Automatic control etching system and method for printed circuit board

Abstract

The invention discloses an automatic control etching system and method for a printed circuit board, and relates to the technical field of circuit boards, and the method comprises the following steps: 1, an operator puts a to-be-etched PCB into an etching groove, and inputs target etching parameters through a human-computer interaction interface; 2, the multi-dimensional sensor module continuously monitors key parameters in the etching tank, and data is transmitted to the central controller; 3, according to the data provided by the sensor, the central controller calculates a real-time etching rate by using a nonlinear kinetic model; 4, when the real-time etching rate deviates from the target rate, the system starts an adaptive control algorithm for adjustment; 5, when the system detects that the set etching depth or width reaches a target value, the etching process is automatically stopped, and key data are recorded; and step 6, the system analyzes based on the stored historical data, provides optimal etching parameters and adjustment strategies for different types of PCBs, and displays the data in real time through a human-computer interaction interface module.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and in particular to an automatic control etching system and method for a printed circuit board. Background Art

[0002] With the continuous development of electronic products, circuit boards, as core electronic components, have become increasingly complex in the production of modern circuit boards in the face of customized needs and fierce market competition. However, in the production of printed circuit boards, etching is one of the important processes that determine the quality of circuit graphics. The traditional etching process has the following disadvantages:

[0003] 1. The system etching process relies on manual monitoring and manual adjustment, which not only makes it difficult to ensure the same accuracy of each etching, but is also easily affected by environmental and human factors, resulting in quality deviations and increased costs;

[0004] 2. Existing automated etching equipment often only adjusts a single parameter, while ignoring the control effect of multi-parameter coupling.

[0005] Therefore, in response to the above problems, there is an urgent need for an automated printed circuit board etching system to improve data processing efficiency, ensure data privacy, and achieve more flexible system integration. Summary of the invention

[0006] The object of the present invention is to provide a printed circuit board automated etching control system and method to solve the problems raised in the above background technology.

[0007] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0008] A printed circuit board automated controlled etching system, comprising an etching tank, a multi-dimensional sensor module, a control module, an intelligent actuator module and a human-machine interaction interface module;

[0009] The etching tank is used to hold etching solution and printed circuit boards to be processed, and is equipped with temperature control, concentration adjustment and flow rate control equipment;

[0010] The multi-dimensional sensor module: integrates a temperature sensor, a concentration sensor and a flow rate sensor, and is used to monitor the temperature, concentration and flow rate of the etching solution in real time;

[0011] The control module includes a central controller, which processes sensor data in real time based on an adaptive control algorithm and calculates the etching rate to be adjusted;

[0012] The adaptive feedback adjustment module is used to adjust itself according to the self-comparison between the detected etching rate and the set target rate;

[0013] The cycle control and dynamic optimization: continuously collect data, optimize and adjust the data, form a closed-loop system, and the controller will automatically correct the parameter model to ensure that the etching rate is always in the optimal range;

[0014] The intelligent termination and process recording module: Based on the cycle control and dynamic optimization module, the intelligent termination and process recording module automatically determines the process completion time according to the monitoring data of etching depth and width. After the etching process reaches the set target parameters, the system will automatically stop the actuator, end the etching, and record and store the data;

[0015] The human-machine interaction interface module is based on the data of the intelligent termination and process recording modules, and transmits the data to the human-machine interaction interface module in real time. The human-machine interaction interface module provides an intuitive interface to display the etching process, key parameters and adjustment status in real time, which is convenient for operators to monitor and record.

[0016] A further improvement of the technical solution of the present invention is that: the etching tank is used to hold etching liquid and the printed circuit board to be processed, and the tank is provided with temperature control, concentration adjustment and flow rate control equipment. This stage includes initial setting and parameter loading. The initial setting operator places the printed circuit board (PCB) in the etching tank according to the etching requirements and inputs the initial process parameters through the human-computer interaction interface; the parameter loading: the system initializes the concentration, temperature and flow rate of the etching liquid, and preloads the etching rate target.

[0017] A further improvement of the technical solution of the present invention is that: the multidimensional sensor module: the system starts the multidimensional sensor and performs preliminary calibration. This module collects the temperature, concentration, and flow rate data of the etching liquid in the etching tank every second, and records the time t, and transmits the information to the central controller in the control module for preliminary analysis.

[0018] A further improvement of the technical solution of the present invention is that the control module includes a central controller, and the central controller calculates the etching rate based on the following nonlinear etching rate model:

[0019]

[0020] Wherein: is the rate constant, which is set according to the etching material and liquid environment; is the concentration sensitivity index; is expressed as the reaction activation energy; is expressed as the gas constant; is expressed as the real-time temperature; is expressed as the real-time concentration, and the real-time rate data is calculated. The system transmits the data to the adaptive feedback adjustment module through the central controller in the control module.

[0021] A further improvement of the technical solution of the present invention is that the adaptive feedback adjustment module compares data according to the data transmitted by the control module, and if the current etching rate deviates from the target rate, the adaptive adjustment is started. The specific analysis is as follows:

[0022] When below, the system calculates the temperature increment and increases the etch rate:

[0023]

[0024] When exceeded, the system will reduce the temperature or concentration to slow down the etching rate and prevent over-etching.

[0025] A further improvement of the technical solution of the present invention is that: the cycle control and dynamic optimization module: the system automatically adjusts according to the results of data comparison of the adaptive feedback regulation module, and continuously collects data, calculates the rate and performs adjustments to form real-time closed-loop control. The central controller will also automatically correct the parameter model to adapt it to different process conditions. The cycle process runs continuously to ensure that the etching rate is always in the optimal range.

[0026] A further improvement of the technical solution of the present invention is that the intelligent termination and process recording module includes an intelligent termination unit and a process recording unit. The intelligent termination unit system automatically determines the process completion time based on the monitoring data of the etching depth and width. When the etching process reaches the set target parameters, the system will automatically stop the actuator and end the etching.

[0027] A further improvement of the technical solution of the present invention is that the data recording unit stores all process data, including real-time etching rate, adjustment temperature and concentration change curves, for future optimization and quality control.

[0028] A further improvement of the technical solution of the present invention is that the human-machine interaction interface module provides an intuitive interface to display the etching process, key parameters and adjustment status in real time, which is convenient for operators to monitor and record.

[0029] A further improvement of the technical solution of the present invention is: a method for automatically controlling etching of a printed circuit board, used to implement an automatically controlled etching system for a printed circuit board as described in any one of claims 1 to 9, comprising the following steps:

[0030] Step 1: When the system starts, the operator places the PCB to be etched into the etching tank and inputs the target etching parameters through the human-computer interaction interface;

[0031] Step 2: Once the system is started, the multi-dimensional sensor module will continuously monitor the key parameters in the etching tank. These data will be transmitted to the central controller for real-time analysis and processing;

[0032] Step 3: Based on the data provided by the sensor, the central controller will use the following nonlinear dynamic model to calculate the real-time etching rate. Through the formula, the system can calculate the real-time etching rate and compare it with the target rate;

[0033] Step 4: When the real-time etching rate deviates from the target rate, the system starts the adaptive control algorithm for adjustment. The algorithm calculates the required adjustment value according to the deviation of the etching rate. The adjustment process is cyclical. The system collects data, calculates and adjusts in each cycle to ensure that the etching rate always remains within the target range.

[0034] Step 5: When the system detects that the set etching depth or width reaches the target value, the etching process automatically stops, and the key data of the entire etching process will be stored and recorded by the system for the operator or subsequent process optimization;

[0035] Step 6: The system can also analyze based on the stored historical data and provide the best etching parameters and adjustment strategies for different types of PCB boards, and display the data in real time through the human-computer interaction interface module.

[0036] Due to the adoption of the above technical solution, the present invention has the following technical advances compared with the prior art:

[0037] 1. The present invention provides an innovative automated control etching system and method for printed circuit boards. The system of the present invention utilizes an adaptive algorithm to dynamically adjust the etching rate under different environmental conditions to ensure accurate control of the etching process;

[0038] 2. The present invention provides a printed circuit board automatic control etching system and method, through a closed-loop control system, the etching rate can always be kept within the target range to avoid over-etching or insufficient etching;

[0039] 3. The present invention provides a printed circuit board automated etching control system and method. The system automatically stores data of each etching process, including parameter changes and adjustment processes, to accumulate data support for further process optimization. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0041] Figure 1 A flow chart of a printed circuit board automated etching control system and method according to the present invention; DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] Examples, such as Figure 1 , an automated controlled etching system for a printed circuit board, comprising an etching tank, a multi-dimensional sensor module, a control module, an intelligent actuator module and a human-machine interaction interface module;

[0044] Etching tank: used to hold etching solution and printed circuit boards to be processed. The tank is equipped with temperature control, concentration adjustment and flow rate control equipment;

[0045] Multi-dimensional sensor module: integrated temperature sensor, concentration sensor and flow rate sensor, used to monitor the temperature, concentration and flow rate of etching solution in real time;

[0046] Control module: including a central controller, which processes sensor data in real time based on an adaptive control algorithm and calculates the etching rate that needs to be adjusted;

[0047] Adaptive feedback adjustment module: self-adjusts according to the self-comparison between the detected etching rate and the set target rate;

[0048] Cycle control and dynamic optimization: continuously collect data, optimize and adjust the data, form a closed-loop system, and the controller will automatically correct the parameter model to ensure that the etching rate is always in the optimal range;

[0049] Intelligent termination and process recording module: Based on the cycle control and dynamic optimization module, the intelligent termination and process recording module automatically determines the process completion time according to the monitoring data of etching depth and width. After the etching process reaches the set target parameters, the system will automatically stop the actuator, end the etching, and record and store the data;

[0050] Human-machine interface module: Based on the data of the intelligent termination and process recording modules, the data is transmitted to the human-machine interface module in real time. The human-machine interface module provides an intuitive interface to display the etching process, key parameters and adjustment status in real time, which is convenient for operators to monitor and record.

[0051] Specifically, the etching tank is used to hold the etching solution and the printed circuit board to be processed. The tank is equipped with temperature control, concentration adjustment and flow rate control equipment. This stage includes initial setting and parameter loading. The initial setting operator places the printed circuit board (PCB) in the etching tank according to the etching requirements and inputs the initial process parameters through the human-computer interaction interface; parameter loading: the system initializes the concentration, temperature and flow rate of the etching solution, and pre-loads the etching rate target.

[0052] The operator places the PCB board into the etching tank and sets the target parameters of the etching process through the human-computer interaction interface, including the target etching depth, etching time, initial temperature, initial concentration and flow rate. When the system starts, all sensors are initialized to detect and store the initial state of the etching solution.

[0053] Specifically, multi-dimensional sensor module: the system starts the multi-dimensional sensor and performs preliminary calibration. This module collects the temperature, concentration, and flow rate data of the etching liquid in the etching tank every second, and records the time t, and transmits the information to the central controller in the control module for preliminary analysis.

[0054] Specifically, the control module includes a central controller, which calculates the etching rate based on the following nonlinear etching rate model:

[0055]

[0056] Wherein: is the rate constant, which is set according to the etching material and liquid environment; is the concentration sensitivity index; is expressed as the reaction activation energy; is expressed as the gas constant; is expressed as the real-time temperature; is expressed as the real-time concentration, and the real-time rate data is calculated. The system transmits the data to the adaptive feedback adjustment module through the central controller in the control module.

[0057] The multi-dimensional sensor module is started, collecting temperature, concentration and flow rate data every second, and transmitting the data to the central controller. The controller calculates the etching rate according to the nonlinear formula. The system calculates the etching rate at each moment through the formula and compares it with the target etching rate. If there is a deviation, it proceeds to the next step.

[0058] Specifically, the adaptive feedback adjustment module compares the data according to the data transmitted by the control module. If the current etching rate deviates from the target rate, the adaptive adjustment is started. The specific analysis is as follows:

[0059] When below, the system calculates the temperature increment and concentration to increase the etch rate:

[0060]

[0061] When exceeded, the system will reduce the temperature or concentration to slow down the etching rate and prevent over-etching.

[0062] When the etching rate deviates from the target value, the central controller calculates the adjustment value through an adaptive algorithm. If the etching rate is lower than the target, the system calculates the temperature and concentration that need to be increased, and controls the equipment to heat, stir or replenish the etching solution through the controller module. If the etching rate exceeds the target, the temperature or concentration is lowered to reduce the reactivity of the etching solution. This adjustment process forms a closed-loop feedback until the etching rate stabilizes near the target value.

[0063] Specifically, the cycle control and dynamic optimization module: the system compares the data based on the adaptive feedback regulation module, and automatically adjusts according to the deviation between the etching rate and the target rate. It continuously collects data, calculates the rate and performs adjustments to form a real-time closed-loop control. The central controller will also automatically correct the parameter model to adapt it to different process conditions. The cycle process runs continuously to ensure that the etching rate is always in the optimal range.

[0064] When the system detects that etching is completed, the intelligent actuator automatically stops the operation in the etching tank. The system stores the temperature, concentration, flow rate data and adjustment history of the entire etching process in the process data recording module for subsequent process analysis and optimization.

[0065] Specifically, the intelligent termination and process recording module includes an intelligent termination unit and a process recording unit. The intelligent termination unit system automatically determines the process completion time based on the monitoring data of etching depth and width. When the etching process reaches the set target parameters, the system will automatically stop the actuator and end etching.

[0066] Specifically, the data recording unit stores all process data, including real-time etching rate, adjustment temperature and concentration change curves, for future optimization and quality control.

[0067] The data recording module analyzes the data of each etching, identifies the key factors affecting the etching rate, and provides recommended optimal etching parameters for different types of PCBs. This optimization information can be used to adjust the etching parameter library, thereby achieving intelligent improvements in subsequent processes and improving the efficiency and consistency of the etching process.

[0068] Specifically, the human-machine interaction interface module provides an intuitive interface that displays the etching process, key parameters and adjustment status in real time, making it convenient for operators to monitor and record.

[0069] Specifically, a printed circuit board automated etching control method is used to implement a printed circuit board automated etching control system according to any one of claims 1 to 9, comprising the following steps:

[0070] Step 1: When the system starts, the operator places the PCB to be etched into the etching tank and inputs the target etching parameters through the human-computer interaction interface;

[0071] Step 2: Once the system is started, the multi-dimensional sensor module will continuously monitor the key parameters in the etching tank. These data will be transmitted to the central controller for real-time analysis and processing;

[0072] Step 3: Based on the data provided by the sensor, the central controller will use the following nonlinear dynamic model to calculate the real-time etching rate. Through the formula, the system can calculate the real-time etching rate and compare it with the target rate;

[0073] Step 4: When the real-time etching rate deviates from the target rate, the system starts the adaptive control algorithm for adjustment. The algorithm calculates the required adjustment value according to the deviation of the etching rate. The adjustment process is cyclical. The system collects data, calculates and adjusts in each cycle to ensure that the etching rate always remains within the target range.

[0074] Step 5: When the system detects that the set etching depth or width reaches the target value, the etching process automatically stops, and the key data of the entire etching process will be stored and recorded by the system for the operator or subsequent process optimization;

[0075] Step 6: The system can also analyze based on the stored historical data and provide the best etching parameters and adjustment strategies for different types of PCB boards, and display the data in real time through the human-computer interaction interface module.

[0076] Working principle: The intelligent etching control system achieves precise control of the etching process through closed-loop feedback. The multi-dimensional sensor module monitors the key parameters of the etching solution in real time, including temperature, concentration and flow rate. The central controller uses the sensor data to calculate the current etching rate and compares it with the preset target etching rate. When it is detected that the actual etching rate deviates from the target value, the adaptive algorithm of the central controller is started to calculate the temperature increment and concentration increment that need to be adjusted, and then the control module is used to perform precise temperature adjustment, etching solution replenishment and stirring to restore the etching rate to the target range. During the whole process, the system forms a dynamic closed-loop control in the etching tank to maintain the stability of the etching process and ultimately achieve high-quality etching effects. By combining real-time data acquisition, dynamic adjustment, closed-loop control and adaptive algorithms, the high precision and consistency of the printed circuit board etching process are ensured, which significantly improves production efficiency, reduces manual intervention, and makes the etching quality more stable and reliable.

[0077] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A printed circuit board automated etching system, characterized in that: It includes an etching tank, a multi-dimensional sensor module, a control module, an intelligent actuator module and a human-machine interaction interface module; The etching tank is used to hold etching solution and printed circuit boards to be processed, and is equipped with temperature control, concentration adjustment and flow rate control equipment; The multi-dimensional sensor module: integrates a temperature sensor, a concentration sensor and a flow rate sensor, and is used to monitor the temperature, concentration and flow rate of the etching solution in real time; The control module includes a central controller, which processes sensor data in real time based on an adaptive control algorithm and calculates the etching rate to be adjusted; The adaptive feedback adjustment module is used to adjust itself according to the self-comparison between the detected etching rate and the set target rate; The cycle control and dynamic optimization: continuously collect data, optimize and adjust the data, form a closed-loop system, and the controller will automatically correct the parameter model to ensure that the etching rate is always in the optimal range; The intelligent termination and process recording module: Based on the cycle control and dynamic optimization module, the intelligent termination and process recording module automatically determines the process completion time according to the monitoring data of etching depth and width. After the etching process reaches the set target parameters, the system will automatically stop the actuator, end the etching, and record and store the data; The human-machine interaction interface module is based on the data of the intelligent termination and process recording modules, and transmits the data to the human-machine interaction interface module in real time. The human-machine interaction interface module provides an intuitive interface to display the etching process, key parameters and adjustment status in real time, which is convenient for operators to monitor and record.

2. The printed circuit board automated etching system according to claim 1, characterized in that: The etching tank is used to hold etching solution and printed circuit boards to be processed. The tank is equipped with temperature control, concentration adjustment and flow rate control equipment. This stage includes initial setting and parameter loading. The initial setting operator places the printed circuit board (PCB) in the etching tank according to the etching requirements and inputs the initial process parameters through the human-computer interaction interface; the parameter loading: the system initializes the concentration, temperature and flow rate of the etching solution, and preloads the etching rate target.

3. A printed circuit board automated control etching system according to claim 2, characterized in that: The multi-dimensional sensor module: The system starts the multi-dimensional sensor and performs preliminary calibration. This module collects the temperature, concentration, and flow rate data of the etching liquid in the etching tank every second, and records the time t, and transmits the information to the central controller in the control module for preliminary analysis.

4. The automated controlled etching system for printed circuit boards according to claim 2, characterized in that: The control module includes a central controller, which calculates the etching rate based on the following nonlinear etching rate model: Wherein: is the rate constant, which is set according to the etching material and liquid environment; is the concentration sensitivity index; is expressed as the reaction activation energy; is expressed as the gas constant; is expressed as the real-time temperature; is expressed as the real-time concentration, and the real-time rate data is calculated. The system transmits the data to the adaptive feedback adjustment module through the central controller in the control module.

5. The printed circuit board automated control etching system according to claim 1, characterized in that: The adaptive feedback adjustment module compares the data according to the data transmitted by the control module. If the current etching rate deviates from the target rate, the adaptive adjustment is started. The specific analysis is as follows: When below, the system calculates the temperature increment and increases the etch rate: When exceeded, the system will reduce the temperature or concentration to slow down the etching rate and prevent over-etching.

6. The automated controlled etching system for printed circuit boards according to claim 1, characterized in that: The cycle control and dynamic optimization module: the system automatically adjusts according to the deviation between the etching rate and the target rate based on the data comparison results of the adaptive feedback regulation module, continuously collects data, calculates the rate and performs adjustments to form real-time closed-loop control. The central controller will also automatically correct the parameter model to adapt it to different process conditions. The cycle process runs continuously to ensure that the etching rate is always in the optimal range.

7. The automated controlled etching system for printed circuit boards according to claim 1, characterized in that: The intelligent termination and process recording module includes an intelligent termination unit and a process recording unit. The intelligent termination unit system automatically determines the process completion time based on the monitoring data of etching depth and width. When the etching process reaches the set target parameters, the system will automatically stop the actuator and end the etching.

8. The automated controlled etching system for printed circuit boards according to claim 1, characterized in that: The data recording unit stores all process data, including real-time etching rate, adjustment temperature and concentration change curves, for future optimization and quality control.

9. The automated controlled etching system for printed circuit boards according to claim 1, characterized in that: The human-machine interaction interface module provides an intuitive interface to display the etching process, key parameters and adjustment status in real time, which is convenient for operators to monitor and record.

10. A printed circuit board automated etching control method, used to implement a printed circuit board automated etching control system according to any one of claims 1 to 9, comprising the following steps: Step 1: When the system starts, the operator places the PCB to be etched into the etching tank and inputs the target etching parameters through the human-computer interaction interface; Step 2: Once the system is started, the multi-dimensional sensor module will continuously monitor the key parameters in the etching tank. These data will be transmitted to the central controller for real-time analysis and processing; Step 3: Based on the data provided by the sensor, the central controller will use the following nonlinear dynamic model to calculate the real-time etching rate. Through the formula, the system can calculate the real-time etching rate and compare it with the target rate; Step 4: When the real-time etching rate deviates from the target rate, the system starts the adaptive control algorithm for adjustment. The algorithm calculates the required adjustment value according to the deviation of the etching rate. The adjustment process is cyclical. The system collects data, calculates and adjusts in each cycle to ensure that the etching rate always remains within the target range. Step 5: When the system detects that the set etching depth or width reaches the target value, the etching process automatically stops, and the key data of the entire etching process will be stored and recorded by the system for the operator or subsequent process optimization; Step 6: The system can also analyze based on the stored historical data and provide the best etching parameters and adjustment strategies for different types of PCB boards, and display the data in real time through the human-computer interaction interface module.

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