Vacuum baking platform, control system, control method and storage medium

By designing a vacuum baking platform and control system and adopting multi-stage vacuuming and heating technology, rapid and precise alignment of filament replacement in semiconductor equipment was achieved, solving the problem of complex and time-consuming filament replacement in existing technologies and improving the success rate and equipment stability.

CN121641779APending Publication Date: 2026-03-10无锡卓海科技股份有限公司
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Patent Information

Application Number
CN202511810206.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-03
Publication Date
2026-03-10

AI Technical Summary

Technical Problem

The replacement process of the cathode filament of the electron gun in existing semiconductor equipment is complex, time-consuming, and prone to damage and contamination, leading to the accumulation of contaminants in the vacuum chamber, which affects the stability of the equipment and the success rate of replacement.

Method used

Design a vacuum baking platform comprising a mirror tube, a vacuum valve, a support tube, a Faraday cup, a vacuum pumping assembly, and a heating assembly. The platform rapidly establishes a vacuum through multi-stage vacuum pumping and heating, and uses the Faraday cup to detect the filament position for precise alignment.

Benefits of technology

It improves the success rate and efficiency of filament replacement, reduces the risk of damage, simplifies the operation process, and reduces labor and time costs.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The invention relates to the technical field of semiconductor equipment maintenance, in particular to a vacuum baking platform, a control system, a control method and a storage medium, the vacuum baking platform comprises a lens cone, a lamp filament is arranged in the lens cone, a through hole is formed in the lower end of the lens cone, and the position of the lamp filament in the lens cone can be adjusted to directly face the through hole; the vacuum valve is arranged on the lens cone and located at the through hole; the supporting cylinder is arranged at the lower end of the lens cone in a sealing manner; the Faraday cup is arranged at the bottom of the supporting cylinder and directly faces the through hole, and a diaphragm is arranged on the Faraday cup; the first vacuumizing assembly is communicated with the lens cone; the second vacuumizing assembly and the third vacuumizing assembly are both communicated with the supporting cylinder; and the heating assembly is used for heating the vacuum baking platform. Vacuum can be quickly established, and meanwhile the success rate of filament replacement can be increased.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor equipment maintenance, in particular to a vacuum baking platform, a control system, a control method and a storage medium. BACKGROUND

[0002] Currently, the replacement of the electron gun cathode filament in the semiconductor equipment generally adopts an on-site replacement method, which needs to inflate the vacuum cavity where the filament is installed, remove the old filament and install a new filament, and then re-establish a high vacuum and perform an electron gun emission axis centering operation. In order to ensure that the electron optical system of the electron microscope can work normally and stably, an ultra-high vacuum degree is required inside the electron gun and the lens barrel. The operation of establishing an ultra-high vacuum degree is complex and time-consuming. At the same time, the filament has high precision, high cleanliness characteristics and requirements, and is extremely easy to be damaged and contaminated during processing, transportation and installation. If the filament is not in good condition after on-site replacement, the above replacement process has to be repeated, which consumes a lot of time and manpower. Moreover, replacing the filament will expose the cavity to the air, which will introduce particulate, gas, liquid and other pollution components during the process. Each replacement of the filament will cause the accumulation of pollution inside the cavity, further increasing the risk of filament damage and downtime.

[0003] Based on the above industry characteristics, the following method is selected in the prior art: before replacing the filament, the filament is replaced and centered on the same type of lens barrel, and then the lens barrel is replaced as a whole. At the same time, the replaced lens barrel is transported to a professional equipment workshop for cleaning and refurbishment, so as to be recycled, which not only ensures fast and reliable machine recovery and production, but also realizes regular cleaning and quality inspection of the inside of the lens barrel. When replacing the filament in the lens barrel, it needs to be done on a vacuum baking device. The existing vacuum baking device is limited by the pumping speed and capacity of the vacuum pump, and the vacuum is established relatively slowly. Moreover, some devices cannot see the light spot, and need to search in a large range to determine the position of the filament, so the success rate of filament replacement is low.

[0004] Therefore, there is a need for a vacuum baking platform, a control system, a control method and a storage medium to solve the above problems. SUMMARY

[0005] The purpose of the present application is to provide a vacuum baking platform, a control system, a control method and a storage medium, which can quickly establish a vacuum and at the same time can improve the success rate of filament replacement.

[0006] To achieve this purpose, the present application adopts the following technical solutions:

[0007] The vacuum baking platform comprises:

[0008] The lens barrel is provided with a filament, and a through hole is formed in the lower end of the lens barrel. The position of the filament in the lens barrel can be adjusted to be opposite to the through hole.

[0009] A vacuum valve is arranged on the lens barrel and located at the through hole for controlling opening and closing of the through hole.

[0010] A support barrel is sealingly arranged at the lower end of the lens barrel.

[0011] A Faraday cup is arranged at the bottom of the support barrel and opposite to the through hole, and a diaphragm is arranged on the Faraday cup.

[0012] A first vacuum assembly is in communication with the lens barrel.

[0013] A second vacuum assembly and a third vacuum assembly are both in communication with the support barrel, and the third vacuum assembly is used to establish a primary vacuum to start the first vacuum assembly and the second vacuum assembly.

[0014] A heating assembly is used to heat the vacuum baking platform.

[0015] In some embodiments, the lens barrel is provided with a first pump interface and a second pump interface, the first vacuum assembly includes a first ion pump and a second ion pump, the first ion pump is arranged at the first pump interface, and the second ion pump is arranged at the second pump interface.

[0016] In some embodiments, the upper end of the support barrel has a connecting flange, and a fastener passes through the connecting flange to connect with the lens barrel.

[0017] In some embodiments, the support barrel is provided with a third pump interface, and the second vacuum assembly includes a third ion pump arranged at the third pump interface.

[0018] In some embodiments, the support barrel is provided with a fourth pump interface, the third vacuum assembly includes a dry pump and a molecular pump in communication with each other, the molecular pump is arranged at the fourth pump interface, an inlet vacuum valve is arranged at the inlet of the dry pump, and a communication vacuum valve is arranged in the pipeline between the dry pump and the molecular pump.

[0019] In some embodiments, the heating assembly includes a first heating member, a second heating member, a third heating member and a fourth heating member, the first heating member is sleeved on the lens barrel, the second heating member is sleeved on the support barrel, the third heating member is arranged on the first vacuum assembly, and the fourth heating member is arranged on the second vacuum assembly.

[0020] In some embodiments, a plurality of groups of first temperature sensors are arranged at intervals in the height direction inside the first heating member, and a group of second temperature sensors is arranged on the second heating member.

[0021] A control system for controlling the vacuum baking platform as described above, comprising a vacuum control module, a baking control module and a beam current control module, the vacuum control module is electrically connected with the vacuum valve, the first vacuum pumping assembly, the second vacuum pumping assembly and the third vacuum pumping assembly, the baking control module is electrically connected with the heating assembly, and the beam current control module is electrically connected with the filament and the Faraday cup.

[0022] A control method for controlling the vacuum baking platform as described above, comprising the following steps:

[0023] S1, installing the lens barrel with the replaced filament to the support cylinder, installing the heating assembly, the first vacuum pumping assembly, the second vacuum pumping assembly and the third vacuum pumping assembly;

[0024] S2, opening the vacuum valve, starting the first vacuum pumping assembly, the second vacuum pumping assembly and the third vacuum pumping assembly to establish a vacuum environment for the lens barrel;

[0025] S3, starting the filament voltage boosting function, after the filament emits a stable beam current, adjusting the filament position according to the current detected by the Faraday cup, so that the monitoring current reaches a set value, and the preliminary centering of the filament is completed;

[0026] S4, after the centering is completed, nitrogen is filled into the lens barrel;

[0027] S5, the first vacuum pumping assembly and the heating assembly are removed, the vacuum valve is closed, and the position where the lens barrel communicates with the first vacuum pumping assembly is blocked;

[0028] S6, opening the vacuum valve, starting the third vacuum pumping assembly to establish a primary vacuum for the lens barrel, and closing the vacuum valve again after completion;

[0029] S7, filling nitrogen into the support cylinder, and removing the lens barrel after the filling is completed, and moving to a semiconductor device for installation.

[0030] A storage medium having a computer program stored thereon, the program being executed by a processor to implement the control method as described above.

[0031] The beneficial effects of the present application are:

[0032] This invention provides a vacuum baking platform with a filament housed in the microscope tube, and a through-hole at the lower end of the tube. A vacuum valve is located in the microscope tube at the through-hole to control its opening and closing. A support cylinder is sealed at the lower end of the microscope tube, and a Faraday cup is positioned at the bottom of the support cylinder, directly opposite the through-hole. An aperture is mounted on the Faraday cup. A first vacuum pumping assembly is connected to the microscope tube, while second and third vacuum pumping assemblies are also connected to the support cylinder. A heating assembly is used to heat the vacuum baking platform. After the filament is installed in the microscope tube, the first, second, and third vacuum pumping assemblies are activated to establish a vacuum environment in the microscope tube. The heating assembly reduces gas adsorption on the inner wall of the vacuum baking platform, further increasing the vacuum level and ensuring rapid vacuum establishment. Once the filament beam stabilizes, the filament position is adjusted based on the current detected by the Faraday cup to bring the current to a set value, completing the initial filament alignment. The aperture on the Faraday cup improves detection accuracy and increases the success rate of filament replacement.

[0033] The present invention provides a control system for controlling the vacuum baking platform as described above, which can quickly establish a vacuum and improve the success rate of filament replacement.

[0034] The present invention provides a control method for controlling the vacuum baking platform as described above, which can quickly establish a vacuum and improve the success rate of filament replacement.

[0035] The present invention provides a storage medium storing a computer program, which, when executed by a processor, implements the control method described above, enabling rapid vacuum establishment and improving the success rate of filament replacement. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of a vacuum baking platform according to the present invention;

[0038] Figure 2 This is a schematic diagram of the mirror tube and support tube in a vacuum baking platform according to the present invention;

[0039] Figure 3 This is a top view of the first heating element in a vacuum baking platform according to the present invention;

[0040] Figure 4This is a top view of the second heating element in a vacuum baking platform according to the present invention;

[0041] Figure 5 This is a schematic diagram of a control system according to the present invention.

[0042] In the picture:

[0043] 1. Lens tube; 11. Filament; 12. Vacuum valve; 13. First pump interface; 14. Second pump interface; 2. Support cylinder; 21. Faraday cup; 22. Third pump interface; 23. Fourth pump interface; 3. First vacuum assembly; 31. First ion pump; 32. Second ion pump; 4. Third ion pump; 5. Third vacuum assembly; 51. Dry pump; 52. Molecular pump; 53. Inlet vacuum valve; 54. Connecting vacuum valve; 55. Vacuum gauge; 6. Heating assembly; 61. First heating element; 611. First temperature sensor; 62. Second heating element; 621. Second temperature sensor; 63. Third heating element; 64. Fourth heating element; 8. Control system; 81. Vacuum control module; 811. Ion pump controller; 812. Molecular pump controller; 813. Dry pump controller; 82. Baking control module; 821. Baking controller; 83. Beam control module; 831. Filament high-voltage power supply; 84. Operation display module. Detailed Implementation

[0044] Before explaining any implementation of this application in detail, it should be understood that this application is not limited to its application to the structural details and component arrangements set forth in the following description or shown in the above drawings.

[0045] In this application, the terms "comprising," "including," "having," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0046] In this application, the terms "connection," "combination," "coupling," and "installation" can refer to direct connection, combination, coupling, or installation, or indirect connection, combination, coupling, or installation. For example, a direct connection refers to two parts or components being connected together without the need for an intermediary, while an indirect connection refers to two parts or components each being connected to at least one intermediary, with the connection achieved through the intermediary. Furthermore, "connection" and "coupling" are not limited to physical or mechanical connections or couplings, but can also include electrical connections or couplings.

[0047] In this application, those skilled in the art will understand that the function performed by a component can be performed by one component, multiple components, one part, or multiple parts. Similarly, the function performed by a part can also be performed by one part, one component, or a combination of multiple parts.

[0048] In this application, the directional terms "upper," "lower," "left," "right," "front," and "rear" are used to describe the orientation and positional relationships shown in the accompanying drawings and should not be construed as limiting the embodiments of this application. Furthermore, in the context, it should be understood that when an element is mentioned as being connected "upper" or "lower" to another element, it can be directly connected to the other element "upper" or "lower," or indirectly connected through an intermediate element. It should also be understood that directional terms such as upper side, lower side, left side, right side, front side, and rear side not only represent positive orientation but can also be understood as lateral orientation. For example, "below" can include directly below, lower left, lower right, lower front, and lower rear.

[0049] In the process of replacing the cathode filament of the electron gun in semiconductor equipment, in order to quickly establish a vacuum and improve the success rate of filament replacement, such as... Figures 1-5 As shown, the present invention provides a vacuum baking platform. The vacuum baking platform includes a mirror tube 1, a vacuum valve 12, a support tube 2, a Faraday cup 21, a first vacuum pumping assembly 3, a second vacuum pumping assembly, a third vacuum pumping assembly 5, and a heating assembly 6.

[0050] The microscope tube 1 contains a filament 11, and a through hole is provided at the lower end of the microscope tube 1. The position of the filament 11 within the microscope tube 1 can be adjusted to align with the through hole. A vacuum valve 12 is located in the microscope tube 1 at the through hole and is used to control the opening and closing of the through hole. A support tube 2 is sealed at the lower end of the microscope tube 1; a Faraday cup 21 is located at the bottom of the support tube 2 and aligns with the through hole, and an aperture is provided on the Faraday cup 21. A first vacuum pumping assembly 3 is connected to the microscope tube 1, and both a second and third vacuum pumping assembly 5 are connected to the support tube 2. The third vacuum pumping assembly 5 is used to establish a primary vacuum to activate the first and second vacuum pumping assemblies 3 and 2. A heating assembly 6 is used to heat the vacuum baking platform.

[0051] After installing the filament 11 in the microscope tube 1, the first vacuum pumping assembly 3, the second vacuum pumping assembly, and the third vacuum pumping assembly 5 are activated to establish a vacuum environment for the microscope tube 1. The heating assembly 6 reduces gas adsorption on the inner wall of the vacuum baking platform, further increasing the vacuum level and ensuring rapid vacuum establishment. Once the beam emitted by the filament 11 stabilizes, the position of the filament 11 is adjusted according to the current detected by the Faraday cup 21 until the monitoring current reaches the set value, completing the initial alignment of the filament 11. The presence of an aperture on the Faraday cup 21 improves detection accuracy and increases the success rate of filament 11 replacement.

[0052] In some embodiments, the microscope tube 1 is provided with a first pump interface 13 and a second pump interface 14. The first vacuum pumping assembly 3 includes a first ion pump 31 and a second ion pump 32. The first ion pump 31 is located at the first pump interface 13, and the second ion pump 32 is located at the second pump interface 14. The ion pump is a type of oil-free ultra-high vacuum pump, mainly used in fields with extremely high vacuum requirements, such as particle accelerators, synchrotron radiation sources, mass spectrometers, and semiconductor manufacturing equipment. It achieves continuous pumping by ionizing residual gas under the action of a strong magnetic field and a high-voltage electric field, and fixing gas atoms on the surface of an active material (such as titanium) using sputtering and chemisorption mechanisms. By arranging the first ion pump 31 and the second ion pump 32, the pumping speed and the vacuum level after pumping can be improved.

[0053] In some embodiments, the upper end of the support cylinder 2 has a connecting flange, and fasteners pass through the connecting flange to connect with the lens barrel 1. The connecting flange facilitates the docking of the lens barrel 1 and the support cylinder 2. A temperature sensor is installed inside the support cylinder 2 to detect the internal temperature.

[0054] In some embodiments, the support cylinder 2 is provided with a third pump interface 22, and the second vacuuming assembly includes a third ion pump 4, which is disposed at the third pump interface 22. By arranging the third ion pump 4 at the third pump interface 22 of the support cylinder 2, the support cylinder 2 can be evacuated using the third ion pump 4. During this process, the vacuum valve 12 needs to be opened to enable the third ion pump 4 to perform vacuuming operations on the mirror barrel 1, further increasing the vacuuming speed of the mirror barrel 1.

[0055] In some embodiments, the support cylinder 2 is provided with a fourth pump interface 23, and the third vacuum assembly 5 includes a dry pump 51 and a molecular pump 52 that are interconnected. The molecular pump 52 is located at the fourth pump interface 23, and an inlet vacuum valve 53 is provided at the inlet of the dry pump 51. A connecting vacuum valve 54 is provided in the pipeline between the dry pump 51 and the molecular pump 52. Since the ion pump needs a certain vacuum level to start normally, the arrangement of the dry pump 51 and the molecular pump 52 serves to assist in the start-up of the ion pump. In practical applications, the dry pump 51 is often used as a backing pump to first evacuate the system to a medium vacuum (e.g., 10⁻² Pa), and then the molecular pump 52 continues to work to achieve an ultra-high vacuum state. The dry pump 51 works to reach the primary vacuum level, which meets the start-up requirements of the molecular pump 52. Then, the molecular pump 52 reaches the secondary vacuum level, which meets the start-up requirements of the ion pump. Finally, the three-stage ion pump establishes an ultra-high vacuum in the mirror cylinder 1. To facilitate the detection of the vacuum level at the fourth pump interface 23, a vacuum gauge 55 is installed at the fourth pump interface 23, which can collect the vacuum level in real time.

[0056] In some embodiments, the heating assembly 6 includes a first heating element 61, a second heating element 62, a third heating element 63, and a fourth heating element 64. The first heating element 61 is sleeved on the mirror barrel 1, the second heating element 62 is sleeved on the support cylinder 2, the third heating element 63 is disposed on the first vacuum assembly 3, and the fourth heating element 64 is disposed on the second vacuum assembly. By rationally arranging the heating assembly 6, the first heating element 61 provides all-round coverage heating of the mirror barrel 1, the second heating element 62 provides all-round coverage heating of the support cylinder 2, and the third heating element 63 and the fourth heating element 64 are both heating plates used to heat the first ion pump 31, the second ion pump 32, and the third ion pump 4. By arranging the heating assembly 6, the gas mobility can be improved, thereby further improving the vacuum level.

[0057] In some embodiments, multiple sets of first temperature sensors 611 are spaced apart along the height direction inside the first heating element 61, and a set of second temperature sensors 621 is provided on the second heating element 62. Specifically, the lens barrel 1 is provided with three sets of first temperature sensors 611 (upper, middle, and lower) inside, used to detect the baking temperature of the lens barrel 1 by the first heating element 61. Each set of first temperature sensors 611 includes four orthogonally distributed temperature sensors, which can detect the temperature of the lens barrel 1 from all directions. The support cylinder 2 contains a set of second temperature sensors 621, which are four orthogonally distributed temperature sensors, used to detect the baking temperature of the inner wall of the support cylinder 2.

[0058] The vacuum baking platform provided in this embodiment can independently achieve high vacuum establishment and filament 11 alignment for the entire lens barrel 1 assembly. The vacuum baking platform can be reused multiple times, and the cost is controllable. Therefore, it is possible to freely select vacuum pumps with higher pumping speeds and capacities. Furthermore, by selecting vacuum pumps for more gas types and designing a baking method with more comprehensive coverage, a higher vacuum can be established, improving the success rate of filament 11 replacement.

[0059] like Figures 1-5 As shown, this embodiment also provides a control system. The control system 8 is used to control the vacuum baking platform described above. It includes a vacuum control module 81, a baking control module 82, and a beam control module 83. The vacuum control module 81 is electrically connected to the vacuum valve 12, the first vacuum pumping assembly 3, the second vacuum pumping assembly, and the third vacuum pumping assembly 5. The baking control module 82 is electrically connected to the heating assembly 6. The beam control module 83 is electrically connected to the filament 11 and the Faraday cup 21. The vacuum control module 81 provides power to the first ion pump 31, the second ion pump 32, and the third ion pump 4 through the ion pump controller 811, and calculates the vacuum level of each chamber based on the current value. It provides power to the molecular pump 52 through the molecular pump controller 812 and acquires the operating status of the molecular pump 52, such as acceleration, deceleration, operation, and stop. It provides power to the dry pump 51 through the dry pump controller 813 and controls its automatic start and stop. It switches the gas path through the inlet vacuum valve 53 and the connecting vacuum valve 54. It acquires the vacuum level of the fourth pump interface 23 through the vacuum gauge 55.

[0060] The baking control module 82 provides power to the first heating element 61, the second heating element 62, the third heating element 63, and the fourth heating element 64 through the baking controller 821. The baking controller 821 collects signals from the first temperature sensor 611 and the second temperature sensor 621 as feedback signals to automatically achieve precise temperature control. The beam control module 83 provides heating current, suppression voltage, extraction voltage, and acceleration voltage to the filament 11 through the filament high-voltage power supply 831, obtains the emission current Ie of the filament 11, and automatically applies the rated voltage and performs beam extraction. By collecting the capture current Ip of the Faraday cup 21, the magnitude of Ip is used to determine whether the filament 11 is aligned, and the stability of Ip over time is used to determine whether the replacement of the filament 11 was successful.

[0061] To facilitate operation, the control system 8 also includes an operation display module 84, which is used for function selection and IP monitoring display, making operation convenient.

[0062] This embodiment also provides a control method for controlling the vacuum baking platform described above, comprising the following steps:

[0063] S1. Install the lens tube 1 with the replaced filament 11 onto the support tube 2, and install the heating assembly 6, the first vacuum assembly 3, the second vacuum assembly and the third vacuum assembly 5.

[0064] S2. Open vacuum valve 12 and start the first vacuum pumping assembly 3, the second vacuum pumping assembly and the third vacuum pumping assembly 5 to establish a vacuum environment for the mirror tube 1.

[0065] S3. Turn on the voltage boost function of filament 11. After the beam emitted by filament 11 is stable, adjust the position of filament 11 according to the current detected by Faraday cup 21 so that the monitoring current reaches the set value and complete the initial alignment of filament 11.

[0066] S4. After alignment, nitrogen gas is introduced into the microscope tube 1;

[0067] S5. Remove the first vacuum assembly 3 and the heating assembly 6, close the vacuum valve 12, and seal the position where the mirror tube 1 connects to the first vacuum assembly 3.

[0068] S6. Open vacuum valve 12 and start the third vacuum pumping component 5 to establish a first-level vacuum for the lens barrel 1. After completion, close vacuum valve 12 again.

[0069] S7. Fill the support cylinder 2 with nitrogen. After filling, remove the lens barrel 1 and move it to the semiconductor equipment for installation.

[0070] In step S2, the steps for establishing a vacuum environment are as follows:

[0071] S21. Open the inlet vacuum valve 53 and the connecting vacuum valve 54 to fill with clean nitrogen.

[0072] S22. Close the inlet vacuum valve 53, stop nitrogen charging, and start the dry pump 51 to perform primary vacuuming until the primary vacuum meets the start-up requirements of the molecular pump 52.

[0073] S23. Start the molecular pump 52 to perform secondary vacuuming until the secondary vacuum level meets the start-up requirements of the heating component 6.

[0074] S24. Start the first heating element 61, the second heating element 62, the third heating element 63 and the fourth heating element 64 of the heating assembly 6 for baking and heating. When the first heating element 61, the second heating element 62, the third heating element 63 and the fourth heating element 64 reach the set temperature, run for a set time until the secondary vacuum meets the ion pump start-up requirements.

[0075] S25. Stop the operation of the third heating element 63 and the fourth heating element 64 until the cooling delay ends. Start the first ion pump 31, the second ion pump 32, and the third ion pump 4 until the vacuum level inside the microscope tube 1 meets the requirements. Then, the first heating element 61 and the second heating element 62 stop working, completing the establishment of the ultra-high vacuum environment. Through the above method, the gradual establishment of ultra-high vacuum working in the microscope tube 1 can be guaranteed to proceed smoothly.

[0076] In some embodiments, in step S24, the molecular pump 52 protection function is activated synchronously. It is determined whether the secondary vacuum level triggers the molecular pump 52 protection threshold. If so, the connecting vacuum valve 54 is closed, the molecular pump 52 is shut down, and the operation of the heating component 6 is stopped. Then, it is determined whether the number of triggers is less than the set number. If so, the process returns to step S23. If the number of triggers is greater than the set number, the process enters the error reporting and stopping procedure.

[0077] In some embodiments, during step S25, while the first ion pump 31, the second ion pump 32, and the third ion pump 4 are started, their protection functions are also activated. When the vacuum level of one of the ion pumps triggers a protection threshold, that ion pump is shut down, and the first heating element 61 and the second heating element 62 are also shut down. The shut-down ion pump is then restarted. If the restart is successful, the first heating element 61 and the second heating element 62 are restarted to continue evacuating the mirror tube 1. If the restart fails, an error-reporting and stopping procedure is initiated.

[0078] In some embodiments, the voltage boosting process of filament 11 in step S3 is as follows:

[0079] S31, filament 11 starts, applies suppression voltage, extracts voltage to rated voltage value, and simultaneously activates filament 11 protection;

[0080] S32. Based on the current-time boosting requirements, increase the heating current to the rated value and apply the accelerating voltage to the rated value until the emission current reaches a stable state;

[0081] S33. Determine whether the emission current has reached the rated range. If yes, the filament 11 starts successfully. If no, proceed to the error reporting and stop step.

[0082] In some embodiments, the filament 11 protection performs the following steps:

[0083] Determine if the vacuum level of tube 1 meets the requirements. If not, turn off the accelerating voltage, reduce the heating current to 0 according to the current-time reduction requirement, turn off the suppression voltage and extraction voltage, and stop the process after reporting an error.

[0084] In some embodiments, in step S3, it is necessary to detect the emitted beam of the filament 11. The beam detection steps are as follows:

[0085] Timing begins; the transmitting current of filament 11 and the receiving current of Faraday cup 21 are collected.

[0086] Determine whether the transmitting and receiving currents of filament 11 are stable, and whether the ratio of the receiving current to the transmitting current of filament 11 meets the set requirements. If both are met, the timing ends and the beam current detection passes. If the receiving current is unstable, the beam current detection is considered to have failed.

[0087] In some embodiments, the step of establishing a primary vacuum in step S6 is as follows:

[0088] S61. Open the inlet vacuum valve 53 and the connecting vacuum valve 54, and fill the support cylinder 2 with clean nitrogen to the set amount;

[0089] S62. Close the inlet vacuum valve 53, stop nitrogen charging, and start the dry pump 51 until the vacuum level meets the requirements for starting the molecular pump 52.

[0090] S63. Start the molecular pump 52 to work until it reaches the rated speed, and simultaneously activate the protection function of the molecular pump 52.

[0091] S64, molecular pump 52 continues to work until the vacuum level meets the startup requirements of the third ion pump 4;

[0092] S65. Start the third ion pump 4 and simultaneously activate the protection function of the third ion pump 4.

[0093] S66 and the third ion pump 4 continue to operate until the first-level vacuum is reached, thus completing the establishment of the first-level vacuum. Through the above method, the first-level vacuum can be successfully established by using the dry pump 51, the molecular pump 52 and the third ion pump 4 in combination. The first-level vacuum will be maintained inside the microscope tube 1, reducing the risk of contamination of the filament 11 during storage and transportation, and also facilitating the establishment of an ultra-high vacuum in the microscope tube 1 again.

[0094] In some embodiments, the molecular pump 52 protection function in step S63 is as follows:

[0095] S631. Does the vacuum level trigger the molecular pump 52 protection threshold? If so, proceed to the next step.

[0096] S632. Close the connecting vacuum valve 54 and the molecular pump 52, and determine whether the number of triggers is less than the set number. If yes, open the connecting vacuum valve 54 and proceed to step S62. If no, proceed to the error reporting program.

[0097] In some embodiments, in step S65, the third ion pump 4 has the following protection function:

[0098] S651. Does the vacuum level trigger the protection threshold of the third ion pump 4? If so, shut down the third ion pump 4 and then restart the third ion pump 4.

[0099] S652. Determine whether the third ion pump 4 has been successfully restarted. If yes, proceed to step S66; otherwise, report an error and stop.

[0100] In some embodiments, step S7 includes the following steps:

[0101] S71, shut down the first ion pump 31, the second ion pump 32, the third ion pump 4, and the molecular pump 52;

[0102] S72. After the molecular pump 52 has finished decelerating, turn off the dry pump 51.

[0103] S73. Open the inlet vacuum valve 53 and the connecting vacuum valve 54 to fill with nitrogen;

[0104] S74. Determine whether the nitrogen pressure at the fourth pump interface 23 has reached atmospheric pressure. If not, continue charging with nitrogen. If yes, close the inlet vacuum valve 53 and the connecting vacuum valve 54 to complete the charging process. By charging with nitrogen, the gas pressure in the support cylinder 2 can be balanced, which facilitates the subsequent separation of the support cylinder 2 from the mirror cylinder 1.

[0105] Through the above design, after the entire lens barrel 1 is installed on the machine, the situation where the light spot is not visible, requiring extensive movement of the filament 11, is avoided. Only fine adjustments are needed to achieve precise alignment of the filament 11, saving a significant amount of on-site installation and adjustment time and reducing the risk of filament 11 damage. The filament 11 is replaced centrally by designated personnel, avoiding the need for extensive professional training for a large number of people. This also greatly reduces the operational and professional knowledge requirements for personnel, facilitating standardized operating procedures and quality inspection.

[0106] This application also provides a storage medium storing a computer program thereon, which, when executed by a processor, implements the control method described above. This control method includes the following steps:

[0107] S1. Install the lens tube 1 with the replaced filament 11 onto the support tube 2, and install the heating assembly 6, the first vacuum assembly 3, the second vacuum assembly and the third vacuum assembly 5.

[0108] S2. Open vacuum valve 12 and start the first vacuum pumping assembly 3, the second vacuum pumping assembly and the third vacuum pumping assembly 5 to establish a vacuum environment for the mirror tube 1.

[0109] S3. Turn on the voltage boost function of filament 11. After the beam emitted by filament 11 is stable, adjust the position of filament 11 according to the current detected by Faraday cup 21 so that the monitoring current reaches the set value and complete the initial alignment of filament 11.

[0110] S4. After alignment, nitrogen gas is introduced into the microscope tube 1;

[0111] S5. Remove the first vacuum assembly 3 and the heating assembly 6, close the vacuum valve 12, and seal the position where the mirror tube 1 connects to the first vacuum assembly 3.

[0112] S6. Open vacuum valve 12 and start the third vacuum pumping component 5 to establish a first-level vacuum for the lens barrel 1. After completion, close vacuum valve 12 again.

[0113] S7. Fill the support cylinder 2 with nitrogen. After filling, remove the lens barrel 1 and move it to the semiconductor equipment for installation.

[0114] The computer storage medium of this invention can be any combination of one or more computer-readable media. A computer-readable medium can be a computer-readable signal medium or a computer-readable storage medium. A computer-readable storage medium can be, for example,—but not limited to—an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of computer-readable storage media (a non-exhaustive list) include: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof. In this document, a computer-readable storage medium can be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.

[0115] Computer-readable signal media may include data signals propagated in baseband or as part of a carrier wave, carrying computer-readable program code. Such propagated data signals may take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. Computer-readable signal media may also be any computer-readable medium other than computer-readable storage media, capable of sending, propagating, or transmitting programs for use by or in connection with an instruction execution system, apparatus, or device.

[0116] Program code contained on a computer-readable medium may be transmitted using any suitable medium, including—but not limited to—wireless, wire, optical fiber, RF, etc., or any suitable combination thereof.

[0117] Computer program code for performing the operations of this invention can be written in one or more programming languages ​​or a combination thereof. Programming languages ​​include object-oriented programming languages—such as Java, Smalltalk, and C++—as well as conventional procedural programming languages—such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or terminal. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0118] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A vacuum bake platform characterized by, The utility model relates to a vacuum baking platform, including: A lens barrel (1) is provided with a filament (11) in the lens barrel (1), and the lower end of the lens barrel (1) is provided with a through hole, the position of the filament (11) in the lens barrel (1) can be adjusted to be opposite to the through hole; A vacuum valve (12) is arranged on the lens barrel (1) and located at the through hole for controlling the opening and closing of the through hole; A support barrel (2) is sealingly arranged on the lower end of the lens barrel (1); A Faraday cup (21) is arranged at the bottom of the support barrel (2) and opposite to the through hole, and an aperture is arranged on the Faraday cup (21); A first vacuum pumping assembly (3) is communicated with the lens barrel (1); A second vacuum pumping assembly and a third vacuum pumping assembly (5) are communicated with the support barrel (2), and the third vacuum pumping assembly (5) is used for establishing a primary vacuum to start the first vacuum pumping assembly (3) and the second vacuum pumping assembly; A heating assembly (6) is used for heating the vacuum baking platform.

2. The vacuum bake platform of claim 1, wherein, A first pump interface (13) and a second pump interface (14) are arranged on the lens barrel (1), the first vacuum pumping assembly (3) comprises a first ion pump (31) and a second ion pump (32), the first ion pump (31) is arranged at the first pump interface (13), and the second ion pump (32) is arranged at the second pump interface (14).

3. The vacuum bake platform of claim 1, wherein, The upper end of the support barrel (2) is provided with a connecting flange, and a fastener penetrates through the connecting flange and is connected with the lens barrel (1).

4. The vacuum bake platform of claim 1, wherein, A third pump interface (22) is arranged on the support barrel (2), and the second vacuum pumping assembly comprises a third ion pump (4) arranged at the third pump interface (22).

5. The vacuum bake platform of claim 1, wherein, A fourth pump interface (23) is arranged on the support barrel (2), and the third vacuum pumping assembly (5) comprises a dry pump (51) and a molecular pump (52) communicated with each other, the molecular pump (52) is arranged at the fourth pump interface (23), an inlet vacuum valve (53) is arranged at the inlet of the dry pump (51), and a communication vacuum valve (54) is arranged on the pipeline between the dry pump (51) and the molecular pump (52).

6. The vacuum bake platform of claim 1, wherein, The heating assembly (6) comprises a first heating member (61), a second heating member (62), a third heating member (63) and a fourth heating member (64), the first heating member (61) is sleeved on the lens barrel (1), the second heating member (62) is sleeved on the support barrel (2), the third heating member (63) is arranged on the first vacuum pumping assembly (3), and the fourth heating member (64) is arranged on the second vacuum pumping assembly.

7. The vacuum bake station of claim 6, wherein, A plurality of groups of first temperature sensors (611) are arranged in the first heating member (61) and spaced apart in the height direction, and a group of second temperature sensors (621) are arranged on the second heating member (62).

8. Control system, characterized in that A vacuum baking platform as claimed in any one of claims 1-7 is controlled, comprising a vacuum control module (81), a baking control module (82) and a beam control module (83), the vacuum control module (81) is electrically connected with a vacuum valve (12), a first vacuum pumping assembly (3), a second vacuum pumping assembly and a third vacuum pumping assembly (5), the baking control module (82) is electrically connected with a heating assembly (6), and the beam control module (83) is electrically connected with a filament (11) and the Faraday cup (21).

9. Control method, characterized in that A vacuum baking platform as claimed in any one of claims 1-8 is controlled, comprising the following steps: S1, installing a lens barrel (1) with a replaced filament (11) to a support barrel (2), installing a heating assembly (6), a first vacuum pumping assembly (3), a second vacuum pumping assembly and a third vacuum pumping assembly (5); S2, opening a vacuum valve (12), starting the first vacuum pumping assembly (3), the second vacuum pumping assembly and the third vacuum pumping assembly (5) to establish a vacuum environment for the lens barrel (1); S3, starting a filament (11) voltage boosting function, after the filament (11) emits a stable beam, adjusting the filament (11) position according to the current detected by a Faraday cup (21) to make the monitored current reach a set value, completing the filament (11) primary centering; S4, after the centering is completed, filling nitrogen into the lens barrel (1); S5, removing the first vacuum pumping assembly (3) and the heating assembly (6), closing the vacuum valve (12), and plugging the position where the lens barrel (1) communicates with the first vacuum pumping assembly (3); S6, opening the vacuum valve (12), starting the third vacuum pumping assembly (5) to establish a first-level vacuum for the lens barrel (1), and closing the vacuum valve (12) again after completion; S7, filling nitrogen into the support barrel (2), and removing the lens barrel (1) after the filling is completed, and moving to a semiconductor device for installation.

10. A storage medium having stored thereon a computer program, characterized in that The program is executed by the processor to realize the control method as claimed in claim 9.