High-strength mobile phone mainboard upper cover assembly

Abstract

The utility model provides a high-strength mobile phone mainboard upper cover assembly, which comprises a decorative frame and an upper cover plate, a plurality of bolts are arranged on one side of the upper cover plate at intervals, a plurality of supporting seats are fixed in the decorative frame at intervals, the threaded ends of the bolts penetrate through the upper cover plate and extend into the supporting seats, and the upper cover plate is fixed on the upper cover plate. A battery mounting area is arranged on one side of the upper cover plate, a heat dissipation assembly is arranged on the other side of the upper cover plate, the heat dissipation assembly comprises cooling fins and heat conductors, a plurality of mounting grooves are formed in one side of the decoration frame in a penetrating mode, the heat conductors are mounted in the mounting grooves, and the heat conductors are arranged in the mounting grooves. According to the mobile phone mainboard upper cover, the problem that the separation and installation processes of the existing mobile phone mainboard upper cover and the decoration frame are time-consuming and labor-consuming is solved by adopting the mobile phone mainboard upper cover, the mobile phone mainboard upper cover and the decoration frame are separated from each other, and the installation process of the mobile phone mainboard upper cover and the decoration frame is time-consuming and labor-consuming.

Description

Technical Field

[0001] The utility model relates to the field of mobile phones, in particular to a high-strength mobile phone mainboard upper cover component. Background Art

[0002] A mobile phone is composed of a main board, a battery panel, a top cover, a decorative frame, a display screen and other parts. The main board is inside the phone, and the top cover, the display screen and the decorative frame are on the outside. The main board top cover of a mobile phone commonly found on the market is glued to the decorative frame by a sealant. When the internal parts of the mobile phone are damaged, the sealant must be heated and dissolved before the top cover can be separated from the decorative frame. Only then can the internal parts of the mobile phone be repaired. In summary, the existing process of separating and installing the main board top cover and the decorative frame of the mobile phone is very time-consuming and labor-intensive.

[0003] Therefore, it is necessary to provide a new high-strength mobile phone motherboard cover assembly to solve the above technical problems. Utility Model Content

[0004] In order to solve the above technical problems, the utility model provides a high-strength mobile phone mainboard cover assembly, which solves the problem that the separation and installation process of the existing mobile phone mainboard cover and the decorative frame is very time-consuming and labor-intensive.

[0005] The high-strength mobile phone motherboard upper cover assembly provided by the utility model comprises a decorative frame and an upper cover plate, a plurality of bolts are arranged at intervals on one side of the upper cover plate, a plurality of support seats are fixed at intervals inside the decorative frame, the threaded ends of the bolts penetrate the upper cover plate and extend into the inside of the support seats, and the threaded ends of the bolts are threadedly connected to the support seats;

[0006] A battery installation area is arranged on one side of the upper cover plate, and a heat dissipation component is arranged on the other side of the upper cover plate.

[0007] In a preferred embodiment, the heat dissipation assembly includes a heat sink and a heat conductor, a plurality of installation grooves are opened through one side of the decorative frame, a heat conductor is installed inside the installation grooves, the heat sink is installed on one side of the heat conductor located inside the decorative frame, and the heat sink is in contact with the surface of the upper cover plate.

[0008] In a preferred embodiment, a side of the heat conductor away from the heat sink is located in the same plane as the outer wall of the decorative frame.

[0009] In a preferred embodiment, thermal conductive silicone grease is applied between the heat sink and the upper cover plate.

[0010] In a preferred embodiment, a plurality of first support rods are fixed on the decorative frame, and a second support rod is fixed on one side of the support base.

[0011] In a preferred embodiment, pre-installed plates are fixed at the four corners of the decorative frame, a card slot is provided on the surface of the pre-installed plate, and card blocks are fixed at the four corners of the upper cover plate, and the card blocks are embedded in the card slots.

[0012] Beneficial effects of the utility model:

[0013] 1. When installing the upper cover assembly of the motherboard, the staff only needs to insert the card block on the upper cover into the card slot, and then connect the support base and the upper cover together with bolts. When it needs to be disassembled, it is only necessary to unscrew the corresponding bolts, and then gently pull the card block on the upper cover out of the card slot to complete the disassembly of the upper cover. The operation is simple and convenient and takes less time;

[0014] 2. By setting up the heat sink, the heat from the upper cover and the battery installation area can be introduced to the heat conductor, which can speed up the heat dissipation of the battery. By setting up the first support rod and the second support rod, a certain supporting force can be provided to the upper cover, further increasing its installation stability and installation strength. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 The main structure of the high-strength mobile phone motherboard upper cover assembly provided by the utility model is a three-dimensional view Figure 1 ;

[0016] Figure 2 for Figure 1 A schematic diagram of the enlarged structure of shown;

[0017] Figure 3 The main structure of the high-strength mobile phone motherboard upper cover assembly provided by the utility model is a three-dimensional view Figure 2 .

[0018] Numbers in the figure: 1. Decorative frame; 2. Upper cover; 3. Bolt; 4. Support seat; 5. Battery installation area; 6. Heat sink; 7. Heat conductor; 8. Installation slot; 9. First support rod; 10. Second support rod; 11. Pre-installed plate; 12. Card slot; 13. Card block. DETAILED DESCRIPTION

[0019] The utility model is further described below in conjunction with the accompanying drawings and implementation modes.

[0020] Please refer to Figure 1 , Figure 2 as well as Figure 3 , Figure 1 The main structure of the high-strength mobile phone motherboard upper cover assembly provided by the utility model is a three-dimensional view Figure 1 ; Figure 2 for Figure 1 A schematic diagram of the enlarged structure of shown; Figure 3The main structure of the high-strength mobile phone motherboard upper cover assembly provided by the utility model is a three-dimensional view Figure 2 .

[0021] In the specific implementation process, Figure 1-Figure 3 As shown, it includes a decorative frame 1 and an upper cover plate 2, a plurality of bolts 3 are arranged at intervals on one side of the upper cover plate 2, a plurality of support seats 4 are fixed at intervals inside the decorative frame 1, the threaded ends of the bolts 3 pass through the upper cover plate 2 and extend to the inside of the support seats 4, and the threaded ends of the bolts 3 are threadedly connected to the support seats 4, a battery installation area 5 is arranged on one side of the upper cover plate 2, and a heat dissipation component is arranged on the other side of the upper cover plate 2.

[0022] The heat dissipation component includes a heat sink 6 and a heat conductor 7. A plurality of mounting grooves 8 are formed through one side of the decorative frame 1, and a heat conductor 7 is installed inside the mounting groove 8. A heat sink 6 is installed on one side of the heat conductor 7 located inside the decorative frame 1, and the heat sink 6 is in contact with the surface of the upper cover plate 2. Thermal grease is applied between the heat sink 6 and the upper cover plate 2 to increase the heat conduction speed. By providing the heat sink 6, the heat from the upper cover plate 2 and the battery installation area 5 can be introduced into the heat conductor 7, which can accelerate the heat dissipation speed of the battery. By providing the first support rod 9 and the second support rod 10, a certain supporting force can be provided to the upper cover plate 2, further increasing its installation stability. The side of the heat conductor 7 away from the heat sink 6 is located in the same plane as the outer wall of the decorative frame 1, and does not affect the normal use of the user.

[0023] A plurality of first support rods 9 are fixed on the decorative frame 1, and a second support rod 10 is fixed on one side of the support seat 4. The first support rods 9 and the second support rods 10 can provide a certain supporting force for the upper cover plate 2, further increasing the stability of its installation.

[0024] Pre-installed plates 11 are fixed at the four corners of the decorative frame 1, and a card slot 12 is opened on the surface of the pre-installed plate 11. Card blocks 13 are fixed at the four corners of the upper cover plate 2, and the card blocks 13 are embedded in the card slots 12. During installation, the staff only needs to card the card blocks 13 on the upper cover plate 2 into the card slots 12, which has a pre-fixing effect and makes it convenient for the staff to connect the support seat 4 and the upper cover plate 2 together.

[0025] The working principle of the utility model: during installation, the staff only needs to insert the clamping block 13 on the upper cover plate 2 into the clamping groove 12, and then connect the support seat 4 and the upper cover plate 2 together through the bolts 3;

[0026] When disassembly is required, it is only necessary to unscrew the corresponding bolt 3, and then gently pull out the block 13 on the upper cover 2 from the slot 12 to complete the disassembly of the upper cover 2. The operation is simple and convenient and takes a short time.

[0027] By providing the heat sink 6, the heat of the upper cover plate 2 and the battery installation area 5 can be introduced into the heat conductor 7, which can accelerate the heat dissipation speed of the battery. By providing the first support rod 9 and the second support rod 10, a certain supporting force can be provided to the upper cover plate 2, further increasing its installation stability.

[0028] The circuits and controls involved in the present invention are all prior art and will not be described in detail here.

[0029] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A high-strength mobile phone mainboard upper cover assembly, comprising a decorative frame (1) and an upper cover plate (2), characterized in that: A plurality of bolts (3) are arranged at intervals on one side of the upper cover plate (2), a plurality of support seats (4) are fixed at intervals inside the decorative frame (1), the threaded ends of the bolts (3) penetrate the upper cover plate (2) and extend into the interior of the support seats (4), and the threaded ends of the bolts (3) are threadedly connected to the support seats (4); A battery installation area (5) is provided on one side of the upper cover plate (2), and a heat dissipation component is provided on the other side of the upper cover plate (2).

2. The high-strength mobile phone mainboard upper cover assembly according to claim 1, characterized in that: The heat dissipation component comprises a heat sink (6) and a heat conductor (7); a plurality of mounting grooves (8) are provided through one side of the decorative frame (1); the heat conductor (7) is installed inside the mounting groove (8); the heat sink (6) is installed on one side of the heat conductor (7) located inside the decorative frame (1); and the heat sink (6) is in contact with the surface of the upper cover plate (2).

3. The high-strength mobile phone mainboard upper cover assembly according to claim 2, characterized in that: The side of the heat conductor (7) away from the heat sink (6) is located in the same plane as the outer wall of the decorative frame (1).

4. The high-strength mobile phone mainboard upper cover assembly according to claim 3, characterized in that: Thermal conductive silicone grease is applied between the heat sink (6) and the upper cover plate (2).

5. The high-strength mobile phone mainboard upper cover assembly according to claim 4, characterized in that: A plurality of first support rods (9) are fixed on the decorative frame (1), and a second support rod (10) is fixed on one side of the support seat (4).

6. The high-strength mobile phone mainboard upper cover assembly according to claim 5, characterized in that: Pre-installed plates (11) are fixed at the four corners of the decorative frame (1), a card slot (12) is provided on the surface of the pre-installed plate (11), and card blocks (13) are fixed at the four corners of the upper cover plate (2), and the card blocks (13) are engaged with the card slots (12).

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