Vacuum chuck and processing equipment

Abstract

The invention belongs to the technical field of semiconductor equipment, and discloses a vacuum chuck and processing equipment. The vacuum chuck comprises a chuck body and a positioning ring, silicon rings with different inner diameters can be positioned, the inner side, corresponding to the positioning ring, of the chuck body is provided with a drainage area, the outer side, corresponding to the positioning ring, of the chuck body is provided with an adsorption area, and when the adsorption area adsorbs the silicon rings, the inner sides of the silicon rings correspond to the drainage area, so that cooling water gathered in the silicon rings can be discharged from the drainage area; cooling water with grinding particles is prevented from being gathered in the silicon ring to influence the surface machining quality of the silicon ring; the suction cup body is further provided with the cooling water tank, cooling media in the cooling water tank can cool the suction cup body, and thermal deformation of the suction cup due to heat accumulation after multiple times of suction work is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a vacuum chuck and processing equipment. Background Art

[0002] In the process of semiconductor processing and manufacturing, wafers are usually fixed and transferred by vacuum adsorption technology. Ceramic suction cups have the characteristics of small pore size and high porosity, which can form a uniform and stable adsorption force. They are a common vacuum adsorption platform and are widely used in wafer grinding, polishing, glue spreading, testing, back reduction, dicing, cleaning, and handling. When fixing the wafer, the gas in the internal cavity of the ceramic suction cup is extracted through a vacuum device, thereby forming a negative pressure between the wafer and the ceramic suction cup, and then fixing the wafer on the adsorption surface of the ceramic suction cup.

[0003] like Figure 1 and Figure 2 As shown, the existing ceramic suction cup can generally only be adsorbed on wafers of conventional sizes. It is usually made of microporous ceramic 11, ceramic matrix 12 and micropermeable ceramic 13 sintered at high temperature, and then the micropermeable ceramic 13 is used as an isolation ring, and the microporous ceramic 11 can achieve adsorption of wafers of different sizes. However, the micropermeable ceramic 13 and the microporous ceramic 11 are both on the same plane, and the silicon ring 41, as the base material of the semiconductor chip, has a ring shape. The existing ceramic suction cup cannot accurately position and adsorb the silicon ring 41. In addition, the size of the silicon ring 41 is usually larger than a 12-inch wafer or smaller than 8 inches. The existing ceramic suction cup cannot adsorb the silicon ring 41 of special size.

[0004] In addition, the existing ceramic suction cup will produce thermal deformation after completing multiple adsorption operations, thereby affecting the processing dimensional accuracy of the silicon ring 41; at the same time, after the ceramic suction cup adsorbs the silicon ring 41, when the processing equipment processes the silicon ring 41, cooling water will accumulate in the silicon ring 41 and cannot be discharged. Since the accumulated cooling water will contain grinding particles, if it is not discharged in time during the processing process, the quality of the surface processing of the silicon ring 41 will be affected.

[0005] Therefore, a vacuum suction cup is urgently needed to solve the above problems. Summary of the invention

[0006] The object of the present invention is to provide a vacuum suction cup and processing equipment which can absorb a silicon ring of a special size, have a good cooling effect and can discharge water accumulated inside the silicon ring.

[0007] To achieve this object, the present invention adopts the following technical solutions:

[0008] A vacuum suction cup, comprising:

[0009] A suction cup body, wherein the suction cup body is provided with a cooling water tank;

[0010] A positioning ring is detachably connected to the suction cup body, the outer peripheral surface of the positioning ring is used to cooperate with the inner wall of the silicon ring for positioning, the suction cup body is provided with a drainage area on the inner side corresponding to the positioning ring, the drainage area is used to discharge the cooling water accumulated in the silicon ring, and an adsorption area is provided on the outer side corresponding to the positioning ring, the adsorption area is used to adsorb the silicon ring.

[0011] Preferably, a mounting groove is further provided on the suction cup body, and a mounting protrusion is provided on the positioning ring, and the mounting protrusion is placed in the mounting groove.

[0012] Preferably, a plurality of the positioning rings are provided, each of the plurality of positioning rings is provided with the mounting protrusion, and different positioning rings have different outer diameters, and one of the plurality of positioning rings is selectively connected to the mounting groove to achieve positioning of the silicon rings with different inner diameters.

[0013] Preferably, the suction cup body is provided with a water inlet hole and a water outlet, and both the water inlet hole and the water outlet are connected to the cooling water tank.

[0014] Preferably, the cooling water groove is arranged in a spiral shape on the suction cup body, or the cooling water groove is annular and is provided in plurality, and the plurality of cooling water grooves are arranged cocentrically and at intervals along the radial direction of the suction cup body.

[0015] Preferably, the suction cup body includes an upper base, a lower base and a porous plate, the positioning ring and the porous plate are both connected to the upper base, the adsorption area is arranged on the porous plate, the porous plate is provided with adsorption holes, the lower base is arranged on the side of the upper base away from the positioning ring and the porous plate, the upper base is provided with drainage holes corresponding to the drainage area, and the lower base is provided with a drainage channel connected with the drainage hole.

[0016] Preferably, the cooling water trough is arranged on a side of the lower base close to the upper base to cool the upper base and the porous disk; and / or, the cooling water trough is arranged on a side of the upper base close to the porous disk to cool the porous disk.

[0017] Preferably, a plurality of the adsorption holes are provided, and at least some of the adsorption holes have gradually larger diameters radially outward from the porous disk, and / or a distribution density of the plurality of adsorption holes gradually increases radially outward from the porous disk.

[0018] Preferably, the suction cup body is arranged on the mounting platform, and a sealing groove is arranged on the lower surface of the suction cup body, and the sealing groove is used for installing a sealing ring to achieve a sealed fit between the suction cup body and the mounting platform.

[0019] A processing equipment comprises a processing device and the above-mentioned vacuum suction cup, wherein the processing device is used for grinding the surface of the silicon ring adsorbed by the vacuum suction cup.

[0020] Beneficial effects of the present invention:

[0021] The invention provides a vacuum suction cup and processing equipment. The processing equipment comprises a processing device and a vacuum suction cup. The vacuum suction cup is used for absorbing a silicon ring. The processing device is used for grinding and thinning the surface of the silicon ring absorbed by the vacuum suction cup. The vacuum suction cup includes a suction cup body and a positioning ring. The positioning ring is detachably connected to the suction cup body and the outer peripheral surface of the positioning ring is used to cooperate with the inner wall of the silicon ring for positioning. The staff can replace the positioning rings of different outer diameters to connect with the suction cup body to realize the positioning of silicon rings of different inner diameters, thereby improving the versatility of the vacuum suction cup. A drainage area is provided on the inner side of the suction cup body corresponding to the positioning ring, and an adsorption area is provided on the outer side. When the silicon ring is placed on the vacuum suction cup, the adsorption area is used to adsorb the silicon ring, and the fixation of the silicon ring is more stable. At this time, the inner side of the silicon ring corresponds to the drainage area, and the cooling water accumulated in the silicon ring during the processing can be discharged from the drainage area, thereby avoiding the cooling water with grinding particles from accumulating in the silicon ring and affecting the surface processing quality of the silicon ring. The suction cup body is also provided with a cooling water tank, and the cooling medium in the cooling water tank can cool down the suction cup body, thereby avoiding thermal deformation of the vacuum suction cup due to heat accumulation after multiple adsorption operations, thereby improving the reliability of the vacuum suction cup. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of a ceramic suction cup provided by the prior art;

[0023] Figure 2 It is a schematic diagram of the structure of a ceramic suction cup provided by the prior art when adsorbing a silicon ring;

[0024] Figure 3 It is a schematic diagram of the structure of the vacuum suction cup provided by the present invention;

[0025] Figure 4 It is a schematic diagram of the structure of the vacuum suction cup provided by the present invention when adsorbing a silicon ring;

[0026] Figure 5 It is a partial schematic diagram of the drainage area of ​​the vacuum suction cup provided by the present invention;

[0027] Figure 6 is an enlarged view of the drainage channel of the vacuum suction cup provided by the present invention;

[0028] Figure 7 It is a partial schematic diagram of the vacuum channel of the vacuum suction cup provided by the present invention;

[0029] Figure 8It is a partial schematic diagram of the cooling water tank and water inlet hole of the vacuum suction cup provided by the present invention;

[0030] Fig. 9 It is a partial schematic diagram of the cooling water tank and the water outlet of the vacuum suction cup provided by the present invention;

[0031] Fig.10 It is a partial schematic diagram of the sealing groove of the vacuum suction cup provided by the present invention.

[0032] Figure 1 and Figure 2 middle:

[0033] 11. Microporous ceramics; 12. Ceramic matrix; 13. Micropermeable ceramics; 41. Silicon ring.

[0034] Figure 3-Figure 10 middle:

[0035] 31. Positioning ring; 32. Porous disk; 34. Upper substrate; 33. Lower substrate; 35. Drain plug; 341. Drain hole; 342. Vacuum groove; 343. First vacuum hole; 331. Drain channel; 332. Second vacuum hole; 333. Cooling water groove; 334. Water inlet hole; 335. Connecting hole; 336. Receiving groove; 337. Sealing groove; 41. Silicon ring. DETAILED DESCRIPTION

[0036] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0037] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0039] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0040] The present invention provides a vacuum suction cup and processing equipment, the processing equipment includes a processing device and a vacuum suction cup, the vacuum suction cup is used to absorb the silicon ring 41, and the processing device is used to grind and thin the surface of the silicon ring 41 absorbed by the vacuum suction cup. Figure 3 and Figure 4 The vacuum suction cup includes a suction cup body and a positioning ring 31. The suction cup body is detachably connected to the positioning ring 31. A drainage area is provided on the suction cup body corresponding to the inner side of the positioning ring 31, and an adsorption area is provided on the outer side of the positioning ring 31. That is, the suction cup body is provided with the drainage area, the positioning ring 31 and the adsorption area from the center to the outside. When the silicon ring 41 is placed on the vacuum suction cup, the outer peripheral surface of the positioning ring 31 cooperates with the inner wall of the silicon ring 41 for positioning, and the silicon ring 41 is adsorbed and fixed by the adsorption area. When the silicon ring 41 is processed, the drainage area is located on the inner side of the silicon ring 41, so that the cooling water accumulated in the silicon ring 41 can be discharged. In the above-mentioned setting, the positioning ring 31 can realize the positioning of the silicon ring 41, solving the problem that the existing suction cup cannot accurately position the silicon ring 41. At the same time, the positioning rings 31 with different outer diameters can be replaced and connected to the suction cup body to realize the positioning of the silicon ring 41 with different inner diameters; in addition, a drainage area is provided on the suction cup body so that the cooling water accumulated in the silicon ring 41 can be discharged from the drainage area, thereby preventing the cooling water with grinding particles from accumulating in the silicon ring 41 and affecting the surface processing quality of the silicon ring 41; in addition, the suction cup body is also provided with a cooling water tank 333, and the cooling medium in the cooling water tank 333 can cool the suction cup body 32, thereby preventing the suction cup from thermal deformation due to heat accumulation after multiple adsorption operations.

[0041] Furthermore, a mounting groove is provided on the suction cup body for installing the positioning ring 31, and a mounting protrusion is correspondingly provided on the positioning ring 31, and the mounting protrusion can be placed in the mounting groove, thereby completing the connection between the positioning ring 31 and the suction cup body. There can be multiple positioning rings 31, and the diameters of the mounting protrusions on different positioning rings 31 are the same, so that these positioning rings 31 can all be connected to the suction cup body, and different positioning rings 31 have different outer diameters, so one can be selected to be connected to the suction cup body to achieve positioning of silicon rings 41 with different inner diameters. Specifically, when positioning the silicon ring 41, a Cartesian rectangular coordinate system can be established on the upper surface of the suction cup body, and the positioning ring 31 positions the silicon ring 41 in the X-axis and Y-axis directions.

[0042] In addition, in order to ensure the connection stability between the positioning ring 31 and the suction cup body, a fastener can be used to install the positioning ring 31 on the suction cup body, and the fastener can be a screw. Of course, in other embodiments, the positioning ring 31 can also be installed on the suction cup body by magnetic attraction. Specifically, the suction cup body is made of steel, and the positioning ring 31 is made of a magnet.

[0043] Reference Figure 5-Figure 10 The vacuum suction cup includes an upper substrate 34, a lower substrate 33 and a porous disc 32. The positioning ring 31 and the porous disc 32 are both connected to the upper substrate 34. The adsorption area is arranged on the porous disc 32. The porous disc 32 is provided with adsorption holes for adsorbing the silicon ring 41. The lower substrate 33 is arranged on a side away from the positioning ring 31 and the porous disc 32. The upper substrate 34 is provided with a drainage hole 341. The drainage hole 341 is arranged corresponding to the drainage area. The lower substrate 33 is provided with a drainage channel 331 connected with the drainage hole 341. When processing the silicon ring 41, in order to avoid the excessive surface temperature of the silicon ring 41 affecting the processing quality, the silicon ring 41 needs to be watered to cool down, and then the cooling water will gather in the silicon ring 41. The suction cup body is provided with a drainage area, so that the cooling water gathered in the silicon ring 41 first passes through the drainage hole 341 on the upper substrate 34, and then passes through the drainage channel 331 on the lower substrate 33 to be discharged from the outside of the vacuum suction cup. Specifically, a receiving groove 336 is provided in the lower base 33, one end of the drainage channel 331 is connected to the groove bottom of the receiving groove 336, and the other end is provided on the outer wall of the lower base 33, and the cooling water enters the receiving groove 336 of the lower base 33 through the drainage hole 341 of the upper base 34, then enters the drainage channel 331, and finally is discharged from the outer wall of the lower base 33. Preferably, one end of the drainage channel 331 is connected to the groove bottom of the receiving groove 336 close to the circumferential surface of the groove wall, and the groove bottom of the receiving groove 336 is an inclined wall and the height decreases from the center to the circumference, and then the cooling water enters the receiving groove 336 and flows to the drainage channel 331 on the inclined wall under the action of gravity, so that the cooling water in the receiving groove 336 can be quickly and timely discharged, and the cooling water can be prevented from accumulating in the receiving groove 336.

[0044] In order to achieve the adsorption and detachment of the silicon ring 41, a vacuum channel is provided on the suction cup body, and the vacuum channel can be in a negative pressure so that the vacuum suction cup adsorbs the silicon ring 41, or in a positive pressure so that the silicon ring 41 is detached. In the suction cup body, a vacuum groove 342 and a first vacuum hole 343 are provided on the upper substrate 34, and the adsorption holes, vacuum grooves 342 and first vacuum holes 343 on the porous disk 32 are connected, and a second vacuum hole 332 is provided on the lower substrate 33, and the first vacuum hole 343 and the second vacuum hole 332 are connected, that is, the adsorption holes, vacuum grooves 342, first vacuum holes 343 and second vacuum holes 332 together constitute a vacuum channel. Optionally, the upper substrate 34, the lower substrate 33 and the porous disk 32 are sintered at high temperature to form the suction cup body to avoid vacuum leakage and thus adsorption failure. Furthermore, the vacuum groove 342 is arranged in a spiral shape on the upper surface of the upper substrate 34, the first vacuum hole 343 penetrates the upper substrate 34 along the axial direction of the upper substrate 34 and is connected to the vacuum groove 342, and the second vacuum hole 332 penetrates the lower substrate 33 along the axial direction of the lower substrate 33 and is connected to the first vacuum hole 343.

[0045] Furthermore, when the suction cup body absorbs the silicon ring 41, the second vacuum hole 332 can be connected to an external vacuum generating device to form a negative pressure in the vacuum channel, so that the silicon ring 41 is tightly absorbed on the porous disk 32. When the silicon ring 41 is processed and needs to be separated from the suction cup body, a cleaning medium can be introduced into the second vacuum hole 332 to form a positive pressure in the vacuum channel, so that the silicon ring 41 can be separated from the porous disk 32, and the cleaning medium can clean the vacuum channel and the porous disk 32. Of course, in other embodiments, there can also be multiple vacuum grooves 342 and they are arranged in an annular shape on the upper surface of the upper substrate 34, and the multiple annular grooves are arranged concentrically. Correspondingly, the first vacuum hole 343 and the second vacuum hole 332 are also arranged in multiple and one-to-one correspondence. Among them, the cleaning medium is preferably a two-fluid, specifically a mixture of compressed gas and cleaning liquid.

[0046] In addition, there are multiple adsorption holes on the porous disk 32, and the radial outward apertures of at least some of the adsorption holes of the porous disk 32 gradually increase, and / or the distribution density of the multiple adsorption holes along the radial outward of the porous disk 32 gradually increases. This arrangement can ensure that the suction force on the outer side of the circumference of the porous disk 32 is greater than the suction force on the inner side, thereby preventing the porous disk 32 from being deformed due to excessive stress on the outer side of the circumference.

[0047] A cooling channel is also provided in the suction cup body, specifically including a cooling water tank 333. The cooling medium in the cooling water tank 333 can cool the suction cup body to prevent the suction cup body from being thermally deformed due to heat accumulation after multiple adsorption operations. Specifically, the cooling channel also includes a water inlet 334 and a water outlet. The water inlet 334 and the water outlet are both connected to the cooling water tank 333. The water inlet 334 is externally connected to a cooling device. The cooling medium enters the cooling water tank 333 from the water inlet 334, takes away the heat of the suction cup body during the processing, and then is discharged from the suction cup body from the water outlet. Furthermore, the cooling water tank 333 is provided on a side of the lower substrate 33 close to the upper substrate 34 to cool the upper substrate 34 and the porous disc 32, and / or is provided on a side of the upper substrate 34 close to the porous disc 32 to directly cool the porous disc. The cooling water groove 333 is arranged in a vortex shape on the upper surface of the lower base 33, the water inlet hole 334 penetrates the lower base 33 along the axis direction of the lower base 33 and is connected to the cooling water groove 333, and the water outlet is arranged on the outer wall of the lower base 33. Of course, in other embodiments, there may be multiple cooling water grooves 333 and they may be arranged in an annular shape on the upper surface of the lower base 33, and the multiple annular grooves may be arranged concentrically, and accordingly, the water inlet holes 334 and the water outlets may also be arranged in multiple and one-to-one correspondence.

[0048] Reference Fig. 9 A drain plug 35 may be provided in the water outlet, and the surface of the drain plug 35 has threads. When the cooling medium is discharged from the water outlet, it is discharged through the thread gap on the drain surface, thereby slowing down the flow rate of the cooling medium, so that the cooling medium can fully take away the heat in the suction cup body.

[0049] It can be understood that, in the present invention, the vacuum channel, the drainage channel 331 and the cooling channel are three independent channels, which are not interconnected.

[0050] Reference Fig.10 The suction cup body can be arranged on the mounting platform, so that the subsequent processing device can stably process the silicon ring 41. Specifically, a sealing groove 337 is arranged on the lower surface of the lower substrate 33. The sealing groove 337 is used to install a sealing ring to achieve a sealed fit between the suction cup body and the mounting platform. Figure 3 A connecting hole 335 is also provided on the lower base 33, and the staff can use a connecting piece to pass through the connecting hole 335 to fix the entire vacuum suction cup on the installation platform to ensure the installation stability of the vacuum suction cup.

[0051] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A vacuum suction cup, characterized in that: For adsorbing silicon ring (41), comprising: A suction cup body, wherein the suction cup body is provided with a cooling water tank (333); A positioning ring (31) is detachably connected to the suction cup body, the outer peripheral surface of the positioning ring (31) is used to cooperate with the inner wall of the silicon ring (41) for positioning, the suction cup body is provided with a drainage area corresponding to the inner side of the positioning ring (31), the drainage area is used to discharge the cooling water accumulated in the silicon ring (41), and an adsorption area is provided corresponding to the outer side of the positioning ring (31), the adsorption area is used to adsorb the silicon ring (41).

2. The vacuum suction cup according to claim 1, characterized in that: The suction cup body is also provided with a mounting groove, and the positioning ring (31) is provided with a mounting protrusion, which is placed in the mounting groove.

3. The vacuum suction cup according to claim 2, characterized in that: A plurality of the positioning rings (31) are provided, each of the plurality of positioning rings (31) is provided with the mounting protrusion, and different positioning rings (31) have different outer diameters. One of the plurality of positioning rings (31) is selectively connected to the mounting groove to achieve positioning of the silicon rings (41) with different inner diameters.

4. The vacuum suction cup according to claim 1, characterized in that: The suction cup body is provided with a water inlet hole (334) and a water outlet, and both the water inlet hole (334) and the water outlet are connected to the cooling water tank (333).

5. The vacuum suction cup according to claim 1, characterized in that: The cooling water groove (333) is arranged in a spiral shape on the suction cup body, or the cooling water groove (333) is annular and is arranged in plurality, and the plurality of cooling water grooves (333) are arranged cocentrically and spaced apart in the radial direction of the suction cup body.

6. The vacuum suction cup according to any one of claims 1 to 5, characterized in that: The suction cup body comprises an upper base (34), a lower base (33) and a porous plate (32); the positioning ring (31) and the porous plate (32) are both connected to the upper base (34); the adsorption area is arranged on the porous plate (32); the porous plate (32) is provided with adsorption holes; the lower base (33) is arranged on a side of the upper base (34) away from the positioning ring (31) and the porous plate (32); the upper base (34) is provided with a drainage hole (341) corresponding to the drainage area; and the lower base (33) is provided with a drainage channel (331) connected with the drainage hole (341).

7. The vacuum suction cup according to claim 6, characterized in that: The cooling water trough (333) is arranged on a side of the lower base (33) close to the upper base (34) to cool the upper base (34) and the porous disk (32); and / or the cooling water trough (333) is arranged on a side of the upper base (34) close to the porous disk (32) to cool the porous disk (32).

8. The vacuum suction cup according to claim 6, characterized in that: A plurality of adsorption holes are provided, and at least some of the adsorption holes have a diameter that gradually increases radially outward from the porous disk (32), and / or a distribution density of the plurality of adsorption holes gradually increases radially outward from the porous disk (32).

9. The vacuum suction cup according to any one of claims 1 to 5, characterized in that: The suction cup body is arranged on the mounting platform, and a sealing groove (337) is arranged on the lower surface of the suction cup body. The sealing groove (337) is used to install a sealing ring to achieve a sealed fit between the suction cup body and the mounting platform.

10. A processing equipment, characterized in that: It comprises a processing device and a vacuum suction cup as claimed in any one of claims 1 to 9, wherein the processing device is used for grinding the surface of the silicon ring (41) adsorbed by the vacuum suction cup.

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