PCB hole metallization method based on suppression of electric leakage influence and PCB

Abstract

The invention provides a PCB hole metallization method based on electric leakage influence suppression and a PCB. The PCB hole metallization method based on suppression of the electric leakage influence comprises the following steps: carrying out hole conditioning treatment for cleaning grease on the surface of a PCB; micro-etching treatment: removing oxides on the copper surface of the PCB and etching the copper surface of the PCB; wherein the micro-etching grounding conductor is arranged in the micro-etching cylinder, and if electric leakage occurs, the micro-etching grounding conductor is used for absorbing charges of liquid medicine in the micro-etching cylinder, so that the micro-etching grounding conductor is used for guiding the charges of the liquid medicine in the micro-etching cylinder to the floor stand; preimpregnation treatment: forming a protective film on the hole wall and the surface of the PCB; activating treatment is carried out to enable the palladium colloid to be attached to the hole wall of the PCB; acceleration processing: stripping the tin colloid layer on the surface of the PCB and in the hole to expose the palladium colloid layer; and carrying out chemical copper treatment for forming a copper layer on the hole wall of the PCB. Therefore, the part, immersed into the micro-etching cylinder, of the micro-etching grounding assembly has high corrosion resistance, and the service life of grounding treatment is prolonged.

Description

Technical Field

[0001] The present disclosure relates to the technical field of PCB boards, and in particular to a PCB hole metallization method and a PCB board based on suppressing the influence of leakage. Background Art

[0002] Copper plating, also known as hole metallization (PTH), connects the wires between the layers of double-sided or multi-layer circuit boards. It uses chemical deposition to deposit a thin layer of chemical copper on the hole wall after drilling to provide conductivity for subsequent electroplating copper. The copper plating process is as follows: glue removal section → hole filling → micro-etching → pre-dip → activation → acceleration → copper plating. The main function of the glue removal section is to remove the residual glue caused by drilling in the hole to prevent ICD separation in the multi-layer board; the function of hole filling is to clean the grease on the board surface and adjust the hole wall from negative charge to positive charge; the micro-etching function is to remove the oxide on the copper surface and bite the copper surface to make it rough; the function of pre-dip is to prevent acidic substances and moisture from entering the activation tank to pollute the tank liquid; the function of activation is to make the tin-palladium colloid adhere to the hole wall; the function of acceleration is to strip the tin colloid layer on the board surface and in the hole to expose the palladium colloid layer; chemical copper uses formaldehyde as a reducing agent and palladium as a catalyst to reduce copper ions into metallic copper in an alkaline solution and attach to the hole wall.

[0003] The quality of copper plating directly affects the functionality of the subsequent finished product, that is, whether the hole can be conductive, and the quality of copper plating is directly reflected in the backlight level (the industry requires ≥9 levels). In the copper plating process, in order to facilitate the filling of the solution, the copper plating line solution tank is equipped with corresponding facilities, including vibration, ultrasound, swing, etc.

[0004] There are many factors that affect the backlight of copper plating, such as poor hole filling, poor activation, insufficient copper plating activity, etc. Another factor that is not easy to find is the leakage of facilities around the copper plating line and the potting tank, such as vibration, ultrasound, etc. When these facilities leak, they will enter the potting tank through the stainless steel copper plating rack. This leakage mainly affects the area between the hole filling tank and the copper plating tank. Because the chemical copper plating process involves chemical reactions and charges, the leakage of facilities around the potting tank will affect the related reactions. The reason why leakage is sometimes difficult to detect is that the equipment sometimes appears and sometimes does not, that is, intermittent leakage. Therefore, in order to prevent the adverse effects of leakage on the backlight, the potting tank can be grounded.

[0005] The copper-sinking line chemical tank involves strong acids and alkalis. For example, the micro-etching tank is made of sodium persulfate and 3-5% sulfuric acid, which can react with general metals such as copper; the activation tank contains about 5% hydrochloric acid, and the activation tank must strictly control the content of copper ions and iron ions. Whether it is copper, iron or even 304 stainless steel, it will be corroded, and copper and iron ions will also be produced to pollute the activation tank; the copper-plating tank contains a strong alkaline environment of sodium hydroxide during production, but sulfuric acid and hydrogen peroxide are used to nitrate copper every few days after the tank is emptied. The nitrate tank liquid is a strong acid and strong oxidant, so the grounding wire from the whole hole tank to the copper-plating tank must be corrosion-resistant and will not pollute the chemical tank, especially the activation tank.

[0006] In the related art, one end of the grounding wire is exposed as copper wire and placed in a medicine tank, and the other end of the grounding wire is also exposed as copper wire and tied to the surrounding ground bracket. However, due to the poor corrosion resistance of copper wire, the grounding wire fails quickly, that is, the grounding treatment fails quickly, usually within half a month or even less than a week. Summary of the invention

[0007] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a PCB hole metallization method and a PCB board based on suppressing the influence of leakage.

[0008] The purpose of this disclosure is achieved through the following technical solutions:

[0009] A PCB hole metallization method based on suppressing the influence of leakage current, wherein hole metallization treatment is performed by a copper sinking line, wherein the copper sinking line comprises a floor support, a hole-smoothing cylinder, a micro-etching cylinder, a pre-dip cylinder, an activation cylinder, an acceleration cylinder, a copper sinking cylinder and a copper sinking rack; the hole-smoothing cylinder, the micro-etching cylinder, the pre-dip cylinder, the acceleration cylinder and the copper sinking cylinder are sequentially arranged on the floor support, and the copper sinking rack is used to sequentially immerse the PCB board into the hole-smoothing cylinder, the micro-etching cylinder, the pre-dip cylinder, the acceleration cylinder and the copper sinking cylinder;

[0010] The copper-plated wire further includes a micro-etching grounding assembly, which includes a micro-etching grounding conductor, a micro-etching grounding wire and a first polymethyl methacrylate solidified body. The micro-etching grounding conductor is disposed in the potion of the micro-etching tank, one end of the micro-etching grounding wire is electrically connected to the micro-etching grounding conductor, and the other end of the micro-etching grounding wire is electrically connected to the landing bracket, and the first polymethyl methacrylate solidified body is coated and connected to one end of the micro-etching grounding wire; wherein the micro-etching grounding conductor is 316 stainless steel;

[0011] The PCB hole metallization method based on suppressing the influence of leakage current includes:

[0012] Whole hole treatment is used to clean the grease on the surface of the PCB board;

[0013] Micro-etching treatment is used to remove oxides on the copper surface of the PCB board and to erode the copper surface of the PCB board; wherein the micro-etching grounding conductor is arranged in the potion in the micro-etching tank, and if there is leakage, the micro-etching grounding conductor is used to absorb the charge of the potion in the micro-etching tank, so that the micro-etching grounding conductor is used to guide the charge of the potion in the micro-etching tank to the floor bracket;

[0014] Prepreg treatment, used to form a protective film on the hole wall and surface of the PCB board;

[0015] Activation treatment is used to make the palladium colloid adhere to the hole wall of the PCB board;

[0016] Accelerating treatment is used to strip the tin colloid layer on the board surface and in the hole of the PCB board to expose the palladium colloid layer;

[0017] Copperization treatment is used to form a copper layer on the hole wall of the PCB board.

[0018] In some of the embodiments, the micro-etching ground conductor is disposed at the bottom of the micro-etching cylinder;

[0019] In the micro-etching process, the micro-etching ground conductor is disposed at the bottom of the micro-etching tank.

[0020] In some embodiments, the micro-etching grounding assembly further includes a micro-etching magnetic attraction component, the micro-etching magnetic attraction component is connected to the micro-etching grounding conductor, the first polymethyl methacrylate solidified body is further coated and connected to the surface of the micro-etching magnetic attraction component, the micro-etching magnetic attraction component is located in the potion of the micro-etching tank and is magnetically connected to the activation tank;

[0021] In the micro-etching process, the micro-etching magnetic attraction member is placed in the solution of the micro-etching tank and is magnetically connected to the micro-etching tank, so that the micro-etching grounding conductor is placed in the solution of the micro-etching tank.

[0022] In some embodiments, the copper-plated wire further includes an activated grounding component, the activated grounding component includes an activated grounding conductor, an activated grounding wire and a second polymethyl methacrylate solidified body, the activated grounding conductor is disposed in the potion of the activation tank, one end of the activated grounding wire is electrically connected to the activated grounding conductor, the other end of the activated grounding wire is electrically connected to the floor bracket, and the second polymethyl methacrylate solidified body is coated and connected to one end of the activated grounding wire; wherein the activated grounding conductor is 316 stainless steel;

[0023] During the activation process, the activation grounding conductor is set in the potion in the activation tank. If leakage occurs, the activation grounding conductor is used to absorb the charge of the potion in the activation tank, so that the activation grounding conductor is used to guide the charge of the potion in the activation tank to the floor bracket.

[0024] In some embodiments, the activation ground conductor is disposed at the bottom of the activation cylinder;

[0025] In the activation process, the activation ground conductor is disposed at the bottom of the activation cylinder.

[0026] In some embodiments, the activation grounding assembly further comprises an activation magnetic member, the activation magnetic member is connected to the activation grounding conductor, the second polymethyl methacrylate solid body is further coated and connected to the surface of the activation magnetic member, the activation magnetic member is magnetically located in the potion of the activation cylinder and is magnetically connected to the activation cylinder;

[0027] During the activation process, the activation magnetic element is placed in the potion in the activation tank and magnetically connected to the activation tank, so that the activation ground conductor is placed in the potion in the activation tank.

[0028] In some embodiments, the copper-plated wire further includes a copper grounding component, the copper grounding component includes a copper grounding conductor, a copper grounding wire and a third polymethyl methacrylate solidified body, the copper grounding conductor is arranged in the potion of the copper tank, one end of the copper grounding wire is electrically connected to the copper grounding conductor, the other end of the copper grounding wire is electrically connected to the landing bracket, and the third polymethyl methacrylate solidified body is coated and connected to one end of the copper grounding wire; wherein the copper grounding conductor is 316 stainless steel;

[0029] In the copper-plating treatment, the copper-plating grounding conductor is set in the solution in the copper-plating tank. If leakage occurs, the copper-plating grounding conductor is used to absorb the charge of the solution in the copper-plating tank, so that the copper-plating grounding wire is used to guide the charge of the solution in the copper-plating tank to the floor bracket.

[0030] In some embodiments, the copper-plating grounding conductor is disposed at the liquid surface of the copper-plating tank;

[0031] In the copper plating process, the copper plating grounding conductor is arranged at the liquid surface of the copper plating tank.

[0032] In some embodiments, the copper-plating grounding assembly further includes a copper-plating magnetic attraction piece, the copper-plating magnetic attraction piece is connected to the copper-plating grounding conductor, the third polymethyl methacrylate solidified body is further coated and connected to the surface of the copper-plating magnetic attraction piece, the copper-plating magnetic attraction piece is located in the potion of the copper-plating tank and is magnetically connected to the copper-plating tank;

[0033] In the copper treatment, the copper magnetic attraction member is placed in the solution of the copper tank and magnetically connected to the copper tank, so that the copper grounding conductor is placed in the copper tank.

[0034] A PCB board is prepared by using the PCB hole metallization method based on suppressing leakage influence described in any of the above embodiments.

[0035] Compared with the prior art, the present invention has at least the following advantages:

[0036] 1. The first polymethyl methacrylate solidified body has strong chemical stability and is not easy to react with the medicine in the micro-etching tank. This stability enables the first polymethyl methacrylate solidified body to maintain its performance stability in the medicine in the micro-etching tank, so that the first polymethyl methacrylate solidified body has strong corrosion resistance in the micro-etching tank. Since the first polymethyl methacrylate solidified body covers one end of the micro-etching grounding wire, specifically covers the exposed copper wire connected to one end of the micro-etching grounding wire, the first polymethyl methacrylate solidified body can protect the exposed copper wire at one end of the micro-etching grounding wire, thereby making the exposed copper wire at one end of the micro-etching grounding wire have strong corrosion resistance in the medicine in the micro-etching tank.

[0037] 2. Although the first polymethyl methacrylate cured body covers the exposed copper wire connected to one end of the micro-etching grounding wire, resulting in the exposed copper wire at one end of the micro-etching grounding wire being unable to be directly electrically connected to the potion, the micro-etching grounding conductor is arranged in the potion in the micro-etching tank, and the exposed copper wire at one end of the micro-etching grounding conductor, the micro-etching grounding wire and the floor bracket are electrically connected in sequence, so that the potion in the micro-etching tank can be grounded through the micro-etching grounding conductor, the micro-etching grounding wire and the floor bracket in sequence, thereby suppressing the influence of leakage on the micro-etching tank.

[0038] 3. 316 stainless steel is a type of chromium-nickel austenitic stainless steel, and its alloy composition contains a high proportion of chromium and nickel. Chromium is one of the most important alloying elements in 316 stainless steel, which can significantly improve the corrosion resistance of 316 stainless steel. Chromium can combine with oxygen to form a dense chromium oxide protective film, which can prevent corrosive substances from directly contacting the stainless steel matrix, thereby slowing down the corrosion process. Nickel can enhance the strength and toughness of 316 stainless steel, and also help improve the corrosion resistance of 316 stainless steel. Nickel can stabilize the austenite structure, reduce the intergranular corrosion tendency of 316 stainless steel in a corrosive environment, and help improve the corrosion resistance of 316 stainless steel. The microstructure of 316 stainless steel is austenite, and the chromium and nickel elements in austenitic stainless steel can be evenly distributed to form a stable alloy phase, thereby improving the corrosion resistance of stainless steel. Therefore, 316 stainless steel has strong corrosion resistance, which makes 316 stainless steel have strong corrosion resistance in the potion containing micro-etching cylinders. Since the micro-etching grounding conductor is made of 316 stainless steel, the micro-etching grounding conductor has strong corrosion resistance in the potion containing the micro-etching tank, that is, the micro-etching grounding conductor has strong corrosion resistance in the micro-etching tank.

[0039] 4. Since the exposed copper wire at one end of the micro-etching grounding conductor has strong corrosion resistance in the solution of the micro-etching tank, and the micro-etching grounding conductor has strong corrosion resistance in the micro-etching tank, the part of the micro-etching grounding component immersed in the micro-etching tank has strong corrosion resistance, which extends the service life of the grounding treatment. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0041] Figure 1 A flowchart of a method for metallizing a PCB hole based on suppressing the influence of leakage current according to an embodiment of the present invention;

[0042] Figure 2 A schematic diagram of a partial structure of a copper-plated wire according to an embodiment;

[0043] Figure 3 for Figure 2 A schematic diagram of the local structure of the copper sinking line shown;

[0044] Figure 4 for Figure 1 Schematic diagram of the structure of the copper sinking line shown.

[0045] Figure numerals: 100, floor stand; 210, whole hole cylinder; 220, micro-etching cylinder; 230, pre-impregnation cylinder; 240, activation cylinder; 250, acceleration cylinder; 260, copper deposition cylinder; 300, copper deposition rack; 400, micro-etching grounding assembly; 410, micro-etching grounding conductor; 420, micro-etching grounding wire; 430, first polymethyl methacrylate cured body; 500, activation grounding assembly; 600, copper deposition grounding assembly; 700, oscillation grounding assembly. DETAILED DESCRIPTION

[0046] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are given in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thoroughly and comprehensively understood.

[0047] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0049] The present invention provides a PCB hole metallization method based on suppressing the influence of leakage current, and the hole metallization treatment is performed through a copper deposition line, and the copper deposition line includes a floor bracket, a hole-smoothing cylinder, a micro-etching cylinder, a pre-preg cylinder, an activation cylinder, an acceleration cylinder, a copper deposition cylinder, and a copper deposition rack; the hole-smoothing cylinder, the micro-etching cylinder, the pre-preg cylinder, the acceleration cylinder, and the copper deposition cylinder are sequentially arranged on the floor bracket, and the copper deposition rack is used to immerse the PCB board into the hole-smoothing cylinder, the micro-etching cylinder, the pre-preg cylinder, the acceleration cylinder, and the copper deposition cylinder in sequence. The copper deposition line also includes a micro-etching grounding component, and the micro-etching grounding component includes a micro-etching grounding conductor, a micro-etching grounding wire, and a first polymethyl methacrylate solidified body. The micro-etching grounding conductor is arranged in the potion of the micro-etching cylinder, one end of the micro-etching grounding wire is electrically connected to the micro-etching grounding conductor, and the other end of the micro-etching grounding wire is electrically connected to the floor bracket, and the first polymethyl methacrylate solidified body is coated and connected to one end of the micro-etching grounding wire; wherein the micro-etching grounding conductor is 316 stainless steel.

[0050] The PCB hole metallization method based on suppressing the influence of leakage current includes: whole hole treatment, which is used to clean the grease on the board surface of the PCB board; micro-etching treatment, which is used to remove the oxide on the copper surface of the PCB board and bite the copper surface of the PCB board; wherein, the micro-etching grounding conductor is set in the micro-etching cylinder, if leakage current occurs, the micro-etching grounding conductor is used to absorb the charge of the potion in the micro-etching cylinder, so that the micro-etching grounding conductor is used to guide the charge of the potion in the micro-etching cylinder to the landing bracket; pre-preg treatment, which is used to form a protective film on the hole wall and surface of the PCB board; activation treatment, which is used to make the palladium colloid adhere to the hole wall of the PCB board; acceleration treatment, which is used to strip the tin colloid layer on the board surface and the hole of the PCB board to expose the palladium colloid layer; copper treatment, which is used to form a copper layer on the hole wall of the PCB board.

[0051] The present disclosure also provides a PCB board, which is prepared by using the above-mentioned PCB hole metallization method based on suppressing the influence of leakage.

[0052] In the above-mentioned PCB hole metallization method and PCB board based on suppressing the influence of leakage, the first polymethyl methacrylate solid body has strong chemical stability and is not easy to react with the medicine in the micro-etching tank. This stability enables the first polymethyl methacrylate solid body to maintain its performance stability in the medicine in the micro-etching tank, so that the first polymethyl methacrylate solid body has strong corrosion resistance in the micro-etching tank. Since the first polymethyl methacrylate solid body covers one end of the micro-etching grounding wire, specifically covers the exposed copper wire connected to one end of the micro-etching grounding wire, the first polymethyl methacrylate solid body can protect the exposed copper wire at one end of the micro-etching grounding wire, thereby making the exposed copper wire at one end of the micro-etching grounding wire have strong corrosion resistance in the medicine in the micro-etching tank.

[0053] Furthermore, although the first polymethyl methacrylate cured body covers the exposed copper wire connected to one end of the micro-etching grounding wire, resulting in the exposed copper wire at one end of the micro-etching grounding wire being unable to be directly electrically connected to the potion, the micro-etching grounding conductor is arranged in the potion in the micro-etching tank, and the exposed copper wire at one end of the micro-etching grounding conductor, the micro-etching grounding wire and the floor bracket are electrically connected in sequence, so that the potion in the micro-etching tank can be grounded through the micro-etching grounding conductor, the micro-etching grounding wire and the floor bracket in sequence, thereby suppressing the influence of leakage on the micro-etching tank.

[0054] Furthermore, 316 stainless steel is a type of chromium-nickel austenitic stainless steel, and its alloy composition contains a high proportion of chromium and nickel. Chromium is one of the most important alloying elements in 316 stainless steel, which can significantly improve the corrosion resistance of 316 stainless steel. Chromium can combine with oxygen to form a dense chromium oxide protective film, which can prevent corrosive substances from directly contacting the stainless steel matrix, thereby slowing down the corrosion process. Nickel can enhance the strength and toughness of 316 stainless steel, and also help improve the corrosion resistance of 316 stainless steel. Nickel can stabilize the austenite structure, reduce the intergranular corrosion tendency of 316 stainless steel in a corrosive environment, and help improve the corrosion resistance of 316 stainless steel. The microstructure of 316 stainless steel is austenite, and the chromium and nickel elements in austenitic stainless steel can be evenly distributed to form a stable alloy phase, thereby improving the corrosion resistance of stainless steel. Therefore, 316 stainless steel has strong corrosion resistance, which makes 316 stainless steel have strong corrosion resistance in the potion containing micro-etching cylinders. Since the micro-etching grounding conductor is made of 316 stainless steel, the micro-etching grounding conductor has strong corrosion resistance in the potion containing the micro-etching tank, that is, the micro-etching grounding conductor has strong corrosion resistance in the micro-etching tank.

[0055] Furthermore, since the exposed copper wire at one end of the micro-etching grounding conductor has strong corrosion resistance in the solution of the micro-etching tank, and the micro-etching grounding conductor has strong corrosion resistance in the micro-etching tank, the part of the micro-etching grounding component immersed in the micro-etching tank has strong corrosion resistance, thereby extending the service life of the grounding treatment.

[0056] In order to better understand the technical solutions and beneficial effects of the present invention, the present invention is further described in detail below in conjunction with specific embodiments:

[0057] like Figures 1 to 4As shown, a PCB hole metallization method based on suppressing the influence of leakage current in one embodiment is used to perform hole metallization processing through a copper sinking line, and the copper sinking line includes a landing bracket 100, a hole-smoothing cylinder 210, a micro-etching cylinder 220, a pre-dip cylinder 230, an activation cylinder 240, an acceleration cylinder 250, a copper sinking cylinder 260, and a copper sinking rack 300. The hole-smoothing cylinder 210, the micro-etching cylinder 220, the pre-dip cylinder 230, the acceleration cylinder 250, and the copper-plating cylinder are sequentially arranged on the landing bracket 100, and the copper sinking rack 300 is used to sequentially immerse the PCB board into the hole-smoothing cylinder 210, the micro-etching cylinder 220, the pre-dip cylinder 230, the acceleration cylinder 250, and the copper-plating cylinder, so that the PCB board is sequentially subjected to hole-smoothing processing, micro-etching processing, pre-dip processing, acceleration processing, and copper-plating processing. The copper sinking wire also includes a micro-etching grounding component 400, which includes a micro-etching grounding conductor 410, a micro-etching grounding wire 420 and a first polymethyl methacrylate solidified body 430. The micro-etching grounding conductor 410 is arranged in the potion of the micro-etching cylinder 220, one end of the micro-etching grounding wire 420 is electrically connected to the micro-etching grounding conductor 410, and the other end of the micro-etching grounding wire 420 is electrically connected to the landing bracket 100. The first polymethyl methacrylate solidified body 430 covers one end of the micro-etching grounding wire 420, specifically covers the exposed copper wire connected to one end of the micro-etching grounding wire 420. Among them, the micro-etching grounding conductor 410 is 316 stainless steel. It can be understood that the first polymethyl methacrylate solidified body 430 is an acrylic colloid. Further, the micro-etching cylinder contains a micro-etching liquid, and the micro-etching liquid includes sodium persulfate and 3-5% sulfuric acid.

[0058] In this embodiment, the first polymethyl methacrylate solidified body 430 has strong chemical stability and is not easy to react with the solution in the micro-etching cylinder 220. This stability enables the first polymethyl methacrylate solidified body 430 to maintain its performance stability in the solution in the micro-etching cylinder, and makes the first polymethyl methacrylate solidified body 430 corrosion-resistant in the micro-etching cylinder 220, thereby enabling the first polymethyl methacrylate solidified body 430 to protect the exposed copper wire at one end of the micro-etching grounding wire 420.

[0059] Furthermore, 316 stainless steel is a type of chromium-nickel austenitic stainless steel, and its alloy composition contains a high proportion of chromium and nickel. Chromium is one of the most important alloying elements in 316 stainless steel, which can significantly improve the corrosion resistance of 316 stainless steel. Chromium can combine with oxygen to form a dense chromium oxide protective film, which can prevent corrosive substances from directly contacting the stainless steel matrix, thereby slowing down the corrosion process. Nickel can enhance the strength and toughness of 316 stainless steel, and also help improve the corrosion resistance of 316 stainless steel. Nickel can stabilize the austenite structure, reduce the intergranular corrosion tendency of 316 stainless steel in a corrosive environment, and help improve the corrosion resistance of 316 stainless steel. The microstructure of 316 stainless steel is austenite, and the chromium and nickel elements in austenitic stainless steel can be evenly distributed to form a stable alloy phase, thereby improving the corrosion resistance of stainless steel.

[0060] like Figures 1 to 4 As shown, in some embodiments, the PCB hole metallization method based on suppressing the influence of leakage includes:

[0061] S101, whole hole treatment, used to clean the grease on the surface of PCB board.

[0062] In this embodiment, after the PCB board is subjected to the degumming treatment, the PCB board is subjected to the hole-sizing treatment. The hole-sizing process can thoroughly clean the hole wall of the PCB board and remove impurities, grease and other pollutants generated during the drilling or other processing processes. The hole-sizing agent used in the hole-sizing treatment has a certain wettability and can penetrate into the hole wall of the PCB board, making the hole wall surface more uniform and moist, which helps the subsequent electroplating solution to better adhere to the hole wall to form a uniform and dense electroplating layer. The hole-sizing process can also improve the electrical properties of the hole wall, making it have better conductivity, which is crucial for electrical connections on the circuit board, because good conductivity can ensure the smooth transmission of current on the circuit board, thereby improving the performance and stability of the entire circuit board.

[0063] S103, micro-etching treatment, used to remove oxides on the copper surface of the PCB board and erode the copper surface of the PCB board; wherein, the micro-etching grounding conductor 410 is set in the micro-etching cylinder 220, if leakage occurs, the micro-etching grounding conductor 410 is used to absorb the charge of the potion in the micro-etching cylinder 220, so that the micro-etching grounding conductor 420 is used to guide the charge of the potion in the micro-etching cylinder 220 to the landing bracket 100.

[0064] In this embodiment, the micro-etching treatment removes these impurities and oxide layers through chemical reactions, making the surface of the circuit board cleaner. The micro-etching treatment can also make the surface of the circuit board rough and increase the surface active points, which is conducive to the electroplating layer to better adhere to the surface of the circuit board. Through the micro-etching treatment, the bonding force between the electroplating layer and the circuit board can be improved, thereby enhancing the mechanical strength and stability of the entire circuit board. The micro-etching grounding conductor 410 is set in the potion of the micro-etching cylinder 220, so that the potion in the micro-etching cylinder 220, the micro-etching grounding conductor 410, the micro-etching grounding wire 420 and the landing bracket 100 are electrically connected in sequence. If there is leakage, the micro-etching grounding conductor 410 is used to absorb the charge of the potion in the micro-etching cylinder 220, so that the micro-etching grounding wire 420 is used to guide the charge of the potion in the micro-etching cylinder 220 to the landing bracket 100, thereby realizing the drainage of the leakage in the micro-etching cylinder 220 to the ground.

[0065] S105, prepreg treatment, used to form a protective film on the hole wall and surface of the PCB board.

[0066] In this embodiment, the pre-preg can remove impurities such as oil, dust, etc. that may exist on the surface of the PCB board, and provide a clean surface for the subsequent copper plating process. The pre-preg liquid used for the pre-preg process can adjust the polarity of the surface of the PCB board, making it easier to adsorb the subsequent colloidal palladium particles, thereby ensuring the uniformity, continuity and density of the copper plating. Through the pre-preg process, the bonding force between the surface of the PCB board and the subsequent electroplating layer can be enhanced, and the mechanical strength and stability of the entire PCB board can be improved.

[0067] S107, activation treatment, used to make the palladium colloid adhere to the hole wall of the PCB board.

[0068] In this embodiment, the activation treatment is carried out by immersing the PCB board in a solution containing an activator. The activator can remove oxides and pollutants on the surface of the hole wall, and a uniform palladium colloid layer will be formed on the hole wall of the PCB board. This colloid layer has excellent catalytic activity and can improve the uniformity and quality of the subsequent electroplated copper layer.

[0069] S109, accelerated treatment, is used to strip off the tin colloid layer on the surface of the PCB board and in the hole, so that the palladium colloid layer is exposed.

[0070] In this embodiment, during the activation process, a tin colloid layer will be formed on the surface of the PCB board, that is, the tin colloid layer will cover the palladium colloid layer, thereby hindering the subsequent chemical copper plating process. Specifically, the presence of the tin colloid layer will interfere with the reduction and deposition of copper ions, resulting in uneven and discontinuous copper deposition, or even failure to proceed smoothly. Therefore, the PCB board is subjected to an accelerated treatment to peel off the tin colloid layer on the board surface and in the hole. During the accelerated treatment, the accelerating liquid in the accelerating cylinder 250 will react with the tin colloid layer to generate soluble compounds or decompose it into small molecules, and these substances will be removed from the surface of the PCB board and in the hole through steps such as washing. After the accelerated treatment, the palladium colloid layer originally covered by the tin colloid layer will be exposed again, providing a good catalytic center for the subsequent chemical copper plating process. In this way, it can be ensured that the copper ions can be uniformly reduced and deposited on the surface of the PCB board and in the hole, forming a continuous and dense copper layer, thereby improving the electrical conductivity, mechanical strength and welding reliability of the PCB board.

[0071] S201, copper plating treatment, used to form a copper layer on the hole wall of the PCB board.

[0072] In this embodiment, the copper treatment uses formaldehyde as a reducing agent and a palladium colloidal layer as a catalyst to reduce copper ions into metallic copper in an alkaline solution and attach the metal to the hole wall of the PCB board, so that a copper layer is formed on the hole wall of the PCB.

[0073] In the above-mentioned PCB hole metallization method based on suppressing the influence of leakage, the first polymethyl methacrylate solidified body 430 has strong chemical stability and is not easy to react with the medicine in the micro-etching tank 220. This stability enables the first polymethyl methacrylate solidified body 430 to maintain its performance stability in the medicine in the micro-etching tank, so that the first polymethyl methacrylate solidified body 430 has strong corrosion resistance in the micro-etching tank 220. Since the first polymethyl methacrylate solidified body 430 covers one end connected to the micro-etching grounding wire 420, specifically covers the exposed copper wire connected to one end of the micro-etching grounding wire 420, the first polymethyl methacrylate solidified body 430 can play a role in protecting the exposed copper wire at one end of the micro-etching grounding wire 420, thereby making the exposed copper wire at one end of the micro-etching grounding wire 420 have strong corrosion resistance in the medicine in the micro-etching tank 220.

[0074] Furthermore, although the first polymethyl methacrylate cured body 430 covers the exposed copper wire connected to one end of the micro-etching grounding wire 420, resulting in the exposed copper wire at one end of the micro-etching grounding wire 420 being unable to be directly electrically connected to the potion, the micro-etching grounding conductor 410 is disposed in the potion in the micro-etching cylinder 220, and the exposed copper wire at one end of the micro-etching grounding conductor 410, the micro-etching grounding wire 420 and the floor stand 100 are electrically connected in sequence, so that the potion in the micro-etching cylinder 220 can be grounded through the micro-etching grounding conductor 410, the micro-etching grounding wire 420 and the floor stand 100 in sequence, thereby suppressing the influence of leakage on the micro-etching cylinder 220.

[0075] Furthermore, 316 stainless steel is a type of chromium-nickel austenitic stainless steel, and its alloy composition contains a high proportion of chromium and nickel. Chromium is one of the most important alloying elements in 316 stainless steel, which can significantly improve the corrosion resistance of 316 stainless steel. Chromium can combine with oxygen to form a dense chromium oxide protective film, which can prevent corrosive substances from directly contacting the stainless steel matrix, thereby slowing down the corrosion process. Nickel can enhance the strength and toughness of 316 stainless steel, and also help improve the corrosion resistance of 316 stainless steel. Nickel can stabilize the austenite structure, reduce the intergranular corrosion tendency of 316 stainless steel in a corrosive environment, and help improve the corrosion resistance of 316 stainless steel. The microstructure of 316 stainless steel is austenite, and the chromium and nickel elements in austenitic stainless steel can be evenly distributed to form a stable alloy phase, thereby improving the corrosion resistance of stainless steel. Therefore, 316 stainless steel has strong corrosion resistance, which makes 316 stainless steel have strong corrosion resistance in the potion containing micro-etching cylinders. Since the micro-etching grounding conductor 410 is made of 316 stainless steel, the micro-etching grounding conductor 410 has a strong corrosion resistance in the solution contained in the micro-etching tank, that is, the micro-etching grounding conductor 410 has a strong corrosion resistance in the micro-etching tank 220 .

[0076] Furthermore, since the exposed copper wire at one end of the micro-etching grounding conductor 420 has strong corrosion resistance in the solution of the micro-etching tank 220, and the micro-etching grounding conductor 410 has strong corrosion resistance in the micro-etching tank 220, the part of the micro-etching grounding assembly 400 immersed in the micro-etching tank 220 has strong corrosion resistance, thereby extending the service life of the grounding treatment.

[0077] like Figure 4 As shown, in some embodiments, the micro-etching ground conductor 410 is disposed at the bottom of the micro-etching tank 220, that is, the micro-etching ground conductor 410 is immersed in the bottom of the micro-etching tank 220. Further, during the micro-etching process, the micro-etching ground conductor 410 is disposed at the bottom of the micro-etching tank 220.

[0078] like Figure 4As shown, in this embodiment, an ultrasonic vibrator is provided at the bottom of the micro-etching cylinder 220. However, there is a risk of leakage of the ultrasonic vibrator. When the ultrasonic vibrator in the micro-etching cylinder 220 leaks, the micro-etching grounding conductor 410 can absorb the leaked charge in time, and make the leaked charge reach the ground through the micro-etching grounding wire 420 and the floor stand 100 in sequence, thereby timely suppressing the influence of the leakage of the ultrasonic vibrator in the micro-etching cylinder 220 on the micro-etching process, thereby avoiding the influence of the leakage of the ultrasonic vibrator on the micro-etching process.

[0079] In some embodiments, the micro-etching grounding assembly 400 further includes a micro-etching magnetic member, which is connected to the micro-etching grounding conductor 410. The first polymethyl methacrylate cured body 430 also covers the surface connected to the micro-etching magnetic member, and the micro-etching magnetic member is located in the solution of the micro-etching cylinder 220 and is magnetically connected to the activation cylinder 240. Further, during the micro-etching process, the micro-etching magnetic member is disposed in the solution of the micro-etching cylinder 220 and is magnetically connected to the micro-etching cylinder 220, so that the micro-etching grounding conductor 410 is disposed in the solution of the micro-etching cylinder 220.

[0080] In this embodiment, since the micro-etching magnetic attraction member is magnetically connected to the micro-etching cylinder 220, the positions of the micro-etching attraction member and the micro-etching grounding conductor 410 are adjustable. Therefore, in the actual preparation process, the micro-etching attraction member can be adsorbed to the position where the leakage is most concentrated, so that the micro-etching grounding conductor 410 is fixed at the position where the leakage is most concentrated, so that the micro-etching grounding assembly 400 can guide the leakage to the ground more promptly, further reducing the influence of the leakage of the ultrasonic vibrator on the micro-etching process.

[0081] It should be noted that, in theory, the leakage of the micro-etching cylinder 220 is mainly concentrated at the bottom, but in the actual preparation process, the leakage position may sometimes change.

[0082] like Figure 4 As shown, in some embodiments, the copper sinking wire also includes an activation grounding component 500, which includes an activation grounding conductor, an activation grounding wire and a second polymethyl methacrylate solid body. The activation grounding conductor is arranged in the potion of the activation cylinder 240, one end of the activation grounding wire is electrically connected to the activation grounding conductor, and the other end of the activation grounding wire is electrically connected to the floor stand 100. The second polymethyl methacrylate solid body is coated and connected to one end of the activation grounding wire, specifically, the exposed copper wire at one end of the activation grounding wire. Among them, the activation grounding conductor is 316 stainless steel. It can be understood that the second polymethyl methacrylate solid body is an acrylic colloid. Further, the activation cylinder contains an activation liquid, and the activation liquid includes 5% hydrochloric acid.

[0083] like Figure 4As shown, further, during the activation process, an activation grounding conductor is set in the potion in the activation cylinder 240. If leakage occurs, the activation grounding conductor is used to absorb the charge of the potion in the activation cylinder 240, so that the activation grounding conductor is used to guide the charge of the potion in the activation cylinder 240 to the floor stand 100.

[0084] In this embodiment, the second polymethyl methacrylate solidified body has strong chemical stability and is not easy to react with the liquid medicine in the activation cylinder 240. This stability enables the second polymethyl methacrylate solidified body to maintain its performance stability in the liquid medicine containing 5% hydrochloric acid, so that the second polymethyl methacrylate solidified body has strong corrosion resistance in the activation cylinder 240. Since the second polymethyl methacrylate solidified body covers one end of the activated grounding wire, specifically covers the exposed copper wire connected to one end of the activated grounding wire, the second polymethyl methacrylate solidified body can protect the exposed copper wire at one end of the activated grounding wire, thereby making the exposed copper wire at one end of the activated grounding wire have strong corrosion resistance in the liquid medicine in the activation cylinder 240.

[0085] Furthermore, although the second polymethyl methacrylate solid body covers the exposed copper wire connected to one end of the activation grounding conductor, resulting in the exposed copper wire at one end of the activation grounding conductor being unable to be directly electrically connected to the medicine, since the activation grounding conductor is arranged in the medicine in the activation cylinder 240, and the exposed copper wire at one end of the activation grounding conductor, the activation grounding conductor and the floor bracket 100 are electrically connected in sequence, the medicine in the activation cylinder 240 can be grounded through the activation grounding conductor, the activation grounding conductor and the floor bracket 100 in sequence, thereby suppressing the influence of leakage on the activation cylinder 240.

[0086] Furthermore, 316 stainless steel is a type of chromium-nickel austenitic stainless steel, and its alloy composition contains a high proportion of chromium and nickel. Chromium is one of the most important alloying elements in 316 stainless steel, which can significantly improve the corrosion resistance of 316 stainless steel. Chromium can combine with oxygen to form a dense chromium oxide protective film, which can prevent corrosive substances from directly contacting the stainless steel matrix, thereby slowing down the corrosion process. Nickel can enhance the strength and toughness of 316 stainless steel, and also help improve the corrosion resistance of 316 stainless steel. Nickel can stabilize the austenite structure, reduce the intergranular corrosion tendency of 316 stainless steel in a corrosive environment, and help improve the corrosion resistance of 316 stainless steel. The microstructure of 316 stainless steel is austenite, and the chromium and nickel elements in austenitic stainless steel can be evenly distributed to form a stable alloy phase, thereby improving the corrosion resistance of stainless steel. Therefore, 316 stainless steel has strong corrosion resistance, which makes 316 stainless steel have strong corrosion resistance in a potion containing 5% hydrochloric acid. Since the activated ground conductor is made of 316 stainless steel, the activated ground conductor has a stronger corrosion resistance in the solution containing 5% hydrochloric acid, that is, the activated ground conductor has a stronger corrosion resistance in the activation cylinder 240 .

[0087] Furthermore, since the exposed copper wire at one end of the activated grounding conductor has strong corrosion resistance in the solution of the activation cylinder 240, and the activated grounding conductor has strong corrosion resistance in the activation cylinder 240, the portion of the activated grounding assembly 500 immersed in the activation cylinder 240 also has strong corrosion resistance, thereby extending the service life of the grounding treatment.

[0088] like Figure 4 As shown, in some embodiments, the activation ground conductor is disposed at the bottom of the activation cylinder 240, that is, the activation ground conductor is immersed in the activation cylinder 240. Further, during the activation process, the activation ground conductor is disposed at the bottom of the activation cylinder 240, that is, the activation ground conductor is immersed in the activation cylinder 240.

[0089] like Figure 4 As shown, in the present embodiment, an ultrasonic vibrator is provided at the bottom of the activation cylinder 240. However, there is a risk of leakage of the ultrasonic vibrator. When the ultrasonic vibrator in the activation cylinder 240 leaks electricity, the activation grounding conductor can absorb the leaked charge in time, and make the leaked charge reach the ground through the activation grounding wire and the floor bracket 100 in turn, thereby timely suppressing the influence of the leakage of the ultrasonic vibrator in the activation cylinder 240 on the activation process, thereby avoiding the influence of the leakage of the ultrasonic vibrator on the activation process.

[0090] In some of the embodiments, the activation grounding assembly 500 further includes an activation magnetic member, which is connected to the activation grounding conductor, and the second polymethyl methacrylate solidified body is also coated and connected to the surface of the activation magnetic member, and the activation magnetic member is magnetically located in the potion of the activation cylinder 240 and is magnetically connected to the activation cylinder 240. Further, during the activation process, the activation magnetic member is disposed in the potion of the activation cylinder 240 and is magnetically connected to the activation cylinder 240, so that the activation grounding conductor is disposed in the potion of the activation cylinder 240. In this embodiment, since the activation magnetic member is magnetically connected to the activation cylinder 240, the positions of the activation adsorbent and the activation grounding conductor are adjustable, so that during the actual preparation process, the activation adsorbent can be adsorbed to the position where the leakage is most concentrated, so that the activation grounding conductor is fixed at the position where the leakage is most concentrated, so that the activation grounding assembly 500 can guide the leakage to the ground more timely, and further reduce the influence of the leakage of the ultrasonic vibrator on the activation process.

[0091] It should be noted that, in theory, the leakage of the activation cylinder 240 is mainly concentrated at the bottom, but in the actual preparation process, the leakage position may sometimes change.

[0092] like Figure 4 As shown, in some embodiments, the copper deposition line also includes a copper grounding component 600, which includes a copper grounding conductor, a copper grounding wire and a third polymethyl methacrylate solid body. The copper grounding conductor is arranged in the potion of the copper tank, one end of the copper grounding wire is electrically connected to the copper grounding conductor, and the other end of the copper grounding wire is electrically connected to the landing bracket 100, and the third polymethyl methacrylate solid body is coated and connected to one end of the copper grounding wire. Among them, the copper grounding conductor is 316 stainless steel. It can be understood that the third polymethyl methacrylate solid body is an acrylic colloid. Further, the copper tank contains copper liquid, and the copper liquid includes sodium hydroxide.

[0093] like Figure 4 As shown, further, in the copper treatment, the copper grounding conductor is set in the solution of the copper tank. If leakage occurs, the copper grounding conductor is used to absorb the charge of the solution in the copper tank, so that the copper grounding wire is used to guide the charge of the solution in the copper tank to the floor bracket 100.

[0094] In this embodiment, the third polymethyl methacrylate solidified body has strong chemical stability and is not easy to react with the solution in the copper-melting tank. This stability enables the third polymethyl methacrylate solidified body to maintain its performance stability in the solution containing sodium hydroxide, so that the third polymethyl methacrylate solidified body has strong corrosion resistance in the copper-melting tank. Since the third polymethyl methacrylate solidified body covers one end of the copper-melting grounding wire, specifically covers the exposed copper wire connected to one end of the copper-melting grounding wire, the third polymethyl methacrylate solidified body can protect the exposed copper wire at one end of the copper-melting grounding wire, thereby making the exposed copper wire at one end of the copper-melting grounding wire have strong corrosion resistance in the solution of the copper-melting tank.

[0095] Furthermore, although the third polymethyl methacrylate solid body covers the exposed copper wire connected to one end of the copper-plating grounding wire, resulting in the exposed copper wire at one end of the copper-plating grounding wire being unable to be directly electrically connected to the chemical solution, since the copper-plating grounding conductor is arranged in the chemical solution in the copper-plating tank, and the exposed copper wire at one end of the copper-plating grounding conductor, the copper-plating grounding wire and the floor bracket 100 are electrically connected in sequence, the chemical solution in the copper-plating tank can be grounded through the copper-plating grounding conductor, the copper-plating grounding wire and the floor bracket 100 in sequence, thereby suppressing the influence of leakage on the copper-plating tank.

[0096] Furthermore, 316 stainless steel is a type of chromium-nickel austenitic stainless steel, and its alloy composition contains a high proportion of chromium and nickel. Chromium is one of the most important alloying elements in 316 stainless steel, which can significantly improve the corrosion resistance of 316 stainless steel. Chromium can combine with oxygen to form a dense chromium oxide protective film, which can prevent corrosive substances from directly contacting the stainless steel matrix, thereby slowing down the corrosion process. Nickel can enhance the strength and toughness of 316 stainless steel, and also help improve the corrosion resistance of 316 stainless steel. Nickel can stabilize the austenite structure, reduce the intergranular corrosion tendency of 316 stainless steel in a corrosive environment, and help improve the corrosion resistance of 316 stainless steel. The microstructure of 316 stainless steel is austenite, and the chromium and nickel elements in austenitic stainless steel can be evenly distributed to form a stable alloy phase, thereby improving the corrosion resistance of stainless steel. Therefore, 316 stainless steel has strong corrosion resistance, which makes 316 stainless steel have strong corrosion resistance in potions containing sodium hydroxide. Since the copper-plated grounding conductor is made of 316 stainless steel, the copper-plated grounding conductor has strong corrosion resistance in the solution containing sodium hydroxide, that is, the copper-plated grounding conductor has strong corrosion resistance in the copper-plated tank.

[0097] Furthermore, since the exposed copper wire at one end of the copper-plating grounding conductor has strong corrosion resistance in the solution of the copper-plating tank, and the copper-plating grounding conductor has strong corrosion resistance in the copper-plating tank, the part of the copper-plating grounding assembly 600 immersed in the copper-plating tank also has strong corrosion resistance, thereby extending the service life of the grounding treatment.

[0098] It should be noted that the materials of the first polymethyl methacrylate solidified body, the second polymethyl methacrylate solidified body and the third polymethyl methacrylate solidified body are the same or different, and polymethyl methacrylate is a mixture of acrylic powder and metallographic curing agent. The acrylic powder and metallographic curing agent are both purchased conventionally on the market. The acrylic powder and metallographic curing agent in this case are both purchased from SPK Company.

[0099] like Figure 4 As shown, in some embodiments, the copper-plating grounding conductor is arranged at the liquid surface of the copper-plating tank, that is, the copper-plating grounding conductor is immersed in the liquid surface of the copper-plating tank. Further, in the copper-plating process, the copper-plating grounding conductor is arranged at the liquid surface of the copper-plating tank, that is, the copper-plating grounding conductor is immersed in the liquid surface of the copper-plating tank.

[0100] like Figure 4 As shown, in the present embodiment, no ultrasonic vibration device is provided in the copper-plating cylinder, and an oscillating device is installed on the copper-plating rack 300. The oscillating device has the risk of leakage. When the oscillating device leaks, the leakage of the oscillating device will be conducted to the copper-plating rack 300. Since the copper-plating rack 300 first contacts the liquid surface of the copper-plating cylinder during the copper-plating process, the leakage will first be conducted to the liquid surface of the copper-plating cylinder through the copper-plating rack 300. Therefore, the copper-plating grounding conductor is provided at the liquid surface of the copper-plating cylinder, so that the copper-plating grounding conductor absorbs the leaked charge in time during the copper-plating process, and the leaked charge is sequentially transmitted to the ground through the copper-plating grounding wire and the floor stand 100, thereby timely suppressing the influence of the leakage charge in the copper-plating cylinder on the copper-plating process.

[0101] In some of the embodiments, the copper-plating grounding assembly 600 also includes a copper-plating magnetic member, which is connected to the copper-plating grounding conductor, and the third polymethyl methacrylate solidified body is also coated and connected to the surface of the copper-plating magnetic member, and the copper-plating magnetic member is located in the potion of the copper-plating cylinder and is magnetically connected to the copper-plating cylinder. Further, in the copper-plating treatment, the copper-plating magnetic member is set in the potion of the copper-plating cylinder and is magnetically connected to the copper-plating cylinder, so that the copper-plating grounding conductor is set in the copper-plating cylinder. In this embodiment, since the copper-plating magnetic member is magnetically connected to the copper-plating cylinder, the positions of the copper-plating adsorbent and the copper-plating grounding conductor are adjustable. Therefore, in the actual preparation process, the copper-plating adsorbent can be adsorbed to the position where the leakage is most concentrated, so that the copper-plating grounding conductor is fixed at the position where the leakage is most concentrated, so that the copper-plating grounding assembly 600 can guide the leakage to the ground more timely, and further reduce the impact of the leakage on the copper-plating treatment.

[0102] It should be noted that, in theory, the leakage of the copper sinking cylinder 260 is mainly concentrated at the liquid surface, but in the actual preparation process, the leakage position may sometimes change.

[0103] like Figure 4As shown, in some embodiments, the copper sinking wire further includes an oscillating grounding component 700, which includes an oscillating grounding conductor, an oscillating grounding wire and a fourth polymethyl methacrylate solidified body, the oscillating grounding conductor is connected to the copper sinking rack 300, the first end of the oscillating grounding wire is electrically connected to the oscillating grounding conductor, and the second end of the oscillating grounding wire is electrically slidably connected to the landing bracket 100. The fourth polymethyl methacrylate solidified body is coated and connected to one end of the oscillating grounding wire. It can be understood that the fourth polymethyl methacrylate solidified body is an acrylic colloid.

[0104] like Figure 4 As shown, in this embodiment, when the copper sinking rack 300 moves, the copper sinking rack 300 will drive the oscillation grounding assembly 700 to move, so that the second end of the oscillation grounding wire is electrically slidably connected to the floor bracket 100. An oscillation device is installed on the copper sinking rack 300, and there is a risk of leakage in the oscillation device. When the oscillation device leaks electricity, the leakage of the oscillation device will be transmitted to the copper sinking rack 300. At this time, the oscillation grounding conductor absorbs the leaked charge in time, and makes the leaked charge reach the ground through the oscillation grounding wire and the floor bracket 100 in turn, avoiding the influence of the leakage charge of the oscillation device on the metallization process.

[0105] The present disclosure also provides a PCB board, which is prepared by using the PCB hole metallization method based on suppressing leakage influence described in any of the above embodiments.

[0106] In the above-mentioned PCB board, the first polymethyl methacrylate solidified body 430 has strong chemical stability and is not easy to react with the liquid medicine in the micro-etching tank 220. This stability enables the first polymethyl methacrylate solidified body 430 to maintain its performance stability in the liquid medicine in the micro-etching tank, so that the first polymethyl methacrylate solidified body 430 has strong corrosion resistance in the micro-etching tank 220. Since the first polymethyl methacrylate solidified body 430 covers one end connected to the micro-etching grounding wire 420, specifically covers the exposed copper wire connected to one end of the micro-etching grounding wire 420, the first polymethyl methacrylate solidified body 430 can protect the exposed copper wire at one end of the micro-etching grounding wire 420, thereby making the exposed copper wire at one end of the micro-etching grounding wire 420 have strong corrosion resistance in the liquid medicine in the micro-etching tank 220.

[0107] Although the first polymethyl methacrylate cured body 430 covers the exposed copper wire connected to one end of the micro-etching grounding wire 420, resulting in the exposed copper wire at one end of the micro-etching grounding wire 420 being unable to be directly electrically connected to the potion, the micro-etching grounding conductor 410 is disposed in the potion in the micro-etching cylinder 220, and the exposed copper wire at one end of the micro-etching grounding conductor 410, the micro-etching grounding wire 420 and the floor stand 100 are electrically connected in sequence, so that the potion in the micro-etching cylinder 220 can be grounded through the micro-etching grounding conductor 410, the micro-etching grounding wire 420 and the floor stand 100 in sequence, thereby suppressing the influence of leakage on the micro-etching cylinder 220.

[0108] 316 stainless steel is a type of chromium-nickel austenitic stainless steel, and its alloy composition contains a high proportion of chromium and nickel. Chromium is one of the most important alloying elements in 316 stainless steel, which can significantly improve the corrosion resistance of 316 stainless steel. Chromium can combine with oxygen to form a dense chromium oxide protective film, which can prevent corrosive substances from directly contacting the stainless steel matrix, thereby slowing down the corrosion process. Nickel can enhance the strength and toughness of 316 stainless steel, and also help improve the corrosion resistance of 316 stainless steel. Nickel can stabilize the austenite structure, reduce the intergranular corrosion tendency of 316 stainless steel in a corrosive environment, and help improve the corrosion resistance of 316 stainless steel. The microstructure of 316 stainless steel is austenite, and the chromium and nickel elements in austenitic stainless steel can be evenly distributed to form a stable alloy phase, thereby improving the corrosion resistance of stainless steel. Therefore, 316 stainless steel has strong corrosion resistance, which makes 316 stainless steel have strong corrosion resistance in the potion containing micro-etching cylinders. Since the micro-etching grounding conductor 410 is made of 316 stainless steel, the micro-etching grounding conductor 410 has a strong corrosion resistance in the solution contained in the micro-etching tank, that is, the micro-etching grounding conductor 410 has a strong corrosion resistance in the micro-etching tank 220 .

[0109] Since the exposed copper wire at one end of the micro-etching grounding conductor 420 has strong corrosion resistance in the solution of the micro-etching tank 220, and the micro-etching grounding conductor 410 has strong corrosion resistance in the micro-etching tank 220, the part of the micro-etching grounding assembly 400 immersed in the micro-etching tank 220 has strong corrosion resistance, thereby extending the service life of the grounding treatment.

[0110] Compared with the prior art, the present invention has at least the following advantages:

[0111] 1. The first polymethyl methacrylate solidified body 430 has strong chemical stability and is not easy to react with the medicine in the micro-etching tank 220. This stability enables the first polymethyl methacrylate solidified body 430 to maintain its performance stability in the medicine in the micro-etching tank, so that the first polymethyl methacrylate solidified body 430 has strong corrosion resistance in the micro-etching tank 220. Since the first polymethyl methacrylate solidified body 430 covers one end connected to the micro-etching grounding wire 420, specifically covers the exposed copper wire connected to one end of the micro-etching grounding wire 420, the first polymethyl methacrylate solidified body 430 can protect the exposed copper wire at one end of the micro-etching grounding wire 420, thereby making the exposed copper wire at one end of the micro-etching grounding wire 420 have strong corrosion resistance in the medicine in the micro-etching tank 220.

[0112] 2. Although the first polymethyl methacrylate cured body 430 covers the exposed copper wire connected to one end of the micro-etching grounding wire 420, resulting in the exposed copper wire at one end of the micro-etching grounding wire 420 being unable to be directly electrically connected to the potion, the micro-etching grounding conductor 410 is disposed in the potion in the micro-etching cylinder 220, and the exposed copper wire at one end of the micro-etching grounding conductor 410, the micro-etching grounding wire 420 and the floor stand 100 are electrically connected in sequence, so that the potion in the micro-etching cylinder 220 can be grounded through the micro-etching grounding conductor 410, the micro-etching grounding wire 420 and the floor stand 100 in sequence, thereby suppressing the influence of leakage on the micro-etching cylinder 220.

[0113] 3. 316 stainless steel is a type of chromium-nickel austenitic stainless steel, and its alloy composition contains a high proportion of chromium and nickel. Chromium is one of the most important alloying elements in 316 stainless steel, which can significantly improve the corrosion resistance of 316 stainless steel. Chromium can combine with oxygen to form a dense chromium oxide protective film, which can prevent corrosive substances from directly contacting the stainless steel matrix, thereby slowing down the corrosion process. Nickel can enhance the strength and toughness of 316 stainless steel, and also help improve the corrosion resistance of 316 stainless steel. Nickel can stabilize the austenite structure, reduce the intergranular corrosion tendency of 316 stainless steel in a corrosive environment, and help improve the corrosion resistance of 316 stainless steel. The microstructure of 316 stainless steel is austenite, and the chromium and nickel elements in austenitic stainless steel can be evenly distributed to form a stable alloy phase, thereby improving the corrosion resistance of stainless steel. Therefore, 316 stainless steel has strong corrosion resistance, which makes 316 stainless steel have strong corrosion resistance in the potion containing micro-etching cylinders. Since the micro-etching grounding conductor 410 is made of 316 stainless steel, the micro-etching grounding conductor 410 has a strong corrosion resistance in the solution contained in the micro-etching tank, that is, the micro-etching grounding conductor 410 has a strong corrosion resistance in the micro-etching tank 220 .

[0114] 4. Since the exposed copper wire at one end of the micro-etching grounding conductor 420 has strong corrosion resistance in the solution of the micro-etching tank 220, and the micro-etching grounding conductor 410 has strong corrosion resistance in the micro-etching tank 220, the part of the micro-etching grounding assembly 400 immersed in the micro-etching tank 220 has strong corrosion resistance, thereby extending the service life of the grounding treatment.

[0115] The above-mentioned embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the disclosed patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the disclosed patent shall be subject to the attached claims.

Claims

1. A PCB hole metallization method based on suppressing the influence of leakage current, wherein hole metallization treatment is performed by a copper sinking line, wherein the copper sinking line comprises a floor stand, a hole-smoothing cylinder, a micro-etching cylinder, a pre-dip cylinder, an activation cylinder, an acceleration cylinder, a copper sinking cylinder and a copper sinking rack; the hole-smoothing cylinder, the micro-etching cylinder, the pre-dip cylinder, the acceleration cylinder and the copper sinking cylinder are sequentially arranged on the floor stand, and the copper sinking rack is used to immerse the PCB board into the hole-smoothing cylinder, the micro-etching cylinder, the pre-dip cylinder, the acceleration cylinder and the copper sinking cylinder in sequence; characterized in that, The copper-plated wire further includes a micro-etching grounding assembly, which includes a micro-etching grounding conductor, a micro-etching grounding wire and a first polymethyl methacrylate solidified body. The micro-etching grounding conductor is disposed in the potion of the micro-etching tank, one end of the micro-etching grounding wire is electrically connected to the micro-etching grounding conductor, and the other end of the micro-etching grounding wire is electrically connected to the landing bracket, and the first polymethyl methacrylate solidified body is coated and connected to one end of the micro-etching grounding wire; wherein the micro-etching grounding conductor is 316 stainless steel; The PCB hole metallization method based on suppressing the influence of leakage current includes: Whole hole treatment is used to clean the grease on the surface of the PCB board; Micro-etching treatment is used to remove oxides on the copper surface of the PCB board and to erode the copper surface of the PCB board; wherein the micro-etching grounding conductor is arranged in the potion in the micro-etching tank, and if there is leakage, the micro-etching grounding conductor is used to absorb the charge of the potion in the micro-etching tank, so that the micro-etching grounding conductor is used to guide the charge of the potion in the micro-etching tank to the floor bracket; Prepreg treatment, used to form a protective film on the hole wall and surface of the PCB board; Activation treatment is used to make the palladium colloid adhere to the hole wall of the PCB board; Accelerating treatment is used to strip the tin colloid layer on the board surface and in the hole of the PCB board to expose the palladium colloid layer; Copperization treatment is used to form a copper layer on the hole wall of the PCB board.

2. The PCB hole metallization method based on suppressing leakage influence according to claim 1 is characterized in that: The micro-etching grounding conductor is arranged at the bottom of the micro-etching cylinder; In the micro-etching process, the micro-etching ground conductor is disposed at the bottom of the micro-etching tank.

3. The PCB hole metallization method based on suppressing leakage influence according to claim 1 is characterized in that: The micro-etching grounding assembly further includes a micro-etching magnetic attraction component, the micro-etching magnetic attraction component is connected to the micro-etching grounding conductor, the first polymethyl methacrylate solidified body is also coated and connected to the surface of the micro-etching magnetic attraction component, the micro-etching magnetic attraction component is located in the potion of the micro-etching tank and is magnetically connected to the activation tank; In the micro-etching process, the micro-etching magnetic attraction member is placed in the solution of the micro-etching tank and is magnetically connected to the micro-etching tank, so that the micro-etching grounding conductor is placed in the solution of the micro-etching tank.

4. The PCB hole metallization method based on suppressing leakage influence according to claim 1 is characterized in that: The copper sinking wire also includes an activation grounding component, which includes an activation grounding conductor, an activation grounding wire and a second polymethyl methacrylate solidified body. The activation grounding conductor is arranged in the potion of the activation tank, one end of the activation grounding wire is electrically connected to the activation grounding conductor, and the other end of the activation grounding wire is electrically connected to the floor bracket, and the second polymethyl methacrylate solidified body is coated and connected to one end of the activation grounding wire; wherein the activation grounding conductor is 316 stainless steel; During the activation process, the activation grounding conductor is set in the potion in the activation tank. If leakage occurs, the activation grounding conductor is used to absorb the charge of the potion in the activation tank, so that the activation grounding conductor is used to guide the charge of the potion in the activation tank to the floor bracket.

5. The PCB hole metallization method based on suppressing leakage influence according to claim 4 is characterized in that: The activation grounding conductor is disposed at the bottom of the activation cylinder; In the activation process, the activation ground conductor is disposed at the bottom of the activation cylinder.

6. The PCB hole metallization method based on suppressing leakage influence according to claim 4 is characterized in that: The activation grounding assembly further includes an activation magnetic member, the activation magnetic member is connected to the activation grounding conductor, the second polymethyl methacrylate solid body is also coated and connected to the surface of the activation magnetic member, the activation magnetic member is magnetically located in the potion of the activation cylinder and is magnetically connected to the activation cylinder; During the activation process, the activation magnetic element is placed in the potion in the activation tank and magnetically connected to the activation tank, so that the activation ground conductor is placed in the potion in the activation tank.

7. The PCB hole metallization method based on suppressing leakage influence according to claim 1 is characterized in that: The copper-plated wire further includes a copper grounding assembly, which includes a copper grounding conductor, a copper grounding wire and a third polymethyl methacrylate solidified body. The copper grounding conductor is arranged in the potion of the copper tank, one end of the copper grounding wire is electrically connected to the copper grounding conductor, and the other end of the copper grounding wire is electrically connected to the floor bracket, and the third polymethyl methacrylate solidified body is coated and connected to one end of the copper grounding wire; wherein the copper grounding conductor is 316 stainless steel; In the copper-plating treatment, the copper-plating grounding conductor is set in the solution in the copper-plating tank. If leakage occurs, the copper-plating grounding conductor is used to absorb the charge of the solution in the copper-plating tank, so that the copper-plating grounding wire is used to guide the charge of the solution in the copper-plating tank to the floor bracket.

8. The PCB hole metallization method based on suppressing leakage influence according to claim 7 is characterized in that: The copper-plating grounding conductor is arranged at the liquid surface of the copper-plating cylinder; In the copper plating process, the copper plating grounding conductor is arranged at the liquid surface of the copper plating tank.

9. The PCB hole metallization method based on suppressing leakage influence according to claim 7, characterized in that: The copper-plating grounding assembly further includes a copper-plating magnetic attraction piece, which is connected to the copper-plating grounding conductor, and the third polymethyl methacrylate solidified body is also coated and connected to the surface of the copper-plating magnetic attraction piece, and the copper-plating magnetic attraction piece is located in the potion of the copper-plating cylinder and is magnetically connected to the copper-plating cylinder; In the copper treatment, the copper magnetic attraction member is placed in the solution of the copper tank and magnetically connected to the copper tank, so that the copper grounding conductor is placed in the copper tank.

10. A PCB board, characterized in that: The method is prepared by using the PCB hole metallization method based on suppressing the influence of leakage current as described in any one of claims 1 to 9.

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