Refrigerating and heating device
By designing the solid-state ejection material into a plate shape, combined with the clamping design and limiting parts of the inner wall of the sleeve, the problem of cracks in the solid-state ejection material during loading and unloading is solved, extending the service life and improving heat transfer efficiency.
Patent Information
- Application Number
- CN202510078850.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-17
- Publication Date
- 2025-03-21
AI Technical Summary
When the existing solid-state ejection refrigeration and heating devices are loaded and unloaded too many times, the solid-state ejection material is prone to cracks, resulting in material failure, reduced service life, and may lead to material buckling and deformation.
A refrigeration and heating device is designed, in which the solid-state ejection material is arranged in a plate shape. Through the transverse engagement of the inner wall of the sleeve and the solid-state ejection material plate and the design of the limiting member, the axial rotation of the plate-shaped material is restricted, cracks are avoided, and a microflow cavity is formed in the perforation through the plug body to improve heat transfer efficiency.
It effectively avoids the cracks of solid-state ejection material, extends the service life of the material, and improves heat transfer efficiency through optimization of structure and design, and avoids buckling and deformation of the material.
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Figure CN119665476A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of refrigeration and heating, and in particular relates to a refrigeration and heating device. Background Art
[0002] Solid-state spring card cooling and heating is an emerging green and environmentally friendly cooling and heating technology. By loading or unloading solid-state spring card materials, it causes phase change or reverse phase change to generate heat or cold, thereby achieving cooling or heating.
[0003] In a cooling and heating device prepared based on this principle, when the driver therein is loaded with a solid-state spring-loaded material, excessive loading and unloading times may cause cracks in the block of solid-state spring-loaded material, leading to failure of the entire piece of material, reduced service life, and easy buckling and deformation of the material. Summary of the invention
[0004] The embodiment of the present application provides a cooling and heating device, comprising: a driver, a solid-state spring card unit and a pipeline, wherein the solid-state spring card unit comprises: a sleeve and a plurality of solid-state spring card material plates stacked and placed in the sleeve, each of the solid-state spring card material plates comprises a perforation, and a plurality of the perforations are stacked to form a flow cavity;
[0005] The driver loads or unloads the multiple solid spring material plates to cause phase change or reverse phase change to generate heat or cold. The pipeline is connected to the flow cavity, so that the medium in the pipeline passes through the flow cavity for heat exchange to transport the heat or cold to the heating end or the cooling end.
[0006] Furthermore, the inner wall of the sleeve is laterally clamped with the solid spring-locking material plate to limit the axial rotation of the solid spring-locking material plate along the sleeve.
[0007] Furthermore, the sleeve is provided with a limiter to limit the axial rotation of the solid spring material plate along the sleeve.
[0008] Further, the perforations are polygonal, radial or circular;
[0009] Furthermore, the solid-state ejection unit further comprises: a plug body, the plug body being inserted into the flow cavity formed by the perforation, so that a plurality of micro-flow cavities are formed between the plug body and the inner wall of the perforation.
[0010] Furthermore, a partition is provided on the inner wall of the sleeve, and the partition is made of Teflon, POM, nylon, polyester or silicone.
[0011] Furthermore, the driver includes: a power element, a pressure rod and a pressure head, the power element is connected to one end of the pressure rod, and the pressure head is arranged at the other end of the pressure rod. The power element drives the pressure rod to make the pressure head reciprocate in the sleeve to load or unload the multiple solid-state spring material plates.
[0012] Furthermore, the pressure head is made of ceramic, tungsten steel, high-speed steel or alloy steel.
[0013] Furthermore, a sealing ring is provided at one end of the sleeve that contacts the pressure head.
[0014] Furthermore, the thickness of the solid spring card material plate is 0.01-100 mm or 0.1-10 mm; more preferably 0.15-0.3 mm.
[0015] In the embodiment of the present invention, the solid-state spring card material is configured as a plate. During the loading and unloading process, even if a crack appears in one of the solid-state spring card material plates, it will not spread to other solid-state spring card material plates. Moreover, after the plate-shaped solid-state spring card materials are stacked, the buckling deformation of the material can be avoided during the loading process, thereby greatly improving the service life of the solid-state spring card material. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0017] Figure 1 A three-dimensional structural diagram of a refrigeration and heating device provided by the present invention;
[0018] Figure 2 A structural diagram of a refrigeration and heating device provided by the present invention;
[0019] Figure 3 A cross-sectional detail diagram of a solid-state spring card unit in a refrigeration and heating device provided by the present invention. DETAILED DESCRIPTION
[0020] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0021] like Figure 1-Figure 3The present invention provides a cooling and heating device, comprising: a driver 1, a solid-state spring card unit 2 and a pipeline, wherein the solid-state spring card unit comprises: a sleeve 21 and a plurality of solid-state spring card material plates 22 stacked and placed in the sleeve, each of the solid-state spring card material plates comprises a perforation 23, and a plurality of perforations are stacked to form a flow cavity;
[0022] The driver 1 loads or unloads multiple solid spring material plates 22 to cause phase change or reverse phase change to generate heat or cold. The pipeline is connected to the flow cavity, so that the medium in the pipeline undergoes heat exchange through the flow cavity to transport the heat or cold to the heating end or the cooling end.
[0023] In the embodiment of the present invention, the solid-state spring card material is set in a sheet shape. Since each sheet is independently stressed, during the loading and unloading process, even if cracks appear in some solid-state spring card materials, only the solid-state spring card material plate where it is located will fail, and the cracks will not spread to other solid-state spring card material plates, that is, it will not cause the overall failure of the solid-state spring card material to affect the overall work, thereby improving the service life of the solid-state spring card material. In addition, after the sheet-shaped solid-state spring card material is stacked, the damage to the material itself by the loading force will be greatly reduced during the loading process, avoiding the buckling deformation of the material.
[0024] In practical applications, in order to prevent the solid-state spring-card material plates from being misaligned or the perforations from being unable to align to form a smooth flow cavity after being stacked during use, in one embodiment of the present invention, the inner wall of the sleeve is laterally clamped to the solid-state spring-card material plate, that is, the cross-sectional shape of the inner wall of the sleeve and the cross-sectional shape of the solid-state spring-card material plate are designed so that the two are clamped to each other to prevent the solid-state spring-card material plate from rotating along the axial direction of the sleeve. For example, the shape of the inner wall of the sleeve is set to be the same as the shape of the solid-state spring-card material plate and both are non-circular, for example, they can be irregular shapes, polygons, squares, ellipses, triangles, etc., and the two can be clamped to each other, making it difficult for the solid-state spring-card material plate to rotate. In one embodiment of the present invention, the shape of the inner wall of the sleeve and the shape of the solid-state spring-card material plate are preferably hexagonal, such as Figure 3 shown.
[0025] In another embodiment, the cross-sectional shape of the inner wall of the sleeve and the cross-sectional shape of the solid spring-stuck material plate can be designed to be different, but they can be locked with each other. For example, the solid spring-stuck material plate is connected to the inner wall of the sleeve. For example, the inner wall of the sleeve is circular, and the inner angle is an arc, square, polygonal or irregular shape, and the solid spring-stuck material plate is square or polygonal and is connected to the inner wall of the sleeve. As long as the solid spring-stuck material plate is stuck, it will not rotate along the axial direction of the sleeve.
[0026] In another embodiment of the present invention, in order to fix the position of the stacked solid-state spring-cage material plates, the sleeve is provided with a limiter to limit the axial rotation of the solid-state spring-cage material plates along the sleeve. For example, a protrusion is radially provided along the inner wall of the sleeve, and a recess is provided at the edge of the solid-state spring-cage material plate, so that the protrusion of the sleeve extends into the recess of the stacked solid-state spring-cage material plate to limit the position. In another embodiment, the stacked solid-state spring-cage material plates are fixed with a limiter and then fixed with the sleeve, for example, the limiter (rod-shaped object) is inserted into the flow cavity of the stacked solid-state spring-cage material plates, and the rod-shaped object is fixed to the sleeve by a fixing device.
[0027] It should be noted that the pipeline can be connected to the flow cavity by setting a water outlet on the sleeve or the pressure head. The specific position is not limited, and it only needs to be connected to the flow cavity.
[0028] It should be noted that the solid-state card material plate will expand in the lateral direction during the loading process. Therefore, in order to ensure that the solid-state card material plate has enough space when expanding, a gap is left between the solid-state card material plate and the inner wall shape of the sleeve. In some applications, a partition is set on the inner wall of the sleeve, for example, a partition film is brushed or attached to the inner wall of the sleeve. The partition film can be Teflon, POM, nylon, polyester or silicone. On the one hand, the film is soft and can play a role in accommodating and buffering when the solid-state card material plate expands. On the other hand, the film has a heat-insulating effect, which minimizes the heat loss when the medium exchanges heat through the flow cavity. In addition, when the inner wall of the sleeve and the solid-state card material plate are connected by clamping, the partition can also clamp the solid-state card material plate well. In practical applications, Teflon is preferably used. In order to facilitate assembly, the brushing method is adopted. After brushing the Teflon paint on the inner wall of the sleeve, the solid-state card material plate is placed in the tube cavity of the sleeve, which is convenient to operate. The thickness of the solid spring card material plate is 0.01-100 mm or 0.1-10 mm, and more preferably 0.15-0.3 mm.
[0029] In an embodiment of the present invention, a plurality of perforations are provided on the solid spring-loaded material plate. After the solid spring-loaded material plates are stacked, the perforations are aligned to form a flow cavity. In an embodiment in which the solid spring-loaded material plate is connected to the inner wall of the sleeve, the edge of the solid spring-loaded material plate and the inner wall of the sleeve form a second flow cavity. In this embodiment, the shape and number of the perforations are not limited. Preferably, the perforations are polygonal, radial, circular or square. Figure 3 As shown, the solid-state ejection card unit also includes: a plug body, which is inserted into the flow cavity formed by the perforation, so that the plug body is connected to the inner wall of the perforation to form a plurality of micro-flow cavities.
[0030] In practical applications, in order to increase the heat transfer efficiency of the medium, the present embodiment designs the perforation to be polygonal, radial, circular or square, and inserts a plug body therein, so that the plug body and the inner wall of the perforation form a microfluidic cavity, which can greatly increase the flow rate of the medium, reduce the flow resistance, and increase the heat transfer efficiency. On the other hand, since the larger the volume (mass or volume) of the solid spring card material, the more heat or cold it generates, therefore, in order to maximize the absorption of the heat or cold generated by the solid spring card material by the medium, the present embodiment also needs to ensure that the amount of the solid spring card material matches the heat transfer capacity. Under normal circumstances, designing a larger perforation size can ensure that the solid spring card material of the same mass has a larger specific surface area or volume. The present embodiment adopts a design of large-sized perforations and plug bodies, which can reduce the flow resistance and increase the flow rate relative to a large number of small-sized perforations, so that the medium can absorb the heat generated by the solid spring card material to the maximum extent and improve the heat transfer efficiency. In an optional embodiment, the plug body can be used as a limiter to fix the position of the solid spring card material plate and limit its movement and dislocation.
[0031] One embodiment of the present invention, as Figure 2 As shown, the driver 1 includes: a power element 11, a pressure rod 12 and a pressure head 13. The power element 11 is connected to one end of the pressure rod 12, and the pressure head 13 is placed at the other end of the pressure rod 12. The power element 11 drives the pressure rod 12 to make the pressure head 13 reciprocate in the sleeve to load or unload multiple solid-state spring material plates.
[0032] Specifically, the power element may be: a motor, a hydraulic power element, a pneumatic power element, etc.
[0033] In order to increase the strength of the loading, the pressure head can be set to a high-strength ceramic, tungsten steel, high-speed steel or alloy cylinder. In order to ensure that the medium flows in the flow cavity, a sealing ring is set at the end where the pressure head extends into the sleeve, that is, at the end where the sleeve contacts the pressure head, to form a closed flow cavity to prevent medium leakage. Similarly, a sealing ring is also set at the other end of the sleeve. In this embodiment, the pipeline is not shown in the figure. It serves as a container for the flow of the medium and is connected to the heat exchange device of the equipment, so that the medium flows into the heat exchange device and releases heat or cold.
[0034] The above content is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims
1. A cooling and heating device, characterized in that: include: A driver, a solid-state spring card unit and a pipeline, wherein the solid-state spring card unit comprises: a sleeve and a plurality of solid-state spring card material plates stacked and placed in the sleeve, each of the solid-state spring card material plates comprises a perforation, and a plurality of the perforations are stacked to form a flow cavity; The driver loads or unloads the multiple solid spring material plates to cause phase change or reverse phase change to generate heat or cold. The pipeline is connected to the flow cavity, so that the medium in the pipeline passes through the flow cavity for heat exchange to transport the heat or cold to the heating end or the cooling end.
2. The refrigeration and heating device according to claim 1, characterized in that: The inner wall of the sleeve is laterally clamped with the solid spring-stuck material plate to limit the axial rotation of the solid spring-stuck material plate along the sleeve.
3. The refrigeration and heating device according to claim 1, characterized in that: The sleeve is provided with a limit piece to limit the solid spring material plate from rotating along the axial direction of the sleeve.
4. The refrigeration and heating device according to claim 1, characterized in that: The perforations are polygonal, radial, spiral or circular.
5. The refrigeration and heating device according to claim 4, characterized in that: The solid-state ejection unit further comprises: a plug body, which is inserted into the flow cavity formed by the perforation, so that a plurality of micro-flow cavities are formed between the plug body and the inner wall of the perforation.
6. The refrigeration and heating device according to claim 1, characterized in that: The inner wall of the sleeve is also provided with a partition layer, and the partition layer is made of Teflon, POM, nylon, polyester or silicone.
7. The refrigeration and heating device according to claim 1, characterized in that: The driver includes: a power element, a pressure rod and a pressure head, the power element is connected to one end of the pressure rod, and the pressure head is arranged at the other end of the pressure rod. The power element drives the pressure rod to make the pressure head reciprocate in the sleeve to load or unload the multiple solid-state spring material plates.
8. The cooling and heating device according to claim 7, characterized in that: The pressure head is made of ceramic, tungsten steel, high-speed steel or alloy steel.
9. The refrigeration and heating device according to claim 8, characterized in that: A sealing ring is arranged at one end of the sleeve in contact with the pressure head.
10. The refrigeration and heating device according to claim 1, characterized in that: The thickness of the solid spring card material plate is 0.01-100 mm or 0.1-10 mm.
Citation Information
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