Component mounting device

Abstract

The component mounting apparatus includes: a control unit that controls a first work unit and a second work unit in a plurality of operation modes including a cooperative mode in which the first work unit and the second work unit perform component mounting work on a substrate of a first substrate transfer path or a second substrate transfer path together, and an independent mode in which the first work unit and the second work unit perform component mounting work on the substrate of the first substrate transfer path or the second substrate transfer path together; enabling the first working part to carry out component carrying work on the substrate of the first substrate conveying channel, and enabling the second working part to carry out component carrying work on the substrate of the second substrate conveying channel; and a control parameter setting unit capable of setting a control parameter for the first working unit and a control parameter for the second working unit, respectively. The control unit operates the first working unit and the second working unit using the control parameters set by the control parameter setting unit to perform component mounting work.

Description

Technical Field

[0001] The present invention relates to a component mounting device for mounting a component on a substrate. Background Art

[0002] A component loading device for producing mounting substrates includes a substrate conveying channel for conveying substrates and an operating section for loading components onto the substrates by moving an operating head that holds the components via an operating head moving mechanism. Furthermore, with respect to mounting substrates, the required accuracy for loading components varies depending on the size of the components or the conditions around the mounting position. When high accuracy is required, the component loading device controls the operating section by, for example, slowing the moving speed of the operating head to ensure the required loading accuracy. The component loading device disclosed in Patent Document 1 has multiple operating modes with different accuracy levels, and by changing the operating mode according to a sequence for which the required accuracy is set for each mounting order, the required loading accuracy for each mounting position is ensured.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2022-65172 Summary of the Invention

[0006] However, in the prior art including Patent Document 1, although components can be loaded with appropriate required accuracy at each loading position of the substrate, there is no disclosure of control in the case where multiple substrates with different required accuracy are loaded simultaneously in a component loading device having multiple substrate conveying channels and multiple working units and performing loading operations on multiple substrates in parallel. In order to appropriately perform component loading operations on multiple substrates with different required accuracy in a component loading device having multiple substrate conveying channels and multiple working units, there is still room for further improvement.

[0007] Therefore, an object of the present invention is to provide a component mounting apparatus capable of appropriately and in parallel performing component mounting operations on a plurality of substrates requiring different levels of precision.

[0008] 18. The component loading device of the present invention comprises: a first substrate conveying path for conveying substrates along an axis extending in a horizontal direction; a second substrate conveying path arranged at a position separated from the first substrate conveying path in a direction along another axis and conveying substrates along the one axis, the other axis being orthogonal to the one axis in a horizontal plane; a first component supply section arranged at a position opposite to the second substrate conveying path in the direction along the other axis and separated from the first substrate conveying path, comprising a plurality of component supply units arranged side by side along the one axis; a second component supply section arranged at a position opposite to the first substrate conveying path in the direction along the other axis and separated from the second substrate conveying path, comprising a plurality of component supply units arranged side by side along the one axis; a first working section including a first working head and a first working head moving mechanism, the first working head holding and mounting components on substrates, the first working head moving mechanism enabling The first operation head moves at least from above the first component supply unit to the first area above the second substrate conveying channel; the second operation unit includes a second operation head and a second operation head moving mechanism, the second operation head holds the component and mounts it on the substrate, and the second operation head moving mechanism enables the second operation head to move at least from above the second component supply unit to the second area above the first substrate conveying channel; a control unit controls the first operation unit and the second operation unit in multiple operation modes, the multiple operation modes including a collaborative mode and an independent mode, in which the first operation unit and the second operation unit jointly perform a component mounting operation on the substrate of the first substrate conveying channel or the second substrate conveying channel, and in the independent mode, the first operation unit performs a component mounting operation on the substrate of the first substrate conveying channel, and the second operation unit performs a component mounting operation on the substrate of the second substrate conveying channel; and a control parameter setting unit capable of setting control parameters for the first operation unit and the control parameters for the second operation unit respectively. The control unit causes the first working unit and the second working unit to perform a component mounting operation using the control parameters set by the control parameter setting unit.

[0009] According to the present invention, component mounting operations can be appropriately performed in parallel on a plurality of substrates requiring different levels of precision. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a plan view showing a schematic structure of a component mounting device according to one embodiment of the present invention.

[0011] Figure 2It is an explanatory diagram of the functions of the main part of the component mounting device according to one embodiment of the present invention.

[0012] Figure 3 (a) is an explanatory diagram of a cooperation mode in a component mounting device according to an embodiment of the present invention. Figure 3 (b) is an explanatory diagram of the independent mode in the component mounting device.

[0013] Figure 4 This is a block diagram showing the configuration of a control system of a component mounting device according to one embodiment of the present invention.

[0014] Figure 5 (a) is an explanatory diagram of the height of the suction nozzle in the component picking-up of the component mounting device according to one embodiment of the present invention. Figure 5 (b) is an illustration of the speed of the nozzle. Figure 5 (c) is an explanatory diagram of the acceleration of the suction nozzle.

[0015] Figure 6 (a) is an explanatory diagram of the height of the suction nozzle during component placement in the component placement device according to one embodiment of the present invention. Figure 6 (b) is an illustration of the speed of the nozzle. Figure 6 (c) is an explanatory diagram of the acceleration of the suction nozzle.

[0016] Figure 7 This is an explanatory diagram of an example of control parameters included in component data used in the component mounting device according to one embodiment of the present invention.

[0017] Figure 8 This is a flowchart showing the processing of the control parameter setting unit included in the component mounting device according to one embodiment of the present invention.

[0018] Figure 9 This is an explanatory diagram of an example of a control parameter correction coefficient table used in another example of the component mounting device according to one embodiment of the present invention.

[0019] Figure 10 This is a flowchart showing the processing of the control parameter setting unit included in another example of the component mounting device according to the embodiment of the present invention. DETAILED DESCRIPTION

[0020] An embodiment of the present invention will be described in detail below using the accompanying drawings. The structures, shapes, etc. described below are examples for illustration and can be appropriately changed according to the specifications of the component mounting device. In the following, in all the drawings, the same symbols are given to corresponding elements and repeated descriptions are omitted. Figure 1 In the following description, the X-axis ( Figure 1 The vertical direction in the direction of the substrate transport), the Y axis orthogonal to the substrate transport direction ( Figure 1 Left and right directions in ). Figure 1 In the following description, the Z axis is shown as a height direction perpendicular to the horizontal plane ( Figure 1 perpendicular to the paper).

[0021] First refer to Figure 1 、 Figure 2 The detailed structure of the component mounting device 1 will be described. Figure 2 This diagram illustrates the functions of the main components of the front first working unit W1. The first substrate conveyance path L1 is located at the center of the upper portion of the base 2, on the front side in the Y-axis direction, and the second substrate conveyance path L2 is located on the rear side. Specifically, the second substrate conveyance path L2 is located at a position separated from the first substrate conveyance path L1 along the Y-axis (an axis perpendicular to the first axis in the horizontal plane). The first substrate conveyance path L1 includes a pair of first substrate conveyor belts K1 that convey substrates 3 along the X-axis (an axis extending horizontally). The second substrate conveyance path L2 includes a pair of second substrate conveyor belts K2 that convey substrates 3 along the X-axis.

[0022] A first component supply unit S1 is located in front of the first substrate transport lane L1. A second component supply unit S2 is located behind the second substrate transport lane L2. Multiple component supply units 4 (tape feeders) are mounted above the first and second component supply units S1 and S2. The component supply units 4 feed carrier tapes holding components in increments and deliver them to the component supply positions.

[0023] Specifically, the first component supply unit S1 is located at a position spaced apart from the first substrate transport path L1 along the Y-axis (the other axis) and opposite to the second substrate transport path L2. It includes a plurality of component supply units 4 arranged side by side along the X-axis (one axis). Specifically, the first component supply unit S1 is located opposite to the second substrate transport path L2 along the Y-axis relative to the first substrate transport path L1 and spaced apart from the first substrate transport path L1. Furthermore, the second component supply unit S2 is located at a position spaced apart from the second substrate transport path L2 along the Y-axis (the other axis) and opposite to the first substrate transport path L1. It includes a plurality of component supply units 4 arranged side by side along the X-axis (one axis). Specifically, the second component supply unit S2 is located opposite to the first substrate transport path L1 along the Y-axis relative to the second substrate transport path L2 and spaced apart from the second substrate transport path L2.

[0024] exist Figure 1 、 Figure 2In the figure, a first Y-axis table 5A is disposed at one end of the upper surface of the base 2 in the X-axis direction, and a second Y-axis table 5B is disposed at the other end opposite to the one end. A Y-axis linear motor extending along the Y-axis is disposed on each of the first Y-axis table 5A and the second Y-axis table 5B. A first X-axis table 6A extending along the X-axis is coupled to the first Y-axis table 5A. The first X-axis table 6A is driven by the Y-axis linear motor and moves back and forth (arrow a) along the first Y-axis table 5A. A second X-axis table 6B extending along the X-axis is coupled to the second Y-axis table 5B. The second X-axis table 6B is driven by the Y-axis linear motor and moves back and forth along the second Y-axis table 5B.

[0025] The first X-axis table 6A and the second X-axis table 6B are each equipped with an X-axis linear motor extending along the X-axis. The first X-axis table 6A is coupled to a first work head H1, which is driven by the X-axis linear motor and moves left and right along the X-axis (arrow b). The second X-axis table 6B is coupled to a second work head H2, which is also driven by the X-axis linear motor and moves left and right along the X-axis.

[0026] exist Figure 2 In the embodiment, the first operation head H1 and the second operation head H2 are equipped with a plurality of suction nozzles 7 holding components at the lower end. The first operation head H1 and the second operation head H2 are provided with a nozzle lifting unit 20 and a nozzle rotating unit 21 corresponding to the plurality of suction nozzles 7, respectively (see FIG. Figure 4 The nozzle lifting unit 20 raises and lowers the nozzle 7 along the Z axis (arrow c). The nozzle rotating unit 21 rotates the nozzle 7 around the Z axis.

[0027] exist Figure 1 、 Figure 2 In the figure, the first work head H1 is moved horizontally (X-axis and Y-axis directions) by a Y-axis linear motor and an X-axis linear motor. It holds components supplied to the component supply position by the component supply unit 4 and places them on the substrate 3 (arrow d). The first Y-axis table 5A and the first X-axis table 6A constitute a first work head moving mechanism 9A, which moves the first work head H1 from at least above the first component supply section S1 to within a first area A1 above the second substrate transport path L2. Furthermore, the first work head H1 and the first work head moving mechanism 9A constitute a first work section W1.

[0028] The second work head H2 is moved horizontally (X-axis and Y-axis directions) by a Y-axis linear motor and an X-axis linear motor. It holds components supplied to the component supply position by the component supply unit 4 and places them on the substrate 3. The second Y-axis table 5B and the second X-axis table 6B constitute a second work head moving mechanism 9B, which moves the second work head H2 from at least above the second component supply section S2 to within the second area A2 above the first substrate transport path L1. Furthermore, the second work head H2 and the second work head moving mechanism 9B constitute the second work section W2.

[0029] exist Figure 1 、 Figure 2 In the embodiment, a control unit 10 is provided on the base 2. The control unit 10 controls the first substrate conveyor belt K1, the second substrate conveyor belt K2, the first working unit W1, and the second working unit W2 so as to perform component loading operations on the substrates 3 conveyed by the first substrate conveyor lane L1 or the second substrate conveyor lane L2 in a plurality of operation modes.

[0030] Next, refer to Figure 3 The cooperative mode and the independent mode will be described as examples of operation modes in which the control unit 10 controls the first working unit W1 and the second working unit W2 to perform the component mounting operation.

[0031] First, refer to Figure 3 The collaborative mode is described below with reference to (a). In the collaborative mode, the control unit 10 alternately performs, on the substrate 3A conveyed by the first substrate conveyance path L1, a task of loading components picked up from the component supply unit 4 of the first component supply unit S1 by the first work head H1 of the first work unit W1 (arrow e1), and a component loading task of loading components picked up from the component supply unit 4 of the second component supply unit S2 by the second work head H2 of the second work unit W2 (arrow e2).

[0032] In addition, the control unit 10 causes the substrate 3B conveyed through the second substrate conveying channel L2 to alternately perform: an operation (arrow f1) of loading components picked up from the component supply unit 4 of the first component supply section S1 by the first work head H1 of the first work section W1, and a component loading operation (arrow f2) of loading components picked up from the component supply unit 4 of the second component supply section S2 by the second work head H2 of the second work section W2.

[0033] Next, refer to Figure 3(b) of the figure will now describe the independent mode. In the independent mode, the control unit 10 causes the substrate 3A conveyed by the first substrate conveyance path L1 to be loaded with a component picked up from the component supply unit 4 of the first component supply unit S1 by the first work head H1 of the first work unit W1 (arrow g1). Furthermore, the control unit 10 causes the substrate 3B conveyed by the second substrate conveyance path L2 to be loaded with a component picked up from the component supply unit 4 of the second component supply unit S2 by the second work head H2 of the second work unit W2 (arrow g2).

[0034] In this way, the control unit 10 controls the first working unit W1 and the second working unit W2 in a plurality of operation modes, including the cooperative mode ( Figure 3 (a)) and standalone mode ( Figure 3 (b)), in the collaborative mode, the first working unit W1 and the second working unit W2 jointly perform component loading operations on the substrates 3A and 3B of the first substrate conveying channel L1 or the second substrate conveying channel L2; in the independent mode, the first working unit W1 performs component loading operations on the substrate 3A of the first substrate conveying channel L1, and the second working unit W2 performs component loading operations on the substrate 3B of the second substrate conveying channel L2.

[0035] The so-called two-stage / two-head component placement device 1 of this embodiment can perform component placement operations on multiple substrates 3A and 3B in parallel. Therefore, there may be situations where one of the work heads (the first work head H1 or the second work head H2) stops above the substrates 3A and 3B and lowers the suction nozzle 7 to place the held component on the substrates 3A and 3B, while the other work head performs operations such as moving and stopping in the horizontal direction (X-axis direction and Y-axis direction) or placing the component held by the suction nozzle 7 on the substrates 3A and 3B.

[0036] When the work head starts or stops moving, or when a component held by suction nozzle 7 lands on substrates 3A or 3B, vibrations are generated in base 2, sometimes affecting the work of the other work head. The magnitude of this vibration depends on the speed or acceleration at which the work head moves or stops, and the speed or acceleration at which suction nozzle 7 is raised or lowered. Specifically, the lower the speed or acceleration, the smaller the vibration. In other words, the dual-stage / dual-head component loading device 1 is affected by the operating conditions (control parameters) of the opposing work heads.

[0037] Next, refer to Figure 4The structure of the control system of the component mounting device 1 will be described. The control unit 10 included in the component mounting device 1 includes a first control unit 11, a second control unit 12, a drive control unit 13, a drive control unit 14, a storage unit 15, and a control parameter setting unit 19. The storage unit 15 is a storage device that stores production data 16, component data 17, parameter coefficients 18, and the like. An example of the control unit 10 is a computer. At least some of the functions of the control unit 10 can be implemented by a processor of the computer.

[0038] The production data 16 includes information necessary for component placement operations, such as the component placement position (X-coordinate, Y-coordinate) on the substrate 3, the type of component to be placed (component name), the placement direction, the placement order, the arrangement of components in the first component supply unit S1 and the second component supply unit S2, the required quality (required accuracy), and the operating mode. The production data 16 is generally created by type of mounting substrate (by type). Furthermore, when multiple types of mounting substrates are mixed and produced by a single component placement device 1, the production data 16 includes information necessary for component placement operations for multiple types of substrates.

[0039] exist Figure 4 Component data 17 includes, for each component type (component name), information necessary for component mounting device 1 to perform component mounting operations, including component shape and dimensions, control parameters related to the movement of suction nozzle 7, and information related to the operation and algorithm during component mounting operations. Component data 17 is associated with production data 16 by component name (component type).

[0040] exist Figure 4 In the embodiment, the first control unit 11 includes a drive control unit 11a that drives and controls the first X-axis table 6A of the first working unit W1, a drive control unit 11b that drives and controls the first Y-axis table 5A, a drive control unit 11c that drives and controls the nozzle lifting unit 20, and a drive control unit 11d that drives and controls the nozzle rotating unit 21. The second control unit 12 includes a drive control unit 12a that drives and controls the second X-axis table 6B of the second working unit W2, a drive control unit 12b that drives and controls the second Y-axis table 5B, a drive control unit 12c that drives and controls the nozzle lifting unit 20, and a drive control unit 12d that drives and controls the nozzle rotating unit 21.

[0041] The drive control unit 13 drives and controls the first substrate conveyor belt K1 of the first substrate conveyor lane L1. The drive control unit 14 drives and controls the second substrate conveyor belt K2 of the second substrate conveyor lane L2. The drive control units 11a to 11d, 12a to 12d, 13, and 14 control their respective components based on the control parameters included in the component data 17. Specifically, the control unit 10 performs component placement operations while referring to the production data 16 and component data 17. The production data 16 includes information regarding the placement positions of components on the substrate 3, and the component data 17 includes control parameters for each component name (component type).

[0042] Here, refer to Figure 5 、 Figure 6 To illustrate an example of control parameters. Figure 5 The height Hz (Hz) of the suction nozzle 7 when the first work head H1 (second work head H2) moves above the component supply unit 4 of the first component supply section S1 (second component supply section S2) and the suction nozzle 7 is raised and lowered by the suction nozzle lifting section 20 to pick up the component supplied to the component supply position is shown. Figure 5 (a)), the lifting speed Vz ( Figure 5 (b)), the acceleration of lifting Az ( Figure 5 (c)) Time lapse.

[0043] During component picking, the suction nozzle 7 descends from the standby height Hz1 to the landing height Hz2 at a speed of Vz1, stops adsorption at the landing height Hz2 for a time period of D1, and then rises from the landing height Hz2 to the standby height Hz1 at a speed of Vz2. In addition, at the adsorption on (ON) time T1 before the descending suction nozzle 7 is about to reach the landing height Hz2, adsorption force is supplied from the negative pressure supply unit (not shown) toward the front end of the suction nozzle 7. During component picking, the adsorption time D1, the adsorption on time T1, the speed Vz1 during descent, and the speed Vz2 during ascent become control parameters. In addition, the acceleration Az1 of the suction nozzle 7 at the start of descent, the acceleration Az2 at the end of descent, the acceleration Az3 at the start of ascent, and the acceleration Az4 at the end of ascent also become control parameters for component picking.

[0044] Figure 6 The height Hz of the suction nozzle 7 when the first work head H1 (second work head H2) moves above the substrate 3 in the first substrate conveying path L1 (second substrate conveying path L2) and the suction nozzle 7 is raised and lowered by the suction nozzle lifting unit 20 to load the held component to the loading position ( Figure 6 (a)), the lifting speed Vz ( Figure 6 (b)), the acceleration of lifting Az ( Figure 6 (c)) Time lapse.

[0045] During component loading, the suction nozzle 7 descends from the standby height Hz1 to the landing height Hz2 at a speed of Vz1. After stopping pressing for a time D2 at the landing height Hz2, it ascends from the landing height Hz2 to the standby height Hz1 at a speed of Vz2. Furthermore, at the suction OFF time T2, immediately before the descending suction nozzle 7 reaches the landing height Hz2, the suction force supplied by the negative pressure supply unit to the tip of the suction nozzle 7 is stopped. Furthermore, at the air supply ON time T3, immediately before the suction nozzle 7 begins to ascend, air is supplied from the positive pressure supply unit (not shown) to the tip of the suction nozzle 7 for a predetermined time.

[0046] In component loading, the pressing time D2, the suction closing time T2, the air supply opening time T3, the speed Vz1 during descent, and the speed Vz2 during ascent become control parameters. In addition, the acceleration Az1 at the start of descent of the suction nozzle 7, the acceleration Az2 at the end of descent, the acceleration Az3 at the start of ascent, and the acceleration Az4 at the end of ascent also become control parameters for component loading. In addition, the speeds Vz1, Vz2, and accelerations Az1 to Az4 for component picking and component loading do not need to be the same. In this way, the control parameters for component picking and component loading include, in addition to the control parameters related to the lifting action (speeds Vz1, Vz2, accelerations Az1 to Az4), control parameters related to moment or time (suction opening time T1, suction closing time T2, air supply opening time T3, suction time D1, pressing time D2).

[0047] Next, refer to Figure 7 The following describes an example of control parameters included in the component data 17. Various control parameters are registered for each component name (component type) in the component data 17. In this example, the control parameters registered include the acceleration Axy and velocity Vxy for horizontal movement of the first work head H1 (second work head H2), the acceleration Az1 and velocity Vz1 for lowering the suction nozzle 7, the suction time D1, the pressing time D2, the suction on time T1, the suction off time T2, and the air blow on time T3.

[0048] Furthermore, in the component data 17 of this embodiment, three levels of control parameters are registered for each component name. Level 1 is a control parameter requiring "standard" quality, Level 2 is a control parameter requiring "high" quality, and Level 3 is a control parameter requiring "ultra-high" quality. For example, the acceleration Axy used to move the first work head H1 (or second work head H2) in the horizontal direction decreases in the order of Level 1 (Axy1), Level 2 (Axy2), and Level 3 (Axy3). Consequently, the vibration generated during the movement of the first work head H1 decreases in the order of Level 1, Level 2, and Level 3, and the mass of the component carried increases. However, in this order, the time required for movement increases, resulting in reduced productivity.

[0049] exist Figure 4 In the present embodiment, the control parameter setting unit 19 sets the control parameters for the first working unit W1 and the control parameters for the second working unit W2 corresponding to the required quality of the mounted substrate based on the information on the operation mode included in the production data 16 and the required quality of the mounted substrate. The control unit 10 then uses the control parameters set by the control parameter setting unit 19 to perform the component mounting operation by operating the first working unit W1 and the second working unit W2.

[0050] Specifically, when the operating mode is the independent mode, the control parameter setting unit 19 sets the control parameters for the first working unit W1 based on the required mass (first required mass) of the substrate 3A on which components are placed in the first substrate transport lane L1, and sets the control parameters for the second working unit W2 based on the required mass (second required mass) of the substrate 3B on which components are placed in the second substrate transport lane L2. For example, if the required mass for the substrate 3A is level 1 and the required mass for the substrate 3B is level 2, the control parameter setting unit 19 sets the control parameters for level 1 for the first working unit W1 and the control parameters for level 2 for the second working unit W2.

[0051] Furthermore, when the operation mode is the collaborative mode, the control parameter setting unit 19 sets the same required quality control parameters for the first work unit W1 and the second work unit W2. If the required quality of the substrate 3A, on which components are loaded in the first substrate transport lane L1, differs from the required quality of the substrate 3B, on which components are loaded in the second substrate transport lane L2, the control parameter setting unit 19 sets the control parameters for the higher required quality. For example, if the required quality of substrate 3A is level 1 and the required quality of substrate 3B is level 2, the control parameter setting unit 19 sets the same level 2 control parameters for both the first work unit W1 and the second work unit W2. In other words, if the required quality of substrate 3A (first required quality) is lower than the required quality of substrate 3B (second required quality), the control parameter setting unit 19 adjusts the control parameters for the first work unit W1 from level 1 (standard) to level 2 (high quality).

[0052] In this way, the control parameter setting unit 19 can set the control parameters for the first working unit W1 and the control parameters for the second working unit W2 separately. This allows the control parameters for the first working unit W1 and the second working unit W2 to be the same in collaborative mode, while different control parameters can be set in independent mode. This allows for appropriate and parallel component placement operations on multiple substrates 3A and 3B with varying required accuracy (required quality).

[0053] Next, refer to Figure 8The following flow describes the control parameter setting method of the control parameter setting unit 19. The control parameter setting unit 19 sets the control parameters before the component mounting operation begins. First, the control parameter setting unit 19 determines whether the operation mode included in the production data 16 is the independent mode (ST1).

[0054] If the operating mode is independent (YES in ST1), the control parameter setting unit 19 checks the required quality, included in the production data 16, for each substrate transport lane (first substrate transport lane L1 and second substrate transport lane L2) for the substrates 3A and 3B scheduled for component mounting (ST2). Next, the control parameter setting unit 19 determines control parameters to be used independently for the first control unit 11 controlling the first work unit W1 and the second control unit 12 controlling the second work unit W2 (ST3).

[0055] exist Figure 8 If the operating mode is not the independent mode (NO in ST1), the control parameter setting unit 19 checks the required quality included in the production data 16 for the substrates 3A and 3B scheduled for component placement in the first substrate transport lane L1 and the second substrate transport lane L2 (ST4). Next, the control parameter setting unit 19 determines common control parameters for the first control unit 11 controlling the first work unit W1 and the second control unit 12 controlling the second work unit W2 (ST5).

[0056] In addition, when the component mounting device 1 is set to be able to produce multiple types of mounted substrates in one substrate conveying lane (first substrate conveying lane L1, second substrate conveying lane L2), in (ST2) and (ST4), the most stringent required quality among the types of component mounting operations is confirmed.

[0057] As described above, the component mounting device 1 of this embodiment includes: a first substrate conveying channel L1 for conveying a substrate 3, a second substrate conveying channel L2 for conveying a substrate 3, a first component supply section S1 having a plurality of component supply units 4, a second component supply section S2 having a plurality of component supply units 4, a first working section W1 including a first working head H1 and a first working head moving mechanism 9A for moving the first working head H1, and a second working section W2 including a second working head H2 and a second working head moving mechanism 9B for moving the second working head.

[0058] In addition, the component loading device 1 includes: a control unit 10, which controls the first working unit W1 and the second working unit W2 in multiple operating modes, and the multiple operating modes include a collaborative mode and an independent mode. In the collaborative mode, the first working unit W1 and the second working unit W2 jointly perform component loading operations on the substrate 3 of the first substrate conveying channel L1 or the second substrate conveying channel L2; in the independent mode, the first working unit W1 performs component loading operations on the substrate 3 of the first substrate conveying channel L1, and the second working unit W2 performs component loading operations on the substrate 3 of the second substrate conveying channel L2; and a control parameter setting unit 19, which can set the control parameters for the first working unit W1 and the control parameters for the second working unit W2 respectively.

[0059] The control unit 10 then operates the first and second working units W1 and W2 to perform component placement using the control parameters set by the control parameter setting unit 19. This allows component placement to be appropriately performed in parallel on a plurality of substrates requiring different precision (quality).

[0060] Next, another embodiment of the component mounting apparatus 1 will be described. In the other embodiment of the component mounting apparatus 1, when the operation mode is the independent mode and the required masses of the substrates 3A of the first substrate transport lane L1 and the substrates 3B of the second substrate transport lane L2 are different, the control parameter setting unit 19 sets the control parameters for the first working unit W1 and the second working unit W2 based on the parameter coefficients 18 stored in the storage unit 15.

[0061] First, refer to Figure 9 , an example of the parameter coefficient 18 included in the control parameter correction coefficient table is described. Parameter coefficient 18 is a coefficient used by the control parameter setting unit 19 to correct the control parameter for the lower required quality when the required quality on the first substrate transport path L1 side differs from the required quality on the second substrate transport path L2 side.

[0062] Parameter coefficient 18 is applied to the control parameters for the work unit on the substrate transport lane (currently in front of the current one). Specifically, if the required quality of substrates in the current substrate transport lane is lower than that of the other side, parameter coefficient 18 is used to correct the control parameters for the current work unit. In other words, if the control parameters for the current work unit are set to a higher productivity than those for the other side, the control parameter setting unit 19 corrects the control parameters for the current work unit (for example, by reducing acceleration or speed).

[0063] When setting control parameters for the first working section W1, the control parameter setting section 19 uses a parameter coefficient 18 determined by the required mass of the substrates 3 of the first substrate transport lane L1 (the front) and the required mass of the substrates 3 of the second substrate transport lane L2 (the other side). On the other hand, when setting control parameters for the second working section W2, the parameter coefficient 18 determined by the required mass of the substrates 3 of the second substrate transport lane L2 (the front) and the required mass of the substrates 3 of the first substrate transport lane L1 (the other side) is used.

[0064] exist Figure 9 In this example, if the required quality of the current substrate transport channel is standard (level 1), high quality (level 2), or ultra-high quality (level 3), and the required quality of the other substrate transport channel is standard, parameter coefficient 18 is set to "1.0." Furthermore, if the required quality of the current substrate transport channel is high quality or ultra-high quality, and the required quality of the other substrate transport channel is high quality, parameter coefficient 18 is set to "1.0." Furthermore, if the required quality of the current substrate transport channel is ultra-high quality, and the required quality of the other substrate transport channel is ultra-high quality, parameter coefficient 18 is set to "1.0." In other words, if the required quality of the current substrate transport channel is equal to or higher than that of the other substrate transport channel, the control parameters of the current channel are not modified.

[0065] exist Figure 9 In this example, if the required quality of the substrate transport lane on the front is standard, and the required quality of the other substrate transport lane is high, then parameter coefficient 18 is set to "0.9," and if it is ultra-high, then parameter coefficient 18 is set to "0.8." Furthermore, if the required quality of the substrate transport lane on the front is high, then parameter coefficient 18 is set to "0.9" if the required quality of the other substrate transport lane on the front is ultra-high. In other words, if the required quality of the other substrate transport lane is higher than that of the current one, the control parameters for the current work unit are adjusted, and the adjustment amount increases as the difference in quality with the required quality of the other substrate transport lane increases.

[0066] Control parameter setting unit 19 corrects control parameters, such as acceleration Axy, Az1, or velocities Vxy, Vz1, which affect quality, by using corresponding parameter coefficients 18. For example, if parameter coefficient 18 is "0.9," control parameters such as acceleration Axy, Az1, or velocities Vxy, Vz1 are corrected by a factor of 0.9. By correcting control parameters to the lower required quality, component placement operations can be appropriately performed in parallel on multiple substrates with varying precision (quality) requirements.

[0067] Next, refer to Figure 10The control parameter setting method of the control parameter setting unit 19 of another embodiment of the component mounting device 1 is described below. Figure 8 The same steps in the control parameter setting method shown are marked with the same symbols and detailed descriptions are omitted. Figure 10 The control parameter setting method shown is the same as Figure 8 The difference in the control parameter setting method shown is that in the independent mode (yes in ST1), after the control parameters to be used separately for the first working unit W1 and the second working unit W2 are determined (ST3), the control parameter setting unit 19 corrects the control parameters based on the parameter coefficient 18 (ST6).

[0068] Specifically, in (ST6), if the required mass of the substrate 3A on the first substrate transport lane L1 side, where the component mounting operation is to be performed, differs from the required mass of the substrate 3B on the second substrate transport lane L2 side, the control parameter setting unit 19 corrects the control parameter for the substrate with the lower required mass based on the parameter coefficient 18. This allows the component mounting operation to be appropriately performed in parallel on multiple substrates with different required accuracies (quality).

[0069] Industrial applicability

[0070] The component mounting apparatus of the present invention has the effect of being able to appropriately and concurrently perform component mounting operations on a plurality of substrates requiring different accuracies, and is useful in the field of mounting components on substrates.

[0071] Explanation of symbols

[0072] 1. Component loading device

[0073] 3.3A, 3B substrates

[0074] 4 Parts supply unit

[0075] 9A 1st working head moving mechanism

[0076] 9B 2nd working head moving mechanism

[0077] 10. Control Unit

[0078] A1 Area 1

[0079] A2 Area 2

[0080] H1 1st operating head

[0081] H2 2nd working head

[0082] L1 1st substrate conveying channel

[0083] L2 Second substrate transport channel

[0084] S1 1st component supply unit

[0085] S2 Second component supply unit

[0086] W1 1st Operation Department

[0087] W2 2nd Operation Department

Claims

1. A component mounting device comprising: a first substrate conveying passage for conveying a substrate along an axis extending in a horizontal direction; a second substrate transport path disposed at a position separated from the first substrate transport path in a direction along another axis and configured to transport substrates along the one axis, the other axis being orthogonal to the one axis in a horizontal plane; a first component supply section, arranged at a position opposite to the second substrate conveyance path with respect to the first substrate conveyance path in a direction along the other axis and at a position separated from the first substrate conveyance path, and comprising a plurality of component supply units arranged side by side along the one axis; a second component supply section, arranged at a position opposite to the first substrate conveyance path with respect to the second substrate conveyance path in a direction along the other axis and arranged at a position separated from the second substrate conveyance path, and comprising a plurality of component supply units arranged side by side along the one axis; a first working section including a first working head and a first working head moving mechanism, wherein the first working head holds and loads components onto a substrate, and the first working head moving mechanism moves the first working head at least from above the first component supply section to a first area above the second substrate conveying passage; a second working section including a second working head and a second working head moving mechanism, wherein the second working head holds and loads components onto a substrate, and the second working head moving mechanism moves the second working head at least from above the second component supply section to a second area above the first substrate conveying passage; a control unit configured to control the first working unit and the second working unit in a plurality of operation modes, the plurality of operation modes including a collaborative mode and an independent mode, wherein in the collaborative mode, the first working unit and the second working unit are jointly operated to carry out a component loading operation on substrates in the first substrate conveying channel or the second substrate conveying channel, and in the independent mode, the first working unit is operated to carry out a component loading operation on substrates in the first substrate conveying channel, and the second working unit is operated to carry out a component loading operation on substrates in the second substrate conveying channel; and The control parameter setting unit can set the control parameters for the first working unit and the control parameters for the second working unit respectively. The control unit causes the first working unit and the second working unit to perform a component mounting operation using the control parameters set by the control parameter setting unit.

2. The component mounting device according to claim 1, wherein: In the cooperative mode, the control parameter setting unit sets the same control parameters for the first working unit and the second working unit. In the independent mode, the control parameter setting unit sets different control parameters for the control parameters for the first working unit and the control parameters for the second working unit.

3. The component mounting device according to claim 1, wherein: The control unit causes the first operation unit and the second operation unit to perform the component mounting operation while referring to production data, wherein the production data includes information on the mounting position of the component on the substrate. The control parameter setting unit sets a control parameter based on information related to the operation mode included in the production data.

4. The component mounting device according to claim 1, wherein: The control parameter setting unit sets a control parameter corresponding to a required quality of a substrate.

5. The component mounting device according to claim 4, wherein: When the first working unit and the second working unit are controlled in the independent mode, the control parameter setting unit sets the control parameters for the first working unit based on the first required mass of the substrate on which the components are mounted in the first substrate conveying channel, and sets the control parameters for the second working unit based on the second required mass of the substrate on which the components are mounted in the second substrate conveying channel.

6. The component mounting device according to claim 5, wherein: The control parameter setting unit corrects the control parameter for the first working unit when the first required quality is lower than the second required quality.

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