High-stability bridge rectifier module assembly process

Abstract

The invention discloses a high-stability rectifier bridge module assembly process. The high-stability rectifier bridge module assembly process comprises the following steps: step 1, preparing components; 2, fixing the electrode and the heat dissipation substrate; step 3, mounting an insulating part; 4, arranging and connecting the diodes; step 5, coating of a sealing coating; step 6, performing surface treatment on the heat dissipation substrate; 7, assembling and fixing the frame; the silicon nitride-based composite material is adopted as the heat dissipation substrate, compared with a traditional metal cooling fin, the heat conductivity and the insulation performance of the material are excellent, heat can be rapidly conducted in high-power operation, local overheating is prevented, and the high-temperature resistance of the module is improved; the heat dissipation substrate composite material can quickly lead out internal heat, the service life of the module is effectively prolonged, it is ensured that the module stably works in a high-temperature environment, and the shock resistance of the module is remarkably improved through the design of a double-layer buffering structure.

Description

Technical Field

[0001] The invention relates to the field of electronic component manufacturing, and in particular to a high-stability rectifier bridge stack module assembly process, belonging to the field of power electronics technology. Background Art

[0002] The bridge rectifier module is a key component that rectifies AC power into DC power and is widely used in various power systems, industrial control equipment, electric vehicles and other fields. The basic components of the bridge rectifier module include multiple diodes, which are usually connected in a bridge type to achieve single-phase or three-phase AC rectification. As electronic equipment has higher requirements for power stability, shock resistance and heat dissipation performance, the bridge rectifier module needs to have higher stability, good heat dissipation and shock resistance to ensure that the equipment can operate safely and stably under long-term and high-load environments.

[0003] Traditional rectifier bridge stack modules mostly use simple metal heat sinks for heat dissipation. This structure can play a certain role in small and medium power equipment, but in high power and high temperature environments, the heat dissipation efficiency is not enough, which can easily lead to excessive temperatures and affect the life of components. The lack of the use of composite heat dissipation materials has limited the heat dissipation efficiency and is difficult to meet the long-term operation requirements in high power environments. Most existing rectifier bridge stack modules lack special buffer structures, especially in high vibration or impact application scenarios. The connectors and diodes inside the module are prone to loosening or damage due to vibration. The design without a multi-layer buffer structure will result in poor working stability of the module in a high vibration environment and prone to failure. Summary of the invention

[0004] The purpose of the present invention is to provide a high-stability rectifier bridge stack module assembly process to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solution: a high-stability rectifier bridge stack module assembly process, the high-stability rectifier bridge stack module assembly process steps are as follows: Step 1: Component preparation: prepare the core components for the rectifier bridge stack module, including at least four diodes, two conductive electrodes, a high thermal conductivity heat dissipation substrate and multiple insulating parts; Step 2: Fixing the electrodes to the heat dissipation substrate, using a positioning device to align the two conductive electrodes with the surface of the heat dissipation substrate, and connecting the electrodes to the heat dissipation substrate using oxygen-free copper welding technology; Step 3: Install the insulating part, place the insulating part in the gap between the electrode and the heat dissipation substrate, and fix it by mechanical pressing so that the insulating part is closely attached to the surface of the electrode and the heat dissipation substrate; Step 4: Arrange and connect the diodes. Arrange the diodes at the connection points of the electrodes in sequence according to the polarity requirements of the positive and negative electrodes. Ensure that the polarity of the diodes is consistent. The connection terminals of the diodes are fixed to the electrode surface by brazing. Step 5: Applying a sealing coating, uniformly applying a layer of modified polymer sealing coating on the connection area between the electrode and the heat dissipation substrate and the diode contact area; Step 6: Surface treatment of the heat dissipation substrate, coating the exposed surface of the heat dissipation substrate; Step 7: Frame assembly and fixation: Place the assembled components inside a metal frame, fix the components around the frame with bolts, and set cushioning materials inside the frame to absorb external vibrations; Step 8: Quality inspection and packaging. Use automatic inspection equipment to perform quality inspection on the assembled rectifier bridge stack module to ensure that the polarity and connection of each diode are accurate. Qualified modules are sealed with packaging materials and the electrode polarity is marked on the packaging surface to facilitate subsequent installation and use.

[0006] As a preferred technical solution of the present invention, in step 1, the electrode is made of copper-tungsten alloy material.

[0007] As a preferred technical solution of the present invention, the heat dissipation substrate is made of a silicon nitride-based composite material, and the thermal conductivity is improved and the heat accumulation effect is reduced through a multi-layer stacking process.

[0008] As a preferred technical solution of the present invention, the surface of the insulating member is coated with a nano-scale coating.

[0009] As a preferred technical solution of the present invention, the sealing coating is a modified polymer coating.

[0010] As a preferred technical solution of the present invention, a double-layer buffer structure is used when fixing the component, and the double-layer buffer structure includes an outer buffer layer and an inner buffer layer, the outer buffer layer is made of silicone rubber, and the inner buffer layer is made of polyurethane foam.

[0011] As a preferred technical solution of the present invention, during the assembly process, the ambient temperature is controlled to be maintained at 20°C-25°C and the humidity is maintained at 30%-50% to ensure the stability of material properties.

[0012] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention adopts silicon nitride-based composite materials as heat dissipation substrates. Compared with traditional metal heat sinks, this type of material has superior thermal conductivity and insulation properties, can quickly conduct heat during high-power operation, prevent local overheating, and improve the high temperature resistance of the module. The heat dissipation substrate composite material can quickly export internal heat, effectively extend the life of the module, and ensure its stable operation in high temperature environments. The double-layer buffer structure design significantly improves the module's anti-seismic ability. The outer layer uses a rubber material with high elasticity to absorb the greater impact of external vibrations, and the inner layer uses a flexible foam material to buffer subtle vibrations. This double-layer buffer structure can not only provide stable support in a high-vibration environment, but also effectively reduce the impact of vibration on internal components, avoid loose electrical connections or component damage caused by vibration, and is suitable for various high-vibration work scenarios. DETAILED DESCRIPTION

[0013] The technical solutions in the embodiments of the present invention are described clearly and completely. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0014] The present invention provides a high-stability rectifier bridge stack module assembly process. Embodiment 1: The assembly process steps of the high-stability rectifier bridge stack module are as follows: Step 1: Component preparation: prepare the core components for the rectifier bridge stack module, including at least four diodes, two conductive electrodes, a high thermal conductivity heat dissipation substrate and multiple insulating parts. The components are prepared in full according to the predetermined quantity and size requirements to ensure the stability of the rectifier bridge stack module; Step 2: Fixing the electrodes to the heat dissipation substrate: Use a positioning device to align the two conductive electrodes with the surface of the heat dissipation substrate, and use oxygen-free copper welding technology to connect the electrodes to the heat dissipation substrate. The fixing area of ​​the electrodes and the heat dissipation substrate is polished with high precision to ensure the flatness of the contact surface and the firmness of the connection. Step 3: Install the insulating part. Place the insulating part in the gap between the electrode and the heat dissipation substrate and fix it by mechanical pressing so that the insulating part is in close contact with the surface of the electrode and the heat dissipation substrate to ensure electrical isolation between the electrode and the heat dissipation substrate and prevent displacement caused by external vibration. Step 4: Arrange and connect the diodes. Arrange the diodes at the connection points of the electrodes in sequence according to the polarity requirements of the positive and negative electrodes to ensure that the polarity of the diodes is consistent. The connection terminals of the diodes are fixed to the electrode surface using a brazing process to ensure the conductivity and position stability of each diode connection to avoid loosening due to environmental changes. Step 5: Applying a sealing coating, uniformly applying a layer of modified polymer sealing coating on the connection area between the electrode and the heat dissipation substrate and the diode contact area. The sealing coating should cover all possible contact points to ensure waterproof, moisture-resistant and corrosion-resistant properties, and extend the service life of the rectifier bridge stack module; Step 6: Surface treatment of the heat dissipation substrate. The exposed surface of the heat dissipation substrate is coated and wear resistance and corrosion resistance are increased. This surface treatment ensures stable heat dissipation under high-temperature operation and avoids component damage caused by temperature accumulation. Step 7: Assemble and fix the frame. Place the assembled components inside a metal frame and fix the components around the frame with bolts. Set buffer materials inside the frame to absorb external vibrations to ensure that the rectifier bridge stack module does not deviate under external forces. Set buffer materials inside the frame to absorb external vibrations and improve the impact resistance of the components. Step 8: Quality inspection and packaging. Use automatic inspection equipment to perform quality inspection on the assembled rectifier bridge stack module to ensure that the polarity and connection of each diode are accurate. Qualified modules are sealed with packaging materials and the electrode polarity is marked on the packaging surface to facilitate subsequent installation and use.

[0015] Embodiment 2: In the step 1, the electrode is made of copper-tungsten alloy material; the heat dissipation substrate is made of silicon nitride-based composite material, and the thermal conductivity is improved through a multi-layer stacking process to reduce the heat accumulation effect; the surface of the insulating part is coated with a nano-scale coating; the sealing coating is a modified polymer coating; a double-layer buffer structure is adopted when the component is fixed, and the double-layer buffer structure includes an outer buffer layer and an inner buffer layer, the outer buffer layer is made of silicone rubber, and the inner buffer layer is made of polyurethane foam; during the assembly process, the ambient temperature is controlled to be maintained at 20°C-25°C, and the humidity is maintained at 30%-50% to ensure the stability of material properties.

[0016] Example 3: In the assembly environment, the temperature is controlled at 22°C and the humidity is controlled at 40%. Prepare electrodes, heat dissipation substrates and insulating parts, and perform ultrasonic cleaning on each component. Then assemble the electrodes and heat dissipation substrates, install the insulating parts and seal them. After completion, check the flatness and gap of the contact surface to ensure assembly accuracy; For rectifier bridge stack modules for high-power applications, a multi-layer composite heat dissipation substrate is used to increase the thickness of the heat dissipation layer and improve the thermal conductivity. After assembly, the thermal stability of the components is verified through thermal cycle testing to ensure reliability in high-temperature environments; In the modules used in outdoor environments, a double-layer buffer structure is installed between the electrode and the heat dissipation substrate to improve the impact resistance of the components. After assembly, the module is placed in a humid environment for a 24-hour corrosion resistance test, and the sealing effect remains good after the test.

[0017] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-stability rectifier bridge stack module assembly process, characterized in that: The assembly process steps of the high-stability rectifier bridge stack module are as follows: Step 1: Component preparation: prepare the core components for the rectifier bridge stack module, including at least four diodes, two conductive electrodes, a high thermal conductivity heat dissipation substrate and multiple insulating parts; Step 2: Fixing the electrodes to the heat dissipation substrate, using a positioning device to align the two conductive electrodes with the surface of the heat dissipation substrate, and connecting the electrodes to the heat dissipation substrate using oxygen-free copper welding technology; Step 3: Install the insulating part, place the insulating part in the gap between the electrode and the heat dissipation substrate, and fix it by mechanical pressing so that the insulating part is closely attached to the surface of the electrode and the heat dissipation substrate; Step 4: Arrange and connect the diodes. Arrange the diodes at the connection points of the electrodes in sequence according to the polarity requirements of the positive and negative electrodes. Ensure that the polarity of the diodes is consistent. The connection terminals of the diodes are fixed to the electrode surface by brazing. Step 5: Applying a sealing coating, uniformly applying a layer of modified polymer sealing coating on the connection area between the electrode and the heat dissipation substrate and the diode contact area; Step 6: Surface treatment of the heat dissipation substrate, coating the exposed surface of the heat dissipation substrate; Step 7: Frame assembly and fixation: Place the assembled components inside a metal frame, fix the components around the frame with bolts, and set cushioning materials inside the frame to absorb external vibrations; Step 8: Quality inspection and packaging. Use automatic inspection equipment to perform quality inspection on the assembled rectifier bridge stack module to ensure that the polarity and connection of each diode are accurate. Qualified modules are sealed with packaging materials and the electrode polarity is marked on the packaging surface to facilitate subsequent installation and use.

2. According to the high-stability rectifier bridge stack module assembly process of claim 1, it is characterized by: In the step 1, the electrode is made of copper-tungsten alloy material.

3. According to the high-stability rectifier bridge stack module assembly process of claim 1, it is characterized by: The heat dissipation substrate is made of a silicon nitride-based composite material, and the thermal conductivity is improved and the heat accumulation effect is reduced through a multi-layer stacking process.

4. The high-stability rectifier bridge stack module assembly process according to claim 1, characterized in that: The surface of the insulating part is coated with a nano-scale coating.

5. The high-stability rectifier bridge stack module assembly process according to claim 1, characterized in that: The sealing coating is a modified polymer coating.

6. The high-stability rectifier bridge stack module assembly process according to claim 1, characterized in that: The assembly is fixed by a double-layer buffer structure, which includes an outer buffer layer and an inner buffer layer. The outer buffer layer is made of silicone rubber, and the inner buffer layer is made of polyurethane foam.

7. The high-stability rectifier bridge stack module assembly process according to claim 1, characterized in that: During the assembly process, the ambient temperature is controlled to be maintained at 20°C-25°C and the humidity is maintained at 30%-50% to ensure the stability of material properties.