Three-dimensional system packaging heat dissipation structure and heat dissipation method thereof

Abstract

According to the three-dimensional system packaging heat dissipation structure and the heat dissipation method thereof provided by the invention, the first diversion cavity is formed in the second substrate, the second diversion cavity is formed in the copper substrate, and the piezoelectric ceramic vibrating reed can generate vibration after being connected with current, so that the metal sheet is driven to vibrate synchronously; the vibration of the metal sheet can be transmitted into the flow channel layer and acts on the airflow flowing area, the space of the airflow flowing area can be changed due to the vibration of the metal sheet, then airflow can be driven to be formed in the airflow flowing area, the formed airflow can further drive air to flow, and therefore air around the second chip is driven. Therefore, the heat around the second chip can be introduced into the external atmosphere, the heat dissipation of the second substrate and the copper substrate is realized, and the cooling effect of the second chip can be realized.

Description

Technical Field

[0001] The present invention relates to the field of packaging technology, and in particular to a heat dissipation packaging structure and a packaging substrate. Background Art

[0002] With the rapid development of consumer electronics, packaging technology is moving towards miniaturization and multifunctionality. As the integration of chips becomes higher and higher, the power of chips is also increasing, so the heat dissipation of chips has become a key factor limiting chip performance and system performance.

[0003] In the prior art, in order to achieve heat dissipation of the chip, a heat dissipation structure is usually set on the chip. The surface area of ​​the heat dissipation structure is larger. However, as the performance requirements of electronic devices continue to increase, the heat generated by the chip during operation is also increasing, resulting in the traditional heat dissipation structure being unable to fully meet the heat dissipation needs of the chip. Summary of the invention

[0004] In view of the defects of the prior art, the present invention provides a three-dimensional system packaging heat dissipation structure and a heat dissipation method thereof.

[0005] A three-dimensional system packaging heat dissipation structure comprises a flexible substrate; a first substrate and a second substrate, wherein the first substrate and the second substrate are respectively connected to the flexible substrate, and the second substrate is arranged on both sides of the first substrate; a copper substrate is arranged on the back of the second substrate, and a receiving portion is arranged on the copper substrate; a first chip is arranged on a surface of the first substrate; a second chip is arranged in the receiving portion; a first guide cavity is arranged on the second substrate, a second guide cavity connected to the first guide cavity is arranged in the copper substrate, and a guide structure is arranged in the first guide cavity, wherein the guide structure comprises: a substrate, on which a plurality of vibration cavities are arranged; a plurality of piezoelectric ceramic vibration sheets are arranged in the vibration cavity and are suitable for connecting a driving circuit; a metal sheet is arranged on one side of the substrate, and the vibration formed by the piezoelectric ceramic vibration sheet is suitable for driving the metal sheet to deform; a flow channel layer is arranged on one side of the metal sheet, and a plurality of airflow flow areas corresponding to the vibration cavities are arranged in the flow channel layer; a bottom plate is arranged on one side of the flow channel layer; an airflow channel is arranged at least one portion of the bottom plate corresponding to the airflow flow area, and the airflow channel is connected to the second guide cavity.

[0006] Furthermore, in the three-dimensional system packaging heat dissipation structure provided by the present invention, a first air inlet and a first air outlet are respectively provided on both sides of the second substrate, the flow channel layer is provided with a second air inlet corresponding to the first air inlet, and a second air outlet corresponding to the first air outlet, and the airflow flow area is located between the second air inlet and the second air outlet.

[0007] Furthermore, in the three-dimensional system packaging heat dissipation structure provided by the present invention, there are two second chips, the two second substrates are arranged parallel to each other, and the first air outlet of one of the second substrates is arranged corresponding to the first air inlet of the other second substrate.

[0008] Furthermore, in the three-dimensional system packaging heat dissipation structure provided by the present invention, two second substrates are connected to each other, and a first air outlet of one second substrate is connected to a first air inlet of another second substrate.

[0009] Further, the inner diameter of the first air outlet of one of the second substrates is r1, and the inner diameter of the first air inlet of the other second substrate is r2, wherein r1>r2.

[0010] Furthermore, the three-dimensional system packaging heat dissipation structure provided by the present invention further includes a heat dissipation plate made of metal material, which is connected to the two second substrates at the same time, and a hollow portion is provided on the heat dissipation plate at a position corresponding to the piezoelectric ceramic vibration piece.

[0011] Furthermore, in the three-dimensional system packaging heat dissipation structure provided by the present invention, the top surface of the heat dissipation plate is provided with a heat dissipation structure extending in the height direction.

[0012] Furthermore, the three-dimensional system packaging heat dissipation structure provided by the present invention is a heat dissipation fin.

[0013] Furthermore, in the three-dimensional system packaging heat dissipation structure provided by the present invention, the second guide cavity is provided through the copper substrate.

[0014] The present invention provides a heat dissipation method for a three-dimensional system packaging heat dissipation structure, comprising the following steps: obtaining the temperature of a second chip; when the temperature of the second chip is higher than a preset threshold, controlling a driving circuit to start; and the driving circuit energizes a plurality of piezoelectric ceramic vibration plates respectively, so that the plurality of piezoelectric ceramic vibration plates form vibrations with different phases.

[0015] In the heat dissipation method of the three-dimensional system packaging heat dissipation structure provided by the present invention, the phases formed by two adjacent piezoelectric ceramic vibrating sheets are opposite.

[0016] The beneficial effects of the present invention are: The three-dimensional system packaging heat dissipation structure provided by the present invention has a first guide cavity on the second substrate, a second guide cavity on the copper substrate, and a guide structure in the first guide cavity. The guide structure can form a certain airflow in the second guide cavity, and then further enter the second guide cavity, so that airflow is formed in the first guide cavity and the second guide cavity, thereby achieving uniform and rapid heat dissipation of the second substrate and the copper substrate, and then achieving uniform and rapid cooling effect on the second chip. In the present invention, the piezoelectric ceramic vibrating plate will vibrate itself after the current is turned on, and then drive the metal plate to vibrate synchronously. The vibration of the metal plate will be transmitted to the flow channel layer and act on the airflow flow area. Since the vibration of the metal plate will cause the space of the airflow flow area to change, it can drive the formation of airflow inside the airflow flow area. The formed airflow will further drive the air flow, thereby driving the air around the second chip, and then the heat around the second chip can be introduced into the outside atmosphere, thereby achieving a cooling effect.

[0017] 2. In the present invention, there are two second chips, the two second substrates are arranged parallel to each other, and the first air outlet of one of the second substrates is arranged corresponding to the first air inlet of the other second substrate.

[0018] With the above arrangement, the hot air flowing out through the first air outlet of the second substrate will further enter the first air inlet position of the adjacent second substrate, and then be further accelerated in another second substrate, thereby accelerating the heat dissipation of the adjacent second substrate.

[0019] 3. In the present invention, the two second substrates are connected to each other, and the first air outlet of one second substrate is connected to the first air inlet of the other second substrate.

[0020] By connecting the two second substrates, the hot air flowing out of the first second substrate can be directly introduced into the other connected second substrate, ensuring that the wind speed of the hot air entering the second substrate is maintained at a certain high wind speed, thereby ensuring the heat dissipation effect on the chip.

[0021] 4. The inner diameter of the first air outlet of one of the second substrates is r1, and the inner diameter of the first air inlet of the other second substrate is r2, wherein r1>r2.

[0022] According to the Bernoulli equation, an increase in flow rate will lead to a decrease in pressure energy. Therefore, when the diameter of the pipe of the other second substrate is reduced, the flow rate of the wind entering the other second substrate increases, resulting in a decrease in pressure, which can then take away more heat. Ultimately, the heat dissipation efficiency of the second chip can be ensured. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The specific contents of the present invention are described below with reference to the accompanying drawings, which will help to more easily understand the above and other purposes, features and advantages of the present invention. The accompanying drawings are only for illustrating the principles of the present invention. The sizes and relative positions of the units in the accompanying drawings need not be drawn to scale.

[0024] Figure 1 It is a schematic diagram of the cooperation between the flexible substrate provided by the present invention and the first substrate and the second substrate; Figure 2 is a schematic diagram of a three-dimensional system packaging heat dissipation structure provided by the present invention; Figure 3 It is an exploded view of the assembly between the guide structure provided by the present invention and the copper substrate; Figure 4 It is a cross-sectional view of the guide structure and the copper substrate provided by the present invention.

[0025] Description of Reference Numerals 1. Flexible substrate; 2. First substrate; 3. Second substrate; 4. Copper substrate; 41. Second guide cavity; 5. First chip; 6. Second chip; 7. Guide structure; 701. Base; 7011. Vibration cavity; 702. Piezoelectric ceramic vibration plate; 703. Metal sheet; 704. Flow channel layer; 705. Airflow area; 706. Bottom plate; 7061. Airflow channel; 8. Bonding wire. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings, so that the above-mentioned and other objects, features and advantages of the present invention will be clearer. The same reference numerals in all the drawings indicate the same parts. The drawings are not deliberately drawn to scale, and the focus is on illustrating the subject matter of the present invention.

[0027] The terms and words used in the following description and claims are not limited to the written meanings, but are used only by the inventor so that the present invention can be clearly and consistently understood. Therefore, it is obvious to those skilled in the art that the following description of various embodiments of the present invention is provided for illustrative purposes only, and not for the purpose of limiting the present invention as defined by the attached claims and their equivalents.

[0028] It should be understood that the singular forms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to a "module" includes reference to one or more such modules. The advantages and features of the present invention and methods of implementing the present invention may be more readily understood by reference to the detailed description and drawings of the embodiments below. However, the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present invention will be thorough and complete and will fully convey the concepts of the present invention to those skilled in the art.

[0029] Example 1 This embodiment provides a three-dimensional system packaging heat dissipation structure, such as Figure 1-Figure 4 Shown, including Flexible substrate 1; like Figure 1 As shown, the flexible substrate 1 itself is made of a flexible material, such as polyimide (PI), so as to facilitate bending operations to form a subsequent three-dimensional structure, which can improve the compactness and lightweight level of the product and enhance the reliability and durability of the product.

[0030] A first substrate 2 and two second substrates 3, the first substrate 2 and the second substrates 3 are respectively connected to the flexible substrate 1, the flexible substrate 1 and the first substrate 2 and the two second substrates 3 can be directly connected without additional connectors or cables, or gold fingers or other forms of contact points can be used between the flexible substrate 1 and the first substrate 2 and the two second substrates 3. The second substrate 3 is arranged on both sides of the first substrate 2 through the flexible substrate 1.

[0031] like Figure 1 As shown, the first substrate 2 is arranged in the middle, and the second substrate 3 is arranged on the left and right sides.

[0032] A copper substrate 4 is arranged on a surface of the second substrate 3 and has a receiving portion thereon; a first chip 5 is arranged on one side of the first substrate 2; Specifically, the copper substrate 4 is bonded and fixed on the back of the two second substrates 3. The two copper substrates 4 are bonded and fixed on one surface of the two second substrates 3 using conductive silver paste, and the length and width of the copper substrate 4 can be the same as those of the second substrate 3.

[0033] The first chip 5 is disposed on the first substrate 2 by welding, and is generally a low-power chip with a power of 20-500 mW.

[0034] A second chip 6, arranged in the accommodation portion; like Figure 2 As shown, the number of the second chips 6 is two, and the two second chips 6 are symmetrically arranged.

[0035] Specifically, since the receiving portion is provided on the copper substrate 4, a cavity is formed on the copper substrate 4, and the second chip 6 is provided in the cavity. In order to achieve stability of the second chip 6, the second chip 6 can be provided in the cavity by welding or bonding.

[0036] The second chip 6 is generally a high-power chip with a power of at least 1 W, so the need for heat dissipation is relatively large.

[0037] In order to achieve signal transmission, in this embodiment, two second chips 6 are bonded to the second substrate 3 through bonding wires 8 .

[0038] Furthermore, in order to form a stable three-dimensional structure, e.g. Figure 2 As shown, after the flexible substrate 1 is bent, a plastic encapsulation material may be further filled in the space covered by the flexible substrate 1 to protect the bonding wires 8 and support the first substrate 2 located on the top.

[0039] In this embodiment, since the second chip 6 is a high-power chip, the heat on the chip is often uneven. Even if the chip is cooled through the copper substrate, the uniformity of the heat dissipation is not ideal, which greatly affects the performance and reliability of the second chip. In order to achieve uniform heat dissipation of the second chip 6, a first guide cavity is provided on the second substrate 3, and a second guide cavity 41 connected to the first guide cavity is provided in the copper substrate 4. Through the cooperation of the first guide cavity and the second guide cavity 41, a space for air flow can be formed in the copper substrate 4, thereby achieving uniform cooling of the second chip 6.

[0040] Furthermore, in order to achieve the flow of air, a flow guiding structure 7 is provided in the first flow guiding cavity, and the flow guiding structure 7 includes: A base body 701, on which a plurality of vibration chambers 7011 are arranged; A plurality of piezoelectric ceramic vibration sheets 702 are arranged in the vibration cavity 7011. In this embodiment, the piezoelectric ceramic vibration sheets 702 are bonded in the vibration cavity 7011 and are suitable for connecting the driving circuit; a metal sheet 703 is arranged on one side of the substrate 701, and the vibration formed by the piezoelectric ceramic vibration sheets 702 is suitable for driving the metal sheet 703 to deform; a flow channel layer 704 is arranged on one side of the metal sheet 703, and a plurality of air flow areas 705 corresponding to the vibration cavity 7011 are arranged in the flow channel layer 704; a bottom plate 706 is arranged on one side of the flow channel layer 704; an air flow channel 7061 is arranged on at least one portion of the bottom plate 706 corresponding to the air flow area 705, and the air flow channel 7061 is connected to the second guide cavity 41. The air flow area 705 is located between the second air inlet and the second air outlet.

[0041] Specifically, Figure 3 As shown, the driving circuit is used to be controlled externally to provide driving control power to two piezoelectric ceramic vibrating pieces 702, so that the piezoelectric ceramic vibrating pieces 702 generate agitation and vibrate at the resonant frequency of the ultrasonic wave. When any piezoelectric ceramic vibrating piece 702 vibrates, the piezoelectric ceramic vibrating piece 702 will also drive the piezoelectrically actuated metal piece 703 to perform a single reed agitation. The two piezoelectric ceramic vibrating pieces 702 vibrating at the resonant frequency of the ultrasonic wave will produce rapid deformation changes. Since the vibration of the two metal pieces 703 will form a certain phase difference, the agitation of the metal piece 703 will drive the volume of the airflow flow area 705 in the flow channel layer 704 to change, and form a bulging and contracting blowing effect in the two airflow flow areas 705, thereby driving the internal airflow to flow.

[0042] In this embodiment, the vibration direction of the metal sheet 703 is perpendicular to the flow channel layer 704. Figure 3 As shown, the metal sheet 703 vibrates in the vertical direction, and the flow channel layer 704 extends in the horizontal direction.

[0043] In this embodiment, the flow mode of the airflow is as follows: the piezoelectric ceramic vibration plate 702 will vibrate itself after the current is turned on, and then drive the metal plate 703 to vibrate synchronously. The vibration of the metal plate 703 will be transmitted to the flow channel layer 704 and act on the airflow flow area 705. The vibration of the metal plate 703 will cause the space of the airflow flow area 705 to change, and then drive the formation of airflow inside the airflow flow area 705. The formed airflow will further drive the air flow in the first guide cavity. The airflow in the first guide cavity further flows into the second guide cavity 41, thereby driving the air around the second chip 6, and then the heat around the second chip 6 can be introduced into the outside atmosphere, thereby achieving a heat dissipation effect on the second chip 6.

[0044] In this embodiment, in order to introduce external air into the packaging structure, a first air inlet and a first air outlet are respectively provided on both sides of the second substrate 3. Figure 2 As shown, the first air inlet is arranged at the left side, and the first air outlet is arranged at the right side. The flow channel layer 704 is provided with a second air inlet corresponding to the first air inlet, and a second air outlet corresponding to the first air outlet. Correspondingly, the second air inlet is arranged at the left side of the flow channel layer 704, and the second air outlet is arranged at the right side of the flow channel layer 704. When the piezoelectric ceramic vibrating piece 702 is started, the external air flow passes through the first air inlet, the second air inlet, the first air outlet, and the second air outlet in sequence.

[0045] At the same time, the air inlet of the second guide cavity 41 is also located between the first air outlet and the second air outlet, so as to guide the airflow into the interior of the copper substrate 4 .

[0046] Specifically, Figure 4 As shown, the second guide cavity 41 is arranged through the copper substrate 4 , and the second guide cavity extends from top to bottom and penetrates the copper substrate 4 .

[0047] Furthermore, in this embodiment, there are two second chips 6 , the two second substrates 3 are arranged parallel to each other, and the first air outlet of one of the second substrates 3 is arranged corresponding to the first air inlet of the other second substrate 3 .

[0048] like Figure 2 As shown, the two second chips 6 are arranged side by side in the horizontal direction. Through the above-mentioned arrangement, the hot air flowing out through the first air outlet of the second substrate 3 on the left will further enter the first air inlet position of the second substrate 3 on the right, and then be further accelerated in the second substrate 3 on the right. Since the wind flowing out from the second substrate 3 on the left already has a certain speed, when entering the second substrate 3 on the right, the wind will be further accelerated. Due to the increase in speed, air with relatively low external temperature can be further introduced from the outside of the second substrate 3 into the second substrate 3 on the right, thereby accelerating the heat dissipation of the adjacent second substrate 3.

[0049] In this embodiment, the above solution is taken as a whole, and the airflow flowing out from the second substrate 3 on the left side can have a certain acceleration effect on the airflow in the second substrate 3 on the right side, thereby achieving effective cooling.

[0050] In this embodiment, the two second substrates 3 are connected to each other, and the first air outlet of one second substrate 3 is connected to the first air inlet of the other second substrate 3. By connecting the two second substrates 3, the hot air flowing out of the first second substrate 3 can be directly introduced into the other second substrate 3 connected thereto, ensuring that the wind speed of the hot air entering the second substrate 3 is maintained at a certain high wind speed, thereby ensuring the heat dissipation effect on the chip.

[0051] Furthermore, the inner diameter of the first air outlet of the second substrate 3 located on the left side is r1, and the inner diameter of the first air inlet of the second substrate 3 located on the right side is r2, wherein r1>r2.

[0052] According to the Bernoulli equation, an increase in flow rate will lead to a decrease in pressure energy. Therefore, when the pipe diameter is reduced, the flow rate increases, resulting in a decrease in pressure. In this way, more heat can be taken away, thereby effectively ensuring that the second chip 6 on the right side is cooled.

[0053] In this embodiment, in order to further achieve the heat dissipation effect, a heat dissipation plate made of metal material is also included, which is connected to the two second substrates 3. A hollow portion is provided on the heat dissipation plate at a position corresponding to the piezoelectric ceramic vibration piece 702.

[0054] Specifically, the heat sink can further collect the heat generated by the packaging structure. At the same time, by forming a hollow portion on the heat sink, the piezoelectric ceramic vibration piece 702 can be avoided, thereby preventing the vibration generated by the piezoelectric ceramic vibration piece 702 from impacting the heat sink and affecting the normal operation of the piezoelectric ceramic vibration piece 702.

[0055] Furthermore, in this embodiment, the top surface of the heat sink is provided with a heat dissipation structure extending in the height direction, and the heat dissipation structure is configured as heat dissipation fins, which can be made of common metals, such as copper, aluminum, etc., which can further enhance the overall heat dissipation effect.

[0056] Example 2 This embodiment provides a heat dissipation method of a three-dimensional system packaging heat dissipation structure, comprising the following steps: Acquire the heating temperature of the second chip; when the temperature of the second chip is higher than a preset threshold, control the driving circuit to start; The driving circuit energizes the plurality of piezoelectric ceramic vibration plates respectively, so that the plurality of piezoelectric ceramic vibration plates vibrate in different phases.

[0057] Specifically, after being powered on, the multiple piezoelectric ceramic vibrating plates use their effective phase difference to control the air intake and exhaust volumes of the two air flow areas, thereby generating an alternating exhaust and continuous output effect.

[0058] In this embodiment, the phases formed by two adjacent piezoelectric ceramic vibrating plates are opposite. By adjusting the driving circuit, one airflow flow area can inhale while the other airflow flow area exhausts, thereby continuously introducing and exhausting airflow, thereby achieving efficient heat dissipation effect.

[0059] As an implementation mode, the voltage of the driving circuit is 25 volts, and the piezoelectric ceramic vibrating piece can form an amplitude in the range of 6 μm-10 μm. By adjusting the voltage value of the driving circuit, different degrees of heat dissipation effects can be obtained.

[0060] Although the technology has been illustrated and described with respect to one or more embodiments, changes and / or modifications may be made to the illustrated examples without departing from the spirit and scope of the appended claims. In particular, with respect to the various functions performed by the above-described components or structures (assemblies, devices, circuits, systems, etc.), the terms used to describe such components (including references to "means") are intended to correspond to any component or structure (e.g., functionally equivalent) that performs the specified function of the described component, even if not structurally equivalent to the disclosed structure that performs the function in the example embodiments described herein, unless otherwise specified. In addition, although a particular feature may have been disclosed with respect to one of several embodiments, such a feature may be combined with one or more other features in other embodiments as may be desired and advantageous for any given or particular application. In addition, to the extent that the terms "comprising," "including," "having," "having," "containing," or variations thereof are used in the detailed description or claims, such terms are intended to be inclusive in a manner similar to the term "comprising."

[0061] Many specific details are described in the above description to facilitate a full understanding of the present invention. However, the above description is only a preferred embodiment of the present invention. The present invention can be implemented in many other ways different from those described herein, so the present invention is not limited to the specific implementation disclosed above. At the same time, any person familiar with the art can make many possible changes and modifications to the technical solution of the present invention using the methods and technical contents disclosed above without departing from the scope of the technical solution of the present invention, or modify it into an equivalent embodiment of equivalent changes. Any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the scope of protection of the technical solution of the present invention.

Claims

1. A three-dimensional system packaging heat dissipation structure, characterized in that: include Flexible substrate (1); A first substrate (2) and two second substrates (3), wherein the first substrate (2) and the second substrate (3) are respectively connected to the flexible substrate (1), and the second substrates (3) are arranged on both sides of the first substrate (2); A copper substrate (4) is arranged on the back side of the second substrate (3), and a receiving portion is arranged on the copper substrate; A first chip (5) is arranged on a surface of the first substrate (2); A second chip (6) is arranged in the receiving portion; The second substrate (3) is provided with a first flow guide cavity, the copper substrate (4) is provided with a second flow guide cavity (41) connected to the first flow guide cavity, the first flow guide cavity is provided with a flow guide structure (7), and the flow guide structure (7) comprises: A base body (701) having a plurality of vibration chambers (7011) disposed thereon; A plurality of piezoelectric ceramic vibration sheets (702), arranged in the vibration cavity (7011) and suitable for connecting to a driving circuit; A metal sheet (703) is arranged on one side of the substrate (701), and the vibration generated by the piezoelectric ceramic vibration sheet (702) is suitable for driving the metal sheet (703) to deform; A flow channel layer (704) is arranged on one side of the metal sheet (703), wherein a plurality of airflow flow areas (705) corresponding to the vibration chamber (7011) are arranged in the flow channel layer (704); A bottom plate (706) is arranged on one side of the flow channel layer (704); At least one portion of the bottom plate (706) corresponding to the airflow area (705) is provided with an airflow channel (7061), and the airflow channel (7061) is connected to the second guide cavity (41).

2. The three-dimensional system packaging heat dissipation structure according to claim 1, characterized in that: A first air inlet and a first air outlet are respectively provided on both sides of the second substrate (3); the flow channel layer (704) is provided with a second air inlet corresponding to the first air inlet, and a second air outlet corresponding to the first air outlet; and the air flow area (705) is located between the second air inlet and the second air outlet.

3. The three-dimensional system packaging heat dissipation structure according to claim 2, characterized in that: There are two second substrates (3), there are two second chips (6), the two second substrates (3) are arranged parallel to each other, and the first air outlet of one of the second substrates (3) is arranged corresponding to the first air inlet of the other second substrate (3).

4. The three-dimensional system packaging heat dissipation structure according to claim 2, characterized in that: The two second substrates (3) are connected to each other, wherein the first air outlet of one second substrate (3) is connected to the first air inlet of the other second substrate (3).

5. The three-dimensional system packaging heat dissipation structure according to claim 4, characterized in that: The inner diameter of the first air outlet of one of the second substrates (3) is r1, and the inner diameter of the first air inlet of the other second substrate (3) is r2, wherein r1>r2.

6. The three-dimensional system packaging heat dissipation structure according to claim 4 or 5, characterized in that: It also comprises a heat sink made of metal material, which is connected to the two second substrates (3) at the same time, and a hollow portion is provided on the heat sink at a location corresponding to the piezoelectric ceramic vibration piece (702).

7. The three-dimensional system packaging heat dissipation structure according to claim 6, characterized in that: The top surface of the heat dissipation plate is provided with heat dissipation fins extending in the height direction.

8. The three-dimensional system packaging heat dissipation structure according to claim 1, characterized in that: The second flow guide cavity is arranged through the copper substrate (4).

9. A heat dissipation method for a three-dimensional system packaging heat dissipation structure, characterized in that: The three-dimensional system packaging heat dissipation structure is the three-dimensional system packaging heat dissipation structure according to any one of claims 1 to 8; Obtaining the heating temperature of the second chip (6); When the heating temperature of the second chip (6) is higher than a preset threshold, the control driving circuit is started; The driving circuit energizes the plurality of piezoelectric ceramic vibration plates (702) respectively, so that the plurality of piezoelectric ceramic vibration plates (702) vibrate in different phases.

10. The heat dissipation method of the three-dimensional system packaging heat dissipation structure according to claim 9, characterized in that: The phases formed by two adjacent piezoelectric ceramic vibration pieces (702) are opposite to each other, and a vibration amplitude is formed within the range of 6 μm-10 μm.

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