -500μm~-50μm and 50μm~500μm.

[0088] Specifically, Figure 2 and Figure 3 As shown, along the direction parallel to the substrate 10 , the distance k1 between the inorganic film layer 41 and the second end D2 of the second circuit layer 24 may range from −500 μm to −50 μm and from 50 μm to 500 μm.

[0089] It should be noted that the embodiment of the present application does not limit the distance between the first flat layer and the second end of the second circuit layer.

[0090] The embodiment of the present application provides a display substrate. By setting a certain distance between the width of the inorganic film layer and the end face of the second circuit layer, the overlap of corrosion derivatives can be greatly improved, and the series connection between the first circuit layer and the second circuit layer can be more effectively improved, thereby reducing or avoiding the risk of circuit short circuit, and will not affect the toughness of the display substrate, significantly improving the yield and quality of the display substrate; at the same time, the first flat layer where the inorganic film layer is not provided will not be too thick, thereby minimizing the impact on the overall transmittance of the isolation layer, thereby reducing the impact on the light output rate of the display substrate, and greatly improving the user experience.

[0091] In one embodiment, reference Figure 4 As shown, the isolation layer 1 is a second flat layer 26, and the second flat layer 26 includes a first sub-flat layer 261 and a second sub-flat layer 262 connected to each other. The thickness d3 of the first sub-flat layer 261 along the direction perpendicular to the substrate 10 is greater than the thickness d4 of the second sub-flat layer 262 along the direction perpendicular to the substrate 10. The side of the first sub-flat layer 261 close to the substrate 10 has a third contact surface ( Figure 4 The first sub-planar layer 261 has a fourth contact surface (not shown) on the side away from the substrate 10 and the second end of the second circuit layer 24. Figure 4 not shown).

[0092] It should be noted that the first sub-flat layer here is the first sub-isolation layer, and the second sub-flat layer is the second sub-isolation layer. Therefore, the thickness of the first sub-flat layer along the direction perpendicular to the substrate is also the thickness of the first sub-isolation layer along the direction perpendicular to the substrate, and the thickness of the second sub-flat layer along the direction perpendicular to the substrate is also the thickness of the second sub-isolation layer along the direction perpendicular to the substrate.

[0093] In practical applications, there is no specific limitation on the material of the second planar layer. For example, the material of the second planar layer may include organic matter, such as PR, PI, etc.

[0094] Furthermore, the increase in thickness of the first sub-flat layer 261 will inevitably increase the consumption of raw materials and the cost. Therefore, by designing the first sub-flat layer 261 to have a thickness within a certain range greater than that of the second sub-flat layer 262, the cost can be controlled and the overlap of the corrosion derivatives can be improved. Figure 4 As shown, d3=d4+(0.2μm~0.8μm), exemplarily, d3=d4+0.2μm, d3=d4+0.4μm, d3=d4+0.6μm or d3=d4+0.8μm, etc.

[0095] The embodiment of the present application provides a display substrate, in which the thickness of the portion between the first end of the first circuit layer and the second end of the second circuit layer on at least one side of the second flat layer is designed to be greater than the thickness of the remaining portion of the second flat layer, that is, the flat layer between two adjacent metal layers is locally thickened in the area prone to reaction, and the vertical distance between the metal ends of the two layers is increased. In this way, even if there are corrosion derivatives, the overlap of the corrosion derivatives with each other can be improved or even avoided, which effectively improves the series connection between the first circuit layer and the second circuit layer, reduces or avoids the risk of circuit short circuit, and improves the yield and quality of the display substrate; at the same time, the second sub-flat layer is not too thick, which minimizes the impact on the overall transmittance of the second flat layer and the loss of materials, thereby reducing the impact on the light output rate of the display substrate. In addition, only the second flat layer is set, which is simple and easy to implement.

[0096] In one embodiment, if the distance between the first sub-flat layer 261 and the second end D2 of the second circuit layer 24 is too large, the first sub-flat layer 261 accounts for a large proportion in the display substrate, which increases the consumption of raw materials and the cost; however, if the distance between the first sub-flat layer 261 and the second end D2 of the second circuit layer 24 is too small, the corrosion derivative overlap problem cannot be improved well. Therefore, referring to Figure 4 As shown, along the direction parallel to the substrate 10, the distance k2 between the first sub-planar layer 261 and the second end D2 of the second circuit layer 24 ranges from ±(0.1μm to 0.4μm), that is, the distance between the first sub-planar layer 261 and the second end D2 of the second circuit layer 24 can range from -0.4μm to -0.1μm and 0.1μm to 0.4μm.

[0097] The embodiment of the present application provides a display substrate. By setting a certain distance between the width of the first sub-flat layer and the end surface of the second circuit layer, it can better ensure that the corrosion derivatives are not overlapped with each other, and more effectively improve the series connection between the first circuit layer and the second circuit layer, thereby reducing or avoiding the risk of circuit short circuit, significantly improving the yield and quality of the display substrate, and greatly improving the user experience.

[0098] Embodiment 2

[0099] The present application provides a display panel, referring to Figures 5 to 7 As shown, the display panel includes an organic light emitting diode device 30 and the display substrate of the first embodiment. The organic light emitting diode device 30 is arranged on a side of the second circuit layer 24 in the display substrate away from the substrate 10 .

[0100] In practical applications, the organic light emitting diode device may include an anode, a light emitting layer and a cathode which are sequentially stacked on the second circuit layer.

[0101] Furthermore, the organic light emitting diode device may also include at least one of a hole injection layer, a hole transport layer, an electron blocking layer, a hole blocking layer, an electron transport layer, and an electron injection layer. When the organic light emitting diode device includes a hole injection layer, a hole transport layer, an electron blocking layer, a hole blocking layer, an electron transport layer, and an electron injection layer, the hole injection layer is arranged between the anode and the hole transport layer, the hole transport layer is arranged between the hole injection layer and the electron blocking layer, the electron blocking layer is arranged between the hole transport layer and the light emitting layer, the hole blocking layer is arranged between the light emitting layer and the electron transport layer, and the electron transport layer is arranged between the hole blocking layer and the electron injection layer.

[0102] The above-mentioned display panel may be a display panel with a touch function, or a display panel with a folding or curling function, or a display panel with both a touch function and a folding function, which is not limited here. The display panel may be a flexible display panel (also known as a flexible screen) or a rigid display panel (i.e., a display screen that cannot be bent), which is not limited here. The above-mentioned display panel may be an OLED display panel, a sub-millimeter light-emitting diode (Mini Light Emitting Diode, Mini LED) display panel or a micro light-emitting diode (Micro Light Emitting Diode, Micro LED) display panel, or a liquid crystal display panel (Liquid Crystal Display, LCD) display panel, etc.

[0103] The display panel can be any product or component with display function, such as mobile phone, watch, laptop, tablet computer, TV, digital camera, etc.; the display panel can also be applied to fields such as identity recognition and medical equipment. Products that have been promoted or have good promotion prospects include security identity authentication, smart door locks, medical image acquisition, etc. The display panel has the advantages of low circuit short circuit risk, high yield, good display effect, low cost, long life, high stability, high contrast, good imaging quality, and high product quality.

[0104] Embodiment 3

[0105] The embodiment of the present application provides a method for preparing a display substrate, wherein the display substrate is the corresponding display substrate in the first embodiment.

[0106] refer to Figure 8 As shown, the method for preparing the display substrate comprises the following steps:

[0107] S1. Provide a substrate.

[0108] S2. Form a first circuit layer on one side of the substrate.

[0109] S3. Form an isolation layer on a side of the first circuit layer away from the substrate.

[0110] S4. Form a second circuit layer on a side of the isolation layer away from the substrate.

[0111] The first circuit layer is adjacent to the second circuit layer but not connected, the first circuit layer has at least one first end, the second circuit layer has at least one second end, and a first end and a second end are located on the same side; along a direction perpendicular to the substrate, an isolation layer is arranged between the first end and the second end of at least one side, the isolation layer includes a first sub-isolation layer and a second sub-isolation layer that are connected, the thickness of the first sub-isolation layer along the direction perpendicular to the substrate is greater than the thickness of the second sub-isolation layer along the direction perpendicular to the substrate, and the first sub-isolation layer has contact surfaces with the first end and the second end respectively.

[0112] The embodiment of the present application provides a method for preparing a display substrate. By designing the thickness of the first sub-isolating layer to be greater than the thickness of the second sub-isolating layer, if the first circuit layer and the second circuit layer are corroded to produce corrosion derivatives, the first sub-isolating layer increases the distance between the first end of the first circuit layer and the second end of the second circuit layer located on the same side, thereby increasing the spatial distance for the growth of the corrosion derivatives, thereby improving or even avoiding the overlap of the corrosion derivatives with each other, effectively improving the series connection between the first circuit layer and the second circuit layer, reducing or avoiding the risk of circuit short circuit, and improving the display yield and quality; at the same time, the second sub-isolating layer is not too thick, minimizing the impact on the overall transmittance of the isolation layer, thereby reducing the impact on the light output rate of the display substrate; in addition, the preparation method is simple and easy to implement, has low cost, and is conducive to industrial production.

[0113] In one embodiment, the isolation layer includes a first planarization layer and an inorganic film layer.

[0114] refer to Fig. 9 As shown, the above step S3, forming an isolation layer on a side of the first circuit layer away from the substrate, includes:

[0115] S311 , forming a first planarization layer on a side of the first circuit layer away from the substrate.

[0116] S312 , forming an inorganic film layer on a side of the first planar layer away from the substrate.

[0117] Among them, the thickness of the first flat layer is uniform along the direction perpendicular to the substrate, the side of the first flat layer close to the substrate has a first contact surface with the first end, the side of the inorganic film layer away from the substrate has a second contact surface with the second end, and the orthographic projection of the inorganic film layer on the substrate is located within the orthographic projection of the first flat layer on the substrate.

[0118] The above step S4, forming a second circuit layer on a side of the isolation layer away from the substrate, comprises:

[0119] S41 , forming a second circuit layer on a side of the first planar layer and the inorganic film layer away from the substrate.

[0120] The embodiment of the present application provides a method for preparing a display substrate, by forming an inorganic film layer between a first flat layer and a second end of a second circuit layer, the inorganic film layer is difficult to adsorb some gases used in the manufacturing process of the second circuit layer, and can make the isolation layer thicker locally as a whole, effectively increasing the spatial distance for the growth of corrosion derivatives, and the corrosion derivatives will not grow infinitely, so it is possible to improve or even avoid the overlap of corrosion derivatives with each other, effectively improving the series connection between the first circuit layer and the second circuit layer, thereby reducing or avoiding the risk of circuit short circuit, and improving the yield and quality of the display substrate; at the same time, the first flat layer itself without the inorganic film layer portion will not be too thick, minimizing the impact on the overall transmittance of the isolation layer, thereby reducing the impact on the light output rate of the display substrate; in addition, the preparation method is simple and easy to implement, low cost, and conducive to industrial production.

[0121] In one embodiment, when the isolation layer includes a second planar layer, the second planar layer includes a first sub-planar layer and a second sub-planar layer connected to each other.

[0122] refer to Fig.10 As shown, the above step S3, forming an isolation layer on a side of the first circuit layer away from the substrate, includes:

[0123] S321 , forming a first sub-planarizing layer and a second sub-planarizing layer on a side of the first circuit layer away from the substrate.

[0124] The thickness of the first sub-planar layer along the direction perpendicular to the substrate is greater than the thickness of the second sub-planar layer along the direction perpendicular to the substrate, the side of the first sub-planar layer close to the substrate has a third contact surface with the first end, and the side of the first sub-planar layer away from the substrate has a fourth contact surface with the second end.

[0125] The above step S4, forming a second circuit layer on a side of the isolation layer away from the substrate, comprises:

[0126] S42 , forming a second circuit layer on a side of the first sub-planar layer and the second sub-planar layer away from the substrate.

[0127] The embodiment of the present application provides a method for preparing a display substrate, by forming a first sub-flat layer, that is, locally thickening the flat layer between two adjacent metal layers in the area prone to reaction, the vertical distance between the first end of the first circuit layer and the second end of the second circuit layer located on at least one side of the second flat layer is increased, so that even if there are corrosion derivatives, the overlap of the corrosion derivatives with each other can be improved or even avoided, which effectively improves the series connection between the first circuit layer and the second circuit layer, reduces or avoids the risk of circuit short circuit, and improves the yield and quality of the display substrate; at the same time, the second sub-flat layer is not too thick, which minimizes the impact on the overall transmittance of the second flat layer and the loss of materials, thereby reducing the impact on the light output rate of the display substrate; in addition, the preparation method is simple and easy to implement, has low cost, and is conducive to industrial production.

[0128] In one embodiment, after forming an isolation layer on a side of the first circuit layer away from the substrate in the above step S3, the method for preparing a display substrate further comprises:

[0129] S5. Allow part of the gas in the isolation layer to escape from the isolation layer.

[0130] The specific order of step S5 and other steps is described below.

[0131] Furthermore, if Fig.11 As shown, after forming an isolation layer on a side of the first circuit layer away from the substrate in the above step S3, and before forming a second circuit layer on a side of the isolation layer away from the substrate in step S4, the method for preparing the display substrate further includes:

[0132] S51, performing a heat treatment on the structure having the isolation layer formed thereon.

[0133] As an example, when the isolation layer includes a first flat layer and an inorganic film layer, heat treatment can be performed after the inorganic film layer is formed on the side of the first flat layer away from the substrate in step S312, and before the second circuit layer is formed on the side of the first flat layer and the inorganic film layer away from the substrate in step S41.

[0134] As another example, when the isolation layer includes a second flat layer, and the second flat layer includes a first sub-flat layer and a second sub-flat layer connected to each other, the heat treatment may be performed after forming the first sub-flat layer and the second sub-flat layer on a side of the first circuit layer away from the substrate in step S321, and before forming the second circuit layer on a side of the first sub-flat layer and the second sub-flat layer away from the substrate in step S42.

[0135] In actual applications, after forming an isolation layer on the side of the first circuit layer away from the substrate in the first device, the structure with the isolation layer is taken out from the first device and placed in a second device for heat treatment, and then a second circuit layer is formed on the side of the isolation layer away from the substrate in the second device. Of course, the structure with the isolation layer can also be taken out from the second device and then a second circuit layer is formed in other devices, which shall be subject to the actual application.

[0136] The first device may include a vacuum chamber or the like.

[0137] The second device may include a heating chamber, etc. Specifically, the structure with the isolation layer formed thereon may be baked at a high temperature in the heating chamber.

[0138] The heating temperature may be in the range of 200° C. to 350° C., and illustratively, the heating temperature may be 200° C., 230° C., 260° C., 290° C., 310° C. or 350° C., etc. In this way, the material loss of the first flat layer or the first sub-flat layer and the second sub-flat layer will not be too great due to the high temperature, and the gas in the first flat layer or the first sub-flat layer and the second sub-flat layer can be well released.

[0139] The heating time may be greater than or equal to 30 minutes. For example, the heating time may be 30 minutes, 40 minutes, 50 minutes or 60 minutes.

[0140] Furthermore, since the first planarization layer and the second planarization layer are made of organic materials, the organic materials will volatilize the water vapor in the system after being heated. If the interval time between the next process is too long, the water vapor in the environment will easily enter the organic material again, causing the water vapor to volatilize again in the subsequent process, affecting the characteristics of the subsequent film layers. Therefore, in order to achieve better results, the interval time between the above step S51 and the next process is preferably not more than 60 minutes. Controlling the interval time here means controlling the amount of water vapor entering the display substrate.

[0141] It should be noted that the next process here mainly refers to the deposition process of the subsequent film layer, the circuit process, etc., for example, the etching process, etc.

[0142] The embodiment of the present application provides a method for preparing a display substrate. Through heat treatment, some gases adsorbed in the first flat layer or the first sub-flat layer and the second sub-flat layer can be released, thereby reducing the gas content in the first flat layer or the first sub-flat layer and the second sub-flat layer, reducing the degree of corrosion of the first circuit layer and the second circuit layer by these gases, reducing the amount of corrosion derivatives generated, improving or even avoiding the overlap of corrosion derivatives with each other, and effectively improving the series connection between the first circuit layer and the second circuit layer, thereby reducing or avoiding the risk of circuit short circuit, and improving the yield and quality of the display substrate; at the same time, the preparation method is simple and easy to implement, has low cost, and is conducive to industrial production.

[0143] Furthermore, if Fig.12 As shown, after the above step S4, in which the second circuit layer is formed on the side of the isolation layer away from the substrate, the method for preparing the display substrate further includes:

[0144] S52, performing ion replacement treatment on the second circuit layer in the structure in which the second circuit layer is formed.

[0145] Since chlorine (Cl2) is often used in the process of preparing the second circuit layer to improve the luminous efficiency, simplify the production process, and reduce the cost, after forming the second circuit layer, it is necessary to mainly remove the chloride ions (Cl - )discharge.

[0146] As an example, when the isolation layer includes a first planar layer and an inorganic film layer, after forming a second circuit layer on the side of the first planar layer and the inorganic film layer away from the substrate in step S41, ion replacement is performed on the structure forming the second circuit layer to expel the reactive elements in the second circuit layer.

[0147] As another example, when the isolation layer includes a second flat layer, and the second flat layer includes a first sub-flat layer and a second sub-flat layer connected to each other, it may be that in step S42, after a second circuit layer is formed on a side of the first sub-flat layer and the second sub-flat layer away from the substrate, ions are replaced on the structure forming the second circuit layer to expel reactive elements in the second circuit layer.

[0148] It should be noted that steps S1-S52 are performed in the first device. Since the structure of the second circuit layer has not been out of the first device, the replacement process is performed at this time to remove the residual reactive ions (mainly Cl - ) to prevent these ions from reacting with gases such as water vapor to generate corrosion products in subsequent processes.

[0149] As an example, the second circuit layer can be bombarded with fluorine (F) by plasma in a vacuum chamber, and the Cl in the second circuit layer can be mainly removed by F.- Replace it.

[0150] The embodiment of the present application provides a method for preparing a display substrate. Through replacement treatment in a vacuum environment, some ions in the second circuit layer can be discharged, reducing or even avoiding the subsequent reaction of these ions with gases such as water vapor to generate corrosion products, thereby reducing the degree of corrosion of the first circuit layer and the second circuit layer, and improving or even avoiding the overlap of corrosion derivatives with each other, effectively improving the series connection between the first circuit layer and the second circuit layer, thereby reducing or avoiding the risk of circuit short circuit, and improving the yield and quality of the display substrate; at the same time, the preparation method is simple and easy to implement, low cost, and is conducive to industrial production.

[0151] Only the contents related to the invention are introduced here. Other structures can be obtained by referring to the relevant technologies and will not be described in detail here.

[0152] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A display substrate, characterized in that: include: A substrate and a first circuit layer, an isolation layer, and a second circuit layer arranged on one side of the substrate, wherein the first circuit layer is arranged between the substrate and the isolation layer, the second circuit layer is arranged on a side of the isolation layer away from the first circuit layer, the first circuit layer and the second circuit layer are adjacent to each other and are not connected, the first circuit layer has at least one first end, the second circuit layer has at least one second end, and one first end and one second end are located on the same side; Along a direction perpendicular to the substrate, the isolation layer is arranged between the first end and the second end of at least one side, and the isolation layer includes a first sub-isolation layer and a second sub-isolation layer that are connected, the thickness of the first sub-isolation layer along the direction perpendicular to the substrate is greater than the thickness of the second sub-isolation layer along the direction perpendicular to the substrate, and the first sub-isolation layer has contact surfaces with the first end and the second end respectively.

2. The display substrate according to claim 1, wherein: The isolation layer includes a first flat layer and an inorganic film layer, wherein the first flat layer is arranged between the first circuit layer and the inorganic film layer; The first flat layer has a uniform thickness along a direction perpendicular to the substrate, and a side of the first flat layer close to the substrate has a first contact surface with the first end; A side of the inorganic film layer away from the substrate has a second contact surface with the second end, and an orthographic projection of the inorganic film layer on the substrate is located within an orthographic projection of the first flat layer on the substrate.

3. The display substrate according to claim 2, wherein: Along a direction perpendicular to the substrate, the first circuit layer and the second circuit layer have a first overlapping region, and an orthographic projection of a boundary of the first overlapping region on the substrate is located within an orthographic projection of the inorganic film layer on the substrate.

4. The display substrate according to claim 2 or 3, characterized in that: The material of the inorganic film layer includes insulating oxide; and / or, The thickness of the inorganic film layer along the direction perpendicular to the substrate ranges from 0.01 μm to 0.1 μm; and / or, Along a direction parallel to the substrate, a distance range between the first sub-isolation layer and the second end includes ±(50 μm to 500 μm).

5. The display substrate according to claim 1, wherein: The isolation layer is a second flat layer, and the second flat layer includes a first sub-flat layer and a second sub-flat layer that are connected. The thickness of the first sub-flat layer along a direction perpendicular to the substrate is greater than the thickness of the second sub-flat layer along a direction perpendicular to the substrate. A side of the first sub-flat layer close to the substrate has a third contact surface with the first end, and a side of the first sub-flat layer away from the substrate has a fourth contact surface with the second end.

6. The display substrate according to claim 5, wherein: The thickness of the first sub-planar layer along the direction perpendicular to the substrate is d3, and the thickness of the second sub-planar layer along the direction perpendicular to the substrate is d4, where d3=d4+(0.2 μm-0.8 μm).

7. The display substrate according to claim 5 or 6, characterized in that: Along a direction parallel to the substrate, a distance range between the first sub-planar layer and the second end includes ±(0.1 μm to 0.4 μm).

8. A display panel, characterized in that: The display substrate comprises an organic light emitting diode device and any one of claims 1 to 7, wherein the organic light emitting diode device is arranged on a side of the second circuit layer away from the substrate.

9. A method for preparing a display substrate, characterized in that: include: providing a substrate; forming a first circuit layer on one side of the substrate; forming an isolation layer on a side of the first circuit layer away from the substrate; A second circuit layer is formed on a side of the isolation layer away from the substrate; wherein the first circuit layer is adjacent to and not connected to the second circuit layer, the first circuit layer has at least one first end, the second circuit layer has at least one second end, and one first end and one second end are located on the same side; along a direction perpendicular to the substrate, the isolation layer is arranged between the first end and the second end on at least one side, the isolation layer includes a first sub-isolation layer and a second sub-isolation layer that are connected, the thickness of the first sub-isolation layer along the direction perpendicular to the substrate is greater than the thickness of the second sub-isolation layer along the direction perpendicular to the substrate, and the first sub-isolation layer has contact surfaces with the first end and the second end respectively.

10. The method for preparing a display substrate according to claim 9, wherein: The isolation layer includes a first flat layer and an inorganic film layer, and the forming of the isolation layer on a side of the first circuit layer away from the substrate includes: forming the first planarization layer on a side of the first circuit layer away from the substrate; The inorganic film layer is formed on a side of the first flat layer away from the substrate; wherein the first flat layer has a uniform thickness along a direction perpendicular to the substrate, a side of the first flat layer close to the substrate has a first contact surface with the first end, a side of the inorganic film layer away from the substrate has a second contact surface with the second end, and an orthographic projection of the inorganic film layer on the substrate is located within an orthographic projection of the first flat layer on the substrate; The forming of a second circuit layer on a side of the isolation layer away from the substrate comprises: forming a second circuit layer on a side of the first planar layer and the inorganic film layer away from the substrate; or, The isolation layer includes a second flat layer, the second flat layer includes a first sub-flat layer and a second sub-flat layer connected to each other, and the step of forming the isolation layer on a side of the first circuit layer away from the substrate includes: The first sub-planar layer and the second sub-planar layer are formed on a side of the first circuit layer away from the substrate; wherein the thickness of the first sub-planar layer along a direction perpendicular to the substrate is greater than the thickness of the second sub-planar layer along a direction perpendicular to the substrate, the side of the first sub-planar layer close to the substrate has a third contact surface with the first end, and the side of the first sub-planar layer away from the substrate has a fourth contact surface with the second end; The forming of a second circuit layer on a side of the isolation layer away from the substrate comprises: A second circuit layer is formed on a side of the first sub-planar layer and the second sub-planar layer away from the substrate.

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