Laser processing device, driving control chip and chip preparation method

Abstract

The invention discloses a laser processing device, a driving control chip and a chip preparation method. The chip comprises a packaging chip body, and a driving detection module, a power supply control module, a control chip and a multifunctional interface which adopt the packaging chip body to carry out system-level packaging, the driving detection module is used for executing sampling signal processing and driving control of one or more paths of motors; the power supply control module is used for being connected with a power supply and transmitting at least one stage of output voltage to an electric load of the packaging chip body; the control chip is connected with at least one of the driving detection module, the power supply control module and the multifunctional interface; the multifunctional interface is at least used for transmitting communication signals and analog-to-digital signals. One or more paths of driving detection, power supply, system control and multifunctional interfaces are integrated on a single chip, discrete devices are reduced, the component layout is simplified, the integration level is higher, and the adaptability is higher.

Description

Technical Field

[0001] The present invention relates to the technical field of drive control, and particularly to a laser processing device, a drive control chip and a chip preparation method. Background Art

[0002] A galvanometer is a device for precisely controlling the direction of a light beam and is usually used in laser technology. The galvanometer mainly includes a galvanometer motor (Galvo Motor), a mirror and a drive control system. The drive control system controls the galvanometer motor to drive the mirror to swing rapidly, changing the reflection angle of the laser beam, so as to achieve precise positioning and scanning of the laser beam in a two-dimensional plane.

[0003] Existing galvanometer drive control chips are usually composed of discrete components, with a large number of devices and a complex system, resulting in a large size of the drive board, which is not suitable for being built into miniaturized devices. Moreover, the galvanometer drive detection chip, power supply and system control chip are placed separately (for example, the power supply and drive control chip are set in the laser control box, and the drive detection chip is set in the welding torch). The drive signal of the system control chip needs to be transmitted to the galvanometer motor through a long cable. During the transmission process, it is very easy to be interfered, and the long-distance transmission signal will have attenuation loss, resulting in unstable performance. Due to the size limitation of the existing drive board, usually only a single-channel galvanometer motor drive circuit is designed, and an external control system is required to provide additional power supply and drive signals to work. Or, part of the control (such as the power supply and drive control chip) is set in the laser control box, and another part of the control (such as the drive detection chip) is set in the welding torch, further increasing the complexity of the galvanometer drive system. Summary of the Invention

[0004] The present invention provides a laser processing device, a drive control chip and a chip preparation method to solve the problems that the existing galvanometer drive control chip uses discrete devices, with part of them set in the main laser box and another part set in the welding torch, resulting in a large number of devices, large size, complex structure and easy signal interference.

[0005] According to one aspect of the present invention, a drive control chip is provided, including: a packaged chip body, and a drive detection module, a power control module, a control chip and a multi-functional interface that are system-level packaged using the packaged chip body; the drive detection module is used to perform processing of one or more motor sampling signals and motor drive control; the power control module is used to connect to a power supply and transmit at least one level of output voltage to the electrical load of the packaged chip body through a wiring line; the control chip is connected to at least one of the drive detection module, the power control module and the multi-functional interface through a wiring line; the multi-functional interface is at least used to transmit communication signals and analog-to-digital signals.

[0006] Optionally, the encapsulated chip body is provided with at least two motor sampling interfaces and at least two motor driving interfaces; the driving and detecting module includes: a signal processing module and a motor driving module; the signal processing module includes at least two signal processing circuits, and the motor driving module includes at least two motor driving circuits; the signal processing circuit is connected to the motor sampling interface for acquiring a motor sampling signal of the galvanometer motor; the motor driving circuit is connected to the motor driving interface for amplifying and outputting the driving signal of the galvanometer motor; the signal processing circuit and the motor driving circuit are respectively connected to the control chip, and the control chip is used for controlling the signal processing circuit and the motor driving circuit to work so as to drive the galvanometer motor.

[0007] Optionally, the signal processing circuit includes: an I / V converter for receiving the motor sampling signal and converting the motor sampling signal into a voltage signal; a first inverting amplifier for receiving a power input signal and performing inverting amplification processing on the power input signal; an integrating amplifier for receiving a current input signal and performing integrating amplification processing on the current input signal; a differentiating amplifier for receiving a voltage input signal and performing differentiating amplification processing on the voltage input signal.

[0008] Optionally, the signal processing circuit further includes: an LED driver for receiving a reference voltage and an LED control signal and outputting an LED driving signal according to the reference voltage and the LED control signal.

[0009] Optionally, the motor driving circuit includes: a second inverting amplifier for receiving an initial driving signal of the motor driving circuit, performing inverting amplification processing on the initial driving signal, and outputting a first-stage amplified driving signal; a differential amplifier for receiving two current feedback signals of the motor driving circuit and performing differential amplification processing on the two current feedback signals; a power amplifier for performing power amplification processing on the first-stage amplified driving signal and outputting the galvanometer driving signal.

[0010] Optionally, the bottom of the encapsulated chip body is provided with a ball grid array; the ball grid array is uniformly arranged, or the ball grid array density in the area where the signal processing module is located is greater than the ball grid array density in the area where the motor driving module is located.

[0011] Optionally, the driving control chip further includes: a heat dissipation structure integrally provided with the driving and detecting module.

[0012] According to another aspect of the present invention, there is provided a laser processing device, including: the above-mentioned driving control chip.

[0013] According to another aspect of the present invention, a handheld laser welding device is provided, comprising: a drive control chip, the drive control chip comprising a packaged chip body, and a drive detection module, a power control module, a control chip and a multi-function interface that are system-level packaged using the packaged chip body; the drive detection module is used to perform sampling signal processing and drive control of one or more motors; the power control module is used to connect to a power supply and transmit at least one level of output voltage to the power load of the packaged chip body; the control chip is connected to at least one of the drive detection module, the power control module and the multi-function interface; the multi-function interface is used to transmit at least communication signals and analog-to-digital signals; a welding gun, in which the drive control chip is arranged.

[0014] According to another aspect of the present invention, a method for preparing a drive control chip is provided, comprising: performing system-level chip packaging on a drive detection module, a power control module, a control chip, and a multi-function interface to form a drive control chip.

[0015] The technical solution of the embodiment of the present invention is to provide a packaged chip body and use system-level packaging to integrate the drive detection module, power control module, control chip and multi-function interface on a single packaged chip, which solves the problem that the existing drive control chip uses discrete devices, resulting in a large number of devices, large size, complex structure, unstable performance, and susceptibility to interference of signals; the system-level packaging chip can be directly built into the welding machine gun head, so that the drive signal can be directly transmitted to the motor without the need for an external drive board and motor connection wires, which can optimize space, increase integration, increase adaptability, and reduce costs. At the same time, it avoids the use of long cables to transmit drive signals, which leads to susceptibility to interference and instability during signal transmission, and reduces the attenuation loss caused by long-distance transmission signals. By integrating the drive detection module, power supply, control and multi-function interface in a single system-level packaging chip, the chip size and system complexity can be reduced, multi-function integration and miniaturization can be achieved, the chip integration can be improved, the component layout can be simplified, the structure and function of the traditional discrete device system can be optimized, and it is convenient for direct application in different products.

[0016] The drive detection module adopts two-way drive control and detection circuits, which can control the operation of two motors at the same time, and can also control one motor to realize the movement in two axis directions (X-axis direction and Y-axis direction). It solves the problem that traditional discrete devices cannot support the conversion function between one-dimensional motor control and two-dimensional motor control, simplifies the operation process, improves flexibility, and can meet different application scenarios according to application requirements.

[0017] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. Brief Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0019] Figure 1 Schematic structural diagram of a drive control chip provided by an embodiment of the present invention;

[0020] Figure 2 Schematic diagram of module splitting of a drive control chip provided by an embodiment of the present invention;

[0021] Figure 3 Schematic circuit diagram of a drive detection module provided by an embodiment of the present invention;

[0022] Figure 4 Schematic bottom surface structure diagram of a packaged chip body provided by an embodiment of the present invention;

[0023] Figure 5 Schematic structural diagram of a laser processing device provided by an embodiment of the present invention;

[0024] Figure 6 Stereoscopic schematic diagram of a handheld laser welding device provided by an embodiment of the present invention. Detailed Embodiments

[0025] In order to enable those skilled in the art to better understand the solutions of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present invention.

[0026] It should be noted that the terms "first", "second", etc. in the description, claims and the above drawings of the present invention are used to distinguish similar objects, and do not necessarily describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present invention described here can be implemented in an order other than those illustrated or described here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily limit to those clearly listed steps or units, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0027] Figure 1 The figure is a schematic structural diagram of a drive control chip provided by an embodiment of the present invention. This embodiment is applicable to the drive control of a one-dimensional galvanometer or a multi-dimensional galvanometer, and is also applicable to the drive control of other motors similar to a galvanometer motor.

[0028] As Figure 1 shown, the drive control chip 1 of the present application includes: a packaged chip body 100, and a drive detection module 200, a power control module 103, a control chip 104, and a multi-functional interface 105 that are system-level packaged using the packaged chip body 100. Among them, the packaged chip body 100 is prepared by a system-in-a-package (SIP) process. The galvanometer drive detection module 200 can realize the drive control and detection functions of a one-dimensional or two-dimensional galvanometer motor. The drive detection module 200, the power control module 103, the control chip 104, and the multi-functional interface 105 are integrated on a printed circuit board inside the packaged chip body 100.

[0029] The drive detection module 200 is used to perform sampling signal processing and drive control for one or more motors. In this embodiment, the drive detection module 200 can be used to realize the sampling and drive control of one galvanometer motor, or, simultaneously realize the sampling and drive control of two galvanometer motors, or, control one galvanometer motor to swing in two axial directions (X-axis direction and Y-axis direction).

[0030] The power control module 103 is used to connect to an external power supply and transmit at least one level of output voltage to the electrical loads within the encapsulated chip body 100 via a wiring circuit. Specifically, the power control module 103 can receive a supply voltage (such as a DC +12V voltage) from the external power supply to supply power to the SIP chip. The power control module 103 also transmits the supply voltage (such as a DC +12V voltage) provided by the external power supply to the drive detection module 200 via a wiring circuit to supply power to the drive detection module 200. The power control module 103 is also integrated with a buck-boost conversion circuit that can convert the supply voltage (such as a DC +12V voltage) provided by the external power supply into voltages of other voltage levels (including but not limited to: DC +5V or DC +3.3V) to supply power to the control chip 104.

[0031] The control chip 104 is connected to at least one of the drive detection module 200, the power control module 103, and the multifunctional interface 105. In this embodiment, the control chip 104 is used to control the drive detection module 200 to perform signal processing and motor drive, and is also used to feedback power signals, and control signals such as the temperature sensor of the welding head, the LED lamp, and the switch.

[0032] The multifunctional interface 105 is at least used to transmit communication signals and analog-to-digital signals, and can also be used to transmit other control signals. For example, this interface can directly access other control signals without passing through the control chip module to control the chip signal processing module 210 and the motor drive module 220. In this embodiment, the multifunctional interface 105 includes but is not limited to: a communication interface and a digital-to-analog conversion interface (i.e., a DAC interface).

[0033] Specifically, when using a drive control chip to control a two-dimensional galvanometer, designers can input control instructions through the digital-to-analog conversion interface (i.e., the DAC interface), or issue control instructions to the control chip 104 through a host computer, or directly provide an analog signal to the drive control chip. When performing system-in-package, those skilled in the art can select the package devices (such as the galvanometer drive detection module, the power control module, the control chip, and the multifunctional interface) based on changes in the application scenario, and adaptively adjust the layout positions and wiring paths of the devices. By designing different chip configurations and layout schemes, the performance and cost requirements of different application scenarios can be met. By integrating a galvanometer drive detection module, a power supply, a control chip, and a multifunctional interface in a single SIP chip, supporting digital and analog signal control of a two-dimensional galvanometer, the usage scenarios of the chip can be extended and the chip integration level can be improved.

[0034] Figure 2 It is a schematic diagram of the module splitting of a drive control chip provided by an embodiment of the present invention. Refer to Figure 2As shown, the encapsulated chip body 100 is provided with at least two motor sampling interfaces (IN1 and IN2) and at least two motor driving interfaces (DRV1 and DRV2). Among them, the motor sampling interfaces (IN1 and IN2) are used to receive motor sampling signals of the galvanometer motor, such as current sampling signals, voltage sampling signals, and power sampling signals; the motor driving interfaces (DRV1 and DRV2) are used to output galvanometer driving signals to the galvanometer motor 2.

[0035] See Figure 2 As shown, the drive detection module 200 includes: a signal processing module 210 and a motor drive module 220. In this embodiment, the signal processing module 210 can be understood as a signal processing module established by integrating multiple different types of operational amplifier circuit structures. This signal processing module 210 can implement the conversion and amplification processing of different types of signals (such as current signals, voltage signals, and power signals). The motor drive module 220 can be understood as a circuit structure that amplifies a control signal into a high-power signal capable of driving a motor. In some embodiments, the signal processing module 210 can form two signal processing circuits by using two parallel devices, or form two signal processing circuits by using a device with parallel channels (including but not limited to a dual-channel operational amplifier). Similarly, the motor drive module 220 can form two motor drive circuits by using two parallel devices, or form two motor drive circuits by using a device with parallel channels (including but not limited to a dual-channel power amplifier).

[0036] See Figure 2 As shown, the signal processing module 210 is provided with at least two signal processing circuits, such as a first signal processing circuit 201 and a second signal processing circuit 202. The first signal processing circuit 201 is connected to the first motor sampling interface IN1, and the second signal processing circuit 202 is connected to the second motor sampling interface IN2, and is used to obtain sampling signals of two motors, or obtain sampling signals of a motor in two axial directions (X-axis direction and Y-axis direction); the motor drive module 220 is provided with at least two motor drive circuits, such as a first motor drive circuit 203 and a second motor drive circuit 204. The first motor drive circuit 203 is connected to the first motor drive interface DRV1, and the second motor drive circuit 204 is connected to the second motor drive interface DRV2, and is used to amplify and output the galvanometer drive signals of two galvanometer motors, or amplify and output the galvanometer drive signals of a motor in two axial directions (X-axis direction and Y-axis direction).

[0037] In this embodiment, when the drive control chip 1 is applied to a two-dimensional galvanometer drive control system, the first motor sampling interface IN1 receives the motor sampling signal of the first galvanometer motor (or the X / Y axis direction of the galvanometer motor), and the second motor sampling interface IN2 receives the motor sampling signal of the second galvanometer motor (or the Y / X axis direction of the galvanometer motor). The first motor drive interface DRV1 outputs a galvanometer drive signal to the first galvanometer motor (or the X / Y axis direction of the galvanometer motor), and the second motor drive interface DRV2 outputs a galvanometer drive signal to the second galvanometer motor (or the Y / X axis direction of the galvanometer motor). The first signal processing circuit 201 and the second signal processing circuit 202 work synchronously, and the first motor drive circuit 203 and the second motor drive circuit 204 work synchronously to achieve two-dimensional galvanometer drive control. When the galvanometer drive control chip 1 is applied to a one-dimensional galvanometer drive control system, any one of the motor sampling interfaces (IN1 or IN2) is used to receive the motor sampling signal of the galvanometer motor, and the corresponding motor drive interface (DRV1 or DRV2) outputs a galvanometer drive signal to the galvanometer motor. Under the coordinated action of the signal processing circuit (such as the first signal processing circuit 201 or the second signal processing circuit 202) and the motor drive circuit (such as the first motor drive circuit 203 or the second motor drive circuit 204), one-dimensional galvanometer drive control is achieved.

[0038] Specifically, the two-dimensional galvanometer drive detection module is integrally packaged through system-level packaging technology, significantly reducing the chip size, facilitating miniaturization design, and improving design flexibility. When the chip is applied to a two-dimensional galvanometer drive control system, only a small number of resistors, capacitors, inductors and interfaces for connecting the power supply and the motor need to be added externally to complete the design of an independent two-dimensional galvanometer drive system, reducing the number of components, lowering the complexity of the solution, and having a high chip integration level. By adding a motor interface to the chip, the drive signal can be directly transmitted to the galvanometer motor without long-distance cable connection, eliminating the interference and long-distance loss problems in signal transmission and improving the stability of signal transmission.

[0039] Optionally, the length dimension of the packaged chip body 100 is less than or equal to 15 millimeters, and the width dimension of the packaged chip body 100 is less than or equal to 15 millimeters.

[0040] Exemplarily, if the encapsulated chip body 100 integrally packages the two-dimensional galvanometer driving and detecting module 200, the control chip 104, the power control module 103, and the multi-functional interface 105, the size of the encapsulated chip body 100 can be made 15 mm × 15 mm; if the encapsulated chip body 100 integrally packages the two-dimensional galvanometer driving and detecting module 200, the power control module 103, and the multi-functional interface 105, the size of the encapsulated chip body 100 can be made 10 mm × 10 mm. When performing system-level packaging, those skilled in the art can select the packaging device based on the change of the application scenario, and adaptively adjust the layout position and routing path of the device. By designing different chip configurations and layout schemes, the performance and cost requirements of different application scenarios can be met.

[0041] Figure 3 It is a schematic circuit diagram of a driving and detecting module provided by an embodiment of the present invention. Refer to Figure 2 and Figure 3 As shown, the signal processing module 210 of the present application includes: an I / V converter 211 for receiving a motor sampling signal and converting the motor sampling signal into a voltage signal; a first inverting amplifier 212 for receiving a power input signal P in , performing inverting amplification processing on the power input signal P in and outputting a power amplified signal P out ; an integrating amplifier 213 for receiving a current input signal I in , performing integrating amplification processing on the current input signal and outputting a current amplified signal I out ; a differentiating amplifier 214 for receiving a voltage input signal D in , performing differentiating amplification processing on the voltage input signal D in and outputting a current amplified signal D out . It should be noted that the encapsulated chip body 100 of the present application is also provided with a plurality of input / output interfaces, and the connection between each device (such as the I / V converter 211, the first inverting amplifier 212, the integrating amplifier 213, and the differentiating amplifier 214) and the input / output interfaces is realized through external wiring or printed circuit board routing.

[0042] Refer to Figure 3 As shown, the I / V converter 211 is provided with two input pins (in1 and in2) and three output pins (OUT1, OUT2, and OUT1-2). The first input pin in1 is connected to the first motor sampling interface IN1, the second input pin in2 is connected to the second motor sampling interface IN2, and the three output pins are used to output a differential voltage signal. By connecting resistive, capacitive, and inductive elements to the output pins, an adjustment circuit for the galvanometer motor is formed, which is convenient for closed-loop adjustment of the motor sampling signal (such as motor current).

[0043] Refer toFigure 2 and Figure 3 As shown, the signal processing module 210 of the present application further includes: an LED driver 215, configured to receive a reference voltage VBASE and an LED control signal Sig-IN, and output an LED drive signal DRV_LED according to the reference voltage VBASE and the LED control signal Sig-IN.

[0044] Referring to Figure 2 and Figure 3 As shown, the motor drive module 220 of the present application includes: a second inverting amplifier 221, configured to receive an initial drive signal DRV of the motor drive circuit in , invert and amplify the initial drive signal DRV in , and output a first-stage amplified drive signal DRV out ; a differential amplifier 222, configured to receive two current feedback signals of the motor drive circuit (such as a first current feedback signal Isense_P and a second current feedback signal Isense_N), and perform differential amplification processing on the two current feedback signals (such as the first current feedback signal Isense_P and the second current feedback signal Isense_N), and output a differential amplified signal; a power amplifier 223, configured to perform power amplification processing on the first-stage amplified drive signal DRV out , and output a galvanometer drive signal.

[0045] Specifically, when applying the galvanometer drive control chip 1 to a two-dimensional galvanometer drive control system, a dual-channel power amplifier 223 can be used, and two second inverting amplifiers 221 are provided. One second inverting amplifier 221 is used to invert and amplify the first initial drive signal, and the other second inverting amplifier 221 is used to invert and amplify the second initial drive signal. After power amplification processing by the dual-channel power amplifier 223, a galvanometer drive signal is output to the first galvanometer motor through the first motor drive interface DRV1, and a galvanometer drive signal is output to the second galvanometer motor through the second motor drive interface DRV2, realizing two-dimensional galvanometer drive control.

[0046] It should be noted that, in this embodiment, the I / V converter 211, the first inverting amplifier 212, the integrator 213, the differentiator 214, the LED driver 215, the second inverting amplifier 221, the differential amplifier 222, and the power amplifier 223 can adopt packaged devices, and their specific models are not limited. If the devices in the signal processing circuit support dual-channel transmission, the two signal processing circuits can be integrated; if the devices in the motor drive circuit support dual-channel transmission, the two motor drive circuits can be integrated.

[0047] Figure 4Schematic diagram of the bottom surface structure of the encapsulated chip body provided by an embodiment of the present invention. Refer to Figure 4 As shown, a ball grid array 101 is provided at the bottom of the encapsulated chip body 100; the ball grid array 101 is uniformly arranged, or the ball grid array density in the area where the motor drive module 220 is located is less than the ball grid array density in the area where the signal processing module 210 is located.

[0048] Specifically, parameters such as the solder ball distribution, solder ball diameter, solder ball pitch, and solder ball quantity of the ball grid array 101 can be adaptively adjusted according to the chip pin function, signal type, and package size. Preferably, when applying the drive control chip of the present application to a two-dimensional galvanometer drive control scenario, the center distance between adjacent two solder balls can be set to any value greater than or equal to 1.0 mm and less than or equal to 1.2 mm; the solder ball diameter can be set to any value greater than or equal to 0.5 mm and less than or equal to 0.6 mm. Since the galvanometer drive signal output by the motor drive module 220 is usually a high-frequency signal, by reducing the ball grid array density in the area where the motor drive module 220 is located, signal crosstalk is reduced; by increasing the ball grid array density in the area where the signal processing module 210 is located, the signal path is shortened, signal delay and loss are reduced, and signal integrity is improved.

[0049] See Figure 2 As shown, the drive control chip of the present application further includes: a heat dissipation structure 107. Among them, the heat dissipation structure 107 is integrally arranged with the heat-generating components in the chip. In this embodiment, the heat-generating components are mainly the motor drive module 220. In this embodiment, the high-frequency signal includes but is not limited to the galvanometer drive signal output by the motor drive module 220.

[0050] Optionally, the heat dissipation structure 107 includes but is not limited to at least one of the following: a heat conduction medium prepared from a high thermal conductivity material (such as copper or aluminum) and a porous structure provided on the package housing.

[0051] Thus, the technical solution of the present application improves the loss caused by chip heating by adding a heat dissipation structure, which is beneficial to extending the reliability and service life of the chip.

[0052] In some embodiments, during the printed circuit board design process of the drive control chip, the routing paths between different components (including but not limited to: drive detection module, power control module, control chip, and multi-functional interface) meet the signal shielding requirements to ensure that signal transmission is not interfered, and improve signal transmission quality and product reliability.

[0053] Based on the above embodiments, an embodiment of the present invention further provides a laser processing device, which has the corresponding structure and beneficial effects of the drive control chip provided by the above embodiments, and the same parts will not be described in detail.

[0054] Figure 5 Schematic diagram of the structure of a laser processing device provided by an embodiment of the present invention.

[0055] See Figure 5 As shown, the laser processing device 3 of the present application includes: the above-mentioned drive control chip 1. In some embodiments, the drive control chip 1 can be connected to one or two galvanometer motors 2, and is used to obtain the motor sampling signal of the galvanometer motor 2 and output a galvanometer drive signal to the galvanometer motor 2.

[0056] In some embodiments, the drive control chip 1 can be arranged inside the welding torch of the laser processing device 3.

[0057] In the present application, the application scenarios of the laser processing device include but are not limited to: laser scanning, laser marking, laser display, laser measurement, high-precision laser processing, optical measurement and detection systems, and medical laser devices.

[0058] Based on the same inventive concept as the above embodiments, the embodiment of the present invention also provides a method for preparing a galvanometer drive control chip, which can execute the corresponding preparation process of the galvanometer drive control chip.

[0059] The method for preparing the galvanometer drive control chip of the present application includes: performing system-level chip packaging on the drive detection module, power control module, control chip, and multifunctional interface to form a drive control chip.

[0060] Therefore, in the technical solution of the present application, when designing the drive control chip, based on the differences in application scenarios, only the two-dimensional drive and detection circuits can be retained in a single SIP chip, or the drive detection module, power supply, control chip, and multifunctional interface can be integrated in a single SIP chip. Only a small amount of resistors, capacitors, inductors, and interfaces for connecting the power supply and the motor are required to complete the design of an independent two-dimensional galvanometer drive system, and it supports digital and analog signal control of the two-dimensional galvanometer. It can expand the chip usage scenarios, improve the chip integration level, facilitate direct application in different products, and shorten the product R & D cycle; by integrating the drive detection module, power supply, control, and multifunctional interface in a single system-level packaged chip, the chip size and system complexity can be reduced, realizing multifunctional integration and miniaturization, improving the stability of signal transmission, increasing the chip integration level, reducing discrete devices, simplifying the component layout, and optimizing the structure and function of the traditional discrete device system; the system-level packaged chip can be completely placed inside the welding torch, enabling the drive signal to be directly transmitted to the motor without external drive boards and motor connection wires, which can optimize the space, have a higher integration level, higher adaptability, lower costs, and at the same time avoid the problem that the drive signal is easily interfered and unstable during transmission when using long cable wires to transmit the drive signal, and there will be attenuation loss in long-distance signal transmission.

[0061] Figure 6A three-dimensional schematic diagram of a handheld laser welding device provided by an embodiment of the present invention. Refer to Figure 6 As shown, the handheld laser welding device 4 of the present application includes: a drive control chip 1, a welding torch 5, and a control box 6. The drive control chip 1 includes a packaged chip body, and a drive detection module, a power control module, a control chip, and a multifunctional interface that are system-level packaged using the packaged chip body. The drive detection module is used to perform sampling signal processing and drive control of one or more motors; the power control module is used to connect to an external power source and transmit at least one level of output voltage to the power-consuming load of the packaged chip body; the control chip is connected to at least one of the drive detection module, the power control module, and the multifunctional interface; the multifunctional interface is at least used to transmit communication signals and analog-digital signals; the drive control chip 1 is disposed in the welding torch 5.

[0062] Thus, the technical solution of the present application integrates the drive detection module, the power control module, the control chip, and the multifunctional interface into a single packaged chip by using system-level packaging to form a drive control chip, solving the problem that the existing galvanometer drive board uses discrete devices, with the galvanometer drive detection chip disposed in the welding torch and the power supply and system control chip disposed in the laser control box. The drive signal of the system control chip needs to be transmitted to the galvanometer motor through a long cable, which is easily interfered during the transmission process, and there will be attenuation loss in the long-distance transmission of signals, resulting in unstable performance. This facilitates the direct application of the drive control chip in miniaturized scenarios such as handheld laser welding devices.

[0063] It should be understood that various forms of the processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in the present invention can be executed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved, and no limitations are imposed herein.

[0064] The above specific embodiments do not constitute a limitation to the protection scope of the present invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. A driving control chip, characterized in that, Comprising: An encapsulated chip body, and a drive detection module, a power control module, a control chip, and a multi-functional interface that perform system-level packaging using the encapsulated chip body; The drive detection module is used to perform sampling signal processing and drive control for one or more motors; The power control module is used to connect to a power source and transmit at least one level of output voltage to the electrical load of the encapsulated chip body; The control chip is connected to at least one of the drive detection module, the power control module, and the multi-functional interface; The multi-functional interface is at least used to transmit communication signals and analog-to-digital signals.

2. The drive control chip according to claim 1, wherein The encapsulated chip body is provided with at least two motor sampling interfaces and at least two motor drive interfaces; The drive detection module includes: a signal processing module and a motor drive module; The signal processing module includes at least two signal processing circuits, and the motor drive module includes at least two motor drive circuits; The signal processing circuit is connected to the motor sampling interface and is used to obtain the motor sampling signal of the galvanometer motor; The motor drive circuit is connected to the motor drive interface and is used to amplify and output the galvanometer drive signal of the galvanometer motor; The signal processing circuit and the motor drive circuit are respectively connected to the control chip, and the control chip is used to control the signal processing circuit and the motor drive circuit to work to drive the galvanometer motor.

3. The drive control chip according to claim 2, wherein The signal processing module includes: An I / V converter, which is used to receive the motor sampling signal and convert the motor sampling signal into a voltage signal; A first inverting amplifier, which is used to receive a power input signal and perform inverting amplification processing on the power input signal; An integrating amplifier, which is used to receive a current input signal and perform integrating amplification processing on the current input signal; A differentiating amplifier, which is used to receive a voltage input signal and perform differentiating amplification processing on the voltage input signal.

4. The drive control chip according to claim 2, wherein The signal processing module further includes: an LED driver, which is used to receive a reference voltage and an LED control signal and output an LED drive signal according to the reference voltage and the LED control signal.

5. The drive control chip according to claim 2, characterized in that, The motor drive module includes: A second inverting amplifier, which is used to receive the initial drive signal of the motor drive circuit, perform inverting amplification processing on the initial drive signal, and output a first-stage amplified drive signal; A differential amplifier, which is used to receive two current feedback signals of the motor drive circuit and perform differential amplification processing on the two current feedback signals; A power amplifier, which is used to perform power amplification processing on the first-stage amplified drive signal and output the galvanometer drive signal.

6. The drive control chip according to claim 2, characterized in that The bottom of the encapsulated chip body is provided with a ball grid array; The ball grid array is uniformly arranged, or the density of the ball grid array in the area where the signal processing module is located is greater than the density of the ball grid array in the area where the motor drive module is located.

7. The drive control chip according to any one of claims 1-6, characterized in that, It further includes: A heat dissipation structure, which is integrally arranged with the drive detection module.

8. A laser processing device, characterized in that, Comprising: The drive control chip according to any one of claims 1-7.

9. A handheld laser welding device, characterized in that, Comprising: A drive control chip, the drive control chip comprising a packaged chip body, and a drive detection module, a power control module, a control chip, and a multi-functional interface that are system-level packaged using the packaged chip body; The drive detection module is used to perform sampling signal processing and drive control for one or more motors; The power control module is used to connect to a power source and transmit at least one level of output voltage to the electrical loads of the packaged chip body; The control chip is connected to at least one of the drive detection module, the power control module, and the multi-functional interface; The multi-functional interface is at least used to transmit communication signals and analog-to-digital signals; A welding torch, the drive control chip is disposed in the welding torch.

10. A method for preparing a drive control chip, characterized in that, Comprising: Performing system-level chip packaging on the drive detection module, the power control module, the control chip, and the multi-functional interface to form a drive control chip.

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