Robot chip mounting equipment

Abstract

The utility model relates to the technical field of semiconductor packaging, in particular to robot chip mounting equipment, which comprises a workbench, a substrate fixing structure movably mounted on the upper surface of the workbench, a jacking structure embedded in the upper surface of the workbench, a transfer tower fixedly mounted in the middle of the upper surface of the workbench, and a chip mounting structure mounted on the transfer tower in a sliding manner. The jacking structure comprises a base, a spring groove is formed in the base, a limiting plate is slidably mounted in the spring groove, a return spring is movably connected between the bottom side of the limiting plate and the bottom of the spring groove, the limiting plate is fixedly mounted in the middle of a metal ejector rod, and a top plate is fixedly mounted at the upper end of the metal ejector rod. According to the utility model, the silica gel transmission belt at the bottom of the chip is pushed by the top plate to slightly swell, an upward supporting force is applied to the chip to assist the lower end of the chip mounting structure to adsorb the upper surface of the chip under negative pressure, and the conditions of insufficient pressure at the lower end of the chip mounting structure, air leakage and falling of the chip from the lower end of the chip mounting structure are avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a robot chip mounting device. Background Art

[0002] With the development of science and technology, the mechanical structure of robots, which are substitutes for artificial labor, has become more and more complex in action and requires more precise instructions. The density of integrated circuits, the main components for issuing instructions and controlling actions, is also getting higher and higher, which puts higher requirements on semiconductor mounting equipment. Originally, only a few or dozens of bonding wires on a chip could meet the requirements, but now it is far from meeting the demand, especially for some high-end central processing units or image processors, which have huge computing power and require more input and output ports. In addition, there are more and more applications in which multiple chips are integrated on a substrate.

[0003] Most of the current chip mounting equipment uses suction heads such as suction cups to perform mobile mounting work by using negative pressure. However, when the pressure when the suction cup contacts the chip surface is insufficient, there will be a gap between the suction cup and the chip contact surface, or negative pressure will be formed at the bottom of the suction cup, resulting in air leakage, which will cause the chip to be unable to be sucked, affecting the working effect. Utility Model Content

[0004] The purpose of the utility model is to provide a robot chip mounting device to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A robot chip mounting equipment comprises a workbench, a substrate fixing structure is movably installed on the upper surface of the workbench, a lifting structure is embedded and installed on the upper surface of the workbench, a transfer tower is fixedly installed on the middle part of the upper surface of the workbench, a patch structure is slidably carried on the transfer tower, and the number of patch structures is six groups, the workbench comprises a substrate, a No. 2 conveyor belt mounting groove is provided at one edge of the upper surface of the substrate, a silicone conveyor belt is rotatably installed in the No. 2 conveyor belt mounting groove, the lifting structure comprises an installation substrate, a base is fixedly installed on the bottom side of the installation substrate, a spring groove is provided in the base, a limit plate is slidably installed in the spring groove, a return spring is movably connected between the bottom side of the limit plate and the bottom of the spring groove, the limit plate is fixedly installed in the middle part of a metal push rod, an electromagnet is movably connected to the lower end of the metal push rod, and a top plate is fixedly installed on the upper end of the metal push rod.

[0007] Furthermore, a dispensing machine installation area is provided on one edge of the upper surface of the substrate, a No. 1 conveyor belt installation groove is provided on one edge of the upper surface of the substrate, a rubber conveyor belt is rotatably installed in the No. 1 conveyor belt installation groove, and a support plate is fixedly installed at the openings of the No. 1 conveyor belt installation groove and the No. 2 conveyor belt installation groove, and slides against the rubber conveyor belt and the silicone conveyor belt.

[0008] Furthermore, the substrate fixing structure includes a support beam, a No. 1 motor is fixedly installed in the middle of the support beam, a No. 1 screw is fixedly installed at the output end of the No. 1 motor, the No. 1 screw is screwed and connected to the middle of the connecting rod, support frames are fixedly installed at both ends of the upper side of the connecting rod, slide rails are fixedly installed at both ends of the upper edge of the surface of one side of the support frame, a No. 2 screw is rotatably installed in the middle of the edge of the surface of one side of the support frame, one end of the No. 2 screw is fixedly connected with an adjustment handle, the side surfaces of the slide rail and the No. 2 screw are sleeved with base strips, and pressure rods are fixedly installed on the bottom sides of both ends of the base strip.

[0009] The invention further comprises: the metal push rod and the return spring are sleeved with each other.

[0010] Furthermore, the transfer tower includes a base column, a No. 2 motor is fixedly installed on the upper end of the base column, a swivel seat is fixedly connected to the output end of the No. 2 motor, a sliding rod is fixedly installed on the side surface of the swivel seat, the number of the sliding rods is six, a sliding groove is inserted in the middle of the sliding rod, a No. 3 screw rod is rotatably installed in the sliding groove, and one end of the No. 3 screw rod is fixedly connected to the output end of the No. 3 motor.

[0011] Furthermore, the patch structure includes a slider, a rod sleeve is fixedly installed on one side of the slider, a suspension rod is slidably sleeved on the rod sleeve in the up and down directions, a suction cup is fixedly installed on the lower end of the suspension rod, an exhaust channel is interspersed between the suspension rod and the middle part of the suction cup, an exhaust pipe is connected to the upper opening of the exhaust channel, a tooth groove is opened on the side surface of the suspension rod, the tooth groove is meshed with a gear, and the gear is fixedly connected to the output end of the No. 4 motor.

[0012] Furthermore, two ends of the support beam are fixedly connected to the groove walls on both sides of the No. 1 conveyor belt installation groove, the support frame is slidably embedded in the groove walls on both sides of the No. 1 conveyor belt installation groove, the installation base plate is embedded in the middle of the support plate inside the No. 2 conveyor belt installation groove, the base column is fixedly installed on the upper surface of the base plate, the slider is slidably installed in the slide groove, and is mutually connected with the No. 3 screw rod.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. The chips used by the robot are transported and fed through the silicone conveyor belt. The silicone material of the silicone conveyor belt has a certain viscosity, and the chips are positioned to a certain extent. When transported to the top of the jacking structure, the silicone conveyor belt stops working, and the chip is taken and transported through the patch structure carried by the transfer tower to perform patch work. When the patch structure presses down to absorb the chip, the electromagnet disconnects the power supply and loses its magnetic force. The return spring pushes the limit plate to slide upward in the spring groove, and then pushes the metal push rod up. The top plate is used to push the silicone conveyor belt at the bottom of the chip to slightly bulge, giving the chip an upward support force, and assisting the negative pressure at the lower end of the patch structure to adsorb the upper surface of the chip, avoiding insufficient pressure at the lower end of the patch structure, air leakage, and the chip falling from the lower end of the patch structure. At the same time, the rigidity of the chip itself and the elasticity and plasticity of the silicone conveyor belt itself are used to separate the edge of the chip from the silicone conveyor belt, avoiding the adhesion of the silicone conveyor belt and the chip affecting the absorption of the chip by the lower end of the patch structure.

[0015] 2. When the rubber conveyor belt transports the substrate to the chip mounting position, the No. 1 motor rubs the connecting rod downward through the No. 1 screw, and then drives the two sets of base strips to move downward synchronously through the support frame, and uses the pressure rod to press the edge of the substrate to press and fix the substrate. For substrates of different sizes, the No. 2 screw can be rotated by adjusting the handle to rub the base strip horizontally, and the downward pressing position of the pressure rod can be adjusted to give the overall structure the ability to adapt to substrates of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a cross-sectional schematic diagram of the workbench in the utility model;

[0018] Figure 3 This is a schematic diagram of the base plate fixing structure in the utility model;

[0019] Figure 4 It is a schematic diagram of the jacking structure in the utility model;

[0020] Figure 5 It is a schematic diagram of the transfer tower in the utility model;

[0021] Figure 6 It is a schematic diagram of the patch structure in the utility model.

[0022] In the figure: 1. Workbench; 101. Base plate; 102. Dispensing machine installation area; 103. No. 1 conveyor belt installation slot; 104. Rubber conveyor belt; 105. No. 2 conveyor belt installation slot; 106. Silicone conveyor belt; 2. Base plate fixing structure; 201. Support beam; 202. No. 1 motor; 203. No. 1 screw rod; 204. Connecting rod; 205. Support frame; 206. Slide rail; 207. No. 2 screw rod; 208. Adjustment handle; 209. Base bar; 210. Pressure rod; 3. Lifting structure; 301. Mounting base plate; 302. Base ; 303, spring slot; 304, limit plate; 305, return spring; 306, metal push rod; 307, electromagnet; 308, top plate; 4, transfer tower; 401, base column; 402, No. 2 motor; 403, swivel seat; 404, slide rod; 405, slide groove; 406, No. 3 screw rod; 407, No. 3 motor; 5, patch structure; 501, slider; 502, rod sleeve; 503, suspension rod; 504, suction cup; 505, exhaust channel; 506, exhaust pipe; 507, tooth groove; 508, gear; 509, No. 4 motor. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Embodiment 1

[0025] See also Figures 1 to 6In the embodiment of the utility model, a robot chip mounting device includes a workbench 1, a substrate fixing structure 2 is movably installed on the upper surface of the workbench 1, a lifting structure 3 is embedded and installed on the upper surface of the workbench 1, a transfer tower 4 is fixedly installed in the middle of the upper surface of the workbench 1, and the transfer tower 4 is slidably equipped with a patch structure 5, and the number of the patch structures 5 is six groups. The workbench 1 includes a substrate 101, and a second conveyor belt mounting groove 105 is opened on one side edge of the upper surface of the substrate 101. A silicone conveyor belt 106 is rotatably installed in the second conveyor belt mounting groove 105. The lifting structure 3 includes an installation substrate 301, and the installation base A base 302 is fixedly installed on the bottom side of the plate 301, and a spring groove 303 is opened in the base 302. A limit plate 304 is slidably installed in the spring groove 303. A return spring 305 is movably connected between the bottom side of the limit plate 304 and the bottom of the spring groove 303. The limit plate 304 is fixedly installed in the middle of a metal top rod 306. An electromagnet 307 is movably connected to the lower end of the metal top rod 306, and a top plate 308 is fixedly installed on the upper end of the metal top rod 306; the metal top rod 306 and the return spring 305 are mutually socketed; the mounting base plate 301 is embedded in the middle of the support plate inside the No. 2 conveyor belt mounting groove 105.

[0026] Specifically, the silicon conveyor belt 106 is used to convey and feed the chips used by the robot. The silicon material of the silicon conveyor belt 106 has a certain viscosity, so that the chips are positioned to a certain extent. When the chips are transported to the top of the lifting structure 3, the silicon conveyor belt 106 stops working, and the chip is taken and transported by the patch structure 5 carried by the transfer tower 4 to perform the patch work. When the patch structure 5 presses down to absorb the chip, the electromagnet 307 is disconnected from the power supply and loses its magnetic force, and the return spring 305 pushes the limit plate 304 to slide upward in the spring groove 303, thereby pushing The metal push rod 306 is pushed up, and the top plate 308 is used to push the silicone conveyor belt 106 at the bottom of the chip to bulge slightly, giving the chip an upward support force, and assisting the negative pressure at the lower end of the patch structure 5 to adsorb the upper surface of the chip, to avoid insufficient pressure at the lower end of the patch structure 5, air leakage, and the chip falling from the lower end of the patch structure 5. At the same time, the rigidity of the chip itself and the elasticity and plasticity of the silicone conveyor belt 106 itself are used to separate the edge of the chip from the silicone conveyor belt 106, to avoid the adhesion of the silicone conveyor belt 106 to the chip affecting the absorption of the chip by the lower end of the patch structure 5.

[0027] like Figure 1-2 As shown, in the present embodiment, a dispensing machine installation area 102 is provided at one edge of the upper surface of the substrate 101, a No. 1 conveyor belt installation groove 103 is provided at one edge of the upper surface of the substrate 101, a rubber conveyor belt 104 is rotatably installed in the No. 1 conveyor belt installation groove 103, and a support plate is fixedly installed at the opening of the No. 1 conveyor belt installation groove 103 and the No. 2 conveyor belt installation groove 105, and slides against the rubber conveyor belt 104 and the silicone conveyor belt 106.

[0028] In this embodiment, a glue dispensing device is installed at the glue dispensing machine installation area 102, and the chip mounting substrate is transported from the rear side by a rubber conveyor belt 104. After being glued by the glue dispensing machine, it is transported to the chip mounting area, and the chip is transported by the mounting structure 5 carried by the transfer tower 4, and the mounting work is performed.

[0029] like Figure 5-6 As shown, in this embodiment, the transfer tower 4 includes a base column 401, a No. 2 motor 402 is fixedly installed on the upper end of the base column 401, a rotating seat 403 is fixedly connected to the output end of the No. 2 motor 402, a sliding rod 404 is fixedly installed on the side surface of the rotating seat 403, and the number of the sliding rods 404 is six. A sliding groove 405 is inserted in the middle of the sliding rod 404, and a No. 3 screw rod 406 is rotatably installed in the sliding groove 405, and one end of the No. 3 screw rod 406 is fixedly connected to the output end of the No. 3 motor 407; the patch structure 5 includes a slider 501, a rod sleeve 502 is fixedly installed on one side of the slider 501, and the rod sleeve A suspension rod 503 is slidably sleeved in the upper and lower directions 502, a suction cup 504 is fixedly installed at the lower end of the suspension rod 503, an exhaust channel 505 is interspersed between the suspension rod 503 and the suction cup 504, an exhaust pipe 506 is connected to the upper opening of the exhaust channel 505, a tooth groove 507 is opened on the side surface of the suspension rod 503, the tooth groove 507 and the gear 508 are meshed with each other, and the gear 508 is fixedly connected to the output end of the fourth motor 509; the base column 401 is fixedly installed on the upper surface of the base plate 101, the slider 501 is slidably installed in the slide groove 405, and is sleeved with the third screw rod 406.

[0030] In the specific implementation, the rotating seat 403 is rotated by the No. 2 motor 402, and then the sliding rods 404 are rotated, and the patch structure 5 is continuously passed over the rubber conveyor belt 104 and the silicone conveyor belt 106. The No. 3 motor 407 rotates the No. 3 screw rod 406 to rub the slider 501 to move horizontally in the slide groove 405, and the horizontal position of the suspension rod 503 is adjusted. When the transfer tower 4 moves the suspension rod 503 to the top of the chip, the gear 508 is rotated by the No. 4 motor 509 to rub the gear Slot 507, and then control the suspension rod 503 to move downward in the rod sleeve 502, so that the suction cup 504 presses the upper surface of the chip, and then through the suction device connected to the suction pipe 506, use the suction channel 505 to draw air to form a negative pressure space at the bottom of the suction cup 504 to absorb the chip, reversely rotate the No. 4 motor 509 to lift the chip, and move the suspension rod 503 to the top of the substrate through the transfer tower 4, move the suspension rod 503 downward, stop suction, and attach the chip to the substrate to realize the mounting work.

[0031] Embodiment 2

[0032] On the basis of the first embodiment, in order to supplement the details not mentioned in the first embodiment, how to limit and fix the substrate after the rubber conveyor belt 104 transports the substrate to the chip mounting position is described.

[0033] like Figure 1-3 As shown, in this embodiment, the substrate fixing structure 2 includes a support beam 201, a motor No. 1 202 is fixedly installed in the middle of the support beam 201, a screw No. 1 203 is fixedly installed at the output end of the motor No. 1 202, the screw No. 1 203 is screwed and connected with the middle of the connecting rod 204, and support frames 205 are fixedly installed at both ends of the upper side of the connecting rod 204, and slide rails 206 are fixedly installed at both ends of the upper edge of the surface of one side of the support frame 205, and a screw No. 2 207 is rotatably installed in the middle of the edge of the surface of one side of the support frame 205, and an adjustment handle 208 is fixedly connected to one end of the screw No. 2 207, and a base strip 209 is sleeved on the side surfaces of the slide rail 206 and the screw No. 2 207, and a pressure rod 210 is fixedly installed on the bottom side of both ends of the base strip 209; the two ends of the support beam 201 are fixedly connected to the groove walls on both sides of the No. 1 conveyor belt mounting groove 103, and the support frame 205 is slidably embedded in the groove walls on both sides of the No. 1 conveyor belt mounting groove 103.

[0034] In specific implementation, when the rubber conveyor belt 104 transports the substrate to the chip mounting position, the No. 1 motor 202 rubs the connecting rod 204 downward through the No. 1 screw rod 203, and then synchronously drives the two groups of base strips 209 to move downward through the support frame 205, and uses the pressure rod 210 to press the edge of the substrate to press and fix the substrate. For substrates of different sizes, the No. 2 screw rod 207 can be rotated by adjusting the handle 208, and then the base strip 209 can be rubbed to move horizontally, and the downward pressing position of the pressure rod 210 can be adjusted to give the overall structure the ability to adapt to substrates of different sizes.

[0035] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0036] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A robot chip placement device, comprising a workbench, characterized in that: A substrate fixing structure is movably installed on the upper surface of the workbench, a lifting structure is embedded in the upper surface of the workbench, a transfer tower is fixedly installed in the middle of the upper surface of the workbench, and a patch structure is slidably mounted on the transfer tower, and the number of patch structures is six groups. The workbench includes a substrate, and a No. 2 conveyor belt mounting groove is opened at one edge of the upper surface of the substrate, and a silicone conveyor belt is rotatably installed in the No. 2 conveyor belt mounting groove. The lifting structure includes an installation substrate, a base is fixedly installed on the bottom side of the installation substrate, a spring groove is opened in the base, and a limit plate is slidably installed in the spring groove, a return spring is movably connected between the bottom side of the limit plate and the bottom of the spring groove, the limit plate is fixedly installed in the middle of the metal push rod, an electromagnet is movably connected to the lower end of the metal push rod, and a top plate is fixedly installed on the upper end of the metal push rod.

2. A robot chip placement device according to claim 1, characterized in that: A glue dispenser installation area is provided on one edge of the upper surface of the substrate, and a conveyor belt installation groove is provided on one edge of the upper surface of the substrate. A rubber conveyor belt is rotatably installed in the conveyor belt installation groove. Support plates are fixedly installed at the openings of the conveyor belt installation groove No. 1 and the conveyor belt installation groove No. 2, and slide against the rubber conveyor belt and the silicone conveyor belt.

3. A robot chip placement device according to claim 2, characterized in that: The substrate fixing structure includes a support beam, a No. 1 motor is fixedly installed in the middle of the support beam, a No. 1 screw is fixedly installed at the output end of the No. 1 motor, the No. 1 screw is screwed and connected to the middle of the connecting rod, support frames are fixedly installed at both ends of the upper side of the connecting rod, slide rails are fixedly installed at both ends of the upper edge of the surface of one side of the support frame, a No. 2 screw is rotatably installed in the middle of the edge of the surface of one side of the support frame, one end of the No. 2 screw is fixedly connected with an adjustment handle, the side surfaces of the slide rail and the No. 2 screw are sleeved with base strips, and pressure rods are fixedly installed on the bottom sides of both ends of the base strip.

4. A robot chip placement device according to claim 3, characterized in that: The metal push rod and the return spring are sleeved with each other.

5. A robot chip mounting device according to claim 4, characterized in that: The transfer tower includes a base column, a No. 2 motor is fixedly installed on the upper end of the base column, a swivel seat is fixedly connected to the output end of the No. 2 motor, a sliding rod is fixedly installed on the side surface of the swivel seat, and the number of the sliding rods is six. A sliding groove is inserted in the middle of the sliding rod, and a No. 3 screw rod is rotatably installed in the sliding groove, and one end of the No. 3 screw rod is fixedly connected to the output end of the No. 3 motor.

6. A robot chip placement device according to claim 5, characterized in that: The patch structure includes a slider, a rod sleeve is fixedly installed on one side of the slider, the rod sleeve is slidably sleeved with a suspension rod in the up and down directions, a suction cup is fixedly installed on the lower end of the suspension rod, an exhaust channel is interspersed between the suspension rod and the middle part of the suction cup, an exhaust pipe is connected to the upper opening of the exhaust channel, a tooth groove is opened on the side surface of the suspension rod, the tooth groove is meshed with a gear, and the gear is fixedly connected to the output end of the No. 4 motor.

7. A robot chip placement device according to claim 6, characterized in that: The two ends of the support beam are fixedly connected to the groove walls on both sides of the No. 1 conveyor belt mounting groove, the support frame is slidably embedded in the groove walls on both sides of the No. 1 conveyor belt mounting groove, the mounting base plate is embedded in the middle of the support plate inside the No. 2 conveyor belt mounting groove, the base column is fixedly installed on the upper surface of the base plate, the slider is slidably installed in the slide groove, and is mutually connected with the No. 3 screw rod.

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